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I. Introduction 1.1 Objectives The APHY 198 Practicum aims to prepare senior BS Applied Physics students in their future career paths. The students can choose to be an intern of a research agency or an industrial company. During their stay in the institution, they will most probably encounter equipment and machinery not available in the university. With their theoretical understanding of the concepts behind the basic operation of scientific instruments, the students are expected to learn new skill sets relevant to their degree. Another goal of this internship is to expose the students to a working environment different from your typical classroom. They will be working under a supervisor and with experienced colleagues; dealing with deadlines and rush jobs; and experience working eight to ten hours a day. 1.2 Place and Duration of Practicum This practicum was held in the Design and Development Engineering Department of Excelitas Technologies Corporation. To accomplish the required 144-hour stay in the company, I worked nine hours a day from June 22 to July 16, 2014. The intern worked a total of 159 hours in the company. 1

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I. Introduction

1.1 Objectives

The APHY 198 Practicum aims to prepare senior BS Applied Physics students in their

future career paths. The students can choose to be an intern of a research agency or an

industrial company. During their stay in the institution, they will most probably encounter

equipment and machinery not available in the university. With their theoretical

understanding of the concepts behind the basic operation of scientific instruments, the

students are expected to learn new skill sets relevant to their degree.

Another goal of this internship is to expose the students to a working environment

different from your typical classroom. They will be working under a supervisor and with

experienced colleagues; dealing with deadlines and rush jobs; and experience working

eight to ten hours a day.

1.2 Place and Duration of Practicum

This practicum was held in the Design and Development Engineering Department of

Excelitas Technologies Corporation. To accomplish the required 144-hour stay in the

company, I worked nine hours a day from June 22 to July 16, 2014. The intern worked a

total of 159 hours in the company.

Figure 1 Excelitas Technologies Corporation located in 3 Ampere St. Light

Industry Science Park 1, Cabuyao, Laguna [1]

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II. Company Profile

2.1 Historical Background

The company was started in Boston, Massachusetts by some MIT Professors in

1931. After the Second World War, EG&G was incorporated and since then the company

acquired many different divisions: GE/RCA Electro-Optics Division, inventor of high

performance solid - state detectors and laser emitters; Reticon, a leader in CCD Imaging;

HeimannOpto-electronics, provider of state-of-the art flash lamps, photocells, thermopiles,

and pyroelectric detectors; Vactec, an innovator in low-cost photodiodes and photocells

and Lumen Technologies, known for CW Xenon lighting, flash lamps and aerospace-

qualified lighting. For the past 80 years, the company evolved into being an institution of

superior technological advancement specializing in lighting and detection [2].

In 1999, the company bought the Analytical Instrument division of PerkinElmer. The

company then adapted the name PerkinElmer Optoelectronics. In late 2010, that same

division was bought by Veritas Capital for an estimated value of 500M US dollars. The

name Excelitas Technologies was then launched on the same year [2].

Presently, the company is organized into three business entities: Lighting, Detection

and Advanced Electronic Systems [2]. The company has 12 manufacturing sites and

seven sales offices all around the globe.

The Manila site is located in 3 Ampere St. Light Industry Science Park 1, Cabuyao,

Laguna. It has a floor area of 5000 square meters and a total number of 397 employees.

The Manila site specializes in Detection and produces different sensor products such as:

photodiodes, photodiode arrays, phototransistors, infra-red emitters, high performance

sensors and sensor hybrid assemblies [1]

2.2 Hierarchical Background

Excelitas Technologies Corporation is a globally recognized company with 12

manufacturing sites and seven sales offices all over the world. The corporate

headquarters is located in Waltham, Massachusetts and is spearheaded by CEO David

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Nislick. The company has three business units: Lighting, Detection and Advanced

Electronics Systems. The figure below shows the international organizational set-up of

the company [2].

Figure 2 Organizational set-up of the Excelitas Tescnologies Corporation [2]

The site in the Philippines is under the Detection division. The organizational set-up

of the Manila site is shown in the figure below.

Figure 3 Hierachical chart showing the dynamics in the Manila Site of Excelitas

Technologies Corporation

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Chief Executive Officer

Executive Vice President and Chief Financial

Officer

Senior Vice President,

General Counsel and Secretary

Executive Vice President and Chief Human

Resources Officer

Executive Vice President and

Chief Operations Officer

Executive Vice President,

Commercial

Executive Vice President,

Defense and Aerospace

Site LeaderDesign and Development Engineering Senior Manager

Unit Manager 1Senior Engineer

Engineer

Purchasing Senior ManagerSenior Purchasing

Purchasing

Manufacturing Senior ManagerUnit Manager 1Group Leader

Process Engineering Senior ManagerUnit Manager 1

Engineer 2Process Engineer

Sr. EngineerProcess Engineer

Facilities/ Equipment Engineering Senior Manager

Information Technology Senior Manager IT Engineer

Accounting Senior ManagerUnit Manager 1

Senior Accountant

Payroll

Costing

Human Resource ManagerSenior Human Resource

Human Resource

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2.3 Laboratory Description and Location Map

The Manila site is located at 3 Ampere St. Light Industry and Science Park 1,

Cabuyao, Laguna, Philippines. It is a building with three floors of production lines dubbed

Modules (ground level), Leadframes (second floor) and Headers (third floor).

The Headers section is where new products are manufactured by the engineers

belonging to the Design and Development Engineering (DDE) department. The

Leadframes section is where existing and established products are manufactured,

improved and tested. The product assembly takes place in the Modules section.

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Figure 4 Digital sketch showing the location of Excelitas Technologies, taken from

Google satellite maps

Figure 5 Floor plan of the third floor of Excelitas Technologies, the arrow points to the

location of the assigned department office

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The activities done by the interns are not limited in the third floor production area,

they are also given tasks on the second and ground level production areas.

2.4 Nature of Products

The main products manufactured in the Manila site are under the detection business

unit of Excelitas Technologies. The table below summarizes the product information of

said products.

Product Description

 Photonic Detectors

Laser diodes – often used in distance and phase shift

range finding systems [4]

Photodiodes – have very high dark resistance; often used

for industrial and commercial applications [4]

Infrared Emitter diodes – used for smoke detector

applications [4]

Phototransistor – have very high gains and very fast

response time [4]

Thermal Infrared Detectors

Surface Mount Detectors (SMD) Pyroelectric Detectors

and SMD Thermopile Detectors – devices suited for high

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volume production of Printed Circuit Boards (PCB); very

small in size and has compact design; main applications

include automatic light switching, presence detection, home

security, energy conserving home appliances and gesture

recognition [5]

2.5 Processing/ Manufacturing Operations

The products being developed by Excelitas Technologies are manufactured using a

process called semiconductor device fabrication. Generally, it involves a multiple-step

sequence wherein electronic components are designed on a semiconducting wafer. The

table below summarizes the manufacturing processes and operations conducted during

production.

Procedure Description

Wafer Testing A step to detect defects on the semiconductor material before

being assembled to electronic components

Sawing A step wherein the wafer is sawed into its corresponding parts

called die

Demounting Using a wafer demounting device, the prepared die are attached to

metal leadframes

Wire Bonding Step performed to create interconnections between the

semiconducting device and another metallic surface

Casting Coating the metal leadframe with protective layer

Trimming Cutting leads into corresponding lengths (for distinction of positive

and negative terminals)

Solder Dipping Process wherein the electronic material is soldered into a PCB; Hot

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tin wets are the commonly used material in this step

Thermal Testing This is done to assess if the device can withstand extreme

temperatures

Visual Inspection This step is done to assure that the device has no visible defects

like cracks, contamination and scratches

Singulation Step done to separate the products that passed the visual

inspection

Electrical Testing This process is done using customized testers to measure the

relevant parameters like power output and irradiance

2.6 Hygiene, Sanitation and Environmental Quality Control

As a global technology leader specializing in various optoelectronics, Excelitas

Technologies Corporation prioritizes the safety and health of its employees and the

surrounding community. It follows an extensive Environment Health and Safety (EHS)

approach to minimize accidents and to efficiently use and manage resources [3].

All employees are given smocks (protective laboratory gown with hood) and white

company shoes. The company shoes are worn inside the building only. Street shoes and

other footwear are not allowed inside the premises. The shoes are worn with socks and

should be worn at all times within the production line [3].

While wearing the company issued gown-type hooded smocks, employees are not

allowed to wear cosmetics (face powder, lipstick, etc.) because it could lead to the

comtamination of electrical components. Jewelries are also strongly discouraged while

working inside the production line. The smocks should not be worn in conference rooms,

cafeteria, rest rooms, clinic and lobby [3].

The smocks are worn such that the following guidelines are met:

No exposed hair strands

Face mask, if required, covers nose and mouth

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Zippered till the neck line

Unfolded sleeves

No ID cards outside smock

No clothing worn over the smock

No things inside the built-in bag

Figure 6 Proper way of wearing company issued apparel

III. Activities Performed During Practicum

Some of the main activities the interns are given are Measurement system analysis of

product testers, visual inspection of products, Documentation of defects, Measurement of

electrical parameters of devices and studying the LabView software. Tables 1 through 4

summarizes the activities conducted during my internship in the company

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Table 1. Activities done during Week 1 (June 22 – June 26 2015)

Date Activity/ Goal Details

06-22-2015 New Employee Orientation

Program for Interns

Discussion of Company Overview, Clinical Lectures,

Major Initiatives of the company, Company rules and

regulations

Visual inspection of laser diodes Visual inspection of caps of newly manufactured

laser diodes via optical microscope; cleaning caps

using blow gun (200 units)

06-23-2015 Visual inspection of laser diodes Visual inspection via optical microscope; cleaning

caps using blow gun (200 units)

LabView Session LabView Introductory Lectures (Chapters 1, 2);

LabView is a software that enables engineers to

create virtual instruments…

Transferring laser diodes units to

shipping containers

Laser diodes are electrically sensitive devices, the

use of electron static discharge (ESD) bracelets is

required; Initial visual inspection of 40 units

Unwinding block component

carrier (1400 units)

Use of specialized equipment to transfer tape reels

to appropriate container; documentation of process

06-24-2015 Weekly Teleconference Teleconference with Montreal branch; Discussion of

the ongoing projects, updates, problems

encountered, customer feedback

Line tour c/o by outgoing OJTs Tour around the production line; sharing of advices

and experiences

LabView Session Exercises on creating, editing and debugging virtual

instruments (Vis)

Office Work Materials Issuance of face masks and tape

Measurement of dimensions of

semiconductor wafer chips

Use of digital caliper to measure the thickness of

semiconductor wafer chips; documentation of

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process

06-25-2015 Environment, Health and Safety

(EHS) Lecture

Discussion of company records regarding EHS;

conducted by supervising DDE engineer; tour around

production

LabView Session Exercise on creating icons and connectors in VI;

using Vis as subVIs

Matching cavities Matching body and lid of specialized containers (144

units)

Office work Materials Issuance of office supplies

Measurement of dimensions of

semiconductor wafer chips

Using specialized equipment to measure dimensions

of a component of semicon wafer chips (35 units)

06-26-2015 LabView session Exercise on Loops and Charts; using while loop and

waveform chart to acquire data in real time

Power Output Measurement Measuring power output of plastic laser diodes (112

units) using specialized equipment

Product testing Product testing of semicon wafer chips using

specialized equipment (45 units)

Power Output Measurement Measuring power output of metal can laser diodes

(123 units) using specialized equipment

Table 2. Activities done during Week 2 (June 29 – July 3, 2015)

Date Activity/ Goal Details

06-29-2015 LabView Session Exercise on Loops and Charts; using shift registers

to perform a running average; building VIs that

displays 2 random plots on a waveform chart in

sweep update mode

Assembly and Testing of smoke

detectors

Cap assembly – component insertion into chambers

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Testing – observing response of components to

simulated smoke signals; observing response of

components to empty chamber units (172 units)

Office work Materials Issuance of unit containers

Handling laser diodes Serializing and putting units in appropriate containers

(85 units)

06-30-15 Testing Infrared smoke detector

components

Using specialized PC-based specialized equipment

to measure angular response of the units (Bin 1 and

2)

Final Product testing Product testing of semicon wafer chips using

specialized equipment (45 units)

07-01-2015 Testing Infrared smoke detector

components

Using specialized PC-based specialized equipment

to measure angular response of the units (Bin 3A, 3B

and 4A)

07-02-2015 LabView Session Continuation of exercises on Loops and Charts

Testing of Oximeters Measurement of Power output using PC-based

specialized equipment (10 units)

07-03-2015 LabView Session Exercise on Strings and File I/O; to create a subVI

utilizing the Format into String, Concatenate string,

String Length functions

Handling laser diodes Serializing and putting units in appropriate containers

(114 units)

Assembly of smoke detectors Insertion of components using specialized

equipment; Curing of units; Auto-trimming of units;

Temporary serialization (147 units)

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Table 3. Activities done during Week 3 (July 06 – July 10, 2015)

Date Activity/ Goal Details

07-06-2015 Assembly and Testing of smoke

detectors

Auto trimming of component detectors (35 units)

Testing – observing response of components to

simulated smoke signals; observing response of

components to empty chamber units (172 units)

Matching of cap and chamber parts (172 units)

07-07-15 Lecture Detailed discussion of the products and projects

currently being developed/ produced by the

company

Study session Study session of acceptability of printed boards,

discussion of surface imperfections, subsurface

imperfections, imperfections on conductive pattern,

hole characteristics, markings anomalies, solder

resist surface coating imperfections and

dimensional characteristics

Dimension measurements X-ray crystals dimension measurements using

specialized equipment

Product testing Testing FPGA boards using specialized equipment

Product testing Testing oximeters using specialized equipment

Dimension measurements Photodiode dimension measurements using

specialized equipment

07-08-2015 Product testing Testing FPGA boards using specialized equipment

Analysis of Reliability of Product

testers

Repeated random testing of Surface mount

detector units to analyze factors affecting product

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performance

Dimension measurements X-ray crystals dimension measurements using

specialized equipment

07-09-2015 Did not report due to unfavorable weather conditions

07-10-2015 Product testing Testing FPGA boards using specialized equipment

Analysis of Reliability of Product

testers

Repeated random testing of FPGA board units to

analyze factors affecting product performance

Documentation Documentation of production defects of surface

mount detector units

Table 4. Activities done during Week 4 (July 13 – July 16, 2015)

Date Activity/ Goal Details

07-13-2015 Visual inspection Visual inspection of caps of newly manufactured

laser diodes via optical microscope; cleaning caps

using blow gun (400 units)

Data processing Consolidation of data for photodiode testing;

measurement system analysis of testers

Reliability measurements Testing oximeter units using specialized instrument

(10 units)

Product testing Testing Surface Mount Detector units using

specialized instrument (45 units)

07-14-15 LabView session Discussion on project development process of

virtual instruments using LabView interface

Measurement System Analysis Testing Surface Mount Detector units using

specialized instrument (50 units)

Three different operators performed the testing of

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units; the MSA was done for three trials

07-15-2015 Power Output Measurement The PO of the blue LED component of smoke

detectors were measured using customized tester

(140 units)

Irradiance Test Using customized PC-based tester, the irradiance

of blue LED components were measured (140

units)

07-16-2015 Documentation of Laser Diode

Defects

Using low power optical microscope, the product

defects of laser diodes were identified and

documented (25 units)

Final Visual Inspection Using low power optical microscope, Final visual

inspection of laser diode units was done. The

diode caps were inspected and good units were

separated from those with defects (60 units)

Visual Inspection Using low power microscope, the defects of

Surface Mount Detectors produced using old

machine was identified; units were sorted and

separated according to product defect (40 units)

IV. Problems Encountered and Solutions

Even in a well-operated industrial company, unavoidable incidents can lead to delays

in production and accidents. One of the problems we encountered during our stay is when

we were performing tests of FPGA boards and the tester we were using is not yet fully

developed. Because the project is still at its early age of development, the tester we were

using is not as reliable as the customized testers used in other projects. Because we

were still inexperienced in handling technical errors in the tester software, our task was

delayed for a few hours. It was a critical task because the client is actually waiting for the

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sample units to be shipped on that day. We also have had difficulties when we were

assigned in the evaluation of smoke detector product rejects. The testers we were using

were unavailable then so we had to wait for the maintenance and calibration personnel to

restore the software and hardware. Other than these minor inconveniences, the interns

did not really encounter major problems in their practicum. The supervisors are also

always available for consultation and they never fail to give sound advice and assistance.

V. Conclusion and Recommendation

At the end of the practicum, the interns learned many practical skills that can be

applied to their future careers. Good work habits and work relationships were also

developed during their stay in the company. For future UPLB BS Applied Physics interns

who considers taking their practicum in the Excelitas Technologies, it is recommended

that they always ask questions and to not hesitate to ask for help among the operators

and engineers. It is important to know what the purpose of the task assigned to you.

Knowing these things will enable interns to appreciate and understand the importance of

the activities assigned to them. When using equipment and machineries that are new and

unfamiliar, it is critical to always read the labels, warnings and flags.

VI. References

[1] Manila Overview slides, powerpoint presentation, from the New Employees

Orientation Program (NEOP) lectures

[2] New Hire Orientation slides, powerpoint presentation, from the New Employees

Orientation Program (NEOP) lectures

[3] Apparel Implementation slides, powerpoint presentation, from the New Employees

Orientation Program (NEOP) lectures

[4] http://www.excelitas.com/Downloads/CAT_PhotonDetection.pdf

[5] http://www.excelitas.com/Pages/Product/Thermal-Infrared-Detectors.aspx

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