MSP432 Hardware Tools - Farnell

MSP432 Hardware Tools

User's Guide

Literature Number: SLAU571March 2015

Contents

Preface ........................................................................................................................................ 41 Hardware ............................................................................................................................ 6

1.1 MSP-TS432PZ100 Rev1.0 ................................................................................................. 71.1.1 Board Configuration For External Target Power Supply ..................................................... 101.1.2 Board Configuration When Using ARM® Cortex®-M Debug Probes With Target Power Supply

Capability .......................................................................................................... 111.1.3 Bill Of Materials.................................................................................................... 121.1.4 Kit Contents ........................................................................................................ 13

1.2 MSP-TS432PZ100 Rev1.1................................................................................................ 141.2.1 Board Configuration For External Target Power Supply ..................................................... 171.2.2 Board Configuration When Using ARM® Cortex®-M Debug Probes With Target Power Supply

Capability .......................................................................................................... 181.2.3 Bill Of Materials.................................................................................................... 191.2.4 Kit Contents ........................................................................................................ 20

1.3 MSP-TS432PZ100 Revision History..................................................................................... 20

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List of Figures1-1. MSP-TS432PZ100 Target Socket Board, Schematic................................................................... 81-2. MSP-TS432PZ100 Target Socket Board, PCB .......................................................................... 91-3. Board Configuration For External Target Power Supply .............................................................. 101-4. Board Configuration For Debugger-Supplied Target Power.......................................................... 111-5. MSP-TS432PZ100 Target Socket Board, Schematic ................................................................. 151-6. MSP-TS432PZ100 Target Socket Board, PCB ........................................................................ 161-7. Board Configuration For External Target Power Supply .............................................................. 171-8. Board Configuration For Debugger-Supplied Target Power.......................................................... 18

List of Tables1-1. Device and Hardware Tool Compatibility List ............................................................................ 61-2. Important Board Components.............................................................................................. 91-3. MSP-TS432PZ100 Bill Of Materials ..................................................................................... 121-4. Important Board Components ............................................................................................ 161-5. MSP-TS432PZ100 Bill Of Materials ..................................................................................... 19

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PrefaceSLAU571–March 2015

Read This First

About This ManualThis manual describes the hardware tools that support the Texas Instruments MSP432™ device family ofARM® Cortex®-M based microcontrollers.

How to Use This ManualThis manual describes the setup and operation of the hardware tools. It does not fully describe theMSP432 microcontrollers or the development software systems. For details of these items, see theappropriate TI documents listed in Important MSP432 Documents on the Web.

This manual applies to the following hardware tool:• Stand-alone target socket board named MSP-TS432PZ100

Important MSP432 Documents on the WebThe primary sources of MSP432 information are the device-specific data sheets and user's guides. TheMSP432 web site (www.ti.com/msp432) contains the most recent versions of these documents.

Documents that describe the Code Composer Studio™ tools (Code Composer Studio™ IDE, assembler,C compiler, linker, and librarian) can be found at www.ti.com/tool/ccstudio. A Wiki page (FAQ) that isspecific to the Code Composer Studio tools is available atprocessors.wiki.ti.com/index.php/Category:CCS. The Texas Instruments E2E™ Community supportforums at e2e.ti.com provide additional help.

Documentation for third-party tools, such as the IAR Embedded Workbench® for ARM IDE or the SeggerJ-Link debug probe, can be found on the respective third-party website.

If You Need AssistanceSupport for the MSP432 devices and the hardware development tools is provided by the TexasInstruments Product Information Center (PIC). Contact information for the PIC can be found on the TI website at www.ti.com/support. The Texas Instruments E2E Community support forums for the MSP432 ate2e.ti.com provide open interaction with peer engineers, TI engineers, and other experts. Additionaldevice-specific information can be found on the MSP432 web site at www.ti.com/msp432.

MSP432, Code Composer Studio, E2E are trademarks of Texas Instruments.ARM, Cortex are registered trademarks of ARM Limited.IAR Embedded Workbench is a registered trademark of IAR Systems AB.

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http://www.ti.com/tool/ccstudio

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http://e2e.ti.com/

http://www.ti.com/support

http://e2e.ti.com/

http://www.ti.com/msp432


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Chapter 1SLAU571–March 2015

Hardware

This chapter contains information relating to the hardware tools and includes schematics, PCB pictorials,and bills of materials. All other tools are described in separate product specific user's guides. Informationabout the Texas Instruments XDS100 and XDS200 debug probes is not included in this document, andcan be found at www.ti.com/tool/xds100 and www.ti.com/tool/xds200, respectively.

Table 1-1. Device and Hardware Tool Compatibility List

Part Number Socket Type Supported DevicesMSP-TS432PZ100 100-pin QFP (PZ100) MSP432P401RIPZ

Topic ........................................................................................................................... Page

1.1 MSP-TS432PZ100 Rev1.0 ...................................................................................... 71.2 MSP-TS432PZ100 Rev1.1..................................................................................... 141.3 MSP-TS432PZ100 Revision History ...................................................................... 20

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www.ti.com MSP-TS432PZ100 Rev1.0

1.1 MSP-TS432PZ100 Rev1.0The MSP-TS432PZ100 target socket board can be used to develop applications with theMSP432P401RPZ devices in 100-pin QFP package. Two standard ARM Cortex-M debug connectorsprovide connectivity to a large number of debug probes from Texas Instruments and third parties.

All device pins are readily accessible through dedicated headers, which makes the board the ideal centerof a prototype setup.

7SLAU571–March 2015 HardwareSubmit Documentation Feedback


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MSP-TS432PZ100 Rev1.0 www.ti.com

Figure 1-1. MSP-TS432PZ100 Target Socket Board, Schematic



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Figure 1-2. MSP-TS432PZ100 Target Socket Board, PCB

Table 1-2. Important Board Components

Reference DescriptionIC1 Socket for PZ100 packageJA 20-pin Cortex-M debug connectorJB 10-pin Cortex-M debug connector

Header to disconnect 3.3-V LDO voltage input from pin 19 of header JA. Pin 19 of header JA is used by someJP8 third party ARM Cortex-M debuggers (for example, Segger J-Link and IAR i-Jet) to supply a 5-V voltage to the

target system.Header to disconnect 3.3-V LDO voltage output from INTVCC. Remove this header if your debugger does notJP12 supply power to avoid current draw by the unpowered LDO.

J1 Selector between internal and external power supply. Keep J1-1 and J1-2 always connected.Header to disconnect DVCC from VCC supply. Connect an ampere meter to measure current flowing into theJP1 digital domain.Header to disconnect AVCC from VCC supply. Connect an ampere meter to measure current flowing into theJP2 analog domain.VCC header. Can be used to observe device VCC when supplied by the debug probe or to feed in externalJ2 power.



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1.1.1 Board Configuration For External Target Power SupplyIf the application needs to operate in stand-alone mode (for example, to measure current consumptionwithout debug overhead) or when using ARM Cortex-M debug probes that do not provide power for thetarget device (for example, TI XDS100, XDS200, Keil ULINK2, or Keil ULINK Pro), power must besupplied externally to the target socket board.

Always follow the voltage limits defined in the device data sheet. Also make sure that the followingjumpers have been set as shown here before connecting the debug probe and power supply:• JP8: Open• JP12: Open• J1: Close 1-2• JP1: Closed• JP2: Closed• J2: Connect external VCC to pin 1, and external GND to pins 2 or 3

Figure 1-3. Board Configuration For External Target Power Supply



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1.1.2 Board Configuration When Using ARM® Cortex®-M Debug Probes With Target PowerSupply CapabilitySome third-party ARM Cortex-M debuggers (for example, Segger J-Link and IAR i-Jet) can optionallysupply a 5-V voltage to the target system through pin 19 of the debug connector. The LDO IC2 uses thisvoltage to generate the 3.3-V target supply voltage. To use the LDO, make sure the following jumpers areset as shown here before connecting the debug probe:• JP8: Closed• JP12: Closed• J1: Close 1-2• JP1: Closed• JP2: Closed

Figure 1-4. Board Configuration For Debugger-Supplied Target Power



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1.1.3 Bill Of Materials

Table 1-3. MSP-TS432PZ100 Bill Of Materials

No. PerPos. Ref Des. No. Description Digi-Key Part No. CommentBoard1 C1, C2, C8, C9 4 DNP, CSMD0805 DNP2 C3 1 10uF/10V, CSMD0805 490-1709-2-ND

C4, C6,3 5 100nF, CSMD0805 490-1666-1-NDC10,C13,C144 C5 1 1.1nF, CSMD0805 490-1623-2-ND5 C7,C11,C15,C16 4 1uF/10V, CSMD0805 490-1702-2-ND6 C12 1 4u7, CSMD0805 445-1370-1-ND7 D1 1 green LED, DIODE0805 P516TR-ND8 D2 1 yellow LED, DIODE0805 DNP9 D3 1 red LED, DIODE0805 DNP10 R1 1 330R, 0805 541-330ATR-ND11 R2, R3, 2 330R, 0805 541-330ATR-ND DNP

R5, R6, R7, R8, R9,12 8 0R, 0805 541-0.0ATR-ND DNPR1513 R12, R13 2 0R, 0805 541-0.0ATR-ND14 R4 1 47k, 0805 541-47KATR-ND15 R10, R11 2 0R, 0805 541-0.0ATR-ND DNP16 R14 1 47k, 0805 541-47KATR-ND DNP

91kOhm, 0.1%, 25ppm/°C ,17 R16 1 P91KDACT-ND0805R17, R18, R19,18 7 27R, 0805 541-27ATR-NDR20, R21, R22, R23

JP1, JP2, JP9, JP7,19 6 2-pin header, male, TH SAM1035-02-ND place jumper on headerJP8, JP1220 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP21 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-222 JP3, JP5 2 12-pin header, male, TH SAM1034-06-ND23 J2 1 3-pin header, male, TH SAM1035-03-ND

25-pin male or female SAM1029-25-ND or DNP, male and female24 J3, J4, J5, J6 4 header, TH SAM1213-25-ND headers enclosed with kit25 JA 1 20-pin connector, male, TH HRP20H-ND

Samtec: FTSH-105-01-F-D-26 JB 1 10-pin connector K27 BSL 1 10-pin connector, male, TH HRP10H-ND DNP

Socket: IC357-1004-053N,28 IC1 1 Manuf. YamaichiLQFP10029 IC1 1 MSP432P401RPZ DNP, enclosed with kit30 L1 1 4.7uH, 0806 490-4044-1-ND Murata

MS3V-TR1 (32,768kHz/31 Q1 1 DNP, enclosed with kit20ppm/12,5pF)32 Q2 1 DNP, Crystal DNP

KX-7T 48MHz 12pF33 Q3 1 Geyer Electronic - 12.8871030/30/50ppm34 SW2 1 EVQ-11L05R P8079STB-ND35 SW1 1 EVQ-11L05R P8079STB-ND36 U1 1 TLV70033DDC, TSOT23-5 296-25276-2-ND



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1.1.4 Kit Contents• One READ ME FIRST document• One MSP-TS432PZ100 target socket board• Two MSP432P401RPZ device samples• One 32.768-kHz crystal from Micro Crystal• Four SAM1029-25-ND 25-pin 100-mil through-hole male headers• Four SAM1213-25-ND 25-pin 100-mil through-hole female headers



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1.2 MSP-TS432PZ100 Rev1.1The MSP-TS432PZ100 target socket board can be used to develop applications with theMSP432P401RPZ devices in 100-pin QFP package. Two standard ARM Cortex-M debug connectorsprovide connectivity to a large number of debug probes from Texas Instruments and third parties.

All device pins are readily accessible through dedicated headers, which makes the board the ideal centerof a prototype setup.



http://www.ti.com


DN

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Figure 1-5. MSP-TS432PZ100 Target Socket Board, Schematic



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1

Vcc

ext

int

Vcc

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Figure 1-6. MSP-TS432PZ100 Target Socket Board, PCB

Table 1-4. Important Board Components

Reference DescriptionIC1 Socket for PZ100 packageJA 20-pin Cortex-M debug connectorJB 10-pin Cortex-M debug connector

Header to disconnect 3.3-V LDO voltage input from pin 19 of header JA. Pin 19 of header JA is used by someJP8 third party ARM Cortex-M debuggers (for example, Segger J-Link and IAR i-Jet) to supply a 5-V voltage to the

target system.Header to disconnect 3.3-V LDO voltage output from INTVCC. Remove this header if your debugger does notJP12 supply power to avoid current draw by the unpowered LDO.

J1 Selector between internal and external power supply.JP1 Header to measure current flowing into AVCC and DVCC power domains.

Header to disconnect DVCC from VCC supply. Connect an ampere meter to measure current flowing into theJP2 digital domain.J2 Header to feed external voltage to device. If used, connect J1-2 and J1-3.

JP15 Header to bypass 3V3 LDO in case a debug probe supplies a logic level voltage through pin 19 of header JA.Header to disconnect AVCC from VCC supply. Connect an ampere meter to measure current flowing into theJP16 analog domain.VCC header. Can be used to observe device VCC when supplied by the debug probe or to feed in externalJ7 power.



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Feed external

GND here

Feed external

VCC here


1.2.1 Board Configuration For External Target Power SupplyIf the application needs to operate in stand-alone mode (for example, to measure current consumptionwithout debug overhead) or when using ARM Cortex-M debug probes that do not provide power for thetarget device (for example, TI XDS100, XDS200, Keil ULINK2, or Keil ULINK Pro), power must besupplied externally to the target socket board.

Always follow the voltage limits defined in the device data sheet. Also make sure that the followingjumpers have been set as shown here before connecting the debug probe and power supply:• JP8: Open• JP12: Open• J1: Close 2-3• JP1: Closed• JP2: Closed• J16: Closed• J2: Connect external VCC to pin 1, and external GND to pins 2 or 3

Figure 1-7. Board Configuration For External Target Power Supply



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1.2.2 Board Configuration When Using ARM® Cortex®-M Debug Probes With Target PowerSupply CapabilitySome third-party ARM Cortex-M debuggers (for example, Segger J-Link and IAR i-Jet) can optionallysupply a 5-V voltage to the target system through pin 19 of the debug connector. The LDO IC2 uses thisvoltage to generate the 3.3-V target supply voltage. To use the LDO, make sure the following jumpers areset as shown here before connecting the debug probe:• JP8: Closed• JP12: Closed• J1: Close 1-2• JP1: Closed• JP2: Closed• JP16: Closed

If the debug probe supplies a logic level voltage through pin 19, the LDO can be entirely bypassed usingJP15. Always follow the voltage limits defined in the device data sheet.

Figure 1-8. Board Configuration For Debugger-Supplied Target Power



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1.2.3 Bill Of Materials

Table 1-5. MSP-TS432PZ100 Bill Of Materials

No. PerPos. Ref Des. No. Description Digi-Key Part No. CommentBoard"MSP-TS432PZ100" Rev.1 PCB 1 95.0 x 100.0 mm 2 layers, green solder mask1.1

2 C1, C2 2 12pF, CSMD0805 1276-1120-1-ND DNP3 C8, C9 2 22pF, CSMD0805 490-3608-1-ND4 C3 1 10uF/10V, CSMD0805 490-1709-2-ND

C4, C6, C10, C13,5 5 100nF, CSMD0805 490-1666-1-NDC146 C5 1 1.1nF, CSMD0805 490-1623-2-ND7 C7, C11, C15, C16 4 1uF/10V, CSMD0805 490-1702-2-ND8 C12 1 4u7, CSMD0805 445-1370-1-ND

green LED, HSMG-C170,9 D1 1 516-1434-1-NDDIODE080510 D2 1 yellow LED, DIODE0805 DNP11 D3 1 red LED, DIODE0805 DNP12 R1 1 330R, 0805 541-330ATR-ND13 R2, R3, 2 330R, 0805 541-330ATR-ND DNP14 R5, R6, R7, R8, R9 5 0R, 0805 541-0.0ATR-ND DNP15 L1 1 4.7uH, 0806 490-4044-1-ND Murata16 R12, R13, R15 3 0R, 0805 541-0.0ATR-ND17 R4 1 47k, 0805 541-47KATR-ND18 R10, R11 2 4k7, 0805 541-4.7KATR-ND19 R14 1 47k, 0805 541-47KATR-ND DNP

91kOhm, 0.1%, 25ppm/°C ,20 R16 1 P91KDACT-ND0805R17, R18, R19,21 7 27R, 0805 541-27ATR-NDR20, R21, R22, R23JP1, JP2, JP9, JP7,22 4 2-pin header, male, TH SAM1035-02-ND place jumper on headerJP16

23 JP8, JP12, JP15 3 2-pin header, male, TH SAM1035-02-ND not jumperedDNP, keep pads free of24 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND solder

25 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2JP3, JP4, JP5, JP6,26 5 2x2-pin header, male, TH SAM1034-02-NDJP14

27 J2, J7 2 3-pin header, male, TH SAM1035-03-NDDNP: Headers are enclosed

28 J3, J4, J5, J6 4 25-pin header, TH SAM1029-25-ND in kit. Keep vias free ofsolder.DNP: Receptacles are

29 J3, J4, J5, J6 4 25-pin receptacle, TH SAM1213-25-ND enclosed in kit. Keep viasfree of solder.

30 JA 1 20-pin connector, male, TH HRP20H-NDSamtec: FTSH-105-01-F-D-31 JB 1 10-pin connector FTSH-105-01-F-D-K K

32 BSL 1 10-pin connector, male, TH HRP10H-NDSocket: IC357-1004-053N,33 IC1 1 Manuf. YamaichiLQFP100

34 IC1 2 MSP432P401RIPZ Not enclosed in kit



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Table 1-5. MSP-TS432PZ100 Bill Of Materials (continued)No. PerPos. Ref Des. No. Description Digi-Key Part No. CommentBoard

DNP, Micro Crystal,MS3V-TR1 (32,768kHz/35 Q1 1 depends on application enclosed in kit, keep vias20ppm/12,5pF) free of solderDNP, keep vias free of36 Q2 1 DNP, Crystal depends on application solder

KX-7T 48MHz 12pF37 Q3 1 Geyer Electronic - 12.8871030/30/50ppm38 SW2 1 EVQ-11L05R P8079STB-ND39 SW1 1 EVQ-11L05R P8079STB-ND40 IC2 1 TLV70033DDC, TSOT23-5 296-25276-2-ND

1.2.4 Kit Contents• One READ ME FIRST document• One MSP-TS432PZ100 target socket board• One TI Terms and Conditions for Evaluation Modules• One 32.768-kHz crystal from Micro Crystal• Four SAM1029-25-ND 25-pin 100-mil through-hole male headers• Four SAM1213-25-ND 25-pin 100-mil through-hole female headers

1.3 MSP-TS432PZ100 Revision History

Revision Date CommentsRev1.0 May 2014 Internal revisionRev1.1 March 2015 First released revision



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