NAN YA PCB CORPORATION · 2010. 1. 4. · Multi-Core 2+4+2 37.5mmSQ 2.66 3.33 2.33 1.66 1.33 0.40 2001 2006 6+4+6 37.5x40mm Multi-Chipset Packaging Status 1 Integrated-Chipset Packaging

PAGE 1

NAN YA PCB CORPORATIONNAN YA PCB CORPORATION

2010 NYPCB, All Rights Reserved.

January 2010

COMPANY BRIEFING

PAGE 2



Safe Harbor NoticeSafe Harbor Notice

�Nan Ya PCB’s statements of its current expectations are forward-looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements.

�Except as required by law, we undertake no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise.

PAGE 3



Mass Prod.

(in FPG)

Outside-

Buying

SandSand

CopperRefinery

CopperRefinery

Copper Foil1992

Copper Foil1992

Crude OilCrude OilCopper OreCopper Ore

Oil RefineryNaphtha Crake

1998

Oil RefineryNaphtha Crake

1998

Epoxy1986

Epoxy1986

Glass Yarn1991

Glass Yarn1991

Wafer1998

Wafer1998

Glass Cloth1990

Glass Cloth1990

DRAM1995

DRAM1995

Copper CladLaminate1986

Copper CladLaminate1986

PCB1985

PCB1985

Electronic FieldElectronic Field

Substrate2000

Substrate2000

LCD1995

LCD1995

Vertical Integration within FPGVertical Integration within FPG

Nan Ya PCBNan Ya PCB

FPG IntroductionFPG Introduction

PAGE 4



MilestoneMilestone

Year 1985 Start up PCB mass production

Year 1997 Establish Na Ya PCB Corporation

Year 2000 Start up Wire-bond Substrate mass production

Year 2001 Start up Flip-chip Substrate mass production

Year 2002 Start up Kunshan PCB mass production

Year 2006 IPO (TWSE Ticker No.: 8046)

Company IntroductionCompany Introduction

PAGE 5



Production Allocation and Monthly CapacityProduction Allocation and Monthly Capacity


+P6 8M UnitsP6 8M Units

Flip ChipFlip Chip

PCB, HDIPCB, HDI

P1+P5 15M UnitsP1+P5 15M Units

P3 160KSFP3 160KSF

P7 7M UnitsP7 7M Units P8 (15M Units)P8 (15M Units)

+

KS P1 1.2MSFKS P1 1.2MSF

+

Wire BondWire Bond

P2 320KSFP2 320KSF

+

Note: KS=Note: KS=KunshanKunshan China manufacturing campusChina manufacturing campus

KS P2 600KSFKS P2 600KSF

+

KS P2 225KSFKS P2 225KSF

+

PAGE 6



Structure of ShareholdersStructure of Shareholders


Date: August, 2009Date: August, 2009

Total Shares: 630,398,531 sharesTotal Shares: 630,398,531 shares

Nan Ya PlasticsNan Ya Plastics

65.3%65.3%

Chunghwa Post 2.7%Chunghwa Post 2.7%

Nan Shan Life Insurance 1.9%Nan Shan Life Insurance 1.9%

CitiCiti Asia Fund 1.9%Asia Fund 1.9%

Standard Chartered Emerging Market 0.7%Standard Chartered Emerging Market 0.7%

Shin Kong Life Insurance 0.7%Shin Kong Life Insurance 0.7%

Capital High Tech Fund 0.6%Capital High Tech Fund 0.6%

Fidelity Greater China Fund 0.5%Fidelity Greater China Fund 0.5%

GIC 0.5%GIC 0.5%

ABP 0.5%ABP 0.5% OthersOthers

24.7%24.7%

PAGE 7



3,689

2,5422,868 2,952

3,301 3,440 3,574 3551 3517

2,469

1,896

967

1,507

1,9672,201 2,179 2,334

2,574 2620 2702 2683 2,696

3501

2,646

0

500

1,000

1,500

2,000

2,500

3,000

3,500

4,000

4,500

Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

2008 2009

2008~2009 Monthly Revenue in Taiwan2008~2009 Monthly Revenue in Taiwan

��2009 December2009 December Sales Sales == NT$ 2.7 BillionNT$ 2.7 Billion；；；；；；；；MoMMoM=+1.9%=+1.9%；；；；；；；；YoYYoY=+42.2%=+42.2%

��Accumulated 2009 Sales = NT$ 27.08 Billion ; Accumulated 2009 Sales = NT$ 27.08 Billion ; YoYYoY==--27.4%27.4%

Company Current StatusCompany Current Status

NT$ M

PAGE 8



2009 Sales Breakdown by Application2009 Sales Breakdown by Application


Networking 5%Automotive 2%

Consumer 6%

IC Substrate 74%

PC&Peripheral 13%

PAGE 9



Products & ApplicationsProducts & Applications--PCPC

CPUFC-PGA

North BridgeFC-BGA

South BridgeWB-BGA

GPUFC-BGA

DDRⅡⅡⅡⅡDRAM Module

Conventional PCBPC Motherboard


PAGE 10



Integrated ChipsetFC-BGA35mm2

3/2/3

MPUFC-BGA27mm2

2/2/2

Integrated ChipsetFC-BGA42.5mm2

3/2/3

MPUFC-BGA33mm2

2/2/2

A B

MPUFC-BGA21mm2

2/2/2

Integrated ChipsetFC-BGA31mm2

2/2/2

C

Products & ApplicationsProducts & Applications--Game ConsoleGame Console


PAGE 11



Set-Top Box37.5mm2

2/2/2

HDTV Chipset35mm2

2/2/2

Products & ApplicationsProducts & Applications--OthersOthers

��SetSet--Top Box and HDTV started to migrate to flipTop Box and HDTV started to migrate to flip--chip design in 2007, and annual chip design in 2007, and annual


demand has been expected to increase dramatically in 2009 .demand has been expected to increase dramatically in 2009 .

PAGE 12



Thank YouThank You

Q & AQ & A

PAGE 13



FC Substrate Development TrendFC Substrate Development Trend�CPU Development

(Source: Intel Web, DigiTimes Lab : 2007/1)

130 65 45 90 32

(GHz)

20052000

Pentium 3

2+2+235mmSQ

2002

Pentium 4

1+4+137.5mmSQ

Dual-Core

2+4+237.5mmSQ

2007 2008 2009 2010

Multi-Core

2+4+237.5mmSQ

2.66

3.33

2.33

1.66

1.33

0.40

20062001

6+4+637.5x40mm

Multi-Chipset PackagingStatus 1

Integrated-ChipsetPackagingStatus 2

4+4+432x37.5mm

(Mainly for high-end product)

Wafer Process Technology Evolution

(Nanometer)

Chip on Board

Appendix Appendix

Documents

NAN YA PCB CORPORATION · 2010. 1. 4. · Multi-Core 2+4+2 37.5mmSQ 2.66 3.33 2.33 1.66 1.33 0.40 2001 2006 6+4+6 37.5x40mm Multi-Chipset Packaging Status 1 Integrated-Chipset Packaging