Mini ITX Mainboard D2703-S - inpc.com.ua · Mini ITX Mainboard D2703-S General Information Andreas Ertel, Peter Hoser Augsburg, 28.01.2008. Agenda ... P Premium Mainboard ECN Engineering

Mini ITX Mainboard D2703-SGeneral Information

Andreas Ertel, Peter Hoser Augsburg, 28.01.2008

Agenda

n FSC Industrial Mainboard Roadmap

n Supported CPUs & AMD platform and embedded Roadmap

n D2703-S and Accessories

n Extended Lifetime and Revision Control

n Reasonable System Configurations & Field of Applications

n Competitive Analysis

FSC_Desktop_Mainboard_Roadmap_2007_12_V1.ppt 12/2007 © Fujitsu Siemens Computers 2007 All rights reserved3

Industrial Mainboards

Q12010

Q4Q3

XLTEOLLGA775i945GD2151-SµATXIP

XLTEOLLGA775i945GD2156-SATXIP

Q2200920082007Mainboard

PL 2)LGA775Intel nextgenerationD2831-SµATXIP

PL 2)LGA775Intel nextgenerationD2836-SATXIP

PL 1)SASocket S1ATI/AMDD2703-SMini-ITXIP

Q1Q3Q1Name Q4Q2Q4SocketChipsetSeries

Note: Min. forecast quantity required for XLT1) Shipments expected from M01/082) Launch expected for early Q4/2008

All mainboards RoHS compliant

P Premium Mainboard ECN Engineering Change NotificationV Value Mainboard LAO After Last Assured Order date, orders can only be accepted based upon availability. SA Samples are available about 4 weeks ahead of launch date. Orders placed on LAO date are binding. Delivery is possible up to 8 weeks after LAO.PL? Product Launch: Date is not yet confirmed. EOL The product has End Of Life and can no longer be ordered. The date listed is the last month of availability. PL Product Launch: Date is confirmed. Mainboard in production

XLT: 12-24 months extended availability after EOL

Agenda







Platform Socket S1 Low-PowerProcessor Longevity Roadmap

embedded until end of 2011!

embedded until end of 2011!

Platform Socket S1 Low-PowerProcessor Features

Embedded Socket S1 Low-PowerProcessor Longevity Roadmap (Planned)

For detailed ordering information, please refer to applicable ACN/EOL notification distributed by AMD Business Operations.

2007 2008 2009 20112010 2012 2013

AMD Turion™ 64 Mobile Processors

Mobile AMD Sempron™ Processors

“Tylor” – 1.6GHz 31W Socket S1 Dual-Core Processor TL-52

“Keene” – 1.8GHz 25W Socket S1 Single-Core Processor

Last Orders through Last Time Ship

Two year contractual extension possible

ACN to announce EOL

Production

“Sherman” - 1.0GHz 8W Lidless Socket S1 Single-Core Processor

“Sherman” – 2.0GHz 25W Socket S1 Single-Core Processor

3500+

2100+

3700+

AMD Sempron™ Processors “Keene” - 9W 1.0GHz Lidless Socket S12100+

“Tyler” – 1.8GHz 31W Socket S1 Dual-Core Processor TL-56“Tyler” – 2.1GHz 35W Socket S1 Dual-Core Processor TL-62

Embedded Socket S1 Low-PowerProcessor Features

AMD Embedded Client Chipset Production Schedule

216-EVA6CVA12FG100-CG1408Q1 2012Q3 2011Q1 2011Q4 2007Oct 2007M690E

100-CG1291

100-CG1292

OPN CodeModelDVT SampleAvailability

ProductionAvailability

ACN toAnnounce EOL

Last Orders Last Ship Part Marking

M690T Now Q1 2007 Q1 2011 Q3 2011 Q1 2012 216-TQA6AVA12FG

SB600 Now Q1 2007 Q1 2011 Q3 2011 Q1 2012 218-S6ECLA21FG

Note:Embedded components offer 5 year longevity with the option of purchasing anextended 2-year supply (via contract) beyond the standard 5 year offering.

Agenda







FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 © Fujitsu Siemens Computers 2007 All rights reserved11

Specification

n Mini-ITX for Industrial Applications, up to 60°C

n AMD Mobile Socket S1g1o AMD Mobile Turion™ 64 X2 / Sempron™o Up to 35W; HyperTransport™ 1 - 800MHz

n DDR2 800/667 SDRAM, Dual Channel, 2 x SO socket

n ATI Radeon X1250 graphics; VGA / DVI & LVDS support (up to 256MB)

n 1 x PCI, 1 x PCIe x1, 1 x CF, 8 x USB 2.0, 4 x SATA 300 / RAID, 1 x IDE

n Dual LAN 10/100/1000Mbit, High Definition Audio, Firewire

n 24V DC (via internal connector or external AC adapter) orinternal ATX Power Supply

D2703-S based on ATI M690E / SB600 Mobile Chipset


DVI / VGA Splitter CableT26139-Y3957-V201

Specification

n Simultaneous use of DVI- and VGAmonitor via DVI-I connector of D2703

n Cable length150mm (DVI output)220mm (VGA output)

Notes: DDC data only possible for DVI monitor!


DVI-I / VGA Adapter PlugOrdercode CFO:AD-005-E-ROHS

Specification

n Direct connection of VGA monitor toDVI-I output of mainboard D2703

n Adapter length: 45mm


Heatsink / Fan for AMD MobileOrdercode C26361-D6000-C100

Specification

n Aluminium heatsink with mountingbackplate for mainboard D2703

n Supports AMD socket S1, up to 35W

n Fan 60mm, ball bearing, max. 6.000rpm

n Connector 4pin PWM, cable length 50mm

n Sound level 20 db(A) – 46 db(A) max.

n MTBF ~ 50.000hrs


Heatsink (Fanless Design) for AMD Mobile Ordercode V26898-B883-V1/V10

Specification


n Supports AMD socket S1

n Designed for Sempron 2100+ (max. 9W)

Note: B883-V1 = Heatsink; B883-V10 = mounting backplate


PCI Risercard (Two PCI Slots)E318-A

Specification

n Released for mainboard D2703


PCI Risercard (One PCI Slot)D2704-A

Specification


Agenda







Extendend (XLT) lifetime at a glance

standard lifecycle

LAO EOL

3 month XLT Period

up to 3 years up to 2 years

up to 5 years

XLT Period up to 2 yearsquarterly price lists

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

Customer A

Customer B

Customer C

LAO

unbi

ndin

gfo

reca

st MOQ 500pcsbi

ndin

gfo

reca

stif

e.g.

a c

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is g

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to b

e di

scon

tinue

dprice

example

ECN and ECN+ Process at a glanceEngineering Change Notification

Name

D2703 S11 GS1

Version RevisionName: remains the same throughout the complete lifecycleVersion: changes only, if the feature set is changingRevision: can change more often, because of technical improvements

Start MPD2703-S11-GS1

ECN to GS2„minor change“announced via E-Mailstart shipping immediately

ECN+ to GS3, or from S11 to S21„major change“announced via E-Mailstart shipping after customer approval

GS1 GS2 GS2 GS3or S21

ship samplesmax. 4 weeks of testing

LAOold GS

GS3

Every customer has to decide in advance whether he wants to participate or not

Agenda







Reasonable Fields of Application for mini-ITX and D2703-S

Industrial Systems Business Systems Consumer Systems

Industrial PC

KIOSKPOS, POI,

Digital Signage

GamingCabinets

Medical Systems

1U EntryServer

Thin Clients

„Lifestyle“ PC

Home Server

Gaming „Cubes“

Media Center

Car PC

standard mid - highperformance solutions

fanless midperformance solutions

D2703-S

Mobile Sempron 2100+

TDP: 8W

Mobile Sempron 3600+ / 3700+ / 3800+TDP: 25 – 31 W or Turion TL-56 – TL68

TDP: 31 – 35 W

fanless low powersolutions

internal ATX PSUexternal AC adapter (24V) or

internal fanless PSUD2703-S does not require a DC-to-ATX convertor

PSU

main-board

CPU

active heat sinkwith PWM fan

by FSC

passive heat sink

by FSC

heatpipesolution adopted

to D2703-S

cool-ing

SO-DIMM 256MB - 8GB, Single Channel or Dual Channel DDR2 800/667 SDRAM, unbuffered, no ECCRAM

mini ITX chassiswith heat pipetechnology

Standard mini ITX chassiscase

Reasonable System Configurations

Standard mini ITX chassis

Overview Chassis for mini ITX

Contact person:Amy Lai [[email protected]]www.morex.com.tw

contact:AOpen HQ Ms. Claire ShiehTel:+886-2-77101168Mail: [email protected]

Jaromir BajgarEMKO Case A.G.Jaromir Bajgar [[email protected]]www.emko.cz

Dana LindeSilverStone Technology GmbHTel :+49 40 675931-18E-Mail /MSN: [email protected]

Tze ChiewChenbro Europe BVTel: +31 40 295 2045 Ext. 732http://www.chenbro.com

Sophie Chen [[email protected]]www.coolermaster.de

this is only a small overview on vendors of mini ITX chassis.FSC does not guarantee the mechanical fit of its mainboards D2703-S/A. Furhtermore FSC does not take any reliability on the products provided

by the named vendors. We kindly recommend to check first before purchase!.

mailto:[email protected]

http://www.morex.com.tw


http://www.aopen.com.tw


http://www.emko.cz


http://www.silverstonetek.de

http://www.chenbro.com


http://www.coolermaster.de

Overview 24V AC Adapter suitable for D2703-Sunder construction

Agenda







The miniITX Motherboard Market - Platforms

Price

Per

form

ance

+ low power consumption (9 – 25 Watt TDP)+ dozens of vendors with a wide portfolioo platform costs vary, depending on configuration o good performance, due to state of the art technology

+ acceptable power consumption (approx. 35Watt TDP)+ dozens of vendors with a wide portfolio+ high performance due to DualCore technologyo platform costs vary, depending on configuration

40$ 60$ 70 - 130$ 150 - 250$ 250$ - ??

+ low power consumption (3,1-20 Watt TDP)+ inexpensive platform costs (~100 USD CPU+MB)+ dozens of vendors with a wide portfolioo acceptable performance (from.. 533-1500 Mhz)

+ very low power consumption (0,8-5,1 Watt TDP)+ very low platform costs (approx. 40 USD CPU+CS)o companion solution (CPU integrated in Chipset)- low performance (from. 433-600 Mhz)

+ very low platform costs (~60 USD CPU+MB)o acceptable performance (1200 Mhz)o acceptable power consumption (27 Watt TDP)- BGA CPU not scaleable- limited expandability and functionalityD201GLY2AT

Competition Positioning Matrixhttp://wwwd.amd.com/catalog/salescat.nsf/shop?openform

Fujitsu Siemens Computers Albatron Albatron Axxtend Technology KINO KINO Kontron WINMATED2703-S KI51PV-754 KI690-AM2 Eagle III ( ASIS-6030 ) MI930/F KINO-690AM2 KINO-690S1 KT690/mITX A270

Chipset AM D M690E /S B600 NV IDIA C51P V G/nForce 430 A MD M690T/S B600 SiS 771CX/966 AMD M690T/S B 600 A MD M 690T/SB 600 A MD M690T/S B600 A MD M690T/S B600 AMD M690T/S B 600

CPU AM D Turion 64 X2,AM D Turion 64,A MD Sempron Mobile

AMD A thlon 64, A MD Turion 64, AM D S empron M obile

A MD Athlon 64, AM D A thlon 64 X2

AMD Turion 64 X2, AMD S empron Mobile

AMD A thlon 64 X2, A MD Athlon 64

A MD A thlon 64, AMD A thlon 64 X2

A MD Turion 64 X2, A MD Turion 64, AMD S empron Mobile

A MD Turion 64 X2,A MD Turion 64,AM D S empron M obile

AMD A thlon 64, A MD Athlon 64 X2

Sockel S1 754 A M2 S1 S1 A M2 S 1 S 1 AM2

Power Consumption max. 24V /5A 35 Wat t 90 Wat t 5V @4.9A , 12V @2.7A 5V @3.65A, [email protected] Voltage 12V internal or 24V DC

external A TX12V A TX 12V A TX ATX ATX 20 P INs 5V /12V A T/A TX 5V /12V AT/A TX A TX ATX

MechanicalHumidity 5-95% 10-90% 10-90% 0-90% 10-90% 5-95% 5-95% 10-90%op.temp 0-60 0-50 0-50 0-50 0-60 0-60 0-60 0-60 0-60

MTBF 200000 200000 200000Shock: 100g @ 11ms

Vibration: 1g (rms - 5 ~ 500Hz)

Memory SODIMM DIMMM S ODIMM SODIM M DIMM DIM M S ODIMM DIMM DIMMmax 8 GB 2GB 2GB 2GB 4 GB 2 GB 2 GB 32 GB 2 GB

Flash Com pact Flash Type II 4GB IDE Compact Flash Type II 4GB Compact F lash Type II

DisplayCRT 1600x1200 1280x1024 yes 1600x1200 1920x1440 1920x1440 1920x1440 2048x1536 1920x1440

LCD/DVI 2048x1536 1600x1200 2560x1060 1280x1024 2560x1600 2560x1600 1600x1200 2560x1600LVDS 2048x1537 1600x1200 1600x1200 2560x1600

18/24 B it, Dual Channel Dual Channel 18/24 Bit Dual Channel Dual Channel Dual Channel, 24-bitTV-Out NTS C, S-V ideo NTSC, P AL, SCA RT, HD,

Component, Composite S -V ideo

NTS C, PA L, S CA RT, S-video HD HD S -V ideo (optional) -

LAN 2 x GbLA N 1 x 10/100 + 1 x GbLA N 1 x GbLAN 2 x GbLAN 2 x GbLAN 2 x GbLA N 2 x GbLA N 2 x GbLAN 2 x GbLANTyp Realtek RTL8111C Broadcom Marvell Marvell + SIS 966 Marvell B roadcom B roadcom Realtek RTL 8111B Realtek

Input/OutputUSB 8 8 8 6 6 6 8 10 10PS/2 2 2 1 2 2 2 2 2

AudioDigital AC97, HD Audio, S /P DIF In S/P DIF in /out HD-Audio, S /P DIF in /out HD Audio, S/P DIF Out HD Audio A C97 A C97 HD Audio AC97

Analog Line In, Line Out Line Out Line Out Line Out, HS (Headset), Line In, MIC Line Out , L&R out, Center/LFE , Line In, CD in, MIC

Line Out, HS (Headset ), Line In

Line Out, HS (Headset), Line In

Line Out, Line In, MIC Line Out, Line In, MIC

COM 1 x ext 1 x ext 1 x ext 1 x ext 2 x ext RS 232 2 x ext RS 232 2 x int RS 232 2 x ext RS2321 x int 1 x int 2 x int 1 x ext RS232/RS 422/RS 485 1 x int RS232/RS 422/RS 485 1 x int RS 232/RS 422/RS485 1 x int RS 232/RS422/RS485 1 x int RS232/RS 422/RS 485

LPT 1 x int (P inheader)1 x int RS 232 1 x int RS 232 1 x int RS232

Digital I/O 8 Channel 8 Channel GP IO 8 Channel GP IO 8 Channel GPIO 8 Channel GPIO 8 Channel1394 2 - 2 - -

SlotsPCI 1 1 1 1 1 1 1 1 1

Mini PCI 1PCI x1 1 1 1 1

PCI x16 1 (used as x8)Mini PCI x1 1 1

DrivesPATA 1 2 1 1 1 1 1 1 1

SATA 150 4 4SATA 300 4 4 2 4 4 4 2

Raid 0,1,0+1 0,1,0+1,5 0,1,0+1 0,1,0+1 0,1,10 0,1,10 0,1,0+1Floppy 1 shared with LPT P inheader

SW W indows XP /XPe, Redhat Linux, Linux, W indows Vista, Other

Windows XP/XPe W indows XP/XP e Windows XP, Linux Windwos XP/XPe, W indowsServer 2003, Redhat Linux, W indows V ista, Linux Terminal

W indows XP W indows CE , W inodws XP /Xpe

W inodws® XPe, W indows® XP /XP e, Linux® , W indows® XP , W indows® Vista, V xW orks, Other

Windows XP /XPe, W indows Vista

Others Longlife components for 24/7 Supports HDTV 720i and 1080i HDM I Connector Supports 2D/3D engine and MP E G-2/1 video decoder4 Port RS 232 expansion with daughter board

Dual Independant Display S upport

V GA AND DV I on I/O

Full revis ion cont rol S CA RT header x 1 Battery Lithium 3V /220 mA H TP M onbaordExtended Lifet im e up to 5 years A MD XPC header for AMD XP C

moduleTin-plated P CB

http://wwwd.amd.com/catalog/salescat.nsf/shop?openform

Main Competitors

+ 24 V DC INcost savings for not requiredAC-to-ATX convertor board: ~ 30€

+ FW 1394b

KINO690S1D2703-S KT690/mITX

- no DC IN- no FW 1394

- no Raid??- no DC IN- no FW 1394

+ 4 x COM+ HDTV Out

+ TV Out S-Video+ TPM

Agenda






n The MiniITX Market

n Summary

Summary - Advantages using the D2703-S

n Start with a brand new product leads to a, at least 3 year, stable platform strategy

nWith “Extended Lifetime” up to 5 years of availability possible

n Scalable AMD platform opens the opportunity to use Images on different solutions

n Functionality headroom (LVDS, Firewire, CF usw.) for other applications

n Bundle opportunities with different AMD embedded CPUs

n Committed Revision Control Process for early announcements of technical changes

n Direct technical support contact with all clients

Mini ITX Mainboard D2703-AGeneral Information

Andreas Ertel, Peter Hoser Augsburg, 28.01.2008

Agenda

nFSC AMD Desktop Mainboard Roadmap

nComparison sheet between D2703-S and D2703-A

nD2703-A and Accessories

FSC_Desktop_Mainboard_Roadmap_2008_01_V1 01/2008 © Fujitsu Siemens Computers 2008 All rights reserved34

Mainboards for AMD processors

121110Q4/08

PLSAPCIe x16& on Board4x DDR2AM2+nVidia

MCP78BD2721-H 1)µBTXV

PL 2)SAPCIe x16& on Board4x DDR2AM2+nVidia

MCP78BD2721-AµBTXV

7Q3/08

8 9

EOLLAOPCIe x16& on Board4x DDR2AM2nVIDIA

C51PVGD2461-CµBTXV

Name

Q2/08Q1/08Mainboard654321VGARAMSocketChipsetSeries

All mainboards RoHS compliant

P Premium Mainboard ECN Engineering Change NotificationV Value Mainboard LAO After Last Assured Order date, orders can only be accepted based upon availability. SA Samples are available about 4 weeks ahead of launch date. Orders placed on LAO date are binding. Delivery is possible up to 8 weeks after LAO.PL? Product Launch: Date is not yet confirmed. EOL The product has End Of Life and can no longer be ordered. The date listed is the last month of availability. PL Product Launch: Date is confirmed. Mainboard in production

1) Dedicated model for Webhosting Applications (e.g. Dual Gbit LAN onboard, full AMD Opteron 12xx/13xx Support)2) Shipment expected from early 03/20083) Note: Mainboard will be provided w/o I/O shield, appropriate aperture in housing required!

PLVGA/DVI1x SOAMD S1ATI M690TD2703-A 3)M-ITXVMini-ITX „Thin Client“ Mainboard - For Projects only -

Update

Update

Update

Agenda




Feature Overview mini-ITX D2703

4 x4 xUSB 2.0 (external, rear connector)2 x--USB 2.0 (external, front connector)1 x2 xUSB 2.0 onboard (internal connector) 2)

1 x2 xGbit LAN onboard (Realtek)1 x1 xCF connector onboard--1 x (one drive)IDE onboard (e.g. for slimline optical drives)

xSATA II RAID-support (0, 1, 0+1)--4 x SATA II onboard--1 xPCIe X1 slot

1 x1 xPCI slot--2 xChassis fan support (4 pin PWM)--1Processor fan support (4 pin PWM)--xStandard ATX power supply option

+19V / 4A+24V / 5ASingle DC power supply option1 / Single Channel2 / Dual ChannelSO DIMM socket DDR2/667

Sempron, Single Core, max. 9WSempron / Turion, DualCore,

up to 35W Processor support

.-- 1)xATX I/O-Shield provided by FSC--xPCB: tin platingx--Designed for Thin Client Applications (8/5; fanless)--xDesigned for Industrial Applications ( 24/7; up to 60°C)

Thin CLientIndustrialD2703-AD2703-S

Feature Overview mini-ITX D2703

2) Note: Two channels per connector

1) Note: Required size extends standard ATX dimension; Chassis must provide required apertures

--stuffing optionMini-PCIe („Mini-Card“) supportstuffing optionstuffing optionTrusted Platform Module TPM V1.2

-- / ---- / --TV out support (internal / external connector)-- / ---- / --Parallel Interface support (internal / external connector)

----Floppy support (internal connector)--1 xLVDS backlight inverter support (internal connector)--1 xLVDS support onboard (dual channel, internal connector)--via FP connectorPower LED / HDD LED (internal connector)

1 xvia FP connectorPower switch (internal connector)--1 xFrontpanel (FP) connector (internal, 10 pin Intel-compliant)--1 xGeneral Purpose I/O (8 Bit, internal connector)--COM2COM connector internal

COM1, COM2COM1COM connector externalx / --x / --Stereo Audio / Multichannel Audio-- / --1 x / 1 xFirewire connector internal / external

--1 xS/PDIF out onboard1 x / 1 x-- / --Microphone / Headphone (external, front connector)

--xFrontpanel audio connectorThin CLientIndustrial

D2703-AD2703-S

Agenda




FSC_Desktop_Mainboard_Details_2008_01_V1 01/2008 © Fujitsu Siemens Computers 2008 All rights reserved39

n Mini-ITX “Thin Client”

n AMD Mobile Socket S1g1o AMD Mobile Low-Power Sempron™ 2100+ Processoro Max. 9W; HyperTransport™ 1 - 800MHz

n DDR2 667 SDRAM, 1 x SO socket

n ATI Radeon X1250 graphics; VGA & DVI support (up to 256MB)

n 1 x PCI, 1 x CF for Embedded OS, 8 x USB 2.0

n LAN 10/100/1000Mbit, High Definition Audio

n 19V DC Power Supply (via AC adapter)

n Designed for fanless operation

D2703-A based on ATI M690E / SB600 Mobile Chipset

Specification

Proprietary I/O Layout of D2703-AThe I/O layout of D2703-A is not fully compliant to ATX standard and therefore requires a proprietary solution for the chassis.

standard format of an ATX compliant I/O shield

does not cover the COM 2 connector


19V AC Adapter suitable for D2703-AS26113-E519-V15

Specification

n Released for mainboard D2703-A (not suitable for D2703-S which strictlyrequires 24V!)

n (20V, 3.25A, 65W)

n power chords:o EU version: T26139-Y2540-V100-*-Z111 o UK version: T26139-Y2540-V200-*-Z111


Heatsink (Fanless Design) for AMD Mobile Ordercode V26898-B883-V1/V10

Specification


n Supports AMD socket S1

n Designed for Sempron 2100+ (max. 9W)

Note: B883-V1 = Heatsink; B883-V10 = mounting backplate


PCI Risercard (One PCI Slot)D2704-A

Specification


Documents

Mini ITX Mainboard D2703-S - inpc.com.ua · Mini ITX Mainboard D2703-S General Information Andreas Ertel, Peter Hoser Augsburg, 28.01.2008. Agenda ... P Premium Mainboard ECN Engineering