Moldex3D Series Product

Version: R14.0

2

Contents

> Introduction

– Overview of Moldex3D

> Product Strong Points

– Powerful pre-processing

– Computing technology

> Moldex3D R14.0 Portfolio and Special Advantages

> Moldex3D Products Summary

Introduction

4

What Moldex3D Do

> World’s leading innovator of 3D CAE software for plastic

injection molding

> Provide a simulation process to perfectly bring the heritage

of experiences of design validation before manufacturing

> Bridge an efficient way to lead the critical

productoptimizations with a broad range of solutions

Iteration

Validation Innovation

5

Moldex3D in Product Lifecycle Management

> Strategic alliance with leading CAD/CAE software, working

closely for product integration

> Offer an extended platform for enhanced simulation

performance

Product

Lifecycle

Management

Molding Innovation

6

Success Customers

> Adopted by 2,500+ renowned companies and industries

> Prove Moldex3D capabilities of bringing quality solutions

Automobile High Tech/Electronics Material/Equipment

7

Non-Stop Technology Innovation

R9.1

R10.0

R9.0

R8.1

R3.xR4.x

R7.0

R5.x

R7.1

R6.x

R8.0

Shell Gas

Shell FPCW

Solid RIM

Solid Fiber

Solid FPCW

Solid Mesh

Enhanced

Flow

Parallel-SMP

Tetra Mesh

Solid MCM

Solid I2

Hybrid Mesh

Parallel-

Cluster

Windows

x64

BLM

Enhanced

FastCool

eDesign

Optics

Viscoelastic

Transient

Cool

License

Manager

RHCM

IC

Packaging

Optical

Molding

Automatic

3D Meshing

Cooling

Optimization

Insert

Molding

Two-Color

Molding

FEA

Integration

Mold Insert

Complete

3D Solid

Simulations

Remote

Computing

Solid Warp+

BLM+

eXplorer

ICM

Stress

Remote

Computing

on Linux

NX, Creo

EmbeddedDesign

Verification

Conformal

Cooling

Cloud

Computing

2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

R12.0

R11.0

Advanced

Hot Runner

Co-Injection

Gas / Water

Injection

MuCell®

DOE

HyperWorks

Partner

Alliance

Designer

Underfill

SolidWorks

Embedded

Viewer

Underfill

Project

Microcellular

Foaming

eDesignSYNC

Injection

Compression

PIM/MIM

Compression

Molding

Bi-injection

Annealing

FSI

Cloud

Computing+

R13.0

Fiber+

Designer

BLM

CCD

Cadence

Interface

2014

Mold

Deformation

Customization R14.0

Moldex3D

Digimat-RP

Designer

BLM+

Fiber+

Hot Runner

Steady

2015 2016

CADdoctor

RTM

Resin Transfer

Molding

MuCell®+

F/P/W+

Powerful Pre-Processing

9

Advanced Meshing Technology

> Moldex3D aims at wide applications to provide different

features for boosting work efficiency in pre-processing

preparation

Moldex3D Mesh• Professional pre-processing tool with robust meshing technology

• Various solid meshing types with elements of pure tetra, pure voxel, Hybrid, and boundary layer mesh (BLM)

Moldex3D Designer• Intelligent pre-processor with eDesign and boundary layer mesh (BLM) modes

- eDesign mode: Simple, fast, and efficient meshing technology

- BLM mode: High-quality, precise, and more accurate meshing technology

• Equipped with efficient CADdoctor and Cooling Channel Designer (CCD) tools for geometry healing/simplification and conformal cooling analysis

CAD-Embedded Pre-Processing (eDesignSYNC)• Full integration with Creo, NX, and SOLIDWORKS®

• Direct and flexible part design in familiar CAD environment

• Seamless interoperability with Moldex3D simulation (Flow/Pack/Cool/Warp/MCM)

10

Export mesh model

Generate solid mesh

Build cooling system

Build runner system

Import model

eDesign Mesh

Easy to Learn for Designers (Easy, Fast, Efficient)

> Full auto-meshing features and powerful wizards

> User-friendly interface with intuitive setting guidance

> Provide eDesign users efficient modeling and meshing

preparation

Automatic meshing

11

Boundary Layer Mesh (BLM)

Advanced Technology for Specialists (Accurate, Precise, Efficient)

> Agile with delicate meshing efficiency and quality with higher

simulation accuracy

> Enhance solver accuracy for viscous heating, pressure simulation,

and warpage prediction

> New automatic mesh generation technology with further robust

non-matching support in R14 New in R14

Export mesh model

Generate solid mesh

Build cooling system

Build runner system

Import model

Automatic meshing

12

Solid Mesh (Hybrid)

Manual Mesh Creation for Customized Purpose

(Flexible, Delicate, Accurate)

> Combine different mesh elements of tetra, pyramid, prism, and hexa

> Increase mesh resolution significantly with flexible control of

biasing mesh pattern and element layer count in thickness direction

> Fit complex geometry shapes and have good mesh quality

PyramidTetra HexahedronPrism

Export mesh model

Generate solid mesh

Build cooling system

Build runner system

Import model

Manual meshing

13

Meshing Technology Positioning

Design Validation

(eDesign)

Molding Innovation

(BLM)

Molding Innovation+

(Solid)

Automatic meshing Automatic meshingAdvanced manual meshing(Hexa, Prism, Pyramid, Hybrid)

CAD/PLM integrationCAD/PLM integration

Process optimization

Process optimization

Innovative process supports

Easy, fast, efficient Accurate, precise, efficient Customized, delicate, accurate

Computing Technology

15

> Support parallel computing with an effective utilization of multi-core CPU

and PC cluster

> Provide multiple remote computing farms for more efficient calculation on

single computer with high analysis efficiency

Stay ahead with enhanced speed

High Performance Parallel Processing

Remote computing

High Performance Computing (HPC)

R14 Portfolio and Special Advantages

17

Moldex3D R14 Product Portfolio

> Comprehensive solutions with series of simulation packages:

– eDesign Basic

– eDesign

– Professional (eDesign + BLM + Tetra)

– Advanced (eDesign + BLM + Tetra + Hybrid)

> More specific solutions for innovative process demands:

– IC Packaging

– Solution Add-on

> One license for both thermoplastics

and thermosets(* excluding IC Packaging)

18

Included modules

eDesign Basic Package

> Full range of flow simulation capabilities

> Decide ultimate gate location, eliminate

weld lines and air traps with the filling

behavior prediction

> Designer

> Flow

> Parallel Processing *4

> Project

19

eDesign Package

> Full auto-meshing feature and intelligent

wizards with intuitive workflow

> Simple, fast, and efficient for your part

design validation

> Designer

> Flow

> Pack

> Cool

> Warp

> MCM

> Parallel Processing *4

> Project

> Solution Add-ons*

*: optional

Included modules

20

Professional Package

> Include eDesign, BLM, and Tetra meshing

technologies

> Cover auto-features of eDesign and robust

meshing capabilities

> Enhanced simulation efficiency for exact

molding innovation

> Designer

> Designer BLM

> 3D Coolant CFD

> Flow

> Pack

> Cool

> Warp

> MCM

> Parallel Processing *8

> Project

> Solution Add-ons*

*: optional

Included modules

21

Advanced Package

> Include eDesign, BLM, Tetra, and Solid meshing

technologies

> Increase mesh resolution with flexible control

of diverse mesh elements creation

> Give in-depth validation and bring innovation

for the highest complex process

> Designer

> Designer BLM

> 3D Coolant CFD

> Flow

> Pack

> Cool

> Warp

> MCM

> Parallel Processing *12

> Project

> Solution Add-ons*

*: optional

Included modules

22

IC Packaging

> Mesh

> Designer

> Cadence Interface*

> Flow

> Cure

> Cool

> Warp

> MCM

> Stress

> FEA Interface

> Compression Molding*

> Underfill*

> Viscoelasticity (VE)*

> Wire Sweep

> Paddle Shift

> Post Mold Cure*

> Project

> Parallel Processing*8

*: optional

> A complete series solution for IC

Packaging process

> Provide in-depth analysis, and optimize

IC Packaging layout design

Included modules

23

Solution Add-on

> More advanced modules for specific

process demands

> Flexible functionality extensions for

innovative process concept

> eDesignSYNC

> CADdoctor

> Cooling Channel Designer

> Fiber

> Stress

> FEA Interface

> Micromechanics Interface

> Digimap-RP

> Expert

> Advanced Hot Runner

> Optics

> Viscoelasticity (VE)

> Powder Injection Molding

> MuCell®

> GAIM

> WAIM

> Co-Injection

> Bi-Injection

> CM

> ICM

> RTM

New in R14

New in R14

Included modules

CAD Interoperability

25

Seamless Integration with CAD

NXCreo SolidWorks

eDesignSYNC A series of CAD-embedded interfaces for eDesign analysis

> Full integration with PTC Creo, NX, and SOLIDWORKS

> Deliver a seamless workflow from familiar CAD design to Moldex3D

eDesignSYNC simulation

> Synchronize design changes with simulations directly with no need to

setup analysis repeatedly

> Bring eDesignSYNC users immediate part design validation

26

Intelligent Geometry Healing Tool

CADdoctor An auto-fixing tool for poor features healing of geometry

> Flexible multi-CAD data exchange between Moldex3D pre-

processing and multi-CAD platforms

> Fix and simplify the defects and complicated features with high-

quality surfaces and entities

> Increase quality of BLM and make pre-processing smoother

27

Cooling Channel Design Tool

Cooling Channel Designer (CCD)Efficient Cooling Channels Design for

Conformal Cooling Analysis

> Create conformal cooling channels automatically based on

the contour of product

> Provide a fast and intuitive workflow to build complex cooling

system

> Observe the flow behaviour inside the channels with further 3D

Coolant CFD analysis

Standard Analysis Functions

29

Flow

Standard Analysis - 1/5

> Simulate the filling process of melted plastic inside the cavity

> Help optimize gate and runner design with achievement of minimum

weld lines, air traps, burn marks, and short shot problems

> Enhanced particle tracking simulation

> Enhanced flow solver and more reliable to mesh resolution

computation efficiency

Trapped air temperature and

pressure indicate burn mark possibility

Everything starts from filling analysis

Weld line prediction for

defects identification

BLM 2 layers

BLM 5 layers

More independent to mesh

resolution calculationParticle tracer analysis

30

Standard Analysis - 2/5

> Impose the melt into the cavity continuously after filling

> Predict gate freeze time and estimate effective packing time for average

pressure effect

> Minimize sink marks and shrinkage for warpage control

Enhanced pressure transmission and

more uniform packing effectSink mark validation

Shrinkage prediction

Shrinkage compensation, minimize warpage effectPack

31

Standard Analysis - 3/5

> Support cooling simulation with advanced analysis

capabilities for mold and cooling circuit designs:

– Transient cool

– Variotherm

– Conformal cooling inserts

– 3D coolant CFD

> Control mold temperature variations to optimize cooling

efficiency and minimize part warpage

1 bar 0.1 bar 1 bar 0.1 bar

Turbulence cooling simulation

Cool Efficient mold temperature management

32

Standard Analysis - 4/5

> Validate part deformed ratio of shrinkage effect such as sink marks,

volumetric shrinkage and warpage for quality excellence

> Support to consider fiber orientation, residual stress and material

viscoelasticity for accurate warpage prediction

> New Enhanced Warp analysis to consider transient effect in mold for

further better warpage and shrinkage rate prediction

Minimize part deformation for perfect design accuracyWarp

New in R14

33

Standard Analysis - 5/5

> Simulate insert molding, overmolding and multi-shot sequential

molding processes

> Evaluate the interactions of different materials, and consider the

material properties to minimize warpage and delamination

> Evaluate core deflection by unbalanced flow

Precise multi-component molding analysis

Note:

One-way FSI is supported. Two-way FSI

analysis needs an additional Stress license

MCM

Heat and Cool Management

35

> Standard Cool solver supports automatic detection of

insulation air gap layer between hot runner metal and mold

> Support quick steady analysis for complex hot runner system, and save

analysis time for hot runner layout designers

> Easier to prepare mesh at air gap region, visualize temperature

distribution for better heating rod/coil design verification

> Efficiently optimize heating cycle and provide more accurate prediction

> Help improve thermal uniformity and prevent degradation of plastic material

Insights of Thermal and Flow in Melt Delivery

Manage thermal control to enhance molding efficiencyAdvanced Hot Runner

New in R14

Fiber Reinforced Plastics and

Structure Validation

37

> Support complete fiber predictions to improve

product dimensional stability and resistance to

deformation:

– Short fibers, long fibers and flakes

– Fiber length distribution

– Fiber orientation

– Flake orientation

> Further consideration of screw-induced fiber length, fiber breakage, and

fiber concentration simulation

Fiber Reinforced Plastics

Fiber orientation helps decide product structural strength

Short fiber prediction Long fiber prediction

Flake orientation indicates flow mark and

weld line on the surface

Fiber breakage and fiber length

distribution results

Fiber

38

Stress and Deformation

> Mechanical properties evaluation with fiber orientation, annealing, post

curing, and boundary condition settings analyses

> Support core shift analysis for core deflection simulation with inserts and

fluid interaction

> Provide further structure analysis for mold deformation behaviour

(only in Solid)

Examine the effect of deformed behavior under the force loading

Annealing

Stress

Core Shift

Note:

Core Shift analysis is supported in Solid projects,

except IC Packaging, ICM, and CM

Total displacement

39

> Integrated with leading software with kinds of format output:

– ANSYS, ABAQUS, LS-DYNA, MSC-Nastran, Marc, Radioss

> Enhanced user interoperability with ANSYS Workbench and ABAQUS

interface output efficiency

> Provide direct data output and 3D results mapping for efficient structure

validation

Interactive structural analysis with leading FEA software

Integrated Interfaces for Structural Analysis

FEA Interface

40

> Give a plus for integration of Digimat and Converse to bring an enhanced

prediction accuracy of structural behaviour with direct data output of:

– Weld line

– Fiber orientation

– Flow-induced residual stress

– Temperature

– MuCell®

Integrated Interfaces for Structural Analysis

Micromechanics

Interface Direct data output for structure performance validation

Micromechanics

Interface

Composite

material analysis

FEA software

Nonlinear analysis LS-DYNA

Fiber orientation

MuCell®

Structural FEA

41

> A new joint product with e-Xstream engineering

> Bridge a straight-forward workflow from Moldex3D injection molding to

Digimat advanced material modeling simulation

> Give more accurate structural nonlinear material validation of reinforced

plastic parts

Better Non-linear Modeling Simulation

More accurate simulations of composite materials Digimat-RP

Moldex3D

Fiber orientation

Moldex3D Stress Solver

Linear behavior

Moldex3D

FEA Interface

Moldex3D

Micromechanics Interface

Moldex3D Digimat-RP

FEA software

Non-linear behaviors

▪Failure

▪Buckling

▪Large deformation

▪Crack

▪Fatigue…

FEA software

Linear behavior

New in R14

Injection Molded Plastic Optics

43

Enhance warpage calculation accuracy

Realistic Material Characteristics of Plastics

Fringed order Total displacementRefractive index

Viscoelasticity/Optics

> Predict polymer material properties for flow-induced residual stress during

packing and cooling stages

> VE supports warpage, stress, and annealing analysis for further part

deformed evaluation

> Estimate with Moldex3D Optics for birefringence, retardation, and

polarization performance for optical parts optimization

> Integrate with CODE V for advanced refractive index simulation

DOE & Optimization

45

Design of Experiment for optimal analysis decision

An Effective Tool for Optimized Result

Expert

> A professional tool that uses efficient DOE method to quickly obtain

optimized design for part quality evaluation from the proposed results

> Support IC Packaging project and linear shrinkage as quality factor

Original result

Optimized result

Special Molding Processes

47

> Simulate cell nucleation, cell growth and melt expansion behaviours during

microcellular foaming process

> Visualize cell radius and cell number density distributions for surface quality

improvement

> Support core-back feature for foaming simulation enhancement, better

understanding of gas volume fraction variation of cell distribution

> Provide cell size and cell density data output to Digimat for structural

performance validation

Utilize physical foaming to enhance product quality

Make Products lighter

MuCell® is a registered trademark of Trexel, Inc.

MuCell®

48

> Simulate injection molding stage in the process workflow

> Support particle tracer function for better

prediction of phase separation phenomena

> Consider the impact on powder concentration

distribution effect for black lines and shrinkage

evaluation

Powder Concentration Performance Monitor

Freedom of shaping metal/ceramic partsPowder Injection Molding

Black line prediction

Weld line prediction

49

> Control the process variation after the compression to

decide the charge design

> Predict optimized compression conditions for perfect

shape of large and fairly intricate parts

> Simulate with fiber-length orientation to avoid degradation

and optimize product strength

Dynamic performance for wall thickness design

Better Control of Compression Process

Compression Molding

Pressure distribution Fiber orientation

50

> Support with VE and optics analysis for thin and flat products to optimize

residual stress, shrinkage and warpage

Enhanced replication for the parts with micro structures

Solution to Micro Structures

Smaller shrinkage variation

Compression birefringence effect

Velocity vector movements prediction

ICM

51

> 3D visualization of dynamic interactions between skin and core

materials penetration for estimating shrinkage and warpage

> Full insights of skin and core advancement with blow through prediction for

identifying skin thickness and core expansion

> Pinpoint potential high temperature and stress locations to optimize critical

characteristics of different sequential materials

Two Materials on Skin/Core Variation

Optimize two materials dynamic combinations

Material distributionVolumetric shrinkage Warpage

Co-Injection

52

> Determine polymer and gas entrances positions with proper injection time

and injection volume of plastic and gas

> Optimize skin thickness and core-out ratio distribution to avoid gas fingering

effect, blow through, etc

3D visualization of dynamic gas and fluid penetration

Even Skin/Core Ratio Distribution Control

GAIM/WAIM

53

Two Materials Filling Behavior

Two separated melt entrance setting for filling optimization Bi-Injection

> Designate two respective material and process condition with each flow rate

profile to suit the needs

> Calculate the two melt front advancement and predict the potential weld line

locations and distribution to optimize gate design

54

Large Dimension Composite Molding Technique

Predict filling behaviours of resin through fiber mat Resin Transfer Molding

> New module in R14.0 for the simulation of filling performance to the effects

on different fiber mat types and orientation

> Predict the filling behaviours in thickness direction to find the optimal

control of resin infusion

New in R14

IC Packaging

56

An Independent Product for Specific IC Industry

A series of solutions for IC Packaging layout designIC Packaging

> Support complete simulation capabilities for chip encapsulation process:

– Transfer molding

– Underfill

– Compression molding

– Wire sweep

– Paddle shift

– Post mold curing

– Filler concentration

> Demonstrate clearly entire processes from filling, curing to warpage, having

overall consideration of IC components and drag force of resin flow

> Provide realistic structure analysis on wire sweep and paddle shift with

stress solver supports of ANSYS, ABAQUS, and Moldex3D Stress

> Apply in compression molding and wafer level packaging process simulation

to examine the molding behaviours on stacked-die and substrate under the

compression force effect and find the optimized compression conditions

57

An Independent Product for Specific IC Industry

Warpage validation under the cure shrinkage effect IC Packaging

(Post Mold Curing)

> Predict the warpage behaviours affected by CTE mismatch and cure

shrinkage effects

> Accurately control the inherent stresses and validate the amount of warpage

> Provide filler particles simulation to observe that how the particles

aggregate, how the concentration varies, and find an optimal gate

design to achieve an uniform distribution

> Simulate with Moldex3D Powder Injection Molding module to have in-depth

verification of inner structure on IC products design

IC Packaging

(Filler concentration)

Filler particles behaviours validation for an even

concentration distribution

Conclusion

59

Moldex3D Product

> Moldex3D complete series products lead you to explore your

ideas, prove your concept of designs, boost collaborative

relationship, and keep business innovative ahead market

> From start to finish, Moldex3D takes care of all the steps no

matter from CAD design, CAE simulation to manufacturing.

It definitely build your confidence to quality products and

create competitiveness with industries