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7/27/2019 Micro Relay FT B3
1/11
n Features
lThese are at type ultra miniature (SMT), 5.20.2mm height
(through hole) relays for telecommunication and data
networking equipments, made of high heat resistant material,
which can support IRS and VPS methods.
l
Ultra slim and light weight with a 5.250.2 mm height andapproximately 0.8 g weight, and an 87mm2 mounting area.
Most suitable for decreasing size and weight, space saving
and high density packaging of equipment.
lContact spring has superb high frequency characteristics.
lHigh insulation design conforming to the Bellcore, FCC
standard, with a minimum of 1.6 mm between coil and
contacts insulation distance, an AC 1.5kV coil contact
withstand voltage, and a 2.5kV coil-contact withstand surge
voltage.
lHigh efcieny polar electromagnet structure implements
a140mW low coil power consumption. A power saving latch
type is also available.lGold-plated silver alloy bifurcated contacts having high
contact reliability.
lUL, CSA recognized. Conrms to IEC 60950, UL1950,
EN60950. Spacing & high breakdown voltage (Basic
insulation, 150 working volts, pollution degree 2).
lRoHS compliant since date code: 0431B8
Please see page 10 for more information
Ftr-B3 serIes
MINIature reLaY
2-CONtaCt 1a(FOr sWItCHING sIGNaLs)roHs comlin
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Ftr-B3 si
Remarks: Actual marking on relay would not carry code FTR and be as below:
Ordering code Actual marking
FTR-B3GA012Z-B10 B3GA012Z
Note: *: - Only surface mount types (G and S) are applicable
- All relays are packaged in tubes unles P/N ends with -B10
FTR-B3 G B 012 Z -B 10
[Example] (a) (b) (c) (d) (e) (f ) (g
)a( emaNseireS seireS3B-RTF
)b( epytlanimreT
elohhguorht:C
tnuomecafrus:G
TMSdecuder,aeragnitnuom:S
)c( noitcnufnoitarepOepytdradnats:A
)lioc1(epytgnihctal:B
)d( liocfoegatlovdetaR
CDV5.1:5.1 CDV5.4:5.4
0CDV3:300 CDV21:21
CDV42:420
)e( lairetamtcatnoC yollarevlisyalrevodlog:Z
)f( *noitceridgnisolcneyaleR noitceridgnisolcnedradnats:B
)g( *leerrepsyalerforebmuN )dradnats(000,1:01
n OrDerING INFOrMatION
7/27/2019 Micro Relay FT B3
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Ftr-B3 si
LEDOMliocdetaR
egatlov
ecnatsiserlioC
)%01(
gnitarepO
egatlov
esaeleR
*egatlov
rewopdetaR
noitpmusnoc
Z5.1A)(3B-RTF CDV5.1 1.61 V31.1+ V51.0+ Wm041
Z300A)(3B-RTF CDV3 3.46 V52.2+ V3.0+ Wm041
Z5.4A)(3B-RTF CDV5.4 541 V83.3+ V54.0+ Wm041
Z210A)(3B-RTF CDV21 820,1 V0.9+ V2.1+ Wm041
Z420A)(3B-RTF CDV42 405,2 V0.81+ V4.2+ Wm032
n COIL Data CHart
Standard type
Latching type (1 coil)
* Pulse driven
Note: All values in the table are measured at 20C.
* Pulse driven
Note: All values in the table are measured at 20C.
n saFetY staNDarD aND FILe NuMBersUL508, 1950 (File No. E63615)
C22.2 No. 14, No. 950 (File No. LR40304)
Please request when the approval markings are required on the cover.
Nominl volg Conc ing
0.5 A 125 VAC1.5 to 12 VDC 1 A 30 VDC resistive
0.3 A 110 VDC
liocdetaR
egatlov
ecnatsiserlioC
)%01(
teS
egatlov
esaeleR
*egatlov
rewopdetaR
noitpmusnoc
Z5.1B)(3B-RTF CDV5.1 5.22 V31.1+ V31.1- Wm001
Z300B)(3B-RTF CDV3 09 V52.2+ V52.2- Wm001
Z5.4B)(3B-RTF CDV5.4 302 V83.3+ V83.3- Wm001
Z210B)(3B-RTF CDV21 044,1 V0.9+ V0.9- Wm001
Z420B)(3B-RTF CDV42 008,4 V0.81+ V0.81- Wm021
7/27/2019 Micro Relay FT B3
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Ftr-B3 si
n speCIFICatIONs
continued
* Minimum switching loads mentioned above are reference values. Please perform the conrmation test with theactual load before production since reference values may vary according to switching frequencies, environmentalconditions and expected reliability levels.
metIepyTdradnatS epyTgnihctaL
A)(3B-RTF B)(3B-RTF
tcatnoC
tnemegnarrA CmroF2
lairetamtcatnoC yollarevlisyalrevodloG
epyttcatnoC )rab-ssorc(stcatnocdetacrufiB
ecnatsisertcatnoC )eulavlaitini( m57 mumixam, A1CDV6ta
gnitartcatnoC )evitsiser(A3.0CAV521,A1CDV03
tnerrucgnihctiws/gniyrracmumixaM A1
rewopgnihctiwsmumixaM W03/AV5.26
egatlovgnihctiwsmumixaM CDV022,CAV052
1*daolgnihctiwsmuminiM *Am10.0,CDVm01 1
ecnaticapaC
)stcatnocneponeewteb(Fp4.0yletamixorppA
)stcatnoctnecajda(Fp5.0yletamiorppA
*Fp0.1yletamixorppA 1 )stcatnocdnaliocneewteb(
lioC
)C02ta(rewoplanimoN Wm041 Wm001
)C02ta(rewopetarepO Wm08 Wm75
)tsorfon(erutarepmetgnitarepO C58+otC04-
emiT
eulaV
etarepO )ecnuobtuohtiw,egatlovlanimonta( mumixamsm3
esaeleR )ecnuobtuohtiw,egatlovlanimonta( mumixamsm3
noitalusnI
)CDV005ta(ecnatsiseR M000,1muminiM
cirtceleiD
htgnertS
stcatnocneponeewteb etunim1CAV000,1
tnecajdaneewteb
stcatnocetunim1CAV000,1
stcatnocdnaliocneewteb etunim1CAV005,1
egruS htgnertS
stcatnocneponeewteb ]86traPCCF[)s061x01ta(V005,1
tnecajdaneewteb
stcatnoc ]86traPCCF[)s061x01ta(V005,1
stcatnocdnaliocneewteb]86traPCCF[)s061x01ta(V005,1
]eroclleB[)s01x2ta(V005,2
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Ftr-B3 si
n speCIFICatIONs
continued
n CHaraCterIstIC Data
5
4
3
2
1
0 0.1 0.2 0.3
Operation
(return time characteristics)
Time
(ms)
Release
Operation time
Coil Power (W)
5
4
3
2
1
0 0.1 0.2 0.3
Set, reset time characteristics
Time
(ms)
Set time
Reset time
Coil Power (W)
100
90
80
70
60
50
400.5 1 2 5 10 20 50 100 200
Pulse characteristics
NominalVoltageMultiplyingFactor(%)
Pulse width (ms)
At set/reset
80
60
40
20
00 0.1 0.2 0.3
Coil Temperature Rise
CoilTemperatureRise
(C)
Coil Power (W)
Contact carrying
current: 1A
Contact carrying
current: 0
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0 20 40 60 80 100
Ambient Temperature(maximum applied voltage,
operating voltage characteristics)
NominalVoltageMultiplyingFactor(%)
Ambient Temperature (C)
Standard type
Contact carrying
current: 0
Contactcarrying
current:1A
Operating
voltage
(hotcoil)
Operatingvo
ltage
(coolcoil)
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0 20 40 60 80 100
Ambient Temperature(maximum applied voltage,
operating voltage characteristics)
NominalVoltageMultiplyingFactor
Ambient Temperature (C)
Contactcarrying
current:1A
Contactcarrying
current:1A
Latching Type
OperatingVo
ltage
(hotcoil)
OperatingVoltag
e
(coolcoil)
continued
metI epyTdradnatS epyTgnihctaL
A)(3B-RTF B)(3B-RTF
efiL
lacinahceM 01x05 6 .nimsnoitarepo )zH3ta( 01x02 6 .nimsnoitarepo )zH3ta(
)daolevitsiser(lacirtcelE01x001 3 )zH5.0ta(CDV03A1ta.nimsnoitarepo
01x001 3 )zH5.0ta(CDV521A3.0ta.nimsnoitarepo
rehtO
noitarbiV
ecnatsiser
noitcnuflaM mm3.3foedutilpmaelbuodtazH55ot01
ecnarudnE mm5foedutilpmaelbuodtazH55ot01
kcohS
ecnatsiser
noitcnuflaM s/m057.niM 2
ecnarudnE s/m0001.niM 2
thgieW g8.0yletamixorppA
7/27/2019 Micro Relay FT B3
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Ftr-B3 si
continued
n CHaraCterIstIC Data
2
1
0.5
0.3
0.2
0.11 2 5 10 20 30 50 100 200
Maximum Switching Power
ContactCurrent(A)
Contact Voltage (V)
AC Resistive
DC Resistive
100
70
50
40
30
20
10
0 0.2 0.4 0.6 0.8 1.0 1.2
Life Curve
Operation(x104)
Contact Current (A)
30VDCResistive
125VDCResistive
n reFereNCe Data
100
80
60
40
20
0 10 20 30 40 50 60 70 80
Distribution of Operate
and Release Voltage
D
istribution(%)
Nominal Voltage Multiplying Factor (%)
FTR-B3GA4.5Z
n=100Operate
Release
100
80
60
40
20
0 10 20 30 40 50 60 70 80
Distribution of Operate
and Release Voltage
Distribution(%)
Nominal Voltage Multiplying Factor (%)
FTR-B3GB4.5Z
n=100Operate
Release
100
80
60
40
20
0 1 2 3 4 5
Distribution of Operate
and Release Time
D
istribution(%)
Time (ms)
FTR-B3GA4.5Z
n=100Operate
Release
100
80
60
40
20
0 1 2 3 4 5
Distribution of Bounce Time
Distribution(%)
FTR-B3GA4.5Z
N=100
Operate
Release
Time (ms)
100
80
60
40
20
0 20 40 60 80 100
Distribution of Contact Resistance
Distribution(%)
FTR-B3GA4.5Z
n=100
Make
Break
Contact Resistance (m)
100
80
60
40
20
0
500
10050
105
100 500 1000 2000 3000 5000
Mechanical Life Test
ContactResistance(m)
Operation (x104)
Operating Voltage
Release Voltage
Make
Break
FTR-B3GA4.5Z
n=81200 operations/min.
Initial
continued
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Ftr-B3 si
8 7 6 5
1 2 3 4
(-)
(+)
Marking
(Coil side indication)
5.080.2
3.
5+
0.
3
-0.
2
0.
5
0.
05
0.4 +0.2
3.2 0.2 2.2 0.2 2.2 0.2(1.5)
3.2 2.2 2.2
5.
0
8
8-O 0.85
5.
2
0.
02
10.6 0.2 7.20.2
n speCIFICatIONs
continued
100
80
60
40
20
0500
10050
105
110
Electrical Life Test
Contact
Resistance(m)
Operation (x104)
Operating Voltage
Release Voltage
Make
Break
FTR-B3GA4.5Z
n=8
30 operations/min.
126 VAC 0.3 A
(resistive load)
Initial
NominalVoltag
e
MultiplyingFac
tor(%)
100
80
60
40
20
0500
10050
105
110
Electrical Life Test
Contact
Resistance(m)
Operation (x104)
Operating Voltage
Release Voltage
Make
Break
Initial
NominalVoltag
e
MultiplyingFac
tor(%)
FTR-B3GA4.5Z
n=8
30 operations/min.
30 VAC 1A
(resistive load)
20
10
0
-10
-2020
10
0
-10
-200 2 4 6 8 10
Magnetic Interference
Operating Voltage
Release Voltage
When cis ON
When c
is OFF
NominalVoltag
e
MultiplyingFac
tor(%)
FTR-B3GA4.5Z
n=4
NominalVoltage
MultiplyingFactor(%)
Standar
type
20
10
0
-10
-2020
10
0
-10
-200 2 4 6 8 10
Magnetic Interference
Distance between relays I (mm)
Operating Voltage
Release Voltage
When coil
is ON
When coil
is OFF
NominalVoltage
MultiplyingFactor
(%)
FTR-B3GA4.5Z
n=4
NominalVoltage
MultiplyingFactor(%)
Standard
type150
100
50
01 3 5 7 10 30 50 70 100 300500 700 1000
High Frequency Characteristics
Frequency (MHz)
FTR-B3GA4.5Z
n=2
Isolation
(dB)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
01 10 30 50 703 5 7 10001 00 3 00 5 00 70 0
High Frequency Characteristics
Frequency (MHz)
FTR-B3GA4.5Zn=2
Insertion
Loss
(dB)
n
DIMeNsIONs
lDimnion
Unit: mm
l Mounting Pad(TOP VIEW)
lWiring Diagram(TOP VIEW)
FTR-B3C( )( )( )
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Ftr-B3 si
n paCKaGING speCIFICatIONs
l pckging Mhod- Packaging Standard: JIS C 0806- Taping Type: TB 1612- Reel Type: R16D- Quantity of 1reel: 1000 pieces
l Packaging Orientation Code:B
Orientation mark sideFeeding
l (2) Dimensions- Reel dimensions
Top cover tape
Embossed carrier tape
l Tape Dimensions
Note: Relays are sold in packs of 1000 pieces,
please order 1000 pieces as one unit.
Unit: mm
n reCOMMeNDeD sOLDerING CONDItIONs
(teMperature prOFILe)
IRS (Infrared Reflow Soldering)
T 3
T 2
T
T 3= 245C max.
T 2= 200C max.
T= 165C max.
0
Temperature(C) soldering
preheatingcooling
120 sec maximum 30 secMax.
VPS (Vapor Phase Soldering)
T 3
T 2
T
T 3= 200C maximum
T 2= 165C maximum
T= 100C maximum
0
Temperature(C)
soldering
preheating
cooling
90 sec Max.60 sec Max.
60 sec Max.
215C maximum
Note: 1.Temperature proles show the temperature of PC board surface.
2.Please perform soldering test with your actual PC board before mass production, since the temperatures of
PC board surfaces vary according to the size of PC board, status of parts mounting and heating method.
n preCautIONs
- For details on general precautions, refer to the section on technical descriptions.
- Since this is a polar relay, follow the instructions of the internal wiring diagram for the +- connections of the coil.
- Note that the terminal array and internal wiring of the surface mount relay are a top view
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Ftr-B3 si
roHs Comlinc nd Ld F rly Infomion
Reow Solder condtion
3. Moi sniiviy
lMoisture Sensitivity Level standard is not applicable to electromechanical realys.
4. tin Whik
lSnAgCu and SnCuNi solder is known as low risk of tin whisker. No considerable length whisker was found
by our in-house test.
We highly recommend that you conrm your actual solder conditions
Flow Solder condtion:Pre-heating: maximum 120C
Soldering: dip within 5 sec. at
260C soler bath
Solder by Soldering Iron:Soldering Iron
Temperature: maximum 360C
Duration: maximum 3 sec.
1. Gnl Infomion
l Relays produced after the specic date code that is indicated on each data sheet are lead-freenow. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
l Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0CU-Ni will be used for the FTR-B3 and FTR-B4 series relays.
l All signal and most power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that
are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).
l It has been veried that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
l LF is marked on each outer and inner carton. (No marking on individual relays).
l To avoid leaded relays (for lead-free sample, etc.) please consult with area sales ofce.
l We will ship leaded relays as long as the leaded relay inventory exists.
Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)
2. Recommended Lead Free Solder Prole
l Recommended solder paste Sn-3.0Ag-0.5Cu amd Sm-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from
February 2005.
max. 120 sec.
90~120 sec. 20~30 sec.
(duration)
CoolingPre-heating
Soldering
PeakTemp.: max. 250C
250
220
130
170
temperature(C)
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Ftr-B3 si
JnFujitsu Component Limited
Gotanda-Chuo Building
3-5, Higashigotanda 2-chome, Shinagawa-kuTokyo 141, Japan
Tel: (81-3) 5449-7010
Fax: (81-3) 5449-2626Email: [email protected]
Web: www.fcl.fujitsu.com
Noh nd soh amicFujitsu Components America, Inc.
250 E. Caribbean DriveSunnyvale, CA 94089 U.S.A.
Tel: (1-408) 745-4900
Fax: (1-408) 745-4970
Email: [email protected]
Web: http://us.fujitsu.com/relays/
eoFujitsu Components Europe B.V.
Diamantlaan 25
2132 WV HoofddorpNetherlands
Tel: (31-23) 5560910
Fax: (31-23) 5560950Email: [email protected]
Web: emea.fujitsu.com/components/
Asia PacicFujitsu Components Asia Ltd.
102E Pasir Panjang Road#01-01 Citilink Warehouse Complex
Singapore 118529
Tel: (65) 6375-8560
Fax: (65) 6273-3021
Email: [email protected]
Web: http://www.fujitsu.com/sg/services/micro/components/
Fujitsu Components International Headquarter Ofces
2007 Fujitsu Components America, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective
owners.
Fujitsu Components America or its afliates do not warrant that the content of datasheet is error free. In a continuing effort to improve ourproducts Fujitsu Components America, Inc. or its afliates reserve the right to change specications/datasheets without prior notice.
Rev. February 15, 2007