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Neutron-Induced Multiple-Bit Upset. Alan D. Tipton 1 , Jonathan A. Pellish 1 , Patrick R. Fleming 1 , Ronald D. Schrimpf 1,2 , Robert A. Reed 2 , Robert A. Weller 1,2 , Marcus H. Mendenhall 3. Vanderbilt University, Department of Electrical Engineering and Computer Science, Nashville,TN - PowerPoint PPT Presentation
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MURI 2007 [email protected]
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Neutron-Induced Multiple-Bit UpsetAlan D. Tipton1, Jonathan A. Pellish1,Patrick R. Fleming1, Ronald D. Schrimpf1,2,Robert A. Reed2, Robert A. Weller1,2,Marcus H. Mendenhall3
1. Vanderbilt University, Department of Electrical Engineering and Computer Science, Nashville,TN
2. Vanderbilt University, Institute for Space and Defense Electronics, Nashville, TN
3. Vanderbilt University, W. M. Keck Free Electron Laser Center, Nashville, TN
MURI 2007 [email protected]
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Update• Objective
– Model multiple-bit upset for 90 nm CMOS technology
– Calibrate to experimental neutron data
• Status– Device description created
– Simulation is good agreement with experimental data
• Results overview– MBU for neutron irradiation exhibits an angle dependence
– MBU for neutron irradiation exhibits frontside/backside dependence
• Future work– Begin modeling of 65 nm technology
– Characterize impact of angular dependence on error rate
MURI 2007 [email protected]
3
Outline• Background
– Multiple-bit upset (MBU)– Neutron-induced MBU
• Modeling– Monte-Carlo Radiative Energy Deposition (MRED)
• Results– Single-bit– Multiple-bit
• Conclusion• Future work
MURI 2007 [email protected]
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Outline• Background
– Multiple-bit upset (MBU)– Neutron-induced MBU
• Modeling– Monte-Carlo Radiative Energy Deposition (MRED)
• Results– Single-bit– Multiple-bit
• Conclusion• Future work
MURI 2007 [email protected]
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Multiple-bit upset increases with scaling• Reliability
– Memory design
– Testing
• Multiple-bit upset (MBU) has been shown to increase for smaller technologies
• Feature size small relative to radiation events
from Seifert, et al., Intel. IRPS, 2006.
Nucleon-Induced MBU
Maiz et al.
Tosaka et al.Kawakami et al.
Hubert et al.
MURI 2007 [email protected]
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Neutrons induce nuclear reactions• Neutron-induced nuclear reactions
• Secondary products are ionizing particles that induce soft errors
Incident Neutron
Nuclear Reaction
Heavy-Ion
Sensitive Nodes
MURI 2007 [email protected]
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Outline• Background
– Multiple-bit upset (MBU)– Neutron-induced MBU
• Modeling– Monte-Carlo Radiative Energy Deposition (MRED)
• Results– Single-bit– Multiple-bit
• Conclusion• Future work
MURI 2007 [email protected]
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• 90 nm SRAM model• Sensitive node
– Charge collection volume
• Technology Computer Aided Design (TCAD) Model
• Simulation - MRED (Monte-Carlo Radiative Energy Deposition) Code
• Energy deposition cross section - ED(E)
• Multiple node cross section - M(E)
Modeling methodology
MRED
SensitiveNode
ED(E)
Metallization
M(E)
TCADNeutronSpectrum
MURI 2007 [email protected]
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MRED irradiated the TCAD device• TCAD structure created from layout and process information for a 90 nm SRAM
• Device imported into MRED and simulated using Los Alamos Neutron Lab (LANL) WNR beam line neutron spectrum Silicon
bulk
Copper lines
Tungsten vias
Single Cell
MURI 2007 [email protected]
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LANL neutron beam• WNR beam spectrum imported into MRED
• Fluence comparable to cosmic-ray neutron fluence B. E. Takala, “The ICE House: Neutron Testing Leads to More
Reliable Electronics,” Los Alamos Science, 30 November 2006.
MURI 2007 [email protected]
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n+Si
C+3n+2p++3
MRED simulates ionization and nuclear processes
• MRED tracks energy deposition through all layers
• Energy deposition at each sensitive node is calculated
Sensitive Nodes
Cell Array
MURI 2007 [email protected]
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Outline• Background
– Multiple-bit upset (MBU)– Neutron-induced MBU
• Modeling– Monte-Carlo Radiative Energy Deposition (MRED)
• Results– Single-bit– Multiple-bit
• Conclusion• Future work
MURI 2007 [email protected]
13
Energy deposition cross section
ED(E)Cross section to deposit at least E in the sensitive volume
• Relationship to SEU cross sectionSEU = ED (Qcrit)
Energy Deposited (MeV)
Charge Generated (fC)
MURI 2007 [email protected]
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Single volume energy deposition ED(E) is the corresponding cross section to deposit energy E or greater in a single sensitive volume
• Exhibits a slight angle dependence– Shape of sensitive volume
Energy Deposited (MeV)
Charge Generated (fC)
0°45°90
°
MURI 2007 [email protected]
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Multiple volume energy deposition• MBU 2 or more
physically adjacent bits
M(E) is the corresponding cross section to deposit energy E or greater in multiple volumes
• Exhibits a slight angle dependence– Cell spacing– Kinematics of reaction products
Energy Deposited (MeV)
Charge Generated (fC)
0°45°90
°
MURI 2007 [email protected]
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Multiple bit multiplicity• MBU characterized for bit multiplicity
• Probability of an event decreases with increasing multiplicity
#Events(multiplicity)
fluence
MURI 2007 [email protected]
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The fraction of MBU exhibits an angle dependence• Fraction of MBU
(# of MBU events)(# of upset bits)• Fraction of MBU increases for neutrons at grazing angles
• Testing and error calculations must account for angular dependencies
MURI 2007 [email protected]
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Conclusion• Multiple-bit upset is increasing for highly-scaled devices
• Neutron irradiation has been modeled using MRED for a 90 nm CMOS technology
• Cross section differs between frontside and backside irradiation
• Fraction of MBU exhibits an angle dependence for neutron irradiation– Fraction increases at grazing angles– Neutron testing must account for these dependencies
MURI 2007 [email protected]
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Future work• Finish 90 nm work and publish findings– Model 90 nm experimental neutron data
• Begin work on 65 nm technology– Create process and design based model
– Proton and heavy-ion testing Fall/Winter 2007
– Examine impact of angular dependence on error rate