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3D PLUS reserves the right to cancel or change specifications without notice.
MEMORY MODULE
3D3D16G16YB4751
16 Gbit DDR3 SDRAM
Organized as 1 Gbx16, based on 512Mx8
Organized as 1Gbx16
Supply voltage: VDD = 1.35V, +0.1V / -0.067V back-
ward compatible 1.5V
System frequency up to 667 MHz
8n-Bit pre-fetch architecture
Programmable CAS Latency
Programmable Additive Latency: 0, CL-1/ 2
Programmable Burst Length: 4 and 8
Programmable Burst Sequence: Sequential or Inter-
leave
OCD (Off-Chip Driver impedance adjustment)
Dynamic ODT (On-Die Termination)
Up to 200 MHz in DLL off mode
Available temperature range:
-40°C to + 105°C *
* Specific temperature range can be requested
The 3D3D16G16YB4751 is a high-speed highly integrated
DDR3 Synchronous Dynamic Ram Memory.
It is organized with 4 chips of 4 Gbit. It is particularly well
suited for use in high reliability, high performance and high
density system applications, as computing memories.
The 3D3D16G16YB4751 is packaged in a 95 balls BGA
available with leaded balls.
A
B
C
D
E
F
G
H
J
K
L
M
1 2 3 4 5 6 7 8
All other signals are common to the four memories.
DDR3 SDRAM
BGA 95 Package BW2 - (14 x 20 - Pitch 1.27 mm)
GENERAL DESCRIPTION
3DFP-0751-4 — April 2020
KEY FEATURES
PIN ASSIGNMENT (top view)
FUNCTIONAL BLOCK DIAGRAM
3D PLUS reserves the right to cancel or change specifications without notice.
DC Operating Conditions and Characteristics
PARAMETER SYMBOL MIN MAX UNIT
Supply Voltage VDD 1.283 1.575 V
Reference Voltage VREF 0.49 x VDD 0.51 x VDD V
PARAMETER SYMBOL VALUE UNIT
Voltage on any pin relative to GND VTT -0.4 to +1.975 V
Storage temperature TSTG -55 to +150 °C
Power dissipation PDMAX 3 W
Power supply voltage VDD -0.4 to +1.975 V
DC Characteristics
Absolute Maximum Ratings
PARAMETER SYMBOL VALUE
(MAX) UNIT
Operating Current (one bank active) IDD1 298 mA
Precharge power down standby cur-
rent IDD2P0 196 mA
Active power-down current IDD3P 200 mA
Note: Permanent device damage may occur if "Absolute maximum ratings” are exceeded. Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
HEADQUARTERS (FRANCE) TECHNICAL CENTER (USA) DISTRIBUTOR
408, rue Hélène Boucher - ZI 78530 Buc
Tel: +33 (0)1 30 83 26 50 E-mail: [email protected]
www.3d-plus.com
151 Callan Avenue - Suite #310 San Leandro, CA 94577
Tel: (510) 824-5591 E-mail: [email protected]
3DFP-0751-4 — April 2020
MODULE MARKING
MECHANICAL DRAWING
3D3D16G16YB4751 X X
Temperature Range
C = (0°C to +70°C)
I = (-40°C to +85°C)
S = Specific (-40°C to 105°C)
Quality Level
N = Commercial Grade
B = Industrial Grade
S = Space Grade
3D PLUS SALES OFFICES
Size: 20 x 14 x 8,50 mm3
MEMORY MODULE
16 Gbit DDR3 SDRAM
Organized as 1 Gbx16, based on 512Mx8
DDR3 SDRAM
