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Mectron and itsSpace ProgramMectron and itsSpace Program
UK – Brazil Workshop on Space Science and TechnologyUK – Brazil Workshop on Space Science and Technology
COMPANY OVERVIEW
FOUNDATION: F eb ru a ry , 1 9 9 1
STOCKHOLDERS: P riva te com p any - 5 p a rtners + B N D E S
MARKET: D efen se an d A erosp ace
CERTIFICATIONS: - ISO 9001/2000- RBQA 2110 ( b ased on NATO AQAP2110) - NBR 15100 ( b ased on AS9100A)
HEADQUARTERS: S ão José d os C am p os/S P - B razi l
TOTAL AREA: 3 7 . 000 m 2 (5 . 2 00 m 2 of b u i lt a rea )
GROSS REVENUE: ≈ U S $ 1 5 M i l l ion s (2 006 )
ADMINISTRATION
QUALITY M arce lo F a rh at
B.U. SENSORS& AVIONICSG ilb erto T rive la to
CEOA zh au ry C . d aC u n h a F i lh o
ADMINISTRATION/FINANCES
João M anoe l D ia sd e O live ira
COMMERCIAL R ogerio
S a lva d or
OPERATIONSH erm es N ilton
M acau
B.U. SPACE Jorge C orb an
B.U. TESTS& LOGISTICSR ob son D u a rte
ADMINISTRATIONCOUNCIL
DEFENSEW agner C am p os
A . S i lva
CHART
HUMAN RESOURCES
TOTAL: ≈ 220ACTIVITIES:
52%
15%
33%
RESEARCH & DEVELOPMENT
PRODUCTION
ADMINISTRATION
EDUCATION LEVEL:
PhDMaster ScienceMBAUniversity Level
TechniciansHigh SchoolOthers
2%6%10%
21%
39%
17%5%75% OF
LABOR COSTS
• FAB - Brazilian Air Force
• Brazilian Army
• Brazilian Navy
• EMBRAER
• AEB - Brazilian Space Agency
• INPE - Brazilian Institute forSpace Research
• Elbit Systems (Israel)
• Galileo Avionica (Italy)
CUSTOMERS
TECHNICAL CAPABILITIES
• AERODYNAMICS
• PROPULSION
• GUIDANCE AND CONTROL
• DIGITAL SIGNAL PROCESSING
• DIGITAL AND ANALOGICELECTRONICS
• MICROPROCESSORS(ON-BOARD SOFTWARE)
• RADIOFREQUENCY
• MATERIALS
• STRUCTURAL AND THERMAL ANALYSIS
• ELETRO-OPTICS
• PYROTECHNICS
• FINE MECHANICS
• TESTS
TECHNICAL CAPABILITIES
RESOURCESMECHANICAL DESIGN
Solid Works AutoCAD Cosmos (Analysis ofFinite Elements)
ELECTRONIC DESIGN
OrCAD
RESOURCESINSTRUMENTATION
LabView
SOFTWAREDEVELOPMENT
Hardware/Software Development Workstation for 8X51/ 8X196 Microcontrollers and TMS320C5X / TMS320C3X / TMS320C67XXDSPs
RESOURCES
SMD (also BGA) PRINTED CIRCUIT BOARD ASSEMBLING
Reflow
Screen PrinterWelding/UnweldingWorkstation
Pick-and-Place
Welding Inspection Equipment
RESOURCES
Wave WelderMachine
PCB Automatic Test Equipment
Cable AssembliesAutomatic TestEquipment
SMD (also BGA) PRINTED CIRCUIT BOARD ASSEMBLING
RECURSOSMECHANICAL MANUFACTURING
ComputerNumerical
ControlMachine
(CNC)
Three Dimensional Inspection
Machine
WARHEAD
CANARDS
HANGER
PROXIMITY FUSE
ROCKET- MOTOR
WINGS
GUIDANCE AND CONTROL SECTION
MAA-1 MISSILE
Launch Against Maneuvering Target2007
Target shop Damage on target airframe
Damage on target IR source
MAA EVOLUTION
CHARACTERISTIC 3rd GENERATION
4th GENERATION
I n frared D etector
S ingle I n S b elem ent, gas cooled ,
one wavelength sens itive
M u ltip le I n S b an d G e elem ents , gas cooled ,
sens itive in two wavelength s for greater
d etection range
M axim u m S eeker B ores igh t A ngle < 4 0° > 60°
R ocket-M otor S ingle S tage T wo stages
M aneu verab ility < 50 g > 60 g
MAA-1
MAA-1B
≈ 90o
MSS - 1.2
LAUNCHING MOTOR
SHAPED-CHARGEWARHEAD
BOOSTER MOTOR
IMPACT FUZE
OGIVE
GUIDANCE AND CONTROL SECTION
WINGS (FOLDABLE)
LASER RECEIVER
NORMAL FLIGHTSTAND-BY MODE
RISKY MANEUVERARMED MODE
DEPLOY COMMANDED
1- “TRAILING CONE” IS CUT
AIRCRAFT OUT OF CONTROL
2- PARACHUTE IS DEPLOYED
TAILCHUTE´S PROCEDURE
“JETIISON” COMMANDED (PARACHUTE CABLE IS CUT)
PARACHUTE IS OPENEDSTABILIZING THE AIRCRAFT
(NOSE DOWN)
AFTER DIVING,AIRCRAFT
RECOVERS TO THE NORMALFLIGHT
TAILCHUTE´S PROCEDURE
NEW AVIONICS PRODUCTS
• L BAND TRANSPONDERSFunctions: tracking/identification ofin flight aircrafts by air traffic control radars
• C/X BANDS TRANSPONDERSFunctions: tracking/identification ofin flight missiles, aircrafts and space rockets during development phase/ flight tests
• S or L BAND TELEMETRY TXFunctions: transmission of performancedata of in flight missiles, aircrafts, UAVs,suborbital platforms and satellite launcherplatforms
AVIONICS INTEGRATION
• CMMI certification
• System conception
• Avionics procurementand supply
• Mission Computerhardware/softwaredevelopment andqualification
• Mission Simulator
• Integration Bench
• Ground/flight tests for avionics qualification
• Modification/installation on customers aircrafts
MULTI-MISSION PLATFORM
SATELLITE
PAY LOAD PMM
STRUCTURALSUBSYSTEMACDH TT&C
SUBSYSTEMPOWER
SUBSYSTEMPROPULSIONSUBSYSTEM
PLATAFORM:
- PROPULSION SUBSYSTEM
- STRUCTURE
- POWER SUPPLY SUBSYSTEM
- TT&C SUBSYSTEM
MULTI-MISSION PLATFORM
MULTI-MISSION PLATFORM – LayoutTRANSPONDERS 1 e 2
SADA 1
SADA 2
PCDU
BATERIAS
ANTENA 1
ANTENA 2
PAINÉISSOLARES
1 e 2
DIPLEXERS1 e 2
PMM – Power Supply Subsystem(Block Diagram)
S A W 2
S A W 1
SADA
SADA
P C D U
B A T T E R Y
S witch ed /P rotected L in es
P rotected L in es
E E D L in es
H ea ter L in es
E G S E
A C D H A C D H
P S S
MULTI-MISSION PLATFORM
SAG Technical Features
Power: 1000 W (BOL - AM0, 28°C and 1353 W/m2)950 W (EOL – 37,5 V, 1326 W/m2, after 4 years)
Consists of ATJ SCA, 26% Efficiency, 40 x 69 mmTwo wingsThree Panels per Wing with four power lines eachDiode BoardResistor BoardEnd-of-Deployment Indication per wingTwo temperature sensors per wingTwo sun sensors per wing with temperature sensor
Weight: less than 13Kg (Electrical Part only)Size: 735 mm x 1429 mm each panelTotal area available for solar cell assembling is 6.3 m2
MULTI-MISSION PLATFORM
SADA Technical Features
Consists of an Actuation Step Motor and a Slip Ring Assembly
Actuation Step MotorSine / Cosine typeRedundant WindingsMotor Coil Resistance: 290 OhmsElectrical Time Constant: 2 * 10E-3 sCoil Voltage: 21,8 to 35,8 V
Slip Ring Assembly60 Identical 1,5A Slip RingsRedundant BrushesSlip Ring Resistance: 60 mOhms at room temperature
Weight: less than 3KgSize: 180 ± 1 mm x Ø 100mm with flange of 30 mm x Ø 150 mm
MULTI-MISSION PLATFORM
PCDU Technical Features
Power: 1000 W (for battery charge and power distribution)
Cold-redundant architectureMicrocontroller based1 RS-422 serial communication interface per redundancy24 analog input channels per redundancy (voltage, current, temperature)
Power Conditioning UnitPower Control by Sequential Shunt Switches18 Power Control Channels (9 + 9)Non-regulated voltage bus-barVoltage in the range of 22V to 35V
Power Distribution Unit40 Power Lines with electronic over-current protection25 Heater Lines with fuse over-current protection14 Non-Switched Fuse Protected Power Lines32 EED Lines (16 + 16)SADA Actuation Interface
MULTI-MISSION PLATFORM
PCDU Technical Features
SoftwareBattery Charge Control SoftwareBattery Heater Control SoftwareSADA Actuation ControlFlexible Communication Protocol to exchange data with OBC (master-slave)
Weight: less than 20Kg
Size: 451 ± 1 mm (B), 275 ± 1 mm (L), 235 ± 1mm (H)
MULTI-MISSION PLATFORM
• Battery Technical Features
Technology: Lithium IonConfiguration: series-parallelConsists of small Sony 18650HC Battery Cells
Capacity: 15 Ah per Battery ModuleEOC Voltage: 33,6V
Weight: less than 4KgSize: 166 ± 1 mm (B), 229 ± 1 mm (L), 95 ± 1mm (H)
MULTI-MISSION PLATFORM
EGSE – PSS – Solar Array/Battery Simulator
MULTI-MISSION PLATFORM
SAS/BTS - MMPSAS 1 - MMP SAS 2 - MMP
S A S -M O D U L E 1O N - O F FE M E R G E N C Y
S A S -M O D U L E 1
S A S /B TS
S A S -M O D U L E 2
S A S -M O D U L E 2
B A T TE R Y S IM U L A T O R (B TS )
S A S /B TS
PMM – TT&C Subsystem (Block Diagram)
SWITCHED BUS
TM & ClockEGSE
NON-SWITCHED BUSTCs do TT&CTC & ClockTT&C TMs
SWITCHED BUS
TM & ClockEGSE
NON-SWITCHED BUSTCs do TT&CTC & ClockTT&C TMs
A n tena 1
Acoplador
Híbrido
D ip lexad or1
TX 1
R X 1
TX 2
R X 2
U p -lin k
D own-lin k
A n tena 2
D ip lexad or2
U p -lin k
D own-lin k
MULTI-MISSION PLATFORM
Antenna Technical Features
Technology: MicrostripConsists of two arms Spiral printed over a ground plane
Frequency: 2,025 to 2,300 MHzCircular Polarization
Weight: less than 0.5 KgSize: 176 ± 1 mm x Ø 150mm
MULTI-MISSION PLATFORM
Transponder Technical Features
Consists of one redundant receiver and one redundant transmitter
TX Frequency: 2,200 to 2,300 MHzRX Frequency: 2,025 to 2,120 MHz
TX RF Power: 1W, 2W and 5W (available versions)
RS-422 Interface with OBC
Weight: less than 5,6 KgSize: 156 ± 1 mm (B), 210 ± 1 mm (L), 94 ± 1mm (H)
MULTI-MISSION PLATFORM
PMM – Metron’s Partners
SUBSYSTEM COMPANY ACTIVITY
TT&C
I N V A P (A rgen tin a ) R X – P S K D em u la tor D esignTX – M od u la tion F i lter D esign
B E T A T e lecom (S JC ) R X – R F D esign an dE G S E D esign
E Q U A TO R I A L (S JC ) T h erm a l an d R a d ia tion A na lys is
C E M E F (S JC ) S tru ctu ra l A n a lys is
POWER SUPPLY
E Q U A TO R I A L (S JC ) T h erm a l an d R a d ia tion A na lys is
O R B I T A L (S JC ) E lectrica l P a rt D esign an d M an u factu re
C E M E F (S JC ) S tru ctu ra l A n a lys is
MULTI-MISSION PLATFORM
Transponder Technical Features
Consists of one redundant receiver and one redundant transmitter
TX Frequency: 2,200 to 2,300 MHzRX Frequency: 2,025 to 2,120 MHzRanging Major Tone: 100 kHzRanging Minor Tone: 16 to 20 kHz
TX RF Power: 1W
TM video, TC video and Lock interface to CTU
Weight: less than 5,0 KgSize: 156 ± 10 mm (B), 210 ± 10 mm (L), 94 ± 10 mm (H)
CBERS
MECTRON’s PARTNERS
CBERS
COMPANY ACTIVITY
Beta Telecom RX – RF Design and EGSE Design
Neuron Eletrônica TX – RF Design
CBERS
DDR - DIGITAL DATA RECORDER SUB-SYSTEM:
D D R D igital S ignal S witch (D D R D S S )
DDR S/S
CAMERAS
S olid S tate R ecord er (S S R )
(MWT S/S)
D Ts
(PIT S/S)
M U X/20m
W F I
P A N
M U X/1 0m
I R S
EPSS
OBDH
28V TM /TC 1 553B
DDR DSS Block Diagram
CBERS
M U X /2 0m
INMUXCH4
M W T
O U TS S R C H 5 I N S S R C H 4 I N S S R C H 5
S S R
M
O U TS S R C H 4
W F I
MR R
INWFICH5
M
R
M
R
M
R
OUTMWTCH4
OUTMWTCH5
M
R
M U X /2 0M ch anne l A /B se lection
W F I ch anne l A /B se lection
M U X /2 0M P layb ack M od e
W F I P la yb ack M od e
D S SC O N V E R S O R D C -D CE P S S
O B D H
V S ec.2 8 V
M U X /2 0M P la yb ack M od e
W F I P la yb ack M od e
M U X /2 0M ch an ne l A /B se lection
W F I ch anne l A /B se lection
T M
Te lecom m and T u rn -on /off D C /D C converters
S 2S 1
S 3S 4
M MR R
T C
M U X /2 0M P layb ack M od e S tatu s
W F I P la yb ack M od e S tatu s
M U X /2 0M ch an ne l A /B S tatu s
W F I ch anne l A /B S ta tu s
D C /D C converter voltage
DDR DSS Features
Cold redundant
LVDS interfaces to camerasLVDS interfaces to data transmittersLVDS interfaces to SSRReal-time and Play-back mode
Weight: less than 4,0 KgSize: 124 ± 10 mm (B), 170 ± 10 mm (L), 80 ± 10 mm (H)
CBERS
DDR SSR Block Diagram
CBERS
SSR
DT Subsystem
or
DDR Digital Signal Switch
Where:
M is M ain R is R ed und ant
Memory Unit 1
(M)
(R)
Controller 1 Controller 2 (M) (M)
Control 1 (M) Control 2 (M)
Control 1 (R)Control 2 (R)
CH1 (R)
CH1 (M)
CAMERASSubsystem
or
DDR Digital Signal Switch
CH1 (R)
CH1 (M)
CH2 (R)
CH2 (M)
CH4 (R)
CH4 (M)
CH2 (R)
CH2 (M)
CH4 (R)
CH4 (M)
28V (R)
EPSS 28V (M)
OBDH Subsystem
1553B (M)
1553B (R)
On/Off (M)
On/Off(R)
DC/DC Converter (M)
Power (M)
Power (R)
DC/DC Converter (R)
CH1 INPUTI/F
CH2
CH4
CH1
CH2
CH4
INPUTI/F
INPUTI/F
OUTPUTI/F
OUTPUTI/F
OUTPUTI/F
INPUT
I/F CH3 (R)
CH3 (M)CH3
CH3 (R)
CH3 (M)
CH3 OUTPUTI/F
CH5 (R)
CH5 (M)
CH5 INPUTI/F CH5 (R)
CH5 (M)
CH5 OUTPUTI/F
Memory Unit 2
(M)
(R)
Controller 1 Controller 2 (R) (R)
DDR SSR Features
Cold redundant / N out of M redundancy
LVDS interfaces to cameras/DSS/data transmitters1553 interface to CTU
Recording, Play-back and Erase mode
Provide capability to record up to 15 minutes of each related input channelCapacity at Begin of Life (BOL): ≥ 330 Gbits (> 40Gbytes);Capacity at End of Life (EOL): ≥ 274 Gbits (> 34 Gbytes)Technology: SDRAM
Weight: 15.0 ± 0.5Size: 250 ± 10 mm (B), 325 ± 10 mm (L), 235 ± 10mm (H)
CBERS