Memory It’s all about storing bits--binary digits Vacuum tubes, CRTs, drums, disks, core, ICs Issues of size, cost, speed Semiconductor memories (chips)

Memory

• It’s all about storing bits--binary digits

• Vacuum tubes, CRTs, drums, disks, core, ICs

• Issues of size, cost, speed

• Semiconductor memories (chips)

Memory

• How to store

• How to organize--so as to be able to “store” a bit (or byte or word) and then find it again

• How to associate an address with a “set” of bits

Up to 2 k

addressable locations

MDR

MAR

Figure 5.1. Connection of the memory to the processor.

k-bitaddress bus

n-bitdata bus

Control lines( , MFC, etc.)

Processor Memory

Word length = n bits

WR/

Memory

• Memory access (read)

address MAR

MAR bus memory

READ bus memory

bus data

processor bus MFC

MDR bus

Memory

• Memory access time:

– Time from Read issued to MFC received

• Memory cycle time:

– Time between two successive reads

Memory

• Obviously, the speed of the processor depends

on the speed of the memory

• Random Access Memory (RAM) simply means

that access time is fixed (and the same) for all

memory locations (addresses)

FF

Figure 5.2. Organization of bit cells in a memory chip.

circuitSense / Write

Addressdecoder

FF

CS

cellsMemory

circuitSense / Write Sense / Write

circuit

Data input/output lines:

A0

A1

A2

A3

W0

W1

W15

b7 b1 b0

WR /

b¢7 b¢1 b¢0

b7 b1 b0

•••

•••

•••

•••

•••

•••

•••

•••

•••

small (very) example (128 bit chip)

16 words of 8 bits each (16 x 8)

FF



Addressdecoder

FF

CS

cellsMemory


circuit

A0

A1

A2

A3

W0

W1

W15

b7 b1 b0

WR /

b¢7 b¢1 b¢0

b7 b1 b0

•••

•••

•••

•••

•••

•••

•••

•••

•••Data input/output lines:

Addressdecoder

A0

A1

A2

A3

W0

W1

W15

•••

four input, sixteen output decoder

4 address lines, 16 word addresses

word lines


W 0

W 1

W 15

b7

b7

b7

•••

•••

•••

•••

•••

. .

. .

word lines

bit lines

data output lines

memory cell

(one bit)

CS

WR / of course

chip select for multi-chip memory

bit 7 of the selected word


W 0

W 1

W 15

b7

b7

b7

•••

•••

•••

•••

•••

. .

. .

word lines

bit lines

data output lines


b0

b0

b0

•••

•••

••••••

•••. .

. .

bit lines

FF



Addressdecoder

FF

CS

cellsMemory


circuit

A0

A1

A2

A3

W0

W1

W15

b7 b1 b0

WR /

b¢7 b¢1 b¢0

b7 b1 b0

•••

•••

•••

•••

•••

•••

•••

•••

•••

small (very) example (128 bit chip)

16 words of 8 bits each (16 x 8)


FF


Addressdecoder

FF

CS

cellsMemory


circuit

A0

A1

A2

A3

W0

W1

W15

b7 b1 b0

WR /

b¢7 b¢1 b¢0

b7 b1 b0

•••

•••

•••

•••

•••

•••

•••

•••

•••

128 bit chip, 16 words of 8 bits each (16 x 8)

4 address lines 8 data lines

R / W linechip select line

power ground

16 external connections


Chip with 1024 Memory Cells

• Could be 128 x 8– Same as the 16 x 8, but with more word lines

Addressdecoder

A0

A1

A7

W0

W1

W127

•••

word lines

•••

4 more address lines, total of 20 external connections

8 data lines

Chip with 1024 Memory Cells

• Or, it could be 1024 x 1

Addressdecoder

A0

A1

A9

W0

W1

W1023

•••

word lines

(1 bit each)•••

2 more address lines, but only 1 data line, total of 15 external connections

1 data line

Figure 5.3. Organization of a 1K 1 memory chip.

CS

address5-bit row

Data input/output

(1 bit)

5-bit column address

address10-bit

output multiplexer 32-to-1

input demultiplexer

WR/

W0

W1

W31

and

32 x 32 memory cell

array Sense/Write circuitry

5-bit decoder

2 lines to choose one of the 4 inputs as its output

Multiplexer

2 lines to choose one of the 4 inputs as its output

Figure 5.3. Organization of a 1K 1 memory chip.

CS

address5-bit row

Data input/output

(1 bit)

5-bit column address

address10-bit

output multiplexer 32-to-1

input demultiplexer

W0

W1

W31

and

32 x 32 memory cell

array Sense/Write circuitry

5-bit decoder

WR/

Static Memory

• Static: retains its state (content) as long as power is applied– and, of course, loses it if powered off (volatile)

• SRAM: static ram– fast– expensive

YX

Word line

Bit lines

Figure 5.4. A static RAM cell.

b

T2T1

b

latch

T T

Voltage = 0 (ground), open switch Voltage = Vs, closed switch

Transistors in the circuit are effectively switches

YX

Word line

Bit lines


b

T2T1

b

If the Word line is low, nothing on the bit lines

If the Word line goes high (read), then

b = 1, (high)

b = 0, (low)

sense line sets output high

If the cell represents a 1, for example

1 0

to sense/write circuit

latch

YX

Word line

Bit lines


b

T2T1

b

To write (say 0), put b low, b high, set Word line high, latch changes

Then, if the Word line goes high (read)

b = 0, b = 1

If the cell represents a 1, for example

1 0

to sense/write circuit

latch

CMOS SRAM

• Complementary Metal Oxide Semiconductor

• Uses both “P type” and “N type” transistors

(a) (b)

Vsupply

R

Vout

S

An inverter circuit.

Vsupply

Vout

R

drain

source

Vin

gate

T

(c)

Vsupply

Vout

R

drain

source

Vin

gate

T

NMOS--closed when Vin raised

PMOS--open when Vin raised

Word line

b

Bit lines

Figure 5.5. An example of a CMOS memory cell.

T1T2

T6

T5

T4T3

YX

Vsupplyb

CMOS SRAM

• Volatile

• Low power consumption--no current flows except when being accessed

• Fast--access times of a few nanoseconds

• Expensive (6 transistors per cell)

Dynamic Ram (DRAM)

• Simpler cells, higher density

• 1 million to 16 million bits or more per chip

• Less expensive

• But, DRAM cells do not retain their state

• Must be refreshed periodically

Figure 5.6. A single-transistor dynamic memory cell

T

C

Word line

Bit line

capacitor is charged to write a 1

(voltage applied to Word line and to the Bit line)

charge on the capacitor will discharge over time

Figure 5.6. A single-transistor dynamic memory cell

T

C

Word line

Bit line

If a Read detects a voltage on the capacitor above the “threshold, ” it “sees” a 1, and drives the bit line to full voltage and recharges the capacitor

If a Read detects a voltage on the capacitor below the “threshold, ” it “sees” a 0, and drives the bit line to ground and fully discharges the capacitor

Refreshes whenever read

Refresh circuit will periodically read all cells

Column decoder

CSSense / Write circuits

Row address

latch

Column address

latch

Row decoder

4096 x (512 x 8) cell array

R/W

A20 9- A8 0-

D0D7

RAS

CAS

Figure 5.7. Internal organization of a 2M x 8 dynamic memory chip.

/

16 megabits, 2 million bytes

12 bits to select one of the 4096 rows

9 bits to select one of the 512 bytes in a row

the selected byte

4096 lines

4096 lines

Column decoder

CSSense / Write circuits

Row address

latch

Column address

latch

Row decoder

4096 x (512 x 8) cell array

R/W

D0D7

RAS

CAS

21 bit address on 12 lines (reduces

external connections)

the selected byte

Row Address Strobe

Column Address Strobe

12 bit row address applied, latched on RAS

9 bit column address applied, latched on CAS

1

2

DRAM

• Possible to leave row selected (all 512 bytes on sense lines)

• Then rapidly retrieve successive bytes by changing column addresses

• Result is a “fast page mode” for “blocks” or “pages” of bytes where appropriate (such as cache loading, disk transfer)

• Or, synchronous DRAM, SDRAM

SDRAM

• Can operate in different modes

• “Burst” modes of different lengths

• Can transfer “blocks” of data on single Read or Write

R/ W

RASCAS

CS

Clock

Cell array

Figure 5.8. Synchronous DRAM.

Data

Row decoder

Columndecoder

Column address counter

Row address

latch

Refresh counter

Read/Write circuits &

latches

Mode register

and timing control

Row/Column address

Data input

register

Data output

register

Entire row can be addressed and put into latches

Successive columns put into output register on successive clock pulsesClock pulses

cause “counting” to select successive columns

R/ W

RAS

CAS

Clock

Figure 5.9. Burst read of length 4 in an SDRAM.

Row Col

D0 D1 D2 D3

Address

Data

2 cycles to activate selected row

1 cycle to put data on data lines

column address latched

row address latched

column address automatically incremented by memory control each cycle

chip select (2 bits)

19 bit address on chip

8-bit data input/output

512K x 8 memory chip

Larger Memories Using Multiple Chips

4 chips

2 million 32-bit words

21 bit address

Figure 5.10. Organization of a 2M 32 memory module using 512K 8 static memory chips (16 chips).

19-bit internal chip address

2-bit decoder

21-bit addresses

A0

A18

A19A20

D31-24 D7-0D23-16 D15-8512K x 8 memory

chip

16 chips



A0

A18

A

D31-24 D7-0D23-16 D15-8

512K x 8 memory

chip

4 chips for each 32 bit word



2-bit decoder

21-bit addresses

A0

A18

A19A20

D31-24 D7-0D23-16 D15-8512K x 8 memory

chip

16 chips

Processor

RAS

CAS

R/ W

Clock

Address

Row/Column address

Memorycontroller

R / W

Clock

Request

CS

Data

Memory

Figure 5.11. Use of a memory controller.

Processor sends all bits of address

Memory controller does the multiplexing of row and column and issues strobe signals

Processor

RAS

CAS

R/ W

Clock

Address

Row/Column address

Memorycontroller

R / W

Clock

Request

CS

Data

Memory

Figure 5.11. Use of a memory controller.

Memory controller provides the refresh control if not done on the chip

Refreshing typically once every 64 ms. At a cost of .2ms

Less than .4% overhead

Not connected to store a 1Connected to store a 0

Figure 5.12. A ROM cell.

Word line

P

Bit line

T

ROM: Read Only Memory

A PROM cell.

Word line

P

Bit line

T Manufactured connected (storing 0), but the connection is a “fuse” and can be burned out with a high current to change it to a 1

PROM: Programmable Read Only Memory

An EPROM cell.

Word line

Bit line

T

Connection to ground always made

P

Transistor can have a charge put into it that causes it to remain permanently open (programmed to be a 1)

Can be erased with ultraviolet light

EPROM: Erasable Read Only Memory

EEPROM: Electrically Erasable PROM

Cells erasable selectively

vs. EPROM, erase all

Flash Memory

Similar to EEPROM--each cell a single transistor

with a “trapped” charge

Read individual cells, write in blocks

Greater density, low power consumption, small, cheap

Can substitute for disks (up to a gigabyte?)

higher cost, but portable

Processor

Primary cache L1

Secondary cache L2

Magnetic disk secondary memory

Main memory

Increasing size

Figure 5.13. Memory hierarchy.

Registers Increasing speed

Increasing cost per bit

Processor

Primary cache L1

Secondary cache L2

Magnetic disk secondary memory

Main memory

Increasing size

Figure 5.13. Memory hierarchy.

Registers always on the processor chip

may also be on the processor chip

main usually DRAM--cheap enough to be large

cache usually SRAM--faster but more expensive

Cache Memories

• Main memory (still) slow in comparison to processor speed

• Main memory constrained by packaging, electronic characteristics and costs

• Cache memory on the processor chip typically ten times faster than main memory

Locality of Reference

• Programs tend to spend their time “focused” on particular groups of instructions– Loops– Frequently called procedures

• “Localized” areas of programs executed repeatedly during some time period

• Much (most?) of program not accessed during some time period

Locality of Reference

• Temporal– Recently executed instruction likely to repeat soon– When first accessed, move to cache where it will

be when referenced again• Spatial

– Instructions near an executed instruction likely to be executed soon

– When fetching an instruction from memory, move its neighbors into cache as well

Figure 5.14. Use of a cache memory.

CacheMain

memoryProcessor

blocks of memory transferred to (and from) cache

processor accesses instructions and data in the cache if there (a “hit”), in main memory if not (a “miss”)

Writing to Cache

• Write through– Cache copy and main memory copy updated

simultaneously– May repeatedly update the same word in main

memory unnecessarily

• Write back– Update cache only– Mark cache block “dirty” or “modified”– Copy it back to main memory when another block

needs the cache space

Cache Management

• Mapping– Determination of where in the cache the blocks

(cache lines) of main memory are to be placed

• Replacement– Determination of when to replace a block in cache

with another block of main memory

• Coherency– Assurance that no problems arise from cache

version differing from main memory version

Direct Mapping Example

64K main memory

16 bit address (word addressed only)

View as 4096 blocks of 16 words each

Cache of 128 blocks of 16 words

0-31 which block

“assigned” to this position

is in the cache

0-15 which word

in block

0--127 which

block in cache

The 16-bit address

Direct Mapping Example

Main memory blocks 0, 128, 256, etc to block 0 of cache

Main memory blocks 1, 129, 257, etc to block 0 of cache

4

tagtag

tag

Cache

Main memory

Block 0

Block 1

Block i

Block 4095

Block 0Block 1

Block 127

12 Main memory address

Figure 5.16. Associative-mapped cache.

Tag Word

Any block of main memory can be put in any block in the cache

Tags are searched

“associatively” to find the

referenced block

Figure 5.24. Caches and external connections

in Pentium III processor.

Processing units

Bus interface unit

L2 cache Mainmemory Input/Output

System busCache bus

L1 instruction

cache

L1 data cache

m bits

Address in module MM address

Figure 5.25. Addressing multiple-module memory systems.

(b) Consecutive words in consecutive modules

i

k bits

0ModuleModuleModule

Module MM address

DBRABRABR DBRABR DBR

Address in module

(a) Consecutive words in a module

i

k bits

Module Module Module

Module

DBRABR DBRABR ABR DBR

0

2 k 1-

n 1-

m bits

Figure 5.26. Virtual memory organization.

Data

Data

DMA transfer

Physical address

Physical address

Virtual address

Disk storage

Main memory

Cache

MMU

Processor

Documents

Memory It’s all about storing bits--binary digits Vacuum tubes, CRTs, drums, disks, core, ICs Issues of size, cost, speed Semiconductor memories (chips)