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Form #: CSI-D-686 Document 004
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com
October 21, 2014 • Revision 1.1
MYXFC64GJDDN
Features• Tin-leadballmetallurgy• MultiMediaCard(MMC)controllerand64GB
NANDFlash• VCC:2.7–3.6V• VCCQ(dualvoltage):1.65–1.95V;2.7–3.6V• Typicalcurrentconsumption
� Standbycurrent:160μA
� Activecurrent(RMS):80mA
MMC - Specific Features• JEDEC/MMCstandardversion4.41-compliant(JEDEC
StandardNo.84-A441)-SPImodenotsupported(seewww.jedec.org/sites/default/files/docs/JESD84-A441.pdf)
� Advanced11-signalinterface� x1,x4,andx8I/Os,selectablebyhost� MMCmodeoperation� Commandclasses:class0(basic);class2(blockread);class4(blockwrite);class5(erase);class6(writeprotection);class7(lockcard)
� MMCplus™andMMCmobile™protocols� Temporarywriteprotection� 52MHzclockspeed(MAX)� Bootoperation(high-speedboot)� Sleepmode� Replay-protectedmemoryblock(RPMB)� Secureeraseandtrim� Hardwareresetsignal� Multiplepartitionswithenhancedattribute� Permanentandpower-onwriteprotection� Doubledatarate(DDR)function� High-priorityinterrupt(HPI)� Enhancedreliablewrite� Configurablereliabilitysettings� Backgroundoperation� Fullyenhancedconfigurable
� Backward-compatiblewithpreviousMMCmodes
• ECCandblockmanagementimplemented
Options Code
• Package(Sn63Pb37solder)
� 169-ballLFBGA BG(14mmx18mmx1.4mm)
• OperatingTemperature
� Industrial(-40°C≤TC≤+85°C) IT
MMC Controller and 64GB NAND FlashAdvanced information. Subject to change without notice.
Table 1: MLC Partition Performance
Condition MYXFC64GJDDN Units
Sequential write 20 MB/s
Sequential read 44 MB/s
Rando write 90 IOPs
Random read 1100 IOPs
Note:Businx8I/Omode.Sequentialaccessof1MBchunk;randomaccessof4KBchunk.Additionalperformancedata,suchaspowerconsumptionortimingfordifferentdevicemodes,willbeprovidedinaseparatedocumentuponcustomerrequest.
MicronPart.No.MTFC64GJDDN-4M
Form #: CSI-D-686 Document 004
Micross US (Americas) • 407.298.7100Micross UK (EMEA & ROW) • +44 (0) 1603 788967
MYXFC64GJDDN • MMC controller and 64GB NAND FlashAdvanced information. Subject to change without notice.
October 21, 2014 • Revision 1.1
Figure 1: 169-Ball FBGA (Top View, Ball Down)
Figure 2: 169-B all LFBGA 14.0mm x 18.00mm x 1.4mm (Package Code: DN)
Notes: 1. All dimensions are in millimeters.2. Solder ball material: Sn63/Pb373. Micron – MTFC64GJDDN-4M
