MOSFET – from 2D to 3D

End of april 2018:

Samsung: 8 nm, 7 nm comming

Taiwan Semicond.Manuf.Comp.: 10nm, 7nm ready, 5nm (2019?)

Intel: 14 nm, 10nm comming (end 2018?)

Mat. Sc. Semicond..Proc. 70, 24 (2017)

LAB on a chip

Maskless lithography

Synchrotron Orbital Radiation (X-rays)

X-ray micromachining

Two-photon stereolithography