LRO PDR Harness - Massachusetts Institute of Technology · Rick Kinder - Harness 6 Grounding & Shielding • Grounding level 1: – Standard silver coated braid wire QQB575F36S125

LRO PDRHarness

Rick Kinder

Rick Kinder - Harness 2

Contents• Requirements• Interfaces and Materials• Grounding and Shielding• ESD protection• Routing Tools

– Pro-E– Areas of Interest

• Solar Array Deployable• HGA Deployable

• Umbilical– Reservations

• Test Panel• Harness Loss and Tracking

– Solar Array and Battery– Harness Loss budget– Mass

• Trade Studies in Work• Fabrication Verification

– Composite ground survey• Liens and Deliverables.

– Parts lists status– Drawing status

• Wrap up


Requirements• LRO Electrical Systems Requirements (ESR) 431-RQMT-0000140 10/12/05

– Crater EICD 431-ICD-000094 9/6/05

– Diviner EICD 431-ICD-000095 1/xx/06

– LAMP EICD 431-ICD-000096 1/xx/06

– LEND EICD 431-ICD-000097 10/18/05

– LOLA EICD 431-ICD-000098 10/4/05

– LROC EICD 431-ICD-000099 12/12/05

– Mini-RF EICD 431-ICD-000152 Draft

– C&DH EICD 431-ICD-000141 Draft

– PSE EICD 431-ICD-000142 1/xx/06

– PDE EICD 431-ICD-000143 In-work

– Star Tracker EICD 431-ICD-000144 In-work

– Inertial Measurement Unit EICD 431-ICD-000145 In-work

– Communications EICD 431-ICD-000146 In-work

– Propulsion EICD 431-ICD-000147 In-work

– Reaction Wheel EICD 431-ICD-000148 Draft

– Gimbal Controller EICD 431-ICD-000149 In-work

– Solar Array EICD 431-ICD-000150 In-work

– Battery EICD 431-ICD-000151 In-work


LVPC

LRO Simplified Systems Block Dia.

1-24-06

S-Xpndr

Ka-XmtrHGA

Hi-RateTlm

Low-RateCmds & Tlm

Battery

Discretes

MIL-STD-1553 Network

SBC

MAC

HK / IO

DIB

C&DH

Comm

Power B

us

ST(2)

IMU

CSS(10)

LAMP

LROC

LOLA

LAMP Sci. & HK

HGAGimbals

PSE

SAM

Sw. andUnsw.

+28V PwrServices

OM-A

PMC

OM_B

OM-C

Prop/Dep-A

Prop/Dep-B

Prop/Dep-C

Prop/Dep-D

GIMBALCONTROL

PDE

SA & HGDeploy

Actuation

Omnis

IRW(4)

ThermistorsClosed Loop Htrs

SpaceWire Network

LEND

Diviner

CRaTER

H/W DecodedCommandDiscretes

Unsw. + 28V

SAGimbals

Mini-RF

GIMBALCONROL

OM-D

DDA

ATA

SolarArray

Vehicle Separation

Break Wires

LRO Simplified System Block Dia.

Inhibit Unit

USO 9600Backup20MHz Clock

USO 9500

20MHz Clock

+ 28V

Propulsion

P

P

P

RR


Interfaces and Materials• Standard Interfaces:

– Wire: Silver coated copper alloy – Insulation: Crosslinked, modified Ethylene Tetrafluoroethylene copolymer (ETFE),

TEFZEL. – AS22759/44, Lighweight, Low loss, versions for 20 and 22AWG and larger.– AS22759/33, Lightweight, high strength versions for 24 AWG and smaller.– All wire ratings comply with EEE-INST-002 @ 200°C

• Power:– Twisted MIL-DTL27500-20SR2U00 or twisted shielded DTL-27500-20SR2S23 typical. – Minimum 22 AWG typical.

• Signal, discretes, :– Twisted MIL-DTL27500-24SC2U00 or twisted shielded DTL-27500-24SC2S23 typical. – Minimum 24 AWG or 26AWG for thermal sensors.

• LVDS and RS422:– Tensolite 26453/9N173X-2. 100Ω impedance 24 or 26AWG – Heritage application only, Perform short shield termination to limit noise.

• 1553:– Twinax MIL-C_17/176-000002 78Ω impedance 24AWG – Standard Harness Connector: Trompeter PL3155AC-201

• SPACEWIRE:– Gore GSC-05-82730-00 100Ω impedance 26AWG – Harness Connector: MDM-9 M83513/1-AN

• RF:– S-Band coax, Ka Band waveguide, X-band coax.– Application specific installation will be coordinated with subsystem leads.

• Fiber optic:– Laser Ranging (0.250 Cable TBD)– Application specific installation will be coordinated with subsystem leads.


Grounding & Shielding• Grounding level 1:

– Standard silver coated braid wire QQB575F36S125– Application specific, typical for ESD, passive components, etc.

• Grounding level 2:– Approximate 5 to 1 ratio laminated ground using TR449 Chase tape.– Extremely light weight, clean, attaches with a wide variety of fasteners.– Can be used for nearly any application.

• Grounding level 3:– Copper sheet fabricated into or mechanically attached to mounting surface. – 5 to 1 ratio for the most demanding grounding requirements.– RF transmitters, Spacewire devices, single point ground.– Heavy, requires specific attach points and hardware.

• Shielding:– Laminated aluminum tape Lamiglas LG-1055 or equivalent harness wrap.– 100% coverage into backshell, splice able, – No adhesive, can receive multi point grounds using TR449.

• Backshells:– Light weight aluminum, nickel plated.– Summer, Kern and Glenair are under review.

• Connectors:– D SUB 311P405, 311P407, 311P409 – D MIN M83513/X – Circular MIL-DTL-38999 – Remaining connectors will be used in compliance with EEE-INST-002


ESD Protection• ESD Filtering and Shielding

– Internal Harness• Shielded cable for clocks, data, and sensitive signal interface.• Fully enclosed RF backshell for all connectors.• Shield terminations at the connector backshell .

– External Harness• Shielded cable for clocks, data, and sensitive signal interface.• Harness bundle shield (Lamiglas tape) for all external harness.• Fully enclosed RF backshell for all connectors.• Shield termination at the harness penetration plate or connector backshell.• Filter block (loss pass filter) at the harness penetration plate for selected cables.


Routing Tools• Data base tracking of connector, backshell, hardware lengths and bend radius.• Pro-E using manual entry of harness model.• Harness loss data to limit length of certain interfaces.• Application specific limiting factors for RF, Spacewire, 1553 stub length, etc.• Key Routing rules

– Pyrotechnics and high surge items routed separately, crossing at 90°– Signal and power routed separately where possible.


Sample Routing


HGA Boom Harness NEW INTERFACE DEFINITION HGA PAGE

Preliminary electrical interface configuration for the deployed boom assemblies.

QTY Cond AWG ITEM Boom Hinge X motor motor bearings Y motor motor bearings ANT1 1 RF Waveguide W34 Horn (Ka)1 1 RF S-band Coax Patch (S)1 1 OF Laser Cable Base

3pr 6 26 Thermistor Therm Ant4 4 20 GND GND

1pr 2 22 Heater Power Heater Mtr, tel2pr 4 26 Thermistor Thermistor Mtr, tel1pr 2 22 Heater Power Heater1pr 2 26 Thermistor Thermistor3pr 6 22 Motor Drive Motor Pri3pr 6 22 Motor Drive Motor Red5pr 9 24 Excite, decode Resolver Pri4pr 9 24 Excite, decode Resolver Red1pr 2 22 Heater Power Heater1pr 2 26 Thermistor Thermistor1pr 2 22 Heater Power Heater2pr 4 26 Thermistor Thermistor3pr 6 22 Motor Drive Motor Pri3pr 6 22 Motor Drive Motor Red5pr 9 24 Excite, decode Resolver Pri4pr 9 24 Excite, decode Resolver Red2pr 4 26 Thermistor Damper2pr 4 22 Heater Power Damper

98 Total49pr inc/ 4 GND + 1 Coax + 1 WG + 1 Fiber


Solar Array Boom HarnessINTERFACE DEFINITION SA PAGE

Preliminary electrical interface configuration for the deployed boom assemblies.SOLAR ARRY

QU Cond AWG S/C Boom Hinge AZ/Yaw Rotary Joint EL/Pitch Rotary Joint SA28pr 56 20 Power Panel 56 562pr 4 22 Performance Monitors (2) Panel 4 44pr 8 24 CSS CSS 8 86pr 12 26 Thermistor PSE data Panel 12 122pr 4 22 SA Deploy HOP HOP 4 42pr 4 22 SA Deploy HOP HOP 4 42pr 4 24 HOP Limit Switch TB X2 Switch 4 44s 4 20 GND GND 4 42pr 4 22 Heater Power (Deploy) Heater 4 42pr 4 22 Heater Power Heater 100 Gimbal2 42pr 4 26 Thermistor Thermistor 43pr 6 22 Motor Drive Motor Pri 63pr 6 22 Motor Drive Motor Red 65pr 9 24 Excite, decode Resolver Pri 94pr 9 24 Excite, decode Resolver Red 92pr 4 22 Heater Power Heater Gimbal1 1382pr 4 26 Thermistor Thermistor3pr 6 22 Motor Drive Motor Pri3pr 6 22 Motor Drive Motor Red5pr 9 24 Excite, decode Resolver Pri4pr 9 24 Excite, decode Resolver Red

176 Total86pr + 4 GND


EELV Umbilical Harness

• Requirements captured in document LRO Launch Vehicle Requirements, 431-RQMT-000397 Rev A– Two 61 pin connectors, s/c side of interface female– EELV selects part number, they provide three (3) full sets (both sides

of the connector) to LRO NLT June 2007– Isolation (1 Megaohm) and grounding requirements defined– Maximum round trip resistance for power specified (1 ohm)– Separation loops defined (1 ohm closed, 1 megaohm open) for both

sides of the interface– Work in progress, expectation is that more spares will be identified as

propulsion valves are completely defined


Preliminary Umbilical Connector DefinitionSeparation Connector (J1)

No. Signal Description Signal TypeWire Type Spacecraft Connection Characteristics

1 Battery OFF Command Pulse Cmd, +56V, EGSE TP 22 Vbus Rtn through relay coil ?2 Battery ON Command Pulse Cmd, +28V TP 22 Vbus Rtn through relay coil ?3 Battery ON/OFF Command Rtn Pulse Cmd, +28V TP 22 Vbus Rtn4 Battery Relay Status Contact Closure TP 24 Relay contact Floating5 Battery Relay Status Rtn Contact Closure TP 24 Relay contact Floating6 Bus Voltage Active Analog 0-35V TSP 24 Vbus, resistor isolated, 100K ohm7 Battery Voltage Active Analog 0-35V TSP 24 Vbat, resistor isolated, 100K ohm8 Bus/Battery Voltage Rtn Active Analog TSP 24 Vbus Rtn9 Battery Current Active Analog TSP 24 Input to Mux ? Floating

10 Battery Current Rtn Active Analog TSP 24 Vbus Analog Rtn ? Floating11 Battery Temperature Passive Analog TSP 24 Input to Mux ? Floating12 Battery Temperature Rtn Passive Analog TSP 24 Vbus Analog Rtn ?13 He Tank Temperature Passive Analog TSP 24 Input to Mux ? Floating14 He Tank Temperature Rtn Passive Analog TSP 24 Vbus Analog Rtn ?15 He Pressure Transducer Signal Active Analog, 0-5 V TSP 24 Min 100K ohm input impedance Floating16 He Pressure Transducer Rtn Active Analog, 0-5 V TSP 24 Vbus Analog Rtn17 He Pressurant Pyro 1 Status - Open Contact Closure TP 24 Switch Closure Floating18 He Pressurant Pyro 1 Status - Closed Contact Closure TP 24 Switch Closure Floating19 He Pressurant Pyro 1 Status Rtn Contact Closure TP 24 Switch Closure Floating20 He Pressurant Pyro 2 Status - Open Contact Closure TP 24 Switch Closure Floating21 He Pressurant Pyro 2 Status - Closed Contact Closure TP 24 Switch Closure Floating22 He Pressurant Pyro 2 Status Rtn Contact Closure TP 24 Switch Closure Floating23 Helium Pressurant Latch Valve CLOSED Status Contact Closure TP 24 Switch Closure Floating24 Helium Pressurant Latch Valve CLOSED Status Rtn Contact Closure TP 24 Switch Closure Floating25 Fuel Tank 1 Temperature Passive Analog TSP 24 Input to Mux ?26 Fuel Tank 1 Temperature Rtn Passive Analog TSP 24 Vbus Rtn ?27 Fuel Tank 2 Temperature Passive Analog TSP 24 Input to Mux ?28 Fuel Tank 2 Temperature Rtn Passive Analog TSP 24 Vbus Rtn ?29 Fuel Tank Pressure Transducer Signal Active Analog, 0-5 V TSP 24 Min 100K ohm input impedance Floating30 Fuel Tank Pressure Transducer Rtn Active Analog, 0-5 V TSP 24 Vbus Analog Rtn31 Pressure Transducers Power EGSE Power +28 V TP 22 Vbus, Diode Isolated Floating32 Pressure Transducers Power Rtn EGSE Power +28 V TP 22 Vbus Rtn33 Spacecraft Separation Loop 1 Break Wire TP 24 None, Minimum 1 Megaohm Isolation Floating34 Spacecraft Separation Loop 1 Rtn Break Wire TP 24 None, Minimum 1 Megaohm Isolation Floating35 ELV Separation Loop 1 Break Wire TP 24 Vbus36 ELV Separation Loop 1 Rtn Break Wire TP 24 Vbus Rtn37 ELV Separation Loop 2 Break Wire TP 24 Vbus38 ELV Separation Loop 2 Rtn Break Wire TP 24 Vbus Rtn39 ELV Separation Loop 3 Break Wire TP 24 Vbus40 ELV Separation Loop 3 Rtn Break Wire TP 24 Vbus Rtn41 ELV Separation Loop 4 Break Wire TP 24 Vbus42 ELV Separation Loop 4 Rtn Break Wire TP 24 Vbus Rtn43 DPC Input 1 Power Power TP20 Vbus, Diode Isolated Floating44 DPC Input 1 Power Rtn Power TP20 Vbus Rtn45 SAS Circuit 1 Power Power TP20 Vbus, Diode Isolated Floating46 SAS Circuit 1 Power Rtn Power TP20 Vbus Rtn47 SAS Circuit 2 Power Power TP20 Vbus, Diode Isolated Floating48 SAS Circuit 2 Power Rtn Power TP20 Vbus Rtn49 SAS Circuit 3 Power Power TP20 Vbus, Diode Isolated Floating50 SAS Circuit 3 Power Rtn Power TP20 Vbus Rtn51 SAS Circuit 4 Power Power TP20 Vbus, Diode Isolated Floating52 SAS Circuit 4 Power Rtn Power TP20 Vbus Rtn53 SAS Circuit 5 Power Power TP20 Vbus, Diode Isolated Floating54 SAS Circuit 5 Power Rtn Power TP20 Vbus Rtn55 SAS Circuit 6 Power Power TP20 Vbus, Diode Isolated Floating56 SAS Circuit 6 Power Rtn Power TP20 Vbus Rtn57 SAS Circuit 7 Power Power TP20 Vbus, Diode Isolated Floating58 SAS Circuit 7 Power Rtn Power TP20 Vbus Rtn59 Chassis Ground TP20 Vbus Rtn60 Spare TSP22 Floating61 Spare TSP22 Floating

Separation Connector (J2)

No. Signal Description Signal TypeWire Type Spacecraft Connection Characteristics

1 Spacecraft Low Speed Tlm Data to ELV - Pos Digital, RS 422 TSP 24 5 Vdc? ?2 Spacecraft Low Speed Tlm Data to ELV - Neg Digital, RS 422 TSP 24 5 Vdc? ?3 Spacecraft Low Speed Tlm Clock to ELV - Pos Digital, RS 422 TSP 24 5 Vdc? ?4 Spacecraft Low Speed Tlm Clock to ELV - Neg Digital, RS 422 TSP 24 5 Vdc? ?5 Transponder Hardline Command Enable Digital, 0-5 V TP 24 ESD/Transient Protection Floating6 Transponder Hardline Command Enable Return Digital, 0-5 V TP 24 Vbus Rtn7 Transponder Hardline Command Signal Pos Digital, RS-422 TSP 24 ESD/Transient Protection Floating8 Transponder Hardline Command Signal Neg Digital, RS-422 TSP 24 ESD/Transient Protection Floating9 S-Band Hardline Tlm Pos Digital, RS-422 TSP 24 ESD/Transient Protection Floating

10 S-Band Hardline Tlm Neg Digital, RS-422 TSP 24 ESD/Transient Protection Floating11 Spacecraft Separation Relays Reset Pulse Cmd, +28V TP 22 EGSE Supplied ?12 Spacecraft Separation Relays Reset Rtn Pulse Cmd, +28V TP 22 EGSE Supplied ?13 Spacecraft Separation Relays OPEN Status (Ganged) Contact Closure TP 24 Relay Contact Floating14 Spacecraft Separation Relays OPEN Status (Ganged) Rtn Contact Closure TP 24 Relay Contact Floating15 Spacecraft Separation Loop 2 Break Wire TP 24 None, Minimum 1 Megaohm Isolation Floating16 Spacecraft Separation Loop 2 Rtn Break Wire TP 24 None, Minimum 1 Megeohm Isolation Floating17 ELV Separation Loop 5 Break Wire TP 24 Vbus18 ELV Separation Loop 5 Rtn Break Wire TP 24 Vbus Rtn19 ELV Separation Loop 6 Break Wire TP 24 Vbus20 ELV Separation Loop 6 Rtn Break Wire TP 24 Vbus Rtn21 ELV Separation Loop 7 Break Wire TP 24 Vbus22 ELV Separation Loop 7 Rtn Break Wire TP 24 Vbus Rtn23 ELV Separation Loop 8 Break Wire TP 24 Vbus24 ELV Separation Loop 8 Rtn Break Wire TP 24 Vbus Rtn25 ELV Separation Loop 9 Break Wire TP 24 Vbus26 ELV Separation Loop 9 Rtn Break Wire TP 24 Vbus Rtn27 ELV Separation Loop 10 Break Wire TP 24 Vbus28 ELV Separation Loop 10 Rtn Break Wire TP 24 Vbus Rtn29 Fuel Tank 1 Latch Valve CLOSED Status Contact Closure TP 24 Switch Closure Floating30 Fuel Tank 1 Latch Valve CLOSED Status Rtn Contact Closure TP 24 Vbus Rtn31 Fuel Tank 2 Latch Valve CLOSED Status Contact Closure TP 24 Switch Closure Floating32 Fuel Tank 2 Latch Valve CLOSED Status Rtn Contact Closure TP 24 Vbus Rtn33 Thrusters 1A - 4A Latch Valve CLOSED Status Contact Closure TP 24 Switch Closure Floating34 Thrusters 1A - 4A Latch Valve CLOSED Status Rtn Contact Closure TP 24 Vbus Rtn35 Thrusters 1B - 4B Latch Valve CLOSED Status Contact Closure TP 24 Switch Closure Floating36 Thrusters 1B - 4B Latch Valve CLOSED Status Rtn Contact Closure TP 24 Vbus Rtn37 Thrusters 20lb (Primary) Latch Valve CLOSED Status Contact Closure TP 24 Switch Closure Floating38 Thrusters 20lb (Primary) Latch Valve CLOSED Status Rtn Contact Closure TP 24 Vbus Rtn39 Thrusters 20lb (Redundant) Latch Valve CLOSED Status Contact Closure TP 24 Switch Closure Floating40 Thrusters 20lb (Redundant) Latch Valve CLOSED Status Rtn Contact Closure TP 24 Vbus Rtn41 PWM Status Active Analog, 0-5V TSP 24 Min 100k ohm imput impedance Floating?42 PWM Rtn Active Analog, 0-5V TSP 24 Vbus Analog Rtn43 DPC Input 2 Power Power TP20 Vbus, Diode Isolated Floating44 DPC Input 2 Power Rtn Power TP20 Vbus Rtn45 SAS Circuit 8 Power Power TP20 Vbus, Diode Isolated Floating46 SAS Circuit 8 Power Rtn Power TP20 Vbus Rtn47 SAS Circuit 9 Power Power TP20 Vbus, Diode Isolated Floating48 SAS Circuit 9 Power Rtn Power TP20 Vbus Rtn49 SAS Circuit 10 Power Power TP20 Vbus, Diode Isolated Floating50 SAS Circuit 10 Power Rtn Power TP20 Vbus Rtn51 SAS Circuit 11 Power Power TP20 Vbus, Diode Isolated Floating52 SAS Circuit 11 Power Rtn Power TP20 Vbus Rtn53 SAS Circuit 12 Power Power TP20 Vbus, Diode Isolated Floating54 SAS Circuit 12 Power Rtn Power TP20 Vbus Rtn55 SAS Circuit 13 Power Power TP20 Vbus, Diode Isolated Floating56 SAS Circuit 13 Power Rtn Power TP20 Vbus Rtn57 SAS Circuit 14 Power Power TP20 Vbus, Diode Isolated Floating58 SAS Circuit 14 Power Rtn Power TP20 Vbus Rtn59 Chassis Ground Power TP20 Vbus Rtn60 Spare TSP 22 Floating61 Spare TSP 22 Floating


Spacecraft Test Panel

• Test Panel Reservations:10/21/2005

Subsystem Component J# Signal Description Description UNIT ConnectorTest PanelINSTRUMENT J1 LAMP SAFE-ARM (High Voltage) See ICDINSTRUMENT J2 LOLA SAFE-ARM (Laser)TIME BASE J3 USO OUT, 1PPS MON (TERM) Monitor 3 time basesC&DH J4 TEST CONNECTOR 51 pin micro D to 62 pin?51 Pin Micro DPOWER SA LOOP J5 SA Out 1 (SA / PSE LOOP) D-37F / 311P409-4M-B-15POWER SA LOOP J6 SA Out 2 (SA / PSE LOOP) D-37F / 311P409-4M-B-15POWER SA LOOP J7 PSE IN 1 (SA / PSE LOOP) D-37M / 311P409-4M-B-15POWER SA LOOP J8 PSE IN 2 (SA / PSE LOOP) D-37M / 311P409-4M-B-15POWER SAS LOOP J9 SAS OUT (SAS / PSE LOOP) TO UMB POWER SAS LOOP J10 PSE IN (SAS / PSE LOOP)POWER J11 PSE TEST POWER IN D-37POWER J12 BATTERY VOLTAGE MON Cell volate monitor/temp/relayPOWER J13 BATTERY ARM Battery LOOP 12AWGHEATER J14 HEATER LOOP HEATER LOOP See commentINHIBIT J15 INHIBIT RESET Reset to known stateINHIBIT J16 INHIBIT MONITOR Monitor see commentRF J17 MINI RF SAFE&ARM XMITRF J18 Ka RF SAFE&ARM XMITRF J19 S BAND RF SAFE&ARM XMITPYRO J20 Pyro Arm 1 (Propulsion)PYRO J21 Pyro Arm 2 (Propulsion)PYRO J22 Pyro / Act Arm 1 (Deploy)PYRO J23 Pyro / Act Arm 2 (Deploy)THRUSTER J24 Thruster Arm 1 (Propulsion incl Loop) 5#THRUSTER J25 Thruster Arm 2 (Propulsion incl Loop) 5#THRUSTER J26 Thruster Arm 3 (Propulsion incl Loop) 20#PROPULSION J27 PRESSURE MONITOR LOOP Pressure xducer loopPROPULSION J28 CSS LOOP BACK For CSS GSE testingTLM J29 1553-A Test / Termination BJ3153 or BJ3154AC-201TLM J30 1553-B Test / Termination BJ3153 or BJ3154AC-201PDE Break wire loop J31 Break Wire Loop Arming or Disaming connectorTLM J32 HARD LINE TELEMETRY GND TEST OR UMB LOOP


Harness Loss and Tracking• Potentially significant losses are closely tracked

– Solar Array to PSE– Battery– Networks, Spacewire, 1553. – Pyrotechnic and high surge items, PDE– RF losses, Ka, S, Mini RF– Anything capable of producing greater than a 1 volt loss, nominally

• Spacecraft Loss Budget– Generic loss review– Current Best Estimate (CBE) peak power consumption– Intermediate connectors pending– Nominal Voltage– 10ft one way harness length, includes number of conductors and AWG.– Thermal compensation run at 20C.– Based on ICD or latest information available as of 12/6/05.– Nothing exceeds the 1 volt loss maximum implied in 431-SPEC-000008– Generic review does not include closely tracked items listed above.


Solar Array and Battery LossesThese numbers are the result of maximum allocations rather than the lower, Current Best Estimate, power consumption. Carrying this amount of liability separately in the Master Equipment List, among other documents, has inconsequential value.

Pre-distribution Loss excerpt Solar Array and Battery.

Solar Array Whole Array Single Wire Single Single Whole Array

Single Single Wire Loss Only Number of Run E Run Wire Loss +

SIZE AMPS/W Wire R Wire E drop Watts Connectors Drop Power loss

Connector Loss W

20 AWG 1.88673469 0.16542 0.312103653 32.97598026 9 0.499 0.9412738 52.71133297

22 AWG 1.88673469 0.2718 0.51281449 54.18251381 9 0.7 1.3199619 73.91786652

Battery

AWG 30A / 8

12 AWG 3.75 0.0266 0.09975 5.985 4 0.205 0.7678125 12.285


S/C Harness Distribution Loss budgetGENERIC HARNESS LOSS Comp. ICD

POWER (in work) Duty Cycle Power ALLOC. I One Way ICD Number of Total Notes

12/6/2005 Avail Service P er Orbit Orbit Orbit Calculation Harness Actual Temp Connector Intermediate Cal Positive Harn Harn E W

Subsystem Components AWG Size (A) Time (M ) Avg (W) Avg (W) M ethod Length Ft AWG compensate R / EA. Connectors Voltage Conductors C R Drop Loss

Instrument CRaTER 22 1 113 5.1 9.0 CW 35-21V 10 22 1 0 0 24 1 0.302 0.11 0.04

Instrument Diviner and OP heaters 22 2 113 17 19.6 GEVS Heater + CW 10 22 1 0 0 24 2 0.151 0.12 0.10 Special Cal

Instrument Diviner REB, Remote Electronics Box (DREB) 22 2 0 5 7.0 CW 35-21V 10 22 1 0 0 24 2 0.151 0.04 0.01

Instrument Diviner Survival Heater 22 2 0 10 12.0 GEVS Heater 10 22 1 0 0 24 2 0.151 0.08 0.04 Special Cal

Instrument LAMP PRIME 22 2 113 4.42 4.86 CW 35-21V 10 22 1 0 0 24 2 0.151 0.03 0.01

Instrument LAMP REDUNDANT 22 2 0 4.42 4.86 CW 35-21V 10 22 1 0 0 24 2 0.151 0.03 0.01

Instrument LEND 22 1 113 13.00 13.00 CW 35-21V 10 22 1 0 0 24 2 0.151 0.08 0.04

Instrument LOLA 22 2 113 34.30 39.40 CW 35-21V 10 22 1 0 0 24 2 0.151 0.25 0.41

Instrument LROC (SCS) 22 1 113 4.40 5.20 CW 35-21V 10 26 1 0 0 24 2 0.448 0.10 0.02 Assumptions

Instrument LROC HOLD (NAC-1) 22 1 113 6.90 8.20 CW 35-21V 10 26 1 0 0 24 2 0.448 0.15 0.05 ↓

Instrument LROC HOLD (NAC-2) 22 1 113 6.90 8.20 CW 35-21V 10 26 1 0 0 24 2 0.448 0.15 0.05 ↓

Instrument LROC HOLD (WAC) 22 1 113 5.10 6.00 CW 35-21V 10 26 1 0 0 24 2 0.448 0.11 0.03 ↓

Instrument LROC Optics Decontamination 22 5 0 98.00 98.00 Non GEVS Heater 10 22 1 0 0 24 4 0.076 0.31 1.26 Special Cal

Instrument Mini RF (Main) 22 2 113/8 7.32 8.80 CW 35-21V 10 22 1 0 0 24 2 0.151 0.06 0.02

Instrument Mini RF (PA) 22 5 8 2.00 2.40 CW 35-21V 10 22 1 0 0 24 2 0.151 0.02 0.00

S Comm TT&C XPDR Stack (xmit) 22 2 58 17.96 24.00 CW 35-21V 10 22 1 0 0 24 2 0.151 0.15 0.15 ICD Pend

Ka Comm Ka Transmitter complement 20 15 58 51.33 59.00 CW 35-21V 10 20 1 0 0 24 4 0.046 0.11 0.28 ICD Pend

C&DH Move to Unsw Bus? C&DH Ka Comm Card (Side B) 22 2 58 8.98 10.00 CW 35-21V (Confir 10 22 1 0 0 24 2 0.151 0.06 0.03 ICD Pend

C&DH USO 9500, Sat Master 22 2 113 4.00 4.40 Heater + CW 35-21 10 22 1 0 0 24 2 0.151 0.03 0.01 ICD Pend

GIMBAL HGA Gimbal Control 20 2 113 20.00 25.00 CW 35-21V 10 20 1 0 0 24 2 0.092 0.10 0.10 ICD Pend

GIMBAL SA Gimbal Control 20 2 113 20.00 25.00 CW 35-21V 10 20 1 0 0 24 2 0.092 0.10 0.10 ICD Pend

PDE PDE 22 5 10 5.00 35.00 Non GEVS Heater 10 22 1 0 0 24 4 0.076 0.11 0.16 ICD Pend

ACS Inertial Measurement Unit 22 2 113 32.00 36.00 CW 35-21V 10 22 1 0 0 24 2 0.151 0.23 0.34 ICD Pend

ACS Star Trackers 22 1 113 12.00 15.00 CW 35-21V 10 22 1 0 0 24 2 0.151 0.09 0.06 ICD Pend

ACS Star Trackers 22 1 113 12.00 15.00 CW 35-21V 10 22 1 0 0 24 2 0.151 0.09 0.06 ICD Pend

ACS Reaction Wheel (Generator warning) 20 5 113 16.00 18.00 CW 35-21V 10 20 1 0 0 24 2 0.092 0.07 0.05 ICD Pend

ACS Reaction Wheel 20 5 113 16.00 18.00 CW 35-21V 10 20 1 0 0 24 2 0.092 0.07 0.05 ICD Pend

ACS Reaction Wheels 20 5 113 16.00 18.00 CW 35-21V 10 20 1 0 0 24 2 0.092 0.07 0.05 ICD Pend

ACS Reaction Wheels 20 5 113 16.00 18.00 CW 35-21V 10 20 1 0 0 24 2 0.092 0.07 0.05 ICD Pend

ACS CAT BED HEATERS 22 2 30 11.72 13.00 Non GEVS Heater 10 22 1 0 0 24 2 0.151 0.08 0.04 ICD Pend

ACS CAT BED HEATERS 22 2 30 11.72 13.00 Non GEVS Heater 10 22 1 0 0 24 2 0.151 0.08 0.04 ICD Pend

S Comm TT&C XPDR Stack (Receive only) 20 2 113 10.00 12.00 CW 35-21V 10 20 1 0 0 24 2 0.092 0.05 0.02 ICD Pend

C&DH C&DH S-Comm card ( Side A) 20 2 113 8.60 9.00 CW 35-21V (Confir 10 20 1 0 0 24 2 0.092 0.03 0.01 ICD Pend

C&DH C&DH Backplane 20 5 113 85.14 100.00 CW 35-21V (Confir 10 20 1 0 0 24 3 0.061 0.26 1.06 ICD Pend

Power PSE D 2 113 0.00 50.00 CW 35-21V N/A N/A 1 0 0 24 n/a

TOTAL 643.19 801.42 AVG 0.10 4.60 total w/o pde

TOTAL 4.60 Watts


Harness Loss and Tracking / Mass• Harness Loss and tracking

– Spacewire and 1553 limits maintained– Network analysis perform at the subassembly level.– RF limits maintained and tracked by the subsystem in coordination

with routing.– Spacewire performance testing– Fiber Optic performance testing

• Mass ITEM CBE ALLOCATION

Prop Harness 5.0 Kg 5.0 Kg. Sub allocation

Bus / Distribution Blocks 3.0 Kg 4.0 Kg.

HGA Boom Harness 1.5 Kg 2.0 Kg. Sub allocation

SA Boom Harness 1.5 Kg 2.0 Kg. Sub allocaiton

1553 Bus Components 1.0 Kg 2.0 Kg.

Avionics / IM 36.0 Kg 45.0 Kg.

TOTAL 48.0 Kg 60.0 Kg ~ 20% Margin


Trade Studies in WorkTrade Study Options Criteria Outcome

SpaceWire cable type

• GSC-05-81757-00 Gore• GSC-05-82730-00 Gore• NF26Q100 Tensolite• GlenAir Options TBD

Criteria included:• Flight heritage• JWST experience• Loss, Jitter, Skew

Pending with GSC-05-82730-00 Gore leading.

Pending with Gore leading

Outer Wrap harness shielding

• LG-1055 0.00035Al• LG-1031 0.002Al• LG-1246 0.001Al Double• LG-927 0.00035Al Double• Standard Aluminum tape• Other

• Low Mass• Radiation reduction required• Contamination • EMI reduction• Installation and handling• Flight heritage

• Pending application analysis • Pending final mechanical

configuration / layout and run disstance.

• Use standard shielding until configuration matures.

• Final outcome pending other trades.

Launch Vehicle Connector interface • KSC requested flexibility in the final connector choice

• Launch Vehicle selection.• Umbilical service requirements.

• Pending launch vehicle selection

RF Waveguide, Coax, Fiber Optic

• Support subsystem trades• Restraint methods and materials • Outer shielding• Radiation shielding methods and

materials.

• Subsystem analysis and direction• Radiation analysis.• Bend Radius• Special Routing• Cable characteristics, fragile.

• Pending joint efforts with subsystems and design maturity.

SpaceWire cable fabrication facility• In-House GSFC• Gore• GlenAir

• JWST experience• Testing capabilities• Reliability

Support HGAS and SA actuator study.

• Moog type 3• Moog type 5• Moog type 6• Starsys

• Role of the harness through the center of the mechanisms.

• Flex torque• Outer wrap selection• Shield analysis requirements


Fabrication and Verification• Fabrication Standards

– EEE Parts selection and derating EEE-INST-002– Flight Electrical Harness Guidelines 565-PG-8700.2.1– NASA Technical Standards NASA-STD-8739.x…..– 1553 Bus Standard MIL-STD-1553– Spacewire Standard ESS-E-50-12A – LRO Contamination plan 431-PLAN-000110– MAR or Fabrication level QA plan 431-PLAN-000000

• Fabrication and verification process– Search NASA Lessons learned data base for new data.– QA coordination with Work orders and procedures

• In process monitoring– Contamination control in advance, prior to fabrication

• Materials approval– Pre-clean / bake materials– Fab & form to mockup– Continuity test – Possible interim high potential test.– Pot required connectors– Lamiglas or other wrap– Final insulation / High potential testing.– Final decontamination bake-out


Pre-installation Verification

• Pre Installation– Composite structure ground

survey (Optical Bench only)– Ground bonding of

components

• Sample ground survey reference• Core sections• Inserts• Ground points• Passive & ESD• Single point OB ground


Liens & Deliverables / StatusItem UID Date Status

ICD’s needed 2849

4322

2847

2010

2847

4336

4347

4350

4365

4365

4350

5/06 4 of 20 ICD’s released, 5 in Draft

Harness Drawings 6/06 Begun using preliminary information (Top Level in NGIN)

Parts Lists 3/06 Begun using preliminary information (Draft in NGIN)

S/C Mockup needed 9/06 In-Work

Parts Needed 9/06 Parts List pending (Draft in NGIN)

Flat-sat Harness 12/06 Limited preliminary information.

Avionics Module, Flight harness 3/07 4 of 20 ICD’s released, 5 in Draft form

Propulsion Module, Flight harness 12/06 Limited preliminary information

Instrument Module, Flight harness 2/07 2 of 4 ICDs released

GSE Umbilical 2/07 Umbilical draft based on vehicle selection

GSE Prop New Requirements in review


Parts List ExcerptSub-System Component Connector

Description

Box Connector Designator

Connector Part Number Connector Backshell Number

Backshell Length

Total Length of Hardware

# Wires Used

Wire Gauge

Connector Bundle

Dia.(Calculated

Bundle Bend Rad (inch)

Bundle Rad from box face (inch)

Comments

C&DH Scomm 9 P J01 311P409-1P-B-15 DW214-09-1-6-0011 1.26 1.57 9 22 0.29 1.45 3.3C&DH Scomm 15 F J02 311P407-1S-B-15 DW214-09-1-6-0011 1.26 1.57 8 24 0.227 1.14 2.9C&DH Scomm 26 M J03 311P407-2P-B-15 DW214-15-2-6-0012 1.26 1.57 22 24 0.376 1.88 3.8C&DH Scomm 9 M MDM J04 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH Scomm 9 M MDM J05 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH Scomm 26 M J06 **** 311P407-2P-B-15 0 0 0.0 JTAG PortC&DH Scomm 15 M J07 311P407-1P-B-15 DW214-09-1-6-0011 1.26 1.57 13 24 0.3 1.50 3.4C&DH Scomm 26 F J08 311P407-2S-B-15 DW214-15-2-6-0012 1.26 1.57 20 24 0.358 1.79 3.7C&DH Scomm 9 M MDM J09 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH Scomm 9 M MDM J10 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH Scomm 9 S J11 311P409-1S-B-15 DW214-09-1-6-0011 1.26 1.57 8 22 0.26 1.30 3.1C&DH KaComm 9 M MDM J12 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH KaComm 9 M MDM J13 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH KaComm 4 Port twinax J14 0.31 4 4 Twinax 0.3C&DH KaComm 26 M J15 **** 311P407-2P-B-15 0 0 0.0 JTAG Port not wiredC&DH KaComm 9 M MDM J16 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH KaComm 9 M MDM J17 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH KaComm 4 Port twinax J18 0.31 4 4 Twinax 0.3C&DH KaComm 15 M J19 311P407-1P-B-15 DW214-09-1-6-0011 1.26 1.57 7 24 0.227 1.14 2.9C&DH KaComm 9 S J20 311P409-1S-B-15 DW214-09-1-6-0011 1.26 1.57 8 22 0.26 1.30 3.1C&DH HK I/O 9 M MDM J21 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH HK I/O 9 M MDM J22 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH HK I/O 44 M J23 311P407-3P-B-15 DW214-25-3-6-0013 1.58 1.89 40 22 0.58 2.90 5.4C&DH HK I/O 26 M J24 311P407-2P-B-15 DW214-15-2-6-0012 1.26 1.57 21 24 0.376 1.88 3.8C&DH HK I/O 9 P J25 311P409-1P-B-15 DW214-09-1-6-0011 1.26 1.57 6 22 0.225 1.13 2.9C&DH HK I/O 9 M MDM J26 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH HK I/O 9 M MDM J27 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH HK I/O 26 F J28 ****311P407-2S-B-15 0.31 0 0 0.3C&DH HK I/O 9 S J29 311P409-1S-B-15 DW214-09-1-6-0011 1.26 1.57 6 22 0.225 1.13 2.9C&DH MAC 104 M J30 311P407-6P-B-15 DW214-104-5-6-0016 1.58 1.89 104 24 0.817 4.09 6.8C&DH MAC 104 M J31 311P407-6P-B-15 DW214-104-5-6-0016 1.58 1.89 104 24 0.817 4.09 6.8C&DH MAC 9 M MDM J32 MWDM2L-9NSB 500-047M09H 0.8 1.11 1.1C&DH MAC TRIAX J33 PL3155AC-201 N/A 1.2 1.51 3 Triax 0.13 1.30 2.9C&DH MAC TRIAX J34 PL3155AC-201 N/A 1.2 1.51 3 Triax 0.13 1.30 2.9C&DH MAC 104 M J35 311P407-6P-B-15 DW214-104--5-6-0016 1.58 1.89 104 24 0.817 4.09 6.8C&DH MAC 104 M J36 311P407-6P-B-15 DW214-104--5-6-0016 1.58 1.89 104 24 0.817 4.09 6.8C&DH MAC 50 S J37 311P409-5S-B-15 DW214-50-5-6-0015 1.58 1.89 46 20 0.675 3.38 5.9 Changed from 50 P to 50 S 11/23/05C&DH LVPC 15 M J38 ****311P407-1P-B-15 0.31 ****44 24 0.3 Connector description does not match spreadsheet which is a 44 pin connectorC&DH LVPC 25 S J39 311P409-3S-B-15 DW214-25-3-6-0013 1.58 1.89 15 20 0.398 1.99 4.3C&DH LVPC 15 P J40 311P409-2P-B-15 DW214-15-2-6-0012 1.26 1.57 15 20 0.398 1.99 4.0C&DH LVPC 15 S J41 311P409-2S-B-15 DW214-15-2-6-0012 1.26 1.57 15 20 0.398 1.99 4.0C&DH SBC 9 M MDM J42 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH SBC 9 M MDM J43 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH SBC 9 M MDM J44 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH SBC 9 M MDM J45 MWDM2L-9NSB 500-047M09H 0.8 1.11 9 26 0.350 2.42 3.9 GlenAir # modified w/large cup. Shield requires 600-057 micro band. 26 awg Space wireC&DH SBC 31 M MDM J46 MWDM2L-31P-6J7-96B 500-047M31H 1.12 1.43 31 26 0.00 1.4 Check connector part #C&DH SBC 51 M MDM J47 MWDM2L-51P-6J7-96B 500-047M51H 1.19 1.50 51 26 0.00 1.5 Connects to Test Panel.C&DH SBC TRIAX J48 PL3155AC-201 N/A 1.2 1.51 3 Triax 0.13 1.30 2.9C&DH SBC TRIAX J49 PL3155AC-201 N/A 1.2 1.51 3 Triax 0.13 1.30 2.9C&DH DIB TBD J50 TBD 0.31 ??? ??? 0.3C&DH DIB 100 M J51 MM-412-100-113-6200 500-047M100H 1.25 1.56 100 24 0.801 4.01 6.4 100 Pin Solder Cup - PlugC&DH DIB 100 M J52 MM-412-100-113-6200 500-047M100H 1.25 1.56 100 24 0.801 4.01 6.4 100 Pin Solder Cup - PlugPSE PMC 15 M J1 311P407-1S-B-15 DW214-09-1-6-0011 1.26 1.57 15 22 0.367 1.84 3.8PSE OM1 25 P J10 311P409-3P-B-15 DW214-25-3-6-0013 1.58 1.89 25 20 0.508 2.54 4.9PSE OM2 44 M J11 311P407-3P-B-15 DW214-25-3-6-0013 1.58 1.89 44 22 0.609 3.05 5.5PSE OM2 15 P J12 311P409-2P-B-15 DW214-15-2-6-0012 1.26 1.57 15 20 0.398 1.99 4.0PSE OM2 25 P J13 311P409-3P-B-15 DW214-25-3-6-0013 1.58 1.89 25 20 0.508 2.54 4.9PSE OM3 44 M J14 311P407-3P-B-15 DW214-25-3-6-0013 1.58 1.89 44 22 0.609 3.05 5.5PSE OM3 15 P J15 311P409-2P-B-15 DW214-15-2-6-0012 1.26 1.57 15 20 0.398 1.99 4.0PSE OM3 25 P J16 311P409-3P-B-15 DW214-25-3-6-0013 1.58 1.89 25 20 0.508 2.54 4.9PSE OM4 44 M J17 311P407-3P-B-15 DW214-25-3-6-0013 1.58 1.89 44 22 0.609 3.05 5.5PSE OM4 15 P J18 311P409-2P-B-15 DW214-15-2-6-0012 1.26 1.57 15 20 0.398 1.99 4.0PSE OM4 25 P J19 311P409-3P-B-15 DW214-25-3-6-0013 1.58 1.89 25 20 0.508 2.54 4.9PSE PMC 44 F J2 311P407-3S-B-15 DW214-25-3-6-0013 1.58 1.89 44 22 0.609 3.05 5.5PSE SAM 15 S J20 311P409-2S-B-15 DW214-15-2-6-0012 1.26 1.57 15 20 0.398 1.99 4.0PSE SAM 37 S J21 311P409-3S-B-15 DW214-37-4-6-0014 1.58 1.89 37 20 0.614 3.07 5.6PSE SAM 37 S J22 311P409-3S-B-15 DW214-37-4-6-0014 1.58 1.89 37 20 0.614 3.07 5.6PSE SAM 37 S J23 311P409-3S-B-15 DW214-37-4-6-0014 1.58 1.89 37 20 0.614 3.07 5.6PSE 9 S J24 311P409-1S-B-15 DW214-09-1-6-0011 1.26 1.57 9 20 0.315 1.58 3.5PSE ?? J25 0.31 4 18 0.3PSE ?? J26 0.31 4 18 0.3PSE PMC 26 M J3 311P407-2P-B-15 DW214-15-2-6-0012 1.26 1.57 26 22 0.468 2.34 4.4PSE PMC 9 P J4 311P409-1P-B-15 DW214-09-1-6-0011 1.26 1.57 9 20 0.315 1.58 3.5PSE PMC TRIAX J5A PL3155AC-201 N/A 1.2 1.51 3 Triax 0.13 1.30 2.9PSE PMC TRIAX J5B PL3155AC-201 N/A 1.2 1.51 3 Triax 0.13 1.30 2.9PSE PMC 15 F J6 311P407-1S-B-15 DW214-09-1-6-0011 1.26 1.57 15 22 - 302 0.367 1.84 3.8PSE PMC 26 F J7 311P407-2S-B-15 DW214-15-2-6-0012 1.26 1.57 26 22 0.468 2.34 4.4PSE OM1 44 M J8 311P407-3P-B-15 DW214-25-3-6-0013 1.58 1.89 44 22 0.609 3.05 5.5PSE OM1 15 P J9 311P409-2P-B-15 DW214-15-2-6-0012 1.26 1.57 15 20 - 304 0.398 1.99 4.0PSE

Parts List excerpt


TL Harness Drawing Excerpt

Top Level Drawing excerpt


Wrap-up

• No exceptional risks or problems have been identified.

• All interfaces are feasible.• All base-line materials are commonly flown.

LRO PDRContamination Control

Chris Lorentson, Rachel Rivera/GSFC Code 546Patsy Dickens, Glen Rosecrans/ SWALES

February 10, 2006

Chris Lorentson - Contamination Control 2

Contamination Requirements Overview

• Instrument Contamination Control requirements are the primary driver for establishing the observatory contamination control requirements and budget

• Not all instruments or spacecraft hardware require the same degree of contamination control, however, all must meet the negotiated contamination requirements established for the observatory

• These requirements include the following:– Surface particulate cleanliness levels based on MIL-STD-1246– Surface molecular cleanlines levels based on MIL-STD-1246– Materials screening criteria (1% TML, 0.1% CVCM). ASTM E1559 may be

required for outgassing rate measurements– Hardware outgassing requirements and bakeout procedures– Purge system requirements– Facility cleanliness requirements

• Failure to meet these established requirements will degrade the ability of the instrument/hardware to meet the mission/science requirements


Contamination Sensitivities

• The following surfaces/hardware have been defined as contamination sensitive surfaces– Instrument apertures

• LAMP, LOLA, and LROC are particularly sensitive• Instruments define and maintain internal surface cleanliness

– Solar Arrays– Thermal Control Surfaces– Star Trackers– Instrument/Spacecraft mechanisms– Laser Ranging detector


Instrument Contamination Requirements

BEGINNING-OF-LIFE

END-OF-LIFE INSTRUMENT COMPONENT

Particulate Molecular Particulate MolecularInternal Laser Level 100 Level A/2 Flight Optics Level 300 Level A/2

TBD TBD LOLA

External Surfaces

Level 500 Level A TBD TBD

LEND TBD TBD TBD TBD TBD Internal Surfaces

Delivery: Level 400

Delivery: Level A/20

Level 440 Level A/15

1LAMP

External Surfaces

Delivery: Level 450

Delivery: Level A/2

Level 575 Level A

LROC TBD Level 250 Level A/2 TBD TBD 2CRaTER TBD VC VC TBD TBD 1DIVINER TBD Delivery:

Level 400 Delivery: Level A/2

TBD TBD

1 Delivery to GSFC for I&T

2 Visibly-Clean per JSC-SN-C-0005


Observatory Contamination Requirements

• Based on the instrument contamination requirements, an observatory cleanliness level has been negotiated

• All LRO external surfaces shall not exceed a level 500A cleanliness level per MIL-STD-1246 at BOL– Contamination budgeting may reduce this requirement at specific

times in the hardware flow (i.e delivery at 450 A/2)– A contamination budget has been developed to specify cleanliness

levels at various hardware milestones such as instrument deliver, I&T, ship to launch site and launch

– Instrument covers, purging, and bagging will be used to allow more stringent instrument internal requirements to be met


Molecular Transport Analysis• Revised Contamination Geometry Model based on new Beta

design concept, eDrawings format dated 12/20/05• Developed S/C model using TRASYS format

– generated geometric viewfactors with rotated SA (5 rotations)– Considered several SA rotation angles and S/C Hot and Cold– Instrument models were reduced nodal J-models and converted TSS

geometry • Used SPACEII computer program to compute molecular

transfer from sources to critical receivers.– Input generic outgassing rates for all sources

• Utilized Excel spreadsheet to compile impingement rates to critical surfaces (i.e. instrument apertures & thermal radiators)– Incorporates sticking coefficients, exposure times, material decay

constants


LRO Contamination Modeling Analysis

LRO “Beta” Geometryw/Instrument Deck

Star Trackers

LROC-NACs

LAMP

LOLA

LROC-WACLOLA MEB

LEND Colliminators

Diviner

Crater SAR

Mini RF

Omni


Outgassing Requirements LRO Subsystem

Bakeout Priority or

OGR Verify (1-High – 4-Low)

Desired Outgassing Level

(g/cm2/sec)

Pred Max On-orbit

temperature (deg C)

Est. Bakeout Criteria to meet DOL

(time/temp)

Outgassing Mitigation

Required/when verified

Upper Bus Structure 3 NR

40C (est.) 48 hrs at >60oC (optional)

Thru bus vent (-X dir.): at subsystem level BO or S/C TV

Lower Bus Structure incl. Aft Deck

3 NR

40C (est.) 48 hrs at >60oC (optional)

Thru bus vent (-X dir.): at subsystem level BO or S/C TV

Instrument (optical) Deck

1 <5E-11 g/cm2/sec 40C (est.) 48 hrs at >60oC Seam vent, anti-nadir dir.

Ebox (-Z) Radiator 4 NR 40C (est.) NA If silicate paint, no BO need “Mini”RF (assumed blanketed backside)

1 <5E-11 g/cm2/sec 60C 48 hrs at >60CoC At subsystem level

Solar Array (cell side (cs) and completed backside(bs))

1 1

<5E-11 g/cm2/sec(cs) <1E-11 g/cm2/sec(bs)

60C (cs) 30C(bs)

36 hrs at 80oC At subsystem level: verify OGR on both sides

SA gimbal assembly & hinges

3 <1E-10 g/cm2/sec(ga) <5E-11 g/cm2/sec(h)

40C (ga) 80C (h)

36 hrs at >50oC (ga) 24 hrs at >80oC (h)

At subsystem or component level

HGA incl. dish and gimbal assemblies

3 <1E-10 g/cm2/sec 80C 24 hrs at >80oC At subsystem level

S/C MLI 1 2.5E-12 g/cm2/sec 40C 24 hrs at >80oC At component or completed level

Omni antennas 2 <5E-11 g/cm2/sec 50C 24 hrs at >60oC At component level Star Cameras (Trackers) incl. electronics

2 <5E-11 g/cm2/sec 40C 24 hrs at 60oC (optional)

At component level

Sun Sensors & electronics

3 <5E-11 g/cm2/sec 60C 24 hrs at 60oC (optional)

At component level

Bus vent(s) 3 <1E-10 g/cm2/sec 40C NA At S/C TV S/C harness 1 <5E-11 g/cm2/sec 40C 36 hrs min. at >80oC Prior to installation on structure Propulsion non-metallic components

1 <5E-11 g/cm2/sec 40C 48 hrs min. at >100oC Silicone grommets and washers at component level

Propulsion harnesses 2 <5E-11 g/cm2/sec 30C 48 hrs min. at >60oC At component level & prior to installation with Prop system


Molecular Transport Analysis Results• Developed a prioritized list of bakeouts for LRO subsystems to maintain

Instrument EOL molecular levels – Outgassing from Backside of Solar Array, Mini RF, and instrument electronic

box needs to be minimized through materials selection or bakeout for molecular mass transfer to instrument apertures.

– Outgassing verification are noted for best opportunities in I&T flow• First cut analysis, updated geometry will be considered prior to CDR to

update outgassing rate/bakeout table.• Design mitigations that will also reduce transfer of outgassed molecules

around LRO. – Edge venting away from nadir viewing apertures will assist with minimizing

external subsystem venting. MLI gaps and other undesirable venting locations should be sealed with tape or other approved sealing method

– Aft Deck and/or anti-nadir bus vents will assist with minimizing molecular transfer to instrument apertures

– Incorporating molecular adsorbers inside electronics box cavity will reduce released effluent over the mission lifetime


Purge System Requirements

• LAMP and LROC require continuous purge through launch to maintain internal contamination requirements– LAMP requires one purge port– LROC requires three separate ports– DIVINER requires one port

• Purge gas required to be Grade C nitrogen or Grade C equivalent dry filtered(30 micron in line filter) air

• Purge tubing and fittings to be precision cleaned to level 100A/5 prior to use

• Purge supply must be sample tested at instrument inlet to verify cleanliness level


LRO Contamination Implementation

• Contamination Control details and implementation specified in LRO Contamination Control Plan

• LRO assembly and testing shall be performed in a class 10,000 clean room per FED-STD-209(ISO-14644)

• LRO must be double bagged whenever it is necessary to remove the hardware from the cleanroom environment

• During periods of inactivity the hardware shall be draped within the cleanroom to reduce contamination buildup

• LRO shall be double bagged and purged for all transportation and/or storage activities

• LRO shall be double bagged during environmental testing activites outside the cleanroom



• LRO personnel garmenting requirements:– Full silicone free, ESD “bunny” suits are required

• Coveralls – 100% polyester or equivalent• Hoods – 100% polyester or equivalent• Booties – 100% polyester or equivalent• Cleanroon approved nitrile or latex gloves• Facemask/Beard Cover

– New garments should be used on a daily basis or more often if soiled

– Polyethlene gloves should be worn when using solvents• All personnel working in the LRO cleanroom

environment must be trained in proper LRO cleanroom procedures as certified by the CCE



• The LRO contamination budget (still being developed) shall be maintained as follows:

INSTRUMENT COMPONENT Delivery to GSFC

I&T At Launch BEGINNING-OF-LIFE END-OF-LIFE

Internal Laser A/2 TBD TBD TBD TBD

Flight Optics 300 A/2 TBD TBD TBD TBD

External Surfaces 450 A/2 450 A/2 450 A 500 A TBD

LEND TBD 450 A/2 450 A/2 450 A 500 A TBD

Internal Surfaces 400 A/20 TBD TBD TBD 440 A/15

External Surfaces 450 A/2 450 A/2 450 A 500 A 575 A

LROC External Surfaces TBR TBR TBR TBR 250 A/5 (TBR)

CRaTER TBD VC VC VC VC TBD

Optical Bench Assembly

100 A/5 TBD TBD TBD TBD

External Surfaces 400 A/2 TBD TBD TBD TBD

Mini-RF TBD 450 A/2 TBD TBD TBD TBD

S/C External Surfaces 450 A/2 450 A/2 450 A 500 A TBD

DIVINER

LAMP

LOLA


Launch Site Contamination Requirements

• Launch on a Delta IV or an Atlas V launch vehicle• Processing at Astro Tech

– 10,000 Cleanroom– Full cleanroom attire [bunnysuit, head, face, and shoe

covers, gloves]. No disposables.– Contamination facility monitoring

• Particles [not to exceed 0.25% surface obscuration]• Molecular [not to exceed 100 Angstroms]

– Carbon filtration of air handling system output• Change filters every 30 days to avoid excessive moisture buildup

which can damage filters– Use of purge gas at Grade C


Launch Site Contamination Requirements

• At the launch Pad– Class 10,000– Fairing air conditioning at a minimum Class 5000 with 70

kg/min airflow [1300 – 1900 scfm]– PLF, PAF and LV exposed to LRO surfaces, inspected

and maintained at Level 450A– Contamination facility monitoring

• Particles – witness fallout plates used through last possible access• Molecular – NVR plates used on a rotating basis

– Full Cleanroom attire [as listed for Astro Tech]– Use of grade C purge from encapsulation through lift-off


Key Milestones/Deliverable for CDR

• Updated CCP with recommended changes after PDR– Expected Delivery - 4/15/2006

• Updated molecular transport model analysis after geometry fully baseline post PDR– Expected Delivery - 7/1/2006

• Complete Contamination Control Implementation Plan to further detail contamination control procedures during I&T and launch phases.– Expected Delivery - CDR

LRO PDRReliability

Lydia Lee

Reliability Scope

• The level of Reliability support provided for the Subsystem PDR including:– Reliability Predictions & Reliability Block Diagrams (RBDs) identify

the design weak links/reliability drivers– Input to trade assessments (As requested)

• Redundant Power Monitor Card (PMC), Power Subsystem• Redundant SBC, C&DH Subsystem

– Fault Tree Analysis identifies minimal cut sets/single point failures as the minimum combinations of failures that would lead to the undesired “top event”

– Failure Modes and Effect Analysis identifies critical failure modes (severity class 1 & 2)

• Results of these analyses will be summarized into the Mission level PRA report.

Minimum Mission Scenarios

Diviner

6-Month 12-MonthWAC

6-Month NAC1 NAC2 12-Month

Scenarios 1 X X X 1, 2, 3 1, 2, 3 2 (6-Month) 3 (6-Month) 1Scenarios 2 X X X 1, 2 1 (12-Month) 2(12-Month)Scenarios 3 X X X 1, 2, 3 2 (12-Month) 1 (6-Month) 2, 3 (6-Month) 1, 3

Scenarios 1 has 3 different combinations of LOLA, NAC1, NAC2, and Diviner.Scenarios 2 has 2 different combinations of NAC1 and NAC2.Scenarios 3 has 3 different combination of WAC, NAC1, NAC2, and Diviner1, 2, and 3 denote combinations of instruments, any one of which is needed to meet minimum mission criteria.

LOLA 1-Month

LROCTopography

Hazards at Potential Landing

IlluminationSpacecraft

Note: Only a sampling of the most plausible scenarios is modeled. There are 26

possible combinations and a number of temporal dimensions.

Preliminary Fault Tree Diagram for Minimum Mission Criteria (Scenarios 2)

LRO Minimum Mission

Loss of LRO Minimum Mission

Q:0.10902

Scenario 2

S/C (12mo) & NACs (12mo)

Spacecraft (-3) 6 Month

Loss of Spacecraft within 6 months

Q:0.108139


Loss of Spacecraft after 6 - 12 months

Q:0.108139

ransmit Capability for Scen 2 (6

Loss of Ka transmit function within 6 months

Ka Transmit - 6 month

Loss of Comm Ka Transmit path

Q:0.00384469

Ka card - 6 month

Loss of C&DH Ka card

Q:0.00178917

Hard Drive Card - DIB - 6 month

Loss of C&DH hard drive card

Q:0.000879985

ard Drive Capability for 6 month

Loss of both hard drives within 6 months

Hard Drive - DDA 1

Loss of hard drive 1

Q:0.00860278

Hard Drive - DDA 2


Q:0.00860278

ansmit Capability for Scen 2 (1

Loss of Ka transmit function after 6 -12 months



Q:0.00384469

Ka card - 12 month


Q:0.00178917

ard Drive Card - DIB - 12 mont


Q:0.000879985

Scenario 1

S/C (6mo) & LOLA (1mo) or Diviner & NACs (6mo)

From Page 5

d Drive Capability for 6-12 mon

Loss of both hard drives after 6 - 12 months

From Page 6

NAC (12 Month) Capability

Loss of NAC (12 Month) Capability

From Page 7

Scenario 3

S/C (12mo) & NACs (6mo) or Diviner & WAC (12mo)

From Page 8

Preliminary Fault Tree Diagram for Minimum Mission Criteria (Scenarios 1 and 3)

Scenario 1

S/C (6mo) & LOLA (1mo) or Diviner & NACs (6mo)


Loss of Spacecraft within 6 months

Q:0.108139

LOLA (1 Month)

Loss of LOLA

Q:0.00585744

NAC/Diviner (6 Month)

Loss of NACs and Diviner

NAC Function (6 Month)

Loss of NACs

a Transmit capability for Scen

Loss of Ka transmit function within 6 months



Q:0.00384469

Ka card - 6 month


Q:0.00178917

ard Drive Card - DIB - 6 mon


Q:0.000879985

ard Drive Capability - 6 mont

Loss of both hard drives

Hard Drive - DDA 1


Q:0.00860278

Hard Drive - DDA 2


Q:0.00860278



SCS Electronics - 6 month

Loss of SCS within 6 months

Q:0.00338942

NACs - 6 Months

Loss of both NACs

NAC 1 (6 Month)

Loss of NAC 1

Q:0.00551563

NAC 2 (6 Month)

Loss of NAC 2

Q:0.00551563

Diviner (6 Month)

Loss of Diviner

Q:0.0188581

To Page 4

d Drive Capability for 6-12 mo

Loss of both hard drives after 6 - 12 months

Hard Drive - DDA 1 (12 mo)


Q:0.00860278

Hard Drive - DDA 2 (12 mo)


Q:0.00860278

To Page 4



SCS Electronics - 6 month

Loss of SCS within 6 months

Q:0.00338942

SCS Electronics -12 month

Loss of SCS after 6 - 12 months

Q:0.00338942

Gate5

Loss of both NACs

NAC 1 (12 Month)

Loss of NAC 1

Q:0.0110008

NAC 2 (12 Month)

Loss of NAC 2

Q:0.0110008

To Page 4

Reliability Predictions/Analysis

• Assumptions and Methodology: The analysis has been done down to the parts level for EEE parts using preliminary parts lists obtained from the designer.– The analysis focuses on the failure distribution and propagation of

each of the components rather the final result coming out from the subsystem reliability.

– The reliability predictions uses Parts Count Method of MIL-HDBK-217F which result in a conservative estimate of subsystem reliability.

– The reliability predictions takes into account only failures that contribute to the total loss of LRO. The FMEA takes into account of all failure modes.

– Mission time is 10220 hours (14 months)– The analysis considers only Space Flight environment.– The time to failure of the parts is exponentially distributed.

Preliminary Failure Modes and Effects Analysis Results

• 159 Failure modes were analyzed• 13 Critical (severity class 2) failure modes (FMs) were identified, with no

compensating provisions.– 6 FMs in the Power Subsystem

• 3 FMs from Output Module A– Loss of output to S-Band Transmitter– Loss of output to propulsion valve actuator– Loss of output to pyro valve open function

• 1 FM from Output Module B– Loss of output to PDE

• 2 FMs from Output Module C– Loss of output to the C&DH – Loss of output to SA & HGA release & deploy mechanisms

– 1 FM in the GNC Subsystem• Loss of Inertial Measurement Unit (IMU)

– 3 FMs in the C&DH Subsystem• 2 FMs from LVPC

– Loss of 5V to MAC, SBC and DIB– Loss of 3.3v to SBC, HK/IO and DIB

• Loss of S-Band Comm. Card– 3 FMs in the Communication Subsystem

• Loss of Telemetry, Tracking, and Control (TT&C) Transponder (Receiver)• Loss of S-Band BRF/Diplexer (Receiving mode)• Loss of Omni 6 dB Coupler (Receiving mode)

Example – Failure Modes and Effects Analysis Worksheet

REFERENCE NUMBER

COMPONENT FUNCTION OPERATIONAL MODE

FAILURE MODE AND

FAILURE MECHANISM

FAILURE EFFECTS SEVERITY CLASS

DETECTIONS AND COMPENSATING

PROVISIONS

REMARKS

6.1.1 Telemetry, Tracking and Control (TT&C) Transponder (Transmitter)

Modulates and amplifies the TT&C data.

Flight Failure Mode: Loss of RF output to the RF Switch. Failure Mechanism: Part failure or connection failure

Local Failure Effect: Transponder failure. Subsystem Level Effect: Loss of S-Band down link function Mission Level Effect: Loss of all housekeeping/status data and low rate science data to the ground. Degradation of mission

3 Detections Data not in S-Band telemetry. Compensating Provisions: High Rate Science data still available

6.1.2 Telemetry, Tracking and Control (TT&C) Transponder (Receiver)

Demodulates command signals/data received from ground and forwards data to the C&DH.

Flight Failure Mode: Loss of output to the C&DH. Failure Mechanism: Part failure or connection failure

Local Failure Effect: Transponder failure. Subsystem Level Effect: Loss of command data to the C&DH. Mission Level Effect: Loss of ability to command spacecraft. Loss of mission.

2 Detections Spacecraft does not respond to commands. Compensating Provisions: None.

Preliminary Fault Tree Diagram

Loss of Spacecraft

Loss of S/C

Q:0

of Deployment Subsys

Loss of Deployable

Q:0

Event36

Loss of Thermal

Q:0

Communincation

Loss of Communication

Q:0

C&DH

oss of C&DH Subsyste

Q:0

Power Subsystem

oss of Power Subsyste

Q:0

GN&C

oss of GN&C Subsyste

Q:0

Propulsion

Loss of Propulsion Subsystem

Q:0

PDE Subsystem

Loss of PDE Subsystem

Q:0

Full Mission, t = 10220 hours (14 months)

Preliminary Fault Tree Analysis Results

• Fault Tree Analysis performed with the “top event” defined as the “Loss of Spacecraft”

• Minimal cut sets were identified– Minimal cut sets are the minimum combinations of failures that would

lead to the undesired “top event”– 341 minimal cut sets

• 48 are single point failure (card level) scenarios - Assumed single string design

• Top 3 reliability drivers (R < 0.99)– Gyro (R = 0.9777)– RAD 750 SBC (R = 0.987843)– PSE Monitor Card (R = 0.98997)

Preliminary Reliability Predictions/Analysis Results

LRO SubsystemSubsystem Reliability Failure Rates Percent of Total

Power 0.94656 5.3739E-06 18.8707%GN&C 0.97415 2.5626E-06 8.9988%C&DH 0.95103 4.9129E-06 17.2519%Propulsion 0.96456 3.5306E-06 12.3981%Communications 0.92928 7.1766E-06 25.2012%PDE 0.98164 1.8132E-06 6.3671%Thermal 0.96874 3.1075E-06 10.9123%

Total Failure Rate = 2.8477E-05 100.00%LRO System Reliability 0.74749

Full Mission, t = 10220 hours (14 months)

Preliminary Reliability Predictions/Analysis Results

Month Hours R

1 730 0.9794262 1460 0.9592763 2190 0.939544 2920 0.920215 3650 0.9012786 4380 0.8827367 5110 0.8645758 5840 0.8467879 6570 0.829366

10 7300 0.81230311 8030 0.79559112 8760 0.77922313 9490 0.76319114 10220 0.7474915 10950 0.73211116 11680 0.71704917 12410 0.70229718 13140 0.68784819 13870 0.67369620 14600 0.65983621 15330 0.64626122 16060 0.63296523 16790 0.61994224 17520 0.607188

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

1 3 5 7 9 11 13 15 17 19 21 23

SMEX Mission History

SMEX MISSION HISTORY

Mission Original Prediction

Min Mission years

Desired Mission Years

Years To Date

Launch Date

Comments

SAMPEX 0.54 1 3 12.01 7/3/1992 Continues to provide scientific data and is also used for to train Flight controllers at Bowie State University

FAST n/a 0.5 1 7.87 8/21/1996 One of 4 wire booms failed to deploy after four years storage and PI's decision not to deploy and repack the booms prior to launch. current status - providing scientific

SWAS 0.5765 1 3 5.59 12/5/1998 Continues to provide full science data TRACE n/a 1 3 6.26 4/2/1998 Continues to provide full science data WIRE n/a 0.33 0.33 5.34 3/4/1999 Instrument design error caused loss of coolant before

mission began. Wire is now used for Astroseismology, as a test bed for ACS and to train Flight controllers at Bowie State University

Total 37.07 Total orbit years without a random spacecraft component failure324,960 Total orbit hours without a random spacecraft component failure

3.077E-06 Failure Rate assuming 1 failure

0.97340 (Ps) Reliability for one year

0.874 (Ps)5 year Reliability

Summary

• R(Spacecraft, Full Mission) = 0.7478• R(Spacecraft and Instruments, Minimum Mission

w/diff. scenerios) = 0.891 • 341 minimal cut sets with 48 single point failures. • 159 failure modes were analyzed with 13 critical

(severity class 2) failure modes (FMs)

Key Milestones/Deliverables - CDR

• Incorporate spacecraft and instruments FMEAs and Reliability Predictions into mission level reliability analyses. Final reports will include full, degraded, and minimum mission. Deliverables are due 30 days prior to CDR.

• Perform simplified PRA incorporating results from above analyses. LRO PRA will identify and quantify major mission risk contributors as undesirable events. Draft PRA is due 60 days prior to CDR. Final report is due 30 days prior to CDR.

Documents

LRO PDR Harness - Massachusetts Institute of Technology · Rick Kinder - Harness 6 Grounding & Shielding • Grounding level 1: – Standard silver coated braid wire QQB575F36S125