Material Solution

H-VLP New Parameters for surface roughness

RTF

Measured by the cross sectional image of SEM

Measured by the cross sectional image of SEM

Measured by using Zygo

Measured by using Zygo

Measured by using Wyko

Measured by using Wyko

0

1

2

3

4

0 1 2 3 4Con

tact

typ

e R

z (μ

m)

Grade0 1 2 3 4

Grade0 1 2 3 4

Grade0 1 2 3 4

Grade

Op

tical

typ

e S

Rz

(μm

)

0

100

200

300

400

500

Op

tical

typ

e S

dr

(%)

0

1

2

3

0

1

2

3N

odul

e he

ight

(μm

)

0

1

2

3

4

Con

tact

typ

e R

z (μ

m)

1 2 3

Grade1 2 3

Grade1 2 3

Grade1 2 3

Grade

Op

tical

typ

e S

dr

(%)

Op

tical

typ

e S

Rz

(μm

)

0

1

2

3

Nod

ule

heig

ht (μ

m)

0

100

200

300

400

500

600

0

0.5

1

1.5

2

2.5

Under development

H-VLP4

F1N-WS, F1X-WS

H-VLP3

FZ-WS, FZTW-WS

H-VLP2

FV-WS, FX-WS

H-VLP1

F2-WS, FT2-WS

VLP

Laminate-side

Resist-side

Laminate-side

Resist-sideUnder development

RTF3

DX-MP

RTF2

DGTSEU2-MP

RTF1

-5

-4

-3

-2

-1

0

0 20 40

S21

(dB

/3in

ch)

Frequency (GHz)

H-VLP3H-VLP2H-VLP

0.38mm

0.15mm

Resin

Cu foil

0.0

0.5

Pee

ling

stre

ngth

(kN

/m)

H-V

LP3

H-V

LP2

H-V

LP

H-V

LP3

H-V

LP2

H-V

LP

H-V

LP3

H-V

LP2

H-V

LP

H-V

LP3

H-V

LP2

H-V

LP

as lamina

ted

boiling t

estoven

test HCI test

New Products

Extremely low transmission loss

Good peeling strength

Excellent heat and acid resistance

H-VLP

RTF