MA1 Dual Above- an elo-the-Rails 1 Analog Multiplexer · Typical Operating Characteristics (VDD = 5.0V, TA = +25°C, unless otherwise noted.) Maxim Integrated │7 MA1 Dual Above-

19-5929; Rev 2; 5/15

Ordering Information appears at end of data sheet.

Functional Diagram

MAX14778 Dual ±25V Above- and Below-the-Rails 4:1 Analog Multiplexer

EVALUATION KIT AVAILABLE

General DescriptionThe MAX14778 dual 4:1 analog multiplexer supports analog signals up to Q25V with a single 3.0 to 5.5V supply. Each multiplexer has separate control inputs to allow independent switching, making the device ideal for multiplexing different communications signals with the same connector pins. Extended ESD protection of Q6kV (Human Body Model) enable direct interfacing to cables and connectors.

The MAX14778 features a low 1.5I (max) on-resistance and 3mI (typ) flatness to maximize signal integrity over the entire common-mode voltage range. Each multiplex-er can carry up to 300mA of continuous current through the multiplexer in either direction.

The MAX14778 supports switching of full-speed USB 1.1 signals (12Mbps) and RS-485 data rates of up to 20Mbps.

The MAX14778 is available in a 20-pin (5mm x 5mm) TQFN package and is specified over the -40NC to +85NC extended temperature range.

Applications RS-485/RS-232/USB 1.1 Multiplexing POS Peripherals Handheld Industrial Devices Communication Systems Audio/Data Multiplexing Connector Sharing Gaming Machines

Benefits and Features Flexible Multiplexer Switches a Wide Array of High-

Voltage and Low-Voltage Signals Such as RS485, RS232, and USB 1.1• Two Independent Multiplexers • Break-Before-Make Operation • 1.5Ω RON (max) • 3mΩ RON Flatness (typ) • 300mA Maximum Current Through Multiplexer • 78pF Input Capacitance • 75MHz Large-Signal Bandwidth

Ideal for Space-Constrained and Mobile Applications• 20-Pin TQFN (5mm x 5mm) Package

Wide Signal Range Supported from Single-Supply Voltage Eliminates Negative Power Supply• ±25V Signal Range• Single 3.0V to 5.5V Supply

ESD Protection Circuitry Eliminates Need for External Protection Circuitry• Extended ESD Protection on A_ and B_ Pins • ±6kV Human Body Model (HBM)

CONTROL ABIAS

GENERATION

SA0ENA

A0

A1

A2

A3

SA1 VDD

VP

VN

ACOM

CONTROL B

SB0ENB SB1 GND

B0

B1

B2

B3

BCOM

MAX14778

(All voltages referenced to GND.)VDD ..........................................................................-0.3V to +6VVP ........................... -0.3V to the lesser of +52V and (VN + 70V)VN ................ The lesser of (VDD - 40V) and (VP - 70V) to +0.3VVP to VN .................................................................-0.3V to +70VENA, ENB, SA_, SB_ ................................ -0.3V to (VDD + 0.3V)A_, ACOM, B_,

BCOM .. (VN - 0.3V) to the lesser of (VP + 0.3V) and (VN + 52V)

Continuous Current Through Switch ............................. ±500mAContinuous Power Dissipation (TA = +70NC) TQFN (derate 33.3mW/NC above +70NC)...............2666.7mWOperating Temperature Range .......................... -40NC to +85NCJunction Temperature .....................................................+150NCStorage Temperature Range ............................ -65NC to +150NCLead Temperature (soldering, 10s) ...............................+300NCSoldering Temperature (reflow) ......................................+260NC

TQFN Junction-to-Ambient Thermal Resistance (BJA) ..........30NC/W Junction-to-Case Thermal Resistance (BJC) .................2NC/W

Absolute Maximum Ratings

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Package Thermal Characteristics (Note 1)

Electrical Characteristics(VDD = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VDD = 5V, TA = +25NC.) (Note 2)

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PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DC CHARACTERISTICS

Supply Voltage Range VDD 3.0 5.5 V

Supply Current IDD

ENA = ENB = highVDD P VDDTH 4.27 10

mAVDD > VDDTH 2.54 6

VENA = VENB = VDD/2VDD P VDDTH 4.31 10

VDD > VDDTH 2.59 6

Charge-Pump Threshold VDDTH (Note 3) 4.64 V

Analog Signal Range VIN Figure 1, switch open or closed -25 +25 V

Continuous Current Through Switch

ICOM -300 +300 mA

On-Resistance RON Figure 1, ICOM = Q300mA, VIN = Q25V 0.84 1.5 Ω

On-Resistance Flatness RFLAT(ON)Figure 1, -25V P VIN P +25V, ICOM = Q300mA

3 mΩ

A_, B_ Off-Leakage Current

IA(OFF),IB(OFF)

Figure 2, VIN = 25V, VOUT = 0V -200 +200 nA

ACOM, BCOM Off-Leakage Current

IACOM(OFF),IBCOM(OFF)

Figure 2, VOUT = 15V, VIN = 0V -1 +1 FA

A_, B_ On-Leakage Current

IA(ON),IB(ON)

Figure 2, VIN = Q25V, ACOM or BCOM is unconnected

-1 +1 FA

www.maximintegrated.com/thermal-tutorial

Note 2: All units are production tested at TA = +25NC. Specifications over temperature are guaranteed by design.Note 3: When VDD is higher than the charge-pump threshold, the internal 5V regulated charge pump is turned off and the input to

the high-voltage charge pumps is provided by VDD.Note 4: The MAX14778 requires a 100nF capacitor on both VP and VN to GND to guarantee full ESD protection. See the

Applications Information section for details on ESD test conditions.

Electrical Characteristics (continued)(VDD = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VDD = 5V, TA = +25NC.) (Note 2)



PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

LOGIC INPUTS (ENA, ENB, SA_, SB_)

Input Logic-Low Voltage VIL

VDD = 5.5V 0.8

VVDD = 4.5V 0.8

VDD = 3.6V 0.7

VDD = 3.0V 0.7

Input Logic-High Voltage VIH

VDD = 5.5V 2.1

VVDD = 4.5V 2.0

VDD = 3.6V 1.9

VDD = 3.0V 1.7

AC CHARACTERISTICS

Power-Up Time tPOR 404 ms

Enable Turn-On Time tONFigure 3, VIN = Q10V, RL = 10kI, CL = 15pF

2 ms

Enable Turn-Off Time tOFFFigure 3, VIN = Q10V, RL = 10kI, CL = 15pF

1.5 ms

Break-Before-Make Interval

tBBMFigure 4, VIN = Q10V, RL = 10kI, CL = 15pF

840 Fs

Charge Injection Q Figure 5, VA_ = 0V, CL = 1nF 1720 pC

Off-Isolation VISOFigure 6, VA_ = 1VRMS, f = 100kHz, RL = 50I, CL = 15pF

-80 dB

Crosstalk VCT Figure 6, f = 100kHz, RS = RL = 50I -103 dB

-3dB Bandwidth BW Figure 6, RS = 50I, RL = 50I 75 MHz

Total Harmonic Distortion Plus Noise

THD+N RS = RL = 1kI, f = 20Hz to 20kHz 0.003 %

Input Capacitance CIN A_, B_ pins 78 pF

THERMAL PROTECTION

Thermal-Shutdown Threshold

TSHUT 145 NC

Thermal-Shutdown Hysteresis

THYST 25 NC

ESD PROTECTION

A_, B_ Pins (Note 4) Human Body Model Q6 kV

All Other Pins Human Body Model Q2 kV

Test Circuits/Timing Diagrams

Figure 1. On-Resistance Measurement

Figure 2. Leakage Current Measurement



A_

B_

ACOM

BCOM

ICOM

VDD

GND

MAX14778

+5V

1µF

V

VIN

VIN

A_

B_

IA(OFF)

IB(OFF)

ACOM

BCOM

VDD

GND

MAX14778

+5V

1µF

A

IACOM(OFF)

IBCOM(OFF)

A

VOUT VIN

A_

B_

IA(ON)

IB(ON)

ACOM

BCOM

VDD

GND

MAX14778

+5V

1µF

A

Test Circuits/Timing Diagrams (continued)

Figure 3. Turn-On/Turn-Off Timing

Figure 4. Break-Before-Make Timing



tR < 20nstF < 20ns

50%VIL

LOGICINPUT

RL

ENA

ENB

VIN

VIH

tOFF

0V

A_

B_

ACOM

BCOM

0.9 x V0UT0.1 x VOUT

tON

VOUT

SWITCHOUTPUT

LOGICINPUT

CL

VOUT

MAX14778

VOUT = VIN RL + RON ( RL )

CL INCLUDES FIXTURE AND STRAY CAPACITANCE.

RL CL

VOUTACOM

SA1

SA0ENA

VDD

A_

GND

MAX14778

VOUT = VIN RL + RON ( RL )

CL INCLUDES FIXTURE AND STRAY CAPACITANCE.

LOGICINPUT

VIN

+5V

1µF

tR < 20ns

0V

+5V

0V

VOUT

LOGICINPUT

SWITCHOUTPUT

tBBM

80%

Test Circuits/Timing Diagrams (continued)

Figure 5. Charge Injection

Figure 6. Off-Isolation, -3dB Bandwidth, and Crosstalk



CL = 1nF

VOUTACOMBCOM

ENAENB

A_B_

VDD

GNDLOGICINPUT

+5V

MAX14778 0V

VOUT

+5V

ON OFFOFF

DVOUT

Q = CL x DVOUT

LOGICINPUT

MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN ACOM AND "OFF" A_ TERMINAL ON EACH MULTIPLEXER. -3dBW IS MEASURED BETWEEN ACOM AND "ON" A_ TERMINAL ON EACH MULTIPLEXER. CROSSTALK IS MEASURED FROM ONE CHANNEL TO ALL OTHER CHANNELS.SIGNAL DIRECTION THROUGH MULTIPLEXER IS REVERSED; WORST VALUES ARE RECORDED.

VDD

VOUT

ENA

SA_

A0

ACOM

VIN

OFF-ISOLATION = 20log VOUT

VIN

ON-LOSS = 20log VOUT

VIN

CROSSTALK = 20log VOUT

VIN

NETWORKANALYZER

50I

50I 50I

50I

MEAS REF

0V OR VDD

50I

MAX14778

Typical Operating Characteristics(VDD = 5.0V, TA = +25°C, unless otherwise noted.)

Maxim Integrated 7www.maximintegrated.com


ON-RESISTANCEvs. COMMON-MODE VOLTAGE

MAX

1477

8 to

c01

VACOM (V)

ON-R

ESIS

TANC

E (I

)

155-5-15

0.96

0.97

0.98

0.99

1.00

0.95-25 25

IACOM = 300mA

VDD = 3.3V

VDD = 5V

ON-RESISTANCEvs. COMMON-MODE VOLTAGE

MAX

1477

8 to

c02

VACOM (V)

ON-R

ESIS

TANC

E (I

)

155-5-15

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

0.5-25 25

TA = +85°C

TA = +25°C

TA = -40°CIACOM = 300mA

OFF-LEAKAGE CURRENTvs. TEMPERATURE

MAX

1477

8 to

c03

TA (°C)

OFF-

LEAK

AGE

CURR

ENT

(nA)

603510-15

1

10

100

0.1-40 85

VA1 = 25VA0 SELECTEDACOM = GND

ON-LEAKAGE CURRENTvs. TEMPERATURE

MAX

1477

8 to

c04

TA (°C)

ON-L

EAKA

GE C

URRE

NT (n

A)

603510-15

10

100

1000

1-40 85

VA0 = 25VA0 SELECTED

ACOM UNCONNECTED

CHARGE INJECTIONvs. ANALOG SIGNAL VOLTAGE

MAX

1477

8 to

c05

VACOM (V)

Q (p

C)

155-5-15

200

400

600

800

1,000

1,200

0-25 25

CL = 1nF

SUPPLY CURRENT vs. TEMPERATURE

MAX

1477

8 to

c06

TA (°C)

I DD

(mA)

6035-15 10

0.5

1.0

1.5

2.0

3.0

2.5

3.5

4.0

0-40 85

VDD = 3.3V

VDD = 5V

CROSSTALK vs. FREQUENCY

MAX

1477

8 to

c07

FREQUENCY (MHz)

CROS

STAL

K (d

B)

101

-100

-80

-60

-40

-20

0

-1200.1 100

A0 TO B0A0 AND B0 SELECTED

OFF-ISOLATION vs. FREQUENCY

MAX

1477

8 to

c08

FREQUENCY (MHz)

OFF-

ISOL

ATIO

N (d

B)

101

-60

-50

-40

-30

-20

-10

0

-700.1 100

A0 TO ACOMA2 SELECTED

FREQUENCY RESPONSEM

AX14

778

toc0

9

FREQUENCY (MHz)

V OUT

/VIN

(dB)

101

-9

-8

-7

-6

-5

-4

-3

-2

-1

0

1

-100.1 100

A0 TO ACOMA0 SELECTED

Typical Operating Characteristics (continued)(VDD = 5.0V, TA = +25°C, unless otherwise noted.)

Maxim Integrated 8www.maximintegrated.com


THD+N vs. FREQUENCY

MAX

1477

8 to

c10

FREQUENCY (kHz)

THD+

N (%

)

20.2

0.001

0.01

0.1

1

0.00010.02 20

A0 TO ACOMRS = 600IRL = 1kI

PSRR vs. FREQUENCY

MAX

1477

8 to

c11

FREQUENCY (kHz)

PSRR

(dB)

1010.1

-120

-100

-80

-60

-40

-20

0

-1400.01 100

VDD TO ACOM

TURN-OFF TIMEvs. ANALOG-SIGNAL VOLTAGE

MAX

1477

8 to

c13

VACOM (V)

t OFF

(ms)

155-5-15

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0-25 25

CHARGE PUMP NOISE WITH SWITCH DISABLED

MAX

1477

8 to

c15

FREQ (MHz)

MAG

(dB)

90807060504030

-120

-100

-80

-60

-40

-20

0

-14020 100

MEASURED AT BCOMENB = GNDRBW = 5100Hz

TURN-ON TIMEvs. ANALOG-SIGNAL VOLTAGE

MAX

1477

8 to

c12

VACOM (V)

t ON

(ms)

155-5-15

1.02

1.04

1.06

1.08

1.10

1.12

1.14

1.16

1.18

1.20

1.00-25 25

CHARGE PUMP NOISE WITH SWITCH ENABLED

MAX

1477

8 to

c14

FREQ (MHz)

MAG

(dB)

90807060504030

-120

-100

-80

-60

-40

-20

0

-14020 100

MEASURED AT BCOMENB = VDDBS0 = BS1 = VDDB2 IS CONNECTED TO GNDWITH A 50I RESISTORRBW = 5100Hz

Pin Description

Pin Configuration



PIN NAME FUNCTION

1 BCOM MUX B Common Terminal

2 VP Positive Charge-Pump Output. Bypass VP to GND with a 100nF 50V ceramic capacitor.

3 GND Ground

4 VN Negative Charge-Pump Output. Bypass VN to GND with a 100nF 50V ceramic capacitor.

5 ACOM MUX A Common Terminal

6 A0 MUX A Bidirectional Analog Input/Output 0




10 ENA MUX A Enable Input

11 SA0 MUX A Channel Select Input 0

12 SA1 MUX A Channel Select Input 1

13 VDD Power-Supply Input. Bypass VDD to GND with a 1FF ceramic capacitor.

14 SB1 MUX B Channel Select Input 1

15 SB0 MUX B Channel Select Input 0

16 ENB MUX B Enable Input

17 B3 MUX B Bidirectional Analog Input/Output 3




— EP Exposed Pad. Connect EP to VN. EP is not intended as an electrical connection point.

MAX14778

TQFN5mm x 5mm

TOP VIEW

19

20 *EP+

18

17

7

6

8

V P V N

ACOM

9

BCOM

SB1

SA1

SA0

SB0

1 2

B2

4 5

15 14 12 11

B1

B0

*CONNECT EXPOSED PAD TO VN.

A3

A2

A1

A0

GND

V DD

3

13

B3

16 10 ENAENB

Truth TablesTable 1. MUX A Channel Selection Table 2. MUX B Channel Selection

X = Don’t care X = Don’t care

Detailed DescriptionThe MAX14778 dual 4:1 analog multiplexer integrates bias circuitry to provide a Q25V analog voltage range with a single 3.0 to 5.5V supply. This extended input range allows multiplexing different communications signals such as RS-232, RS-485, audio and USB 1.1 onto the same connector.

Integrated Bias GenerationThe MAX14778 contains a total of three charge pumps to generate bias voltages for the internal switches: a 5V regu-lated charge pump, a positive high-voltage (+35V) charge pump, and a negative high-voltage (-27V) charge pump. When VDD is above 4.7V (typ), the 5V regulated charge pump is bypassed and VDD provides the input for the high-voltage charge pumps, reducing overall supply current.

An external 100nF capacitor is required for each high-voltage charge pump between VP/VN and GND.

Analog Signal LevelsThe MAX14778 transmits signals of up to Q25V with a single 3.0 to 5.5V supply due to integrated bias circuitry. The device features 1.5Ω (max) on-resistance and 3mI

(typ) flatness for analog signals between -25V and +25V (see the Typical Operating Characteristics). The current flow through the multiplexers can be bidirectional, allow-ing operation either as a multiplexer or demultiplexer.

Digital InterfaceThe MAX14778 has two digital select inputs for each MUX: SA1 and SA0 control MUX A; SB1 and SB0 control MUX B. Drive the digital select inputs high or low to select which input (A_, B_) is connected to the common termi-nal (ACOM, BCOM) for each MUX. See the Truth Tables for more information.

Each MUX features an independent enable input (ENA and ENB). Drive ENA or ENB low to disconnect all inputs from the common terminal for that MUX, regardless of the status of the select inputs or the other enable input.

Applications InformationConnector SharingThe MAX14778 supports a Q25V analog signal range independently for each input/output, allowing physical connector sharing between interface types that have differing signal ranges.

The multiprotocol connector-sharing application in the Typical Operating Circuits shows an application with RS-232, half-duplex RS-485, full-speed USB 1.1, and audio signals sharing the same connector. The device allows signals to pass over the entire signal range speci-fied by each standard while safely isolating the unused transceivers.



ENA SA1 SA0ACOM

CONNECTED TO

0 X X Open

1 0 0 A0

1 0 1 A1

1 1 0 A2

1 1 1 A3

ENB SB1 SB0BCOM

CONNECTED TO

0 X X Open

1 0 0 B0

1 0 1 B1

1 1 0 B2

1 1 1 B3

Non-Powered ConditionThe MAX14778 can tolerate input voltages on the A_, B_, ACOM, and BCOM pins in the ±25V range when it is not powered.

When VDD = 0V, the DC input leakage current into the A_, B_, ACOM or BCOM pins will typically be below 1µA. Some devices can have a larger leakage current up to mA range due to technology spread.

With VDD not powered, internal diodes between the ana-log pins and the VP and VN will charge up the external capacitors on VP and VN when positive and/or negative voltages are applied to these pins. This causes transient input current flow.

Large dv/dt on the inputs causes large capacitive charg-ing currents, which have to be limited to the 300mA Absolute Maximum Ratings in order to not destroy the internal diodes. With 100nF capacitors on VP and VN, the dv/dt must be limited to 3V/µs once the capacitors reach their final voltage; the input current decays to the leakage current levels mentioned above.

High-ESD ProtectionElectrostatic discharge (ESD)-protection structures are incorporated on all pins to protect against electrostatic discharges up to Q2kV Human Body Model (HBM) encountered during handling and assembly. A_ and B_ are further protected against ESD up to Q6kV (HBM) without damage. The ESD structures withstand high ESD both in normal operation and when the device is powered down. After an ESD event, the MAX14778 continues to function without latchup.

ESD Test ConditionsESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results.

The MAX14778 requires a 100nF capacitor on both VP and VN to GND to guarantee full ESD protection.

Human Body ModelFigure 7 shows the Human Body Model. Figure 8 shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest that is then discharged into the device through a 1.5kI resistor.

Figure 7. Human Body ESD Test Model Figure 8. Human Body Current Waveform



CHARGE CURRENT-LIMIT RESISTOR

DISCHARGERESISTANCE

STORAGECAPACITOR

CS100pF

RC1MI

RD1.5kI

HIGH- VOLTAGE

DCSOURCE

DEVICEUNDERTEST

36.8%

tRLTIME

tDL

CURRENT WAVEFORM

PEAK-TO-PEAK RINGING(NOT DRAWN TO SCALE)

Ir

10%

00

AMPERES

IP 100%90%

Typical Operating Circuits



CONTROL

CONTROLINPUTS

SA1ENA SA0 SB1 SB0 ENB

RS-232TRANSCEIVER

RS-485TRANSCEIVER

USB 1.1TRANSCEIVER

AUDIOSOURCE

MULTIPROTOCOL CONNECTORSHARING APPLICATION

A0TX

RX

A

B

D+

D-

L

R

B0

ACOM

VN

VP

+5V

VDD

1µF

100nF

BCOM

A1

B1

A2

B2

A3

B3

MAX14778

GND

100nF SHAREDCONNECTOR

+5V

Typical Operating Circuits (continued)



CONTROL

CONTROLINPUTS

SA1ENA SA0 SB1 SB0 ENB

RS-232TRANSCEIVER

RS-485TRANSCEIVER

USB 1.1TRANSCEIVER

KEYBOARDWEDGE

SCANNER CONNECTORSHARING APPLICATION

A0TX

RX

A

B

D+

D-

CLOCK

DATA

B0

ACOM

VN

VP

+5V

VDD

1µF

100nF

BCOM

A1

B1

A2

B2

A3

B3

MAX14778

GND

100nF SHAREDCONNECTOR

+5V

Ordering Information

+Denotes a lead(Pb)-free/RoHS-compliant package.*EP = Exposed pad.

Chip InformationPROCESS: BiCMOS

Package InformationFor the latest package outline information and land patterns (foot-prints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.



PART TEMP RANGE PIN-PACKAGE

MAX14778ETP+ -40NC to +85NC 20 TQFN-EP*

PACKAGE TYPE

PACKAGE CODE

OUTLINE NO.

LAND PATTERN NO.

20 TQFN-EP T2055+4 21-0140 90-0009

www.maximintegrated.com/packages

http://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF

http://pdfserv.maximintegrated.com/land_patterns/90-0009.PDF

Revision History

Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.

Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2015 Maxim Integrated Products, Inc. 15


REVISIONNUMBER

REVISIONDATE

DESCRIPTIONPAGES

CHANGED

0 6/11 Initial release —

1 6/12Added new TOCs 14 and 15, updated Non-Powered Condition section, updated Note 4, Pin Description, ESD Test Conditions, Typical Operating Circuits, updated capacitor values

3, 8, 9, 10, 11, 12, 13

2 5/15 Revised Benefits and Features section 1

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.

Documents

MA1 Dual Above- an elo-the-Rails 1 Analog Multiplexer · Typical Operating Characteristics (VDD = 5.0V, TA = +25°C, unless otherwise noted.) Maxim Integrated │7 MA1 Dual Above-