NanoLambda NSP32-V1 Spectrometer - System Plus

©2017 System Plus Consulting | NanoLambda – NSP32-V1 Spectrometer 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

NanoLambda – NSP32-V1 Spectrometer

Nano spectrometer for IoT and industrial

MEMS/Imaging report by Sylvain HallereauJune 2017

mailto:[email protected]

mailto:[email protected]

http://www.systemplus.fr/

http://www.systemplus.fr/


Table of Contents

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o NanoLambda

o NanoLambda Technology

Physical Analysis 13

o Synthesis of the Physical Analysis

o Physical Analysis Methodology

o Spectrometer Module 16

Module Views & Dimensions

Module Corss-Section

Module Disassembly

Top Package Disassembly & Cross-Section : Window, Diffuser, Reflector

o Spectrometer Die 34

Die View, Dimensions & Marking

Nano optical filter array

Filter Array View & Dimensions

Photodiode

Filter Cross-Section

Pads & Pixels

Die Main Blocks ID

Die Process

Die Cross-Section

Process Characteristics

Physical Comparison 57

NSP32-V1 and SCiO spectrometer

Manufacturing Process Flow 62

o Global Overview of the Spectrometer Head

o Sensor Front-End Process Flow

o Sensor Wafer Fabrication Unit

o Package and Module Assembly Process

o Package Assembly Unit

Cost Analysis 68

o Synthesis of the cost analysis

o Yields Explanation & Hypotheses

o Sensor 74

Sensor Front-End Cost

Sensor Back-End 0 : Probe Test, Thinning & Dicing

Sensor Wafer & Die Cost

Package Cost

Module cost

o Component 83

Spectrometer Component Cost

Estimated Price Analysis 85

Company services 87


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

• NanoLambda brings spectrometry to consumers. The second spectrometer to be integrated in a smartphone or other IoTequipment is very small, with an area of 7.5 mm x 6.5 mm and only 5.7mm of thickness.

• To provide spectral analysis, NanoLambda’s distinguishing feature eliminates the optical network usual in spectrometers,replacing it with a bespoke 32x32 filter array based on a technological breakthrough, the plasmonic filter. The very thinfilter array is manufactured at the wafer level just after the metal layers directly on the light sensor array IC, it is amonolithic solution.

• The light sensor array circuit is specific with large pixels to increase the sensitivity of the spectrometer.

• All data processing is done by a exterior processor.

• The report also includes a comparison between the characteristics of the NSP32-V1 and the SCIO Molecular sensor fromConsumer Physics. The comparison highlights differences in technical choices made by the companies and their impactson the process flow and manufacturing cost.

• Based on a complete teardown of the NanoLambda Spectrometer, the report provides technology and cost analysis witha detailed focus on the spectrometer module. Complete cost analysis is provided, fully disclosing the potential for massadoption of the component.


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary


Physical Analysis


Cost Analysis


About System Plus

The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price

Reverse Costing Methodology


Overview / Introduction


Physical Analysis o Synthesiso Spectrometer Moduleo Spectrometer Packageo Spectrometer Sensoro Comparison


Cost Analysis


About System Plus

Synthesis of the Physical Analysis






Cost Analysis


About System Plus

Module View

18

.25

mm

6.46mm

Front view. Back view.

Model and Lot code

5.7

mm

Spectrometer window/diffuser

Spectrometer window

Lateral view.






Cost Analysis


About System Plus

Module Cross-Section






Cost Analysis


About System Plus

Spectrometer Die

Spectrometer Die – Top view

XX mm

XX

mm

XX mm

XX

mm

Die Area: XXmm²(XX x XX mm)

Nb of PGDW per 8-inch wafer: XX

Pad number: 26Connected : 25

Pixel array: XX mm²(XX x XX mm)

resolution: 32 x 32 = 1024

Pixel area: XX µm²

Pixel size: XX µm






Cost Analysis


About System Plus

Pixel Cross-Section






Cost Analysis


About System Plus

Patent




Physical Analysis


Cost Analysiso Synthesiso Supply Chaino Yieldso Sensor Wafer & Die Costo Package Costo Component Cost


About System Plus

Sensor Front-End Cost




Physical Analysis


Cost Analysiso Synthesiso Supply Chaino Yieldso Sensor Wafer & Die Costo Package Costo Component Cost


About System Plus

Module Assembly Cost per Process Steps




Physical Analysis


Cost Analysis

Selling Price Analysiso Manufacturer Price

About System Plus

Spectrometer Component Estimated Manufacturer Price




Physical Analysis


Cost Analysis


About System Pluso Company serviceso Feedbackso Contacto Legal

• SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle

• STMicroelectronics Time of Flight Proximity Sensor in the Apple iPhone 7 Plus

• Lenovo Phab2Pro 3D ToF Camera

MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT

IMAGING• Gas Sensor Technology and Market

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

PATENT ANALYSIS - KNOWMADE

IMAGING• Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

http://www.systemplus.fr/reverse-costing-reports/scio-molecular-sensor-from-consumer-physics-mobile-spectrometer-dongle/

http://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-time-of-flight-proximity-sensor-in-the-apple-iphone-7-plus/

http://www.systemplus.fr/reverse-costing-reports/lenovo-phab2pro-3d-tof-camera/

https://www.i-micronews.com/category-listing/product/gas-sensor-technology-and-market.html







http://www.systemplus.fr/reverse-costing-reports/consumer-physics-scio-molecular-sensor-patent-to-product-mapping/


COMPANYSERVICES




Physical Analysis


Cost Analysis



Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis


Cost Analysis



Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

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NanoLambda NSP32-V1 Spectrometer - System Plus