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March 2016Issue
Magazine
Edward HughesCEO of Aculon, producers of
NanoClear® stencil nanocoating
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Chrys SheaPresident of Shea Engineering
Services, an independentconsulting firm
Today’s Presentation Nanocoating Benefits Cost and Payback Calculator Documented Performance Improvements New photos and data
Aperture Side Wall Coating Choosing Fluoropolymer or SAMP coatings Best Practices in Cleaning and Durability Distribution and Availability Sneak Peek at Next Generation Questions & Answers
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Extremely thin flux-repellent films that are applied tothe bottom side and aperture walls of stencils to:
Improve Quality Higher yields Better transfer effectiveness
Boost Productivity Less underwiping Less downtime for paper changes
Reduce Costs Less rework Lower paper and solvent consumption
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Nanoclear is a SAMP Coating(Self-Assembling Monolayer Phosphonate)
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PCB Assembly Characteristics High
er Y
ield
s
Bett
er T
rans
fer
Effe
ctiv
enes
s
Redu
ced
Und
erW
ipin
g
Less
Dow
ntim
e fo
rPa
per C
hang
e
Low
er P
aper
and
Solv
ent U
sage
Less
Rew
ork
Component Population Density
High P P P P P P P P P P P P Med P P P P P P P P P Low P P P P P P Component Mix
Most component pitches ≤ 0.5mm P P P P P P P P P P P Mix of fine and coarse pitch components P P P P P P P P Most component pitches ≥ 0.5mm P P P P Component Type Leading edge
≤ 0.4mm pitch leadless (BGA, BTC, POP), 01005 chip P P P P P P P P P P P P Challenging new packages
0.5mm pitch leadless, high I/O BGA, 0201 chip P P P P P P P P P P P PMainstream SMT> 0.5mm pitch leadless, ≥ 0.4mm leaded, ≥ 0402 chip P P P P P P
P - measurable improvement, P P - substantial improvement
Benefits of NanoClear® SMT Stencil Treatment
Quality Productivity Cost Reduction
6 6
PCB Assembly Characteristics High
er Y
ield
s
Bett
er T
rans
fer
Effe
ctiv
enes
s
Redu
ced
Und
erW
ipin
g
Less
Dow
ntim
e fo
rPa
per C
hang
e
Low
er P
aper
and
Solv
ent U
sage
Less
Rew
ork
Component Population Density
High P P P P P P P P P P P P Med P P P P P P P P P Low P P P P P P Component Mix
Most component pitches ≤ 0.5mm P P P P P P P P P P P Mix of fine and coarse pitch components P P P P P P P P Most component pitches ≥ 0.5mm P P P P Component Type Leading edge
≤ 0.4mm pitch leadless (BGA, BTC, POP), 01005 chip P P P P P P P P P P P P Challenging new packages
0.5mm pitch leadless, high I/O BGA, 0201 chip P P P P P P P P P P P PMainstream SMT> 0.5mm pitch leadless, ≥ 0.4mm leaded, ≥ 0402 chip P P P P P P
P - measurable improvement, P P - substantial improvement
Benefits of NanoClear® SMT Stencil Treatment
Quality Productivity Cost Reduction
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Early TechnologyEarly Technology
• Chemically etchedapertures
• Generic, mill-grade stainlesssteel
• Chemically etched singlesteps
• Chemically etchedapertures
• Generic, mill-grade stainlesssteel
• Chemically etched singlesteps
ImprovementsImprovements
• Laser cut apertures
• Specialty alloys
• Machined or welded multi-level steps
• Laser cut apertures
• Specialty alloys
• Machined or welded multi-level steps
All these technologies commanded a premium price when introduced to the market.SAMP nanocoatings have always been extremely affordable.
All these technologies commanded a premium price when introduced to the market.SAMP nanocoatings have always been extremely affordable.
• Simple• Customizable, no locked cells• Works with any currency• All calculations transparent• Returns payback in # of prints PLUS extra uptime
per year• Available at www.aculon.com or
www.sheaengineering.comLive Demo: Open Excel Workbook named “NanoClear Cost Savings Estimator”Live Demo: Open Excel Workbook named “NanoClear Cost Savings Estimator”
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Time required, min` 4 Cost per roll 20
Labor rate, per hour 12 Length of roll, m 10
Benefit rate, % 25 Advance per wiper pass, mm 5
Overhead Rate, % 25 # of wiper passes in cycle 3
Cost of Simple Rework 1.20$ Cost of Paper per Wipe Cycle 0.03$
Time required, min` 60 Cost of solvent container 30
Labor rate, per hour 16 Capacity of solvent container, liter 4
Benefit rate, % 25 Volume of solvent used on each wipe, ml 2
Overhead Rate, % 25 # of solvent passes in wipe cycle 1
Cost of Complex Rework 24.00$ Cost of Solvent per Wipe Cycle 0.02$
Cost of Complex Rework
Rework and Consumables Cost Calculator
Cost of Simple Rework Cost of Wiper Paper
Cost of Wiper Solvent
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Current First Pass Yield, % 80 Savings per print 0.35$
Projected First Pass Yield, % 90 Cost of Nanoclear 25.00$
% Improvement 10% Cost of Application 20.00$
% of defects requiring simple rework 90 Payback - # of Prints 128
% of defects requiring complex rework 10
Savings in Yield Improvement, per print 0.35$
# of prints per hour 60Current Wipe Frequency 5 # of production hours per week 80Projected Wipe Frequency 10 # of paper roll changes per week 10
% Reduction 50% Time to change wiper roll, minutes 5Savings in under wipe consumables, per print 0.005$ Annual Cost Reduction 87,984$
Cost of simple rework 1.20$ Additional Prodution Uptime, hours per year 43
Cost of complex rework 24.00$ Additional PCBs assembled per year 2600
Cost of wiper paper, per wipe cycle 0.03$Cost of solvent, per wipe cycle 0.02$
Modify cost information on the "Cost Calculator" tab
Cost Reduction
Payback Period
Cost Savings of NanoClear® SMT Stencil Treatment
Quality
Productivity
Annual Savings per SMT Line
>>> PLUS <<<
Enter information into the white cells; calculations appear in the yellow cells
0.4mm QFN in production (100µm stencil)
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Without Nanoclear With Nanoclear
Compare PrintQuality
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0.5mm QFN in production (120µm stencil)
With NanoclearWet/Dry wipe: 5 prints
Wet/Dry/Vac wipe: 10 prints
Without NanoclearWet/Dry wipe: 3 prints
Wet/Dry/Vac wipe: 6 prints
Better PrintQuality
FewerWipes
• SPI Yields boosted from 60% to 75%• 0.4mm QFN - 100µ stencil Average height reduced from ~120% of stencil thickness to ~97% of
stencil thickness – more in control Average transfer efficiency reduced from 150% to 125% - more in
control• 0.5mm QFN - 120µ stencil, less wiping Average height reduced from ~134% of stencil thickness to ~120%
of stencil thickness– more in control Average transfer efficiency reduced from 138% to 125% - more in
control• All min-max ranges improved also
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Improvements due to cleaner stencil bottom and apertures
Yes!• Because it is so thin it is difficult to see• Transmission Electron Microscopy is requiredFirst coated with CrThen coated with C-based inkThen coated with PtCross sectioned and analyzed
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• Three sample configurationsNo coatingFresh coatingCoating after 15,000 print cycles and 5,000 in-
printer solvent wipe cycles
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Stainless steel
Pt layer
NanoCoat
Cr layer,distinguishesbetween nanocoatand Pt layer
Carbon Layer
Stainless Steel
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High mag cross section of corner – no coating
Sidewall – coated
Sidewall – coated & 15kprints
No NanoCoat
NanoCoat
NanoCoat Present
Contamination
Summary Stencil with no nanocoating: No coating was detected Stencil with nanocoating: Nanocoating was detected with thickness ranging
from 0.99nm to 4.76nm. Stencil with nanocoating after 15,000 printed (5,000 cleaned by auto wiper with
solvent): Nanocoating remained intact. However, there appears to be a buildupof solder paste/ contamination beneath the chrome layer that was not presentbefore. Due to a lack of cleaning solder paste / contamination has essentiallyoverwhelmed the nanocoating as material has built up on top of it.
In prior work Aculon has demonstrated that the use of just a dry wipe or using justIPA does not as effectively clean the treated stencil as engineered solvents.
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Attribute Fluoro-Polymer SAMP
Application Spray andthermal cure Wipe on
Applied by Stencil supplier Supplier or self
Thickness 2-4 µm 1-2 nm
Hydro- and oleophobic
Abrasion resistance
Chemical resistance
Visible
Accessibility Selected suppliers Stencil suppliers or internet
Reworkable if worn off
Reduces frequency ofunderside cleaning
Solder paste volume 15 – 25% increase in TE Slight decrease < 5%
Aperture Redesign? Maybe No
Minimum Area Ratio 0.10 lower than foil Same as foil
Cost >$100 supplier dependent $20-50
Based on 5 years of production and multipleresearch projects:
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1. Use soft, non-abrasive UnderstencilWiper Paper such as Eco Roll SC-ER360 or Hyperclean PP4200
2. Utilize a Solvent Wipe Rather than aDry Wipe – engineered solvents arebest for lead-free no-clean pastes
3. Utilize pH Neutral Cleaners4. Reduce Understencil Wipe Frequency
10 prints with 1 wipe (vac-dry-vac)
Untreated Nanocoated
Flux treated with UV tracer dye and photographed under black light
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Dry WipeApertures are Clear
But thin film of flux remains
IPA WipeSmall apertures are blocked
Thin film of flux remains
Solvent WipeSmall apertures are clearNo visible film remains
Stencil Coated with NanoClear; Paste is Pb-Free No-clean
NanoClear® is 100% Compatible with IPA….But is your solder paste?
Lead-Free Tin-Lead
Many lead-free solder paste fluxes use synthetic resins that are insoluble in IPAIf aperture clogging is a chronic problem with IPA, check the compatibility
of the IPA with the solder paste
DESIRABLEUNDESIRABLE
• Edward/Mario
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Next Generation Coating• Finalizing development cycle• Local testing showing excellent performance
in the printer and in the stencil cleaner• Beta test partnerships available
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• Edward/Mario
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NanoClear® NanoCoating Increases print yields
Reduces print volume variation
Improves print definition
Extends under wipe frequency
Decreases wipe consumables costs & downtime
Extensively tested & broadly adopted
Delivers the industry’s best cost, performance and ease of use
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NanoClear enables a higher quality, more cost-effective stencil print process
Presentation Will be emailed to all attendees
Videos Introduction & Instruction Videos
For Free samples NanoClear Free samples
To Download Cost Calculator Workbook NanoClear Cost of Ownership Calculator
To order NanoClear Shopping Cart
For questions and volume quotes for NanoClear Contact Mario Gattuso [email protected]
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