MEMS packaging Review - System Plus Consulting · ©2017 by System Plus Consulting | MEMS Packaging –Reverse Costing Review 1 21 rue la Noue Bras de Fer 44200 NANTES ... Humidity

©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

MEMS Packaging Reverse Technology ReviewEnvironmental Sensor, Inertial, Optical Sensor, Microphones & RF

MEMS report by Audrey LAHRACHOctober 2017 – Version 1


Table of Contents

Overview / Introduction 4

o Executive Summary

o Analyzed Devices

o Reverse Costing Methodology

Technology Review 15

o Environmental Sensor

o Pressure Sensors

o Consumer (x5)

o Automotive (4)

o TPMS (x2)

o Humidity Sensors

o Consumer (x10)

o Gas Sensors

o Consumer (x4)

o Combo Sensors

o Consumer (x2)

o Inertial Sensors

o Accelerometer

o Consumer (x7)

o Automotive (x7)

o Gyroscopes

o Consumer (User Motion) (x5)

o Consumer (OIS) (x2)

o Automotive (x2)

o Magnetometers

o Consumer (x16)

o Combo + Sensor Hubs

o 6-Axis e-Compass (x2)

o 6-Axis IMU (x8)

o 9-Axis IMU (x4)

o Sensor Hub (x2)

o Automotive Combo (x6)

o Optical MEMS

o Microbolometers

o Consumer (x3)

o Micromirrors

o Consumer (x2)

o Industrial/ Medical (x1)

o Acoustic Sensors

o Microphones

o Consumer (x6)

o RF Components

o Antenna Tuners

o Consumer (x2)

o RF Filters

o Consumer (x5)

o Oscillators

o Consumer (x2)

Company services 401


Overview / Introductiono Executive Summaryo Analyzed Deviceso MEMS Packaging Matrixo Reverse Costing

Methodology

Technologies Review

About System Plus

Executive Summary

This comparative technology review has been conducted to provide insight on structure and technology for over 80 Consumerand 20 Automotive MEMS from the main suppliers (Bosch, TI, Broadcom, STMicroelectronics, Knowles…).

We analyze and compare several types of device: Environmental sensors, including pressure, humidity, gas and combo sensors;Inertial devices including accelerometers, gyroscopes, magnetometers and sensor hubs; Optical MEMS includingmicrobolometers and micromirrors; Microphones; and Radio frequency (RF) MEMS including antenna tuners, RF filters andoscillators. We look at their package dimensions and internal structures, substrate types, die numbers and dimensions andpackage cross-sections to answer key questions about MEMS packaging, including:

- What are the main encapsulation processes used by manufacturers, single-chip wafer level packages or multi-chip moldedpackages?

- What is the preferred interconnection method, wire bonding, flip chip, or through-silicon vias (TSVs)?

- Which innovations can we observe for each manufacturer, and what differences are there between the main competitors?

- Which manufacturers offer the best component integration and which one offers the maximum functionality inside onecomponent?

This 300 page report includes multiple comparisons based on physical analyses of over 100 MEMS components. It offersbuyers the unique possibility of seeing MEMS package technology evolution, tracked by manufacturer.



Methodology

Technologies Review

About System Plus

Analyzed Devices

• Environmental SensorsType Manufacturer Reference Application

Pressure Infineon DPS310 Consumer

Pressure STMicroelectronics LPS331AP Consumer

Pressure STMicroelectronics LPS22HB Consumer

Pressure Bosch BMP280 Consumer

Pressure Bosch BMP380 Consumer

Pressure Infineon KP200 Automotive

Pressure Bosch #1 Automotive

Pressure Bosch #2 Automotive

Pressure Melexis MLX90809 Automotive

TPMS Infineon SP37 Automotive

TPMS Freescale FXTH87 Automotive

Type Manufacturer Reference Application

Humidity Sensirion SHT21 Consumer

Humidity Sensirion SHTC1 Consumer

Humidity Sensirion SHT31 Consumer

Humidity STMicroelectronics HTS221 Consumer

Humidity Bosch BME280 Consumer

Humidity ALPS HSHCAA006A Consumer

Humidity SiLabs Si7021 Consumer

Humidity SiLabs Si7034 Consumer

Humidity MEAS HPP845E031R4 Consumer

Humidity TI HDC1000 Consumer

Gas Cambridge (ams) CCS801 Consumer

Gas Ams AS-MLV-P2 Consumer

Gas Sensirion SGP30 Consumer

Gas Sensirion SGPC3 Consumer

Gas Bosch BME680 Consumer

Combo Sensor Bosch BME280 Consumer

Combo Sensor Bosch BME680 Consumer



Methodology

Technologies Review

About System Plus

Analyzed Devices

• Inertial Sensors


Accelerometer

mCube MC3413 Consumer



Bosch Sensortec BMA222 Consumer




STMicroelectronics LIS2DH Consumer

STMicroelectronics LIS302DL Consumer

STMicroelectronics LIS3DSH Consumer

STMicroelectronics IIS328DQTR Consumer

STMicroelectronics AIS1120SX/2120SX/3684

Automotive

Bosch SMA582 + 2 Ref. Automotive

Analog Devices ADXL278 Automotive

Analog Devices ADXL189 Automotive

Murata (VTI) SCA3100 Automotive

Murata(VTI) SCA2120 Automotive

NXP (Freescale) MMA5248 Automotive

Colibrys VS1000 Industrial


Gyroscope

Bosch BMG160 Consumer (User Motion)

Bosch BMG250 Consumer (User Motion)

STMicroelectronics L3GD20H Consumer (User Motion)

NXP FXAS21002CQR1 Consumer (User Motion)

Maxim MAX210000 Consumer (User Motion)

Invensense IDG-2030 Consumer (OIS)

STMicroelectronics L2G2IS Consumer (OIS)

Bosch SMG550 Automotive

STMicroelectronics A3G4250D (Navigation)

Automotive



Methodology

Technologies Review

About System Plus

Analyzed Devices

• Inertial Sensors

Type Mfr. Ref. Package Application

Magnetometer3-Axis

ALPS HSCDTD008A LGA Consumer

AKM AK8973 WLCSP Consumer




AKM AK09918C WLCSP Consumer

Bosch BMM150 LGA Consumer

Freescale MAG3110 QFN Consumer

Honeywell HMC5883 LGA Consumer

MEMSIC MMC3316xMT LGA Consumer

STMicro LIS3MDL LGA Consumer

Yamaha YAS529 WLCSP Consumer

Yamaha YAS532B WLCSP Consumer

Yamaha YAS537 WLCSP Consumer

eCompass6-Axis

STMicro LSM303D LGA Consumer

Bosch BMC150 LGA Consumer

Type Mfr. Ref. Application

6-Axis IMU

Bosch BMI055 Consumer

Bosch BMI160 Consumer

Bosch iPhone 8 Consumer

Bosch Apple Watch 3 Consumer

STMicroelectronics LSM6DS3 Consumer

STMicroelectronics LSM6DSL/M Consumer

On Semi (Fairchild) FIS110 Consumer

Invensense iPhone 7 (6-axis) Consumer

Invensense ICM-20789 Consumer

9-Axis IMU

Bosch BMX055 Consumer



Invensense MPU-9250 Consumer

Sensor HubBosch BMF055 Consumer

Invensense ICM-30630 Consumer

Automotive Combo

Bosch SMI540 Automotive

Bosch SMI500/510 Automotive

Bosch SMI130 (Navigation)

Automotive

Murata SCC2000 Automotive

Murata SCC1300 Automotive

Silicon Sensing CMS300 Automotive



Methodology

Technologies Review

About System Plus

Analyzed Devices

• Acoustic Sensors


Microphone

Invensense ICS43432 Consumer

Knowles iPhone 5S Consumer

AAC iPhone 5S Consumer

Knowles iPhone 7 Consumer

STMicroelectronics iPhone 7 Consumer

Goertek iPhone 7 Consumer

Vesper VM1000 Consumer

Wolfson WM7121 Consumer

Wolfson WM7132 Consumer



Methodology

Technologies Review

About System Plus

Analyzed Devices

• Optical Sensors


Microbolometer

Ulis PICO384P Consumer

Raytheon EXC001 Consumer

Flir ISC1406L Consumer


Micromirror DLP Texas Instruments DLP1700 Consumer

Micromirror DLP Texas Instruments DLP3000 Industrial/Medical

Resonant Mirror STMicroelectronics PM53A Consumer



Methodology

Technologies Review

About System Plus

Analyzed Devices

• RF Sensors


Antenna Tuner Cavendish 32CK417R Consumer

Antenna Tuner Wispry A2101 Consumer

Filter Broadcom BAW Filters Consumer

Filter Qorvo BAW & SAW Filters Consumer

Filter Murata SAW Filters Consumer

Filter Tayio Yuden SAW Filters Consumer

Oscillator SiTime Si1552 Consumer

Oscillator Microchip DSC6003 Consumer



Methodology

Technologies Review

About System Plus

The analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured

Die

•The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking

Comparison

•Innovations we can observe for each manufacturer, and differences between the main competitors

Executive Summary


TECHNOLOGIESR E V I E W


Overview / Introduction

Technologies Reviewo Environmental Sensor

o Pressure Sensoro TPMSo Humidity Sensoro Gas Sensoro Combo Sensor

o Inertial Sensoro Accelerometero Gyroscopeo Magnetometero Combo + Sensor

Hubo Microbolometero Micromirroro Microphoneo RF Components

o Antenna Tunero RF Filtero Oscillators

About System Plus

Pressure Sensor - Technology Summary

• 9 references from 4 companies of pressure sensor component manufacturer has been analyzed.








About System Plus

Infineon – DPS310 – Package View & Dimensions








About System Plus

Infineon – DPS310 – Package Cross-Section








About System Plus

Pressure Sensor - Comparison

Melexis – MLX90809Bosch #2Bosch #1Infineon – KP200

Component Ref Package size Footprint Volume Dies nb Wire bonding Nb

KP200 7.0 x 7.0 x 2.8mm 49mm² 137mm3 x x (Material)

Bosch #1 8.2 x 4.4 x 2.4mm 36.1mm² 86.6mm3 x x (Material)

Bosch #2 13.9 x 8.6 x 3.2mm 119.5mm² 382.5mm3 x x (Material)

MLX90809 10.3x7.5x2.4mm 77.25mm² 185mm3 x x (Material)



Technologies Review

About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal

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MEMS packaging Review - System Plus Consulting · ©2017 by System Plus Consulting | MEMS Packaging –Reverse Costing Review 1 21 rue la Noue Bras de Fer 44200 NANTES ... Humidity