National Center for Micro- and Nanofabricationlabadviser.danchip.dtu.dk/images/2/22/Stormode_2016.pdf · 13-12-2016 DTU Danchip National Center for Micro- and Nanofabrication DTU

13-12-2016

DTU DanchipNational Center for Micro- and Nanofabrication

DTU DANCHIP

DTU Cen

13-12-2016

Facts and figures

0

5000

10000

15000

20000

25000

30000

35000

40000

45000

50000

2015201420132012201120102009

Registered

tool time (Hou

rs)

Year

C

B

A

Total machine usage Danchip

x3

• 500 registered users

• 80 total staff, 15 research staff, 7PhD stud.

• 77 peer reviewed publications (2015) with DCH/CEN staff directly involved (authored/co-authored); 6 publications in Nature Publishing Group

• Used by 15 departments and 4 Centers of Excellence (Grundforskningscentre)

• 20 companies

• 170 ext. financed research projects with budgeted activities in Danchip/Cen last 5 years

Key numbers

13-12-2016

Facts and figures - Total usage CEN (2015)

0

500

1000

1500

2000

2500

Registrerede

timer

DTU brug af Cen

Cat D Cat E27%

69%

4%

"Low end" mikroskopibrug (Cat D)6273 timer

Cen DTU udover Cen Kommerciel

69%

27%

4%

"High end" mikroskopibrug (Cat E)7709 timer


50%46%

4%

Total mikroskopibrug (Cat D+E)13981 timer


Fraction of access to cleanroom

40%

31%

9%

9%

8%3%

DTU NanotechDTU FotonikDTU RemaningNILt AcademicCommercialCopenhagen University

4

Data collected from November 1st 2015 to November 1st 2016.Danchip operational access has been removed from dataset.Cap is not in effect.Total access in the period: 34134 hours

Facts and figures

Top 20 of personnel cleanroom access0 100 200 300 400 500 600 700 800

Lasse ThamdrupSushil Tandukar

Dmitrii ViazmitinovAnders Simonsen

Hitesh SahooMaksim Zalkovskij

Hoa ThanhYi Zheng

William TiddiEvgeniy Shkondin

Artem ShikinAndrej Mironov

Maksym PlakhotnyukIlja Czolkos

Aurimas SakanasLi Lin

Kristian HagstedSøren Petersen

Xiaowei GuanPedram Sadeghi

5

Data collected from November 1st 2015 to November 1st 2016.Danchip operational access has been removed from dataset.Cap is not in effect.Total access in the period: 34134 hours

Facts and figures

13-12-2016

A more thorough introduction to cleanroom processing

Training engineers - not operators

Prevent downtime and accidents through understanding and insight

scheduled tool package training (TPT)

Preparation,E-learning material

Including :Basic theory on the specific technology, tool manual, video of tool operation

Classroom tool specific theory run through: specific properties of the respective tools,

possible outcomes, typical mistakes

and how to detect and avoid those

Tool training at the tool in small groups

If needed: Individual 2. tool

training and ”driving license

test” at the machine

13-12-2016

Tool package training (TPT) - StatusLithography

in place v1.0 (3h theoretical, 2 (1) practical training session(s), monthly

aim for: more electronic material, 1h theoretical, 1 practical training session, bi-weekly

SEM training

from January 2017: 3h theory 2h practical training at SEM basement 346

Mask design

from February 2017: 6-8 participants, distributed course over 2 weeks

Dry etch training

from February 2017: 3h theory, 2h practical training

Soon: Thin Film TPT

13-12-2016

New clean room access procedure

….faster, more efficient….

a better start into the cleanroom

13-12-2016

13-12-2016

New clean room access procedure

Introduction:Student/postdoc signs on:

- Supervisors Email (supervisor is cc’ed)

- Project type

- Projectnumber (for labmanager)

- Teaching goals

- Expected cleanroom time

- A short project description

- A possible meeting time danchip/supervisor/student

13-12-2016

New cleanroom access procedure

Student/postdoc get the software/e-learning package

- Theoretical safety course is E-learning (video + PP with speak)

- Instructions how to use Labmanager/Labadviser

- Access to Labmanager test site

- Exercises on usage of Labmanager/Labadviser

- Online Test on safety in cleanroom pass/fail

13-12-2016


Student/postdoc has passed and gets access to book practical safety course

- At least once a week

- Limited to 4 participants

- Includes chemistry handling, gowning, etc

- Ends with a second test pass/failed

13-12-2016


Student/postdoc has passed and books a launch meeting with Danchip and supervisor

- Process flow walk through

- Training plan, TPT, individual training

- Possible new APVs, special materials, special chemistry

- Setup regular meetings

Professor in Silicon nanofabrication Henri Jansen started 1 nov 2016

Danchip Technology Research

Diamond

Together with DTU Physics

Material Platform for many applications


Plasma etch of Si with aspect ratio higher than 70

Material Platform for many applications

Danchip Technology ResearchIce lithography


Integrated inductor coils

Soft matter electron microscopy

Strategic frame

characterization

not just imaging

useful for the ”wet” sciences

No professor this round….

Looking for a senior associate professor

try to exploit synergies with

possibilities at Danchip

make use of the

existing toolpark

with few but significant

additions

Acquired a used BioTwin (FEI Tecnaioptimised for soft matter microscopy)

Oneview Camera(since July 2016)

High speedcamera

Nanoparticle melting - Platinum• 5nm particle• Fully melting at 1020ºC• Surface melting ~750ºC

Thomas W. Hansen

Nanoparticle melting - Platinum• 5nm particle• Solidifying at approx 800ºC

Thomas W. Hansen

High Pressure Holder (January 2017)• DensSolution Climate S3+

High Pressure Holder (January 2017)• DensSolution Climate S3+• https://youtu.be/5kn-71sEP48• Surface oscillation of Cu nanoparticle• Direct imaging of real-time dynamics of a catalyst Cu nanoparticle at atomic resolution (350°C,

500 mBar mixed N2+H2+O2 gas flow).

• Dr. M. Willinger & Dr. R. FarraFritz-Haber-Institute, Germany

New (second hand) TEM (April 2017)

Manufacturer FEI

Model Tecnai 12 Bio-Twin

Emitter LaB6(or W)

Resolution 0.49 nm (point)

Acceleration voltage 40 - 120 kV

Camera Orius

Objectivelens

Cs 6.3 mmCc 5.0 mm

120 kV TEM (FEI Tecnai 12)120 kV TEM especially for soft-matter analysis.FEI Tecnai 12 Bio-Twin Information Card

FACILITY

Clearing out the cleanroom ghettos

• III-V will move out of A-5 (”III-V lab”)• Better, shared facilities in ballroom and E-4 & E-5• More open, sharing community• Graphene activities will move to cleanroom with

standard processes

27 13.12.2016

New cleanroom

order

28 13.12.2016

Wet proces-sing and fume hoods

”Clean” Litho-graphy

E-beam

FringetoolsIm

prin

t. S

U8,

cl

uste

r2,

SEM

Furn

ace,

PVD

, Pl

asm

a

6” furn

MOVPE

Ste

pper

Com

mer

cial

, ALD

etc

.

Plas

ma

Ballroom with new fume hoods and wet benches

29 13.12.2016

KOH

BHF

KOH

Nitride

7UP wafers

7UPmasks

BHF

Polyetch

Aletch

Optionaletch

Acetone

IPA

Lift-off

IPA

Techno-Franz

The vision has become reality Behold, the brave new fume hood world is here

30 13.12.2016

Time schedule for fume hoods and wet benches in Ballroom• 8 fume hoods for ballroom

– Most fume hoods released

• 7 Wet benches for ballroom– KOH wet bench: Expected release 15-Feb-2017– Nitride etch: Expected release 15-Jan-2017– Resist strip & lift-off: Expected release: 2017Q1– 7-Up wafers & masks: Delivery 15-Dec-2017. Expected release: 2017Q1– BHF etch, HF etch & Poly etch: Delivery 15-Dec-2017. Expected release 2017Q1

• 2 spinner wet benches + 1 cleaning fume hood for E-5 (litho)– Delivery: 15-Dec-2016– Expected release: 2017Q2

31 13.12.2016

Idea Users Funds Tender Contract FAT SAT Manual Released

Equipment Tetris – moving stuff around and installing new things – plan per December 2016

32 13.12.2016

SüssGamma 4M spinner

SSE

Tool Moves to Date

New wet benches D-3 Nov-Dec 2016

Last old wet benches in D-3 Trash Dec 2016

Old wet benches in C-1 Trash Once newbenches ready

New spinner wet benches E-5 Dec 2016

Heidelberg MLA100 E-5 Jan 2017

New spinner for 2/4/6”UV and e-beam resist E-5 June 2017

Thermal evaporator April 2017

Table-Top SEM Basement January 2017

Diamond CVD (B-1) Apr 2017

Pegasus 2 A-1 Feb-Apr 2017

III-V fume hoods Trash

Nanoscribe 2PP Fotonik Dec 2016

Old wet benches in D-3 Trash Dec 2016

New wet benches D-3 Dec 2016

Spinner benches

Pegasus 2Diamond CVD

2 PP

Inclined UV

Thermal evaporator

EVG

620

Spin track

Old wet benches & fume hoods

Heidelberg

MLA 100

Tools leaving the cleanroom• SSE Maximus. Has been shut down• SVG spin track. Replaced by Gamma 4M• Nanoscribe 2 photon polymerization. Will go to DTU Fotonik• Old wet benches in Ballroom (replaced by new benches and fume hoods)• Wet benches in C-1 (old yellow room)

– Replaced by new wet benches in Ballroom– Will stay until new benches are ready

• SIMS (no replacement – use external services)• PECVD-2 (replaced by PECVD-4)• Cryofox (already transferred to TI)

33 13.12.2016

E-beam column service • 13 February 2017 to 27 February 2017• New calibration files needed afterwards• Improved spot size in field corners

34 13.12.2016

NEW TOOLS

New bonder tool• Pre-align in KS MA-6 aligner• Released for use• Standard processes established• No user editing of recipes• No samples smaller than 10x10 mm2

• Extra sample holder is being ordered

36 13.12.2016


New 2/4/6” coater for e-beam and UV• 4/6” coater station

– AZ5214E– MIR 701– AZ 4562– Syringe dispense– EBR

• 2” coater station– CSAR

• Flexible tool• Potential backup for other Gamma spinners• Transfer to Gamma platform complete

– Easier training– Easier process transfer– Easier maintenance

37 13.12.2016


New imprint tools• The blue and the white NIL

• CNI 1.5 and 2.0 from NILT

• Alignment not possible

• Heating up to 280 deg. C

38 13.12.2016


Heidelberg maskless aligner


• UV LED illumination, 365 nm(can expose all g-, h-, and i-line photoresists)

• Minimum feature size: 1 µm (on 0.5 µm resist)• Linewidth variation, 3σ: 200 nm• Alignment accuracy, 3σ: 1 µm• Maximum substrate size: 6” x 6”• Minimum substrate size: 5 x 5 mm²• Maximum write area: 125 x 125 mm²• Substrate thickness: 0.1 to 6 mm• Average writing time: Ca. 4 hours for 4” wafer• Grey scale exposure possible

(Process development needed)• Suitable for rapid prototyping• Unsuitable for many wafers• NO mask making! There is no business case.

plasma/thermal ALD from Picosun


Key features

- Highly flexible ALD system, thermal & plasma-ALD

- Stacked substrates (pieces – 8” wafers)

- ”Work horse” as well as new capabilities

- New chemistries, e.g. for metals and metal nitrides

- Low temperature processes

Accepted – being prepared for release January 2017

Processes (so far)

- Al2O3 , TiO2 , HfO2 , SiO2

- AlN , TiN

- acceptance tests on planar substrates and trench structures


• SiO / SiN / SiON / BPSG / (Ge doped)

• Including stress-tuning capability

• Refurbished SPTS system (2011)

PECVD-4Replacement for PECVD-1/2

Installation “almost” done

- Initial functional tests done

- Started processing tests (undoped SiO2)

- Toxic lines (B2H6 and PH3) need running in

- Process transfer from PECVD-2 from Q1

Pegasus 2 + happy Roy


• Background: – Bottleneck situation on Pegasus 1– Backup system & research

• 2nd hand system being installed

• Expected release around March-April 2017


Key features

- Microwave Plasma CVD (2nd hand system)

- Generator: 5 kW @ 2.45 GHz

- Substrate: 4” max (2” standard)

- Gases: N2 , H2 , CH4 , O2

- Installation: Q1 2017

Diamond thin film: Seki SDS 5250S

Thermal Evaporation: Lesker NANO 36- resistive heated boats (simple system)


• Background & system:– Heavy load on Wordentec– Improve flexibility/costs– single substrate (up to 200 mm)– 2 source assembly (resistive heated)

Table-top SEM: Hitachi TM3030plus


- Variable pressure- BSE & SE detector- Manual stage (X-Y)- Easy access- To be released in January

(XPS-room in basement)

MONEY

Payment for materials

47 13.12.2016

InvoiceProjectSpecificationDanchip use

LabManagerregistrations

Yes always Commercial Yes always

Yes always DTU -externalfunding Yes always

Yes always DTU – noexternal funding Yes always

Material price changes 2017• Cost of DUV resists is significant and will be added as a materials cost

– DUV42S-6: 3.7 kr/g– KRF M35G: 2.2 kr/g– KRF M230Y: 2.2 kr/g

• Prices for noble metals have changed significantly:– Gold: 2.7 kr/nm– Platinum: 2.1 kr/nm– Palladium: 1.2 kr/nm

• ALD sources priced at cost:– TMA: 3.2 kr/s– DEZ: 7.6 kr/s– TiCl: 1.1 kr/s

• Automatic registration:– Machine readout - crystal information, internal gauges– Logbook entries

48 13.12.2016

Payment for services

49 13.12.2016

InvoiceProjectSpecificationDanchip/Cen service use

LabManagerregistrations

Yes always Commercial Yes always –commercial prices

Yes always DTU -externalfunding

Project getsburdened with

cost less than ‘fullcost’

Yes always DTU – no externalfunding

No invoice or costburdening

Unified price model for Danchip/Cen serviceComplete overhaul:

– Re-evaluate cost objects for UK95 (Academic) justification– All registrations in ”Anlægs kartotek” audited and corrected for

funding agencies/infra-structure funding/private funding– Capacity/actual hours puzzle solved for the categories

Overall results– Commercial pricing: No changes– Academic pricing: Mainly increases– All SEMs at 346 move to Cat D

50 13.12.2016

Service prices – external commercial users (UK90)

a) Cleanroom access above cap of 20 hours is 0 kr/h

Service from Danchip New price2017

Present price 2016

Unit

Cleanroom access (below cap)a) 800 800 kr/h

Danchip assistance 1250 1250 kr/h

Cleanroom area 1600 1600 kr/m²/mo

Category A tools 370 370 kr/h

Category B tools 630 630 kr/h

Category C tools 3600 3600 kr/h

Category D tools 1200 1200 kr/h

Category E tools 1700 1700 kr/h

Category F toolsb) 0 0 kr/h

Service cost - External funded projects and users (UK95, Danish academia)

a) Cleanroom access above cap of 20 hours is 0 kr/h

Service from Danchip Cost 2017 Present cost 2016

Unit

Cleanroom access (below cap)a) 550 350 kr/h

Danchip assistance 550 450 kr/h

Cleanroom area (500) (200) kr/m²/mo

Category A tools 170 160 kr/h

Category B tools 400 300 kr/h

Category C tools 2100 1800 kr/h

Category D tools 550 800 kr/h

Category E tools 1300 1200 kr/h

Category F toolsb) 0 0 kr/h

3 TO TAKE HOME

• Changes in access procedure, safety course, training (TPT)

• Professor started – collaboration projects welcome !!

• A host of new tools• 9 wet benches, 9 Fume hoods, Oneview camera, BioTwin, Bonder,

PECVD 4, Pegasus 2, Tabletop SEM, Thermal evaporator, Diamond deposition,ALD 2, CNI NIL 1.5, CNI NIL 2.0, Maskless aligner, Resist coater station

Documents

National Center for Micro- and Nanofabricationlabadviser.danchip.dtu.dk/images/2/22/Stormode_2016.pdf · 13-12-2016 DTU Danchip National Center for Micro- and Nanofabrication DTU