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MIO-2261 Sales kitMI/O-Ultra (Pico-ITX SBC) Intel ATOM N2600/N2800
MIO-2261 Sales kitMI/O-Ultra (Pico-ITX SBC) Intel ATOM N2600/N2800
Embedded Stackable Board Computer
PM Victor.Huang
May, 30, 2012
MIO-2261 Compelling FeaturesMIO-2261 Compelling FeaturesIntel® Atom N2600/N2800 Pico-ITX SBC with 18/24-bit LVDS/ VGA/ LAN/Half-size Mini-PCIe/ 2COM/ 1 mSATA/ 4 USB2.0/MIOeIntel® Atom N2600/N2800 Pico-ITX SBC with 18/24-bit LVDS/ VGA/ LAN/Half-size Mini-PCIe/ 2COM/ 1 mSATA/ 4 USB2.0/MIOe
Intel N2600/N2800+ NM10, DDR3 1066 SO-DIMMN2600 1.66G / N2800 1.86G DC
Dual Core Processor with All Fan-less Design
Intel N2600/N2800+ NM10, DDR3 1066 SO-DIMMN2600 1.66G / N2800 1.86G DC
Dual Core Processor with All Fan-less Design
Support SUSI Access Supports Embedded Software API and Utility
WinCE7.0, XP, XPE, Win7,WES7,QNX,Vxwork Support
Support SUSI Access Supports Embedded Software API and Utility
WinCE7.0, XP, XPE, Win7,WES7,QNX,Vxwork Support
12V DC Power input ,Support DC power hot plug15KV Air ESD protection COM port designTVS design for power ESD/EFT protection
12V DC Power input ,Support DC power hot plug15KV Air ESD protection COM port designTVS design for power ESD/EFT protection
1GbE-Intel LAN/ HD Audio2 COM/ 4 USB2.0/ 1 mSATA/ 8-bit GPIO/ SMBus/I2C/
MIOe Extension / Half-size Mini PCIe
1GbE-Intel LAN/ HD Audio2 COM/ 4 USB2.0/ 1 mSATA/ 8-bit GPIO/ SMBus/I2C/
MIOe Extension / Half-size Mini PCIe
2018/Q4 Longevity2018/Q4 Longevity
Smallest SBC w/ 100x72mm size (same as 2.5” HDD)with MIOe extension flexibility
Smallest SBC w/ 100x72mm size (same as 2.5” HDD)with MIOe extension flexibility
Low Power Consumption (Kit TDP: 5~8W)DirectX 9, MPEG2 (H/W acceleration)
H.264/ VC1/ WMV9 (H/W Decode/Acceleration)
Low Power Consumption (Kit TDP: 5~8W)DirectX 9, MPEG2 (H/W acceleration)
H.264/ VC1/ WMV9 (H/W Decode/Acceleration)
Lockable DC Jack
Lockable DC Jack
Power connector
Power connector
MIO-2261 spec MIO-2261 spec
MIO-2261 Block DiagramMIO-2261 Block Diagram
Board Layout-Top Board Layout-Top
18/24-bit LVDS
DDR3 SO-DIMM Socket
2x RS-232
HD Audio
(Line-in, Line-out)
Power button
/HDD LED
/Power LED
VGA
Board Layout-Bottom Board Layout-Bottom
mSATA
MIOe
(SMbus, 2 x USB2.0, 2 x PCIe, line-out, LPC, 5Vsb/12Vsb)
SATA
1 GbE LAN2xUSB2.0VGA12V DC input
Inverter
SMBus
GPIO Half-size Mini PCIe2xUSB2.0
LCD Power Selection
/Auto Power On
MIO-2261 MIOe supported interfaceMIO-2261 MIOe supported interfaceConsidering most demands from customer and future chipset trends (~2013Y new platforms)Considering most demands from customer and future chipset trends (~2013Y new platforms)
Interface Number MIO-2261 Supports
Functions can be
Display port 1 Yes HDMI, LVDS, DVI, CRT or eDP display interface…
GP PCIE 4 Yes (2 x PCIex1)
Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion…
USB 3.0USB 2.0
12
N/AYes
Super speed storage, capture card, HD Webcam & display interface…
LPC 1 Yes Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port from LPC I/O…
HD Audio(Line-Out)
1 Yes Line out, keep flexibility with selected amplifier…
SMBus 1 Yes Implementation for GPIO control, Smart battery/ Charger, W/R EEPROM or System communication…
Power Control 3 Yes
Reserved Yes
VCC +12VSB Yes 2A for MIOe module
VCC +5VSB Yes 3A for CPU board and MIOe module totally
GND Yes
Order InformationOrder Information
Packing ListPacking List Embedded OS/APIEmbedded OS/API
Coast Line (Rear IO)Coast Line (Rear IO)
Model Rear I/O Photo
MIO-2261N-S6A1E
MIO-2261N-S8A1E
LAN + 2USB + VGA
MIO-2261
(by request)
LAN+ 2USB + VGA + DC Power Jack
Thermal Solution Thermal Solution Model MIO-2261N-S6A1E / MIO-2261N-S8A1E
Photo
Description CPU Heatsink Dimension: 99.5(L)* 70.5(W)*15.7(H)mmTotal height including CPU board + heatsink is 33.48(H)mm
Model
Photo
Description
Standard Thermal Solution
Optional Thermal Solution
Heat Spreader Dimension: 99.5(L)* 70.5(W)*11.2(H)mm Total height including CPU board + heat spreader is 29(H)mm
MIO-2261 Advanced TechnologyMIO-2261 Advanced Technology Intel Atom Cedar Trail Ultra Low Power Solution
Ultra Low Power Consumption, all comes with Dual Core processors: N2600 1.66G Dual Core: TDP of Intel bundle kit is 5 Watts N2800 1.86G Dual Core: TDP of Intel bundle kit is 8 WattsFan-less Design: All Fan-less low profile heatsink design
Multiple Display Support & H/W Decode Dual independent display : VGA + 18/24-bit LVDS Support additional 48-bit LVDS, HDMI , or DisplayPort through MIOe eDPGraphic Engine and H/W Decode: DirectX 9 and OpenGL3.0 support Hardware decode H/W acceleration: MPEG2 H/W Decode/Acceleration: H.264/ VC1/ WMV9
DC Power Hot Plug Protection Design Good to protect board in case direct power in and damage the board and system.
COM Port 15KV ESD Protection Design TVS (Transient Voltage Suppressor)design for power ESD/EFT
protection
Design for Ruggedize Solution--- Advantech MIO-2261Design for Ruggedize Solution--- Advantech MIO-2261• MIO-2261 is designed with 100% Solid Capacitors (固態電容 )
Wide temperature design and test criteria: Power/ Clock generator/ Sequence PCB Type: TG-150 as PCB type, much reliable in high temperature environments.
• Rugged Design on Selected Components
Higher tolerance for high frequencies & high temperature With better MTBF compared with Electrolytic Capacitors No more exploding capacitors More reliable solution if using Solid capacitors than Electrolytic capacitors
• High ESD Protection for RS-232 I/O Pins to ±15kV
IEC61000-4-2 Air Gap Discharge: ±15kV IEC61000-4-2 Contact Discharge : ±8kV Human Body Model: ±15 kV
Reliable Power DesignReliable Power Design
The power tolerance range is 12V +/-10% MIO-2261 is designed with Power Hot Plug protection IC
design– To avoid pulse current to damage the board when DC power hotplug
directly
MIO-2261 DC Power adapter
Performance benchmark (CPU Arithmetic Benchmark-ALU, FPU)Performance benchmark (CPU Arithmetic Benchmark-ALU, FPU)
MIO-2261(N2800 1.86GHz)
MIO-2261(N2600 1.66GHz)
PCM-3362 (N450 1.6G)
Sliverthrone XL (Z530 1.6G)
Intel Tunnel (E660 1.3G)
+ 16%
+ 96%
+ 104%
Performance benchmark (Processor MultiMedia - Integer, Float Point)Performance benchmark (Processor MultiMedia - Integer, Float Point)
MIO-2261(N2800 1.86GHz)
MIO-2261(N2600 1.66GHz)
PCM-3362 (N450 1.6G)
Sliverthrone XL (Z530 1.6G)
Intel Tunnel (E660 1.3G)
+ 17%
+ 94%
+ 102%
0
2
4
6
8
10
12
MIO-2260 (N455 1.66GHz)
MIO-2261(N2800 1.86GHz)
MIO-2261(N2600 1.66GHz)
Typical(Win. Idle Mode)
Max (Test in HCT1.2)
Power consumptionPower consumption
10.32 Watts9.6 Watts
9.12 Watts
7.68 Watts
5.5 Watts
4.2 Watts
MIO-2260(N455 1.66GHz)
MIO-2261(N2800 1.86GHz)
MIO-2261(N2600 1.66GHz)
Graphic Performance- 3DMark 2006 Graphic Performance- 3DMark 2006
N455 to N2600130% increase
N455 to N2800244% increase
MIO-2261(N2800 1.86GHz)
MIO-2261(N2600 1.66GHz)
MIO-2260(N455 1.66GHz)
Pico-ITX Competitor ComparisonPico-ITX Competitor Comparison
MIO-Ultra Target ApplicationsMIO-Ultra Target Applications
Machine Automation
POS/ KIOSK
HMI (Human Machine Interface)
Ultra Low Power Demand
Measurement Instrument
Portable Device
Medical
Home Automation
New Form factor MI/O-Ultra Introduction
New Form factor MI/O-Ultra Introduction
The SPEC on standard SBC can’t be fulfilled if need additional I/O change
The SPEC on standard SBC can’t be fulfilled if need additional I/O change
Resource: Need redesign PCB to fulfill the SPEC requirement
Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE.
Resource: Need redesign PCB to fulfill the SPEC requirement
Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE.
The customer needs a board easier for system integration
The customer needs a board easier for system integration
The customer hopes to keep domain knowhow through easier way
The customer hopes to keep domain knowhow through easier way
Time to MarketTime to Profit
Time to MarketTime to Profit
Less cabling: less problems and cost on assembling.Concentrated thermal design: make thermal design
be easier in customer’s system integration.
Less cabling: less problems and cost on assembling.Concentrated thermal design: make thermal design
be easier in customer’s system integration.
Documentation: customer can keep domain knowhow to design their own I/O module by referring to Advantech design guide & SPEC.
Documentation: customer can keep domain knowhow to design their own I/O module by referring to Advantech design guide & SPEC.
Save development schedule and cost: Choose one platform based on MI/O Extension structure, just change I/O module can approach different applications in a short time.
Save development schedule and cost: Choose one platform based on MI/O Extension structure, just change I/O module can approach different applications in a short time.
Why a New Form Factor – MI/O Extension- Takes New Position between SBC and COM
Positioning on Different SolutionsMI/O Extension Single Board Computer Computer On Module
Readiness 100%(I/O module only by demand)
100% 60~80%(Need bundle carrier board )
Flexibility Middle Low High
RD Resource Low ~ Middle(design I/O module if needed)
Low High(design carrier board)
Pricing Middle Middle High
Develop Schedule
Short ~ Middle Short Long
Dimension 146*102mm100*72mm
146*102mm Q7, ETX, COM-Express, COM-Ultra...
Keep domain knowhow
Yes(design I/O module)
No Yes(design carrier board)
Target customer
Only lack few I/O interfacesSensitive on pricing
Tight development scheduleWith RD ability who can
design I/O module.
Need single board solutionNeed wide-range choices
Time to Market
Complicated SPEC demandWith exists COM carrier boardWith senior RD ability who
can design power sequence and I/O functions.
MI/O Extension FeaturesMI/O Extension Features
Product Line PositioningProduct Line Positioning
MI/O-Ultra Market PositionMI/O-Ultra Market Position
Ultra Small Size (100x72mm)Flexibility from M/O Extension Competitive price with simple I/OUltra Low Power (<8W)Easy for System Integration 20% size reduction of PC/104
Ultra Small Size (100x72mm)Flexibility from M/O Extension Competitive price with simple I/OUltra Low Power (<8W)Easy for System Integration 20% size reduction of PC/104
Portable DeviceSmall HMI/PPCEmbedded Instrument In- vehicle Home Automation
Portable DeviceSmall HMI/PPCEmbedded Instrument In- vehicle Home Automation
Smallest Size SBC with Maximum Flexibility Smallest Size SBC with Maximum Flexibility
MI/O Extension-Ultra (Pico-ITX) MI/O Extension-Ultra (Pico-ITX)
Install MIOe moduleFlexibility and unified multiple
interfaces
Heat-generated parts on TOPEasy to make thermal solution
Right angle connectorEasy system integration and cabling
Install Heat Spreaderconduct heat to chassis cover for
better thermal solution
Easy system integrationUltra small from factor w/ 100x72mm sizeHeat-generated parts on TOPRear IO and connector on BOTUnified rear IO with less cablingOptional heat spreader
Flexibility from MIOe extensionSecure core knowledge on MIOe modulesMIOe extension design guide for referenceUnified multiple interfaces Less design effort
,
Heat Spreader
Right angle connector
Unified rear IO
MIOe extension
RAM Module
Heat-generated parts
Comparison with other SBCsComparison with other SBCs
Items
MI/O Extension-Ultra series(PICO-ITX)
PC/104 Series 3.5" Small form factor
Dimension100*72mm
(20% reduction of PC/104 size)96*90mm 146*102mm
Coast Line Yes No Yes
System Integration Simple Complex Medium
Pricing LowHigh
(PC/104 connectors are expensive)Medium
Flexibility High Low Medium
Anti-Vibration MiddleHigh
(Good with salf-stacking long pin andmounting holes)
Medium
Extended Temperature No Yes Yes
Ruggedized Support Low High Medium
Power Consumption Ultra Low power (<8W) Ultra Low power/ Low power (<10W) Low power (<15W)
Expansion
MIOe(PCIe,
DP,USB2.0/3.0,SMBus,LPC,Audio,S3/S5, Power,reset)
Lagacy PC/104 or PCI-104Lagacy PC/104, PCI-104, or
MIO/160(PCI/USB2.0/PCIe/LPC/SDVO/Smbus/Power)
iManager Support No Lite version Yes (support after PCM-9364 and 9389)
Power Type AT 12V+/- 10% AT 5V+/- 5% AT 12V+/- 10% or 5V+/- 5%
ApplicationsPortable device
Small HMI/Instrument/PPCFlight or car entertainment
TransportationFactory AutomationOutdoor applications
TransportationFactory Automation
MedicalDigital Signage/ PPC
Flexibility PossibilitiesFlexibility Possibilities
MI/O B
MIOe Module A
MIOe Module B
MI/O Extension SBC+ MIOe Expansion Module = Vertical Applications
Your own MIOe design !
MIOe Module C
MI/O A
Unified MIOe for MIO Extension SBCUnified MIOe for MIO Extension SBC
Interface Number Functions can beDisplayPort 1 HDMI, LVDS, DVI, CRT or eDP display interface…
PCIe x 1 4 Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion…
USB 3.0USB 2.0
1 01 2
Super speed storage, capture card, HD Webcam & display interface…
LPC 1 Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port from LPC I/O…
HD Audio (Line-Out) 1 Line out, keep flexibility with selected amplifier…
SMBus 1 Implementation for GPIO control, Smart battery/ Charger, W/R EEPROM or System communication…
VCC (Power) +12VSB
VCC (Power) +5VSB
GND
Interfaces are considered including most demands from customer and future chipset trends Interfaces are considered including most demands from customer and future chipset trends
or
MIO PositioningMIO PositioningEasy
System Integration
Minimum Design Effort
Secure CoreKnowledge
Compact Chassis Design
Flexibility/Vertical Market
Cost Effective
MIOMIO
SUSIAccessSmart Access To Embedded Devices
SUSIAccessSmart Access To Embedded Devices
DeviceMonitoring
SystemRecovery
RemoteConfiguration
22
11
33
Integrated Device Monitoring, Configuration & System Recovery
Core FeaturesCore Features Centralized Device Monitoring
– Collects all embedded device data – Displays data in a customized dashboard – Auto notifies errors via warning popups and e-mail alerts
Integrated Remote Configuration – Remotely adjust embedded device settings – Transfer files to a remote device for firmware or application updates – Remote diagnostics via screen captures, hardware log analysis, and
windows XP event log files One-Click System Recovery
– Back-up complete system and files any time – Restore a system – Smart back-up saves images to offsite FTP
Centralized Device MonitoringCentralized Device Monitoring
On CPU/SYS Temp, Fan Speed, Voltage & Modules
Integrated Remote ConfigurationIntegrated Remote Configuration
For Power On/Off, Display, Volume & File Transfer
Advantech Peripheral Modules SolutionAdvantech Peripheral Modules Solution
Peripheral HighlightsPeripheral Highlights
• PATA/SATA/USB• Full Range• Wide Temp.
• Wide Temp.• 30u Plating• Fix Die• Thermal Sensor
• 7 years Longevity• Wide Temp.
• Wide Temp.• High Brightness• Various Interface
SQFlash SQRAM Wireless Touch/Display
SQFlash – Smart & Quality Flash ModuleSQFlash – Smart & Quality Flash Module
Leading Technology• Fragment Writing – better endurance, performance• GuaranteedFlush – robust mDDR cache• Power Failure Protection • OS Mutual – High random access
Full Range Interface/Form Factor• PATA, SATA, CF, CFast, USB, mPCIe, SD• Wide Temp. modules for both SLC & MLC• Flexible firmware and software customization• Security features
SQRAM – Smart & Quality Memory ModuleSQRAM – Smart & Quality Memory Module
Rugged Specification• Fixed Die with Samsung memory chip• Extra-thick 30u" gold-plated contact pins• Stable operation in extreme temp. (-40° to 85ºC)• Industrial grade capacitors ensure voltage stability• Thermal Sensor & software package
Sorting Mechanism• 10G vibration• Low temp. (-40 ℃) & high temp. (+85 ℃) burning• Thermal shock stress test• VDD, Frequency Margin test• Power Cycling, application test
Embedded Wireless ModuleEmbedded Wireless Module
Industrial WiFi Module• 7 years longevity • Stable operation in extreme temp. ( -40° to 85ºC) • Cisco CCX 4.0 certified• Seamless roaming between respective APs• Support Intel Active Management Technology 7.0• Industrial leading power consumption• Multiple OS support
Full Range Solution/ Interface/ Form Factor• Frequency band: 2.4GHz and 5/2.4GHz• Data Rates: 802.11n 1T1R, 2T2R and 3T3R• Form Factor: Full-size and Half-size mini PCIe, mini PCI and USB• Signal Protocol: PCIe, PCI and USB• Solution type: WiFi module and WiFi + Bluetooth module
Industrial Display add-in Touch SolutionIndustrial Display add-in Touch Solution
Rugged Display Solution • Full range of size support from 5.7” to 42” • Wide operation temp from -20~ 70 degree C• IP54 rating for water and dust proof (ITM series)• Backlight MTBF support of 50K hours
Touch enhancement • 5 years longevity• Widely Input flexibility • Various interface for each application
Thank You
Contact product manager for any further information [email protected]
Thank You
Contact product manager for any further information [email protected]