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Approved for Public Release – Distribution Unlimited MTO & Heterogeneous Integration Dr. Mark Rosker, MTO Director Briefing prepared for LUMOS Proposers Day November 20, 2019

MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

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Page 1: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

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MTO & Heterogeneous Integration

Dr. Mark Rosker, MTO Director

Briefing prepared for LUMOS Proposers Day

November 20, 2019

Page 2: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

2

Microsystems Technology Office (MTO)

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Page 3: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

MTO’s Mission

DE

MTO’s core mission is the development of high-performance, intelligent microsystems and next-generation components to enable dominance in national security C4ISR, EW, and DE applications

The effectiveness, survivability, and lethality of these systems depends critically on microsystems

C4ISR Electronic Warfare Directed Energy

UNCLASSIFIED

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Page 4: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

MTO Vision

1. Embedded Microsystem Intelligence / Localized Processing

2. Next-Generation EMComponents & Technologies

3. Microsystem Integration for Functional Density & Security

4. Disruptive Defense Microsystem Applications

C4ISRElectronicWarfare

Directed Energy

UNCLASSIFIED

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Page 5: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

Heterogeneous IntegrationMillimeter Wave Digital Arrays (MIDAS)

Provide Full Coverage for Multi-Beam Networked Communication

• High-gain in all directions for improved network performance

• Wide bandwidth & frequency agility to adapt to future needs

Unclassified

1. Embedded Microsystem Intelligence / Localized Processing

2. Next-Generation Components &

Technologies for Spectrum Dominance

3. Microsystem Integration for Functional Density & Security

4. Disruptive Defense Microsystem Applications

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Page 6: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

6

Electronics Resurgence Initiative (ERI)

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Page 7: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

7

Modern electronics development waves

Unclassified

Perf

orm

ance

, N

um

ber

of

Tra

nsi

stors

1990 2000 2010 2020 20301980

1st Wave Geometric

Scaling

• DUV lithography• Automatic

Place/Route

2nd WaveBEOL Scaling

• More scaling• Low-κ/Cu interconnects• Bus width scaling• Logic Synthesis

3rd Wave3D Devices

• Even more scaling• FinFETs• High-κ dielectric• Strain engineering • Multi-core architectures

Intel 486

Device Innovations Architecture InnovationsDesign Innovations

Dennard Scaling Ends

4th Wave3D Heterogeneous Integration

• A little more scaling• 3D architectures• Specialized processors• Domain-specific architectures• Design & security automation

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Page 8: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

ERI strategy: Innovating the 4th waveTHE ELECTRONICS RESURGENCE INITIATIVE

3D Heterogeneous Integration

New Materials & Devices

Specialized Functions

Design & Security

Unclassified

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Page 9: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

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Compound Semiconductor Materials On Silicon (COSMOS)

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Page 10: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

1 10 100 1k 10k 100k 1M 10M 100M 1G

The FutureInP HEMT

GaAs HBT

InP HBT

SiGe HBT

SOI

CMOS

SiGe BiCMOS

GaAs pHEMT

ABCS HBT

ABCS HEMT

Level of Integration

Perf

orm

an

ce

III-V’s offer key

performance advantages

Si offer incredible

integration levels

Heterogeneous Integration Offers Best of Both Worlds

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Page 11: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

CSMANTECH / April 2008 / 11

Compound Semiconductor Materials

On Silicon (COSMOS)

Program Objective: Heterogeneous integration all the way to the transistor scale

• Enable materials selection within circuits – without loss of transistor performance

• Exploit existing SOA CMOS infrastructure & integration levels – without process modification

DoD Benefits

• Achieve higher functional density: dense integration of analog, mixed-signal, & digital electronics

• Enable circuits with lower dissipated power & far higher I/O throughput

Today

Flip-chip

Reflow solder bumps

200 μm pitch

Chip size

~1 mm

COSMOS Vision

Allow the circuit designer to select the optimal

transistor technology everywhere in the circuit

Heterogeneous integration exists only on a

very coarse scale – and not in the signal path

Si CMOS

Compound

Semiconductor (CS)

“Chiplets”

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Page 12: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

CSMANTECH / April 2008 / 12

Interfaces

OthersABCS

What is COSMOS About?

InP HBT

Si CMOS

Yield

GaAs pHEMT

Thermal management

Avoid any

process change

• Manage the dislocations and

defects at the interfaces that

could degrade transistor

performance

• Accommodate CTE mismatch

between materials

• Place (or grow) very small CS “chiplets” in exactly

the right position on a processed CMOS wafer/die

• High-density process

• Process consistent

with integration

approach

• Remove heat

from “chiplets”

• High interconnect yield

Interconnects

Assembly

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Page 13: MTO & Heterogeneous Integration LUMOS_Proposers_Day...MTO Vision 1. Embedded Microsystem Intelligence / Localized Processing 2. Next-Generation EM Components & Technologies 3. Microsystem

www.darpa.mil

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