MC54HC00AJ

SEMICONDUCTOR TECHNICAL DATA

Motorola, Inc. 1995 110/95

REV 7

HighPerformance SiliconGate CMOSThe MC54/74HC00A is identical in pinout to the LS00. The device

inputs are compatible with Standard CMOS outputs; with pullup resistors,they are compatible with LSTTL outputs.

Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2 to 6V Low Input Current: 1A High Noise Immunity Characteristic of CMOS Devices In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 32 FETs or 8 Equivalent Gates

3Y1

1A1

PIN 14 = VCCPIN 7 = GND

LOGIC DIAGRAM

2B1

6 Y24

A25

B2

8 Y39

A310

B3

11Y4

12A413B4

Y = AB

Pinout: 14Lead Packages (Top View)

1314 12 11 10 9 8

21 3 4 5 6 7

VCC B4 A4 Y4 B3 A3 Y3

A1 B1 Y1 A2 B2 Y2 GND

LLHH

LHLH

FUNCTION TABLEInputs Output

A B

HHHL

Y

D SUFFIXSOIC PACKAGECASE 751A03

N SUFFIXPLASTIC PACKAGE

CASE 64606

ORDERING INFORMATIONMC54HCXXAJMC74HCXXANMC74HCXXADMC74HCXXADT

CeramicPlasticSOICTSSOP

1

14

114

1

14DT SUFFIX

TSSOP PACKAGECASE 948G01

J SUFFIXCERAMIC PACKAGE

CASE 632081

14

MC54/74HC00A

MOTOROLA HighSpeed CMOS Logic DataDL129 Rev 6

2

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

VCC

DC Supply Voltage (Referenced to GND)

0.5 to + 7.0

V

Vin

DC Input Voltage (Referenced to GND)

0.5 to VCC + 0.5

V

Vout

DC Output Voltage (Referenced to GND)

0.5 to VCC + 0.5

V

Iin

DC Input Current, per Pin

20

mA

Iout

DC Output Current, per Pin

25

mA

ICC

DC Supply Current, VCC and GND Pins

50

mA

PD

Power Dissipation in Still Air, Plastic or Ceramic DIPSOIC Package

TSSOP Package

750500450

mW

Tstg

Storage Temperature

65 to + 150

C

TL

Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package

Ceramic DIP

260300

C

* Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.

Derating Plastic DIP: 10 mW/C from 65 to 125CCeramic DIP: 10 mW/C from 100 to 125CSOIC Package: 7 mW/C from 65 to 125C TSSOP Package: 6.1 mW/C from 65 to 125C

For high frequency or heavy load considerations, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

VCC

DC Supply Voltage (Referenced to GND)

2.0

6.0

V

Vin, Vout

DC Input Voltage, Output Voltage (Referenced to GND)

0

VCC

V

TA

Operating Temperature, All Package Types

55

+ 125

C

tr, tf

Input Rise and Fall Time VCC = 2.0 V(Figure 1) VCC = 4.5 V

VCC = 6.0 V

000

1000500400

ns

This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, Vin andVout should be constrained to therange GND (Vin or Vout) VCC.

Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or VCC).Unused outputs must be left open.

MC54/74HC00A

HighSpeed CMOS Logic DataDL129 Rev 6

3 MOTOROLA

DC CHARACTERISTICS (Voltages Referenced to GND)

VCCV

Guaranteed Limit

Symbol Parameter ConditionVCC

V 55 to 25C 85C 125C Unit

VIH Minimum HighLevel Input Voltage Vout = 0.1V or VCC 0.1V|Iout| 20A2.03.04.56.0

1.502.103.154.20

1.502.103.154.20

1.502.103.154.20

V

VIL Maximum LowLevel Input Voltage Vout = 0.1V or VCC 0.1V|Iout| 20A2.03.04.56.0

0.500.901.351.80

0.500.901.351.80

0.500.901.351.80

V

VOH Minimum HighLevel OutputVoltage

Vin = VIH or VIL|Iout| 20A2.04.56.0

1.94.45.9

1.94.45.9

1.94.45.9

V

Vin =VIH or VIL |Iout| 2.4mA|Iout| 4.0mA|Iout| 5.2mA3.04.56.0

2.483.985.48

2.343.845.34

2.203.705.20

VOL Maximum LowLevel OutputVoltage

Vin = VIH or VIL|Iout| 20A2.04.56.0

0.10.10.1

0.10.10.1

0.10.10.1

V

Vin = VIH or VIL |Iout| 2.4mA|Iout| 4.0mA|Iout| 5.2mA3.04.56.0

0.260.260.26

0.330.330.33

0.400.400.40

Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 0.1 1.0 1.0 A

ICC Maximum Quiescent SupplyCurrent (per Package)

Vin = VCC or GNDIout = 0A

6.0 1.0 10 40 A

NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).

AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)

VCCV

Guaranteed Limit

Symbol ParameterVCC

V 55 to 25C 85C 125C Unit

tPLH,tPHL

Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)

2.03.04.56.0

75301513

95401916

110552219

ns

tTLH,tTHL

Maximum Output Transition Time, Any Output(Figures 1 and 2)

2.03.04.56.0

75271513

95321916

110362219

ns

Cin Maximum Input Capacitance 10 10 10 pF

NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).

CPD Power Dissipation Capacitance (Per Buffer)*Typical @ 25C, VCC = 5.0 V, VEE = 0 V

pFCPD Power Dissipation Capacitance (Per Buffer)* 22 pF* Used to determine the noload dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the

Motorola HighSpeed CMOS Data Book (DL129/D).

MC54/74HC00A


4

Figure 1. Switching Waveforms

GND

VCC

OUTPUT Y

INPUTA OR B

CL*

*Includes all probe and jig capacitance

TESTPOINT

90%50%

10%

tTLH

DEVICEUNDERTEST

OUTPUT

Figure 2. Test Circuit

YA

B

Figure 3. Expanded Logic Diagram(1/4 of the Device)

tTHL

90%50%

10%

tPLH tPHL

tf tr

MC54/74HC00A


5 MOTOROLA

OUTLINE DIMENSIONS

J SUFFIXCERAMIC DIP PACKAGE

CASE 63208ISSUE Y

MIN MINMAX MAXINCHES MILLIMETERS

DIMABCDFGJKLMN

0.7850.2800.2000.0200.065

0.0150.170

15 0.040

0.7500.2450.1550.0150.055

0.0080.125

0 0.020

19.947.115.080.501.65

0.384.31

151.01

19.056.233.940.391.40

0.213.18

0 0.51

0.100 BSC

0.300 BSC

2.54 BSC

7.62 BSC

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.4. DIMESNION F MAY NARROW TO 0.76 (0.030)

WHERE THE LEAD ENTERS THE CERAMICBODY.

14 8

1 7

-A-

-B-

-T-SEATING

PLANE

F G N

K

C L

M

0.25 (0.010) T AM S 0.25 (0.010) T BM SJ 14 PLD 14 PL

N SUFFIXPLASTIC DIP PACKAGE

CASE 64606ISSUE L

NOTES:1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUMMATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHENFORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLDFLASH.

4. ROUNDED CORNERS OPTIONAL.1 7

14 8

B

A

F

H G DK

C

N

L

J

MSEATINGPLANE

DIM MIN MAX MIN MAXMILLIMETERSINCHES

A 0.715 0.770 18.16 19.56B 0.240 0.260 6.10 6.60C 0.145 0.185 3.69 4.69D 0.015 0.021 0.38 0.53F 0.040 0.070 1.02 1.78G 0.100 BSC 2.54 BSCH 0.052 0.095 1.32 2.41J 0.008 0.015 0.20 0.38K 0.115 0.135 2.92 3.43L 0.300 BSC 7.62 BSCM 0 10 0 10 N 0.015 0.039 0.39 1.01

MC54/74HC00A


6

OUTLINE DIMENSIONS

D SUFFIXPLASTIC SOIC PACKAGE

CASE 751A03ISSUE F

MIN MINMAX MAXMILLIMETERS INCHES

DIMABCDFGJKMPR

8.553.801.350.350.40

0.190.10

0 5.800.25

8.754.001.750.491.25

0.250.25

76.200.50

0.3370.1500.0540.0140.016

0.0080.004

0 0.2280.010

0.3440.1570.0680.0190.049

0.0090.009

7 0.2440.019

1.27 BSC 0.050 BSC


Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.127 (0.005) TOTALIN EXCESS OF THE D DIMENSION ATMAXIMUM MATERIAL CONDITION.

A

B P 7 PL

GC

KSEATINGPLANE D 14 PL

M J

R X 45

1 7

814

0.25 (0.010) T B AM S S

B0.25 (0.010) M M

F

DT SUFFIXPLASTIC TSSOP PACKAGE

CASE 948G01ISSUE O

DIM MIN MAX MIN MAXINCHESMILLIMETERS

A 4.90 5.10 0.193 0.200B 4.30 4.50 0.169 0.177C 1.20 0.047D 0.05 0.15 0.002 0.006F 0.50 0.75 0.020 0.030G 0.65 BSC 0.026 BSCH 0.50 0.60 0.020 0.024J 0.09 0.20 0.004 0.008J1 0.09 0.16 0.004 0.006K 0.19 0.30 0.007 0.012K1 0.19 0.25 0.007 0.010L 6.40 BSC 0.252 BSCM 0 8 0 8


Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASHOR GATE BURRS SHALL NOT EXCEED 0.15(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEADFLASH OR PROTRUSION. INTERLEAD FLASH ORPROTRUSION SHALL NOT EXCEED0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.08 (0.003) TOTAL INEXCESS OF THE K DIMENSION AT MAXIMUMMATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINEDAT DATUM PLANE W.

SU0.15 (0.006) T

2X L/2

SUM0.10 (0.004) V ST

LU

SEATINGPLANE

0.10 (0.004)T

SECTION NN

DETAIL E

J J1

KK1

DETAIL E

F

M

W

0.25 (0.010)814

71

PIN 1IDENT.

HG

A

D

C

B

SU0.15 (0.006) T

V

14X REFK

N

N

MC54/74HC00A


7 MOTOROLA

How to reach us:USA/EUROPE: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; TatsumiSPDJLDC, Toshikatsu Otsuki,P.O. Box 20912; Phoenix, Arizona 85036. 18004412447 6F SeibuButsuryuCenter, 3142 Tatsumi KotoKu, Tokyo 135, Japan. 0335218315

MFAX: [email protected] TOUCHTONE (602) 2446609 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, INTERNET: http://DesignNET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 85226629298

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters can and do vary in differentapplications. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. Motorola doesnot convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components insystems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure ofthe Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any suchunintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmlessagainst all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

MC54/74HC00A/D

CODELINE

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MC54HC00AJ