NeSSI*: The Good, The Bad and the Ugly -Early Implementations and Directions

IFPACScottsdale, AZ, USA - January 22, 2003

John Cumbus Rob Dubois

C PΛ C

“the best way to predict the future is to create it”

*New Sampling/Sensor Initiative

“And let it be noted that there is no more delicate matter to take in hand,nor more dangerous to conduct, nor more doubtful in its success, than to set upas the leader in the introduction of changes. For he who innovates will have forhis enemies all those who are well off under the existing order of things, and onlylukewarm supporters in those who might be better off under the new.'’

Niccolò Machiavelli (from The Prince pub. 1515)

Presentation Outline

• Recap of NeSSI Structure, Objectives & History• NeSSI Gen I, II, III Overview• Some “sacred cows”• The good, the bad, the ugly• Implementations and Directions

– POCA Projects– DoE Project

• Acknowledgements• Summary

NeSSI Structure & History

• An ad hoc global industry initiative, formed in June, 2000 to drive permanent change in the way we do Process Analytical.– NeSSI mail-out has now grown to 330+ subscribers

• Represents over 33 End Users from Oil and Petrochemical as wells as Manufacturing Companies, Academia, National Labs

• An “Open” Initiative sponsored by CPAC (Center for Process Analytical Chemistry)

• End User driven

NeSSI Objectives

• Facilitate the acceptance/implementation of...– modular, miniature & smart process analytical

technology• Promote the concept of...

– at the pipe/field-mounted (“by-line”) analytical• Lay the groundwork for...

– open connectivity communication architecture• Provide a technology bridge to the process for...

– “sensor/lab-on-a-chip” microanalytical devices

NeSSI: The Vision of Success

Vision Element: To design, assemble and configure an analytical system on one’s kitchen table.

Courtesy of U. Bonne. Honeywell.

• Reduce Engineering Time– “configurator tool”– self-documenting

• Reduce Assembly Time– Lego Like Assembly

• Lower Maintenance Costs– diagnostics

Courtesy of J. Warnowski/D. Mitchell. Swagelok/Panametrics

NeSSI Generation Segmentation

Gen III

Gen II

Gen IMechanical Components (mostly)

Electrical Transducers/IS Network

Wireless, Advanced Gas & Liq. Sensors

& Platform for microAnalyticalValue

NeSSI Generation IMechanical: Miniature and Modular

• Adapted from SEMI• ANSI/ISA SP76

approved “Standard” Form Factor

• Allows Lego®-like construction

• Several SP76 substrate compliant vendors exist

Courtesy of Swagelok

NeSSI Gen. IINetworked/I.S./ miniTransducers/Wireless PDA

Programmable Substrate Heater

VP

A

F

Ethernet LAN

Analyzer

Controller or PC

SAM

CANbus

PDA

Auxiliary Heating/Cooling

SubstrateT

T

SAMAT

One sensor measures multiple components

Enabling Technologyfor µAnalytical

VTA

A

NeSSI Gen III - an enabling platform for µAnalytical

Ethernet LAN

One sensormeasures one

componentuanlaytical

Fiber Optic

Sacred Cows........ or Opportunities?

• Size of sample passages restrictive to flow• Sample System should be located under the GC• Double block and bleed valves are needed for

stream switching• Modular assembly prone to leaks from number of

connections• Components do not meet area electrical

classification• insufficient flow to purge for stream switching • Flow path difficult to follow without tubing

The Good

• Reduction in detailed engineering effort • Ease of Construction• Saves space, allows options for location• Simple design• Competitive costs • Remote monitoring possible• Alarm on failure• Number of manufacturers increasing

The Bad

• Harder for technicians to intuitively understand / follow• Need more components, broader ranges• O-rings/seals in vertical configuration• Low flow monitors / controllers

The Ugly(Softer Issues)

• Who constructs the system• Packaging for ease of maintenance interface• Interconnection (power, signal, control) with analyzer• SAM interface?• Technician education / acceptance• Re-evaluation of maintenance effort

Field Installations

Substrate Selection

What do we like?

• 4-screw approach• o-ring grooves (gripper)• no torque requirements• flow pattern inscribed• P/N & function visible on

parts

What we don’t like!

• metal seals• tight space • what component is it?• any special tools required• inconsistencies with other

substrates

Shopping List of DownmountComponents

• Pressure regulator• Flow measurement devices• Flow control devices• Quick change filters• Any temp/pressure/flow transmitters

with liquid crystal display

Activities and Directions

• Since IFPAC, 2002– May, 2002. DoE supplier/user team formed & White

Paper developed by U. Bonne/Honeywell Labs– June, 2002. White Paper Submitted to DoE– June, 2002. Honeywell demonstrates first IS CANbus– July, 2002. POCA* Project conceived– August, 2002. ISA SP76 footprint approved by ANSI– 12 Installations in Dow & ExxonMobil Facilities– November, 2002. POCA prototypes ordered.

*POCA = NeSSI Gen II Proof of Concept Apparatus Project

Introducing the POCA Project(s)

• Purpose: Accelerate NeSSI Gen II dev.• Seeded by Dow Chemical, ExxonMobil Chemical,

Air Products• Honeywell is the major supplier/integrator

– B. Nickels/J. Mosher (commercialization & networking)– U. Bonne (sensor R&D)

• Impact to Industry• first SP76 diagnostic physical minisensors (p, T, F)• first SP76 miniactuators (Vo, Vm)• first intrinsically safe, low cost, network IN PROGRESS

Introducing Potential DoE Project

• Purpose– Field test NeSSI Gen II– Develop/source missing components– Certification of electrical products

• ~ $2MM funding (50% “work in kind”)• 2 year duration (1 year lab/1 year field test)

The DoE User/Supplier Team(More folks welcome!!)

• User Team– Peter van Vuuren (ExxonMobil)– Rob Dubois (Dow Chemical)– Joe Andrisani (DuPont)– Steve Wright (Eastman)– Bob Reed (Merck)– Paul Vahey (Honeywell-SM)– D. Young/D. Nettles

(ChevronTexaco)– Frank Scweighardt (Air Products)– George Vickers (BP)– Paul Barnard (EquistarChemicals)– Steve Doherty (Pharmacia)– Bob Maglagenta (Kraft)– Alan Eastman (ConocoPhillips)– UOP

• Supplier Team– Ulrich Bonne (Honeywell Labs)*– Bob Nickels (Honeywell ACS)– Dave Simko (Swagelok)– Steve Doe (Parker-Hannifin)

• CPAC– Mel Koch

* Supplier Team Lead PI

DoE Project Deliverables

1. Heated/Temperature Programmed Substrate2. mini-Sensor Transducers (p, T, F)3. “Combi” Actuator Transducers (Vo, Vm)

(on/off & modulating transducers)

4. SAM - Sensor/Actuator Manager ☺5. Multi-Drop Digital Intrinsically Safe Bus6. Micro Climate Enclosure

Certified CSA, FM, CENELEC

* HMI = Human Machine Interface

Acknowledgements

• ExxonMobil Chemical– Dan Podkulski– Jeff Gunnell– Peter van Vuuren– Rajko Puzic– Kelley Bell

• Honeywell– John Mosher– Bob Nickels– Ulrich Bonne

• CPAC– Mel Koch– Dave Veltkamp

• Dow Chemical– R. Hartwig/D. Quevillon– Craig Snook– B. Vu /P. Williams/J.Leach– R. O’Reilly– W. Henslee

• Air Products– Frank Schweighardt

• Eastman Chemical– Steve Jacobs

• Tatera & Associates– Jim Tatera

Summary...

• Gen I products moving into the field• Strengths and Weaknesses Reviewed

– Strengths to build on…weaknesses to overcome• Gen II - High Level of Activity

– Proof of Concept (POCA) in progress– DoE Potential Project

• Gen III Products in Sight