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H61S Support Intel® second / third generation processors Intel® H61 Chipset Dual channel DDR3 1600(IVB)/1333 x 2 DIMMs, Max. 16GB 1* PCIe3.0(IVB)/2.0 x16 2* SATA II, 5.1 channel HDA, Gigabit Lan mini-ITX form factor

MB FOXCONN H61S

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MB FOXCONN H61S 1155/1333/DDR3/S/LV

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Page 1: MB FOXCONN H61S

H61S

Support Intel® second / third generation processors

Intel® H61 Chipset

Dual channel DDR3 1600(IVB)/1333 x 2 DIMMs, Max. 16GB

1* PCIe3.0(IVB)/2.0 x16

2* SATA II, 5.1 channel HDA, Gigabit Lan

mini-ITX form factor

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Mainstream segment MB,target to meet DDR3 platform demands of enthusiasts and gamers.support LGA1155 for Intel®

second / third generation processors with H61 single chipset .the H61S allows you to build powerful PCs on a budget.

Supportting dual channel 2 DIMMs DDR3 memory up to 16GB at 1600MHz(IVB),it is the best MB with DVI & VGA

integrated.Gigabit LAN and 6-channel HD audio are also included on this Microsoft Windows XP and Windows 7 ready

motherboard

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Specification

Processor Intel® second / third generation processors

Chipset Intel® H61 Chipset

Front Side Bus

Memory Dual channel DDR3 1600(IVB)/1333/1066 x 2 DIMMs, Max. 16GB

VGA on Die

Expansion Slots 1* PCIe3.0(IVB)/2.0 x16

IDE N/A

Serial ATA(SATA)/RAID 2* SATA II

Audio 5.1 channel HDA

LAN Gigabit Lan

IEEE1394 N/A

Back Panel I/O Ports

1X PS/2 keyboard port

1X DVI-I port

1X VGA port

1X RJ45 Lan port.

1X Audio jack support 3 jacks.

6X USB2.0 ports

Internal I/O Connectors

1X ATX 24-Pin power connector. --White

1X 4-pin ATX 12V power connector.--White

1X 4-pin CPU FAN connector. --White

1X 4-pin System FAN connector.--White

1X Front Pannel header--full color

1X Front Audio header--Black

1X TPM header(Black)

1X S/PDIF out header.--Black

2X SATAII Connectors--Blue

2X USB 2.0 headers.--Green

1X Speaker header.--Black

1X Buzzer(reserve)