Managing Lead and Lead-Free Transition Dr. Sudarshan Lal FCI USA, Inc. Etters, PA (USA) June 20, 2002

Managing Lead and Lead-Free Transition

Dr. Sudarshan LalFCI USA, Inc.

Etters, PA (USA)June 20, 2002

> Titre de la présentation - Date - Références - 2

Outline

> Introduction

> Lead-free test plans

> Lead-free implementation for:

i) Pressfit ii) Reflow iii) BGA Applications

> Test status

> Conclusions


Commercial 2003

Industrial Not Clearly

Defined

Computer 2003

Telecom/Backpanel Not Clearly

Defined

Request for segment data made to fleck and bishop

Board and connector performance issues are the cause for a less defined need in the Telecom/Backpanel market

Market Segment Requirements


Regions – Timing Requirements

Americas Not Clearly Defined

A/P * 2003 (Some Appliances in

Japan)

Europe 2006 (Servers & Auto. 2010)

* Although there is no legislation, pending

or otherwise, Japan is calling for the

reduction or elimination of lead in

Electronics. Several Japanese OEM’s have

taken it upon themselves to be as proactive

in this market as possible


The use of lead in electronics assembly within the

European Union will be banned after January 2008 (and

possibly as soon as 2006). Servers and Automotive

exempted until 2010

Since A/P, specifically Japan, is the first regional area to

require lead-free products, FCI’s lead-free implementation

will be heavily influenced by the needs and requirements

of major Japanese OEM customers.

Source:Envirowise Website http://www.envirowise.gov.uk

Timing Requirements – Europe & A/P


Provide leadership, coordination, and communication to FCI Worldwide to implement a lead-free offering of our products where

appropriate in a way that:

Identifies marketing and customer expectations

Establishes product conversion priority and timing

Provides leadership and communication

Coordinates activities with the other regions

Provides technology solutions for our products

Assures the generation and communication of technical support data, and

Generates an implementation plan that includes sales, marketing, engineering, manufacturing, and technology actions and timing

so that FCI can provide a lead-free product offering that meets the needs of our customers in a timely manner and meets our business objectives.

Lead-Free Global Team Charter


Rather than focus on 40+ product lines, the lead-free

team will focus on the three main termination styles.

Each termination style will have a different technical

solution or a significantly different performance or

whisker issue that needs solving.

Lead-Free Team Methodology


Implementation By Termination Style

BGA Termination Reflow

Th

ru-H

ole

SMT

Pre

ss-F

it


Advantages of Sn-Cu v. Sn coating

> Aesthetically superior bright deposit with low carbon & stable alloy composition

> Sn-Cu is less prone to whiskering than pure tin . Alloying helps in whisker mitigation

> Low foam, stable solution without strong odors for Sn-Cu bath

> Plated Sn-Cu film resistant to discoloration in heat tests

> Solderability for Sn-Cu coating is equivalent or better than Sn-Pb and pure tin finishes. Tin coatings after steam aging exhibited poor solderability (longer wetting times, negative forces)


Technical Solution

Press-Fit & Reflow

Sn-Cu Plating ( Bath Globally Available)

BGA

Sn-Cu-Ag Spheres (Spheres Globally Available)

Note: FCI Searching Lead-Free Epoxy to Withstand 260 C


Connector Technical

Solution Sn-Cu Plating

Perform DOE And Test Plan

Utilizing Multiple Boards

Press-Fit Lead-Free Implementation Flow Chart

Confirm Technical Solution In Press-Fit

Applications

Test Boards

Immersion Ag

Immersion Sn

Bare Cu/OSP

Tin/Lead

Nickel Gold


Utilizing a Metral EON press-fit pin

Testing conducted with: Tin-Lead, OSP, ImAg, ImSn, & Ni-Au Boards

Telecom UE Tests:

Vibration & Shock – 50 Contacts – Min. & Max. PTH Board

Thermal Shock/Humidity – 50 contacts – Min. & Max. PTH Board

Mixed Flow Gas – 25 Contacts – Max. PTH Board Only

Repair (Insertion/Retention, Heat Age, Hole Deformation) 150

Contacts – Min. & Max. PTH Board

Lead-Free Press-Fit Test Plan


Press-Fit Test Results Status

> Vibration & Shock : No abnormalities found

> Thermal Shock/Humidity test: In Progress

> Mixed Flow Gas: Initial Preparation Completed. Going to MFG chamber

> Repair (Insertion/Retention, Heat Age, Hole-size): Passed within normal limits

> Compliant pin resistances were within specifications (less than 1 milliohm)


Connector Technical Solution

SnCuAg BGA


Utilizing Copper Board

BGA Implementation Flow Chart

Confirm Technical

Solution In BGA Applications

Test Boards

Bare Cu/OSP


Test PCB Pad Plating: OSP (Cu with Coating)

1.) Thermal Shock Testing Per MEG-Array Product Spec GS-12-100

2.) Solder Joint Tensile Strength & 3-Point Bend Testing per MEG-

Array Product Specification GS-12-100 2a. Solder ball pull strength.

3.) Solder Wicking Evaluation

4.) Thermal Cycling per IPC-SM-785 (Telecom Central Office

Environment)

Lead-Free BGA Test Plan


Lead-Free BGA Test Results

> Passed three-point bend test. No dye penetration observed. Micro-cracks were absent

> Lead-free solder tensile strength was greater than standard Tin-lead solder

> Solder joint reliability was equivalent to Tin-lead


Connector Technical

Solution Sn-Cu Plating


Utilizing Copper Board

Re-flow Termination Implementation Flow Chart

Confirm Technical Solution In Re-

flow Applications

Test Boards

Bare Cu/OSP


Lead-free Re-flow Test Status

> Solderability was excellent exhibiting normal forces and percentage coverage comparable to Tin-lead

> Tensile Strength using Instron was similar to Tin-lead

> Whisker tendency not studied yet. Reflow should minimize whisker formation

> Need to develop plan for i) Bergstik-thruhole ii) Bergstak-SMT iii) Memory-SMT Products


Resins & Molding For Lead-Free

Three resins failed to withstand the industry anticipated 260C peak re-flow temperature for lead free soldering. These resins are :

LCP A (280C) (“Baby H”Metral Headers)

PPS (Card Edge Press-Fit)

SPS (GBIC SMT)

Polyamide 46 & Polyphthalamide high temperature nylons passed at all re-flow temperatures in the dry state, but failed at all re-flow temperatures (even the current 223C) in the wet state via blistering. The failures were due to the hygroscopic property of the material and not the re-flow temperature.

In general, those materials with a melting point of 285C and lower exhibited visual and/or dimensional defects following exposure to 260C and higher re-flow temperatures. All resins with melting points greater than 285C successfully sustained the industry anticipated 260C peak re-flow profile without visual/dimensional damage.

Converged EON Metral Headers Use LCP E – Melt Temp = 335C


Existing FCI Lead-Free Products

Group Product PlatingBoard-To-Board BergStik Simplex - 30u Au, 15u Au

Quickie Headers Simplex - 30u Au, 15u AuShunts Simplex - 30u Au, 15u AuDubox Simplex - 30u Au, 15u AuCard Connectors Simplex - 30u Au, 15u AuBergCon Headers Simplex - 30u Au, 15u AuQuickie IDC Simplex - 30u Au, 15u AuPV Simplex - 40u Au, 30u Au, 15u AuMinitek Simplex - 30u Au, 15uAuSocket - Screw Machine Simplex - 30u Au

Group Product PlatingI/O Products SATA Duplex - 50u Au (Mate) 30uSnCu (Tail)

Modjack Simplex - 30u Au, 30u GXT, 50u AuClincher Simplex - 30u Au

Group Product PlatingBackpanel HPC Simplex - 50u Au, 30u Au, 30u GXT

BergPin Simplex - 50u Au, 30u Au, 15u Au


Conclusions

FCI maintains an open dialogue with suppliers, contract

manufacturers, OEM’s and consortia regarding lead-free technical

solutions. Presently customers are interested in plans , capabilities

and limited test samples

The global lead-free team is in the process of identifying & testing

lead-free solutions for BGA, press-fit & re-flow products

Implementation and smooth transition shall be case-by- case

based on credible scientific data of proven reliability, market

demand, regulatory compliance, supply assurance, quality and

competitive cost

Documents

Managing Lead and Lead-Free Transition Dr. Sudarshan Lal FCI USA, Inc. Etters, PA (USA) June 20, 2002