Presenter’s Name June 12 to 15, 2011S Di CACompany

Kevin Fredriksen /Kevin Fredriksen /

San Diego, CA

Kevin Fredriksen / Kevin Fredriksen / MSO MSO –– Multi Site Optimizer Multi Site Optimizer

FF IEEE SW T t W k hIEEE SW T t W k hFor For IEEE SW Test WorkshopIEEE SW Test Workshop

CompanyLogo

Kevin Kevin FredriksenFredriksen, SPA GmbH , SPA GmbH GermanyGermany

Customer support / SalesCustomer support / Sales

OVERVIEWOVERVIEW

MSO HISTORYMSO HISTORYMSO basics and facts

Optimization exampleOptimization example

Multi site layouts & touchdown options

Stepping path algorithmsStepping path algorithms

MEMS wafer test – a multi site quest!

SummarySummary

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 2222

MSO HISTORYMSO HISTORY

Prober Multi site test on prober

Multi site test

p

Wafer= NON-OPTIMIZED

touchdown positioning

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 3333

MSO HISTORYMSO HISTORY

Prober Multi site test on prober

Multi site test

p

?

= NON-OPTIMIZEDtouchdown positioning

Wafer

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 4444

MSO HISTORYMSO HISTORY

MULTI SITE TEST SITUATIONMULTI SITE TEST SITUATIONMulti site test on prober

Most probers do not supply any intelligent stepping algorithms

MULTI SITE TEST SITUATIONMULTI SITE TEST SITUATIONp

Unnecessary high amount of touchdowns to process

As a result: long process times

Highlighted fields signalizepotential touchdown

surplus !

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 5555

surplus !

MSO HISTORYMSO HISTORY

Create a program that minimizes p gtouchdowns by automatic shifting

of touchdown coordinates.

IS-TESTGmbH

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 6666

PRIMARY GOAL: minimize total amount of touchdowns

MSO HISTORYMSO HISTORY

Optimized touchdown positioningTouchdown column shift

o a a ou o ouc do s

Touchdown

Touchdown surplus/fall-out

afterTouchdown row shift

aftercolumn/row shift

6 out of 56 touchdowns saved!

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 7777

MSO

Basics and factsThe benefits and usability of MSO

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 8888

INTRODUCTIONINTRODUCTIONINTRODUCTIONINTRODUCTION

The Multi Site Layout Optimizer (MSO) is an easy to use

software for optimizing multisite layouts.

Less touchdowns The benefits:

Optimized probing path

Optimized hot probing

Find ideal probecard layout

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 9999

MSO workflow AMSO workflow A

Controlmap Physical wafer Multisite probecard

+ +

Optimized steppingOptimized touchdowns

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 10101010

MSO workflow BMSO workflow B

Controlmap Physical wafer Multisite params

+ +

Ideal multi site probecard layout

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 11111111

MSOMSOE l

Complete OptimizationExample

Touchdowns and stepping path

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MINIMIZE TOUCHDOWNS

Prober: 44 Tochdowns MSO: 38 Touchdowns

= 14,6 % TD reduction!

Technology: automatic column / row shift

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 13131313

OPTIMIZE PROBING PATH

Prober stepping: 1680mm MSO stepping: 1056mm

= ~37 % Stepping reduction!

Technology: shortest way

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TESTTEST--COST REDUCTIONCOST REDUCTIONSS COS UC OCOS UC OWafertype/Prober parameters

Dies to test / Wafer = 3 823 Test Time / TD = 5 sec.Dies to test / Wafer 3.823

Number of DUT = 128

NonNon--optimizedoptimized MSOMSO

Test Time / TD 5 sec.

X/Y Stepping / sec = 100mm

Number of TD / Wafer 44 TD 38 TD

Test time / Wafer 220 sec. 190 sec.

X/Y Stepping / Wafer 1680 mm 1056 mm

Stepping Time / Wafer 17 sec. 11 sec.

Total Test Time / Wafer 237 sec. 201 sec.

Process time reduction /wafer = 36 sec.36 sec. = ~15%

TEST COST REDUCTION!

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 15151515

MSOMSO

Feature Overview

Multi site layouts and touchdown options

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MSO TOUCHDOWN OPTIONSMSO TOUCHDOWN OPTIONS

Multi siteshape options:shape options:

Touchdown shifting algorithms:g

COL shift ROW shift

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MSO TOUCHDOWN OPTIONSMSO TOUCHDOWN OPTIONS

Untouchable die zones

(=> overlappings/untested)

Manual touchdown edit

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 18181818

MSO MSO RESULT DATARESULT DATA

Touchdown data Stepping path data

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MSOMSO

Feature Overview

Stepping path algorithms

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MSO STEPPING OPTIONSMSO STEPPING OPTIONS

Meander stepping options

Meander Meander_shift(North-East shift)

Meander_shift(Column shift)

Time optimized stepping

(North East shift) (Co u s t)

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 21212121

Shortest way

MSO STEPPING OPTIONSMSO STEPPING OPTIONS

Hot probing optimizations *

Optimized stepping for more uniform heat expansion

Longest waySpiralRadial

of probe card, tester interface and prober head plate.

* BLEYL, et al, SWTW 2011

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, ,

MEMS wafer testMEMS wafer test:: a multi site quest :::: a multi site quest ::

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MEMS Waferprocess

MEMS MEMS WaferWaferCAPCAP

SENSORSENSORSENSORSENSOR

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MEMS chip structure

SENSOR CAP wafer

electrical testing

b d dlNO-contact area for

test pads surface

probecard needlescontact area probecard needles

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 25252525

MEMS test pads

Probecardneedles

position #1position #1

Probecardneedles

position #2position #2position #1position #1

on MEMS die

position #2position #2

on MEMS die180° DIE rotation!!

Alternating needle position on dies!

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 26262626

MEMS wafer test

Single Single SiteSiteprobingprobing

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MEMS single site test

Probecard layoutNeedles contactingupper sensor pads

MEMS die

Chip type a Chip type bChip type a Chip type b

Needle damageby collision withCAP f

Electrical test OKCAP surface test OK

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 28282828

MEMS single site test1. Test 2. Test

2 3 411 2 3 4

180° f

Long wafer process time !

180° wafer rotation!!

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MEMS Wafertest

Wh tWhy not process MEMS wafer withinMEMS wafer within

ONEOtest cycle ?

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MEMS Wafertest

Multi SiteProbing

!!!!!!

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MEMS multi site test

Wh t th t ti l bl kiWhat are the potential blocking points p

for multi site testing

MEMS devices?

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 32323232

MEMS multi site test

Blocking points?Probecard site needles

touching the CAP Wafertouching the CAP Wafersurface (causing damage)

Needles touching CAP area of die Needles touching wafer EDGE area Needles touching wafer EDGE area

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 33333333

MEMS multi site testExample

One touchdown

2x22x2 lti itlti it2x22x2 lti itlti it2x22x2 multi sitemulti sitelayoutlayout

with 1 skip columnwith 1 skip column

2x22x2 multi sitemulti sitelayoutlayout

with 1 skip columnwith 1 skip column

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 34343434

MEMS multi site test

First touchdownFirst touchdown

MS layout

1

2

3

4 Special steppingl ith f MEMS1 3 algorithm for MEMS

to avoid CAP contact

MEMS device can be tested in ONE probing cycle!

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 35353535

MEMS multi site test

WAFER EDGE ZONE !!!WAFER EDGE ZONE !!! Needle damage!

SOLUTION → see next page

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 36363636

MEMS multi site testUNTOUCHABLE DIES

Automatic touchdown repositioning → creating 2 double touched dies!

=> Safe needle contacting via untouchable die zones !

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 37373737

MEMS multi site test

WAFER EDGE ZONE !!!

26 241

2

26

27

28 12

25

24

2726

2829

30 25

1

Automatic touchdown repositioning → creating 6 double touched dies here !

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 38383838

MEMS multi site testBlocking points?Blocking points?

Contact of probecard and

CAP/EDGE wafer can

be a oided b intelligentbe avoided by intelligent

touchdown positioning!p g

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 39393939

SUMMARYSUMMARYSUMMARYSUMMARYMSO optimized touchdown positioning increases prober test efficiency and saves process time!

MSO is able to provide special stepping pathMSO is able to provide special stepping path algorithms, which are useful to:

compensate probing-related problems such as needle expansions during HOT PROBING (already used by customer NXP)

handle wafer-specific features and optimize the handle wafer specific features and optimize the test process (e.g. MEMS / future prospect)

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 40404040

ACKNOWLEDGEMENTSACKNOWLEDGEMENTSACKNOWLEDGEMENTSACKNOWLEDGEMENTS

Jan Martens (NXP Germany)Jan Martens (NXP Germany)

Torsten Liese (IS-TEST)

Axel Dressel (SPA GmbH)

Georg Sauer (SPA GmbH)

Thomas Schäfer (SPA GmbH)

l d d k ( G b )Roland Fredriksen (TRF GmbH)

June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011June 12 to 15, 2011 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 41414141

THANK YOUTHANK YOUVERY MUCH FOR YOURVERY MUCH FOR YOURVERY MUCH FOR YOUR VERY MUCH FOR YOUR

ATTENTION! ATTENTION!

Questions?Questions?Questions?Questions?

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SPA Software Entwicklungs GmbHSeifartshofstr. 12-1496450 CoburgGERMANYGERMANY

Phone: +49(0) 9561/79 47 0Fax: +49(0) 9561/79 47 77

Web: www.spa.deMail: info@spa.de

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