lsd815-65-xx-pf

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DOC. NO : QW0905-

REV. : A

DATE : - 2006

LSD815/65-XX-PF

DATA SHEET

LIGITEK ELECTRONICS CO.,LTD.Property of Ligitek Only

LSD815/65-XX-PF

02 - Mar.

Lead-Free Parts

PbSINGLE DIGIT LED DISPLAY (0.8 Inch)

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Note : 1.All dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted.2.Specifications are subject to change without notice.

Package Dimensions PART NO.


LSD815/65-XX-PF Page 1/8

2.2(0.087")

5.00.5

20.3

(0.8")

27.5

(1.083")

0.51TYP

15.24(0.6")

LSD815/65-XX-PF

LIGITEK

PIN NO.1

19.7(0.776")

2.54X7

=17.78

(0.7")

8.2(0.323")

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Internal Circuit Diagram

Page 2/8LSD815/65-XX-PFPART NO.

LSD8155-XX-PF

3,5,11,16

D

LSD8165-XX-PF

3,5,11,16

D

1214 101

A B C

1 1214 10

A B C

961324

GE F RDPLDP

24 13 6 9

GE F LDPRDP

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Electrical Connection



Anode C12

No Pin

Anode B

Anode G

Common Cathode16

13

14

15

Anode D

Anode RDP

Common Cathode

No Pin

Common Cathode

Anode LDP

No Pin

11

10

9

8

7

6

5

Common Cathode

Anode E

Anode F

Anode A1

3

4

2

PIN NO. LSD8155-XX-PF

Cathode C12

16

14

15

13

Common Anode

Cathode B

Cathode G

No Pin

LSD8165-XX-PF

10

11

9

8

7

6

5

Common Anode

Cathode RDP

Cathode D

Common Anode

No Pin

No Pin

Cathode LDP

PIN NO.

1

3

4

2

Cathode A

Cathode F

Cathode E

Common Anode

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Part Selection And Application Information(Ratings at 25 )

Note : 1.The forward voltage data did not including 0.1V testing tolerance.2. The luminous intensity data did not including 15% testing tolerance.

Material

GaAlAs

CHIP

LSD8155-XX-PF

LSD8165-XX-PF

PART NO

Electrical

Common

Cathode

Common

Anode

Red 660 1.520 2.41.8

P(nm)

common

cathode

or anodeEmitted Min.

(nm)

Typ. Max.

Vf(v)

2:16.1 10.5

IV-M

Typ.Min.

Iv(mcd)

Reverse Current Per Any Chip

Operating Temperature

Storage Temperature

Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260

Peak Forward Current Per

Chip (Duty 1/10,0.1ms

Pulse Width)

Power Dissipation Per Chip

Forward Current Per Chip

Absolute Maximum Ratings at Ta=25

Parameter

IF mA30

Topr

Tstg -25 ~ +85

-25 ~ +85

Ir

PD

IFP

10

100

100

A

mW

mA


SymbolRatings

SR

UNIT

4/7PageLSD815/65-XX-PFPART NO.

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Luminous Intensity Matching Ratio

Test Condition For Each Parameter

Luminous Intensity Per Chip

Peak Wavelength

Forward Voltage Per Chip

Spectral Line Half-Width

Reverse Current Any Chip

nm

Ir

IV-M

A

P

Iv

nm

mcd

If=20mA

Vr=5V

If=10mA

If=20mA


Parameter Symbol

Vf

Unit

volt

Test Condition

If=20mA


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Fig.3 Forward Voltage vs. Temperature

Fig.5 Relative Intensity vs. Wavelength

Ambient Temperature()

Re

lative

Intens

ity

@20m

A

Wavelength (nm)

Forward

Vo

ltage

@20m

A

Norma

lize

@25

Fig.4 Relative Intensity vs. Temperature

Ambient Temperature()

Re

lative

Intensi

ty@20m

A

Norma

lize

@25

Typical Electro-Optical Characteristics Curve

Forward Voltage(V)

Fig.1 Forward current vs. Forward Voltage

Forw

ard

Curren

t(m

A)

Forward Current(mA)

Fig.2 Relative Intensity vs. Forward Current

Relative

Intensi

ty

Norm

alize

@20m

A


1.0

0.1

1.0

10

100

1000

1.0 10 100 1000

0.0

0.5

1.0

1.5

2.0

2.5

3.0

-40 -20 0 20 40 60

1.0

1.1

1.2

600 650 700 7500.0

0.5

1.0

2.0 3.0 4.0 5.0

80 100

0.8

0.9

-20-40 40200 80 10060

2.0

0.0

0.5

1.0

1.5

2.5

3.0

SR CHIP


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0

Temp(C)

025

260

120

5 /sec

max

260C3sec Max

50Preheat

2 /sec

max

Time(sec)100 150

Dip SolderingPreheat: 120C MaxPreheat time: 60seconds MaxRamp-up2C/sec(max)Ramp-Down:-5C/sec(max)Solder Bath:260C MaxDipping Time:3 seconds MaxDistance:Solder Temperature 1/16 Inch Below Seating

Plane For 3 Seconds At 260C

2.Wave Soldering Profile

Soldering Condition(Pb-Free)

1.Iron:

Soldering Iron:30W MaxTemperature 350C Max

Soldering Time:3 Seconds Max(One Time)

Distance:Solder Temperature 1/16 Inch Below Seating

Plane For 3 Seconds At 260C


Page 7/8

60 Seconds Max

LSD815/65-XX-PFPART NO.

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MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

1.T.Sol=23052.Dwell time=5 1sec

This test intended to see soldering well

performed or not.Solderability Test

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1


JIS C 7021: B-12

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

MIL-STD-883:1008JIS C 7021: B-10

MIL-STD-202: 107DMIL-STD-750: 1051

MIL-STD-883: 1011

MIL-STD-202:103B

JIS C 7021: B-11

1.T.Sol=26052.Dwell time= 10 1sec.

1.Ta=-405

2.t=1000 hrs (-24hrs, +72hrs)

1.Ta=1055&-405(10min) (10min)2.total 10 cycles

1.Ta=655

2.RH=90%~95%

3.t=240hrs2hrs

1.Ta=105

5

2.t=1000 hrs (-24hrs, +72hrs)

Solder Resistance

Test

Thermal Shock Test

Low Temperature

Storage Test

High TemperatureStorage Test

High Temperature

High Humidity Test

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

The purpose of this is the resistance ofthe device to sudden extreme changes

in high and low temperature.

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

The purpose of this tes t is the resistance

of the device under tropical for hours.

The purpose of this is the resistance of

the device which is laid under conditionof high temperature for hours.

1.Under Room Temperature

2.If=10mA

3.t=1000 hrs (-24hrs, +72hrs)

Test Condition

Reliability Test:

Operating Life Test

Test Item

This tes t is conducted for the purpose

of detemining the resistance of a part

in elec trical and themal stressed.

DescriptionReference

Standard


Documents

lsd815-65-xx-pf