Lvl selection guide

8/7/2019 Lvl selection guide

1/8

Level Selection Guide

The Right Product or Process Level Applications


2/8

DifferentialPressure

Reliable and simple

Widely used

Can be used intanks with agitationor foam

No moving parts

Unaffected byinternal tankequipment

Diaphragm Sealsextend limitationsdue to processconditions such as:- High Temperatures- Corrosives- Dirty or viscousmediums

- SanitaryConnections

Non-ContactingRadar

Top-down, directmeasure

No moving parts

Handles changingdensity, dielectrics,

conductivity Immune to mostvapor spacechanges

Immune topressure andtemperaturechanges

Can be isolatedfrom processby using barriers

suchasTeon

windows or valves

Good for dirty or

material coatingapplications

Guided

Wave Radar


No moving parts

Handles changingdensity, dielectrics,conductivity,turbulence

Immune to mostvapor spacechanges


Measures interfaceGoodtforsmall

spaces

Easy swapdisplacer andcapacitancereplacer

Handles foamsbetter than non-contacting radar

Measures solids,powders, granules

Ultrasonics


No moving parts

Handles changingdensity, dielectrics,conductivity

Good for dirty ormaterial coatingapplications

Non-metallic PVDFsensor handlescorrosive materials

Level Switches

No moving parts

Handles changingdensity, dielectrics,conductivity

Immune to mostvapor spacechanges


With all the technologies, products, and parameters to consider, selecting the besttechnology for level measurement can be difcult. Emerson Process Management

is aware of this challenge and has developed a selection guide to help you choose

the right product for your level application. By using this guide you can rest

assured that you have chosen the correct technology, product, and that you haveRosemount quality working in your plant to reduce overall risk and project cost.

Level Technologies in Practice

TECHNOLOGIES

The Rosemount level product offering includes: Differential Pressure (DP), GuidedWave Radar (GWR), Non-Contacting Radar, Ultrasonic, and Level switches usingvibrating fork technology. Each of these technologies has advantages dependingon application.


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PARAMETERS

APPLICATION CONSIDERATIONS

Conditions within a vessel are an importantfactor when choosing a level technology.A measurement device must handle allpressure, temperature, and process conditions.Turbulence,foam,uidchemicalproperties,

and vapor can impact measurement and needto be considered. Some of the more commonapplication conditions include:

1.) Vapor

2.) Foam

3.) Turbulence

4.) Change in Dielectric / Density

5.) Surface Turbulence

INSTALLATION CONSIDERATIONSMatching atechnologytovesselcongurationis key for successful installation. Connectionsizes, types, and locations impact this choice.The need for device isolation, mechanicalstructures,andmaterialowscanruleoutsome

technologies. Installation considerations are:

A.) Bypass Connection

B.) Valve

C.) Top Mount; position, length and nozzle diameter

D.) Side Mount; position, length and nozzle diameter

E.) Fluid Flow into Vessel

F.) Obstructions and Agitators

G.) Overall dimensions

H.) Bottom type

SELECTION GUIDE

On the inside following pages is a selectionguide that functions as a decision tree. Beginat START, and follow and make the parameterchoices. This guide will narrow down yourselection and lead you to further information.


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STEP2

INTERFACE SELECTION OVERVIEW

APPLICATION &INSTALLATIONCONSIDERATIONS

FEATURES OF INTEREST

GWR (Interface applications based on dielectric differences between two fluids.) Lower dielectric fluid must be on top

Dielectric difference of two liquids must be at least 10

Upper dielectric must be known. In-field determination possible

Upper fluid layer must be 4"(1dm) thick with rigid probe for interface to be detected

Upper fluid layer must be 8"(2dm) thick with 3300 flexible probe and 5300, 3300

HTHP coax probes for interface to be detected

Max thickness of upper layer is dependent upon its dielectric

Target applications, low upper layer dielectric (20)

Both level and interface measurements are possible

Differential Pressure(Interface applications based on densitydifferences between two fluids.)

Both taps must be covered

Distance between taps x difference in SG = dp

Suggested minimum dp of 20 in H20 (500 mm

Interface Measurement only

See TDS 00816-0200-4016 for further informa

LowerProductLower

Product

UpperProductUpper

Product

Vapor

LRV

URV

UNZ

HART Output

2-Wire, DC Power

4-Wire, DC or AC Pwr

2nd Analog Output

Configurable Display

Configurable Locally

Temperature Inputs

Volume Calc Available

Frequency GHz

PC Tools

Pressure***Minimum andMaximumLimits

Temperature***Minimum &MaximumLimits

Minimum PracticalRange (URV-LRV)

Recmnd for smallvessels < 40(1m)

Maximum Range(Varies greatly withspecific products)

AMS Suite: IntelligentDevice Manager

Accuracy (up to 10m)

PrimaryMultivariableOptions

FOUNDATION fieldbus

Pressure,Temp,DifferentialPressure*

Level,Volume**

Level,Volume,Temp**

LevVolu

Interf

3mm 540210mm 5401

Vacuum to:232 psig(16 bar)

115 (35m)calm surface,E>1.8 and4 Antenna

165 (50m)calm

surface,E>1.9 and8 Antenna

77(23.5 m)

16(50

Radar Mstr/ EDDL

Rada/ ED

RadarMaster

6, 26 GHz

YES

10 GHz

5mm

YES


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STEP3

PRESSURE AND TEMPERATURE LIMITS

SG1SG1

SG2SG22

600 (3392 (200)-103 (-75)

ftm)

36ft(11m)

36ft(11m)

-22F(-30C)

to 158F(70 C)

-22F(-30C)

to 158F(70 C)

FC)8 FC)

el

O

kHz 51 kHz 51 kHz

% ofured

ge1

0.25% ofMeasured

Range2

0.25% ofMeasured

Range2

O

n5m)

O

O

O

S

O

S

S

S

O

O

tosig

5 barbar)

-4 to44 psig

(-0.25 barto 3 bar)

-4 to44 psig

(-0.25 barto 3 bar)

EDDL

YES

2 in(0.05m)

NO

NO

YES

1

YES

Future

YES

YES

YES

YES

Level,Vol, OpenChannel

Flow

Level,Vol, OpenChannel

Flow

EDDL

YES

2 in(0.05m)

NO

NO

YES

1

YES

Future

YES

YES

YES

YES

O 2 NO

01 3102 3105

-40 (40)-40 (40) -4 (20)-4 (20) 104 (40)104 (40) 212 (100)212 (100) 302 (15302 (150

120 (8.2)120 (8.2)

90 (6.2)90 (6.2)

30 (2.0)30 (2.0)

73 (5.0)73 (5.0)

10 (0.7)10 (0.7)

ATMATM

-15 (-1)-15 (-1)

5402, Teflon, all sizes5600, Teflon 65600, Teflon 4

Ultrasonic

DP Level

3100 Series

Switches

Temperature F (C)

Temperature F (C)

Process Temperature F (C)

Direct Loadswitching(2-wire)

MaximumTemp***

MaximumPressure***

FaultMonitoringSelf -Checking

NO

YES

302F(150C)

302F(150C)

500F(260C)

1450psig(100barg)

1450psig(100barg)

1450psig(100barg)

YES

YES

YES

YES

PNP/PLCswitching(3-wire)

YES YES YES

RelayDPDT/DPCO(8-wire)

NO YES YES

IS Namur -Ex ia(2-wire)

8...16mA(2-wire)

AS - iBus(2-wire)

NO YES YES

NO YES YES

NO YES YES

2110 2120 2130Vibrating ForkKey

Features

Pressurepsig(bar)

Pre

ssurepsig(bar)

Pressurepsig(bar)

Note: Scales Vary on Pressure and Temperature Graphs

363 (25)

-40 (-40)-76 (-60) 392 (200)302 (150)212 (100) 752 (400

580 (40)

5000 (345)

2940 (203)

798 (55)

232 (16)

145 (10)

73 (5)

01 (0.7)

-15 (-1)

GWR, Teflon Plate Probe

GWR Std Teflon Process Seal

GWR Ceramic ProcessSeal1

5600 Quartz Tank Seal & Cone1

5600, Std Teflon Tank Seal & Cone

5600, Teflon Rod Antenna

5600, Parabolic Antenna, Welded Ver.**

5400, Teflon Tank Seal & ConeAntenna;Teflon Rod Antenna

Radar Level

Temperature F (C)

Pressurepsig(bar)

Pressurepsig(bar)With Process Seal

Available for 5402 and 5600 seriestransmitters. The non-flat surfacestyle is easy to clean, minimizescondensed material build up, and isthe ideal solution for applicationswhere coating or corrosion is aproblem.

-15(-1)

6000(413)

ATM

302(150)

-3.62 (-0.25)

1450 (100)

0 (0)

1160 (80)

** Clamped version limited to 2.9 psig (.2 barg)(1) This is the high pressure and high temperature option

50(26

32(0)

122(50)

-76(-60)

-40(-40)

31023105

3101

158(70)

-4(-20)

32(0)

-22(-30)

-4 (-0.25)

44 (3)

0 (0)

Approximate values are shown.Pressure and Temperature limits are

shown independentlyof each other.

21102120

2130

s 5mms 2.5mm


6/8

APPLICATION DEPENDENT

NOT RECOMMENDED/ RELEVANT

GOOD

NR

AD

GD

STEP 5A

DP LEVELTECHNOLOGY

Pressure transmittersand diaphragm sealsare available in a variety

of sizes and materials.Refer to Product DataSheets for productchoices.

Use Toolkit formodel numbervalidation andperformanceprediction.

Condensing vapors

Bubbling/boiling surfaces

Foam

Solids, granules, powdersHigh turbulence

Device will be close to tank wall/disturbing objectAngled or slanted surfaceInternal obstructions, directly in pathInternal obstructions, avoidance

5401 5600 5402

ULTRASONTECHNOLO

Ultrasonicproductsare availabl

in PVDF Senmaterials.

See PDS formodelSelection.

Use Toolkit validation, e

NON-CONTACTRADAR TECHNOLOGY

GWRcoax

5401rod

5401rod

5401rod

5401rod

5401 rod5402

5401 rod5402

5401 rod5402

5401 rod5402

5401 rod5402

5401 rod5402

5401 rod5402

5401 rod5402

5402

5402

5402

5402

5402

5402

5402

5402

5400

5400

5402

5402

5402

5402

5402

5402

5402

5402

5600rod

5600rod

5600rod 3100

5600rod

5600rod

5600rod

GWRcoax1

GWRcoax1

GWRcoax1

GWR

coax

1

GWRcoax1

GWRcoax1

GWRcoax

GWRcoax1

GWRcoax1

GWRcoax1

GWR

coax

1

GWRcoax1

GWRcoax1

GWR

coax1

GWRcoax1

GWRcoax1

GWR

coax1

GWRcoax1

GWRcoax1

GWR

coax

1

GWRcoax1

GWRcoax1

GWR

coax

1

GWRcoax1

GWRcoax1

GWR

coax

1

GWRcoax1

GWRcoax1

GWR

coax

1

GWRcoax1

GWRcoax1

GWR 3100

3100

5400

5400

5400

5400

5400

5402

5402

5400

5402

5402

5400

5400

5402

3100

3100

3100

3100

5400 56003100

3100

3100

3100

3100

3100

3100

5400

5400

5400

5400

5402

5402

5401

5402

5400

5402

5402

5600

5600

5600

5600

5600

5600

5600

5600

5600

5600

5600

560056005600

5600

5600

5600

5600

5600

5600

5600

5600

5600

5600

5600

5600

5600

5600

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWRGWR

GWR

GWR

GWR

GWR

GWR

GWR

5600rodGWR

5600rodGWR

GWR

GWR

GWR

GWR

GWR GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

GWR

1 in 1.5 in 2/DN 50 3/DN 80 4/DN 100 6/DN 150 8/Connection Size

Up to 2(50mm)

Up to 4(100mm)

Up to 8(200mm)

Up to 10(250mm)

Up to 14(350mm)

Up to 20(500 mm)

>20(500mm)and 500, < 2000mm


7/8

Maximum length1

Minimum Dielectric Constant

at Maximum Range

Minimum Dielectric Constant

Level2

Interface (liquid/liquid)2

Changing Density

Changing Dielectric

Wide pH Variations

Pressure Changes

Temperature Changes

Condensing Vapors

Bubbling/Boiling SurfacesFoam ( Mechanical Avoidance)

Foam ( Measurement of Top of Foam)

Foam ( Measurement of Foam & Liquid)

Clean Liquids

Materials with Very Low Dielectric

Coating, Sticky Liquids

Viscous Liquids

Crystallizing liquids

Solids, Granules, Powders 3

Fibrous Liquids

Turbulence

Tall, Narrow Nozzles

Cleanability of Probe

Disturbing EMC Environmentin Tank

Liquid or Vapor Spray May TouchProbe Above Surface

Probes Will Be Close (


8/8

Emerson Process ManagementGlobal Solutions, Local Presence.

00803-0100-6112 Rev EA, 04/07

Emerson Process ManagementRosemount Inc.8200 Market BoulevardChanhassen, MN 55317 USAT (U.S.) 1-800-999-9307T (International) (952) 906 8888F (952) 949 7001www.rosemount.com

Emerson Process ManagementShared Services Ltd.Heath PlaceBognor RegisWest Sussex PO22 9SHEnglandT 44 (1243) 863 121F 44 (1243) 867 554www.emersonprocess.com

Emerson Process ManagementAsia Pacifc Private Limited1 Pandan CrescentSingapore 128461T (65) 6777 8211F (65) 6777 [email protected]

The Emerson logo is a trademark and servicemark o Emerson Electric Co. Rosemount and the Rosemount logotype are registered trademarks o Rosemount Inc. PlantWeb is a registered trademark o the EmersonProcess Management group o companies. All other marks are the property o their respective owners.2006Rosemount Inc. All rights reserved. The contents o this publication are presented or inormation purposesonly, and while eort has been made to ensure their accuracy, they are not to be construed as warranties or guarantees, expressed or implied, regarding the products or services described herein or their use orapplicability. All sales are governed by our terms and conditions, which are available on request. We reserve the right to modiy or improve the designs or specifcations o our products at any time without notice.

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Lvl selection guide