Module05_MemsNems

8/6/2019 Module05_MemsNems

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Presented by:

Nitish Ghosal

Amit Rai

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The objective of the module is to introduce micro-

and nano -electromechanical systems with special

emphasis on the development, processing,

applications, and materials that are currently in use

to produce MEMS/NEMS.


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Introduction

Brief History

Electromechanical Systems

MEMS

Current Applications

NEMS and Nanotechnology

Impact of Miniaturization

Challenges and Possibilities

References

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Figure 5.1: Jonathan Swift.

Courtesy Sandia National Laboratories, SUMMiT Technologies, www.sandia.gov/mstc.

Figure 5.1: Drive gear chain and linkages, with a grain ofpollen (top right) and coagulated red blood cells (lower right,

top left) to demonstrate scale.


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Figure 5.2: The Scale of Things.

Introduction, Continued


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MST - Microsystems Technology (European)

MEMS - Microelectromechanical Systems

(U.S.)

Manmade devices created using compatible

microfabrication techniques that are capable of

Converting physical stimuli, events and parameters to

electrical, mechanical & optical signals

Performing actuation, sensing and other functions

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Introduction, ContinuedDefinition and Terms


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Figure 5.3: Spider mite with legs on a mirror drive assembly.

Introduction, Continued

Image Courtesy of Sandia National Laboratories, SUMMiTTM Technologies, www.mems.sandia.gov


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1962 Silicon Integrated piezo actuators BY O.N. Tufte et al.

1967 Anisotropic deep silicon etching H.A. Waggener

1967 The resonant gate transistor by H. Nathanson, et.al

1972 National Semiconductor - Pressure Sensor

1979 Thermal inkjet technology is invented at HP laboratories

1982 Silicon as a Mechanical Material K. Peterson

1982 Liga Process (KFIK, Germany)

1983 Infinitesimal Machinery R. Feynman

1983 Silicon Micromechanical devices J.B.Angel etc.

1983 Integrated Pressure Sensor Honeywell

1985 Airbag Crash Sensor

1987 Dr. Hornbeck Digital Micromirror Device or DMD (DLP by Texas

Instruments)Later in 1990s micromachining begins leveraging microelectronicsindustry

1993 Accelerometer integrated with electronics Analog devices

1994 DRIE Etching (Bosch process is patented)

1999 Optical network switch - Lucent

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Brief History


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Figure 5.4: Electromechanical Systems functional block diagram.

Electromechanical SystemsFunctional Block Diagram


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Materials

Crystallography Forms of Silicon

Amorphous Polycrystalline

Crystalline

Miller Planes

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Figure 5.5: MillerIndices, Direction Examples

MEMSMicrostructure Fabrication


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Pattern definition

Photolithography

Deposition

Oxidation, chemical-vapor

deposition, ion implantation

Removal

Etching, evaporation

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-Structural layer

-Sacrificial layer

deposit

pattern

etchFigure 5.6: Microstructure Fabrication

MEMS, ContinuedMicrostructure Fabrication, Continued


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Processing Techniques

Deep Reactive Ion Etching (DRIE)

Surface Micromachining LIGA process Lithography / Electroplating / Molding

SUMMIT process

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Microstructure Fabrication, Continued


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MEMS Advantages

The advantages of MEMS devices include

Size

High sensitivity Low noise

Reduced cost

Batch Processing

The applications for MEMS are so far reaching that a multi-billiondollar market is forecast. Key industry applications include

transportation, telecommunications and healthcare.

MEMS, Continued


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Worldwide MEMS MarketsWorldwide MEMS Markets(in Millions of$)(in Millions of$)

2002 2007

Microfluidics 1401 2241

Optical MEMS 702 1826

RF MEMS 39 249

Other actuators 117 415

Inertial sensors

81

91

82

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Pressure sensors 546 917

Other sensors 273 830

TotalTotal 39003900 83008300

Figure 5.7: Worldwide MEMS Market (2002 vs. 2007)

MEMS Economy

MEMS, Continued


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Micro-arrayed biosensors

Virus detection

DNA Chip PCR (Polymerase Chain Reaction)

Neuron probes (nerve damage/repair)

Retina/Cochlear Implants

Micro Needles

QChemLab

Micro Fluidic Pumps

- Insulin Pump (drug delivery) 16

Biomedical

Current Applications, Continued


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Hand held detectors biological & chemical

microsensors

QChems Lab on a Chip (security applications)

Micro and Radio Frequency (RF) Switches

RFIDTechnologies

Modern bar-coding system increasingly used on tollroads and materials handling applications

Data Storage Systems

IBM Millipede storage system AFM tip writes data bit by

melting a depression into polymer mediaum and reads17

Detection systems

Current Applications, Continued


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Nanotechnology

manipulation of matter at

the nanometer scale. Nanomaterials

Started with carbon.

Behavior depends on

morphology.

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Figure 5.8: Eight allotropes ofcarbon:Diamond, graphite, lonsdaleite, C60, C540,

C70, amorphous carbon and carbon nanotube

NEMS and Nanotechnology


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Quantum dots

NanowiresQuantum films

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Figure 5.9: Quantum Dots.

NEMS and Nanotechnology,

Continued


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Electrostatic manipulation

Moving one electron or molecule at a time

Patterning

Dip Pen Lithography

Electron Beam Lithography

Self assembly

Nano Fabrication


Continued


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Cantilever Sensors

Mass Storage

(IBM) Millipede chip

Nanochip

Molecular Electronics Transistors

Memory cells

Nanowires

Nanoswitches

Merging of technologies


Continued


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Cantilever sensors are essentially

MEMS cantilevers with chemical

arrays attached. The cantilevers,

acting much like tuning forks,

have a natural frequency of

vibration which changes as more

mass is attached (nano function).

The change in frequency issensed by the MEMS device

indicating a measurable presence

in the system of particular reacting

compound.

Selective chemical

layer

Reacting compound

cantilever

Figure 5.10: Cantilever sensor

Merging of technologies


Continued


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Potential Positive Impacts

Reduction of disease.

Job opportunities in new fields.

Low-cost energy.

Cost reductions with improved efficiencies.

Improved product and building materials.

Transportation improvements

Potential Negative Impacts Material toxicity

Non-biodegradable materials.

Unanticipated consequences.

Job losses due to increased manufacturing efficiencies.23

Impact ofM

iniaturization


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Fundamental and applied research

Engineering and technological developments

High Fidelity Modeling

High Yield / Low Cost Fabrication

Molecular manufacturing

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Challenges and Possibilities


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Gad-el-Hak, M. MEMS, Design and Fabrication,Second Edition. (2005)

Lyshevski, S., MEMS and NEMS, CRC Press LLC.

(2002

)Maluf, N. and Williams, K., An Introduction to

Micromechanical Systems Engineering,Second Edition, Artechouse, Inc. (2004)

Microsytems, Same-Tec 2005 Preconference

Workshop, July 25 &26, 2005. Taylor and Francis, MEMSIntroductory

Course, Sandia National Laboratories, June13-15, 2006.

What is MEMS technology? MEMS and 25

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Module05_MemsNems