Manufacturing Advantage Service: Mobile System Integration
Intel Centrino Duo Mobile Technology-based Notebooks September
2006
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Disclaimer All Intel boxed products are intended to be
professionally installed. This product integration training and the
guidance contained herein is provided to Intel customers as a
convenience. Intel assumes no responsibility for any errors
contained in this training and has no liabilities or obligations
for any damages arising from or in connection with the use of this
training and the guidance contained herein. Intel is not obligated
to provide any support or assistance with regard to the information
provided in this training. Consult all product manufacturers
documentation before attempting to install or remove Intel boxed
products. INFORMATION IN THIS PRODUCT INTEGRATION TRAINING IS
PROVIDED IN CONNECTION WITH INTEL PRODUCTS. EXCEPT AS PROVIDED IN
INTELS TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS. INTEL
ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS,
INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT, OR OTHER INTELLECTUAL PROPERY RIGHT. All products,
dates, and figures are preliminary and subject to change without
notice. Intel may make changes to this training and product
descriptions at any time, without notice. Intel, Pentium, Intel
Inside, NetBurst, Centrino, Celeron, the Intel Inside logo and the
Intel logo are trademarks or registered trademarks of Intel
Corporation or its subsidiaries in the United States and other
countries. The hardware vendors of the barebone notebooks and the
interchangeable components remain solely responsible for the
design, sale and functionality of their respective products,
including any liability arising from product infringement and
product warranty. Intel is not warranting the products of the
hardware vendors *Other names and brands may be claimed as the
property of others. 2006 Intel Corporation
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Objectives Introduce mobile basics to new notebook resellers
Provide tips and hints for quality mobile integration
Slide 4
Agenda What is Different about Mobile Design Building a
Notebook Material Handling and Operation Top Tips for Verified by
Intel Notebooks
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What is Different about Mobile Design Most new notebooks are
designed for high-volume manufacturing Easily accessible components
Limited number of required tools Notebooks have fewer components to
integrate than desktop or server systems Desktop/Server PSU,
multiple HDD, multiple ODD, motherboard, cpu+heatsink, memory,
add-in cards Mobile 1 HDD, 1 ODD, cpu+heatsink, memory, WLAN
Notebook components are smaller than server/desktop components
Typically more sensitive to shock & vibration Requires more
precise and careful handling methods Intel Centrino Duo-based
notebooks are Easy to Build
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Mobile Integration Flow
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Notebook SKU management Pre-2006 customer feedback Mobile
integration is complex with high sku maintenance Inflexible supply
choice Inventory management difficulties New features introduced
with Barebone Notebooks that are Verified By Intel Designs from
selected ODMs tested by Intel for interchangeability across Common
Building Blocks 7 CBBs in 2006 - hard disk drive, optical disk
drive, keyboard, battery pack, LCD panel, customizable notebook
panel (CNP) & AC adapter CBB defines the mechanical form and
fit and basic electrical connections
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Verified certain barebones notebook designs of ODMs for
interchangeability 24x7 support via web/phone/email Warranty
fulfillment by Intel on behalf of ODM Warranty support for
resellers only Intel Customer Support & Post Sales Support
Interchangeability Vision Verified By Intel
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Verified By Intel & Interchangeability Optical Drive Hard
Disk LCD Keyboard Custom Panel AC Adapter Battery Pack Channel
Value Multiple suppliers Flexibility Improved availability
Customizable Notebooks Vision: Accelerate Adoption of
Interchangeable Ingredients New for 2006
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Participating Vendor Detail Barebone Notebooks that are
Verified By Intel Asus* Compal* Quanta* * Other names and brands
may be claimed as the property of others. Interchangeable
Ingredients Tested & verified for compliance to industry or
Intel specifications Hard Disk Battery Optical Drive Keyboard AC/DC
CNP LCD Hitachi*, Fujitsu*, Seagate* Panasonic*, QSI*, Lite-On*
CMO*, AUO*, CPT*, QDI* Simplo*, Dynapack*, Celxpert* Sunrex* Delta*
Bradys*, FedEx Kinkos*, Worldmark* Channel Value Multiple suppliers
Flexibility Improved availability Customizable Notebooks
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Agenda What is Different about Mobile Design Building a
Notebook Material Handling and Operation Top Tips for Verified by
Intel Notebooks
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Common component locations Most components are accessible via
the bottom of the notebook Some components may be located top-side,
underneath the keyboard Battery CPU, memory, WLAN HDD CPU, memory,
WLAN Battery HDD, WLAN CPUMemoryHDD
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General Tips for Mobile System Integration Remove power cable
and battery before any work Option to order notebook without the
battery installed could reduce installation time Minimize ESD and
physical shock Assemble one component at a time; keep screws
together Recommend to have a bin of extra screws, as it is usually
not cost effective to search for a dropped screw Follow System
Torque requirements; do not over-tighten screws Loosen all screws
before removing component/screw panels; loosely tighten all screws
before securing component/screw panel
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CPU Insertion and Attributes Intel Mobile ProcessorIntel
Desktop Processor Retention MechanismRetention ScrewRetention Lever
SocketMicro-FCPGA 478-pinLGA775 CPU Pin A1 markingYes
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CPU Insertion Tips (1 of 2) 1. Remove CPU Fan Cable 2. Loosen
all screws first before removing thermal mounting plate
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CPU Insertion Tips (2 of 2) 3. Align CPU Pin 1 with socket;
turn retention screw to secure CPU in socket 4. Loosely tighten all
screws first before securing thermal mounting plate
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Wireless LAN Card Tips 1. When not in use - Recommend to use a
non-conductive material around the antennae connector leads 2.
Insert WLAN card at an angle, and gently push down 3A. Do not swap
the two WLAN connector leads Main and Aux 3B. To ensure tight
connection, firmly press on the leads until a click is felt
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Keyboard/LCD Tips The ribbon cable connector that attaches to
the LCD screen, keyboard and mouse pad connector could be easily
ripped. These cables can create intricate assembly procedure,
manufacturing aids that hold components in place can help with this
process. The panel that holds the keyboard in place is fragile.
Breakage from the assembly / disassembly process can be minimized
with careful handling.
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Memory & HDD Tips 2. HDD may have mounting brackets, handle
with care to avoid physical shock 1. Insert Memory at an angle and
then gently press down until locking in place
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Agenda What is Different about Mobile Design Building a
Notebook Material Handling and Operation Top Tips for Verified by
Intel Notebooks
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Recommended Materials
Slide 22
Screw Torque Requirements The screw torque is an important
factor when assembling systems Too much torque will strip the
threads of screws or screw holes, causing damage to the component
If there is not enough torque applied to a screw, then components
can shake loose during shipping, often causing extensive damage to
the computer system Never use screw after multiple insertion or
after any striping. Torque requirements should be available from
barebones system supplier
Slide 23
ESD Overview Electrostatic Discharge, or ESD, is an event which
occurs when two dissimilarly charged materials move to the same
electrical potential ESD is one of the most common causes of
semiconductor failure ESD normally causes latent failures, where
the circuit works for a short time, but fails prematurely Latent
failures usually make it into customers hands before they fail
Survey source: Intel, 1998
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ESD Basic Checklist Keep your work area clean. Eliminate all
non-conductors from assembly and test area or neutralize static
charges with ion systems Work surfaces and conveyors are grounded
Floors and work surfaces are kept free of dust Charge generators
are kept out of the work area Employees wear ESD protective
equipment Handle electronic devices and assemblies only if you are
properly grounded Employees wear ESD shoes or heel straps and ESD
smocks If an ESD floor is not available, employees need to wear
wrist straps, this includes Receiving, Storage, Repair and the
Reject area Employees test twice daily for ESD compliance Store and
transport ESD sensitive items in static shielding containers or
faraday cages Assume all electronic devices and equipment are
susceptible to ESD damage or failure
Slide 25
Material Storage In the case of ESD sensitive components, they
should be stored in their ESD package, and preferable in a grounded
storage location (i.e. Grounded shelves) In the case of humidity
sensitive, components should be kept in their sealed containers. No
damage due to humidity should be observed in the container. If the
material is suspect, follow the quarantine/rebake procedures In the
case of temperature sensitive components, they should be store in a
temperature controlled area, with temperature monitors
Slide 26
Material Handling Circuit Boards Broken caps Bent pins Cracked
connecters Cracked solder joints Cracked circuit boards CPUs/ICs
Bent pins Broken capacitors & resistors Drives Head slap
Chipped sectors on disc Head misalignment Exterior surfaces
Scratches Dents Broken components Types of damage that can be
caused by physical shocks
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Material Handling Do not stack devices, and do not place other
objects on top of the devices Keep material in its original
packaging until it is ready to be used Place devices flat on an ESD
padded surface Do not place devices on top of ESD bag Handle all
devices by the edge The following guidelines can greatly reduce the
risk of damaging components from physical shocks and ESD
Slide 28
Processor Handling/Insertion Overview Before installing the
processor, inspect the package for Physical damage such as
scratches, die chips, or cracks Bent or misaligned pins Debris on
the die or within the pins which cannot be blown off Ensure the
socket is properly mounted on the motherboard in the correct
orientation Ensure the socket is free of debris and the socket
holes are clear of any contamination Ensure the socket is in the
OPEN position Do not force the package into the socket
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Processor Handling (1 of 3) Care must be exercised when
attaching the thermal solution to the processor Avoid edge loading
or concentrated forces on the die Processors are ESD-sensitive Same
as current processors Follow safe ESD practices (clothing,
grounding, work areas) Processors should only be unpacked from
boxes at ESD workstations Transfer material using ESD-safe trays,
not by hand (note: shipping trays are static dissipative) Example:
During assembly, a tilted thermal solution may apply undesired
instantaneous edge loading to the bare die during assembly which
could cause damage to the die
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Processor Handling (2 of 3) Avoid touching or pressing on the
silicon die Avoid smashing the balls, dont coin-stack units Avoid
putting excessive force on the die Avoid scratching die Avoid
introducing foreign material onto die surface > 100 psi
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Processor Handling (3 of 3) Care must be exercised when
disassembling the thermal solution from the processor Some thermal
interface materials have high viscosity High-viscosity materials
may induce high stress on die during disassembly High viscosity
materials may need heating to soften prior to disassembly In
general, a torsional (twisting) removal force is better than
peeling as former tends to shear the thermal interface materials
rather than transferring a tensile load to the silicon die
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Agenda What is Different about Mobile Design Building a
Notebook Material Handling and Operation Top Tips for Verified by
Intel Notebooks
Slide 33
Tips - Customizable Notebook Panel (CNP) What is the
Customisable Notebook Panel? It is a piece of material (typically
Polycarbonate or Vinyl) that has been customized for the insertion
into the top cover of notebook barebones supporting
interchangeability It is designed for thin & light notebook
computer platforms to allow an integrator to differentiate the
design of their notebooks with a high quality, cost effective,
customized design Barebones that are Verified By Intel will ship
with ~0.3mm recess on the A Cover to accommodate the panel CNP is
not designed to be reusable Before installation of the CNP, clean
the A-cover surface with isoprophyl alcohol Remove air bubbles
before completing installation Use a roller or ruler 2 Types of
adhesive available: Permanent type Pressure Sensitive Adhesive
(PSA) ~15 minutes to set Removal of CNP after the PSA has set and
cured is not recommended (leaves residue & can damage A Cover)
Replaceable type Pressure Sensitive Adhesive (PSA) Adjust and
verify CNP alignment before the PSA has set and cured
(~15minutes)
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Tips Verified by Intel Warranty Policy Eligible warranty
components L4, ODD (include bezel), keyboard (include keyboard
cover strip), thermal module, battery, AC/DC power adapter HDD,
Wireless, CPU & memory excluded from warranty L4 definition -
Chassis, motherboard, LCD Reseller should remove the following
components when returning the L4 barebone/chassis (if not, they
will not be returned to the reseller by Intel) ODD (w/bezel),
keyboard (w/keyboard strip), battery, HDD (w/HDD brackets),
wireless card, processor, thermal module, memory, CNP, AC/DC power
adapter Defective components will be replaced by Intel Components
determined to be CID/NTF/NDF will be returned to the reseller For
any warranty questions, please contact Intel Customer Support
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Tips Verified by Intel Warranty Policy (Contd) L4 Returns &
Customizable Notebook Panels (CNP) The CNP will not be returned The
reseller will be required to replace the CNP L4 Returns and
Stickers The Microsoft* Certificate of Authenticity sticker placed
on the chassis will not be replaced along with a L4 barebone return
Recommend placing OS license sticker on a removable part (i.e. the
hard drive cover) and remove part before sending in the L4 It will
be the resellers responsibility to replace any OS logo stickers for
the A Cover Country of Assembly (COA) stickers placed on the
chassis will not be replaced for an L4 return Recommend placing COA
sticker on a removable part (i.e. the hard drive cover) and remove
part before sending in the L4 It will be the resellers
responsibility to replace any CPU or Intel Centrino Mobile
Technology stickers after appropriately re-certifying the system
For any warranty questions, please contact Intel Customer
Support
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Tips LCD Panel LCD Handling Recommendations Do not push or
scratch LCD panel surface with any objects Do not touch the LCD
panel surface with bare hands Wipe off LCD panel surface with an
absorbent cotton or soft cloth E.g. dust, dirt, fingerprints,
smudges Immediately wipe off drops of liquids (e.g. adhesives,
saliva, water) on the LCD panel surface Liquids may cause panel
surface variation and color change Use screen savers to lessen the
chance of permanent patterns from being imprinted on the
screen
Slide 37
Tips Interchangeable Battery Pack Notebook Barebones that are
Verified By Intel may or may not require a cover that is attached
to the battery pack The cover need not be the same as the reference
design but it must fit to the attachment mechanism of the battery
pack For example, to swap the battery pack from one Verified By
Intel Barebone to another you may need to either remove or add a
battery cover depending on the make and model of the barebone Each
cover is designed to have five rear catch pins and four front catch
pins To remove the cover use a flat wedge tool For visual examples
refer to 4-figures in following slide
Slide 38
Tips Interchangeable Battery Pack (Contd)
Slide 39
Tips Updating to Intel Core TM 2 Duo Processor All Verified By
Intel SKUs support: Intel Core Duo Processor (65nm Intel codename
Yonah) Intel Core 2 Duo Processor (65nm Intel codename Merom) BIOS
Update Required Intel Core Solo Processor (65nm Intel codename
Yonah) Intel Celeron M processor (65nm Intel codename Yonah or
Merom only) Updating to Intel Core 2 Duo Processor (Merom) No H/W
or product code changes required except ASmobile* S62x series 2 new
part codes S62FM and S62JM that are Merom-ready BIOS update
required on most SKUs Most SKUs require Intel Core Processor during
BIOS upgrade Requesting ODMs to externally ID Merom Ready systems
Not all SKUs will support Microsoft* Windows* XP-64 32-bit OS
support confirmed on all SKUs Quanta* Thermal Solution New larger
Thermal Interface Material (TIM) should be used Larger surface area
due to increase in processor die size of the Intel Core TM 2 Duo
processor Ensure that thermal throttle feature is enabled in BIOS
No product code change for TIM modification * Intel internal
codename
Slide 40
Tips - Thermals and Wireless Notebooks typically use
low-profile heat spreader thermal solutions for the processor Fan
may not be attached directly to thermal solution Screw locations
also may be located away from the processor area Wireless antennae
connector leads When not in use, it is recommend to use a
non-conductive material around the antennae connector leads
Slide 41
Mobile Platform Integration Resources via the Intel Reseller
website (login required) Intel Channel Knowledge Builder website:
http://intel.seminars.net/etraining
http://intel.seminars.net/etraining Interactive Hardware
Integration Training for VBI-based notebooks Mobile Platform
Integration Guides 1 ODD Installation Guide CNP Installation Guide
HDD Installation Guide Keyboard Installation Guide Battery Pack
Installation Guide Verified by Intel Warranty Guide Assembly and
Disassembly Guides 2 Users Manuals 2 Service Manuals 2 1 Provided
by Intel 2 Provided by notebook manufacturer
Slide 42
Summary Intel Centrino Duo-based notebooks are easy to build
Use proper tools, handling, and assembly processes to build a
quality notebook Work in a clean and ESD safe assembly environment
Additional platform integration resources can be found Intel
Reseller website Intel Channel Knowledge Builder website Verified
By Intel Information
www.intel.com/reseller/eng/VerifiedByIntel
Slide 43
Backup
Slide 44
Acronym List CNP = Customizable Notebook Panel ODD = Optical
Drive device HDD = Hard Drive device LCD = Liquid Crystal Display
NDF = No Defect Found NTF = No Trouble Found CID = Customer Induced
Damage VBI = Verified by Intel CBB = Common Building Block ESD =
electrostatic discharge PSU = power supply unit WLAN = Wireless LAN
PSA = Pressure Sensitive Adhesive TIM = Thermal Interface Material
ODM = Original Design Manufacturer
Slide 45
LCD Defects Measurements SPWG 3.5 lists 18 elements in two
categories used to evaluate LCD defects Cosmetic Visual Defects
Screen Functional Defects Individual defects may be graded as Major
or Minor, based on expected customer acceptance Minor defects of
sufficient quantity and scope may also cause an LCD panel to be
rejected See SPWG V3.5 (March 2005) www.spwg.orgwww.spwg.org
LCD Minor Cosmetic Defects Cosmetic Smaller scratches, dents,
bubbles on polarizer Foreign material presence Bad Pixels (Bright,
Dark) Mounting hole offset Frame distortion Display Visibility
Tiger Mura Brightness Uniformity Contrast ratio
Slide 48
LCD RGB Pixel Control Every pixel contains three separate R-G-B
sub- pixels; each sub-pixel employs one transistor switch Defective
transistor at any sub-pixel location can cause that pixel to be
bright or dark Objectives SPWG V3.5 (March 2005)
Slide 49
LCD Transistor Density Total LCD transistor count is based on
panel resolution Panel size and LC technology (a-Si, LTPS) will
determine the aperture size of individual sub-pixels Aperture size
affects the users ability to detect defective pixels
Slide 50
Bad Pixels Bright and/or Dark Pixels may be acceptable if they
Are small in number Non-adjacent Outside screen center Do not
exceed overall Minor Defect thresholds Bad Pixel Defects across a
full row, a full column, or over any block constitutes a Major
Defect
Slide 51
Example: LCD Defect Rates Major Defects Minor Defects Bad
Pixels Grade A None 15 mm Dark Pair > 5 mm Grade B None>8>
3-3-5 Bright Pair < 15 mm Dark Pair > < mm
Slide 52
What is Intel Channel Knowledge Builder? Online training
available 24/7 to all Intel Channel Program Members at no
additional cost Provides simple to highly interactive knowledge and
skills training Training that is available any time and accessible
to all employees Training typically covers Product, Technical,
Sales and Marketing topics around every major platform launch
Available in 12 languages Web Based, Downloadable, and CD versions
available
Slide 53
Training available to all Intel Reseller employees no extra
travel expense required Provides in-depth Intel Platform training
on Desktop, Mobile, and Server solutions Soft Skills training
recently added that covers: Integration Techniques Sales Skills
Business Development Course completion certificates available Most
courses provide a training certificate that can be printed
Completion incentives offered on some major course launches The
Primary contact at the Intel Reseller can assign training courses
to any of their employees What benefit does Intel Channel Knowledge
Builder Provide?
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Processor Insertion Orient the Micro-FCPGA package so that the
pin A1 corner matches with the socket marking Align pins and holes
and lightly press the package into the socket until fully seated.
There should be very little resistance Dont force the package into
the socket; damage could result Actuate the socket to engage the
processor, lightly press on the package to ensure it is completely
seated on the socket surface Do NOT try to force the package into
the socket NOTE PIN A1 CORNER REFERENCE MARKINGS