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Microproducts Breakthrough Institute Overview
Rich Peterson Ward TeGrotenhuisBrian Paul Terry HendricksGoran Jovanovic Dan PaloKevin Drost Pacific NorthwestChih-hung Chang National LaboratoryOregon State University
2
ONAMI Mission
Grow Oregon’s nanoscience and microtechnology innovation capacity to leverage outside investment:
• Compete nationally for research $$ growth via collaborations among OHSU, OSU, PNNL, PSU and UO
• Attract private capital to Oregon startups seeded by a professionally managed ONAMI “gap” fund
3
ONAMI Shared Facilities*
Nano-Materials Characterization Commercialization
*not an exhaustive list of OUS-based labs offering services/collaboration to industry
Microproducts Breakthrough InstituteAn ONAMI Facility – Jointly Operated by OSU/Pacific Northwest National Laboratory
Goals Provide basic science “infrastructure” to
support technology development of Microchannel Process Technology (MPT) and Microreactor-Assisted Nanomanufacturing (MANX)
Development of innovative “early” product and process technology for a wide range of public and private sector applications
Support of MPT and MANX education at OSU by enabling collaboration with industrial partners
Private sector partnering for the development of specific devices and technology suites
Economic development in the Pacific Northwest
Enabling High Technology Commercialization by Accelerating the R&D of Emerging Microchannel and Nanomanufacturing Process Technologies
DH
L
• Microchannel Array
Microchannel Process Technology
• Heat and Mass Transfer
Microchannel
Macrochannel
resavg
H
res
tVLD
D
t
2
2
micromacro AnA
where DH is the hydraulic dia. and D is the fluidic diffusivity
Micro Energy and Chemical SystemsHeat Exchanger Comparison
Parameter Units PNNL HX Commercial HX [1]
HX mass [2] Kg 5 70
HX volume [3] L 1.25 35
Duty Watts 3500 3500
Effectiveness % 87 <80
Side 1, Air dP in H2O
4.3 4.3
Side 2, Air dP in H2O
3.1 3.1
Parameter Units PNNL HX Commercial HX
HX mass [1] g 432 2285
HX volume [2] cm3 134 ~1278
Duty W 155 136
Effectiveness % 92.2 80.0
Side 1, Air dP psi 0.3 <1 psi
Side 2, Air dP psi 0.9 < 1 psi
[1] Mass does not include tubing connections.
[2] Approximate volume occupied by heat exchanger.
Microchannel Benefits
Attribute BenefitReduced Size Factor of 10-100 (volume); 5-50 (weight) – rapid heat and
mass transfer & inherent high surface area to volume
Safety Low flame propagation; low inventory; fast quench
Low Pressure Drop Reduced pumping power for same process duty
Good Reaction Control
Minimize undesirable side and back reactions; can process highly energetic reactions
Can be Gravity Insensitive
Orientation independence
High Integration Enables complex processes in single device with higher efficiency
Modular & Reconfigurable
Enhances reliability, configurable in broad range of capacities, enables incremental capacity growth, testing at small capacities and more predictable scale up
Mass Production Microlamination approach suits mass production
Microfluidic Technology
Microchannel Process Technology (MPT)Micro Total Analysis Systems (µTAS)
BIOMEDICAL
MEMS
CHEMICAL
BIOLOGICALCHEMICAL
ENERGY
Cell sorting
DNA Diagnostics
Inkjet Print Heads
Drug Delivery
MicroelectronicCooling Automotive Heat
Pumps
Portable Power Generation
Fuel ReformingPoint-of-use
Nanomaterial Synthesis
BiodieselSynthesis
Lab-on-a-chip
ProteomicsSingle Cell Analysis
Cytosensors
KidneyDialysis
BiopolymerSynthesis
Water Purification
Person Portable Cooling
Blood Processing
At-Home Sensors
>> 100 mL/minpL or nL
higherlower
25 µm < Channel Height < 250 µm
Fluid Volume
Application Temperature
Channel Dimensions < 100 µm
Analytical Microfluidics Arrayed Microfluidics
Emerging Industry
Fuel Processing
Chemical Processing
Heating & Cooling
Nanomaterial Synthesis
Separations
life microsystems
200 µm wide channels
“Number Up” Channels
channel header
channels
Single Lamina
• Channels – 200 µm wide; 100 µm deep
– 300 µm pitch
• Lamina (24” long x 12” wide)– ~1000 µchannels/lamina
– 300 µm thickness
Patterning: • machining (e.g. laser …) • forming (e.g. stamping …)• micromolding
“Number Up” Laminae
• Laminae (24” long x 12” wide)– ~1000 µchannels/lamina
– 300 µm thickness
• Device (12” stack)~ 1000 laminae= 1 x 106 reactor µchannels
Bonding: • diffusion bonding• solder paste reflow• laser welding …
Patterning: • machining (e.g. laser …) • forming (e.g. stamping …)• micromolding
24”
12”
12”
12”
24”Cross-section of Microchannel Array
“Number Up” Devices
Bonding: • diffusion bonding• solder paste reflow• laser welding …
Interconnect• welding• tapping
24”12”
12”
Microchannel Reactor
Bank of Microchannel Reactors
(9 x 106 microchannels)• Device (12” stack)
~ 1000 laminae= 1 x 106 reactor µchannels
• Laminae (24” long x 12” wide)– ~1000 µchannels/lamina
– 300 µm thickness
Arrayed Microchannel Manufacturing Fab
3.0 FTE MBI staff currently exists
Supply Chain
Partners
MBI
MPT Research
Application Development
Business Assessment
Commerciali-zation
Commerciali-zation
Capability Development
Processes
New devices Biz partn
er
Platforms
Business partners
Industrial PartnersIndustrial Partners
0.3 FTE ONAMI Extension Director
Micreactor-Assisted NanomanufacturingGreener, Safer, Cheaper Processing of Nanomaterials
Oregon Process Innovation Center
3.0 FTE MBI staff currently exists
Nanotech Business Partners
MBI Buildout
PilotProduction
Proto-typing
TestTest
Current
Ph 2
ONAMI $9.5M Facilities• 14 labs + 16 offices• AMM pilot production• Infrastructure
Nanomfg Equipment• Oregon BEST • Novel Process Equip• Process Diagnostics
Capabilities
• Design Studio
• Fab– Shells– Surfaces
• Characterization
• Machine Shop
• Concept Development and Solid Modeling
– Solidworks• Functional Analysis and
Computational Fluid Dynamics– COMSOL (Finite Element)– Fluent (Finite Volume)
• Manufacturability Analysis and Thermal and Stress Analysis
– Abaqus (Finite Element)– Cosmos (Finite Element)
Capabilities
• Design Studio
• Fab– Shells– Surfaces
• Characterization
• Machine Shop
• Laser micromachining–Deep UV (266 nm)–UV (355 nm)–Green (532 nm)
• Isotropic etching• microEDM• Electrochemical etching• Electroforming• Microembossing• Nanoimprinting• Injection molding• CNC micromilling• Ultrasonic machining
Cour
tesy
of D
OE
NETL
Capabilities
• Design Studio
• Fab– Shells– Surfaces
• Characterization
• Machine Shop
• Diffusion bonding• Diffusion brazing• Diffusion soldering• Solder paste bonding• Laser transmission welding• Thermal adhesive• UV adhesive• Pressure-sensitive adhesive• Solvent welding• Ultrasonic welding
Courtesy of DOE NETL
10 20 30 40 50 60
Cou
nts
per
seco
nd
substrate
222
111
CdS
2 (degrees)
Capabilities
• Design Studio
• Fab– Shells– Surfaces
• Characterization
• Machine Shop
• Plasma Cleaning/Prep• Sputtering• Atomic Layer Deposition• Microreactor-assisted
Nanoparticle Deposition• Microreactor-assisted Solution
Deposition• (Molecular Beam Epitaxy)
Capabilities
• Design Studio
• Fab– Shells– Surfaces
• Characterization
• Machine Shop
• Laser scanning microscope• Contact profiler• Optical microscopes at all mags
with video/image capture• Gas chromatography• Liquid chromatography• Scanning electron microscope
Supplier Interactions
• Desired interactions– Microforming– Microbrazing– Adhesive bonding
Patterning:Feature Process
Blind cut PCMDrawing of metal foilsRoller embossing
Through cut
Laser cuttingPunch/blankAbrasive water jet
Bonding:Process CapabilityDiffusion brazing VHP (vendor) Shim coating DTE fixtureBrazing Braze dispense Braze foil Screen printing Forming gas oven Reflow oven Humpback furnaceSoldering Adhesive bonding Adhesive dispense
Screen printingLaser weldingUltrasonic weldingSpark plasma bonding
Current Vendor EngagementVendor Engagement Needed
Industry Partnership
Market Development
Technology Development
Technology Partners• Large companies• Technology “off-the-shelf”• Equipment, methods, platform technology
product licenses
Supply Chain Partners• Existing companies• Small & medium sized• Leverages capabilities
Process Development
apps
process licenses, manufacturability
research needs
Business Partners• Entrepreneurs• Marketeers• Existing businesses
product designs
Microproducts Breakthrough Institute
Industrial OutreachMonday, September 21,2009Tentative Agenda
1:00 – 1:10
Welcome and Introduction to the Workshop Kevin Drost, OSU, MBI
1:10 – 1:30
Significance of Microchannel Process TechnologyKevin Drost, OSU, MBI
1:30 - 1:50 Advantages of MPT Solutions Goran Jovanovic, OSU, MBI
1:50 - 2:15 Arrayed Microchannel ManufacturingBrian Paul, OSU, MBI
2:15 – 2:30
The MBI Alliance: Industry, National Labs and OSUDan Palo, PNNL, MBI
2:30 – 2:40
MPT OpportunitiesGoran Jovanovic, OSU, MBI
2:40 – 3:00 Break
3:00 – 3:20
Opportunity 1 – Microchannel Energy ApplicationsRichard Peterson, OSU, MBI
3:20 – 3:40
Opportunity 2 – Building TechnologiesWard TeGrotenhuis, PNNL, MBI
3:40 – 4:00
Opportunity 3 – Polysilicon ProductionGoran Jovanovic, OSU, MBI
3:40 – 4:00
Opportunity 4 – Sustainable NanomanufacturingBrian Paul, OSU, MBI
4:20 – 4:30
How Do You Connect to MBI and Transfer Technologies?Brian Wall, OSU Technology Transfer
4:30 – 5:00 Open Forum