mitsubishi, КАТАЛОГ модуль mitsubishi, igbt, мост диодный€¦ · модуль mitsubishi, igbt, Минск +375447584780 радиодетали, электронные

г.Минск www.tiristor.by email: [email protected] viber и тел.+375447584780

модуль mitsubishi, igbt, Минск +375447584780

www.fotorele.net www.tiristor.by радиодетали, электронные компоненты

email [email protected] tel.+375 29 758 47 80 мтс

каталог, описание, технические, характеристики, datasheet, параметры,

маркировка,габариты, фото, модуль mitsubishi,

КАТАЛОГ

модуль mitsubishi, igbt, мост диодный

купить, продажа

электронные компоненты

где и как купить в Минске?

http://igbt.by/kak-kupit/


www.MitsubishiElectric.com

H-CT575-C FU-1808 Printed in Japan <IP>

POWER MODULES

Please visit our website for further details.

Revised publication, effective Oct. 2018.Superseding publication of H-CT575-B Aug. 2018.

Specifications subject to change without notice.

2018

POWER MODULES

Type your text

модуль mitsubishi, igbt, Минск +375447584780 www.fotorele.net www.tiristor.by радиодетали, электронные компонентыemail [email protected] tel.+375 29 758 47 80 мтс

каталог, описание, технические, характеристики, datasheet, параметры, маркировка,габариты, фото, модуль mitsubishi, КАТАЛОГ модуль mitsubishi, igbt, мост диодныйкупить, продажаэлектронные компонентыгде и как купить в Минске?


21

Mitsubishi Electric power modules are at the forefront of the latest energy innovations that seek to solve global environmental issues while creating a more affluent and comfortable society for all. Some of these innovations are photovoltaic (PV) and wind power generation from renewable energy sources, smart grids realizing efficient supply of power, hybrid/electric vehicles (HVs/EVs) that take the next step in reducing carbon emissions and fuel consumption, and home appliances that achieve ground-breaking energy savings. Whether in appliances, railcars, EVs or industrial systems, our power modules are key elements in changing the way energy is used.

Innovative Power Devicesfor a Sustainable Future

Smart gridPhotovoltaic power

generation

Wind powergeneration

Household electricalappliances

Electric/ Hybrid vehicles

MotorsIndustrial robots

Traction

InvertersInduction heatingcooking stoves

Effective useof energy

EnergyCreation

＊HV: Hybrid Vehicle ＊EV： Electric Vehicle ＊PHEV： Plug-in Hybrid Electric Vehicle

Modules realizing single-control power supply and photocoupler-less systems for household appliances and low-capacity invertersKey Features•Transfer-molded structure incorporating a high thermal conductivity insulation sheet provides heat•High-voltage IC equipped with drive, protection and level-shift circuits for direct control via input signals from a CPU or microcomputer

•Compact board and highly reliable equipment realized through single power-supply and photocoupler-less systems•Includes built-in bootstrap diode (BSD)

Modules with built-in control and protection circuits for AC servo robots and PV power generationKey Features•Built-in protection circuits for short-circuiting, power supply undervoltage and overheating •Highly compatible package with simplified printed circuit board (PCB) design•Special intelligent power modules (IPMs) for power conditioners in PV power generation systems

IGBT modules for general-purpose inverters used in various applicationsKey Features•Various low-inductance packages and power chips available•Compatible with high-frequency, high-voltage (1,700V) applications•Large-capacity modules available for renewable energy systems

High voltage, large capacity and high reliability are realized for traction and power transmission applicationKey Features・Two types of package are realized: "std type" with large output power and "LV100/HV100 type"

for various inverter capacity by easy parallel connection・The abundant field experience more than 20 years especially in the application of bullet train・High reliability due to a long lifetime design and a robust design against severe environment

7th-Generation 1,200V-Class IGBT Chip TechnologyCutting-edge technology realizes energy-saving inverter devices

• Latest thin-wafer processing (n-drift layer) achieves thinner wafer than 6th-generation devices• Performance improved by combining CSTBTTM* and light punch-through (LPT) structures• Inverter system power dissipation mini-mized by its superior performance(lower VCEsat and Eoff)

Focus Technology

*CSTBT: Mitsubishi Electric’s unique IGBT that makes use of carrier cumulative effect

Modules realizing high performance and reliability for propulsion inverters in HVs/EVsKey Features•Built-in temperature analog output function realizing highly reliable drive train•High-power/temperature cycle life ensures high reliability•Compliant with the End-of-life Vehicles Directive, regulations relating to substances of environmental concern•High traceability in managing materials/components throughout the entire production process for each product

A small surface mount pakage IPM has been newly developed for fan and low-power motor drive applicationsKey Features・Optimal pin layout realizes easier PCB wiring design and enables smaller PCB size・Newly integrated interlock function in addition to conventional protection features for robust operation・Bootstrap diode is integrated for the P-side drive power supply like conventional DIPIPMTM series,

reducing the number of peripheral external parts

1200V-class IGBT structure

Optimize wafer thicknessImprove performance

6th-gen. IGBT 7th-gen. IGBT

n-drift layer n-drift layer

p＋ collector n＋ bufferＣ

E EG

p＋ collectorn＋ bufferＣ

E EG

The latest thin wafer process

Comparison of power loss

7th-gen.ＩＧＢＴ

6th-gen. ＩＧＢＴ



DIPIPMTM

IPMIntelligent Power Modules

IGBT ModulesInsulated Gate Bipolar

Transistor Modules

HVIGBT ModulesHigh-Voltage Insulated Gate Bipolar

Transistor Modules

Power Modules for VehiclesPower Modules for EV/PHEV

MISOPTM

Surface mount package IPM




21

Mitsubishi Electric power modules are at the forefront of the latest energy innovations that seek to solve global environmental issues while creating a more affluent and comfortable society for all. Some of these innovations are photovoltaic (PV) and wind power generation from renewable energy sources, smart grids realizing efficient supply of power, hybrid/electric vehicles (HVs/EVs) that take the next step in reducing carbon emissions and fuel consumption, and home appliances that achieve ground-breaking energy savings. Whether in appliances, railcars, EVs or industrial systems, our power modules are key elements in changing the way energy is used.

Innovative Power Devicesfor a Sustainable Future

Smart gridPhotovoltaic power

generation

Wind powergeneration

Household electricalappliances

Electric/ Hybrid vehicles

MotorsIndustrial robots

Traction

InvertersInduction heatingcooking stoves

Effective useof energy

EnergyCreation

＊HV: Hybrid Vehicle ＊EV： Electric Vehicle ＊PHEV： Plug-in Hybrid Electric Vehicle

Modules realizing single-control power supply and photocoupler-less systems for household appliances and low-capacity invertersKey Features•Transfer-molded structure incorporating a high thermal conductivity insulation sheet provides heat•High-voltage IC equipped with drive, protection and level-shift circuits for direct control via input signals from a CPU or microcomputer

•Compact board and highly reliable equipment realized through single power-supply and photocoupler-less systems•Includes built-in bootstrap diode (BSD)

Modules with built-in control and protection circuits for AC servo robots and PV power generationKey Features•Built-in protection circuits for short-circuiting, power supply undervoltage and overheating •Highly compatible package with simplified printed circuit board (PCB) design•Special intelligent power modules (IPMs) for power conditioners in PV power generation systems

IGBT modules for general-purpose inverters used in various applicationsKey Features•Various low-inductance packages and power chips available•Compatible with high-frequency, high-voltage (1,700V) applications•Large-capacity modules available for renewable energy systems

High voltage, large capacity and high reliability are realized for traction and power transmission applicationKey Features・Two types of package are realized: "std type" with large output power and "LV100/HV100 type"

for various inverter capacity by easy parallel connection・The abundant field experience more than 20 years especially in the application of bullet train・High reliability due to a long lifetime design and a robust design against severe environment

7th-Generation 1,200V-Class IGBT Chip TechnologyCutting-edge technology realizes energy-saving inverter devices

• Latest thin-wafer processing (n-drift layer) achieves thinner wafer than 6th-generation devices• Performance improved by combining CSTBTTM* and light punch-through (LPT) structures• Inverter system power dissipation mini-mized by its superior performance(lower VCEsat and Eoff)

Focus Technology

*CSTBT: Mitsubishi Electric’s unique IGBT that makes use of carrier cumulative effect

Modules realizing high performance and reliability for propulsion inverters in HVs/EVsKey Features•Built-in temperature analog output function realizing highly reliable drive train•High-power/temperature cycle life ensures high reliability•Compliant with the End-of-life Vehicles Directive, regulations relating to substances of environmental concern•High traceability in managing materials/components throughout the entire production process for each product

A small surface mount pakage IPM has been newly developed for fan and low-power motor drive applicationsKey Features・Optimal pin layout realizes easier PCB wiring design and enables smaller PCB size・Newly integrated interlock function in addition to conventional protection features for robust operation・Bootstrap diode is integrated for the P-side drive power supply like conventional DIPIPMTM series,

reducing the number of peripheral external parts

1200V-class IGBT structure

Optimize wafer thicknessImprove performance

6th-gen. IGBT 7th-gen. IGBT

n-drift layer n-drift layer

p＋ collector n＋ bufferＣ

E EG

p＋ collectorn＋ bufferＣ

E EG

The latest thin wafer process

Comparison of power loss


6th-gen. ＩＧＢＴ



DIPIPMTM

IPMIntelligent Power Modules

IGBT ModulesInsulated Gate Bipolar

Transistor Modules

HVIGBT ModulesHigh-Voltage Insulated Gate Bipolar

Transistor Modules

Power Modules for VehiclesPower Modules for EV/PHEV

MISOPTM

Surface mount package IPM

г.Минск www.tiristor.by email: [email protected] viber и тел.+375447584780Surface mount package IPM

43

All-in-one intelligent power modules equipped with 3-phase converter and brake circuit in addition to inverter circuit

Feature Products

<Main Features>• Encapsulated with transfer molded resin, integrates three-phase converter,

inverter, brake and control IC• Built-in converter and brake enable system size to be reduced and save design

cost, contributing to total cost reduction• Lower PCB inductance pattern reduces noise, thereby reducing design time

and countermeasure parts required for noise reduction • Built-in BSD*1 with 1,200V withstand voltage reduces number of external parts

and improves reliability

*1 BSD: Bootstrap diode*2: Available without brake circuit

* For further information, please contact sales office.

PSS05MC1FT, PSS10MC1FT, PSS15MC1FT, PSS25MC1FT, PSS35MC1FT, PSS50MC1F6DIPIPM+TM

P1

RST B

P

NU NV NWN1 N(B)

LVIC

LVIC

Converter Brake Inverter

HVIC

■ Internal circuit diagram

<Main Features>・RC-IGBT*1 incorporated, reducing package size 30% compared to Super-mini DIPIPM・Maximum case temperature increased from 100°C to 115°C, increusing the operating temperature range and leading to easier system design・Additional terminals for floating supply and built-in bootstrap diodes simplify PCB wiring

pattern・Both VOT*2 and OT*3 functions integrated for temperature protection

*1 RC-IGBT: Reverse conducting IGBT*2 VOT: Temperature information output function*3 OT: Over-temperature protection function

Smaller package size realized by integrating newly designed RC-IGBTRecommended for low-cost inverter and fan controller applications

Feature Products

SLIMDIP-S, SLIMDIP-LSLIMDIPTM

Power supply and control Bootstrap capacitor

Shunt resistor

To motor

NW PUVWNUNV

EVA series, evaluation boards for each DIPIPMTM

Various evaluation boards to easy support system design

Customer Support

SP1SK, SP1SL, SP3SK and SP3SLSurface mount package IPM MISOPTM

<Main Features>・Optimal pin layout realizes easier PCB wiring design and enables smaller PCB size・Insulation distance between pins ensured, realizing easier board mounting without coating process・Newly integrated interlock function in addition to conventional protection features for robust operation・Installing RC-IGBT*1 simultaneously realizes compact package and low loss performance can go thogether・Bootstrap diode is integrated for the P-side drive power supply like conventional DIPIPMTM series, reducing

the number of peripheral external parts

A small Surface mount package IPM has been newly developed for fan and low-power motor drive applications

New Products

■ Schematic drawing ■ Outline Drawing

1A

3A

600V

RC-IGBT

HVIC

LVIC

BSD

SP1SK★★

SP1SL★★

SP3SK★★

SP3SL★★

　

-

Embedded

-

Embedded

　

UV

SC

OT

VOT

IL

Surface mountpackage

*1 Reverse-conducting IGBT

Type name Rated current Rated voltage Chips BSC Protection Shape

VOT: Analog temperature outputUV： Power supply under-voltage protectionSC： Short-circuit protectionOT：Over Temperature protectionIL：Inter LockBSC：Bootstrap capacitor

[Term]

0.76.3

7.019.9

3-4.32-2.6 0.8

0.5

27.4

11-1.00.8 15.0

5.01.4

15.2

19.3

0.84(3.45)

3.3

Low Side Driver

BSD

BSC

Input Logic

Protection circuit

Op. AMP

Ref

UV

SC

Temperature sensor

OT

RC-IGBT

Input Logic (UV detection)

High Side Level Shift Driver (UV detection)

Interlock

Unit:ｍｍ

UP(8)

VW

FB (7)

VW

FS (6)

VV

FB (5)

VV

FS (4)

VU

FB (3)

VU

FS (2)

VP(9) WP(10)

VP1(11)

VNC(12)

UN(13)

VN(14)

WN(15)

P(27)

U(26)V(25)W(24)

NU(23)

NV(22)

NW(21)

VN1(16)

CIN(18)

VOT(19)

FO(17)

★★:Under development

SLIMDIPTM evaluation boardEVA15-SLIM

Super mini DIPIPMTM evaluation board

EVA11-SDIP DIPIPM+TM evaluation boardEVA14-DIP+

DIPIPM+TM evaluation

boardEVA03-DIP+


DIPIPMTM

27

1

21

19

г.Минск www.tiristor.by email: [email protected] viber и тел.+375447584780Surface mount package IPM

43

All-in-one intelligent power modules equipped with 3-phase converter and brake circuit in addition to inverter circuit

Feature Products

<Main Features>• Encapsulated with transfer molded resin, integrates three-phase converter,

inverter, brake and control IC• Built-in converter and brake enable system size to be reduced and save design

cost, contributing to total cost reduction• Lower PCB inductance pattern reduces noise, thereby reducing design time

and countermeasure parts required for noise reduction • Built-in BSD*1 with 1,200V withstand voltage reduces number of external parts

and improves reliability

*1 BSD: Bootstrap diode*2: Available without brake circuit

* For further information, please contact sales office.

PSS05MC1FT, PSS10MC1FT, PSS15MC1FT, PSS25MC1FT, PSS35MC1FT, PSS50MC1F6DIPIPM+TM

P1

RST B

P

NU NV NWN1 N(B)

LVIC

LVIC

Converter Brake Inverter

HVIC


<Main Features>・RC-IGBT*1 incorporated, reducing package size 30% compared to Super-mini DIPIPM・Maximum case temperature increased from 100°C to 115°C, increusing the operating temperature range and leading to easier system design・Additional terminals for floating supply and built-in bootstrap diodes simplify PCB wiring

pattern・Both VOT*2 and OT*3 functions integrated for temperature protection

*1 RC-IGBT: Reverse conducting IGBT*2 VOT: Temperature information output function*3 OT: Over-temperature protection function

Smaller package size realized by integrating newly designed RC-IGBTRecommended for low-cost inverter and fan controller applications

Feature Products

SLIMDIP-S, SLIMDIP-LSLIMDIPTM

Power supply and control Bootstrap capacitor

Shunt resistor

To motor

NW PUVWNUNV

EVA series, evaluation boards for each DIPIPMTM

Various evaluation boards to easy support system design

Customer Support

SP1SK, SP1SL, SP3SK and SP3SLSurface mount package IPM MISOPTM

<Main Features>・Optimal pin layout realizes easier PCB wiring design and enables smaller PCB size・Insulation distance between pins ensured, realizing easier board mounting without coating process・Newly integrated interlock function in addition to conventional protection features for robust operation・Installing RC-IGBT*1 simultaneously realizes compact package and low loss performance can go thogether・Bootstrap diode is integrated for the P-side drive power supply like conventional DIPIPMTM series, reducing

the number of peripheral external parts

A small Surface mount package IPM has been newly developed for fan and low-power motor drive applications

New Products

■ Schematic drawing ■ Outline Drawing

1A

3A

600V

RC-IGBT

HVIC

LVIC

BSD

SP1SK★★

SP1SL★★

SP3SK★★

SP3SL★★

　

-

Embedded

-

Embedded

　

UV

SC

OT

VOT

IL

Surface mountpackage

*1 Reverse-conducting IGBT

Type name Rated current Rated voltage Chips BSC Protection Shape

VOT: Analog temperature outputUV： Power supply under-voltage protectionSC： Short-circuit protectionOT：Over Temperature protectionIL：Inter LockBSC：Bootstrap capacitor

[Term]

0.76.3

7.019.9

3-4.32-2.6 0.8

0.5

27.4

11-1.00.8 15.0

5.01.4

15.2

19.3

0.84(3.45)

3.3

Low Side Driver

BSD

BSC

Input Logic

Protection circuit

Op. AMP

Ref

UV

SC

Temperature sensor

OT

RC-IGBT

Input Logic (UV detection)

High Side Level Shift Driver (UV detection)

Interlock

Unit:ｍｍ

UP(8)

VW

FB (7)

VW

FS (6)

VV

FB (5)

VV

FS (4)

VU

FB (3)

VU

FS (2)

VP(9) WP(10)

VP1(11)

VNC(12)

UN(13)

VN(14)

WN(15)

P(27)

U(26)V(25)W(24)

NU(23)

NV(22)

NW(21)

VN1(16)

CIN(18)

VOT(19)

FO(17)

★★:Under development


Super mini DIPIPMTM evaluation board

EVA11-SDIP DIPIPM+TM evaluation boardEVA14-DIP+

DIPIPM+TM evaluation

boardEVA03-DIP+


DIPIPMTM

27

1

21

19


Spe

cific

atio

nsP

rote

ctiv

eF

unct

ion

65

■ Series Matrix of 1200V DIPIPMTM

1200V

Ver.4 CIB/CI Ver.6

LargeMini

DIPIPM+

5

10

15

25

35

50

IGBT/MOSFETUVSCOTVOT

Active inputEmitter pin of N-sideFault outputInsulation voltageInsulation structureRoHS directive

CSTBTP-side/N-side

N-sideー

N-sideHigh(5V)

OpenN-side (UV,SC)

2500VrmsInsulation sheet

Compliant

CSTBTP-side/N-side

N-sideー

N-sideHigh(5V)

OpenN-side (UV,SC)


Compliant

CSTBTP-side/N-side

N-sideー

N-sideHigh(5V)

OpenN-side (UV,SC)


Compliant

Pin type ーーー

CSTBTP-side/N-side/Brake

N-sideー

N-sideHigh(5V)

OpenN-side (UV,SC)


Compliant

ー

IC（A）Series

VCES（V）

PSS05S72FT

PSS10S72FT

PSS05SA2FT

PSS10SA2FT

PSS15SA2FT

PSS25SA2FT

PSS35SA2FT

PSS50SA2FT

PS22A72

PS22A73

PS22A74

PS22A76

PS22A78-E

PS22A79

PSS05MC1FTPSS05NC1FT＊1





■ Type Name Definition of DIPIPMTM

Chip typeDIPIPM

OptionsVoltage class

Rated current

Circuit construction

FunctionSeriesPackage

PS

BSD: Bootstrap DiodeCSTBTTM: Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effect.HVIC: High Voltage IC, LVIC: Low Voltage ICUV: Supply Under Voltage protection, OT: Over Temperature protection, SC: Short Circuit protectionVOT: Analog temperature outputRoHS: Restriction of hazardous substances in electrical and electronic equipmentCIB: Converter Inverter Brake, CI: Converter Inverter

[Term]

[Notes] *1: PSS**NC1FT is not included brake

★: New Product Non-recommended : Please contact to the sales offices.

Chip

Spec

ifica

tions

Pro

tect

ive

Func

tion

Line-up of DIPIPMTM

■ Series Matrix of 600V / 500V DIPIPMTM

Super mini

500V600V

MiniMOSFET

Large

Ver.4

CIB/CI

DIPIPM+Ver.6

Super miniSLIMDIP



35

50

75

IC（A）Series

VCES（V）

20

5

3

10

15

30

Pin type

■ Application circuit of super mini DIPIPMTM

CSTBTP-side/N-side

N-sideN-side＊1

N-side＊1

High(3/5V)Open

N-side (UV,SC,OT)1500Vrms＊2

Insulation sheetCompliant

Long

RC-IGBTP-side/N-side

N-sideN-sideN-side

High(3/5V)Open

N-side(UV,SC,OT)2000Vrms＊2


Control side of zigzag(Long, Short)

PSS05S92F6-AGPSS05S92E6-AG






C: Control side of zigzagNone: Short

CSTBTP-side/N-side

N-sideー

N-sideHigh(3/5V)

OpenN-side (UV,SC)

2500VrmsMolding resin＊４/Insulation sheet

Compliant ＊3

PSS05S51F6PSS05S51F6-C



PSS20S51F6PSS20S51F6-CPSS20S71F6

PSS30S71F6

PSS50S71F6

ー

CSTBTP-side/N-side

N-side with senseー

N-sideHigh(3/5V)

OpenN-side (UV,SC)


Compliant

PS21A79

PS21A7A

ー

CSTBTP-side/N-side/Brake part

N-sideー

N-sideHigh(5V)

OpenN-side (UV,SC)


Compliant

PSS50MC1F6PSS50NC1F6 ＊５

SJ-MOSFETP-side/N-side

N-sideー

N-sideHigh(3/5V)

OpenN-side (UV,SC)1500Vrms＊2


Long

PSM15S94H6-A

PSM20S94H6-A

Long

MOSFETP-side/N-side

N-sideN-side

ーHigh(3/5V)

OpenN-side (UV,SC,OT)

1500Vrms＊2


PSM03S93E5-A

PSM05S93E5-A

[Notes] *1：PSSxxS92E6 has OT function, PSSxxS92F6 has VOT function*2：AC60Hz,1minute.Corresponds to isolation voltage 2500Vrms in the case the convex-shaped heat sink*3：High melting point solder (Lead Over 85%) is used for chip soldering of PSSxxS51F6 only.*4：Molding resin insulation for PSSxxS51F6/-C*5：PSS50NC1F6 is not included brake.

CSTBTTM: Mitsubishi Electric's unique IGBT that makes use of the carrier cumulative effectRC-IGBT: Reverse conducting IGBT HVIC: High Voltage IC, LVIC: Low Voltage IC, BSD: Bootstrap DiodeUV: Supply Under Voltage protection, OT: Over Temperature protection, SC: Short Circuit protectionVOT: Analog temperature outputRoHS: Restriction of the use of certain Hazardous Substances in electrical and electronic equipmentCIB: Converter Inverter Brake, CI: Converter Inverter

[Term]

SLIMDIP-SSLIMDIP-L

75 PSS75SA2FT★

Chip

+

+

MCU

M

Shuntresistor

5V

VUFB

VVFB

V WFB

UN

VN

WN

F O

VN1

VNC

P

U

W

LVIC

V VP

WP

UP

VP1

CIN

+

VNC

NW

NU

NV VOT

+

+ 15V

HVIC


Spe

cific

atio

nsP

rote

ctiv

eF

unct

ion

65

■ Series Matrix of 1200V DIPIPMTM

1200V

Ver.4 CIB/CI Ver.6

LargeMini

DIPIPM+

5

10

15

25

35

50



CSTBTP-side/N-side

N-sideー

N-sideHigh(5V)

OpenN-side (UV,SC)


Compliant

CSTBTP-side/N-side

N-sideー

N-sideHigh(5V)

OpenN-side (UV,SC)


Compliant

CSTBTP-side/N-side

N-sideー

N-sideHigh(5V)

OpenN-side (UV,SC)


Compliant

Pin type ーーー

CSTBTP-side/N-side/Brake

N-sideー

N-sideHigh(5V)

OpenN-side (UV,SC)


Compliant

ー

IC（A）Series

VCES（V）

PSS05S72FT

PSS10S72FT

PSS05SA2FT

PSS10SA2FT

PSS15SA2FT

PSS25SA2FT

PSS35SA2FT

PSS50SA2FT

PS22A72

PS22A73

PS22A74

PS22A76

PS22A78-E

PS22A79






■ Type Name Definition of DIPIPMTM

Chip typeDIPIPM

OptionsVoltage class

Rated current

Circuit construction

FunctionSeriesPackage

PS

BSD: Bootstrap DiodeCSTBTTM: Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effect.HVIC: High Voltage IC, LVIC: Low Voltage ICUV: Supply Under Voltage protection, OT: Over Temperature protection, SC: Short Circuit protectionVOT: Analog temperature outputRoHS: Restriction of hazardous substances in electrical and electronic equipmentCIB: Converter Inverter Brake, CI: Converter Inverter

[Term]

[Notes] *1: PSS**NC1FT is not included brake


Chip

Spec

ifica

tions

Pro

tect

ive

Func

tion

Line-up of DIPIPMTM

■ Series Matrix of 600V / 500V DIPIPMTM

Super mini

500V600V

MiniMOSFET

Large

Ver.4

CIB/CI

DIPIPM+Ver.6

Super miniSLIMDIP



35

50

75

IC（A）Series

VCES（V）

20

5

3

10

15

30

Pin type

■ Application circuit of super mini DIPIPMTM

CSTBTP-side/N-side

N-sideN-side＊1

N-side＊1

High(3/5V)Open

N-side (UV,SC,OT)1500Vrms＊2


Long

RC-IGBTP-side/N-side

N-sideN-sideN-side

High(3/5V)Open

N-side(UV,SC,OT)2000Vrms＊2


Control side of zigzag(Long, Short)







C: Control side of zigzagNone: Short

CSTBTP-side/N-side

N-sideー

N-sideHigh(3/5V)

OpenN-side (UV,SC)

2500VrmsMolding resin＊４/Insulation sheet

Compliant ＊3




PSS20S51F6PSS20S51F6-CPSS20S71F6

PSS30S71F6

PSS50S71F6

ー

CSTBTP-side/N-side

N-side with senseー

N-sideHigh(3/5V)

OpenN-side (UV,SC)


Compliant

PS21A79

PS21A7A

ー

CSTBTP-side/N-side/Brake part

N-sideー

N-sideHigh(5V)

OpenN-side (UV,SC)


Compliant

PSS50MC1F6PSS50NC1F6 ＊５

SJ-MOSFETP-side/N-side

N-sideー

N-sideHigh(3/5V)

OpenN-side (UV,SC)1500Vrms＊2


Long

PSM15S94H6-A

PSM20S94H6-A

Long

MOSFETP-side/N-side

N-sideN-side

ーHigh(3/5V)

OpenN-side (UV,SC,OT)

1500Vrms＊2


PSM03S93E5-A

PSM05S93E5-A

[Notes] *1：PSSxxS92E6 has OT function, PSSxxS92F6 has VOT function*2：AC60Hz,1minute.Corresponds to isolation voltage 2500Vrms in the case the convex-shaped heat sink*3：High melting point solder (Lead Over 85%) is used for chip soldering of PSSxxS51F6 only.*4：Molding resin insulation for PSSxxS51F6/-C*5：PSS50NC1F6 is not included brake.

CSTBTTM: Mitsubishi Electric's unique IGBT that makes use of the carrier cumulative effectRC-IGBT: Reverse conducting IGBT HVIC: High Voltage IC, LVIC: Low Voltage IC, BSD: Bootstrap DiodeUV: Supply Under Voltage protection, OT: Over Temperature protection, SC: Short Circuit protectionVOT: Analog temperature outputRoHS: Restriction of the use of certain Hazardous Substances in electrical and electronic equipmentCIB: Converter Inverter Brake, CI: Converter Inverter

[Term]

SLIMDIP-SSLIMDIP-L

75 PSS75SA2FT★

Chip

+

+

MCU

M

Shuntresistor

5V

VUFB

VVFB

V WFB

UN

VN

WN

F O

VN1

VNC

P

U

W

LVIC

V VP

WP

UP

VP1

CIN

+

VNC

NW

NU

NV VOT

+

+ 15V

HVIC




P N U V W

P NC U V W

87

IPM

For the "A" package 6-in-1 (CG1A) main pin shape, select either solder pin or screw typeFor the pin layout, select either straight or L-shaped

*1 CSTBT™: Mitsubishi Electric’s unique IGBT that utilizes the carrier cumulative effect*2 RFC: Relaxed field cathode*3 Conventional product: IPM L1-Series Built-in functions: Supply Undervoltage lock protection (UV)、Short-circuit protection (SC), Over-temperature protection (OT)*4 Bootstrap diode (BSD): Optional products include 50A, 75A, 100A/650V, 25A,35A,50A /1200V*5 PC-TIM: Phase change-thermal interface material

Loaded with built-in functions, contributing to inverters with enhanced energy savings

New Products

G1 Series IPM with 7th-generation IGBT

■ "A" package main pin shape and layout

<Main Features>・Power loss has been reduced with the introduction of the 7th-generation IGBT produced using CSTBTTM*1 and a diode incorporating a RFC*2 structure

that contributes to reducing the power consumed in inverters・The new resin-insulated metal baseplate, originally introduced in 7th-generation IGBT modules, eliminates the solder-attached section, increasing the

thermal cycle lifetime and improving inverter reliability・In addition to the built-in functions of the previous product,*3 automatic switching speed control, error detection function and Bootstrap diode (BSD)*4

contribute to lowering inverter loss and shortening design time・The introduction of PC-TIM*5 contribute to simplifying the inverter assembly process (optional)

Main pin layoutMain pin shape

Main pin: Solder pin Main pin: Screw L-shaped Straight

B or NC N

★: New Product

Representative reference is "A" package with screw terminal and straight layout (CG1A).

■ Lineup

VCES(V) PackageIc（A）

650V

1200V

A package

B package

C package

A package

B package

C package

Main pinshape

Main pinlayout

Straight

L-shaped

Straight

L-shaped

L-shaped

L-shaped

Straight

L-shaped

Straight

L-shaped

L-shaped

L-shaped

Screw

Screw

Screw

Screw

Screw

Screw

Solder pin

Solder pin

Mini DIPIPM (PSSxxS51F6)

Large DIPIPM

(2.54×10)

1.8

8.6

0.8 22.7

168

10±0.3 10±0.3 10±0.3 10±0.3 10±0.3 10±0.3

70 ±0.379 ±0.5

2.54±0.3

31±0

.5

A = 2.54±0.3B = 5.08±0.3

B B B

12 53 4 6 87 9 1110 15 1716 20

303132

333440

294241

18 191412 13

B

B

B

A A A AA A

A 2.8

12.7

Type name , Lot No. 2-ø4.5±0.2

28 27 26 25 24 23 22 21 20 19 18 16 15 13 12 10 9 8 7 6 5 4 3 2 11417 11

3536

2930

37 34 33 32 31

Type name , Lot No.

6.7±0.32.54±0.3

(6.3

)(2

)

(2)(0.5)

46.228(26×1.778)

2.54±0.3

7.62±0.37.62±0.37.62±0.35.76±0.3

1.778±0.2

30.5

15.2

50.

50.

5

(41)

4942±0.15

10.5

6.5±

0.5

2-Ø3.3

28 27 26 25 24 23 22 21 20 19 18 16 15 13 12 10 9 8 7 6 5 4 3 2 11417 11

3536

2930

37 34 33 32 31

Type name , Lot No.

6.7±0.3

(6.3

)(2

)

1.778±0.2

46.228(26×1.778)

2.54±0.32.54±0.3

7.62±0.37.62±0.37.62±0.3

5.76±0.3

10.5

30.5

0.5

0.5

15.2

5

42±0.15

6.5±

0.5

(2)(0.5)

49

(41)

2-Ø3.3

Mini DIPIPM(PSSxxS51F6-C)Zigzag(C)

■ Outline Drawing of DIPIPMTM

Super mini DIPIPM Ver.6MOSFET Super mini DIPIPMLong (A)

Unit :mm

1.78±0.2

3.3±0.3 3.3±0.3

6.6±0.3 7.62±0.3 7.62±0.3 7.62±0.3 7.62±0.3

1.78±0.21.78±0.2

(11×1.78)

31

15.5

46±0.2 3.25

0.51.51

2

52.5

7.112

.7

28

2930

31 38

1

Type name, Lot No.

4.32±0.2 4.32±0.2

2-ø3.3

0.61

1

2.04±0.3

3.95±0.3

18 25

17 1

Type nameLot No.12

0.28

0.28

8-0.6

14×2.54(=35.56)

3 MIN2-R1.6

4-C1.2

24±0

.5(1

)1.778±0.2

35±0.3

20×1.778(=35.56)38±0.5

16-0.5

2.54±0.2

14±0

.5

5.5±0

.5

HEAT SINK SIDE

0.5 0.50.5 0.5

Mini DIPIPM (PSSxxS71F6)1200V Mini DIPIPM

DIPIPM+

A AAA

1 2

0.5

5.7

1.2 0.6

6.45

13

0.5

36 35 34 33 32 31 30 29 28 27 26

3 4 5 6 7 910 1314151617181920212223 25248

BB

B BA

A=1.778 0.3±

1.778 0.3±1.778 12x

B=3.556 0.3±6.58 0.3±

14.6

50.

3±

340.

5±

8.7 0.3±

8.7 0.3± 8 0.3± 8 0.3± 8 0.3± 8 0.3±

76 0.3±

85 0.5±

8 0.3± 8 0.3± 8 0.3± 8 0.3± 3 0.3±

3 0.3±

8.7 0.3± 8.7 0.3±

SLIMDIPLong

32.8±0.5

29.8±0.3

5±0.2

5.5±

0.5

9.4±

0.3

15-1.15±0.15

19-0.4

20

0.64-C1.2

21

2-R1.6

0.5

0.45

6×5 ( =30 )

0.3

0.5

0.45

10.8

18.8

(0.1

)

1

1.025

7-0.6

HEAT SINK SIDE

32.8±0.5

29.8±0.3

5±0.2

5.5±

0.5

9.4±

0.3

15-1.15±0.15

19-0.4

20

0.64-C1.2

21

2-R1.6

0.5

0.45

6×5 ( =30 )

S

0.3

0.5

0.45

9.3

18.8

(0.1

)

1

1.025

7-0.6

HEAT SINK SIDE

Line-up of DIPIPMTM

SLIMDIPShort

25 35 50 75 100 150 200 300 450

PM25CG1A120★

PM25RG1A120★

PM25CG1AL120★

PM25CG1AP120★

PM25RG1AP120★

PM25CG1APL120★

PM25CG1B120★

PM25RG1B120★

PM75CG1A065★

PM75RG1A065★

PM75CG1AP065★

PM75RG1AP065★

PM75CG1APL065★

PM75CG1B065★

PM75RG1B065★

PM75CG1B120★

PM75RG1B120★

PM75CG1AL065★

PM50CG1A065★

PM50RG1A065★

PM50CG1AP065★

PM50RG1AP065★

PM50CG1APL065★

PM50CG1B065★

PM50RG1B065★

PM50CG1AL065★

PM35CG1A120★

PM35RG1A120★

PM35CG1AL120★

PM35CG1AP120★

PM35RG1AP120★

PM35CG1APL120★

PM35CG1B120★

PM35RG1B120★

PM50CG1A120★

PM50CG1AL120★

PM50CG1AP120★

PM50CG1APL120★

PM50CG1B120★

PM50RG1B120★

PM100CG1A065★

PM100CG1AL065★

PM100CG1AP065★

PM100CG1APL065★

PM100CG1B065★

PM100RG1B065★PM150CG1B065★

PM150RG1B065★PM200CG1B065★

PM200RG1B065★

PM200CG1C065★

PM200RG1C065★PM300CG1C065★

PM300RG1C065★PM450CG1C065★

PM450RG1C065★

PM200CG1C120★

PM200RG1C120★PM150CG1C120★

PM150RG1C120★

PM100CG1B120★

PM100RG1B120★

PM100CG1C120★

PM100RG1C120★


P N U V W

P NC U V W

87

IPM

For the "A" package 6-in-1 (CG1A) main pin shape, select either solder pin or screw typeFor the pin layout, select either straight or L-shaped

*1 CSTBT™: Mitsubishi Electric’s unique IGBT that utilizes the carrier cumulative effect*2 RFC: Relaxed field cathode*3 Conventional product: IPM L1-Series Built-in functions: Supply Undervoltage lock protection (UV)、Short-circuit protection (SC), Over-temperature protection (OT)*4 Bootstrap diode (BSD): Optional products include 50A, 75A, 100A/650V, 25A,35A,50A /1200V*5 PC-TIM: Phase change-thermal interface material

Loaded with built-in functions, contributing to inverters with enhanced energy savings

New Products

G1 Series IPM with 7th-generation IGBT

■ "A" package main pin shape and layout

<Main Features>・Power loss has been reduced with the introduction of the 7th-generation IGBT produced using CSTBTTM*1 and a diode incorporating a RFC*2 structure

that contributes to reducing the power consumed in inverters・The new resin-insulated metal baseplate, originally introduced in 7th-generation IGBT modules, eliminates the solder-attached section, increasing the

thermal cycle lifetime and improving inverter reliability・In addition to the built-in functions of the previous product,*3 automatic switching speed control, error detection function and Bootstrap diode (BSD)*4

contribute to lowering inverter loss and shortening design time・The introduction of PC-TIM*5 contribute to simplifying the inverter assembly process (optional)

Main pin layoutMain pin shape

Main pin: Solder pin Main pin: Screw L-shaped Straight

B or NC N

★: New Product

Representative reference is "A" package with screw terminal and straight layout (CG1A).

■ Lineup

VCES(V) PackageIc（A）

650V

1200V

A package

B package

C package

A package

B package

C package

Main pinshape

Main pinlayout

Straight

L-shaped

Straight

L-shaped

L-shaped

L-shaped

Straight

L-shaped

Straight

L-shaped

L-shaped

L-shaped

Screw

Screw

Screw

Screw

Screw

Screw

Solder pin

Solder pin

Mini DIPIPM (PSSxxS51F6)

Large DIPIPM

(2.54×10)

1.8

8.6

0.8 22.7

168

10±0.3 10±0.3 10±0.3 10±0.3 10±0.3 10±0.3

70 ±0.379 ±0.5

2.54±0.3

31±0

.5

A = 2.54±0.3B = 5.08±0.3

B B B

12 53 4 6 87 9 1110 15 1716 20

303132

333440

294241

18 191412 13

B

B

B

A A A AA A

A 2.8

12.7

Type name , Lot No. 2-ø4.5±0.2

28 27 26 25 24 23 22 21 20 19 18 16 15 13 12 10 9 8 7 6 5 4 3 2 11417 11

3536

2930

37 34 33 32 31

Type name , Lot No.

6.7±0.32.54±0.3

(6.3

)(2

)

(2)(0.5)

46.228(26×1.778)

2.54±0.3

7.62±0.37.62±0.37.62±0.35.76±0.3

1.778±0.2

30.5

15.2

50.

50.

5

(41)

4942±0.15

10.5

6.5±

0.5

2-Ø3.3

28 27 26 25 24 23 22 21 20 19 18 16 15 13 12 10 9 8 7 6 5 4 3 2 11417 11

3536

2930

37 34 33 32 31

Type name , Lot No.

6.7±0.3

(6.3

)(2

)

1.778±0.2

46.228(26×1.778)

2.54±0.32.54±0.3

7.62±0.37.62±0.37.62±0.3

5.76±0.3

10.5

30.5

0.5

0.5

15.2

5

42±0.15

6.5±

0.5

(2)(0.5)

49

(41)

2-Ø3.3

Mini DIPIPM(PSSxxS51F6-C)Zigzag(C)

■ Outline Drawing of DIPIPMTM

Super mini DIPIPM Ver.6MOSFET Super mini DIPIPMLong (A)

Unit :mm

1.78±0.2

3.3±0.3 3.3±0.3

6.6±0.3 7.62±0.3 7.62±0.3 7.62±0.3 7.62±0.3

1.78±0.21.78±0.2

(11×1.78)

31

15.5

46±0.2 3.25

0.51.51

2

52.5

7.112

.7

28

2930

31 38

1

Type name, Lot No.

4.32±0.2 4.32±0.2

2-ø3.3

0.61

1

2.04±0.3

3.95±0.3

18 25

17 1

Type nameLot No.12

0.28

0.28

8-0.6

14×2.54(=35.56)

3 MIN2-R1.6

4-C1.2

24±0

.5(1

)

1.778±0.2

35±0.3

20×1.778(=35.56)38±0.5

16-0.5

2.54±0.2

14±0

.5

5.5±0

.5

HEAT SINK SIDE

0.5 0.50.5 0.5

Mini DIPIPM (PSSxxS71F6)1200V Mini DIPIPM

DIPIPM+

A AAA

1 2

0.5

5.7

1.2 0.6

6.45

13

0.5

36 35 34 33 32 31 30 29 28 27 26

3 4 5 6 7 910 1314151617181920212223 25248

BB

B BA

A=1.778 0.3±

1.778 0.3±1.778 12x

B=3.556 0.3±6.58 0.3±

14.6

50.

3±

340.

5±

8.7 0.3±

8.7 0.3± 8 0.3± 8 0.3± 8 0.3± 8 0.3±

76 0.3±

85 0.5±

8 0.3± 8 0.3± 8 0.3± 8 0.3± 3 0.3±

3 0.3±

8.7 0.3± 8.7 0.3±

SLIMDIPLong

32.8±0.5

29.8±0.3

5±0.2

5.5±

0.5

9.4±

0.3

15-1.15±0.15

19-0.4

20

0.64-C1.2

21

2-R1.6

0.5

0.45

6×5 ( =30 )

0.3

0.5

0.45

10.8

18.8

(0.1

)

1

1.025

7-0.6

HEAT SINK SIDE

32.8±0.5

29.8±0.3

5±0.2

5.5±

0.5

9.4±

0.3

15-1.15±0.15

19-0.4

20

0.64-C1.2

21

2-R1.6

0.5

0.45

6×5 ( =30 )

S

0.3

0.5

0.45

9.3

18.8

(0.1

)

1

1.025

7-0.6

HEAT SINK SIDE

Line-up of DIPIPMTM

SLIMDIPShort

25 35 50 75 100 150 200 300 450

PM25CG1A120★

PM25RG1A120★

PM25CG1AL120★

PM25CG1AP120★

PM25RG1AP120★

PM25CG1APL120★

PM25CG1B120★

PM25RG1B120★

PM75CG1A065★

PM75RG1A065★

PM75CG1AP065★

PM75RG1AP065★

PM75CG1APL065★

PM75CG1B065★

PM75RG1B065★

PM75CG1B120★

PM75RG1B120★

PM75CG1AL065★

PM50CG1A065★

PM50RG1A065★

PM50CG1AP065★

PM50RG1AP065★

PM50CG1APL065★

PM50CG1B065★

PM50RG1B065★

PM50CG1AL065★

PM35CG1A120★

PM35RG1A120★

PM35CG1AL120★

PM35CG1AP120★

PM35RG1AP120★

PM35CG1APL120★

PM35CG1B120★

PM35RG1B120★

PM50CG1A120★

PM50CG1AL120★

PM50CG1AP120★

PM50CG1APL120★

PM50CG1B120★

PM50RG1B120★

PM100CG1A065★

PM100CG1AL065★

PM100CG1AP065★

PM100CG1APL065★

PM100CG1B065★

PM100RG1B065★PM150CG1B065★

PM150RG1B065★PM200CG1B065★

PM200RG1B065★

PM200CG1C065★

PM200RG1C065★PM300CG1C065★

PM300RG1C065★PM450CG1C065★

PM450RG1C065★

PM200CG1C120★

PM200RG1C120★PM150CG1C120★

PM150RG1C120★

PM100CG1B120★

PM100RG1B120★

PM100CG1C120★

PM100RG1C120★


■ Matrix of IPM Modules 1200V (No.: Number of outline drawing, see page 11 to 12)

9

Line-up of IPM

UVOTSC

D C R

IGBTchip

RoHS directiveCompatibility

Connection

1200V

CSTBT＊1 Built-in current sensor

Built-in temperature sensor

P-side/N-sideP-side/N-sideP-side/N-side

－CompliantL Series

L1 Series

CSTBT＊1

Emiｔter sensor installedTemperature sensor installed

P-side/N-sideP-side/N-sideP-side/N-sideP-side/N-side

Compliant－

G1 Series



N-sideN-sideN-side

－Compliant

S-DASH SERVO

S1 Series




－CompliantV Series

V1 Series




－Compliant

－

L SeriesSeriesIC(A)

VCES(V)


[Notes]

[Term] UV：Supply Under Voltage-lock protection，SC：Short-Circuit Protection，OT：Over-temperature protection，OC：Over-current protection，RoHS：the Restriction of the use of certain Hazardous Substances in electrical and electronic equipment

*1: Full-gate CSTBTTM *2: PCM (Plugged Cell Merged) CSTBTTM

No.Connection No.Connection No.Connection No.Connection No.Connection

Faultoutput

Identification

■ Matrix of IPM Modules 650V/600V (No.: Number of outline drawing, see page 11 to 12)

UVOTSC

400/450

600800

300

200

150

100

75

50

D B4 B5 B6 C R

600V650V


－Compliant

－

CSTBT＊2 Built-in emitter sensor


PM150CLA060PM150RLA060

PM600CLA060


CR

PM75CLA060PM75CLB060PM75RLA060PM75RLB060

CCRR


CCRR

CR


CR

PM450CLA060 C 08

C 08

L Series


Built-in temperature sensorP-side/N-sideP-side/N-sideP-side/N-side

－CompliantＬ　Series

CSTBT＊1



Compliant－

PM150CL1A060PM150CL1B060PM150RL1A060PM150RL1B060

CCRR


CCRR

01020102

01020102


CCRR

01020102

CR

0404

PM200CL1A060PM200RL1A060

CCRRR

PM50CL1A060PM50CL1B060PM50RL1A060PM50RL1B060PM50RL1C060

0102010203

L1 SeriesNo.

G1 Series

N-sideN-sideN-side

－Compliant

S-DASH SERVO



C

CPM50CS1D060 05

CPM100CS1D060 05

05PM150CS1D060

C 05PM200CS1D060

S1 Series


－CompliantV　Series



DD

PM400DV1A060 D 06

0607

V1 Series


－Compliant

－



PM50B4LA060PM50B5LA060PM50B6LA060PM50B4LB060PM50B5LB060PM50B6LB060PM50B4L1C060PM50B5L1C060PM50B6L1C060

B4B5B6B4B5B6B4B5B6

010101020202030303

PhotovoltaicIC(A)


Connection

SeriesVCES(V)

UV: Supply Under Voltage-lock protection, SC: Short-Circuit protection, OT: Over-temperature protection,OC: Over-current protection, CSTBTTM: Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effectRoHS: Restriction of hazardous substances in electrical and electronic equipment

[Notes]

[Term]



Connection No.Connection No.Connection No.Connection No.Connection No.Connection

IGBTchip

Faultoutput


B4B5B6B4B5B6B4B5B6

010101020202030303

PM75CS1D060 C 05

PM600DV1A060PM800DV1B060

CR

0404


CR


Identification

PM75CG1A065★

PM75RG1A065★

PM75CG1B065★

PM75RG1B065★

PM75CG1AL065★

PM75CG1AP065★

PM75CG1APL065★

PM75RG1AP065★

CRCRCCCR

1212101012090909

PM50CG1A065★

PM50RG1A065★

PM50CG1B065★

PM50RG1B065★

PM50CG1AL065★

PM50CG1AP065★

PM50CG1APL065★

PM50RG1AP065★

CRCRCCCR

1212101012090909

PM150CG1B065★

PM150RG1B065★CR

1010

PM300CG1C065★

PM300RG1C065★CR

1111

PM450CG1C065★

PM450RG1C065★CR

1111

PM100CG1A065★

PM100CG1B065★

PM100RG1B065★

PM100CG1AL065★

PM100CG1AP065★

PM100CG1APL065★

CCRCCC

121010120909

CRCR

10101111

PM200CG1B065★

PM200RG1B065★

PM200CG1C065★

PM200RG1C065★

200

300450

150

100

75

50

25


CCRRR

0102010203

PM25CG1A120★

PM25CG1B120★

PM25RG1A120★

PM25RG1B120★

PM25CG1AL120★

PM25CG1AP120★

PM25CG1APL120★

PM25RG1AP120★

CCRRCCCR

1210121012090909

PM50CG1A120★

PM50CG1B120★

PM50RG1B120★

PM50CG1AL120★

PM50CG1AP120★

PM50CG1APL120★

CCRCCC

121010120909

35

PM35CG1A120★

PM35CG1B120★

PM35RG1A120★

PM35RG1B120★

PM35CG1AL120★

PM35CG1AP120★

PM35CG1APL120★

PM35RG1AP120★

CCRRCCCR

1210121012090909

PM100CG1B120★

PM100CG1C120★

PM100RG1B120★

PM100RG1C120★

CCRR

10111011

PM75CG1B120★

PM75RG1B120★CR

1010

PM150CG1C120★

PM150RG1C120★CR

1111

PM200CG1C120★

PM200RG1C120★CR

1111

PM75CS1D120 C

PM25CS1D120 C 05

PM50CS1D120 C 05

CPM100CS1D120 05

05

PM200DV1A120

PM300DV1A120PM450DV1A120

D

DD

06

0606


CCRR

CCRR


08

0808


CCRR


CCRR

01020102

01020102

PM200CLA120

PM300CLA120PM450CLA120

C

CC


CCRR


CR


CR


CR

0404


CR

0404

10


■ Matrix of IPM Modules 1200V (No.: Number of outline drawing, see page 11 to 12)

9

Line-up of IPM

UVOTSC

D C R

IGBTchip


Connection

1200V




－CompliantL Series

L1 Series

CSTBT＊1



Compliant－

G1 Series



N-sideN-sideN-side

－Compliant

S-DASH SERVO

S1 Series




－CompliantV Series

V1 Series




－Compliant

－

L SeriesSeriesIC(A)

VCES(V)


[Notes]

[Term] UV：Supply Under Voltage-lock protection，SC：Short-Circuit Protection，OT：Over-temperature protection，OC：Over-current protection，RoHS：the Restriction of the use of certain Hazardous Substances in electrical and electronic equipment


No.Connection No.Connection No.Connection No.Connection No.Connection

Faultoutput

Identification

■ Matrix of IPM Modules 650V/600V (No.: Number of outline drawing, see page 11 to 12)

UVOTSC

400/450

600800

300

200

150

100

75

50

D B4 B5 B6 C R

600V650V


－Compliant

－




PM600CLA060


CR


CCRR


CCRR

CR


CR

PM450CLA060 C 08

C 08

L Series


Built-in temperature sensorP-side/N-sideP-side/N-sideP-side/N-side

－CompliantＬ　Series

CSTBT＊1



Compliant－


CCRR


CCRR

01020102

01020102


CCRR

01020102

CR

0404


CCRRR


0102010203

L1 SeriesNo.

G1 Series

N-sideN-sideN-side

－Compliant

S-DASH SERVO



C

CPM50CS1D060 05

CPM100CS1D060 05

05PM150CS1D060

C 05PM200CS1D060

S1 Series


－CompliantV　Series



DD

PM400DV1A060 D 06

0607

V1 Series


－Compliant

－




B4B5B6B4B5B6B4B5B6

010101020202030303

PhotovoltaicIC(A)


Connection

SeriesVCES(V)

UV: Supply Under Voltage-lock protection, SC: Short-Circuit protection, OT: Over-temperature protection,OC: Over-current protection, CSTBTTM: Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effectRoHS: Restriction of hazardous substances in electrical and electronic equipment

[Notes]

[Term]



Connection No.Connection No.Connection No.Connection No.Connection No.Connection

IGBTchip

Faultoutput


B4B5B6B4B5B6B4B5B6

010101020202030303

PM75CS1D060 C 05

PM600DV1A060PM800DV1B060

CR

0404


CR


Identification

PM75CG1A065★

PM75RG1A065★

PM75CG1B065★

PM75RG1B065★

PM75CG1AL065★

PM75CG1AP065★

PM75CG1APL065★

PM75RG1AP065★

CRCRCCCR

1212101012090909

PM50CG1A065★

PM50RG1A065★

PM50CG1B065★

PM50RG1B065★

PM50CG1AL065★

PM50CG1AP065★

PM50CG1APL065★

PM50RG1AP065★

CRCRCCCR

1212101012090909

PM150CG1B065★

PM150RG1B065★CR

1010

PM300CG1C065★

PM300RG1C065★CR

1111

PM450CG1C065★

PM450RG1C065★CR

1111

PM100CG1A065★

PM100CG1B065★

PM100RG1B065★

PM100CG1AL065★

PM100CG1AP065★

PM100CG1APL065★

CCRCCC

121010120909

CRCR

10101111

PM200CG1B065★

PM200RG1B065★

PM200CG1C065★

PM200RG1C065★

200

300450

150

100

75

50

25


CCRRR

0102010203

PM25CG1A120★

PM25CG1B120★

PM25RG1A120★

PM25RG1B120★

PM25CG1AL120★

PM25CG1AP120★

PM25CG1APL120★

PM25RG1AP120★

CCRRCCCR

1210121012090909

PM50CG1A120★

PM50CG1B120★

PM50RG1B120★

PM50CG1AL120★

PM50CG1AP120★

PM50CG1APL120★

CCRCCC

121010120909

35

PM35CG1A120★

PM35CG1B120★

PM35RG1A120★

PM35RG1B120★

PM35CG1AL120★

PM35CG1AP120★

PM35CG1APL120★

PM35RG1AP120★

CCRRCCCR

1210121012090909

PM100CG1B120★

PM100CG1C120★

PM100RG1B120★

PM100RG1C120★

CCRR

10111011

PM75CG1B120★

PM75RG1B120★CR

1010

PM150CG1C120★

PM150RG1C120★CR

1111

PM200CG1C120★

PM200RG1C120★CR

1111

PM75CS1D120 C

PM25CS1D120 C 05

PM50CS1D120 C 05

CPM100CS1D120 05

05

PM200DV1A120

PM300DV1A120PM450DV1A120

D

DD

06

0606


CCRR

CCRR


08

0808


CCRR


CCRR

01020102

01020102

PM200CLA120

PM300CLA120PM450CLA120

C

CC


CCRR


CR


CR


CR

0404


CR

0404

10


1110

1211

Line-up of IPM

■ Outline Drawing of IPM

PM200,300,400,450CG1C/RG1C065PM100,150,200CG1C/RG1C120

12Unit:mm

120106766.518.75

163-2

21

1 5 9 13 19

27.5

27.5

55

17.5

17.5

21

19.5 22 30

.831

.9

21

(12)

(30) (60)

(10)

(5)

18.5

(5)

(9)

3-2 3-2 6-23.25 16 16

22+1 –0

.5

2±0.5

2-φ5.3

2-φ2.5

MOUNTING HOLES

SCREWING DEPTH 6.56-M4 NUTS

19-□0.5

35.523.05

3.25 3-2 3-2 3-2 6-210

1 5 9

(2)

4

2058.7

57

2015

.5 3.5

3.5 (10.5)27.5 26 26

(62)(29)

(12)

(5.9

)

120

419

2421.2 30

.933

.4(1

4.75

)(6

.25)

(2)

39 85

1366.5

10 10

4 441

24+1 –0

.5

71±

0.5

106±0.57

4-φ5.3

2-φ2.5

MOUNTING HOLES

(SCREWING DEPTH 7.2)6-M5 NUTS

19-□0.5

2-10

(11.

7)(4

.7)

(5)(

10)

(15) (60)90

(8)

5 8016 16 16

3-23-23-24

1 5

20.4

525

16

18 18 18 18

19.5 2230

.2

16

9 13 19

6-219.55

22+1 –0

.5

2-φ4.3

2-φ5.7

MOUNTING HOLES

SCREWING DEPTH 6.56-M4NUTS

19-□0.5

06

02 0301

04 05

0807 09 PM50,75,100CG1AP/CG1APL/RG1AP065PM25/35/50CG1AP/CG1APL/RG1AP120


C2F1 E2 C1

Ｐ

１２３４５

Ｎ

１２３４５3-M6 NUTS

SCREWING DEPTH 9.5

PM400,600DV1A060PM200,300,450DV1A120

PM50,75,100,150CL1A/RL1A060PM25,50,75CL1A/RL1A120PM50,75B4/B5/B6LA060

PM50,75,100,150CL1B/RL1B060PM25,50,75CL1B/RL1B120PM50,75B4/B5/B6LB060

PM200,300CL1A/RL1A060PM100,150CL1A/RL1A120

PM450,600CLA060PM200,300,450CLA120

PM50RL1C060PM25RL1C120PM50,75,B4/B5/B6L1C060

PM50,75,100,150,200CS1D060PM25,50,75,100CS1D120

PM800DV1B060

106

19.753.25

7

16 15.25 2-φ5.5

6-M5NUTS

MOUNTINGHOLES

6-23-23-23-2

10.75

712

(SCR

EWIN

G DE

PTH)

19-□0.5

32.75 23 23 23

1331

5511.

7532

13.5

17.5

17.5

19.75

1214

.5

1616

12011

1 5 9 13 19

12

227.75 98.25

2.5232323

19.5

5525

.75

25

19-□0.5

9.5

11.5

27.5

106±0.25

66.519.753.25

7

44

354

4

44 44 44 44

16 15.256-23-23-23-2

1616

120

1 5 9 13 19

4-φ2.5

MOUNTINGHOLES

2-φ5.5

10.5 10.5

10.5

10.5

78±

0.5

6.05

6.05

34.7

33.6

24.1

+1 –0.5

10.5 21

.518

.720 11

0

2016

.5

71.5

3.25

2-φ2.5

4-φ5.5MountingHoles


19-□0.5

6-2

19 13 9 5 1

1130.15

3-2 3-2 3-2 3.2510 10 10

66.5

26

1811

26

135110±0.56.05

6-M5 Nuts6.05

40.5 11.710.5

LABEL

35.5

36.6

12 7

1 6

13 36

9.08

21 3-2.54

50

53.75 50 53.75

31.843-2.543.22

50

21 3-2.54

31.843-2.543.22

21 3-2.54

31.843-2.543.22

17

12

17

12

17

12

17

12

17

12

17

12

162

172

50±0.5614 22 28 22 2228

11

8-φ5.5MOUNTINGHOLES

6-φ2.5

12-M6NUTS

94.5

7.75

55

3.75

(15.

5)

150

137

123

99

2013.5

5.5

6.5

24-□0.64

13951

2320

.5

25

50

2

1325

2- φ4.3

16.5

90

5 10 2 2 2 10 2 2 2 10 2 2 2 10 2 2 2 2 2 2

12 12 12 12 1210

80

MOUNTINGHOLES

LABEL

5-M4 NUTネジ深さ7.5

23.79 2-2.

54

2-2.

54

2-2.

54

5-2.5410.16 10.16

15

3

197

19 19 19

10.16

106 ±0.3

28 6.5

211

.61.

1

10

16.5

30

7

120

1 4

967.4

5.5750 398.

52.

525

1.65 7 10 15

31.2 42

.7

LABEL


2-R7

15-□0.64

50±0.5 50±0.5

110±

0.5

29+1

/-0.

5106±0.25

25

14 14 14

25 38 3±0.5

2-φ3.5

56±

0.25

28 26 3.5

120

4-R6.5

70

9.3

LABEL

3–M8NUTS

4

312828

120

181818

4-φ6.5

2-φ3.5

MOUNTING HOLES

C2E1 E2 C1

P

N

12345

12345

LABEL

76±

0.25

3±0.5

4-R6.5 106±0.25

34+1

/-0.

5

90 73

3132.8

Unit:mm

2-φ4.3

2-φ5.7

5 8016

18

（15）

（3）（

10）

17 25

.5

（60）90

6-0.8 6-319-□0.5

22.6

1620.4

525

4 18 18 18

19.552.63-2 3-2 3-2 6-2

2-10

16 16

MOUNTING HOLES

PM50,75,100,150,200CG1B/RG1B065PM25,35,50,75,100CG1B/RG1B120

PM50,75,100CG1A/CG1AL/RG1A065PM25/35/50CG1A/CG1AL/RG1A120


1110

1211

Line-up of IPM


PM200,300,400,450CG1C/RG1C065PM100,150,200CG1C/RG1C120

12Unit:mm

120106766.518.75

163-2

21

1 5 9 13 19

27.5

27.5

55

17.5

17.5

21

19.5 22 30

.831

.9

21

(12)

(30) (60)

(10)

(5)

18.5

(5)

(9)

3-2 3-2 6-23.25 16 16

22+1 –0

.5

2±0.5

2-φ5.3

2-φ2.5

MOUNTING HOLES

SCREWING DEPTH 6.56-M4 NUTS

19-□0.5

35.523.05

3.25 3-2 3-2 3-2 6-210

1 5 9

(2)

4

2058.7

57

2015

.5 3.5

3.5 (10.5)27.5 26 26

(62)(29)

(12)

(5.9

)

120

419

2421.2 30

.933

.4(1

4.75

)(6

.25)

(2)

39 85

1366.5

10 10

4 441

24+1 –0

.5

71±

0.5

106±0.57

4-φ5.3

2-φ2.5

MOUNTING HOLES

(SCREWING DEPTH 7.2)6-M5 NUTS

19-□0.5

2-10

(11.

7)(4

.7)

(5)(

10)

(15) (60)90

(8)

5 8016 16 16

3-23-23-24

1 5

20.4

525

16

18 18 18 18

19.5 2230

.2

16

9 13 19

6-219.55

22+1 –0

.5

2-φ4.3

2-φ5.7

MOUNTING HOLES

SCREWING DEPTH 6.56-M4NUTS

19-□0.5

06

02 0301

04 05

0807 09 PM50,75,100CG1AP/CG1APL/RG1AP065PM25/35/50CG1AP/CG1APL/RG1AP120


C2F1 E2 C1

Ｐ

１２３４５

Ｎ

１２３４５3-M6 NUTS

SCREWING DEPTH 9.5

PM400,600DV1A060PM200,300,450DV1A120

PM50,75,100,150CL1A/RL1A060PM25,50,75CL1A/RL1A120PM50,75B4/B5/B6LA060

PM50,75,100,150CL1B/RL1B060PM25,50,75CL1B/RL1B120PM50,75B4/B5/B6LB060

PM200,300CL1A/RL1A060PM100,150CL1A/RL1A120

PM450,600CLA060PM200,300,450CLA120

PM50RL1C060PM25RL1C120PM50,75,B4/B5/B6L1C060

PM50,75,100,150,200CS1D060PM25,50,75,100CS1D120

PM800DV1B060

106

19.753.25

7

16 15.25 2-φ5.5

6-M5NUTS

MOUNTINGHOLES

6-23-23-23-2

10.75

712

(SCR

EWIN

G DE

PTH)

19-□0.5

32.75 23 23 23

1331

5511.

7532

13.5

17.5

17.5

19.75

1214

.5

1616

12011

1 5 9 13 19

12

227.75 98.25

2.5232323

19.5

5525

.75

25

19-□0.5

9.5

11.5

27.5

106±0.25

66.519.753.25

7

44

354

4

44 44 44 44

16 15.256-23-23-23-2

1616

120

1 5 9 13 19

4-φ2.5

MOUNTINGHOLES

2-φ5.5

10.5 10.5

10.5

10.5

78±

0.5

6.05

6.05

34.7

33.6

24.1

+1 –0.5

10.5 21

.518

.720 11

0

2016

.5

71.5

3.25

2-φ2.5



19-□0.5

6-2

19 13 9 5 1

1130.15

3-2 3-2 3-2 3.2510 10 10

66.5

26

1811

26

135110±0.56.05

6-M5 Nuts6.05

40.5 11.710.5

LABEL

35.5

36.6

12 7

1 6

13 36

9.08

21 3-2.54

50

53.75 50 53.75

31.843-2.543.22

50

21 3-2.54

31.843-2.543.22

21 3-2.54

31.843-2.543.22

17

12

17

12

17

12

17

12

17

12

17

12

162

172

50±0.5614 22 28 22 2228

11


6-φ2.5

12-M6NUTS

94.5

7.75

55

3.75

(15.

5)

150

137

123

99

2013.5

5.5

6.5

24-□0.64

13951

2320

.5

25

50

2

1325

2- φ4.3

16.5

90

5 10 2 2 2 10 2 2 2 10 2 2 2 10 2 2 2 2 2 2

12 12 12 12 1210

80

MOUNTINGHOLES

LABEL

5-M4 NUTネジ深さ7.5

23.79 2-2.

54

2-2.

54

2-2.

54

5-2.5410.16 10.16

15

3

197

19 19 19

10.16

106 ±0.3

28 6.5

211

.61.

1

10

16.5

30

7

120

1 4

967.4

5.5750 398.

52.

525

1.65 7 10 15

31.2 42

.7

LABEL


2-R7

15-□0.64

50±0.5 50±0.5

110±

0.5

29+1

/-0.

5

106±0.25

25

14 14 14

25 38 3±0.5

2-φ3.5

56±

0.25

28 26 3.5

120

4-R6.5

70

9.3

LABEL

3–M8NUTS

4

312828

120

181818

4-φ6.5

2-φ3.5

MOUNTING HOLES

C2E1 E2 C1

P

N

12345

12345

LABEL

76±

0.25

3±0.5

4-R6.5 106±0.25

34+1

/-0.

5

90 73

3132.8

Unit:mm

2-φ4.3

2-φ5.7

5 8016

18

（15）

（3）（

10）

17 25

.5

（60）90

6-0.8 6-319-□0.5

22.6

1620.4

525

4 18 18 18

19.552.63-2 3-2 3-2 6-2

2-10

16 16

MOUNTING HOLES

PM50,75,100,150,200CG1B/RG1B065PM25,35,50,75,100CG1B/RG1B120

PM50,75,100CG1A/CG1AL/RG1A065PM25/35/50CG1A/CG1AL/RG1A120




1413

IGBT Modules

◆ Press-fit terminal support （NX）

①Main pin

■Press-fit pin

②Signal pin

New Products

■ New structure realizes improved reliability (improved thermal cycle lifetime)

Base plateSolder

Ceramic insulation board

Chip ChipWire Silicone gel

Base plateSolder


Wire

NX package structure comparison

7th-generation IGBT

Compared to standard (std) package structure6th-generation IGBT 6th-generation IGBT

Resin insulated metal baseplate Thick metal substrate(TMS)

※Adopts SoLid Cover(SLC) Technology ※Standard package is not available for CIB

ResinAdded pattern thickness

7th-generation IGBT

Ultra sonic bonding adopted

WireChipWireChip

• Possible to select the control pin shape　(soldered terminals/press-fit terminals)• Solder attachment process eliminated

<Main Features>・New modules equipped with three-phase converter, inverter, and brake circuit(CIB), contributes to simplifying design for inverter systems・CIB modules contribute to compact inverter systems by reducing package size by 36% compared to the Mitsubishi Electric's existing module.(CIB)• Power loss has been reduced with the introduction of the 7th-generation IGBT produced using CSTBTTM*2 and a diode incorporating a relaxed field of

cathode (RFC) structure• The new structure introduced eliminates the solder-attached section, increasing the thermal cycle lifetime, which contributes to improving the

reliability of inverters• The introduction of press-fit pins and PC-TIM*1 contribute to simplifying the assembly process for inverters

*1 PC-TIM: Phase change - thermal interface material*2 CSTBTTM： Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effect

New lineup contributes to simplifying design, downsizing, energy-saving s of industrial inverters.

IGBT Module T/T1-Series

Line-up of MOSFET Modules

100200300

ID (A)

VDSS

Connection

FM200TU-07A, -2A, -3AFM400TU-07A, -2A, -3AFM600TU-07A, -2A, -3A

11.5

9.1

11097

83 8.812 12.916.5 16 1632

1 1314

7

612

6.5

11.5

35 26 25

16.5 32 32

6.520

44

6738

90 80

R6.5

ø6.5

ø6.5ø6.5

Unit :mm

T

RoHS directive compliant

Outline Drawing of MOSFET Modules

Series Matrix of MOSFET Modules

FM200TU-07AFM400TU-07AFM600TU-07A

75V

TTT

Connection


100V

TTT

Connection


150V

TTT

Connection


1413

IGBT Modules

◆ Press-fit terminal support （NX）

①Main pin

■Press-fit pin

②Signal pin

New Products

■ New structure realizes improved reliability (improved thermal cycle lifetime)

Base plateSolder


Chip ChipWire Silicone gel

Base plateSolder


Wire

NX package structure comparison

7th-generation IGBT

Compared to standard (std) package structure6th-generation IGBT 6th-generation IGBT

Resin insulated metal baseplate Thick metal substrate(TMS)

※Adopts SoLid Cover(SLC) Technology ※Standard package is not available for CIB

ResinAdded pattern thickness

7th-generation IGBT

Ultra sonic bonding adopted

WireChipWireChip

• Possible to select the control pin shape　(soldered terminals/press-fit terminals)• Solder attachment process eliminated

<Main Features>・New modules equipped with three-phase converter, inverter, and brake circuit(CIB), contributes to simplifying design for inverter systems・CIB modules contribute to compact inverter systems by reducing package size by 36% compared to the Mitsubishi Electric's existing module.(CIB)• Power loss has been reduced with the introduction of the 7th-generation IGBT produced using CSTBTTM*2 and a diode incorporating a relaxed field of

cathode (RFC) structure• The new structure introduced eliminates the solder-attached section, increasing the thermal cycle lifetime, which contributes to improving the

reliability of inverters• The introduction of press-fit pins and PC-TIM*1 contribute to simplifying the assembly process for inverters

*1 PC-TIM: Phase change - thermal interface material*2 CSTBTTM： Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effect

New lineup contributes to simplifying design, downsizing, energy-saving s of industrial inverters.

IGBT Module T/T1-Series

Line-up of MOSFET Modules

100200300

ID (A)

VDSS

Connection

FM200TU-07A, -2A, -3AFM400TU-07A, -2A, -3AFM600TU-07A, -2A, -3A

11.5

9.1

11097

83 8.812 12.916.5 16 1632

1 1314

7

612

6.5

11.5

35 26 25

16.5 32 32

6.520

44

6738

90 80

R6.5

ø6.5

ø6.5ø6.5

Unit :mm

T

RoHS directive compliant

Outline Drawing of MOSFET Modules

Series Matrix of MOSFET Modules


75V

TTT

Connection


100V

TTT

Connection


150V

TTT

Connection


1615

IGBT Modules Line-up of IGBT Modules

Evolution of IGBT Module Series

IGBT module

Series nameVoltage class

Rated current capacityConnection type

Outline drawing and other specifications

CM 600 D Y -13 TType Name Definition of IGBT Modules

・Lineup includes various package types・6th-generation CSTBTTM delivers low-loss performance・Thinner package (Height: 17mm) (NX type)・Suited to large-capacity applications (MPD type)

S Series

・High-speed CSTBTTM delivers low-loss performance・Soft switching (resonant) turn-off function (ZVS)・Enhanced inner wiring (skin effect)

NFH Series

Features of IGBT Module Series

CSTBTTM: Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effect.MPD: Mega power dual

F Series NF Series S Series, S1 Series T Series

Standard (Std) type NX type NX type

NFH Series Standard (Std) type Standard (Std) type

MPD type MPD type

4th-generation of IGBT


6th/6.1th-generation of IGBT


A Series

NX type

Standard (Std) type

■ Lineup


125-500kW inverter

500kW - inverter

CM400ST-24S1 IGBT 1200V 400A 4-in-1 115×82

CM1400HA-24S IGBT 1200V 1400A 1-in-1 130×67

RM1400HA-24S Diode 1200V 1400A 1-in-1 130×67

CM1000HA-34S IGBT 1700V 1000A 1-in-1 130×67

CM500C2Y-24S IGBT 1200V 500A 2-in-1 130×67

External dimensionsW×D（mm）Main application Model Module type Rated voltage Rated current Circuit structure

Feature Products

4-in-1 type1-in-1 / 2-in-1 type

1-in-1 type (H) 2-in-1 type (C2) 4-in-1 type (S)

Contributes to realizing smaller, energy-saving large-capacity inverters

<Main Features>• Compatible with 3-level inverters, reducing power consumption approx. 30％*1

• New package developed*2 contributing to lower inductance and simplified inverter circuit structure• IGBT specifications optimized*3 with development of new compact,

low-inductance package• 4-in-1*4 and 1-in-1/2-in-1*5 lineup contributes to improved compactness and

freedom in inverter design

*1 Comparison between 3-level inverter incorporated in this device and 2-level inverter in conventional device.

*2 1-in-1/2-in-1 type external dimensions of 130x67mm, 4-in-1 type external dimensions of 115x82mm, new package developed with innovative terminal positioning.

*3 IGBT specifications optimized for 3-level inverters, adopting CSTBTTM (Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effect).

*4 4-in-1 module with one 3-level inverter arm in one package.*5 Bidirectional switch model as emitter common connection.

Power Modules for 3-level Inverters

1700 V IGBT Module 1200 V Diode Module 1700 V Diode Module

50

75

100

150

200

225

300

400

450

600

1000

■ Matrix of IGBT Modules 650V/600V (No.: Number of outline drawing, see page 19 to 20)

650V 600V

Series

Connection

Connection

IC(A)

VCES(V)

D T R M

RoHS directive (2011/65/EU) compliant

RoHS directive (2011/65/EU) compliant■ Matrix of Power Modules for 3-level Inverter (No.: Number of outline drawing, see page 22 to 23)

1200 V IGBT Module

Diode moduleIGBT module

IC/IF

VCES/VRRM

400

450

500

600

800

1000

1400

SC1

3511

★★: Under Development ★: New Product＊Connection of diode module and IGBT module are different.

HHC2 SC1

T/T1-SeriesNX Type

T/S/S1-Seriesstd Type

T-Seriesstd Type

A-SeriesNX Type

NF-Series NF-SeriesNFH Type

CM75MXUB-13T★★

CM75MXUB-13T1★★

CM75MXUBP-13T★★

CM75MXUBP-13T1★★

CM100TX-13T★

CM100TXP-13T★

CM100MXUB-13T★★

CM100MXUB-13T1★★

CM100MXUBP-13T★★


CM100MXUD-13T★★

CM100MXUD-13T1★★

CM100MXUDP-13T★★

CM100MXUDP-13T1★★

CM150TX-13T★

CM150TXP-13T★

CM150RX-13T★

CM150RXP-13T★

CM150MXUD-13T★★




CM200TX-13T★

CM200TXP-13T★

CM200RX-13T★

CM200RXP-13T★

CM300DX-13T★

CM300DXP-13T★

CM450DX-13T★

CM450DXP-13T★

CM600DX-13T★

CM600DXP-13T★

CM400ST-24S1★

CM400C1Y-24S

C1 32CM450C1Y-24T★★

C2 36CM500C2Y-24S★

C1 32CM600C1Y-24T★

H 36CM1400HA-24S★

MMMM

D 30

D 30

D 30

D 31

D 31

D 32

D 03

D 03 D 08

D 10

D 11

R 02

R 02

MR

0102

M 01

TTMMMMMMMM

TTRRMMMM

TTRR

DD

DD

DD

4242--

33374242--

4444--

333734384444--

33373438

2839

2839

2839

CM100DY-13T★

CM150DY-13T★

CM200DY-13T★

CM300DY-13T★

CM400DY-13T★

CM600DY-13T★

CM75MX-12A

CM100MX-12ACM100RX-12A

CM150RX-12A

CM200RX-12A

CM300DX-12A

CM400DX-12A

CM75TL-12NFCM75RL-12NF


CM150DY-12NFCM150TL-12NFCM150RL-12NF

CM200DY-12NF CM200TL-12NFCM200RL-12NF

CM300DY-12NF

CM400DY-12NF

CM600DY-12NF

CM100DUS-12F

CM150DUS-12F

CM200DU-12NFH

CM300DU-12NFH

CM400DU-12NFH

CM600DU-12NFH

TR

0707

DTR

080707

DTR

080909

TR

0707

D 14

D 13

D 13

D 13

D 14

D 15

S/S1-Seriesstd Type

S/S1-Seriesstd Type

S/S1-Seriesstd Type

H 36CM1000HA-34S★

H 36CM800HA-34S★

H 36CM600HA-34S★

H 36RM1400HA-24S★

D 32RM600DY-34S★

D 32RM800DY-34S★

No.Connection No.Connection

No.Connection No.Connection No.Connection No.Connection

No.Connection No.Connection No.Connection

★★: Under Development ★: New Product Non-recommended : Please contact to the sales offices.

CM50MXUB-13T★★

CM50MXUB-13T1★★

CM50MXUBP-13T★★


MMMM

4242--

D


1615

IGBT Modules Line-up of IGBT Modules

Evolution of IGBT Module Series

IGBT module

Series nameVoltage class

Rated current capacityConnection type

Outline drawing and other specifications

CM 600 D Y -13 TType Name Definition of IGBT Modules

・Lineup includes various package types・6th-generation CSTBTTM delivers low-loss performance・Thinner package (Height: 17mm) (NX type)・Suited to large-capacity applications (MPD type)

S Series

・High-speed CSTBTTM delivers low-loss performance・Soft switching (resonant) turn-off function (ZVS)・Enhanced inner wiring (skin effect)

NFH Series

Features of IGBT Module Series

CSTBTTM: Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effect.MPD: Mega power dual

F Series NF Series S Series, S1 Series T Series

Standard (Std) type NX type NX type

NFH Series Standard (Std) type Standard (Std) type

MPD type MPD type



6th/6.1th-generation of IGBT


A Series

NX type

Standard (Std) type

■ Lineup


125-500kW inverter

500kW - inverter

CM400ST-24S1 IGBT 1200V 400A 4-in-1 115×82

CM1400HA-24S IGBT 1200V 1400A 1-in-1 130×67

RM1400HA-24S Diode 1200V 1400A 1-in-1 130×67

CM1000HA-34S IGBT 1700V 1000A 1-in-1 130×67

CM500C2Y-24S IGBT 1200V 500A 2-in-1 130×67

External dimensionsW×D（mm）Main application Model Module type Rated voltage Rated current Circuit structure

Feature Products

4-in-1 type1-in-1 / 2-in-1 type

1-in-1 type (H) 2-in-1 type (C2) 4-in-1 type (S)

Contributes to realizing smaller, energy-saving large-capacity inverters

<Main Features>• Compatible with 3-level inverters, reducing power consumption approx. 30％*1

• New package developed*2 contributing to lower inductance and simplified inverter circuit structure• IGBT specifications optimized*3 with development of new compact,

low-inductance package• 4-in-1*4 and 1-in-1/2-in-1*5 lineup contributes to improved compactness and

freedom in inverter design

*1 Comparison between 3-level inverter incorporated in this device and 2-level inverter in conventional device.

*2 1-in-1/2-in-1 type external dimensions of 130x67mm, 4-in-1 type external dimensions of 115x82mm, new package developed with innovative terminal positioning.

*3 IGBT specifications optimized for 3-level inverters, adopting CSTBTTM (Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effect).

*4 4-in-1 module with one 3-level inverter arm in one package.*5 Bidirectional switch model as emitter common connection.

Power Modules for 3-level Inverters

1700 V IGBT Module 1200 V Diode Module 1700 V Diode Module

50

75

100

150

200

225

300

400

450

600

1000

■ Matrix of IGBT Modules 650V/600V (No.: Number of outline drawing, see page 19 to 20)

650V 600V

Series

Connection

Connection

IC(A)

VCES(V)

D T R M

RoHS directive (2011/65/EU) compliant

RoHS directive (2011/65/EU) compliant■ Matrix of Power Modules for 3-level Inverter (No.: Number of outline drawing, see page 22 to 23)

1200 V IGBT Module

Diode moduleIGBT module

IC/IF

VCES/VRRM

400

450

500

600

800

1000

1400

SC1

3511

★★: Under Development ★: New Product＊Connection of diode module and IGBT module are different.

HHC2 SC1

T/T1-SeriesNX Type

T/S/S1-Seriesstd Type

T-Seriesstd Type

A-SeriesNX Type

NF-Series NF-SeriesNFH Type

CM75MXUB-13T★★

CM75MXUB-13T1★★

CM75MXUBP-13T★★


CM100TX-13T★

CM100TXP-13T★

CM100MXUB-13T★★

CM100MXUB-13T1★★

CM100MXUBP-13T★★


CM100MXUD-13T★★




CM150TX-13T★

CM150TXP-13T★

CM150RX-13T★

CM150RXP-13T★

CM150MXUD-13T★★




CM200TX-13T★

CM200TXP-13T★

CM200RX-13T★

CM200RXP-13T★

CM300DX-13T★

CM300DXP-13T★

CM450DX-13T★

CM450DXP-13T★

CM600DX-13T★

CM600DXP-13T★

CM400ST-24S1★

CM400C1Y-24S

C1 32CM450C1Y-24T★★

C2 36CM500C2Y-24S★

C1 32CM600C1Y-24T★

H 36CM1400HA-24S★

MMMM

D 30

D 30

D 30

D 31

D 31

D 32

D 03

D 03 D 08

D 10

D 11

R 02

R 02

MR

0102

M 01

TTMMMMMMMM

TTRRMMMM

TTRR

DD

DD

DD

4242--

33374242--

4444--

333734384444--

33373438

2839

2839

2839

CM100DY-13T★

CM150DY-13T★

CM200DY-13T★

CM300DY-13T★

CM400DY-13T★

CM600DY-13T★

CM75MX-12A

CM100MX-12ACM100RX-12A

CM150RX-12A

CM200RX-12A

CM300DX-12A

CM400DX-12A



CM150DY-12NFCM150TL-12NFCM150RL-12NF

CM200DY-12NF CM200TL-12NFCM200RL-12NF

CM300DY-12NF

CM400DY-12NF

CM600DY-12NF

CM100DUS-12F

CM150DUS-12F

CM200DU-12NFH

CM300DU-12NFH

CM400DU-12NFH

CM600DU-12NFH

TR

0707

DTR

080707

DTR

080909

TR

0707

D 14

D 13

D 13

D 13

D 14

D 15

S/S1-Seriesstd Type

S/S1-Seriesstd Type

S/S1-Seriesstd Type

H 36CM1000HA-34S★

H 36CM800HA-34S★

H 36CM600HA-34S★

H 36RM1400HA-24S★

D 32RM600DY-34S★

D 32RM800DY-34S★

No.Connection No.Connection

No.Connection No.Connection No.Connection No.Connection

No.Connection No.Connection No.Connection

★★: Under Development ★: New Product Non-recommended : Please contact to the sales offices.

CM50MXUB-13T★★

CM50MXUB-13T1★★

CM50MXUBP-13T★★


MMMM

4242--

D


1817

Line-up of IGBT Modules

■ Matrix of IGBT Modules 1200V (No.: Number of Outline Drawing, see page 19 to 23)RoHS directive (2011/65/EU) compliant

CM35MXUA-24T★★CM35MXUA-24T1★★CM35MXUAP-24T★★CM35MXUAP-24T1★★

MMMM

4141--

MMMM

4141--

MMMMMMMM

4242--

4343--

TTRRMMMM

333734384343--

TTRRMMMM

333734384444--

TT

3337

DD

2839

DD

2839

DD

2839

DD

2839

DD

2940

1200V

Series

IC

VCES(V)

T/T1-SeriesNX Type

T-Seriesstd Type

S/S1-SeriesNX Type

S/S1-Seriesstd Type

S/S1-SeriesMPD Type

A-Series※1

NF-Series※1

Connection

★★: Under Development ★: New Product

35

50

75

100

150

200

225

300

400

450

800

900

1000

1400

600

D R MT E E3H


CM75MXUB-24T★★CM75MXUB-24T1★★CM75MXUBP-24T★★CM75MXUBP-24T1★★CM75MXUC-24T★★CM75MXUC-24T1★★CM75MXUCP-24T★★CM75MXUCP-24T1★★

CM100TX-24T★CM100TXP-24T★CM100RX-24T★CM100RXP-24T★CM100MXUC-24T★★CM100MXUC-24T1★★CM100MXUCP-24T★★CM100MXUCP-24T1★★

CM150TX-24T★CM150TXP-24T★CM150RX-24T★CM150RXP-24T★CM150MXUD-24T★★CM150MXUD-24T1★★CM150MXUDP-24T★★CM150MXUDP-24T1★★

CM225DX-24T★CM225DXP-24T★



CM200TX-24T★CM200TXP-24T★



CM100DY-24T★

CM150DY-24T★

CM200DY-24T★

CM300DY-24T★

CM450DY-24T★

CM600DY-24T★

CM35MXA-24S

CM50MXA-24S

CM75MXA-24SCM75TX-24SCM75RX-24S

CM100MXA-24SCM100TX-24S1CM100RX-24S1

CM150DX-24SCM150EXS-24SCM150TX-24S1CM150RX-24S1

CM200EXS-24SCM200RXL-24S

CM225DX-24S1

CM300DX-24S1CM300EXS-24SCM300RXL-24S1★

CM450DX-24S1

CM600DX-24S1CM600DXL-24S

CM1000DXL-24S

CM300DY-24S

CM450DY-24S

CM600DY-24S

CM800DY-24S

CM1400HA-24S★

CM900DUC-24S

CM1400DUC-24S

CM50RL-24NFCM50TL-24NF

CM75RL-24NFCM75TL24NF

CM100DY-24ACM100DY-24NFCM100E3Y-24NFCM100RL-24NFCM100TL-24NFCM100DU-24NFH


CM200DY-24ACM200DY-24NFCM200RL-24NFCM200TL-24NFCM200DU-24NFH

CM300DY-24ACM300DY-24NFCM300DU-24NFH

CM400DY-24ACM400HA-24ACM400DY-24NFCM400DU-24NFH

CM600DY-24ACM600HA-24ACM600DU-24NFCM600DU-24NFH

*1: A-Series have model namse ending with A, NF-Series have model name ending with NF/NFH

D 32

D 32

D 31

D 31

D 30

D 30

D 06

DD

276

D 27

DER

272421

D 27

ER

2421

DETR

03242526

MTR

042526

MTR

040502

M 04

M 04

D 10

D 11

D 11

D 12

H 36

DHDD

11161215

DHDD

11161115

DDD

101114

DDRTD

0810090914

DDE3RTD

080808090913

DDE3RTD

080808070713

RT

0707

RT

0707

D 17

D 17

■ Matrix of IGBT Modules 1700VRoHS directive (2011/65/EU) compliant

1700V

Series

IC

VCES(V)

T-SeriesNX Type

T-Seriesstd Type

S/S1-SeriesNX Type

S/S1-Seriesstd Type

S/S1-SeriesMPD Type

A-Seriesstd Type

Connection

D R MT


35

50

75

100

150

200

225

300

400

450

800

900

1000

1400

600

500

EH

CM100TX-34T★★CM100TXP-34T★★


CM225DX-34T★★CM225DXP-34T★★

CM300DX-34T★★

CM300DXP-34T★★



CM75DY-34T★★

CM100DY-34T★★

CM150DY-34T★★

CM200DY-34T★★

CM300DY-34T★★

CM400DY-34T★★

CM75MXA-34SACM75RX-34SA

CM150DX-34SACM150RXL-34SA

CM200DX-34SACM200EXS-34SA

CM300DX-34SA

CM450DXL-34SA

CM600DXL-34SA CM600HA-34S★

CM800HA-34S★

CM1000HA-34S★ CM1000DUC-34SA

CM75DY-34A

CM100DY-34A

CM150DY-34A

CM200DY-34A

CM300DY-34A

CM400DY-34A

CM500HA-34A

TT

3337

TT

3337

DD

2839

D

D

28

39

DD

2839

DD

2839

D 30

D 30

D 31

D 31

D 32

D 32

MR

2319

DR

2021

DE

2024

D 20

D 22

D 22 H 36

H 36

H 36 D 17

D 08

D 08

D 10

D 10

D 11

D 18

H 16

No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection


1817


■ Matrix of IGBT Modules 1200V (No.: Number of Outline Drawing, see page 19 to 23)RoHS directive (2011/65/EU) compliant


MMMM

4141--

MMMM

4141--

MMMMMMMM

4242--

4343--

TTRRMMMM

333734384343--

TTRRMMMM

333734384444--

TT

3337

DD

2839

DD

2839

DD

2839

DD

2839

DD

2940

1200V

Series

IC

VCES(V)

T/T1-SeriesNX Type

T-Seriesstd Type

S/S1-SeriesNX Type

S/S1-Seriesstd Type

S/S1-SeriesMPD Type

A-Series※1

NF-Series※1

Connection


35

50

75

100

150

200

225

300

400

450

800

900

1000

1400

600

D R MT E E3H


CM75MXUB-24T★★CM75MXUB-24T1★★CM75MXUBP-24T★★CM75MXUBP-24T1★★CM75MXUC-24T★★CM75MXUC-24T1★★CM75MXUCP-24T★★CM75MXUCP-24T1★★

CM100TX-24T★CM100TXP-24T★CM100RX-24T★CM100RXP-24T★CM100MXUC-24T★★CM100MXUC-24T1★★CM100MXUCP-24T★★CM100MXUCP-24T1★★

CM150TX-24T★CM150TXP-24T★CM150RX-24T★CM150RXP-24T★CM150MXUD-24T★★CM150MXUD-24T1★★CM150MXUDP-24T★★CM150MXUDP-24T1★★




CM200TX-24T★CM200TXP-24T★



CM100DY-24T★

CM150DY-24T★

CM200DY-24T★

CM300DY-24T★

CM450DY-24T★

CM600DY-24T★

CM35MXA-24S

CM50MXA-24S

CM75MXA-24SCM75TX-24SCM75RX-24S

CM100MXA-24SCM100TX-24S1CM100RX-24S1

CM150DX-24SCM150EXS-24SCM150TX-24S1CM150RX-24S1

CM200EXS-24SCM200RXL-24S

CM225DX-24S1

CM300DX-24S1CM300EXS-24SCM300RXL-24S1★

CM450DX-24S1

CM600DX-24S1CM600DXL-24S

CM1000DXL-24S

CM300DY-24S

CM450DY-24S

CM600DY-24S

CM800DY-24S

CM1400HA-24S★

CM900DUC-24S

CM1400DUC-24S

CM50RL-24NFCM50TL-24NF

CM75RL-24NFCM75TL24NF



CM200DY-24ACM200DY-24NFCM200RL-24NFCM200TL-24NFCM200DU-24NFH

CM300DY-24ACM300DY-24NFCM300DU-24NFH

CM400DY-24ACM400HA-24ACM400DY-24NFCM400DU-24NFH

CM600DY-24ACM600HA-24ACM600DU-24NFCM600DU-24NFH

*1: A-Series have model namse ending with A, NF-Series have model name ending with NF/NFH

D 32

D 32

D 31

D 31

D 30

D 30

D 06

DD

276

D 27

DER

272421

D 27

ER

2421

DETR

03242526

MTR

042526

MTR

040502

M 04

M 04

D 10

D 11

D 11

D 12

H 36

DHDD

11161215

DHDD

11161115

DDD

101114

DDRTD

0810090914

DDE3RTD

080808090913

DDE3RTD

080808070713

RT

0707

RT

0707

D 17

D 17

■ Matrix of IGBT Modules 1700VRoHS directive (2011/65/EU) compliant

1700V

Series

IC

VCES(V)

T-SeriesNX Type

T-Seriesstd Type

S/S1-SeriesNX Type

S/S1-Seriesstd Type

S/S1-SeriesMPD Type

A-Seriesstd Type

Connection

D R MT


35

50

75

100

150

200

225

300

400

450

800

900

1000

1400

600

500

EH




CM300DX-34T★★

CM300DXP-34T★★



CM75DY-34T★★

CM100DY-34T★★

CM150DY-34T★★

CM200DY-34T★★

CM300DY-34T★★

CM400DY-34T★★

CM75MXA-34SACM75RX-34SA

CM150DX-34SACM150RXL-34SA

CM200DX-34SACM200EXS-34SA

CM300DX-34SA

CM450DXL-34SA

CM600DXL-34SA CM600HA-34S★

CM800HA-34S★

CM1000HA-34S★ CM1000DUC-34SA

CM75DY-34A

CM100DY-34A

CM150DY-34A

CM200DY-34A

CM300DY-34A

CM400DY-34A

CM500HA-34A

TT

3337

TT

3337

DD

2839

D

D

28

39

DD

2839

DD

2839

D 30

D 30

D 31

D 31

D 32

D 32

MR

2319

DR

2021

DE

2024

D 20

D 22

D 22 H 36

H 36

H 36 D 17

D 08

D 08

D 10

D 10

D 11

D 18

H 16

No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection No.Connection


■ Outline Drawing of IGBT Modules■ Outline Drawing of IGBT Modules

CM400DY-34A18

130

36 43.8 13.8 11.510110±0.2

1013010

1010

20.5

14.5

4014

.511

0±0.

2

99

920

9

(25.9) (15)

4-φ6.5

24.5

+1 –0.5

35+1 –0

.5

17 CM900,1400DUC-24SCM1000DUC-34SA

ＬＡＢＥＬ

C2G

2E2 G1

E1C1

C1E2

C2E1

MOUNTING HOLES

（SC

REW

ING

DEPT

H）

（SC

REW

ING

DEPT

H）

9-M6 NUTS 12

18

42 42

15.7

42

150

166

42.5

\0.2

538

\0.2

5

137.5\0.25

74\0

.25

14 1414141414

1414

25.1

5.5

10.5

2111

19

129.

5

212

15.7

74\0

.25

38\0

.25

8-Ø6.5

6.7

16.5

16.5

6.7

16 CM400,600HA-24ACM500HA-34A

93±0.25

108

16

29

67.9

17.57.5

10

20

9 10 1348 62

Dia - 6.5(4 TYP.)

24 20

25.8

+1/-0

.5

36+1

/-0.5

(8.5)

M6 - THD.(2 TYP.)M4 - THD.

(2 TYP.)

LABEL

14 CM300,400DU-12NFHCM200,300DU-24NFH

TAB#110,t=0.5

29+1 –0

.58.8

58.2

5

4

4-φ6.5 MOUNTING HOLES3-M6 NUTS

108

62

18 187 7 18

8.522

2.84

7.56

156

717

.5

14 14 14

25 2.521.525

Tc measured point7.57.5

LABEL

25.7

18

48±

0.25

93±0.25

13 CM100,150DUS-12FCM200DU-12NFHCM100,150DU-24NFH

94

2317

2448

30+1

/-0.

5

421

.2

4

7.5

1118

2 - MountingHoles (6.5 Dia.)

723

3 - M5 Nuts

80±0.25

13.512

16 1625

LABEL

2.5 2.52.5 TAB#110,t=0.5

CM600DU-24NFCM800DY-24S

12

140130

110±0.25

20

1020

.414

.5

9

14.5

408

130

110 ±

0.25

65

36

3–M8 NUTS 4–M4 NUTS

43.8 13.8 11.510

2626 26

15

35+1 –0

.5

24.5

+1 –0.5

15

4–φ6.5MOUNTING HOLES LABEL

11 CM600DY-12NFCM400DY-24NFCM400,600DY-24ACM300DY-34A

CM400C1Y-24SCM450DY-24SCM600DY-24SCM300DY-24NF

62±

0.25

80

25 25 21.5

4-φ6.5MOUNTING HOLES

8.521

.2

7718

14 14 14

18 18 TAB#110,t=0.5

3-M6 NUTS

LABEL29+1

.0–0

.5

615

6

93±0.25

110

CM200TL/RL-12NFCM150,200TL/RL-24NF

09

2020

16.5

18

110±0.5(6.05) (6.05)11.7262617.5

135

10.5

10.5

18.7

110

10.5

10.5

10.5 10.5

(13)

48.7

513

.7526

.54

4-φ5.5

78±

0.5

(6.0

5)

2530.5 25 (13)1146.3

13

24.1

(SCRE

WING

DEPT

H)

6-M5 NUTS

(6.0

5)+1 –0

.5

LABEL

MOUNTINGHOLES

08 CM150,200,300DY-12NFCM100,150DY-24NF CM100,150,200DY-24ACM75,100DY-34ACM100,150E3Y-24NF

TAB#110,t=0.5

80±0.25

94

48 13

47.5

21.2

184

121212

2323 1717


3-M5 NUTS

7716 16 16

LABEL29+1

.0–0

.5

CM75,100,150TL/RL-12NFCM50,75,100TL/RL-24NF

07

2-φ5.5

5511.

7532

(13.5)

106±0.5

13.627

17 1740.78

12011

6-M5NUTS

35

(19.75)

10.75

22 23 23 23

163 23.212

22 (SCR

EWIN

G DE

PTH)

12

1212

12 12 12

+1 –0.5

MOUNTINGHOLES

06CM600,1000DXL-24S

φ0.5＊All dimensions with a tolerance of

27262524232221201918171615141312111098765

28293031

34

33

32

353637383940

4142434445464748495051525354555657585960616263

1

2

3

4

A

4-ø5.5MOUNTINGHOLES

110±

0.5

10.74

4.05

41.2

249

.72

3.6

7.75

117.

2

94.5

2222

27.53

22

6

110±0.5

16.9

117.23.6 94.57.75

137

6.5

121.

7

39

12

39

10.53

3915.2419.0515.2415.24

(21.14)

(20.5

)

121.7

152

(SC

REW

ING

DEP

TH)

LABEL 17 +1 -0

.5

3.5

13

7 13

19.24

6-M6 N

UTS

13.515.14

3.81

3.81

3.81

(3)(6

.5)

05 CM75TX-24S

3.81

3.813.81

15.2415.24

110±0.5

50±

0.5

57.562

9994.5

114.06

39

24.52

15 11.43 11.43 11.43 11.43 11.43 3.81

15.24 3.81

3.81

11.43

11.66

3.81

11.43

3.5

11.66

3.75

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.813.81

4.060.8

3.81

7.75

121.7


LABEL

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

5253 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31

2324252627282930

6160595857565554

04 CM35,50,75,100MXA-24S

22.8611.4311.43

11.4311.4311.4311.4315

11.4313.094.06

50±

0.5

99110±0.5

94.5

118.1

393.

5

57.5

62

3.81

0.8

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.813.81

3.813.81

3.81

3.81

3.81

11.43

11.66

11.43

11.66

4.2

121.7


LABEL

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

5253 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31

2324252627282930

6160595857565554

2019


15 CM600DU-12NFHCM400,600DU-24NFH

3-M6 NUTS

4-φ6.5 MOUTINGHOLES

(8.5)

(22.

2)

9.25(

10)

(8.5)

(9)

(9)

93±0.25

62±

0.25

110

17.5

18.2

5

80

615

6

2514 14 14

25 21.5

LABEL29+1

.0–0

.5

21.2

8.5

18 18 187 7 TAB#110. t=0.5

CM400DY-12NFCM200DY-24NFCM300DY-24ACM300DY-24SCM150,200DY-34A

10

48±

0.25

62

21.5 25 25 24


8.522

.2

771814 14 14

18 18TAB#110,t=0.5

3-M6 NUTS

LABEL30+1

.0–0

.5

615

6

93±0.25

108

Unit :mm

03 CM300,400DX-12A CM150,200DX-24S

02 CM100,150,200RX-12A CM75RX-24S

01 CM75,100MX-12A

53

54

61

1 22

31

30

23

99

121.7＊118.1110±0.5

94.5

＊58

.4

0

0.8

3950±

0.5

57.5 62

＊4.2

＊15.48＊11.66

＊4.

06

＊13

.09

＊16

.9＊

15＊

18.8

＊30

.24

＊34

.04

＊45

.48

＊49

.28

＊60

.72

＊64

.52

＊75

.96

＊79

.76

＊91

.2＊

950(7

.75)

＊28

.33

＊32

.14

＊66

.43

＊70

.24

＊81

.67

＊85

.48

＊89

.29

＊93

.1＊

96.9

1

＊15.48＊19.28＊30.72＊34.52

＊47

.38

＊51

.19

＊26.9＊23.1

＊38.34＊34.52

0 0 3.75

0.8

3.5 LABEL


φ0.5＊All dimensions with a tolerance of φ0.5＊All dimensions with a tolerance of φ0.5＊All dimensions with a tolerance of

Unit :mm

34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13

12111098765

1 2 3 4

35

36

A

6-M5 NUTS

22.8622.86

8.5612 17

22.8620.7113.5

13.6

4

6.5

6.5

(21.

14)

(21.14)

121.7

9994.5

393.

7557

.5 6277

.1

7.75

68.

512

392214

17

110±0.5

50±0

.5

136.9

4-ø5.5MOUNTING HOLES

LABEL

11.43 11.43 11.43 11.43 11.4315

3.81

(20.

5)

3.81

3.81

3.81

3.81

3.81

0.8

3.5

46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25

24

23

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

47

48

A 15

94.5

110±0.5

41.66

137

6.5

54.2

4.

2

3.75

57

.550

±0.522

6

49.53

99

121.7

152

3.81

22.86

3.81

3.81

17

62

1239

4-M6 NUTS

(14)

(14)


LABEL

6.5

17+1 -0

.5

3.5

13.5

7.75

(13.5)

(21.14)

(SC

REW

ING

DEP

TH)



CM400DY-34A18

130

36 43.8 13.8 11.510110±0.2

1013010

1010

20.5

14.5

4014

.511

0±0.

2

99

920

9

(25.9) (15)

4-φ6.5

24.5

+1 –0.5

35+1 –0

.5

17 CM900,1400DUC-24SCM1000DUC-34SA

ＬＡＢＥＬ

C2G

2E2 G1

E1C1

C1E2

C2E1

MOUNTING HOLES

（SC

REW

ING

DEPT

H）

（SC

REW

ING

DEPT

H）

9-M6 NUTS 12

18

42 42

15.7

42

150

166

42.5

\0.2

538

\0.2

5

137.5\0.25

74\0

.25

14 1414141414

1414

25.1

5.5

10.5

2111

19

129.

5

212

15.7

74\0

.25

38\0

.25

8-Ø6.5

6.7

16.5

16.5

6.7

16 CM400,600HA-24ACM500HA-34A

93±0.25

108

16

29

67.9

17.57.5

10

20

9 10 1348 62

Dia - 6.5(4 TYP.)

24 20

25.8

+1/-0

.5

36+1

/-0.5

(8.5)

M6 - THD.(2 TYP.)M4 - THD.

(2 TYP.)

LABEL

14 CM300,400DU-12NFHCM200,300DU-24NFH

TAB#110,t=0.5

29+1 –0

.58.8

58.2

5

4

4-φ6.5 MOUNTING HOLES3-M6 NUTS

108

62

18 187 7 18

8.522

2.84

7.56

156

717

.5

14 14 14

25 2.521.525

Tc measured point7.57.5

LABEL

25.7

18

48±

0.25

93±0.25

13 CM100,150DUS-12FCM200DU-12NFHCM100,150DU-24NFH

94

2317

2448

30+1

/-0.

5

421

.2

4

7.5

1118

2 - MountingHoles (6.5 Dia.)

723

3 - M5 Nuts

80±0.25

13.512

16 1625

LABEL

2.5 2.52.5 TAB#110,t=0.5

CM600DU-24NFCM800DY-24S

12

140130

110±0.25

20

1020

.414

.5

9

14.5

408

130

110±

0.25

65

36

3–M8 NUTS 4–M4 NUTS

43.8 13.8 11.510

2626 26

15

35+1 –0

.5

24.5

+1 –0.5

15

4–φ6.5MOUNTING HOLES LABEL

11 CM600DY-12NFCM400DY-24NFCM400,600DY-24ACM300DY-34A

CM400C1Y-24SCM450DY-24SCM600DY-24SCM300DY-24NF

62±

0.25

80

25 25 21.5


8.521

.2

7718

14 14 14

18 18 TAB#110,t=0.5

3-M6 NUTS

LABEL29+1

.0–0

.5

615

6

93±0.25

110

CM200TL/RL-12NFCM150,200TL/RL-24NF

09

2020

16.5

18

110±0.5(6.05) (6.05)11.7262617.5

135

10.5

10.5

18.7

110

10.5

10.5

10.5 10.5

(13)

48.7

513

.7526

.54

4-φ5.5

78±

0.5

(6.0

5)

2530.5 25 (13)1146.3

13

24.1

(SCRE

WING

DEPT

H)

6-M5 NUTS

(6.0

5)+1 –0

.5

LABEL

MOUNTINGHOLES

08 CM150,200,300DY-12NFCM100,150DY-24NF CM100,150,200DY-24ACM75,100DY-34ACM100,150E3Y-24NF

TAB#110,t=0.5

80±0.25

94

48 13

47.5

21.2

184

121212

2323 1717


3-M5 NUTS

7716 16 16

LABEL29+1

.0–0

.5

CM75,100,150TL/RL-12NFCM50,75,100TL/RL-24NF

07

2-φ5.5

5511.

7532

(13.5)

106±0.5

13.627

17 1740.78

12011

6-M5NUTS

35

(19.75)

10.75

22 23 23 23

163 23.212

22 (SCR

EWIN

G DE

PTH)

12

1212

12 12 12

+1 –0.5

MOUNTINGHOLES

06CM600,1000DXL-24S

φ0.5＊All dimensions with a tolerance of

27262524232221201918171615141312111098765

28293031

34

33

32

353637383940

4142434445464748495051525354555657585960616263

1

2

3

4

A

4-ø5.5MOUNTINGHOLES

110±

0.5

10.74

4.05

41.2

249

.72

3.6

7.75

117.

2

94.5

2222

27.53

22

6

110±0.5

16.9

117.23.6 94.57.75

137

6.5

121.

7

39

12

39

10.53

39

15.2419.0515.2415.24

(21.14)

(20.5

)

121.7

152

(SC

REW

ING

DEP

TH)

LABEL 17 +1 -0

.5

3.5

13

7 13

19.24

6-M6 N

UTS

13.515.14

3.81

3.81

3.81

(3)(6

.5)

05 CM75TX-24S

3.81

3.813.81

15.2415.24

110±0.5

50±

0.5

57.562

9994.5

114.06

39

24.52

15 11.43 11.43 11.43 11.43 11.43 3.81

15.24 3.81

3.81

11.43

11.66

3.81

11.43

3.5

11.66

3.75

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.813.81

4.060.8

3.81

7.75

121.7


LABEL

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

5253 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31

2324252627282930

6160595857565554

04 CM35,50,75,100MXA-24S

22.8611.4311.43

11.4311.4311.4311.4315

11.4313.094.06

50±

0.5

99110±0.5

94.5

118.1

393.

5

57.5

62

3.81

0.8

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.81

3.813.81

3.813.81

3.81

3.81

3.81

11.43

11.66

11.43

11.66

4.2

121.7


LABEL

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

5253 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31

2324252627282930

6160595857565554

2019


15 CM600DU-12NFHCM400,600DU-24NFH

3-M6 NUTS

4-φ6.5 MOUTINGHOLES

(8.5)(2

2.2)

9.25(

10)

(8.5)

(9)

(9)

93±0.25

62±

0.25

110

17.5

18.2

5

80

615

6

2514 14 14

25 21.5

LABEL29+1

.0–0

.5

21.2

8.518 18 187 7 TAB#110. t=0.5

CM400DY-12NFCM200DY-24NFCM300DY-24ACM300DY-24SCM150,200DY-34A

10

48±

0.25

62

21.5 25 25 24


8.522

.2

771814 14 14

18 18TAB#110,t=0.5

3-M6 NUTS

LABEL30+1

.0–0

.5

615

693±0.25

108

Unit :mm

03 CM300,400DX-12A CM150,200DX-24S

02 CM100,150,200RX-12A CM75RX-24S

01 CM75,100MX-12A

53

54

61

1 22

31

30

23

99

121.7＊118.1110±0.5

94.5

＊58

.4

0

0.8

3950±

0.5

57.5 62

＊4.2

＊15.48＊11.66

＊4.

06

＊13

.09

＊16

.9＊

15＊

18.8

＊30

.24

＊34

.04

＊45

.48

＊49

.28

＊60

.72

＊64

.52

＊75

.96

＊79

.76

＊91

.2＊

950(7

.75)

＊28

.33

＊32

.14

＊66

.43

＊70

.24

＊81

.67

＊85

.48

＊89

.29

＊93

.1＊

96.9

1

＊15.48＊19.28＊30.72＊34.52

＊47

.38

＊51

.19

＊26.9＊23.1

＊38.34＊34.52

0 0 3.75

0.8

3.5 LABEL


φ0.5＊All dimensions with a tolerance of φ0.5＊All dimensions with a tolerance of φ0.5＊All dimensions with a tolerance of

Unit :mm

34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13

12111098765

1 2 3 4

35

36

A

6-M5 NUTS

22.8622.86

8.5612 17

22.8620.7113.5

13.6

4

6.5

6.5

(21.

14)

(21.14)

121.7

9994.5

393.

7557

.5 6277

.1

7.75

68.

512

392214

17

110±0.5

50±0

.5

136.9


LABEL

11.43 11.43 11.43 11.43 11.4315

3.81

(20.

5)

3.81

3.81

3.81

3.81

3.81

0.8

3.5

46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25

24

23

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

47

48

A 15

94.5

110±0.5

41.66

137

6.5

54.2

4.

2

3.75

57

.550

±0.522

6

49.53

99

121.7

152

3.81

22.86

3.81

3.81

17

62

1239

4-M6 NUTS

(14)

(14)


LABEL

6.5

17+1 -0

.5

3.5

13.5

7.75

(13.5)

(21.14)

(SC

REW

ING

DEP

TH)



2221


Unit :mmUnit :mm

3534 36

3231 33

29 3028

CM225DX-24S1CM300DX-24S1CM450DX-24S1CM600DX-24S1

LABEL

152137

121.7

94.57.75110±0.5


(SCR

EWIN

G DE

PTH)

37.72±0.333.91±0.3

0.45±

0.3

57.9

5±0.

3

7.24±

0.3

11.0

5±0.

3

60.5

8±0.

364

.39±

0.3

87.2

5±0.

3

50±

0.5

39 2214

12

(6.5)(15.64)

(15.64

) 3.75

57.5 62

714

17+1 -0

.53.5

(7.75

)

6

4-M6 NUTS

(13.5)(15.14)

27

77.1

CM100RX-24S1CM150RX-24S1

136.9121.7

94.157.75(15.64)

6.5

110±0.5

50±

0.5

57.5

6-M5 NUTS22.8622.8622.8620.7113.5

126 8

2214

13.6

411.5

39

3.75

62


7.24±

0.2

11.0

6±0.

2

22.4

8±0.

226

.3±0.

2

37.7

2±0.

241

.54±

0.2

52.9

6±0.

256

.78±

0.2

68.2±

0.2

72.0

2±0.

2

83.4

4±0.

287

.26±

0.2

106.

3±0.

2

(94.

5)

(7.7

5) 0

LABEL

24CM75MXA-34SA

121.7

94.5

0

(57.5)

62

4-φ5.5 MOUNTING HOLES

3.75

0

4-R6.5

(41.

9)

7.75(102.3)110±0.5

38.27±0.2

23.04±0.2

34.46±0.2

34.0

257

.5

(3.75)

19.22±0.215.42±0.2

106.3±0.211.8±0.20.8

3.5

4

5.34±

0.2

50±

0.5

9.15±

0.2

42.08±0.238.28±0.234.46±0.2

23.04±0.219.22±0.215.42±0.2

7.24±

0.2

11.06±

0.2

22.48±

0.2

26.3±

0.2

37.72±

0.2

41.54±

0.2

52.96±

0.2

56.77±

0.2

60.58±

0.2

72.01±

0.2

75.82±

0.2

79.63±

0.2

(94.5)

(7.75) 0

0

20.58±

0.2

35.82±

0.239

.63±

0.2

51.06±

0.254

.87±

0.258

.68±

0.2

81.54±

0.285

.35±

0.289

.16±

0.2

24.39±

0.2

23CM450DXL-34SACM600DXL-34SA

121.7(20.5)

3.57

(3)

17 +1-0.5

4-φ5.5

121.

7

0

147

0

2227.5322

137

152

3.6

13.5

19.2410.74 88.537.75

6-M6 NUTS(SCREWING DEPTH)

15.14

MOUNTING HOLES

(6.5

)(1

5.64

)

41.22 3922

(8)(12)

49.72

105.9±0.311.36±0.3

117.66±0.3117.21±0.3

105.85±0.3

96.7±0.3

81.46±0.377.65±0.3

58.6±0.3

110±

0.5

9.15±

0.312

.96±

0.3

43.36±0.339.55±0.3

24.31±0.320.5±0.3

94.5±0.3106.3±0.3

24.31±0.320.05±0.3

11.8±0.3

11.35±0.3

110±0.5

22

CM200RXL-24SCM300RXL-24S1CM150RXL-34SA

13

(7.7

5) 07.

24±

0.2

11.0

6±0.

2

110±0.5

110±

0.5

3.6 11

.539

13.5

14.1

422

126

8

6.5

22.4

8±0.

226

.3±

0.2

37.7

2±0.

241

.54±

0.2

52.9

6±0.

256

.78±

0.2

68.2±

0.2

72.0

2±0.

2

83.4

4±0.

287

.26±

0.2

106.

3±0.

2 3.5

6-M522.8622.8622.8620.71

(15.64)

13.585.5818.06

15.1

121.

711

7.2

NUTS

121.7

94.55.864-φ5.5 MOUNTING HOLES

7.75

(94.

5)

(20.

5)LABEL

21CM150DX-34SACM200DX-34SACM300DX-34SA

152137

121.7(15.14)

94.5

(6.5)(15.64) 0

8612

142239

110±0.5

7.24±

0.3

11.0

5±0.

3

60.5

8±0.

364

.39±

0.3

50±

0.5

87.2

5±0.

3

37.72±0.333.91±0.3

57.9

5±0.

30.

45±

0.3

14

7(S

CR

EWIN

G D

EPTH

)

(13.5)7.75

4-φ5.5

4-M6 NUTS

MOUNTING HOLES(94.

5) 3.75

57.5

62

3.5

17+1

-0.5

19

25

1048962

19.05

6257.5

13.1 13

.1

16.4

17

(5.6

)

503.

753922

1417

105

4.2

46.573.71

7.754-φ5.5 MOUNTING HOLES

4-M5 NUT

17.66 3.813.8113.5

LABEL

CM150EXS-24SCM200EXS-24SCM300EXS-24SCM200EXS-34SA

26CM100TX-24S1CM150TX-24S1

121.7

0

(57.5)

4-R6.5

62

(41.

9)

03.75

0

(102.3)94.57.75

110±0.5

106.31±0.211.8±0.2

43.

5 0.8

16.77±

0.3

42.09±0.338.28±0.334.46±0.3

23.04±0.319.22±0.315.41±0.3

7.24±

0.311

.06±

0.3

22.48±

0.3

37.72±

0.341

.54±

0.3

52.96±

0.356

.78±

0.3

72.02±

0.3

83.44±

0.387

.26±

0.3

15.41±0.319.22±0.323.04±0.3

34.46±0.338.27±0.342.09±0.3


(94.5)

57.5

0

68.2±

0.3

26.3±

0.3

50±

0.5

20.58±

0.324

.39±

0.3

39.63±

0.343

.44±

0.347

.25±

0.3

62.49±

0.366

.3±0.3

70.11±

0.3

85.35±

0.389

.16±

0.3

LABEL

20CM75RX-34SA

136.9121.7110±0.594.57.75（15.64）

7.24±

0.2

110.

6±0.

2

22.4

8±0.

226

.3±

0.2

37.7

2±0.

241

.54±

0.2

52.9

6±0.

256

.78±

0.2

68.2±

0.2

72.2±

0.2

83.4

4±0.

287

.26±

0.2

106.

3±0.

2

（7.

75）

（94

.5）0

6.5

13.5

13.6

414

223911

.577

.1

12

8

50±

0.5

3.75

57.5

62

20.71 22.86 22.86 22.86 6-M5 NUTS

MOUNTING HOLES4-Ø5.5

B

LABEL

CM400ST-24S1

70 0.5±

36 0.3±

A

32 0.3±

20.5 0.3±

1.1 0.3±

64.6

0.3

±

450.

3±

410.

3±

320.

3±

230.

3±

190.

3±

150.

3±

60.

3±

103

0.5

±

13.6

0.3

±

82

26 264-φ5.5

4-M6 NUTS

6.5

43

519.53

0

330

.54611

5

76

12

0

(15.

5)

(MOUNTING HOLES)9

CM100,150,200DY-13TCM100,150DY-24T

80±0.25

30-0

.5+1

(7)

94

23 23 17

184

4

17

13

1334

MOUNTING HOLES

TAB #110 t=0.5

3-M5 NUTS

14 14 1499

12

7.5

(28.

8)

12

LABEL

12

2- 6.5

CM300,400DY-13TCM200,300DY-24T

80±0.25(7)

94

44

181348

2323

3-M5 NUTS

TAB #110 t=0.5

TAB #110 t=0.5

LABEL

16 16 16

12 12 12

7.5

(28.

8)

77

17

MOUNTING HOLES2- 6.5

30-0

.5+1

CM600DY-13TCM450,600DY-24TCM450,600C1Y-24T

93±0.25

48±0

.25

(7.5)108

66

17.5

15

(7)

62

3-M5 NUTS

TAB (DIN46244-A2.8-0.5)

LABEL

22 22 226614

4.9

(30.

9)

18.5 28 28 21


30-0

.5+1

CM1000DX-24T

0.7±0.3

3.5±0.2 39.5

105.7±0.3

9.1±

0.2

7.85±0.3

23.09±0.326.9±0.3

83.8

±0.2

19±0.3

20.5

±1

19±0.3

102±

0.2 38.33±0.3

34.52±0.3

23.09±0.3

11.66±0.37.85±0.3

0

1010

137

114

105±0.298±0.2

110

12181218

12

A

19±0.3 6-M6 NUTSMOUNTING HOLES

(31)

(7)

(4.2) (0.8)

3.5

17137

16.5

0

(12.

3)

(4.6

)

R7(R0.5)

4- 5.5±0.2

CM150,200RX-13TCM100,150RX-24T

110±0.294.5±0.2

1106

±0.3

22.4

9±0.

326

.3±0

.3

37.7

3±0.

341

.54±

0.3

52.9

7±0.

356

.78±

0.3

72.0

2±0.

3

87.2

6±0.

3

50±0

.2

38.28±0.334.47±0.3

19.23±0.315.42±0.3

3.75A

6-M6 NUTS22.8622.8622.8620.713.5

RESIN SURFACE

13.6

414

126

223911

.5

77.1 57

.5±0

.2

6±0.

5

17-0

.5+1

62

83.4

5 ±0.

3

68.2

1±0.

3

7.25

±0.3

7.75

122

MOUNTING HOLES4- 5.5±0.2

CM300,450,600DX-13TCM225,300,450,600DX-24T

152137±0.3

122110±0.2

50±0

.2

80.0

1±0.3

57.1

5±0.3

53.3

4±0.3

30.4

8±0.3

26.6

7±0.3

3.81

±0.3

7.24

±0.34.2±0

.3

6±0.5

22±0

.3

58.4

±0.3

0.45

±0.3

3914

8612

0

0

(3.7

5)7

14.4

57.5

±0.2

17+1

-0

.5

62

4-φ5.5±0.2

15±0.3

(15.5)(6.5)

4-φ7.5±0.3

MOUNTING HOLES

RESIN SURFACE

(SCRE

WING

DEPT

H)

94.5±0.2

4-M6 NUTS

(15)

(13.5)(7.75)

CM100,150,200TX-13TCM100,150,200TX-24TCM100,150TX-34T

57.5

±0.2

50±0

.23.

75±0

.262

42.54±0.3

58.4±0.3

7.75±0.2

7.25

±0.3

0 9.52

±0.3

13.3

3±0.3

17.1

4±0.3

32.3

8±0.3

36.1

9±0.3

40±0

.3

55.2

4±0.3

59.0

5±0.3

62.8

6±0.3

78.1

±0.3

81.9

1±0.3

19.0

5±0.3

99.0

6±0.30

15.2

4±0.3

3.81

±0.3

19.0

5±0.3

45.7

2±0.3

49.5

3±0.3

30.4

8±0.3

34.2

9±0.3

60.9

6±0.3

64.7

7±0.3

76.2

±0.3

80.0

1±0.3

38.73±0.3

34.92±0.3

23.49±0.3

19.68±0.3

15.87±0.3

42.54±0.3

38.73±0.3

34.92±0.3

23.49±0.3

19.68±0.3

15.87±0.3

0.45±0.3

00

(37)

0.8

15

6±0.5 3.5

4

4-φ5.5±0.2

4-φ7.5±0.3MOUNTING HOLES

RESIN SURFACE

94.5±0.2110±0.2122

(99.5)

CM500C2Y-24SCM1400HA-24SCM1000HA-34SRM1400HA-24S

130

118±0.5

55±0

.5

676

61056.576 A 6.5 (MOUNTING HOLES)

15.5

1713

10.5

8.5

(21.

2)

(1)1430 30 4-M6 NUTS181 22

120

LABEL

381426

66

22

208

426.

516

.53.

3

29.5

1.5

(19.

6)

4- 5.5±0.2



2221


Unit :mmUnit :mm

3534 36

3231 33

29 3028

CM225DX-24S1CM300DX-24S1CM450DX-24S1CM600DX-24S1

LABEL

152137

121.7

94.57.75110±0.5


(SCR

EWIN

G DE

PTH)

37.72±0.333.91±0.3

0.45±

0.3

57.9

5±0.

3

7.24±

0.3

11.0

5±0.

3

60.5

8±0.

364

.39±

0.3

87.2

5±0.

3

50±

0.5

39 2214

12

(6.5)(15.64)

(15.64

) 3.75

57.5 62

714

17+1 -0

.53.5

(7.75

)

6

4-M6 NUTS

(13.5)(15.14)

27

77.1

CM100RX-24S1CM150RX-24S1

136.9121.7

94.157.75(15.64)

6.5

110±0.5

50±

0.5

57.5

6-M5 NUTS22.8622.8622.8620.7113.5

126 8

2214

13.6

411.5

39

3.75

62


7.24±

0.2

11.0

6±0.

2

22.4

8±0.

226

.3±0.

2

37.7

2±0.

241

.54±

0.2

52.9

6±0.

256

.78±

0.2

68.2±

0.2

72.0

2±0.

2

83.4

4±0.

287

.26±

0.2

106.

3±0.

2

(94.

5)

(7.7

5) 0

LABEL

24CM75MXA-34SA

121.7

94.5

0

(57.5)

62


3.75

0

4-R6.5

(41.

9)

7.75(102.3)110±0.5

38.27±0.2

23.04±0.2

34.46±0.2

34.0

257

.5

(3.75)

19.22±0.215.42±0.2

106.3±0.211.8±0.20.8

3.5

4

5.34±

0.2

50±

0.5

9.15±

0.2

42.08±0.238.28±0.234.46±0.2

23.04±0.219.22±0.215.42±0.2

7.24±

0.2

11.06±

0.2

22.48±

0.2

26.3±

0.2

37.72±

0.2

41.54±

0.2

52.96±

0.2

56.77±

0.2

60.58±

0.2

72.01±

0.2

75.82±

0.2

79.63±

0.2

(94.5)

(7.75) 0

0

20.58±

0.2

35.82±

0.239

.63±

0.2

51.06±

0.254

.87±

0.258

.68±

0.2

81.54±

0.285

.35±

0.289

.16±

0.2

24.39±

0.2

23CM450DXL-34SACM600DXL-34SA

121.7(20.5)

3.57

(3)

17 +1-0.5

4-φ5.5

121.

7

0

147

0

2227.5322

137

152

3.6

13.5

19.2410.74 88.537.75

6-M6 NUTS(SCREWING DEPTH)

15.14

MOUNTING HOLES

(6.5

)(1

5.64

)

41.22 3922

(8)(12)

49.72

105.9±0.311.36±0.3

117.66±0.3117.21±0.3

105.85±0.3

96.7±0.3

81.46±0.377.65±0.3

58.6±0.3

110±

0.5

9.15±

0.312

.96±

0.3

43.36±0.339.55±0.3

24.31±0.320.5±0.3

94.5±0.3106.3±0.3

24.31±0.320.05±0.3

11.8±0.3

11.35±0.3

110±0.5

22

CM200RXL-24SCM300RXL-24S1CM150RXL-34SA

13

(7.7

5) 07.

24±

0.2

11.0

6±0.

2

110±0.5

110±

0.5

3.6 11

.539

13.5

14.1

422

126

8

6.5

22.4

8±0.

226

.3±

0.2

37.7

2±0.

241

.54±

0.2

52.9

6±0.

256

.78±

0.2

68.2±

0.2

72.0

2±0.

2

83.4

4±0.

287

.26±

0.2

106.

3±0.

2 3.5

6-M522.8622.8622.8620.71

(15.64)

13.585.5818.06

15.1

121.

711

7.2

NUTS

121.7

94.55.864-φ5.5 MOUNTING HOLES

7.75

(94.

5)

(20.

5)LABEL

21CM150DX-34SACM200DX-34SACM300DX-34SA

152137

121.7(15.14)

94.5

(6.5)(15.64) 0

8612

142239

110±0.5

7.24±

0.3

11.0

5±0.

3

60.5

8±0.

364

.39±

0.3

50±

0.5

87.2

5±0.

3

37.72±0.333.91±0.3

57.9

5±0.

30.

45±

0.3

14

7(S

CR

EWIN

G D

EPTH

)

(13.5)7.75

4-φ5.5

4-M6 NUTS

MOUNTING HOLES(94.

5) 3.75

57.5

62

3.5

17+1

-0.5

19

25

1048962

19.05

6257.5

13.1 13

.1

16.4

17

(5.6

)

503.

753922

1417

105

4.2

46.573.71

7.754-φ5.5 MOUNTING HOLES

4-M5 NUT

17.66 3.813.8113.5

LABEL

CM150EXS-24SCM200EXS-24SCM300EXS-24SCM200EXS-34SA

26CM100TX-24S1CM150TX-24S1

121.7

0

(57.5)

4-R6.5

62

(41.

9)

03.75

0

(102.3)94.57.75

110±0.5

106.31±0.211.8±0.2

43.

5 0.8

16.77±

0.3

42.09±0.338.28±0.334.46±0.3

23.04±0.319.22±0.315.41±0.3

7.24±

0.311

.06±

0.3

22.48±

0.3

37.72±

0.341

.54±

0.3

52.96±

0.356

.78±

0.3

72.02±

0.3

83.44±

0.387

.26±

0.3

15.41±0.319.22±0.323.04±0.3

34.46±0.338.27±0.342.09±0.3


(94.5)

57.5

0

68.2±

0.3

26.3±

0.3

50±

0.5

20.58±

0.324

.39±

0.3

39.63±

0.343

.44±

0.347

.25±

0.3

62.49±

0.366

.3±0.3

70.11±

0.3

85.35±

0.389

.16±

0.3

LABEL

20CM75RX-34SA

136.9121.7110±0.594.57.75（15.64）

7.24±

0.2

110.

6±0.

2

22.4

8±0.

226

.3±

0.2

37.7

2±0.

241

.54±

0.2

52.9

6±0.

256

.78±

0.2

68.2±

0.2

72.2±

0.2

83.4

4±0.

287

.26±

0.2

106.

3±0.

2

（7.

75）

（94

.5）0

6.5

13.5

13.6

414

223911

.577

.1

12

8

50±

0.5

3.75

57.5

62

20.71 22.86 22.86 22.86 6-M5 NUTS

MOUNTING HOLES4-Ø5.5

B

LABEL

CM400ST-24S1

70 0.5±

36 0.3±

A

32 0.3±

20.5 0.3±

1.1 0.3±

64.6

0.3

±

450.

3±

410.

3±

320.

3±

230.

3±

190.

3±

150.

3±

60.

3±

103

0.5

±

13.6

0.3

±

82

26 264-φ5.5

4-M6 NUTS

6.5

43

519.53

0

330

.54611

5

76

12

0

(15.

5)

(MOUNTING HOLES)9

CM100,150,200DY-13TCM100,150DY-24T

80±0.25

30-0

.5+1

(7)

94

23 23 17

184

4

17

13

1334

MOUNTING HOLES

TAB #110 t=0.5

3-M5 NUTS

14 14 1499

12

7.5

(28.

8)

12

LABEL

12

2- 6.5

CM300,400DY-13TCM200,300DY-24T

80±0.25(7)

94

44

181348

2323

3-M5 NUTS

TAB #110 t=0.5

TAB #110 t=0.5

LABEL

16 16 16

12 12 12

7.5

(28.

8)

77

17


30-0

.5+1

CM600DY-13TCM450,600DY-24TCM450,600C1Y-24T

93±0.25

48±0

.25

(7.5)108

66

17.5

15

(7)

62

3-M5 NUTS

TAB (DIN46244-A2.8-0.5)

LABEL

22 22 226614

4.9

(30.

9)

18.5 28 28 21


30-0

.5+1

CM1000DX-24T

0.7±0.3

3.5±0.2 39.5

105.7±0.3

9.1±

0.2

7.85±0.3

23.09±0.326.9±0.3

83.8

±0.2

19±0.3

20.5

±1

19±0.3

102±

0.2 38.33±0.3

34.52±0.3

23.09±0.3

11.66±0.37.85±0.3

0

1010

137

114

105±0.298±0.2

110

12181218

12

A

19±0.3 6-M6 NUTSMOUNTING HOLES

(31)

(7)

(4.2) (0.8)

3.5

17137

16.5

0

(12.

3)

(4.6

)

R7(R0.5)

4- 5.5±0.2

CM150,200RX-13TCM100,150RX-24T

110±0.294.5±0.2

1106

±0.3

22.4

9±0.

326

.3±0

.3

37.7

3±0.

341

.54±

0.3

52.9

7±0.

356

.78±

0.3

72.0

2±0.

3

87.2

6±0.

3

50±0

.2

38.28±0.334.47±0.3

19.23±0.315.42±0.3

3.75A

6-M6 NUTS22.8622.8622.8620.713.5

RESIN SURFACE

13.6

414

126

223911

.5

77.1 57

.5±0

.2

6±0.

5

17-0

.5+1

62

83.4

5 ±0.

3

68.2

1±0.

3

7.25

±0.3

7.75

122


CM300,450,600DX-13TCM225,300,450,600DX-24T

152137±0.3

122110±0.2

50±0

.2

80.0

1±0.3

57.1

5±0.3

53.3

4±0.3

30.4

8±0.3

26.6

7±0.3

3.81

±0.3

7.24

±0.34.2±0

.3

6±0.5

22±0

.3

58.4

±0.3

0.45

±0.3

3914

8612

0

0

(3.7

5)7

14.4

57.5

±0.2

17+1

-0

.5

62

4-φ5.5±0.2

15±0.3

(15.5)(6.5)

4-φ7.5±0.3

MOUNTING HOLES

RESIN SURFACE

(SCRE

WING

DEPT

H)

94.5±0.2

4-M6 NUTS

(15)

(13.5)(7.75)

CM100,150,200TX-13TCM100,150,200TX-24TCM100,150TX-34T

57.5

±0.2

50±0

.23.

75±0

.262

42.54±0.3

58.4±0.3

7.75±0.2

7.25

±0.3

0 9.52

±0.3

13.3

3±0.3

17.1

4±0.3

32.3

8±0.3

36.1

9±0.3

40±0

.3

55.2

4±0.3

59.0

5±0.3

62.8

6±0.3

78.1

±0.3

81.9

1±0.3

19.0

5±0.3

99.0

6±0.30

15.2

4±0.3

3.81

±0.3

19.0

5±0.3

45.7

2±0.3

49.5

3±0.3

30.4

8±0.3

34.2

9±0.3

60.9

6±0.3

64.7

7±0.3

76.2

±0.3

80.0

1±0.3

38.73±0.3

34.92±0.3

23.49±0.3

19.68±0.3

15.87±0.3

42.54±0.3

38.73±0.3

34.92±0.3

23.49±0.3

19.68±0.3

15.87±0.3

0.45±0.3

00

(37)

0.8

15

6±0.5 3.5

4

4-φ5.5±0.2

4-φ7.5±0.3MOUNTING HOLES

RESIN SURFACE

94.5±0.2110±0.2122

(99.5)

CM500C2Y-24SCM1400HA-24SCM1000HA-34SRM1400HA-24S

130

118±0.5

55±0

.5

676

61056.576 A 6.5 (MOUNTING HOLES)

15.5

1713

10.5

8.5

(21.

2)

(1)1430 30 4-M6 NUTS181 22

120

LABEL

381426

66

22

208

426.

516

.53.

3

29.5

1.5

(19.

6)

4- 5.5±0.2


2423


■ Outline Drawing of IGBT Modules Unit :mm

HVIGBT Modules

37 38

40 41 42

43 44

39

CM1000DXP-24T

0.7±0.2

3.5±0.2 39.5

105.7±0.2

9.1±

0.2

7.85±0.2

23.09±0.226.9±0.2

83.8

±0.2

19±0.3

20.5

±1

19±0.3

102±

0.2

38.33±0.234.52±0.2

23.09±0.2

11.66±0.27.85±0.2

0

1010

137

114

105±0.298±0.2

110

12181218

12

A

19±0.3 6-M6 NUTS(31)

(7)

(4.2) 0.62

3.5

17

13716.5

0

(12.

3)

(4.6

)

R7(R0.5)


CM150,200RXP-13TCM100,150RXP-24T

110±0.2

94.5±0.2

11.0

6±0.

2

22.4

9±0.

226

.3±0

.2

37.7

3±0.

241

.54±

0.2

52.9

7±0.

256

.78±

0.2

68.2

1±0.

272

.02±

0.2

87.2

6±0.

2

38.28±0.238.28±0.234.47±0.2

19.23±0.215.42±0.2

106.3±0.2

17-0

.5+1

50±0

.2

57.5

±0.2

62

3.75

0

A

6-M6 NUTS22.8622.8622.8620.7

RESIN SURFACE

13.5

13.6

414

223911

.511

.5

77.1

126

83.4

5±0.

2

7.25

±0.2

0.45

±0.2

0

7.75

137122


CM35,50MXUA-24T/24T1

φ6.5

0

0 0 11

0

A

B

B

23.64±0

.3

35.07±0

.3

46.5±

0.350

.31±0

.354

.12±0

.3

73.17±0

.376

.98±0

.3

12.21±0

.36.9±0

.312

.21±0

.3

23.64±0

.3

35.07±0

.3

46.5±

0.350

.31±0

.3

61.74±0

.365

.55±0

.3

86.1±

0.3

20.95±0.3

20.95±0.3

11.43±0.3

11.43±0.3

7.62±0.3

7.62±0.3

93±0

.3

11.43±0.37.62±0.3

11.43±0.37.62±0.3

93±0.2

32±

0.3

6.5±

0.3

6±0.

5

107.5

45

R5.5

4-φ5.5MOUNTING HOLESφ7.5±0.3

RESIN SURFACE

CM50,75,100MXUB-13T/13T1CM75MXUB-24T/24T1

φ6.1

0

0 0 11

0

A

B

B23

.64±0

.319

.83±0

.3

35.07±0

.338

.88±0

.3

46.5±

0.350

.31±0

.354

.12±0

.3

73.17±0

.376

.98±0

.3

12.21±0

.36.9±0

.312

.21±0

.316

.02±0

.323

.64±0

.327

.45±0

.335

.07±0

.338

.88±0

.346

.5±0.3

50.31±0

.354

.12±0

.361

.74±0

.365

.55±0

.369

.36±0

.3

86.1±

0.3

20.95±0.3

20.95±0.3

11.43±0.315.24±0.3

11.43±0.3

7.62±0.3

7.62±0.3

93±0

.3

11.43±0.37.62±0.3

11.43±0.37.62±0.3

93±0.232±

0.3

6.5±

0.3

6±0.

3

107.545

R5.54-φ5.5

MOUNTING HOLESφ7.5±0.3

RESIN SURFACE

CM300,450,600DXP-13TCM225,300,450,600DXP-24T

4-φ5.5±0.2

50±0

.2

22±0

.314

39

8612

714

.43.

75±0

.2

57.5

±0.2

62

(7.2

4)

(58.

4)(0

.45)

0

(3.8

1)

(26.

67)

(30.

48)

(53.

34)

(57.

15)

(80.

01)

0 4-φ7.5±0.3

MOUNTING HOLES

RESIN SURFACE

(SCRE

WING

DEPT

H)

152137±0.3

122110±0.2

94.5±0.2

(15)

(15.5)

(6.5)

(13.5)7.75±0.2

4-M6 NUTS

6±0.5

17+1

-0

.5

CM100,150,200TXP-13TCM100,150,200TXP-24TCM100,150TXP-34T

4-φ5.5±0.2

4-φ7.5±0.3

(37)

(9.5

3)(1

3.34

)(1

7.15

)

(32.

39)

(36.

2)(4

0.01

)

(55.

25)

(59.

06)

(62.

87)

(78.

11)

(81.

92)

57.5

±0.2

3.75

±0.2

50±0

.2

62

(19.

05)

(42.54)

0.78

4.3

5

6±0.5

(38.73)(34.92)(23.49)(19.68)(15.87)

(42.54)(38.73)(34.92)(23.49)(19.68)(15.87)(0.45)

(58.4)

(7.2

5) 00

(3.8

1)

(15.

24)

(19.

05)

(30.

48)

(34.

29)

(45.

72)

(49.

53)

(60.

96)

(64.

77)

(76.

2)(8

0.01

)

(99.

06)

MOUNTING HOLES

RESIN SURFACE

94.5±0.2110±0.2

7.75±0.2

122

0

CM75,100MXUC-24T/24T1

3.75

±0.2

57.5

±0.2

57.9

5±0.3

0.45

±0.3

62

38.28±0.3

94.5±0.2110±0.2122

7.75±0.2

34.47±0.3

23.03±0.3

11.8

±0.3

7.24

±0.3

11.0

6±0.3

16.7

7±0.3

22.4

8±0.3

26.3

±0.3

37.7

2±0.3

41.5

4±0.3

52.9

6±0.3

56.7

8±0.3

60.5

8±0.3

72.0

2±0.3

75.8

2±0.3

79.6

4±0.3

106.

31±0

.3

19.23±0.3

15.42±0.3

38.28±0.342.09±0.3

34.47±0.3

23.04±0.3

19.23±0.3

15.42±0.3

00

05.

34±0

.3

9.15

±0.3

20.5

8±0.3

24.3

9±0.3

35.8

2±0.3

39.6

3±0.3

51.0

6±0.3

54.8

7±0.3

58.6

8±0.3

81.5

4±0.3

85.3

5±0.3

89.1

6±0.3

0

50±0

.2(3

7)

6±0.5

4-φ5.5±0.2

4-φ7.5±0.3

MOUNTING HOLES

RESIN SURFACE

CM100/150MXUD-13T/T1CM150MXUD-24T/T1

0.45

±0.3

57.9

5±0.3

62

94.5±0.2110±0.2122

7.75±0.2

38.28±0.342.09±0.3

34.47±0.3

23.04±0.3

19.23±0.3

15.42±0.3

0 0

11.8

±0.3

7.24

±0.3

11.0

6±0.3

14.8

6±0.3

22.4

8±0.3

26.3

±0.3

30.1

±0.3

37.7

2±0.3

41.5

4±0.3

45.3

4±0.3

52.9

6±0.3

56.7

8±0.3

60.5

8±0.3

64.4

±0.3

72.0

2±0.3

75.8

2±0.3

79.6

4±0.3

83.4

4±0.3

106.

31±0

.305.

34±0

.3

9.15

±0.3

20.5

8±0.3

24.3

9±0.3

28.2

±0.3

35.8

2±0.3

39.6

3±0.3

43.4

4±0.3

51.0

6±0.3

54.8

7±0.3

58.6

8±0.3

81.5

4±0.3

85.3

5±0.3

89.1

6±0.3

0

3.75

±0.2

57.5

±0.2

38.28±0.3

34.47±0.3

23.03±0.326.84±0.3

19.23±0.3

15.42±0.3

50±0

.2(3

7)

6±0.5

4-φ5.5±0.2

4-φ7.5±0.3

MOUNTING HOLES

RESIN SURFACE

<Main Features>・Power loss reduced by incorporating 7th-generation IGBT and RFC*1 diode・Industry-leading power*2 for increased inverter capacity・External size reduced 33% while maintaining the same voltage resistance

and rated current as conventional products,*3 contributing to inverter downsizing

・Optimal package internal structure realizes improved heat dissipation, humidity resistance and flame retardance, increasing product life

<Main Features>・ Power loss reduced by incorporating 7th-generation IGBT and RFC *1 diode・ Industry's highest 3.3kV/600A Si module power density of 8.57A/cm2 *4

contributes to increased power output and efficiency・Terminal layout optimized for easy paralleling and flexible inverter

configurations and capacities・New package structure offers extra reliability

Existing compatible package: Standard type Contributes to smaller, higher-capacity inverter systems by expanding lineup

New common frame package: LV100/HV100 type Class-leading current density contributes to increased power output in inverter systems

New Products

1600

2400

2000

1200

400

100％

95％

90％

85％

80％

75％

70％

800

00 1 2 3 4 5 6

VCEsat[V]

Ic[A

]

CM1200HC-66H(Conventional Product)

CM1800HC-66X(New Product)

CM1200HC-66H(Conventional Product)CM1800HC-66X(New Product)

■ Characteristics graph

■ Positioning from conventional series

■ Package features (LV100 type)

■ Various current ratings for optimal system design

■ Output current characteristicsConditions: Tj=125℃, Vcc=1800V, P.F=0.85, fo=50Hz, Tf=80℃

　

2400A/3600A

1200A/1800A

900A/1350A/1500A

600A/900A/1000A

　

1600A/2400A

1200A

900A/1000A

600A

1.7kV

3.3kV

4.5kV

6.5kV

LV100 Type

1000A/1200A

450A/600A

std. Type HV100 Type

450A/600A

225A/300A

1.7kV

3.3kV

6.5kV

*1　RFC : Relaxed field of cathode*2　3.3kV - 6.5kV (as of Apr. 5, 2018 based on Mitsubishi Electric research)*3　Comparison of X Series CM1200HC-66X and H Series CM1200HC-66H

*4　As of Apr. 5, 2018, based on Mitsubishi Electric research

X Series HVIGBT Modules

H Series(CM1200HC-66H)

X Series(CM1800HC-66X)


X Series B Type(CM1200HCB-66X)

1.5 times rated current

Compatible external shape

2/3 size

For smaller inverterFor smaller inverter For quicker designFor quicker design

For larger output powerFor larger output power

Inverter capacities

500A 1000A 1500A 2000A 2500A

450A 600A

900A 1200A

1350A 1800A

1800A 2400A

450A/3.3kV product parallel connection600A/3.3kV product parallel connection

Two 450A and 600A products added to the LV100 3.3kV product lineup combined with other parallel products in answer to the need of inverters with various capacities

1 parallel

2 parallel

3 parallel

4 parallel

Terminal temperature rise suppressed thanks to three AC

main terminalsTerminal height ensured to enable use as the gate

driver substrate for double-sided mounting

Terminal layout optimized for easy paralleling

Low internal inductance

ON state voltage reduced approx.

40%

Thermalresistance improved approx.

18%

Saturation voltage between collectorand emitter (H Series vs. X Series)

Tｈermal resistance comparison(H Series vs. X Series)

Switching carrier frequency［Hz］0 400

Inve

rter

out

put

curr

ent［

Arm

s］

5001000

1500

2000

2500

200 600 800 1000 1200

CM1800HC-66X(New)CM1200HC-66H(Conventional)


2423


■ Outline Drawing of IGBT Modules Unit :mm

HVIGBT Modules

37 38

40 41 42

43 44

39

CM1000DXP-24T

0.7±0.2

3.5±0.2 39.5

105.7±0.2

9.1±

0.2

7.85±0.2

23.09±0.226.9±0.2

83.8

±0.2

19±0.3

20.5

±1

19±0.3

102±

0.2

38.33±0.234.52±0.2

23.09±0.2

11.66±0.27.85±0.2

0

1010

137

114

105±0.298±0.2

110

12181218

12

A

19±0.3 6-M6 NUTS(31)

(7)

(4.2) 0.62

3.5

17

13716.5

0

(12.

3)

(4.6

)

R7(R0.5)


CM150,200RXP-13TCM100,150RXP-24T

110±0.2

94.5±0.2

11.0

6±0.

2

22.4

9±0.

226

.3±0

.2

37.7

3±0.

241

.54±

0.2

52.9

7±0.

256

.78±

0.2

68.2

1±0.

272

.02±

0.2

87.2

6±0.

2

38.28±0.238.28±0.234.47±0.2

19.23±0.215.42±0.2

106.3±0.2

17-0

.5+1

50±0

.2

57.5

±0.2

62

3.75

0

A

6-M6 NUTS22.8622.8622.8620.7

RESIN SURFACE

13.5

13.6

414

223911

.511

.5

77.1

126

83.4

5±0.

2

7.25

±0.2

0.45

±0.2

0

7.75

137122


CM35,50MXUA-24T/24T1

φ6.5

0

0 0 11

0

A

B

B

23.64±0

.3

35.07±0

.3

46.5±

0.350

.31±0

.354

.12±0

.3

73.17±0

.376

.98±0

.3

12.21±0

.36.9±0

.312

.21±0

.3

23.64±0

.3

35.07±0

.3

46.5±

0.350

.31±0

.3

61.74±0

.365

.55±0

.3

86.1±

0.3

20.95±0.3

20.95±0.3

11.43±0.3

11.43±0.3

7.62±0.3

7.62±0.3

93±0

.3

11.43±0.37.62±0.3

11.43±0.37.62±0.3

93±0.2

32±

0.3

6.5±

0.3

6±0.

5

107.5

45

R5.5


RESIN SURFACE

CM50,75,100MXUB-13T/13T1CM75MXUB-24T/24T1

φ6.1

0

0 0 11

0

A

B

B

23.64±0

.319

.83±0

.3

35.07±0

.338

.88±0

.3

46.5±

0.350

.31±0

.354

.12±0

.3

73.17±0

.376

.98±0

.3

12.21±0

.36.9±0

.312

.21±0

.316

.02±0

.323

.64±0

.327

.45±0

.335

.07±0

.338

.88±0

.346

.5±0.3

50.31±0

.354

.12±0

.361

.74±0

.365

.55±0

.369

.36±0

.3

86.1±

0.3

20.95±0.3

20.95±0.3

11.43±0.315.24±0.3

11.43±0.3

7.62±0.3

7.62±0.3

93±0

.3

11.43±0.37.62±0.3

11.43±0.37.62±0.3

93±0.2

32±

0.3

6.5±

0.3

6±0.

3

107.5

45

R5.5


RESIN SURFACE

CM300,450,600DXP-13TCM225,300,450,600DXP-24T

4-φ5.5±0.2

50±0

.2

22±0

.314

39

8612

714

.43.

75±0

.2

57.5

±0.2

62

(7.2

4)

(58.

4)(0

.45)

0

(3.8

1)

(26.

67)

(30.

48)

(53.

34)

(57.

15)

(80.

01)

0 4-φ7.5±0.3

MOUNTING HOLES

RESIN SURFACE

(SCRE

WING

DEPT

H)

152137±0.3

122110±0.2

94.5±0.2

(15)

(15.5)

(6.5)

(13.5)7.75±0.2

4-M6 NUTS

6±0.5

17+1

-0

.5

CM100,150,200TXP-13TCM100,150,200TXP-24TCM100,150TXP-34T

4-φ5.5±0.2

4-φ7.5±0.3

(37)

(9.5

3)(1

3.34

)(1

7.15

)

(32.

39)

(36.

2)(4

0.01

)

(55.

25)

(59.

06)

(62.

87)

(78.

11)

(81.

92)

57.5

±0.2

3.75

±0.2

50±0

.2

62

(19.

05)

(42.54)

0.78

4.3

5

6±0.5

(38.73)(34.92)(23.49)(19.68)(15.87)

(42.54)(38.73)(34.92)(23.49)(19.68)(15.87)(0.45)

(58.4)

(7.2

5) 00

(3.8

1)

(15.

24)

(19.

05)

(30.

48)

(34.

29)

(45.

72)

(49.

53)

(60.

96)

(64.

77)

(76.

2)(8

0.01

)

(99.

06)

MOUNTING HOLES

RESIN SURFACE

94.5±0.2110±0.2

7.75±0.2

122

0

CM75,100MXUC-24T/24T1

3.75

±0.2

57.5

±0.2

57.9

5±0.3

0.45

±0.3

62

38.28±0.3

94.5±0.2110±0.2122

7.75±0.2

34.47±0.3

23.03±0.3

11.8

±0.3

7.24

±0.3

11.0

6±0.3

16.7

7±0.3

22.4

8±0.3

26.3

±0.3

37.7

2±0.3

41.5

4±0.3

52.9

6±0.3

56.7

8±0.3

60.5

8±0.3

72.0

2±0.3

75.8

2±0.3

79.6

4±0.3

106.

31±0

.3

19.23±0.3

15.42±0.3

38.28±0.342.09±0.3

34.47±0.3

23.04±0.3

19.23±0.3

15.42±0.3

00

05.

34±0

.3

9.15

±0.3

20.5

8±0.3

24.3

9±0.3

35.8

2±0.3

39.6

3±0.3

51.0

6±0.3

54.8

7±0.3

58.6

8±0.3

81.5

4±0.3

85.3

5±0.3

89.1

6±0.3

0

50±0

.2(3

7)

6±0.5

4-φ5.5±0.2

4-φ7.5±0.3

MOUNTING HOLES

RESIN SURFACE

CM100/150MXUD-13T/T1CM150MXUD-24T/T1

0.45

±0.3

57.9

5±0.3

62

94.5±0.2110±0.2122

7.75±0.2

38.28±0.342.09±0.3

34.47±0.3

23.04±0.3

19.23±0.3

15.42±0.3

0 0

11.8

±0.3

7.24

±0.3

11.0

6±0.3

14.8

6±0.3

22.4

8±0.3

26.3

±0.3

30.1

±0.3

37.7

2±0.3

41.5

4±0.3

45.3

4±0.3

52.9

6±0.3

56.7

8±0.3

60.5

8±0.3

64.4

±0.3

72.0

2±0.3

75.8

2±0.3

79.6

4±0.3

83.4

4±0.3

106.

31±0

.305.

34±0

.3

9.15

±0.3

20.5

8±0.3

24.3

9±0.3

28.2

±0.3

35.8

2±0.3

39.6

3±0.3

43.4

4±0.3

51.0

6±0.3

54.8

7±0.3

58.6

8±0.3

81.5

4±0.3

85.3

5±0.3

89.1

6±0.3

0

3.75

±0.2

57.5

±0.2

38.28±0.3

34.47±0.3

23.03±0.326.84±0.3

19.23±0.3

15.42±0.3

50±0

.2(3

7)

6±0.5

4-φ5.5±0.2

4-φ7.5±0.3

MOUNTING HOLES

RESIN SURFACE

<Main Features>・Power loss reduced by incorporating 7th-generation IGBT and RFC*1 diode・Industry-leading power*2 for increased inverter capacity・External size reduced 33% while maintaining the same voltage resistance

and rated current as conventional products,*3 contributing to inverter downsizing

・Optimal package internal structure realizes improved heat dissipation, humidity resistance and flame retardance, increasing product life

<Main Features>・ Power loss reduced by incorporating 7th-generation IGBT and RFC *1 diode・ Industry's highest 3.3kV/600A Si module power density of 8.57A/cm2 *4

contributes to increased power output and efficiency・Terminal layout optimized for easy paralleling and flexible inverter

configurations and capacities・New package structure offers extra reliability

Existing compatible package: Standard type Contributes to smaller, higher-capacity inverter systems by expanding lineup

New common frame package: LV100/HV100 type Class-leading current density contributes to increased power output in inverter systems

New Products

1600

2400

2000

1200

400

100％

95％

90％

85％

80％

75％

70％

800

00 1 2 3 4 5 6

VCEsat[V]

Ic[A

]

CM1200HC-66H(Conventional Product)

CM1800HC-66X(New Product)

CM1200HC-66H(Conventional Product)CM1800HC-66X(New Product)

■ Characteristics graph

■ Positioning from conventional series

■ Package features (LV100 type)

■ Various current ratings for optimal system design

■ Output current characteristicsConditions: Tj=125℃, Vcc=1800V, P.F=0.85, fo=50Hz, Tf=80℃

　

2400A/3600A

1200A/1800A

900A/1350A/1500A

600A/900A/1000A

　

1600A/2400A

1200A

900A/1000A

600A

1.7kV

3.3kV

4.5kV

6.5kV

LV100 Type

1000A/1200A

450A/600A

std. Type HV100 Type

450A/600A

225A/300A

1.7kV

3.3kV

6.5kV

*1　RFC : Relaxed field of cathode*2　3.3kV - 6.5kV (as of Apr. 5, 2018 based on Mitsubishi Electric research)*3　Comparison of X Series CM1200HC-66X and H Series CM1200HC-66H

*4　As of Apr. 5, 2018, based on Mitsubishi Electric research

X Series HVIGBT Modules

H Series(CM1200HC-66H)



X Series B Type(CM1200HCB-66X)

1.5 times rated current

Compatible external shape

2/3 size

For smaller inverterFor smaller inverter For quicker designFor quicker design

For larger output powerFor larger output power

Inverter capacities

500A 1000A 1500A 2000A 2500A

450A 600A

900A 1200A

1350A 1800A

1800A 2400A

450A/3.3kV product parallel connection600A/3.3kV product parallel connection

Two 450A and 600A products added to the LV100 3.3kV product lineup combined with other parallel products in answer to the need of inverters with various capacities

1 parallel

2 parallel

3 parallel

4 parallel

Terminal temperature rise suppressed thanks to three AC

main terminalsTerminal height ensured to enable use as the gate

driver substrate for double-sided mounting

Terminal layout optimized for easy paralleling

Low internal inductance

ON state voltage reduced approx.

40%

Thermalresistance improved approx.

18%

Saturation voltage between collectorand emitter (H Series vs. X Series)

Tｈermal resistance comparison(H Series vs. X Series)

Switching carrier frequency［Hz］0 400

Inve

rter

out

put

curr

ent［

Arm

s］

5001000

1500

2000

2500

200 600 800 1000 1200

CM1800HC-66X(New)CM1200HC-66H(Conventional)


2625

■ Outline Drawing of HVIGBT Modules

■ Series Matrix of HVDIODE Modules (No.: Number of outline drawing, see page 28)

Line-up of HVIGBT ModulesCo

nnec

tion

Conn

ectio

n

[Type] B:Cu base plate C:AlSiC base plate / 6 kViso D:AlSiC base plate / 10kViso

CM: IGBT, RM: DIODE, PM: HVIPM

Rating current class

Connection type

Outline drawing and package type

Voltage class

Series name

Type Name Definition of IGBT Modules

■ Series Matrix of HVIGBT/HVIPM (No.: Number of outline drawing, see page 26 and 28)

★★: Under Development


[Type]*There are possibility to change the type of auxiliary terminals.

A: Al base plate / 6 kViso B:Cu base plate C:AlSiC base plate / 6 kViso D:AlSiC base plate / 10kViso　E:Al base plate / 10kViso

H E4 D1E2/E6

200225300

750

800

900

1000

1200

1500

1350

1600

1800

2400

400

450

600 CM600DY-34HCM600E2Y-34H

HH

HHH

H

RR

HHXX

X

RRR

XX

X

X

HXXR

HXXHHH

XX

XX

XX

HHH

RR

RR

XX

HHXXX

H

H

NHH

X

HNNNSX

HXHNNHXNNX

CM1200HC-34HCM1200HCB-34NCM1200E4C-34NCM1200DC-34NCM1200DC-34SCM1200DA-34X★★

CM1800HC-34HCM1800HC-34NCM1800HCB-34N

CM2400HC-34HCM2400HC-34X★★

CM2400HC-34NCM2400HCB-34NCM2400HCB-34X★★

CM1600HC-34HCM1600HC-34X★★

BB

CM400HG-66HCM400DY-66H

CM400HG-130HCM400E2G-130HCM400E4G-130H

CM800HC-66HCM800E4C-66HCM800E6C-66H

CM1000HC-66RCM1000E4C-66R

CM1500HC-66RCM1500HG-66R

CC

CM400DY-50H

CM200HG-130HCM225DE-130XA★★CM300DE-130XA★★

CM600HG-130HCM600HG-130X★★CM600HGB-130X★★

CM750HG-130R

HE2E4

H

HHHH

120909

07

11181911

CM600HG-90H

CM1200HC-90RCM1200HC-90RACM1200HG-90R

CCCCCA

CCC

CCCCC

CC

D1E2

HHE4D1D1D2

HHH

HHHHH

HH

0101

CM800DZB-34NCM800DZ-34HCM800HA-34H

CM1000DA-34X★★

CCB

D1D1H

0101-

020305040420

AD2 20

060506

0616050617

2400 CM3600HC-34X★★ CH 17

0216

BD1 15

CM800HB-50H BH 03

CM1200HC-50H CH 06

HD1

HE4

HH

CCC

HE4E2

0715

0810

1011

030606

H

HHH

12

101011

CM800HC-90R

CM1000HG-90X★★

CM800HG-90R H 13H 08C

D

D

CM900HC-90HCM900HG-90HCM900HG-90X★★

CM900HGB-90X★★

HHHH

09131819

CDDD

H 18D

CCD

CM1350HC-90X★★

CM1350HG-90X★★

HH

1719

CD

CM1500HC-90XA★★

CM1500HG-90X★★

HH

1719

CD

DB

CM450DA-66X★★

CM450DE-66X★★

D2D2

2021

AE

CM600DA-66X★★

CM600DE-66X★★

D2D2

2021

AE

CD

CM1800HC-66X★★

CM1800HG-66X★★HH

1719

CD

DDD

DD1 21ED1 21E

DDDD

CM900HG-130X★★ H 19D

CM1200HG-66HCM1200HC-66HCM1200HC-66X★★

CM1200E4C-66X★★

CM1200HCB-66X★★

PM1200HCE330-1

HHHE4HH

090616161714

DCCCBC

IC(A)

Vces1700V 2500V 3300V 4500V 6500V

Model Number Model Number Model Number Model Number Model Number

H 19DCM1000HG-130XA★★

Ser ies Connection No.Type Ser ies Connection No.Type Ser ies Connection Ser iesNo.Type Connection No.Type Ser ies Connection No.Type

H Ｄ

RM1200DB-34S

RM1800HE-34S

B

C

D

H

22

23

200250300

400

450600

900

1000

1200

15001800

RM400DG-66S

RM400DY-66S

RM300DG-130X★★

RM200DG-130S

RM250DG-130F

RM600DG-130S

DD

D

DD

D

2424

24RM600HE-90S

RM1200DG-90F

RM900HC-90SRM900DB-90S

RM400DG-90F

D

C

C

B

D

D

H

H

D

D

24

23

24

RM300DG-90S DD 24

RM450DG-90X★★ DD 24

27

27

RM600DY-66S

RM1000DG-130XA★★ D

RM1500DC-66F

RM1200DG-66SRM1200HE-66SRM1200DB-66SRM1200DG-66X★★

D

B

B

C

DCBD

D

D

D

D

D

DHDD

24

25

25

800 RM800DG-90F DD 24

DD 24

24

26

24232724

RM1000DC-66F CD 26

1700V 3300V 4500V 6500V

IF(A)

VPRM

No.Connection Type No.Connection Type No.Connection Type No.Connection Type

■ Evolution of HVIGBT 　 Module Series

CM 1800 H C -66 X

1700V～　6500V

3300V～　6500V

1700V～　6500V

1700V 1700VH Series N Series S Series

X SeriesR Series

09 CM1200HG-66HCM900HG-90HCM400E2G/E4G-130HCM600HG-130H

07 08

02

04

03

05

01

06

CM1000HC-66RCM800HC-90R

CM400HG-66HCM200HG-130H

CM1200,1600HC-34HCM600DY-34HCM600E2Y-34HCM800DZ-34H CM800DZB-34N

CM1200HCB-34NCM800HB-50H,-66HCM800HC-66H

CM1800,2400HCB-34NCM1800,2400HC-34HCM1200HB/HC-50H,-66HCM800E4C/E6C-66HCM900HB/HC-90H

CM1200E4C-34N CM1800,2400HC-34N

CM1200DB/DC-34NCM1200DC-34S

6

5

4

3

2

1

61.2±0.5 61.2±0.512±0.3

6-M8 NUTS

17±

0.19±

0.1

124±

0.25

44±

0.3

190±0.5

57±0.25 57±0.2557±0.25

140±

0.5

8-φ 7MOUNTING HOLES

3-M4 NUTS 14±0.3 59.2±0.5

5±0.

15

SCREWING DEPTHMIN. 7.7


48+1

.0 0

130

3020

140

4-M8 NUTS

6-φ7 MOUNTING HOLES

11457±0.25

55.253

11.85

5 38

57±0.25

124±

0.25

5-M4 NUTS

57

1640 44

18

LABEL

130

140

4-M8 NUTS

6-φ7MOUNTING HOLES

11457±0.25

61.518

5 38

57±0.25

124±

0.25

3020

16.5 2.518.5

3-M4 NUTS

LABEL

130

40 140

4-M8 NUTS

6-φ7MOUNTING HOLES

11457±0.25 57±0.25

124±

0.25

3-M4 NUTS10.65

48.861.5

10.35

18

5 38

20

LABEL

1906-M8 NUTS

8-φ7MOUNTING HOLES

17157±0.25 57±0.25 57±0.25

61.5 61.513

5 3840

20

140

124 ±

0.25

3-M4 NUTS 41.2579.420.25

LABEL11.85±0.2

20±

0.1

4 2

3 1

130±0.557±0.25 57±0.25

140±

0.5

124±

0.25

30±

0.2

55.2±0.3


4-M8 NUTS

6-M4 NUTS

53±0.2 57±0.240±0.2 44±0.2

5±0.

2



38+1 -0

4 2

3 1

20±

0.1

140±

0.5

124±

0.25

18±0.2

4-M8 NUTS


3-M4 NUTS

130±0.557±0.25 57±0.25

40±

0.2

61.5±0.3

10.35±0.210.65±0.2

48.8±0.2

5±0.

2



38+1 -0

10.65±0.3 10.35±0.3

48.8±0.3

18±0.3

61.5±0.3

28±

0.5

5±0.

2

9±0.

2

40±

0.3

57±0.25 57±0.25

130±0.5

124±

0.25

140±

0.5




4-M8 NUTS

3-M4 NUTS

38+1 0

20+0

.1-0

.2

1

2

3

4

17±

0.1

140±

0.5

124±

0.25

44±

0.3

73±0.557±0.25

2

1

16.2±0.3

2-M8 NUTS

4-φ 7 MOUNTING HOLES

28.7

36

521.6±0.3

5.8

5 ±0.

15

36.2


SCREWING DEPTHMIN. 4

48+1

.0 0

18±0.216±0.2

12.9±0.3

Unit :mm

D2


2625


■ Series Matrix of HVDIODE Modules (No.: Number of outline drawing, see page 28)

Line-up of HVIGBT Modules

Conn

ectio

nCo

nnec

tion

[Type] B:Cu base plate C:AlSiC base plate / 6 kViso D:AlSiC base plate / 10kViso

CM: IGBT, RM: DIODE, PM: HVIPM

Rating current class

Connection type

Outline drawing and package type

Voltage class

Series name

Type Name Definition of IGBT Modules

■ Series Matrix of HVIGBT/HVIPM (No.: Number of outline drawing, see page 26 and 28)



[Type]*There are possibility to change the type of auxiliary terminals.

A: Al base plate / 6 kViso B:Cu base plate C:AlSiC base plate / 6 kViso D:AlSiC base plate / 10kViso　E:Al base plate / 10kViso

H E4 D1E2/E6

200225300

750

800

900

1000

1200

1500

1350

1600

1800

2400

400

450

600 CM600DY-34HCM600E2Y-34H

HH

HHH

H

RR

HHXX

X

RRR

XX

X

X

HXXR

HXXHHH

XX

XX

XX

HHH

RR

RR

XX

HHXXX

H

H

NHH

X

HNNNSX

HXHNNHXNNX

CM1200HC-34HCM1200HCB-34NCM1200E4C-34NCM1200DC-34NCM1200DC-34SCM1200DA-34X★★

CM1800HC-34HCM1800HC-34NCM1800HCB-34N

CM2400HC-34HCM2400HC-34X★★

CM2400HC-34NCM2400HCB-34NCM2400HCB-34X★★

CM1600HC-34HCM1600HC-34X★★

BB

CM400HG-66HCM400DY-66H

CM400HG-130HCM400E2G-130HCM400E4G-130H

CM800HC-66HCM800E4C-66HCM800E6C-66H

CM1000HC-66RCM1000E4C-66R

CM1500HC-66RCM1500HG-66R

CC

CM400DY-50H

CM200HG-130HCM225DE-130XA★★CM300DE-130XA★★

CM600HG-130HCM600HG-130X★★CM600HGB-130X★★

CM750HG-130R

HE2E4

H

HHHH

120909

07

11181911

CM600HG-90H

CM1200HC-90RCM1200HC-90RACM1200HG-90R

CCCCCA

CCC

CCCCC

CC

D1E2

HHE4D1D1D2

HHH

HHHHH

HH

0101

CM800DZB-34NCM800DZ-34HCM800HA-34H

CM1000DA-34X★★

CCB

D1D1H

0101-

020305040420

AD2 20

060506

0616050617

2400 CM3600HC-34X★★ CH 17

0216

BD1 15

CM800HB-50H BH 03

CM1200HC-50H CH 06

HD1

HE4

HH

CCC

HE4E2

0715

0810

1011

030606

H

HHH

12

101011

CM800HC-90R

CM1000HG-90X★★

CM800HG-90R H 13H 08C

D

D

CM900HC-90HCM900HG-90HCM900HG-90X★★

CM900HGB-90X★★

HHHH

09131819

CDDD

H 18D

CCD

CM1350HC-90X★★

CM1350HG-90X★★

HH

1719

CD

CM1500HC-90XA★★

CM1500HG-90X★★

HH

1719

CD

DB

CM450DA-66X★★

CM450DE-66X★★

D2D2

2021

AE

CM600DA-66X★★

CM600DE-66X★★

D2D2

2021

AE

CD

CM1800HC-66X★★

CM1800HG-66X★★HH

1719

CD

DDD

DD1 21ED1 21E

DDDD

CM900HG-130X★★ H 19D

CM1200HG-66HCM1200HC-66HCM1200HC-66X★★

CM1200E4C-66X★★

CM1200HCB-66X★★

PM1200HCE330-1

HHHE4HH

090616161714

DCCCBC

IC(A)

Vces1700V 2500V 3300V 4500V 6500V

Model Number Model Number Model Number Model Number Model Number

H 19DCM1000HG-130XA★★

Ser ies Connection No.Type Ser ies Connection No.Type Ser ies Connection Ser iesNo.Type Connection No.Type Ser ies Connection No.Type

H Ｄ

RM1200DB-34S

RM1800HE-34S

B

C

D

H

22

23

200250300

400

450600

900

1000

1200

15001800

RM400DG-66S

RM400DY-66S

RM300DG-130X★★

RM200DG-130S

RM250DG-130F

RM600DG-130S

DD

D

DD

D

2424

24RM600HE-90S

RM1200DG-90F

RM900HC-90SRM900DB-90S

RM400DG-90F

D

C

C

B

D

D

H

H

D

D

24

23

24

RM300DG-90S DD 24

RM450DG-90X★★ DD 24

27

27

RM600DY-66S

RM1000DG-130XA★★ D

RM1500DC-66F

RM1200DG-66SRM1200HE-66SRM1200DB-66SRM1200DG-66X★★

D

B

B

C

DCBD

D

D

D

D

D

DHDD

24

25

25

800 RM800DG-90F DD 24

DD 24

24

26

24232724

RM1000DC-66F CD 26

1700V 3300V 4500V 6500V

IF(A)

VPRM

No.Connection Type No.Connection Type No.Connection Type No.Connection Type

■ Evolution of HVIGBT 　 Module Series

CM 1800 H C -66 X

1700V～　6500V

3300V～　6500V

1700V～　6500V

1700V 1700VH Series N Series S Series

X SeriesR Series

09 CM1200HG-66HCM900HG-90HCM400E2G/E4G-130HCM600HG-130H

07 08

02

04

03

05

01

06

CM1000HC-66RCM800HC-90R

CM400HG-66HCM200HG-130H

CM1200,1600HC-34HCM600DY-34HCM600E2Y-34HCM800DZ-34H CM800DZB-34N

CM1200HCB-34NCM800HB-50H,-66HCM800HC-66H

CM1800,2400HCB-34NCM1800,2400HC-34HCM1200HB/HC-50H,-66HCM800E4C/E6C-66HCM900HB/HC-90H

CM1200E4C-34N CM1800,2400HC-34N

CM1200DB/DC-34NCM1200DC-34S

6

5

4

3

2

1

61.2±0.5 61.2±0.512±0.3

6-M8 NUTS

17±

0.19±

0.1

124±

0.25

44±

0.3

190±0.5

57±0.25 57±0.2557±0.25

140±

0.5


3-M4 NUTS 14±0.3 59.2±0.5

5±0.

15



48+1

.0 0

13030

20

140

4-M8 NUTS


11457±0.25

55.253

11.85

5 3857±0.25

124±

0.25

5-M4 NUTS

57

1640 44

18

LABEL

130

140

4-M8 NUTS

6-φ7MOUNTING HOLES

11457±0.25

61.518

5 38

57±0.25

124±

0.25

3020

16.5 2.518.5

3-M4 NUTS

LABEL

130

40 140

4-M8 NUTS

6-φ7MOUNTING HOLES

11457±0.25 57±0.25

124±

0.25

3-M4 NUTS10.65

48.861.5

10.35

18

5 38

20

LABEL

1906-M8 NUTS

8-φ7MOUNTING HOLES

17157±0.25 57±0.25 57±0.25

61.5 61.513

5 3840

20

140

124±

0.25

3-M4 NUTS 41.2579.420.25

LABEL11.85±0.2

20±

0.1

4 2

3 1

130±0.557±0.25 57±0.25

140±

0.5

124±

0.25

30±

0.2

55.2±0.3


4-M8 NUTS

6-M4 NUTS

53±0.2 57±0.240±0.2 44±0.2

5±0.

2



38+1 -0

4 2

3 1

20±

0.1

140±

0.5

124±

0.25

18±0.2

4-M8 NUTS


3-M4 NUTS

130±0.557±0.25 57±0.25

40±

0.2

61.5±0.3

10.35±0.210.65±0.2

48.8±0.2

5±0.

2



38+1 -0

10.65±0.3 10.35±0.3

48.8±0.3

18±0.3

61.5±0.3

28±

0.5

5±0.

2

9±0.

2

40±

0.3

57±0.25 57±0.25

130±0.5

124±

0.25

140±

0.5




4-M8 NUTS

3-M4 NUTS

38+1 0

20+0

.1-0

.2

1

2

3

4

17±

0.1

140±

0.5

124±

0.25

44±

0.3

73±0.557±0.25

2

1

16.2±0.3

2-M8 NUTS


28.7

36

521.6±0.3

5.8

5 ±0.

15

36.2


SCREWING DEPTHMIN. 4

48+1

.0 0

18±0.216±0.2

12.9±0.3

Unit :mm

D2


2827


Unit :mm


■ Outline Drawing of HVDIODE Modules

Unit :mm

*There are possibility to change the type of auxiliary terminals.

11

13 23

2625RM400,600DY-66S

RM1800HE-34SRM1200HE-66S RM600HE-90S

RM1000,1500DC-66F 27 RM1200DB-66SRM900DB/HC-90S

22 24RM1200DB-34S

130

140

4 - M8 NUTS

LABEL


11457±0.25

61.518

5 38

57±0.25

124±

0.25

4020


130

>PPS< 114±

0.3

74±0.3

38+1

.0 0

29.7 9.

361

.5

40

90

4-M8 NUTS


38+1 –0

4-M8 NUTS

CM

40

57±0.2557±0.25

140

130

1861.5

124±

0.25

205


4

3

2

1

55.2±0.311.85±0.2

4-M8 NUTS

20±

0.1

130±0.5

57±0.25 57±0.25

140±

0.5

124±

0.25

30±

0.2


5±0.

2

38+1

.0 0


>PET+PBT<

5±0.

2

40±

0.3

57±0.25 57±0.25

130±0.5

124±

0.25

140±

0.5

18±0.3

61.5±0.3

4-M8 NUTS



38+1 0

20+0

.1-0

.2

1

2

3

4

14 PM1200HCE330-1

17(16.5)

18.3

15.8

5

(14)

(15)

(15)

61.5±0.3

41

61.5±0.3

124±

0.3

140±

0.3

6-M8NUTS13 Screwing depth16.5mm

(Electrode thickness 1.0mm)

8-ø6.5 MOUNTING HOLES

2-M3 Screwing

38

9.3

+1.0

0

2.6

2311

190±0.357±0.3

40

4557±0.357±0.3

10 CM1000E4C-66RCM1500HC-66RCM1200HC-90RCM1200HC-90RA

CM800HG-90R

16 CM1600HC-34XCM2400HC-34XCM1200HC-66XCM1200E4C-66X

CM1500HG-66RCM1200HG-90RCM750HG-130R

12 CM600HG-90HCM400HG-130H

28±

0.5

5±0.

3

20.25±0.341.25±0.3

79.4±0.3

124±

0.25

140±

0.5

61.5±0.361.5±0.3

57±0.25 57±0.25 57±0.25

40±

0.3

13±0.3

190±0.5



6-M8 NUTS

3-M4 NUTS


38+1 0

1

2

3

4

5

6

4

3

2

1

61.2±0.5

16.5±0.3

4-M8 NUTS

17±

0.1

9±0.

1

124±

0.25

44±

0.3

130±0.5

57±0.25 57±0.25

140±

0.5


3-M4 NUTS 28.5±0.5

42.5±0.3 30.7±0.5

5±0.

15



48+1

.0 0

38+1

.0 0

Unit :mm

14 0.3

380.5

50.2

6-M8 NUTS

3-M4 NUTS 8-φ7MOUNTING HOLES

SCREWING DEPTHMIN 16.5SCREWING DEPTHMIN 7.7

2019 CM1800HG-66X, CM900HGB-90XCM1350, 1500HG-90XCM600HGB-130XCM900HG-130XCM1000HG-130XA

CM1000DA-34XCM1200DA-34XCM450DA-66XCM600DA-66X

21 CM450DE-66XCM600DE-66XCM225DE-130XACM300DE-130XA

4-M8 NUTS

3-M4 NUTS ６－φ７ＭＯＵＮＴＩＮＧＨＯＬＥＳ

SCREWING DEPTHMIN 7.7 SCREWING DEPTHMIN 16.5

380.

5

14 0.3

440.

3

15 CM400DY-50H/66H

17 CM2400HCB, CM3600HC-34XCM1200HCB, CM1800HC-66XCM1350HC-90XCM1500HC-90XA

18 CM900HG-90XCM1000HG-90XCM600HG-130X

130114

2040

24.536.37.2

53.6

61.5

385

0+2

280+2

18

48.8

140

E1

E2

E1E2(C1)

G1

G2

C1

C2

CM

C2

57±0.25

124±

0.25


SCREWINGDEPTHMIN 11.7


4-M 8 NUTS

5-M 4 NUTS

57±0.25

RM400,1200DG-66SRM1200DG-66XRM300DG-90SRM400,800,1200DG-90FRM450DG-90XRM200,600DG-130SRM300DG-130XRM1000DG-130XA

4

3

2

1

61.2±0.516.5±0.3

4-M8 NUTS

17±

0.1

124±

0.25

44±

0.3

130±0.557±0.25 57±0.25

140±

0.5


5±0.

15

48+1

.0 0


57±0.25 57±0.25

10.35±0.310.65±0.3

61.5±0.3

18±0.3

48.8±0.3

40±

0.3

124±

0.25

9±0.

2

28±

0.5

5±0.

214

0±0.

5

130±0.5

4-M8 NUTS



3-M4 NUTS

20-0

.2+0

.1

38-0+1


140±

0.5

124±

0.25

9±0.

25±

0.2

28±

0.5

40±

0.3

57±0.25 57±0.25

20.25±0.3

13±0.3

41.25±0.3

79.4±0.3

61.5±0.3 61.5±0.3

57±0.25

190±0.5 6-M8 NUTS


3-M4 NUTS

20-0

.2+0

.138

0+1



48-0+1

17-0

.2+0

.1

130±0.5

57±0.25 57±0.25

140±

0.5

44±

0.3

9±0.

2

14±0.3 28.5±0.3

59.2±0.3

61.2±0.316.5±0.3

124±

0.25

38±

0.5

5±0.

2




3-M4 NUTS

4-M8 NUTS

6-M8 NUTS

3-M4 NUTS

190±0.5

14±0.3

12±0.3

59.2±0.3

61.2±0.361.2±0.3

57±0.25 57±0.25 57±0.25

44±

0.3

38±

0.5

5±0.

2

17-0

.2+0

.148

-0+1



8-φ 7MOUNTINGHOLES

140±

0.5

124±

0.25

122.5±0.3

86±

0.25

46±

0.3

99.5

±0.

5

82±

0.3

46±

0.3

29.5±0.3

25.25±0.3

44±0.353.5±0.3

127±0.25

140±0.5

8.5±0.3

35±

0.3

30±

0.3

4±0.

340

±0.

3

144±0.5

31.5±0.3

69±0.353.5±0.3

22.5±0.3

15±0.3

9.5±0.3

(4.5)

(5.5) (10) 7-M8 NUTS

6-M3 NUTS

18-0

.2+0

.1

18-0

.2+0

.1

4-φ 8.5MOUNTINGHOLES



SCREWINGDEPTHMIN 7

SCREWINGDEPTHMIN 16

4-M8NUTS

6-M3NUTS


144138127

81.5

93

21

344.5

18

36

40

127

9.5

99448698100

44

26.59.5


2827


Unit :mm


■ Outline Drawing of HVDIODE Modules

Unit :mm

*There are possibility to change the type of auxiliary terminals.

11

13 23

2625RM400,600DY-66S

RM1800HE-34SRM1200HE-66S RM600HE-90S

RM1000,1500DC-66F 27 RM1200DB-66SRM900DB/HC-90S

22 24RM1200DB-34S

130

140

4 - M8 NUTS

LABEL


11457±0.25

61.518

5 38

57±0.25

124±

0.25

4020


130

>PPS< 114±

0.3

74±0.3

38+1

.0 0

29.7 9.

361

.5

40

90

4-M8 NUTS


38+1 –0

4-M8 NUTS

CM

40

57±0.2557±0.25

140

130

1861.5

124±

0.25

205


4

3

2

1

55.2±0.311.85±0.2

4-M8 NUTS

20±

0.1

130±0.5

57±0.25 57±0.25

140±

0.5

124±

0.25

30±

0.2


5±0.

2

38+1

.0 0


>PET+PBT<

5±0.

2

40±

0.3

57±0.25 57±0.25

130±0.5

124±

0.25

140±

0.5

18±0.3

61.5±0.3

4-M8 NUTS



38+1 0

20+0

.1-0

.2

1

2

3

4

14 PM1200HCE330-1

17(16.5)

18.3

15.8

5

(14)

(15)

(15)

61.5±0.3

41

61.5±0.3

124±

0.3

140±

0.3

6-M8NUTS13 Screwing depth16.5mm

(Electrode thickness 1.0mm)

8-ø6.5 MOUNTING HOLES

2-M3 Screwing

38

9.3

+1.0

0

2.6

2311

190±0.357±0.3

40

4557±0.357±0.3

10 CM1000E4C-66RCM1500HC-66RCM1200HC-90RCM1200HC-90RA

CM800HG-90R

16 CM1600HC-34XCM2400HC-34XCM1200HC-66XCM1200E4C-66X

CM1500HG-66RCM1200HG-90RCM750HG-130R

12 CM600HG-90HCM400HG-130H

28±

0.5

5±0.

3

20.25±0.341.25±0.3

79.4±0.3

124±

0.25

140±

0.5

61.5±0.361.5±0.3

57±0.25 57±0.25 57±0.25

40±

0.3

13±0.3

190±0.5



6-M8 NUTS

3-M4 NUTS


38+1 0

1

2

3

4

5

6

4

3

2

1

61.2±0.5

16.5±0.3

4-M8 NUTS

17±

0.1

9±0.

1

124±

0.25

44±

0.3

130±0.5

57±0.25 57±0.25

140±

0.5


3-M4 NUTS 28.5±0.5

42.5±0.3 30.7±0.5

5±0.

15



48+1

.0 0

38+1

.0 0

Unit :mm

14 0.3

380.5

50.2

6-M8 NUTS

3-M4 NUTS 8-φ7MOUNTING HOLES

SCREWING DEPTHMIN 16.5SCREWING DEPTHMIN 7.7

2019 CM1800HG-66X, CM900HGB-90XCM1350, 1500HG-90XCM600HGB-130XCM900HG-130XCM1000HG-130XA

CM1000DA-34XCM1200DA-34XCM450DA-66XCM600DA-66X

21 CM450DE-66XCM600DE-66XCM225DE-130XACM300DE-130XA

4-M8 NUTS

3-M4 NUTS ６－φ７ＭＯＵＮＴＩＮＧＨＯＬＥＳ

SCREWING DEPTHMIN 7.7 SCREWING DEPTHMIN 16.5

380.

5

14 0.3

440.

3

15 CM400DY-50H/66H

17 CM2400HCB, CM3600HC-34XCM1200HCB, CM1800HC-66XCM1350HC-90XCM1500HC-90XA

18 CM900HG-90XCM1000HG-90XCM600HG-130X

130114

2040

24.536.37.2

53.6

61.5

385

0+2

280+2

18

48.8

140

E1

E2

E1E2(C1)

G1

G2

C1

C2

CM

C2

57±0.25

124±

0.25




4-M 8 NUTS

5-M 4 NUTS

57±0.25

RM400,1200DG-66SRM1200DG-66XRM300DG-90SRM400,800,1200DG-90FRM450DG-90XRM200,600DG-130SRM300DG-130XRM1000DG-130XA

4

3

2

1

61.2±0.516.5±0.3

4-M8 NUTS

17±

0.1

124±

0.25

44±

0.3

130±0.557±0.25 57±0.25

140±

0.5


5±0.

15

48+1

.0 0


57±0.25 57±0.25

10.35±0.310.65±0.3

61.5±0.3

18±0.3

48.8±0.3

40±

0.3

124±

0.25

9±0.

2

28±

0.5

5±0.

214

0±0.

5

130±0.5

4-M8 NUTS



3-M4 NUTS

20-0

.2+0

.1

38-0+1


140±

0.5

124±

0.25

9±0.

25±

0.2

28±

0.5

40±

0.3

57±0.25 57±0.25

20.25±0.3

13±0.3

41.25±0.3

79.4±0.3

61.5±0.3 61.5±0.3

57±0.25

190±0.5 6-M8 NUTS


3-M4 NUTS

20-0

.2+0

.138

0+1



48-0+1

17-0

.2+0

.1

130±0.5

57±0.25 57±0.25

140±

0.5

44±

0.3

9±0.

2

14±0.3 28.5±0.3

59.2±0.3

61.2±0.316.5±0.3

124±

0.25

38±

0.5

5±0.

2




3-M4 NUTS

4-M8 NUTS

6-M8 NUTS

3-M4 NUTS

190±0.5

14±0.3

12±0.3

59.2±0.3

61.2±0.361.2±0.3

57±0.25 57±0.25 57±0.25

44±

0.3

38±

0.5

5±0.

2

17-0

.2+0

.148

-0+1



8-φ 7MOUNTINGHOLES

140±

0.5

124±

0.25

122.5±0.3

86±

0.25

46±

0.3

99.5

±0.

5

82±

0.3

46±

0.3

29.5±0.3

25.25±0.3

44±0.353.5±0.3

127±0.25

140±0.5

8.5±0.3

35±

0.3

30±

0.3

4±0.

340

±0.

3144±0.5

31.5±0.3

69±0.353.5±0.3

22.5±0.3

15±0.3

9.5±0.3

(4.5)

(5.5) (10) 7-M8 NUTS

6-M3 NUTS

18-0

.2+0

.1

18-0

.2+0

.1




SCREWINGDEPTHMIN 7

SCREWINGDEPTHMIN 16

4-M8NUTS

6-M3NUTS


144138127

81.5

93

21

344.5

18

36

40

127

9.5

99448698100

44

26.59.5


UPV

UPGUPAUPSUPE

VPV

VPGVPAVPSVPE

WPV

WPGWPAWPSWPE

UNGUNAUNSUNE

U

VNGVNAVNSVNE

V

WNGWNAWNSWNE

W

P1

N1

P2

N2

P3

N3

■ Matrix of 650V Power Modules (No. : Number of outline drawing, please refer to page 30)

New ProductsPackage with 6-in-1 connection and integrated water-cooled fin contributes to more compact, high-power inverters for EVs/HEVs

3029

Power Modules for Electric and Hybrid Vehicles

＊CSTBTTM: Mitsubishi Electric’s unique IGBT that utilizes the carrier cumulative effect.

■ Matrix of 1200V Power Modules (No. : Number of Outline Drawing, please refer to page 30)

Type Name Definition of Power Modules for Electric and Hybrid Vehicles

Features

・Long power/temperature cycle life・High-precision on-chip temperature sensor・High traceability in managing materials/components for each

product throughout the entire production process

Common・Package structure compliant with the End-of-Life-Vehicles Directive,

regulations relating to substances of environmental concern

・Structure incorporates transfer molding and original direct lead bonding(DLB) technique

・DLB structure reduces internal wiring resistance and inductance

・Completely Pb-free (including the pins)

J Series T-PM (Transfer-molded Power Module)・Cooling fin integrated direct water-cooled structure and 6-in-1

configuration contribute to minimize the automobile inverter・DLB structure realizes high reliability・Installation of the 7th generation IGBT adapting the CSTBTTM＊

structure realizes a further reduction in loss・On-chip current sensor that enables high-speed current-cutoff

protection is installed

J1 Series (6-in-1)

02 CT300DJG06001

■ Outline Drawing of Power Modules for Electric and Hybrid Vehicles

03

CT1000CJ1B060CT600CJ1B120

04

CT600DJH060

Unit :mm

<Main Features>• Integrated direct water-cooling structure with cooling fins and 6-in-1 connection contribute to more compact inverters for EVs/HEVs• Direct lead bonding (DLB) structure ensures high reliability• Loss further reduced by incorporating 7th-generation IGBT built with a CSTBTTM＊ structure• Completely lead-free, conforms to RoHS directives (2011/65/EU)• Suitable for a variety of electric and hybrid vehicle inverters

CT1000CJ1B060,CT600CJ1B120High Power J1 Series Power Modules for EVs/HEVs 23

36.8

13.2

53.2

83.2

77.2

6

16

38.557.5

68.7

2.5

12.4 0.3±

26.6

0.3

±

7.3

0.2

±

13.7

0.2

±

23.2

0.3

±

43.2

0.3

±

66.4

0.1

±

73.7

0.2

±

79.4

80.

2±

2.54 0.2±

6.75 0.3±9 0.2±

17.45 0.2±

32.83 0.2±

48 0.3±

60.83 0.2±

86.2 0.2±86.2 0.1±

13.0

80.

2±

15.2

0.2

±

51.2

0.2

±

66.4

0.1

±

86.2 0.1±

62.33

A

UNAUNSUNEUNG

UPG

PPV

N

U

V

W

UPEUPSUPAVPGVPEVPSVPA

WPGWPEWPSWPA

VNAVNSVNEVNG

WNAWNSWNEWNG

0.2±

40.33 0.2±

18.45 0.2±

for self tapping screw

4xφ5.5

4xφ74xφ9

24-□0.64□1

12.5

66.4

18.9

3.5mm x 5mm

88.792.25xM5 8Max.

78.7 0.3±

φ5.4

3-φ6

2-φ2.5

42.6

69.5

49.6

12

6.33

10.1

6

125.

08

5.08P=

2.54

12

P=2.

5444

0.2

±

7

16.7

0.5

± 0.64

6.5

2-1.

5

3.36

50.

2±

23.8 1± 23.8 1±

18.5 0.2±

170.

2± 8.

7

AP

PGPEPSPV

NSNENGNKNA

N

U

29.25 0.4±

9-□0.64

1 M MＡ29.25 0.4±■ Block Diagram

CT: IGBT

Voltage class

Rating current classConnection type

Series name and structure

CT 600 C J1B 120No.Connection

1200V

J1 SeriesPower Module with pin fin

Series

IC(A)

VCES(V)

★: New Product ★★: Under Development

No. No.Connection Connection

650V

J1 Series J SeriesPower Module with pin fin T-PM

Connection

Series

IC(A)

VCES(V)

2×2

0.64

(P=2

.54)

NENGNSNKNA

PAPKPSPGPEPV

3×φ6

2×φ3.5

φ5.4

36±0.4

24.75±0.2

23.25

±0.

2

12±

0.2

28.75

±0.

2

21.15

±0.

15

3.36

6.4

36±0.4

2.5±

0.2

14.5

±0.

2

30.5±130.5±1

56

1212

84

7.5

10.16

5.08

11.2

64

1 AM M

10.16

(P=2.5

4)9 A

U

N

P

12

11×□0.64

8-φ5.58-φ12.8

48.8

16.412-M6 MAX.13MM

3.5×8MM

16.4 16.43-16

5.1

9.3

4.6

6-4.986-4.987-4.987-4.987-4.98 6-4.98

3-32 38.4

53.95

50.7553.4562.25

3-7.5

3-15

.6

3-6.

64

3-9.1

3-10.8

6-12

.7(p

=2.5

4)3-8

.5

124.

5

14.65 14.65 14.653-19.5

3-14.5

3-7 3-7

3-14.5

101.

4

163131.4

75.4

33.7

3-50

.44

48.8 48.8

39-□0.64

8-φ98-φ7

INLET OF COOLING WATER

FOR SELF TAPPING SCREWUNAUNSUNE1UNG1UNE2UNG2

VNAVNSVNE1VNG1VNE2VNG2

WNAWNSWNE1WNG1WNE2WNG2

WPG1WPE1

WPSWPA

WPG2WPE2

WPV

VPG1VPE1

VPSVPA

VPG2VPE2

VPV

UPG1UPE1

UPSUPA

UPG2UPE2

UPV

CT600CJ1A060CT700CJ1A060CT300CJ1A120

CT600CJ1B120★ C600

Connection

04CT300CJ1A120★★ C300 01

C

-CT600CJ1A060

CT700CJ1A060★

CT1000CJ1B060★

-CCC

CT300DJG060★★

CT600DJH060★★

--

DD--

0203--

-010104

3006007001000

DC





UPV

UPGUPAUPSUPE

VPV

VPGVPAVPSVPE

WPV

WPGWPAWPSWPE

UNGUNAUNSUNE

U

VNGVNAVNSVNE

V

WNGWNAWNSWNE

W

P1

N1

P2

N2

P3

N3

■ Matrix of 650V Power Modules (No. : Number of outline drawing, please refer to page 30)

New ProductsPackage with 6-in-1 connection and integrated water-cooled fin contributes to more compact, high-power inverters for EVs/HEVs

3029

Power Modules for Electric and Hybrid Vehicles

＊CSTBTTM: Mitsubishi Electric’s unique IGBT that utilizes the carrier cumulative effect.

■ Matrix of 1200V Power Modules (No. : Number of Outline Drawing, please refer to page 30)

Type Name Definition of Power Modules for Electric and Hybrid Vehicles

Features

・Long power/temperature cycle life・High-precision on-chip temperature sensor・High traceability in managing materials/components for each

product throughout the entire production process

Common・Package structure compliant with the End-of-Life-Vehicles Directive,

regulations relating to substances of environmental concern

・Structure incorporates transfer molding and original direct lead bonding(DLB) technique

・DLB structure reduces internal wiring resistance and inductance

・Completely Pb-free (including the pins)

J Series T-PM (Transfer-molded Power Module)・Cooling fin integrated direct water-cooled structure and 6-in-1

configuration contribute to minimize the automobile inverter・DLB structure realizes high reliability・Installation of the 7th generation IGBT adapting the CSTBTTM＊

structure realizes a further reduction in loss・On-chip current sensor that enables high-speed current-cutoff

protection is installed

J1 Series (6-in-1)

02 CT300DJG06001

■ Outline Drawing of Power Modules for Electric and Hybrid Vehicles

03

CT1000CJ1B060CT600CJ1B120

04

CT600DJH060

Unit :mm

<Main Features>• Integrated direct water-cooling structure with cooling fins and 6-in-1 connection contribute to more compact inverters for EVs/HEVs• Direct lead bonding (DLB) structure ensures high reliability• Loss further reduced by incorporating 7th-generation IGBT built with a CSTBTTM＊ structure• Completely lead-free, conforms to RoHS directives (2011/65/EU)• Suitable for a variety of electric and hybrid vehicle inverters

CT1000CJ1B060,CT600CJ1B120High Power J1 Series Power Modules for EVs/HEVs 23

36.8

13.2

53.2

83.2

77.2

6

16

38.557.5

68.7

2.5

12.4 0.3±

26.6

0.3

±

7.3

0.2

±

13.7

0.2

±

23.2

0.3

±

43.2

0.3

±

66.4

0.1

±

73.7

0.2

±

79.4

80.

2±

2.54 0.2±

6.75 0.3±9 0.2±

17.45 0.2±

32.83 0.2±

48 0.3±

60.83 0.2±

86.2 0.2±86.2 0.1±

13.0

80.

2±

15.2

0.2

±

51.2

0.2

±

66.4

0.1

±

86.2 0.1±

62.33

A

UNAUNSUNEUNG

UPG

PPV

N

U

V

W

UPEUPSUPAVPGVPEVPSVPA

WPGWPEWPSWPA

VNAVNSVNEVNG

WNAWNSWNEWNG

0.2±

40.33 0.2±

18.45 0.2±

for self tapping screw

4xφ5.5

4xφ74xφ9

24-□0.64□1

12.5

66.4

18.9

3.5mm x 5mm

88.792.25xM5 8Max.

78.7 0.3±

φ5.4

3-φ6

2-φ2.5

42.6

69.5

49.6

12

6.33

10.1

6

125.

08

5.08P=

2.54

12

P=2.

5444

0.2

±

7

16.7

0.5

± 0.64

6.5

2-1.

5

3.36

50.

2±

23.8 1± 23.8 1±

18.5 0.2±

170.

2± 8.

7

AP

PGPEPSPV

NSNENGNKNA

N

U

29.25 0.4±

9-□0.64

1 M MＡ29.25 0.4±■ Block Diagram

CT: IGBT

Voltage class

Rating current classConnection type

Series name and structure

CT 600 C J1B 120No.Connection

1200V

J1 SeriesPower Module with pin fin

Series

IC(A)

VCES(V)


No. No.Connection Connection

650V

J1 Series J SeriesPower Module with pin fin T-PM

Connection

Series

IC(A)

VCES(V)

2×2

0.64

(P=2

.54)

NENGNSNKNA

PAPKPSPGPEPV

3×φ6

2×φ3.5

φ5.4

36±0.4

24.75±0.2

23.25

±0.

2

12±

0.2

28.75

±0.

2

21.15

±0.

15

3.36

6.4

36±0.4

2.5±

0.2

14.5

±0.

2

30.5±130.5±1

56

1212

84

7.5

10.16

5.08

11.2

64

1 AM M

10.16

(P=2.5

4)9 A

U

N

P

12

11×□0.64

8-φ5.58-φ12.8

48.8

16.412-M6 MAX.13MM

3.5×8MM

16.4 16.43-16

5.1

9.3

4.6

6-4.986-4.987-4.987-4.987-4.98 6-4.98

3-32 38.4

53.95

50.7553.4562.25

3-7.5

3-15

.6

3-6.

64

3-9.1

3-10.8

6-12

.7(p

=2.5

4)3-8

.5

124.

5

14.65 14.65 14.653-19.5

3-14.5

3-7 3-7

3-14.5

101.

4

163131.4

75.4

33.7

3-50

.44

48.8 48.8

39-□0.64

8-φ98-φ7

INLET OF COOLING WATER

FOR SELF TAPPING SCREWUNAUNSUNE1UNG1UNE2UNG2

VNAVNSVNE1VNG1VNE2VNG2

WNAWNSWNE1WNG1WNE2WNG2

WPG1WPE1WPSWPA

WPG2WPE2

WPV

VPG1VPE1VPSVPA

VPG2VPE2VPV

UPG1UPE1UPSUPA

UPG2UPE2UPV

CT600CJ1A060CT700CJ1A060CT300CJ1A120

CT600CJ1B120★ C600

Connection

04CT300CJ1A120★★ C300 01

C

-CT600CJ1A060

CT700CJ1A060★

CT1000CJ1B060★

-CCC

CT300DJG060★★

CT600DJH060★★

--

DD--

0203--

-010104

3006007001000

DC






H-CT575-C FU-1808 Printed in Japan <IP>

POWER MODULES

Please visit our website for further details.

Revised publication, effective Oct. 2018.Superseding publication of H-CT575-B Aug. 2018.

Specifications subject to change without notice.

2018

POWER MODULES




















КАТАЛОГ






г.Минск www.tiristor.by email: [email protected] viber и тел.+375447584780Power Devices

J1-Series for Automotive ApplicationsNew Lightweight Compact Power Modules for xEV InvertersEnhancing Efficiency and Reliability

Features− Compact highly reliable light weight 6in1 package for automotive inverters− Direct water-cooling structure with Aluminum cooling fins− Direct Lead Bonding (DLB) package (wire bond less) ensures high reliability− Low power loss 7th-Generation CSTBT™* chip technology− On-chip temperature and current sensors− Pb-free, RoHS-compliant structure− Lineup suitable for a wide range of power-ratings in electric and hybrid vehicle

applications

Medium Power Package

High Power PackageCircuit Diagrams J1-series

Automotive Power Modules (J1-Series) LineupIc(A)

VCES (V) [@Tj = – 40 °C] 300 600 700 1000

650 CT300CJ1A060* CT600CJ1A060 CT700CJ1A060* CT1000CJ1B060*

1200 CT600CJ1B120*

Medium Power 6in1 Package High Power 6in1 Package

* CSTBT™: Carrier Stored Trench-Gate Bipolar Transistor

Medium Power 6in1 PackageHigh Power 6in1 Package

* under development

ME_SC_Handout_A4_PowerDevices_2017_RZ.indd 1 08.05.17 11:11


MISOPTM

Power chip RC-IGBT

Tj max 150deg C

Tc max 115deg C

Packagesurface mounting

15.2x27.4x3.3mm

Viso 1500Vrms

Terminal

MISOPTM with Reverse Conducting IGBT

- Saves your design & development time -

Home Appliance

Circuit Circuit Diagram Package Size Product Name Application

6in1

15.2 mm

X

27.4 mm

X

3.3 mm

SP1SK

*SP1SL

(1A / 600V)Refrigerators

Pumps

Fans

Small AC DrivesSP3SK

*SP3SL

(3A / 600V)

Product Advantages

� SMD type IPM with RC-IGBT Chip technology

� Integrated bootstrap diode (BSD) & capacitors (BSC)*

� Short circuit protection through external shunt resistor

� Power supply under-voltage protection : Fo output on N-side

� Over Temperature protection

� Analog temperature voltage signal output

� Interlock function

Mitsubishi Electric has added a new transfer molded SMD type Intelligent Power Module to its line-up – the

MISOP™ (Mitsubishi Electric Intelligent Small Outline Power Module) . Applications with small power inverters

like pump, fan or low servos are requesting compactness, easy assembling, reliability and high performance. The

new MISOP™ SMD type IPM combines all the attractive features of Mitsubishi Electric DIPIPM family with the

high efficiency RC-IGBT technology (based on Mitsubishi Electric 7th Chip technology). The integration of driver

ICs (HVIC and LVIC), bootstrap diodes & capacitors, and protection functions conveniently reduces the inverter

design & development time.

P

NU NV NW

HVIC

LVIC

Industrial

*Included Bootstrap Capacitor (BSC) under development


MISOPTM Package

Mitsubishi Electric Europe B.V. (European Headquaters)

- Semiconductor European Business Group -

Mitsubishi-Electric-Platz 1 / D-40882 Ratingen

Phone +49 (0) 2102 486 0

Fax +49 (0) 2102 486 7220

Protection via MitsubishiThe device offers the possibility to implement a short circuit

protection via external shunt resistances which can be

connected to each of the open emitter pins. To avoid the

risk of overheating during operation, there is a built-in over-

temperature protection (OT), and the functionality to

monitor the module temperature with an accurate linear

analog voltage output signals (VOT), which helps to define

the derating points to use the module with high power

density. The availability of the “interlock-protection” is a an

important implementation, this protection function prevents

the simultaneous turn-on of both high side and low side

switches (such a turn-on would lead to an arm-shoot

through short circuit). In addition, the ability to detect and

indicate a failure in the control supply voltage is also

included in the MISOPTM.

The MISOPTM Reverse Conduction (RC) IGBT is based on

Mitsubishi Electric 7th generation chip technology. The 7th

generation chip technology is a low loss thin wafer IGBT

technology which allows an optimization of the balance

between performance and IGBT chip size. In addition to the

inherent benefits of the 7th generation chip technology, the

RC technology enables a significant level of optimization of

the power module’s surface area requirement since the

IGBT and the diode are effectively integrated into a single

die.

Simplified PCB PatternBootstrap circuits, which require external capacitors, are

generally used to provide the high-side power supply in

conventional DIPIPM circuits. In a conventional DIPIPM

circuit, the pins used for bootstrap capacitor connection are

located on opposite sides of the module. In the MISOPTM,

the ground pins are placed next to the high voltage supply

pins, simplifying the PCB wiring design and thus utilizing

more efficient available space.

Ap

ril 2

01

8

MIS

OP

Size 70x80

*

*Included Bootstrap Capacitor (BSC) under development


Super Mini Full SiC DIPIPMTM Series for high efficiency

Features Integrated newly developed SiC

MOSFET for improving efficiency NO requirement of negative bias by

mounting MOSFET with highthreshold voltage VGSth.

Single DC 18V power supply drivewith bootstrapping scheme.

Safety operating SiC MOSFET byprotection functions.

Easy to replace from conventionalVer.6 due to pin and functioncompatibility.

Mitsubishi Electric has developed New Super Mini Full SiC DIPIPM (hereinafter called Full SiC DIP) for ConsumerGoods Applications. Full SIC DIP is an ultra-small compact transfer molded intelligent power module integratingSiC MOSFET chip which is the next generation high efficiency power chips. Power chips, drive and protectioncircuits are integrated in the module with transfer molding resin.Full SiC DIP can improve inverter efficiency drastically by embedding SiC MOSFET chips, and additionally the FullSiC DIP package is 100% compatible with conventional Super Mini DIPIPM Ver.6 series. This compatibility enablesto utilize the existing conventional inverter boards easily and to expand the lineup of installed systems.


6in124 mm

X38 mm

PSF15S92F6(15A / 600V)

AC 100-240Vrmsclass low power motor control

PSF25S92F6(25A / 600V)

ItemsSuper Mini

DIPIPM Ver.6Super Mini Full

SiC DIPIPM

P-side control supply voltage VDB

Typ. 15V(13～18.5V)

Typ. 18V(15～22V)

N-side control supply voltage VD

Typ. 15V(13～16.5V)

Typ. 18V(17～19V)

Built-in bootstrap diodesBuilt-in with

current limiting resistor

←

Temperature protection OT or VOT VOT

N-side IGBT emitter terminal

Open ←

Terminal shape Long ←

The difference between conventional Ver.6 and Full SiC DIP

P

NU NV NW

HVIC

LVIC

Home Appliance Industrial





Phone +49 (0) 2102 486 0

Fax +49 (0) 2102 486 7220


Functions

Increased Performance

May

20

17

[Condition] Simulation model: 3 phase PWMVCC=VDD=300V, M=1, P.F=0.8, Io=7rms, fc=15kHz, fo=60Hz, Tj=Tch=125degree C

[Condition] Simulation model: 3 phase PWMVCC=VDD=300V, M=1, P.F=0.8, fo=60Hz, Tj=Tch=125degree C, Tc=100degree C, ΔT(ch-c)=25K

For P-side MOSFETs:- Drive circuit, high voltage level shift circuit;- Control supply under voltage lockout circuit (without fault signal output)- Built-in bootstrap diode with current resistor For N-side MOSFETs:

- Drive circuit;- Short circuit protection circuit(by inserting external shunt resistor into main current path)

- Control supply under voltage lockout circuit (with fault signal output)- Outputting LVIC temperature by analog signal Fault Signal Output

- Corresponding to N-side MOSFET SC and N-side UV MOSFET Drive Supply

- Single DC18V power supply (in case of using bootstrap method) Control Input Interface

- Schmitt-triggered 3V, 5V input compatible, high active logic UL recognized

- UL 1557 File E323585


Super Mini DIPIPM SLIMDIP

Power chip 7th Gen. IGBT RC-IGBT

Tj max 150deg C 150deg C

Tc max 100deg C 115deg C

PackageSuper Mini

24x38SLIM

18.8x32.8

Viso 1500Vrms 2000Vrms

Terminal

SLIMDIPTM with Reverse Conducting IGBT - Slim your cost -

Home Appliance


6in118.8 mm

X32.8 mm

SLIMDIP-S(5A / 600V)

Air ConditionersWashing Machine

RefrigeratorsPumps

FansSmall AC Drives

SLIMDIP-L(15A / 600V)

Product Advantages Smaller package

(30% smaller than Super MiniDIPIPM)

Integrated bootstrap diodeeliminates the need for externaldiode, simplifying design & PCB layout

Dedicated protection functions: short circuit, over temperature, under voltage lockout

Robust package for high temperature operation, TC,max of 115oC for switching operation

UL recognized, isolation voltageViso = 2000V AC RMS

Mitsubishi Electric has developed a new SLIM package Intelligent Power Module(SLIMDIPTM) for Consumer GoodsApplications. Power chips, drive and protection circuits are all integrated into the module, which makes it asimple choice for AC100-200V class motor inverter control. SLIMDIPTM utilizes reverse conducting RC-IGBTtechnology, which applies MITSUBISHIs latest 7th generation IGBT chip design, enabling the use of a smallerpackage by reducing number of internal component when compared to MITSUBISHIs Super Mini DIPIPM series.By virtue of these features SLIMDIPTM is especially suitable for low cost inverterized home appliances and cancontribute to system cost reduction.

P

NU NV NW

HVIC

LVIC

+15deg C

-30%

+500V

Easy pattern

Industrial


SLIMDIPTM Package




Phone +49 (0) 2102 486 0

Fax +49 (0) 2102 486 7220


Ease of UseThe SLIMDIPTM shows an improvement in the followingareas compared to the Super Mini DIPIPM , making it easierto use.- An increased maximum case temperature specification,

Tc max 100→115deg C- Both temperature protection tripping OT and analog

temperature information are IC functions.

- The SLIMDIPTM package has roughly a 30% smaller footprint area than the conventional Super Mini DIPIPM. The package and power semiconductors are optimized to provide the smallest 3-phase IPM for motor drive applications up to 1.5kW.

- The conventional DIPIPM package contains 6 IGBTs and 6 FWDs, but the new RC-IGBTs used in the SLIMDIPTM

allows a 50% reduction in the number of power chips, thus shrinking the internal space requirement.

Simplified PCB PatternBootstrap circuits, which require external capacitors, aregenerally used to provide the high-side power supply inconventional DIPIPM circuits. In a conventional DIPIPMcircuit, the pins used for bootstrap capacitor connection arelocated on opposite sides of the module. In the SLIMDIP, theground pins are placed next to the high voltage supply pins,simplifying the PCB wiring design and thus utilizing lessspace.

• 30% reduction in package size

• Simple wiring of bootstrap circuit

May

20

17


„All-In-One“ DIPIPM+TM Series for Compact Inverter DesignsMitsubishi Electric has developed a novel family of compact Intelligent Converter-Inverter-Brake modules. This new DIPIPM+TM series incorporates optimized IGBT- and FWDi-chips, low voltage and high voltage driver ICs in a compact transfer molded dual-inline package. The new DIPIPM+TM series provides smart answers to the two key questions a designer faces when developing a new inverter: How to reduce the system cost? How to reduce the inverter size using compact design?

Circuit Circuit Diagram Package Size Product Name 600V 1200V

Converter+

7in1

85 mmX

34 mm

PSS05MC1FT 5A

PSS10MC1FT 10A

PSS15MC1FT 15A

PSS25MC1FT 25A

PSS35MC1FT 35A

PSS50MC1F6 50A

Converter+

6in1

85 mmX

34 mm

PSS05NC1FT 5A

PSS10NC1FT 10A

PSS15NC1FT 15A

PSS25NC1FT 25A

PSS35NC1FT 35A

PSS50NC1F6 50A

Product Advantages Compact design with integrated

Converter, Inverter and Brake Integrated HVIC & LVIC Dedicated protection functions:

short circuit, over temperature, under voltage lockout

Operation at TC,Max = 110oC High Isolation Voltage

Viso = 2500V Same Package size

for 6 different power ratings

User Benefits Achieved by

Inverter Cost Reduction

Manufacturing Cost

- Easy assembly: only one power module to be soldered to the PCB

- Reduced assembly cost by lower part count

Development Cost

- Easy test setup with the DIPIPM+TM Evaluation Board - Reduced engineering efforts & shorter dev. time

Material Cost- Reduced PCB-cost- Reduced EMI filter cost- No AC-output current sensors needed

Inverter Size Reduction

- Reduced heat sink size- Reduced EMI Filter size- Very compact PCB design

Increasing Inverter Performance

- Increased robustness to endure harsh environmental conditions- Accurate analog temperature-output VOT for adaptive inverter control

Industrial


Size Reduction




Phone +49 (0) 2102 486 0

Fax +49 (0) 2102 486 7220


Cost ReductionWhen developing a new general purpose inverter,optimizing the system costs is an important necessity.Basically three cost factors must be considered:Development cost, material cost and manufacturing cost.All three factors are addressed by the new DIPIPM+TM series.- Availability of a plug-and-play Evaluation board- Integrated functionalities- Reduced part count on the PCB-Board

Increased Inverter Performance

Inverter compactness is an important objective when establishing anew inverter design since power density (kVA/dm³) is a keybenchmarking criteria for comparing general purpose inverters.DIPIPM+TM offers the following advantages for increasing the inverterpower density:- Using the bootstrap-technology for control power supply - Substituting the inverter output current sensors by emitter shunts- Converter, Inverter and Brake in the same module package- Reducing the EMI-filter size- Very compact PCB design- Reducing the heat sink size

The analog Voltage-Over-Temperature signal (VOT) ofDIPIPM+TM can be used to enhance the robustness of theinverter against harsh environmental conditions. Usually theinverter specification is provided at maximum ambienttemperature of Ta=+40°C. For higher ambient temperaturesan inverter de-rating has to be considered when installingthe drive. By using the accurate VOT-signal of DIPIPM+TM anadaptive inverter de-rating can be activated duringoperation for avoiding an OT-trip of the drive.

May

20

17


Small-Pkg.

(A-Pkg.)

Middle-Pkg.

(B-Pkg.)

Large-Pkg.

(C-Pkg.)

Vces Topology*

650V50A, 75A, 100A

50A, 75A, 100A, 150A, 200A

200A, 300A, 450ANEW

1200V25A, 50A

25A, 50A, 75A, 100A

100A, 150A, 200ANEW

650V 50A, 75A50A, 75A, 100A,

150A,200A200A, 300A,

450ANEW

1200V25A

25A, 50A, 75A,100A

100A, 150A,200ANEW

G1 Series IPM Modules

Product Advantages

Low-loss 7th generation Full Gate IGBT

Advanced internal drive circuit with integrated protection functions

High reliability using a new package technology

Line-up with multiple packages, voltage levels and current levels

The new Mitsubishi Electric G1 series was developed in order to achieve higher efficiency, easy system design and superior reliability. The Intelligent Power Modules have been developed in the 650V and 1200V categories in the 6 in 1 and the 7 in 1 configurations.

Industrial

Unique Benefits Solutions Employed

Advanced low loss

chip technology

A new 7th generation Full Gate IGBT is employed with an integrated sense-emitter

Best EMI vs Loss

trade-off

An innovative switching speed control is established using the integrated sense-emitter component.

Integrated driver

with multiple

functionalities

Protection functions are already integrated into the module (short circuit protection using sense-emitter, control supply under voltage detection and on-chip over-temperature sensor at IGBT).

A failure output signal with identification of fault type is available.

* The topologies presented here represent only the power electronic components. The driver IC is not represented here.


G1 series IPMs – Chip Technology and benefits

➢ Full Gate IGBT with an integrated current sense mirror emitter : The G1 IPM utilizes a 7th generation Full Gate IGBT which consists of a monolithically integrated sense-emitter component. The Full Gate chip structure is utilized to reduce losses. SC (Short Circuit) protection is established using the sense-emitter which aids in detecting the collector current (accordingly an appropriate trip level is assigned). An on-chip Tj sense diode is integrated to detect an over-temperature event on each IGBT chip.

Innovative Module Concept :

➢ Built-in failure detection and Fo output signal.

➢ Robust packaging using IMB (Insulated Metal Baseplate)structure and SLC (Solid Cover) technology to ensure superiorthermal cycling behavior while providing low thermal resistance.

➢ Flexibility in busbar design in the small pkg (A Pkg) : The straightterminal and L shape terminal layout are possible.




Phone +49 (0) 2102 486 0

Fax +49 (0) 2102 486 7220


May

20

17

Sense Emitter

Tj Sense Diode

VF=f(Tj)

➢ Switching speed control using the sense-emitter : An innovativeswitching speed control can be established depending on theactual value of the collector current Ic. This means - a reducedspeed (for Low EMI) turn-on at low Ic values and a high speedturn-on (low turn-on loss) at high Ic values can be achieved. Thisapproach delivers a higher inverter efficiency while simultaneouslyensuring good EMI performance during operation.




PowerTransmission

X Series: High-Voltage IGBT ModulesIndustrial-Leading Power and Operating Temperature RangeHigh-power modules are essential for power systems that require large capacity, high reliability and maximumefficiency. Mitsubishi Electric's first HVIGBT module, which was commercialized in 1997, enabled thedevelopment of larger capacity and smaller sized high-voltage converter systems. The X-Series HVIGBT modulesfeature 7th-generation insulated gate bipolar transistors (IGBT) and relaxed field of cathode (RFC) diodes.

Product Advantages Power loss reduced by incorporating 7th-generation IGBT

and RFC diode Current rating increased by 50 % compared to conventional

package Latest package technology enhances power cycle lifetime Package compatible to previous H and R series for simplified

design and easy replacement 150 °C maximal operation temperature

Besides state-of-the-art chip technology, the new X Seriesoffers two packages. A small 130 mm package allows compactconverter design and a 190 mm package is compatible to theprevious H and R Series. As key technologies the X Seriesprovides a 1.5-times higher current rating than H Series and, asworld’s first for the 6.5 kV class, 150°C maximal junctiontemperature.

Railway

CircuitCircuit

Diagram

Package

Size1700 V 3300 V 4500 V 6500 V

CM1200HC-66X CM900HG-90X CM600HG-130X

1200 A 900 A 600 A

CM1800HC-66X

CM1800HG-66X CM1350HG-90X CM900HG-130X

1800 A 1350 A 900 A

CM1500HC-90XA CM1000HG-130XA

1500 A 1000 A

1in1

1in1

130mm x

140mm

190mm x

140mm


Package Technology




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Chip TechnologyThe 7th-generation IGBT with carrier-storeeffect and RFC diode reduce the power lossby about 20 %. This leads to either a higheroutput power or a more compact converterthrough higher switching frequency.Moreover, the optimized edge terminationstructure LNFLR (Linearly-Narrowed FieldLimiting Ring) allows an increased activechip area of 28 % compared to previousproduct. Furthermore, as first in the world,Mitsubishi Electric achieves 150 °C junctiontemperature for the 6.5 kV class.

The X Series offers two different packagesizes. A compact 130 mm x 140 mmpackage allows compact converter design.Furthermore, another larger package with afootprint of 190 mm x 140 mm iscompatible with the previous H and RSeries. For this package, the current ratingcan be increase by 50 % compared to theprevious series. This is achieved through theimproved chip technology and a reductionof the thermal resistance by approximately10 % compared to the R Series.Moreover, the power cycle lifetime isimproved by an optimized wire bondingapproach and improved packagingtechnology.

May

20

17


Railway

LV100 type X Series : High-Voltage IGBT ModulesMore Flexibility through Standardized Package

The newly developed next-generation power module called LV100-type X-Series HVIGBT module for traction andelectric power applications in heavy industries features higher power density and efficiency for inverters.Moreover, it offers a standardized package that allows a flexible design of inverter systems. Samples of the 3.3kVversion of the LV100-type X-Series HVIGBT module (CM450DA-66X & CM600DA-66X) are available. The line-upwill be extended by 1.7kV, 3.3kV (HV100), 4.5kV and 6.5kV versions from 2018 onwards.

Product Advantages Power loss reduced by incorporating 7th-generation

IGBT and RFC diode Contributing to high energy efficiency and high

power density by improving package technology for low parasitic inductance and thermal resistance

LV100 and HV100 modules have a common package foot print

Simple, standard connections allow for optimal system design and a range of current ratings

CircuitCircuit

Diagram

Package

Type1700 V 3300 V 4500 V 6500 V

CM450DA-66X

LV100 450 A

V iso = 6 kVCM600DA-66X

600 A

HV100V iso = 10 kV

900 A

450 A 330 A 225 A

2in1

2in1


Package Technology




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Chip TechnologyLV100-type X-Series HVIGBT module use the same 7th-generation IGBT anddiode as the new X Series including carrier-store layer and RFC.The optimized N buffer achieves the operation at higher temperatures of150 °C. Moreover, the optimized edge termination structure LNFLR(Linearly-Narrowed Field Limiting Ring) allows an increased active chiparea of up to 28 % compared to previous products.

LV100 and HV100 modules have a standardized package design with a size of 100 mm x 140 mm x 40 mm. Thisallows manufacturers of industrial electronics simplified design, improved scalability for system configurationand secure multiple sources for inverters.For the first time, aluminum is used as base-plate material in HV modules. It offers compared to classicalmaterials, like AlSiC, a higher thermal conductivity and less weight. A new insulating material is introducedwhich increases the power-dissipation capability of the package further. Overall, this allows converter designswith increased output power and higher power density while the stress on thermal cycling is reduced.

May

20

17

New base plate results in higher thermal conductivity between junction and case and an increased thermal-cycling performance

E

C

G

N- drift

N

P

N+ P+

NP

Chip structure improving maximal temperature range

7. AlSiC base plate6. Pb-Sn solder5. Al metallization4. AlN substrate3. Al metallization2. Pb-Sn solder1. Si chip

7. Al base plate

4. AlN substrate3. Al metallization2. Pb-Sn solder1. Si chip

Compared to previous product*, active chip area is increased 28 % by optimizing edge termination.* CM750HG-130R


T-Series IGBT Modules – Standard-Type

Product Advantages

Low-loss 7th generation CSTBT™ Low package inductance Low internal electrical resistance High thermal conductivity Compact size Wide power range Light weight

The new Mitsubishi Electric 7th Generation Standard-Type IGBTs for 650V, 1200V and 1700V have beendeveloped for the purpose of highest power density inverters and best-in-class thermal behavior. The new 7th Generation CSTBT™ and diode chip set provides high efficiency by reducing both dynamic and static losses. The innovative TMS packaging technology provides very low thermal impedance, low package inductance and high thermal cycling capacity. The new Mitsubishi Standard-Type modules facilitate a high performance and reliability and compact inverter design. The well established 34mm and 62mm package styles greatly simplify the design of medium power inverters for various applications like industrial drives, wind power, solar power and UPS. The newly introduced 48mm package for 300A and 400A rated currents enables a more compact inverter size than with comparable modulesin 62mm outline. The 62mm package is a defacto standard in the market since many years. The 7th Generation extends the ratedcurrent range of this 62mm standard package, pushing its limits from previously 450A/1200V to 600A/1200V. This gives advantages in terms of operational inverter power, efficiency, reliability and even switching frequency.

Industrial Wind Solar

User benefits Achieved by

High thermal cycling capability by new TMS-Technology

reduced "pump-out"-effect by symmetric TMS construction

Reduction of assembly costs PC-TIM (pre-applied Phase Change Thermal Interface Material)

production lot-independant paralleling capability

Increased power density for Low loss 7th gen. Chipset

- less cooling effort increased active area by common substrate layer

- higher load conditions Low thermal resistance Rth(j-c)

high energy efficiency Low losses by reduced package inductance due to laminated main

terminals

Scalable platform concepts full power rating line-up of 650V and 1200V modules up to 600A

Extended module life time

Circuit Topology Package outline Package size 650V 1200V 1700V

100A 100A 75A

150A 150A 100A

200A

300A 200A 150A

400A 300A 200A

450A 300A

600A 600A 400A

450A

600A

2in1 D

34mm x 94mm

48mm x 94mm

62mm x 118mm

2in1AC switch

C162mm x 118mm




TMS (Thick-Metal-Substrate)-Technology

The newly introduced TMS-Technology is a packagingtechnology developed for realizing low inductance and very high thermal conductivity. Instead of the conventional packagestructure with several ceramic subtrates soldered to a copperbaseplate, the Thick-Metal-Substrate contains a high thermal conductive silicon nitride ceramic with thick copper layersbrazed directly to the top and bottom sides.The thick copper layer underneath the IGBT chip provides lowlead resistance and thus allows a higher current density. At thesame time, it enables a better heat spreading directly next tothe chip. This, in combination with the elimination of thesubstrate solder, means that both the thermal resistance andtemperature cycling capacity are improved.The symmetrically stacked structure of the TMS- Technology prevents the typical bending of baseplates in operation. This improves the thermal interface between the module and theheatsink.Finally the total thermal resistance from junction to heatsink isreduced by more than half compared to conventional modules.

User-friendly by PC-TIM

The Standard-Type of 7th Generation IGBT modules is also available with Pre-applied Phase Change Thermal Interface Material (PC-TIM). The structure and consistency of Mitsubishi PC-TIM compliments theadvantages of TMS-technology and removes the need for applying thermal grease. By PC-TIM a very low thermal contact resistance is achieved. This feature enables a highly reliable mounting process even in harshenvironments and easy maintenance in the field.

newTMS-Technology Conventional Technology

7th Generation main terminalConnection Technology

Conventional Technology

The TMS contains one common substrate instead of multi substrate arrangements as used in conventionalmodules. This expands the effective mounting area for chips and by eliminating wire bond interconnections - theinternal stray inductance and lead resistance are reduced.

The main terminals are connected to the TMS by laminated internal bus bar with increased laminated area andultrasonic bonding. This reduces the package inductance by 30% and contributes to low lead resistance .




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T-Series IGBT Modules – NX-Type

Product Advantages

Low-loss 7th generation CSTBT™ SLC assembly technology Warpage suppression Tj,max of 175

oC for switching

operation Low-profile package Integral Thermistor

The Mitsubishi Electric 7th Generation NX-Type IGBTs greatly simplify the design of medium power inverters for various applications like industrial drives, wind power, solar power and UPS. Features such as an industry standard low profile package, significantly improved thermal impedance and very low loss, 7th Generation CSTBT™ technology facilitate a very efficient, economical and robust inverter design.The NX-Type line-up has been expanded up to 1000A/1200V and all new 1700V and 650V line-up of dual modules to suit a wider power range of applications. Design effort is minimized as the 7th Generation NX-Type employs the same standard packaging and features previously introduced for the 5th and 6th Generation NX-Type. The newly developed SLC-Technology of the 7th Generation NX-Type enables the design of inverters with higher output current, higher power density and improved reliability in both power and temperature cycling.

Industrial Wind Solar

User benefits Achieved by

High thermal cycling capability by Insulated Metal Baseplate (IMB)

pump-out free by matched thermal expansion coefficients

PressFit terminals

PC-TIM (pre-applied Phase Change Thermal Interface Material)

production lot-independant paralleling capability

Low loss 7th gen. Chipset

Low thermal resistance Rth(j-c)

Reduced package inductance by single pattern layout

scalable platform concepts full power rating line-up of 650V, 1200V and 1700V modules

Extended module life time

Reduction of assembly costs

Compactness and

extended power range

Circuit Topology Package outline Package size 650V 1200V 1700V

225A 225A

300A 300A 300A

450A 450A 450A

600A 600A 600A

800A

114mm x 110mm 1000A

100A 100A 100A

150A 150A 150A

200A 200A

100A

150A 150A

200A

35A

50A 50A

75A 75A

100A

75A

100A 100A

150A 150A

7in1 R62mm x 122mm

CIB M

45mm x 107.5mm

62mm x 122mm

2in1 D

62mm x 152mm

6in1 T62mm x 122mm


SLC (SoLid Cover)-Technology

SLC-Technology is a newly developed package technology combining a resin-insulated metal baseplate and hard direct potting resin.

The IMB (Insulated Metal Baseplate) combines an electrically insulating resin layer with a top and bottom side copper layer by direct bonding, thus eliminating thesubstrate solder layer and the baseplate. Less layers and matched thermal expansion coefficientslead to high thermal cycling capability, exceeding severaltimes the conventional capability. At the same time, the thermal resistance at same chip size is reduced by 30% compared to conventional modules having Aluminium-Oxide insulation.

The SLC concept utilizes one common substrate instead of multiple ceramic substrates. This approach expands the effective area available for mounting chips and eliminates wire bond interconections. Hence, the IMB is a key elementof the SLC-Technology for high power density and low strayinductance.

User-friendly design features

The NX-Type of 7th Generation IGBT modules line-up contains press-fit as well as solder pin types. The newly developed “needle eye”-pintype has a self adjusting shape for easy assembly.

The light weight package is also available as an option with applied PC-TIM. This removes the need to apply grease and achieves lower thermal contact resistance. Both features enable a highly reliable mounting process even in harshenviroments and easy maintenance in the field.




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new

The new NX-package has been developed with direct potting resin instead of silicone gel. This hard mold was designed to match the CTE (Coefficient of Termal Expansion) of the copper aswell as the insulation material ofthe IMB. Therefore the bi-metall effect is suppressed and the module offers warpage-free behavior effectivelypreventing the pump-out effect of the thermal interface material. This eanbles a long term reliable thermal connection to the heatsink.







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