MOC3023 SERIES MOC3020 THRU Product Data Sheet …

LITE-ON DCC

RELEASE

BNS-OD-FC001/A4

LITE-ON Technology Corp. / OptoelectronicsNo.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.

Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660http://www.liteon.com/opto

PhotocouplerProduct Data SheetMOC3020 THRU MOC3023 SERIES

Spec No. :DS-70-99-0019Effective Date: 06/16/2021Revision: K

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PhotocouplerMOC302X series

Part No. : MOC302X SeriesBNS-OD-FC002/A4Rev. : I

1. DESCRIPTION1.1 Featuresn Isolation voltage between input and output Viso : 5,000Vrms

n 6pin DIP photocoupler, triac driver outputn High repetitive peak off-state voltage VDRM : Min. 400Vn High critical rate of rise of off-state voltage( dV/dt : MIN. 1000V / ms )n Dual-in-line package : MOC3020, MOC3021, MOC3022, MOC3023n Wide lead spacing package : MOC3020M, MOC3021M, MOC3022M, MOC3023Mn Surface mounting package : MOC3020S, MOC3021S, MOC3022S, MOC3023Sn Tape and reel packaging : MOC3020S-TA, MOC3021S-TA, MOC3022S-TA, MOC3023S-TA MOC3020S-TA1, MOC3021S-TA1, MOC3022S-TA1, MOC3023S-TA1n Safety approval

UL 1577

VDE DIN EN60747-5-5 (VDE 0884-5)

CSA CA5A

CQC GB4943.1-2011/ GB8898-2011 (meet Altitude up to 5000m)

Nordic Safety (DEMKO)

n RoHS Compliance

All materials be used in device are followed EU RoHS directive (No.2002/95/EC).n MSL class1n Halogen free option

1.2 Applicationsn AC Motor Drivesn AC Motor Startersn E.M. Contactorsn Lighting Controlsn Solenoid/Valve Controlsn Solid State Relaysn Static Power Switchesn Temperature Controls

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2. PACKAGE DIMENSIONS2.1 MOC302X 2.2 MOC302XM

2.3 MOC302XS

Notes :1. 2-digit year code, example : 2016 = 162. 2-digit work week ranging from ‘01’ to ‘53’3. Factory identification mark shall be marked

(W: China-CZ, Y: Thailand) 4. VDE option 5. IFT rank

* Dimensions are in Millimeters and (Inches).

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3. TAPING DIMENSIONS

3.1 MOC302XS-TA 3.2 MOC302XS-TA1

3.3 Quantities Per Reel

Description Symbol Dimension in mm (inch)

Tape wide W 16±0.3 (0.63)

Pitch of sprocket holes P0 4±0.1 (0.15)

Distance of compartmentF 7.5±0.1 (0.295)

P2 2±0.1 (0.079)Distance of compartment to

compartmentP1 12±0.1 (0.472)

Package Type MOC302XS series

Quantities (pcs) 1000

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4. RATING AND CHARACTERISTICS

4.1 Absolute Maximum Ratings at Ta=25°C

Parameter Symbol Rating Unit

Input

Forward Current IF 50 mA

Reverse Voltage VR 6 V

Junction Temperature TJ 125 oC

Power Dissipation P 70 mW

Output

Off-State Output Terminal Voltage VDRM 400 V

Peak Repetitive Surge Current

( PW=1ms, 120pps )ITSM 1 A

Junction Temperature TJ 125 oC

Collector Power Dissipation PC 300 mW

Total Power Dissipation Ptot 330 mW

1. Isolation Voltage Viso 5000 Vrms

Operating Temperature Topr -40 ~ +110 oC

Storage Temperature Tstg -55 ~ +150 oC

2. Soldering Temperature Tsol 260 oC

1. AC For 1 Minute, R.H. = 40 ~ 60%

Isolation voltage shall be measured using the following method.

(1) Short between anode and cathode on the primary side and between collector and emitter on the

secondary side.

(2) The isolation voltage tester with zero-cross circuit shall be used.

(3) The waveform of applied voltage shall be a sine wave.

2. For 10 Seconds

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4.2 Recommended Operating Conditions (Note)

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device.

Additionally, each item is an independent guideline respectively. In developing designs using this product,

please confirm specified characteristics shown in this document.

Characteristics Symbol Min. Typ. Max. Unit

Supply Voltage VAC - - 120 Vac

Forward Current

MOC3021

IF

22.5 25 30 mA

MOC3022 15 20 30 mA

MOC3023 7.5 10 30 mA

Operating Temperature Topr -25 - 85 °C

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4.3 Electrical Optical Characteristics at Ta=25°C

Parameter Symbol Min. Typ. Max. Unit Test Condition

Input Forward Voltage VF — 1.15 1.4 V IF=20mA

Reverse Current IR — 0.05 10 mA VR=6V

Output

1Peak Blocking Current, Either

DirectionIDRM — 10 100 nA VDRM = 400V

Peak On-State Voltage, Either

DirectionVTM — — 3.0 V ITM=100 mA Peak

2Critical rate of Rise of Off-

State Voltagedv/dt 1000 — — V/ms Vin=240Vrms

Couple

Led Trigger

Current, Current

Required to

Latch Output,

Either Direction

MOC3021

IFT

— — 15

mAMain Terminal

Voltage = 3VMOC3022 — — 10

MOC3023 — — 5

Holding Current, Either

DirectionIH — 200 — mA

*1. Test voltage must be applied within dv/dt rating.

*2. This is static dv/dt. Commutating dv/dt is a function of the load-driving thyristor(s) only.

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5. CHARACTERISTICS CURVES (TYPICAL PERFORMANCE)

Fig.1 Forward Current vs. Fig.2 On-state Current vs. AmbientTemperature

Fig.4 Forward Current vs. Forward

F

0-40

60 C40 C20 C

Ambient TemperatureFig.6 Holding Current vs.

TemperatureFig.5 On-state Voltage vs. Ambient

Fig.3 Minimum Trigger Currentvs. Ambient Temperature

Forw

ard

curre

nt I

(m

A)

I ,

on-

stat

e cu

rrent

(A)

Forw

ard

curre

nt IF

(mA)

On-

stat

e vo

ltage

VT

(V)

Min

imum

trig

ger c

urre

nt IF

T (m

A)

Hol

ding

cur

rent

IH (m

A)

Ambient temperature Ta ( C) Ambient Temperature Ta ( C)

Forward voltage VF (V)Ambient temperature ( C)

Ambient temperature Ta ( C) Ambient temperature Ta ( C)0 20 40 60 80 100

60

0

0.41

2.0

0.0120 40 60 80 10020

1.0100

200

10

o

o

o

Ambient Temperature

o o

Voltage

IT= 100mA3.0

10

100

8

6

4

2

50

40

30

20

10

100

1

o80 Co100 C

0.05

0.10

TM

VP= 6VRL= 100

2.6

2.2

1.4

1.8

40 8060o

VP= 6V

0.8 1.2 1.6

o

806040o

0.1

120-20 -40 -20 0 804020 60 100 120

Fig.3 Normalized Trigger Current

vs Ambient Temperature

Fig.5 Normalized On-state Voltage


0

10

20

30

40

50

60

-40 -20 0 20 40 60 80 100 120

I F-F

orw

ard

Curr

ent -

(mA)

TA - Ambient Temperature - oC

0

20

40

60

80

100

120

-40 -20 0 20 40 60 80 100 120

I TM-O

n St

ate

Curr

ent -

(mA)


0.1

1

10

100

0.6 0.8 1 1.2 1.4 1.6

I F-F

orw

ard

Curr

ent -

mA

VF - Forward Voltage - V

TA=110oCTA=75oCTA=25oCTA=0oCTA=-40oC

Fig.6 Normalized Holding Current


0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

1.8

2

-40 -20 0 20 40 60 80 100 120

N.I F

T-

Norm

aliz

ed T

rigg

er LE

D C

urre

nt


VTM=3VNormalized to TA =25oC

00.20.40.60.8

11.21.41.61.8

2

-40 -20 0 20 40 60 80 100 120

N.V

TM-N

orm

aliz

ed O

n-St

ate

Volta

ge


IF=10mA, ITM=100mANormalized to TA =25oC

0.1

1

10

-40 -20 0 20 40 60 80 100 120

N.I H

-Nor

mal

ized

Hol

ding

Curr

ent


Normalized to TA =25oC

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Fig.7 Off-state Current vs

Ambient Temperature

1

10

100

1000

1 1.5 2 2.5 3

I TM-O

n-St

ate

Curr

ent -

mA

VTM - On-State Voltage - V

IF=Rated IFTTA = 25oC

Fig.8 On-state Current vs

On-state Voltage

0.1

1

10

100

1000

-40 -20 0 20 40 60 80 100 120

N. I

DRM

-Nor

mal

ized

Peak

Off-

stat

e Cu

rren

t


VDRM=Rated VDRM

Normalized to TA=25oC

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6. TEMPERATURE PROFILE OF SOLDERING6.1 IR Reflow soldering (JEDEC-STD-020E compliant)

One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three

times.

Profile item Conditions

Preheat

- Temperature Min (TSmin)

- Temperature Max (TSmax)

- Time (min to max) (ts)

150˚C

200˚C

90±30 sec

Soldering zone

- Temperature (TL)

- Time (tL)

217˚C

60 sec

Peak Temperature (TP) 260˚C

Ramp-up rate 3˚C / sec max.

Ramp-down rate 3~6˚C / sec

60 ~ 120 sec25 C

150 C

200 C

260 C

217 C

60 sec

Time (sec)

Tem

pera

ture

( C

)

20 sec

Tsmax

ts (Preheat)

tL (Soldering)Tsmin

TL

TP

Ramp-down

Ramp-up

35~70 sec

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6.2 Wave soldering (JEDEC22A111 compliant)One time soldering is recommended within the condition of temperature.

Temperature: 260+0/-5˚C

Time: 10 sec.

Preheat temperature:25 to 140˚C

Preheat time: 30 to 80 sec.

6.3 Hand soldering by soldering iron Allow single lead soldering in every single process. One time soldering is recommended.

Temperature: 380+0/-5˚C

Time: 3 sec max.

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7. RRECOMMENDED FOOT PRINT PATTERNS (MOUNT PAD)

Unit: mm

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8. NAMING RULE

9. NOTESn LiteOn is continually improving the quality, reliability, function or design and LiteOn reserves the right to make changes without

further notices.n The products shown in this publication are designed for the general use in electronic applications such as office automation

equipment, communications devices, audio/visual equipment, electrical application and instrumentation.n For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment,

medical equipment, etc, please contact our sales representatives.n When requiring a device for any ”specific” application, please contact our sales in advice.n If there are any questions about the contents of this publication, please contact us at your convenience.n The contents described herein are subject to change without prior notice.n Immerge unit’s body in solder paste is not recommended.

MOC302(X)(1)-(2)-GDEVICE PART NUMBER (MOC302X)

Please refer to Electrical OpticalCharacteristics Table on Page 6

(2) TAPING TYPE (TA, TA1)

(3) Halogen free

Example : MOC3021S-TA1-G

(1) FORM TYPE (S, M or none)

MOC302(X)(1)(2)-V-GDEVICE PART NUMBER (MOC302X)

Please refer to Electrical OpticalCharacteristics Table on Page 6

(2) TAPING TYPE (TA, TA1)

(1) FORM TYPE (S, M or none)

(3) VDE option

(4) Halogen free

Example : MOC3021STA1-V-G

Documents

MOC3023 SERIES MOC3020 THRU Product Data Sheet …