LogiComm Control System with Combination Configurationemanuals.nordson.com/adhesives/English_Manuals/1105135.pdf · LogiComm2 Control System with Combination Configuration Part 1105135_01

®LOGICOMMCONTROL SYSTEM

Customer Product ManualPart 1105135_01

Issued 11/11

This document contains important safety information Be sure to read and follow all safety information in this document and any other related documentation.

withCOMBINATION CONFIGURATION

Part 1105135_01 E 2011 Nordson CorporationAll rights reserved

Nordson Corporation welcomes requests for information, comments, and inquiries about its products. General informationabout Nordson can be found on the Internet using the following address: http://www.nordson.com.

Address all correspondence to:

Nordson CorporationAttn: Customer Service11475 Lakefield Drive

Duluth, GA 30097

Notice

This is a Nordson Corporation publication which is protected by copyright. Original copyright date 2011.No part of this document may be photocopied, reproduced, or translated to another language without the prior written

consent of Nordson Corporation. The information contained in this publication is subject to change without notice.

Trademarks

AccuJet, AeroCharge, Apogee, AquaGuard, Asymtek, Automove, Baitgun, Blue Box, Bowtie, CanWorks, Century, CF, CleanSleeve, CleanSpray, ColorMax,Color-on-Demand, Control Coat, Coolwave, Cross-Cut, cScan+, Dage, Dispensejet, DispenseMate, DuraBlue, DuraDrum, Durafiber, DuraPail, Dura-Screen,

Durasystem, Easy Coat, Easymove Plus, Ecodry, Econo-Coat, e.DOT, EFD, Emerald, Encore, ESP, e stylized, ETI - stylized, Excel 2000, Fibrijet, Fillmaster,FlexiCoat, Flex-O-Coat, Flow Sentry, Fluidmove, FoamMelt, FoamMix, Fulfill, GreenUV, HDLV, Heli-flow, Horizon, Hot Shot, iControl, iDry, iFlow, Isocoil,Isocore, Iso-Flo, iTRAX, Kinetix, LEAN CELL, Little Squirt, LogiComm, Magnastatic, March, Maverick, MEG, Meltex, Microcoat, Micromark, Micromedics,

MicroSet, Millennium, Mini Squirt, Mountaingate, Nordson, Optimum, Package of Values, Pattern View, PermaFlo, PicoDot, Porous Coat, PowderGrid,Powderware, Precisecoat, PRIMARC, Printplus, Prism, ProBlue, Prodigy, Pro-Flo, ProLink, Pro-Meter, Pro-Stream, RBX, Rhino, Saturn, Saturn with rings,Scoreguard, Seal Sentry, Select Charge, Select Coat, Select Cure, Signature, Slautterback, Smart-Coat, Solder Plus, Spectrum, Speed-Coat, SureBead,

Sure Coat, Sure-Max, Sure Wrap, Tracking Plus, TRAK, Trends, Tribomatic, TrueBlue, TrueCoat, Ultra, UpTime, u-TAH, Vantage, VersaBlue, Versa-Coat,VersaDrum, VersaPail, Versa-Screen, Versa-Spray, Watermark, and When you expect more. are registered trademarks of Nordson Corporation.

Accubar, Active Nozzle, Advanced Plasma Systems, AeroDeck, AeroWash, AltaBlue, AltaSlot, Alta Spray, Artiste, ATS, Auto-Flo, AutoScan, Axiom,Best Choice, Blue Series, Bravura, CanPro, Champion, Check Mate, ClassicBlue, Classic IX, Clean Coat, Cobalt, Controlled Fiberization, Control Weave,

ContourCoat, CPX, cSelect, Cyclo-Kinetic, DispensLink, Dry Cure, DuraBraid, DuraCoat, DuraPUR, Easy Clean, EasyOn, EasyPW, Eclipse, e.dot+,E-Nordson, Equalizer, Equi?Bead, FillEasy, Fill Sentry, Flow Coat, Fluxplus, Get Green With Blue, G-Net, G-Site, IntelliJet, iON, Iso-Flex, iTrend,

Lacquer Cure, Maxima, Mesa, MicroFin, MicroMax, Mikros, MiniBlue, MiniEdge, Minimeter, Multifill, MultiScan, Myritex, Nano, NexJet, OmniScan, OptiMix,OptiStroke, Partnership+Plus, PatternJet, PatternPro, PCI, Pinnacle, Plasmod, Powder Pilot, Powder Port, Powercure, Process Sentry, Pulse Spray,

PURBlue, PURJet, Ready Coat, RediCoat, Royal Blue, Select Series, Sensomatic, Shaftshield, SheetAire, Smart, Smartfil, SolidBlue, Spectral, SpeedKing,Spray Works, Summit, SureFoam, Sure Mix, SureSeal, Swirl Coat, TAH, ThruWave, Trade Plus, Trilogy, Ultra FoamMix, UltraMax, Ultrasaver, Ultrasmart,

Universal, ValueMate, Versa, Vista, Web Cure, YESTECH, and 2 Rings (Design) are trademarks of Nordson Corporation.

Designations and trademarks stated in this document may be brands that, when used by third parties for their own purposes,could lead to violation of the owners' rights.

Windows is a registered trademark of Microsoft Corporation.

Table of Contents i

Part 1105135_01� 2011 Nordson Corporation

Table of Contents

Safety 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Safety Alert Symbols 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Responsibilities of the Equipment Owner 2. . . . . . . . . . . . . . . . . . . . . . . . . . .

Safety Information 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Instructions, Requirements, and Standards 2. . . . . . . . . . . . . . . . . . . . . .User Qualifications 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Applicable Industry Safety Practices 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Intended Use of the Equipment 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Instructions and Safety Messages 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Installation Practices 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Operating Practices 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Maintenance and Repair Practices 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Equipment Safety Information 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Equipment Shutdown 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .General Safety Warnings and Cautions 7. . . . . . . . . . . . . . . . . . . . . . . . . .Other Safety Precautions 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .First Aid 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Safety Labels and Tags 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Overview 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Main System Components 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Touch‐screen Panel 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Control Module 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Architecture 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Basic System Architecture 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Expanded System Architecture 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Typical System Setup 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Block Diagram 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Control Module Configurations 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bank Configuration Examples 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bank Combinations 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Available System Configurations 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Control Module Components 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Power Supply Board 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Touch‐screen Panel Supply Board 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .System Link Board 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Driver Boards 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Output Connectors 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Engine Board 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Combi System Components 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Component Features 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Additional Information 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Embedded Help 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Service Kit Instruction Sheets 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Online Support 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Touch‐screen Panel Installation Instructions 38. . . . . . . . . . . . . . . . . . . . . .Touch‐screen Panel User's Guide 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Table of Contentsii

Part 1105135_01 � 2011 Nordson Corporation

Installation 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Positioning and Mounting the Control Module 39. . . . . . . . . . . . . . . . . . . . . . .Unpacking the Control Module 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Mounting Guidelines 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Typical Installation Sequence 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Typical Combi System Installation 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Mounting Options 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Bundled Installation 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Distributed Installation Option 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Hybrid Installation Option 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Control Module Dimensions 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Mounting the Control Module 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Touch‐screen Panel Dimensions 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Mount the Touch‐screen Panel 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Cable Connections 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .System Power Connections 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .System Link Connections 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Master I/O Bank Connectors and LEDs 50. . . . . . . . . . . . . . . . . . . . . . . . . .Pattern Controller I/O Bank Connectors and LED 53. . . . . . . . . . . . . . . . .Verification I/O Bank Connectors and LEDs 54. . . . . . . . . . . . . . . . . . . . . .Output Connectors 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ejector Setup Guidelines 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Setup 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Main Menu Screen 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Status Bar 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Message Log 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Help Pages 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Setup Pages 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Setup Page 1 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Setup Page 2 69. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Setup Page 3 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .System Settings Page 4 71. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Setup Tasks 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Setup Encoders 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Setup Save and Restore System Information 74. . . . . . . . . . . . . . . . . . . . .Setup System I/O 77. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Software/Hardware Versions 78. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Assign Device Names 78. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Name Styles 79. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Table of Contents iii


Programming the System 81. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Setup the Wizards 81. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Programming for Pattern Generation 82. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Setup the Gun 82. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Select Number of Beads 83. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Select the Trigger 84. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Program the Pattern 85. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Gun Settings 90. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Pressure Control Setup 95. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Gun Purge Setup 96. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Working with Job Files 98. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Programming for Product Verification 103. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Setup the Sensor 103. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Select the Trigger 105. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Setup the Properties 107. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Select Inspection Parameters 110. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Learn Pattern 113. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Product Verification Analysis Methods 115. . . . . . . . . . . . . . . . . . . . . . . . . .Link Product Verification to Pattern Generation 117. . . . . . . . . . . . . . . . . . . .Monitor Sensors 117. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Job Status 118. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Setup the Ejector 120. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Troubleshooting 122. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Alarm Messages 122. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Fault Messages 124. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .User Generated Event Messages 129. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Warning Messages 130. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts List 141. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Master Modules 141. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Expansion Modules 141. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Data Communication Cables and Accessories 142. . . . . . . . . . . . . . . . . . . . . .Touch‐screen Panel 142. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Accessories 142. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Applicator Cables - Electric Applicators 143. . . . . . . . . . . . . . . . . . . . . . . . . . . .Applicator Cables - Pneumatic Applicators* 143. . . . . . . . . . . . . . . . . . . . . . . .Applicator Cables - Miscellaneous 144. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Encoders 144. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Photocell 144. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I/P Transducer 145. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .GD200 Verification Sensor for Liquid Adhesive 145. . . . . . . . . . . . . . . . . . . . .HD‐100 Hot Melt Verification Sensor (High Speed) 145. . . . . . . . . . . . . . . . . .HD‐70 Hot Melt Verification Sensor (Low Speed) 145. . . . . . . . . . . . . . . . . . . .Reject, Marking & Batch Control Equipment 146. . . . . . . . . . . . . . . . . . . . . . . .UV Sensors 146. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Other Sensors 146. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Barcode Sensors 147. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .GD500 Sensors 147. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Table of Contentsiv


Appendix A A-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .System Specifications A‐1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Conditions A‐1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Non‐Operating Conditions A‐1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Power Supply A‐2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Performance A‐2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connector Pin Layout A‐3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .System Link Connectors A‐3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Power Entry Connector A‐4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Gun Driver Output Connector A‐5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Verification I/O Connectors A‐5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Pattern Controller I/O Connectors A‐6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Master I/O Connectors A‐7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Settings A‐9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Minimum GTO Required A‐9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Maximum Line Speed for Smallest Bead or Gap A‐10. . . . . . . . . . . . . . . . . .

System I/O Information A‐11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Programmable Inputs A‐11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Programmable Outputs A‐12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Appendix B B-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Software Upgrade Procedure B‐1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Requirements B‐1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Upgrade Setup B‐1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Installing the Software B‐2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Upgrade Process B‐4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

LogiComm� Control System with Combination Configuration 1


LogiComm� Control System with Combination Configuration

Safety Read this section before using the equipment. This section containsrecommendations and practices applicable to the safe installation, operation,and maintenance (hereafter referred to as “use”) of the product described inthis document (hereafter referred to as “equipment”). Additional safetyinformation, in the form of task‐specific safety alert messages, appears asappropriate throughout this document.

WARNING! Failure to follow the safety messages, recommendations, andhazard avoidance procedures provided in this document can result inpersonal injury, including death, or damage to equipment or property.

Safety Alert Symbols

The following safety alert symbol and signal words are used throughout thisdocument to alert the reader to personal safety hazards or to identifyconditions that may result in damage to equipment or property. Comply withall safety information that follows the signal word.

WARNING! Indicates a potentially hazardous situation that, if not avoided,can result in serious personal injury, including death.

CAUTION! Indicates a potentially hazardous situation that, if not avoided,can result in minor or moderate personal injury.

CAUTION! (Used without the safety alert symbol) Indicates a potentiallyhazardous situation that, if not avoided, can result in damage to equipment orproperty.

LogiComm� Control System with Combination Configuration2


Responsibilities of the Equipment Owner

Equipment owners are responsible for managing safety information, ensuringthat all instructions and regulatory requirements for use of the equipment aremet, and for qualifying all potential users.

Safety Information � Research and evaluate safety information from all applicable sources,

including the owner‐specific safety policy, best industry practices,governing regulations, material manufacturer's product information, andthis document.

� Make safety information available to equipment users in accordance with

governing regulations. Contact the authority having jurisdiction forinformation.

� Maintain safety information, including the safety labels affixed to the

equipment, in readable condition.

Instructions, Requirements, and Standards � Ensure that the equipment is used in accordance with the information

provided in this document, governing codes and regulations, and bestindustry practices.

� If applicable, receive approval from your facility's engineering or safety

department, or other similar function within your organization, beforeinstalling or operating the equipment for the first time.

� Provide appropriate emergency and first aid equipment.

� Conduct safety inspections to ensure required practices are being

followed.

� Re‐evaluate safety practices and procedures whenever changes are

made to the process or equipment.



User Qualifications

Equipment owners are responsible for ensuring that users:

� receive safety training appropriate to their job function as directed by

governing regulations and best industry practices

� are familiar with the equipment owner's safety and accident

prevention policies and procedures

� receive, equipment‐ and task‐specific training from another qualified

individual

NOTE: Nordson can provide equipment‐specific installation,operation, and maintenance training. Contact your Nordsonrepresentative for information

� possess industry‐ and trade‐specific skills and a level of experience

appropriate to their job function

� are physically capable of performing their job function and are not

under the influence of any substance that degrades their mentalcapacity or physical capabilities

Applicable Industry Safety Practices

The following safety practices apply to the use of the equipment in themanner described in this document. The information provided here is notmeant to include all possible safety practices, but represents the best safetypractices for equipment of similar hazard potential used in similar industries.

Intended Use of the Equipment � Use the equipment only for the purposes described and within the limits

specified in this document.

� Do not modify the equipment.

� Do not use incompatible materials or unapproved auxiliary devices.

Contact your Nordson representative if you have any questions onmaterial compatibility or the use of non‐standard auxiliary devices.



Instructions and Safety Messages � Read and follow the instructions provided in this document and other

referenced documents.

� Familiarize yourself with the location and meaning of the safety warning

labels and tags affixed to the equipment. Refer to Safety Labels and Tagsat the end of this section.

� If you are unsure of how to use the equipment, contact your Nordson

representative for assistance.

Installation Practices � Install the equipment in accordance with the instructions provided in this

document and in the documentation provided with auxiliary devices.

� Ensure that the equipment is rated for the environment in which it will be

used. This equipment has not been certified for compliance with theATEX directive nor as nonincendive and should not be installed inpotentially explosive environments.

� Ensure that the processing characteristics of the material will not create a

hazardous environment. Refer to the Material Safety Data Sheet (MSDS)for the material.

� If the required installation configuration does not match the installation

instructions, contact your Nordson representative for assistance.

� Position the equipment for safe operation. Observe the requirements for

clearance between the equipment and other objects.

� Install lockable power disconnects to isolate the equipment and all

independently powered auxiliary devices from their power sources.

� Properly ground all equipment. Contact your local building code

enforcement agency for specific requirements.

� Ensure that fuses of the correct type and rating are installed in fused

equipment.

� Contact the authority having jurisdiction to determine the requirement for

installation permits or inspections.

Operating Practices � Familiarize yourself with the location and operation of all safety devices

and indicators.

� Confirm that the equipment, including all safety devices (guards,

interlocks, etc.), is in good working order and that the requiredenvironmental conditions exist.

� Use the personal protective equipment (PPE) specified for each task.

Refer to Equipment Safety Information or the material manufacturer'sinstructions and MSDS for PPE requirements.

� Do not use equipment that is malfunctioning or shows signs of a potential

malfunction.



Maintenance and Repair Practices � Allow only personnel with appropriate training and experience to operate

or service the equipment.

� Perform scheduled maintenance activities at the intervals described in

this document.

� Relieve system hydraulic and pneumatic pressure before servicing the

equipment.

� De‐energize the equipment and all auxiliary devices before servicing the

equipment.

� Use only new Nordson‐authorized refurbished or replacement parts.

� Read and comply with the manufacturer's instructions and the MSDS

supplied with equipment cleaning compounds.

NOTE: MSDSs for cleaning compounds that are sold by Nordson areavailable at www.nordson.com or by calling your Nordson representative.

� Confirm the correct operation of all safety devices before placing the

equipment back into operation.

� Dispose of waste cleaning compounds and residual process materials

according to governing regulations. Refer to the applicable MSDS orcontact the authority having jurisdiction for information.

� Keep equipment safety warning labels clean. Replace worn or damaged

labels.

Equipment Safety Information

This equipment safety information is applicable to the following types ofNordson equipment:

� hot melt and cold adhesive application equipment and all related

accessories

� pattern controllers, timers, detection and verification systems, and all

other optional process control devices



Equipment Shutdown

To safely complete many of the procedures described in this document, theequipment must first be shut down. The level of shut down required varies bythe type of equipment in use and the procedure being completed. If required, shut down instructions are specified at the start of the procedure.The levels of shut down are:

Relieving System Hydraulic Pressure

Completely relieve system hydraulic pressure before breaking any hydraulicconnection or seal. Refer to the melter‐specific product manual forinstructions on relieving system hydraulic pressure.

De‐energizing the System

Isolate the system (melter, hoses, applicators, and optional devices) from allpower sources before accessing any unprotected high‐voltage wiring orconnection point.

1. Turn off the equipment and all auxiliary devices connected to theequipment (system).

2. To prevent the equipment from being accidentally energized, lock andtag the disconnect switch(es) or circuit breaker(s) that provide inputelectrical power to the equipment and optional devices.

NOTE: Government regulations and industry standards dictate specificrequirements for the isolation of hazardous energy sources. Refer to theappropriate regulation or standard.

Disabling the Applicators

NOTE: Adhesive dispensing applicators are referred to as “guns” in someprevious publications.

All electrical or mechanical devices that provide an activation signal to theapplicators, applicator solenoid valve(s), or the melter pump must bedisabled before work can be performed on or around an applicator that isconnected to a pressurized system.

1. Turn off or disconnect the applicator triggering device (pattern controller,timer, PLC, etc.).

2. Disconnect the input signal wiring to the applicator solenoid valve(s).

3. Reduce the air pressure to the applicator solenoid valve(s) to zero; thenrelieve the residual air pressure between the regulator and the applicator.



General Safety Warnings and Cautions

Table 1 contains the general safety warnings and cautions that apply toNordson hot melt and cold adhesive equipment. Review the table andcarefully read all of the warnings or cautions that apply to the type ofequipment described in this manual.

Equipment types are designated in Table 1 as follows:

HM = Hot melt (melters, hoses, applicators, etc.)

PC = Process control

CA = Cold adhesive (dispensing pumps, pressurized container, andapplicators)

Table 1 General Safety Warnings and Cautions

EquipmentType Warning or Caution

HM

WARNING! Hazardous vapors! Before processing any polyurethanereactive (PUR) hot melt or solvent‐based material through a compatibleNordson melter, read and comply with the material's MSDS. Ensurethat the material's processing temperature and flashpoints will not beexceeded and that all requirements for safe handling, ventilation, firstaid, and personal protective equipment are met. Failure to comply withMSDS requirements can cause personal injury, including death.

HM

WARNING! Reactive material! Never clean any aluminum componentor flush Nordson equipment with halogenated hydrocarbon fluids.Nordson melters and applicators contain aluminum components thatmay react violently with halogenated hydrocarbons. The use ofhalogenated hydrocarbon compounds in Nordson equipment cancause personal injury, including death.

HM, CAWARNING! System pressurized! Relieve system hydraulic pressurebefore breaking any hydraulic connection or seal. Failure to relieve thesystem hydraulic pressure can result in the uncontrolled release of hotmelt or cold adhesive, causing personal injury.

Continued...



General Safety Warnings and Cautions (contd)

Table 1 General Safety Warnings and Cautions (contd)

EquipmentType Warning or Caution

HM

WARNING! Molten material! Wear eye or face protection, clothing thatprotects exposed skin, and heat‐protective gloves when servicingequipment that contains molten hot melt. Even when solidified, hot meltcan still cause burns. Failure to wear appropriate personal protectiveequipment can result in personal injury.

HM, PC

WARNING! Equipment starts automatically! Remote triggering devicesare used to control automatic hot melt applicators. Before working onor near an operating applicator, disable the applicator's triggeringdevice and remove the air supply to the applicator's solenoid valve(s).Failure to disable the applicator's triggering device and remove thesupply of air to the solenoid valve(s) can result in personal injury.

HM, CA, PC

WARNING! Risk of electrocution! Even when switched off andelectrically isolated at the disconnect switch or circuit breaker, theequipment may still be connected to energized auxiliary devices.De‐energize and electrically isolate all auxiliary devices beforeservicing the equipment. Failure to properly isolate electrical power toauxiliary equipment before servicing the equipment can result inpersonal injury, including death.

HM, CA, PC

WARNING! Risk of fire or explosion! Nordson adhesive equipment isnot rated for use in explosive environments and has not been certifiedfor the ATEX directive or as nonincendive. In addition, this equipmentshould not be used with solvent‐based adhesives that can create anexplosive atmosphere when processed. Refer to the MSDS for theadhesive to determine its processing characteristics and limitations.The use of incompatible solvent‐based adhesives or the improperprocessing of solvent‐based adhesives can result in personal injury,including death.

HM, CA, PC

WARNING! Allow only personnel with appropriate training andexperience to operate or service the equipment. The use of untrainedor inexperienced personnel to operate or service the equipment canresult in injury, including death, to themselves and others and candamage to the equipment.



Warning or CautionEquipment

Type

HM

CAUTION! Hot surfaces! Avoid contact with the hot metal surfaces ofapplicators, hoses, and certain components of the melter. If contactcan not be avoided, wear heat‐protective gloves and clothing whenworking around heated equipment. Failure to avoid contact with hotmetal surfaces can result in personal injury.

HM

CAUTION! Some Nordson melters are specifically designed toprocess polyurethane reactive (PUR) hot melt. Attempting to processPUR in equipment not specifically designed for this purpose candamage the equipment and cause premature reaction of the hot melt. Ifyou are unsure of the equipment's ability to process PUR, contact yourNordson representative for assistance.

HM, CA

CAUTION! Before using any cleaning or flushing compound on or inthe equipment, read and comply with the manufacturer's instructionsand the MSDS supplied with the compound. Some cleaningcompounds can react unpredictably with hot melt or cold adhesive,resulting in damage to the equipment.

HM

CAUTION! Nordson hot melt equipment is factory tested with NordsonType R fluid that contains polyester adipate plasticizer. Certain hot meltmaterials can react with Type R fluid and form a solid gum that canclog the equipment. Before using the equipment, confirm that the hotmelt is compatible with Type R fluid.



Other Safety Precautions � Do not use an open flame to heat hot melt system components.

� Check high pressure hoses daily for signs of excessive wear, damage, or

leaks.

� Never point a dispensing handgun at yourself or others.

� Suspend dispensing handguns by their proper suspension point.

First Aid

If molten hot melt comes in contact with your skin:

1. Do NOT attempt to remove the molten hot melt from your skin.

2. Immediately soak the affected area in clean, cold water until the hot melthas cooled.

3. Do NOT attempt to remove the solidified hot melt from your skin.

4. In case of severe burns, treat for shock.

5. Seek expert medical attention immediately. Give the MSDS for the hotmelt to the medical personnel providing treatment.



Safety Labels and Tags

Figure 1 illustrates the location of the product safety labels affixed to theequipment. Table 2 provides an illustration of the hazard identificationsymbols that appear on each safety label and tag, the meaning of thesymbol, or the exact wording of any safety message.

1 2

Figure 1 Location of safety labels

1. Power entry panel 2. Driver output connector

Table 2 Safety label

Item Part Description

1. N/A WARNING: Risk of electrical shock. Failure to observe may result inpersonal injury, death, or equipment damage.



System Overview The LogiComm Control System is an integrated system solution. The controlsystem has the flexibility of containing several functionalities that can beused by itself or in different combinations. The functionalities include:

� Pattern generation

� Product verification

� Combination (also known as combi) system that contains both pattern

generation and product verification functionalities

This manual describes the installation, set up, and operation of the controlsystem with combi functionalities.

The combi control system uses:

� the pattern generation functionality of producing signals to dispense

adhesive accurately on the production line. The system monitors theproduction line position through the encoder and detects the producttraveling down the production line using a trigger (photosensor). Itthen activates the applicators which dispense the programmedpattern.

and

� the product verification functionality for monitoring adhesive patterns

in variable speed applications. Defective products are tracked andejected or marked for later ejection.



Main System Components

The combi system consists primarily of a control module and a touch‐screenpanel.

2

1

Figure 1 A single control module connected to a single touch‐screen panel

1. Control module 2. Touch‐screen panel



Touch‐screen Panel

The touch‐screen panel is a PC that runs on the Windows CE platform. It isthe interface for setting up and monitoring the control system. All real‐timefunctions, such as pattern generation and product verification are performedby the control module through the touch‐screen panel.

1 2 3 45 6 7

8

910

10

1112

Figure 2 Touch‐screen panel components

1. VGA

2. COM (RS‐232)

3. COM (RS‐232/422/485)

4. PS/2

5. USB

6. LAN (10/100/1000)

7. LPT

8. Audio

9. PCMCIA

10. Compact Flash card slot

11. Power switch

12. Speaker



Control Module

The control module is the core of the system where real‐time systemprocessing takes place. It works in conjunction with the touch‐screen panelfor system setup and monitoring.

A combi control module is configured with both pattern generation andproduct verification components. For configuration details refer to ControlModule Configurations given later.

The control modules are factory‐configured to suit customer specifications.

1

2

3

Figure 3 Combi control module

1. Master Input/Output (I/O) bank

2. I/O bank A

3. I/O bank B



System Architecture

The control system can consist of single or multiple control modules andtouch‐screen panels.

Basic System Architecture

A basic system architecture consists of a single touch‐screen panel that isconnected directly to a single control module through a cross‐over Ethernetcable.

1

2

3

4

Figure 4 Basic system setup

1. Touch‐screen panel

2. Cross‐over Ethernet cable

3. Control module

4. Touch‐screen panel power cable



Expanded System Architecture

An expanded system may consist of up to eight (8) control modules and up tothree (3) touch‐screen panels.

In an expanded system, the communication is accomplished through theEthernet network port on the expansion banks. Multiple control modules areconnected via standard or cross-over Ethernet cables and a System Linkconnection. This enables real‐time signals for encoders, triggers, andejection signals.

The master control module tracks the programs for the entire system, andupdates the expansion control modules with the correct settings for thespecific control module. The master control module also manages thetracking and ejection of bad product, therefore the master control modulemust have at least one verification I/O bank whenever the system requiresproduct verification.

1

1

2 12

3

1

Figure 5 Expanded system setup

A. Master control module(One per system)

B. Expansion modules(Up to seven [7])

C. Multiple touch‐screens(Up to three [3])

1. Ethernet cable 2. System link cable 3. Touch‐screen panel power cable



Typical System Setup

See Figure 6 for a typical setup of the control system with its components ona carton folder adhesive machine.

1

2

34

57

8

9

1011

12

13

Figure 6 Components on a carton folder adhesive machine

1. Catch basket

2. Ejector

3. Pusher

4. Warning light

5. Trigger

6. Cello detector

7. Double sheet detector

8. Feed sensor

9. Bar code scanner

10. Sensor


12. Control module

13. Carton folder adhesive machine



Block Diagram

The system architecture of the control system is functionally divided intoseveral major building blocks. This modular system design enables thecreation of multiple platforms of controllers by using various combinations ofthe following major components:

� Control module

� Touch‐screen panel

� Pattern and verification engine

� Power supply

� Universal gun driver and 24 VDC voltage driver

� I/O banks

Pattern Generation

Accelerator FPGA boards

Control Module

Touch-screen PanelUser Interface

Input/OutputBanks Power Supply

Gun Driversor

Machine ControlBanks

OutputConnector

Banks

Product Verification

Accelerator FPGA boards

and

Figure 7 System block diagram for a combi configuration



Control Module Configurations

The control module uses three interchangeable boards, this concept isknown as the bank system. In the bank system, the different I/O banks mustbe installed in matched sets. Refer to Bank Combinations in this section.

The bank slots are designated on the inside left section of the control modulefascia:

‐ M = Master I/O bank

‐ A = I/O bank A

‐ B = I/O bank B

The I/O banks isolate and buffer signals that interface with the controlmodule. Depending on the application requirements, the I/O banks can usedin different combinations to configure the control system for patterngeneration, product verification, or combi. See the following table:

Table 3 I/O bank combinations used for specific control module configurations

For the following systemfunctionality:

Use the I/O banks in the following combinations:

Pattern generationOne master I/O bank, up to two pattern generationI/O banks, and driver options.

VerificationOne master I/O bank and up to two verification I/O banks.

CombinationOne master I/O bank, one pattern generation I/O bank, one verification I/O bank, and outputconnectors and/or machine control outputs.

Multi module systemOne master control module and up to seven (7)expansion control modules.

NOTE: Upgrade kits are available to reconfigure the control modules. Referto Parts for the appropriate part numbers.



Bank Configuration Examples

The following figures give examples of different control moduleconfigurations.

1. Bank Configuration in a master control module:

1

2

3

Figure 8 Combi module

1. Master I/O bank (or M)

2. I/O bank A (pattern generation)

3. I/O bank B (product verification)

2. Bank Configuration in an expansion control module:

1

2

3

Figure 9 Expansion module

1. Ethernet expansion bank

2. I/O bank A (pattern generation)

3. I/O bank B (product verification)



Bank Combinations

The banks must be installed in matched sets for full system functionality:

� I/O bank A must correspond with accelerator FPGA board A,

driver board A, and output connector A.

and

� I/O bank B must correspond with accelerator FPGA board B,

driver board B, and output connector B.

A

B

A

B

A B

3 4

1 2

BA

Figure 10 I/O bank configuration in control module

1. I/O banks A and B:

A: Pattern generationB: Product verification

2. Accelerator FPGAboards:A: Pattern generationB: Product verification

3. Driver boards:

A: Universal gun driverB: Low voltage driver

4. Output connectors:

A: Output connectorB: Machine controloutput



Available System Configurations



Control Module Components

The specific components installed in the control module enable theprocessing for both pattern generation and product verification.

4

56

7

8

9

12

3

10

11

12

Figure 11 Control module components

1. Power supply board

2. Touch‐screen panel power supplyboard

3. Driver boards

4. Power panel

5. Output connectors

6. Accelerator FPGA board B

7. Accelerator FPGA board A

8. Engine board

9. System link board

10. I/O bank B

11. I/O bank A

12. Master I/O bank



Power Supply Board

The power supply board contains multiple low voltage power supplies andthe logic circuitry required to interface with the gun drivers, most of which iscontained in a large field programmable gate array (FPGA) device.

1

2

3

456 6

7

8

Figure 12 Power board components

1. Touch‐screen panel power supplyboard

2. Engine power cable

3. Fuses

4. Input power terminal block

5. Driver LEDs

6. Driver (driver installed)

7. Power supply ribbon cable

8. Panel supply cable



Touch‐screen Panel Supply Board

This plug‐in board provides 24 VDC power to the touch‐screen panel. Thisboard can also be used to power an external Ethernet switch.

1

41 1

2

3

Figure 13 Touch‐screen panel power supply board components

1. Mounting screws

2. 8‐pin header connector

3. 24 VDC output connector

4. Status LEDs

32

1



System Link Board

The system link board supplies high speed system signals from the mastercontrol module to the expansion control modules. Due to their realtimenature, these are signals that cannot travel over the network. The system linksignals include:

� Up to 8 global triggers

� Two encoders

� Ejector

Figure 14 System link board

1. Ethernet connection

2. Control module number display

3. System link connectors (input and output)

The system link board automatically generates the control module numberbased on the connection sequence. Control module number 1 is always themaster control module. Expansion control modules are numbers 2 through 8,in order of connection via the daisychained system link cables.

Figure 15 System link boards connected via daisychained system link cables

1. Control module number

System Network Communications

The control system uses an Ethernet communications network between thetouchscreen panel(s) and the control module(s). If the control systemincludes expansion control modules, the Ethernet cabling requirements maydiffer. Refer to Figures 4 and 5 under System Architecture.

The control system uses the standard CAT5 Ethernet cables. Single modulesystems use the crossover type Ethernet cable. In multimodule systemsthat have the builtin Ethernet expansion I/O bank, either standard orcrossover type cables are used.



System Network Communications (contd)

Each touchscreen panel in the multiscreen system operates independentlyfrom the other touchscreen panels.

Ethernet Expansion I/O Bank

Ethernet network uses two communication methods:

� UDP (User Data gram Protocol) for fast, realtime, oneway

transmission of monitoring data:

‐ Product counters

‐ Line speed

‐ Clock

‐ Status LEDs

� TCP (Transmission Control Protocol) for slower, critical twoway

system settings and information:

‐ Pattern generation settings

‐ Verification settings

‐ System settings

1

2

3

Figure 16 Ethernet expansion bank

1. Ethernet network ports and LEDs 2. System status LEDs 3. Serial port



Driver Boards

The power supply board has the capability of containing two driver boards.The following types of driver boards are available with the control system.

Universal Gun Driver

The universal gun driver configuration consists of a universal driver boardand a standard output connector panel. This configuration is used whendriving valves directly from the system. The universal gun driver providesoptimum valve performance and allows operation at the maximum speed.The applicator type for each output is selected through the touch‐screenpanel, or the output waveform can be programmed manually.

This is a non‐isolated, high‐voltage, and current‐controlled output that shouldonly be connected to a properly grounded device.

1

2

4

3

5

b

ac

Figure 17 Universal gun driver board

1. Plug‐in sockets

2. High voltage symbol

3. Driver output

4. Diagnostic LEDs

5. Output waveforma) Pattern signalb) Output currentc) Time



Low Voltage Driver`

The low voltage 24 VDC driver board is similar to the universal gun driver.The only difference is that the output waveform is a switched 24 VDC signalinstead of a high‐voltage spiking current‐controlled waveform.

1

2

3

4

5

6

b

a

c

7

Figure 18 Low voltage 24 VDC driver board

1. Plug‐in sockets

2. Logic output connector

3. Gun connector

4. Driver output LEDs

5. Diagnostic LEDs

6. Daisy‐chain power cable

7. 24 VDC output waveforma) Pattern signalb) Output voltagec) Time



Output Connectors

For combi modules, the output connectors differ between master andexpansion combi modules.

In a master combi module, output connector associated with bank A has afour output connector, corresponding to the four pattern control channels.Depending on the configuration specified, the machine control outputconnector will either have the four standard output connectors or the logicpanel.

1 2

3

Figure 19 Output connectors used in a combi configuration

1. Master combi module withstandard machine control output

2. *Master combi module with Logicinterface verification master

3. Combi expansion module

NOTE: *Expansion combi modules contain only output connectors for the four pattern generation channels.



Engine Board

The engine board contains the microprocessor that controls all the real-timeprocessing performed by the control system.

12

1

3

1

4

5

6

7

8

9

10

Figure 20 Engine board components

1. I/O bank socket

2. System link ribbon cable

3. Power supply cable

4. Power supply ribbon cable

5. Anybus socket

6. Compact flash card

7. Ethernet port

8. Diagnostics LED

9. Accelerator board socket B

10. Accelerator board socket A



Engine Board Components

5 4

1

3

2

Figure 21 Engine board components

1. Product verification FPGA board

2. Pattern generation FPGA board

3. Engine board

4. Accelerator FPGA board B for I/Obank B

5. Accelerator FPGA board A for I/Obank A



Combi System Components

In addition to the control module and the touch‐screen panel the combisystems comprise of the following components:

1

3

2

6

a

c

b

5

a

b

4

ba

Figure 22 Key Combi system components

1. Encoder (4) on the master I/O bank

2. Sensor (GD‐200 shown here)

3. Smart sensorsa) CBC5100 b) BC5100c) GD‐500

4. Expansion output connectora) Pusher b) Ejector

5. Applicators:a) Electric b) Pneumatic

6. Trigger connections on I/O banksA and B (LA650 shown here)



Component Features

See Figure 22.

Trigger

� Up to eight (8) assignable triggers can be connected per control module.

� Any trigger can be assigned to any applicator.

� A single trigger can be assigned to multiple applicators.

� A global master trigger is available on the connected control modules.

� Up to eight (8) trigger signals can be sent from the master control module

to the expansion control modules via the System Link connections.

� Trigger masking prevents false triggers.

� Product length is measured and displayed onscreen in realtime (visual

pattern programming).

� All input triggers are PNP/NPN type and are compatible with all legacy

and industry standard photoeyes.

� Overlength, underlength, and blocked photocell diagnostic features.

Run‐up output

Connects to a 0-10 V and 4-20 mA pressure transducer.

Remote Purge Input

Remote purge can be accomplished with the standard eight‐input wiredremote, or with a four channel wireless remote.

For detailed setup instructions refer to Wireless Remote Purge Kit - 8 Channel Instruction Sheet, available at www.emanuals.nordson.com.

Encoder

� Supports two encoders (assignable per channel) for multiplespeed

machines.

� Two types of encoders are available for the control system:

‐ quadrature encoders (RS422)

‐ single phase encoders (NPN)



Component Features (contd)

See Figure 22.

Pneumatic or Electric Applicators

� Support four or eight channel outputs.

� The output connectors can drive virtually any applicator:

‐ Pneumatic, electric, hot melt, or liquid adhesive

� Universal gun driver:

‐ Different types of applicators can be used on different channels

‐ Multiple solenoid coils can be used on one channel

� Low voltage 24 VDC driver.

� Applicator parameters automatically set by applicator selection.

� Only one ejector bank per system and it must be on the master control

module (master control module must have at least one verification bankfor ejector).

� Expansion control modules do not have driver banks.

� Logic machine control bank is used for connecting to the Bobst Cube.

Sensors

There are six sensor inputs that analyze the product's surface for thepresence or absence of adhesive. The sensor interface includes:

� One digital input for detection.

� One output for calibration.

Smart Sensors

There is one smart sensor per bank, see 3 in Figure 22.

� Smart sensors perform the verification analysis and report the results to

the control module.

� Product failure can be for one of eight possible causes (decoded 3 bits).

� Smart sensors have an onboard microprocessor and communicate with

the Engine board via a serial port cable.

� Smart sensor setup is done on the touch‐screen panel.

� More complex results (images, etc.) can be displayed on the

touch‐screen panel.



Ejectors

Ejectors are used to eliminate defective products from the line at fullproduction speed. There are three basic types of ejectors:

� Rotary

In the rotary type ejector, the spinning disc and wheel grabs and tossesthe product out from the production flow.

� Dump Gate

The dump gate type ejector diverts the product up or down out of theproduction flow.

� Linear

The linear type ejector is similar to the rotary type, however it ejects theproduct from the production flow in a linear direction.

Other Types of Ejectors

� Spray marking system:

‐ Sprays ink or water

‐ Identifies products for manual culling

‐ Connects to the ejector output

‐ Creates a pattern on the defective products with delay/duration

� Pusher/Kicker:

‐ Pushes defective products out for visual identification

‐ Products are manually discarded

‐ Connects to the ejector output



Additional Information

The following additional resources provide information for getting the mostout of your system components.

Embedded Help

The screen‐level help is integrated into the touch‐screen panel userinterface.

Service Kit Instruction Sheets

There are several component‐specific service kit instruction sheets thatprovide installation information.

Online Support

Visit www.enordson.com/support to download updates and software utilities.

Touch‐screen Panel Installation Instructions

The touch‐screen panel installation instructions provide basic installation andparts information.

Touch‐screen Panel User's Guide

The touch‐screen panel user's guide provides common pattern generationtasks, bead verification tasks, and pressure control setup tasks.



Installation

WARNING! Allow only personnel with appropriate training and experience tooperate or service the equipment. The use of untrained or inexperiencedpersonnel to operate or service the equipment can result in injury, includingdeath, to themselves and others, and damage to the equipment.

Positioning and Mounting the Control Module

Equipment and production line configuration may dictate a variation in themounting options described in this section. Regardless of the mountingmethod used, refer to Mounting Guidelines.

Unpacking the Control Module 1. Carefully unpack the control module. Exercise care to prevent equipment

damage during unpacking.

2. Inspect for any damage that may have occurred during shipping. Reportany damage to your Nordson representative.

Mounting Guidelines � Position the control module as close as possible to the parent machine or

production line.

� Mount the control module vertically on the wall or post to provide

maximum cooling by convection across the heatsink fins.

� Ensure that the mounting location provides sufficient clearance around

the sides, the base, and rear of the control module for easy access to theconnectors.

NOTE: For unhindered air flow, the recommended minimum clearanceat the top and base of the control module is 50 mm (1.96 in.).

� Mount the control module on a rigid support (e.g. wall or post) to prevent

external vibration.



Typical Installation Sequence

Follow this sequence to install the different components that make up thecontrol system:

1. Control modules.

2. Touch‐screen panel.

3. Light tower (optional).

4. Encoder(s).

5. Mount the applicators and related photocells.

6. Mount the sensors and related photocells.

7. Mount the ejector/batch kicker/marker.

8. Connect to the parent machine.

NOTE: The words gun and applicator are used interchangeably in thissection.



Typical Combi System Installation

J2J1

1

2

3

4

5

6

7

8

9

10

11

12

Figure 23 An installed combi control system

1. Light tower

2. I/O relay


4. Remote purge

5. Standard sensor

6. Smart sensor

7. Pusher

8. Ejector

9. Electric gun

10. Pressure transducer

11. Trigger

12. Encoder



Mounting Options

Several mounting options are available for the control system.

Bundled Installation

In a bundled installation all the components are mounted together either on acart or in an IP rated control enclosure.

A

B

Figure 24 Bundled installation

A. Adhesive System Console (ASC) for modular systemconfiguration

B. IP54 integrated cabinet



Distributed Installation Option

In a distributed installation all the components are mounted close to theparent machine or production line for easy operator access.

Figure 25 Distributed installation

Hybrid Installation Option

The hybrid installation is setup to facilitate OEM machine mounting.

Figure 26 Hybrid installation



Control Module Dimensions

Use the following dimensions to mount the control module.

163 mm

(6.42 in.)

362 mm

(12.87 in.)

290.57 mm

(11.44 in.)

310.64 mm(12.23 in.)

281.17 mm

(11.07 in.)

4 x 9.65 mm

(0.38 in.)

Figure 27 Control module dimensions



Mounting the Control Module 1. Drill four holes on the wall or post. For dimensions see Figure 27.

2. Insert two screws in the lower hole mounting position. Tighten the screwsenough to support the weight of the control module.

3. Position the control module so that the control module mounting slots sitsecurely on the two lower screws.

1

2

3

Figure 28 Mounting the control module

1. Socket head screws

2. Mounting holes

3. Mounting slots

4. Thread the top screws through the mounting holes on the control moduleinto the upper hole positions.

5. Tighten all the four screws firmly.

6. Go to Touch‐screen Panel Dimensions.



Touch‐screen Panel Dimensions

Use the following dimensions to position or mount the touch‐screen panel.

373 mm (14.6 in.)

29

7 m

m (

11

.69

in.)

383 mm (15.08 in.)

64.5 mm

(2.54 in.)4.5 mm

(0.17 in.)307 mm (12,09 in.)

23

0.1

30

7

Figure 29 Touch‐screen panel dimensions

Mount the Touch‐screen Panel 1. Position the touch‐screen panel for easy operator access.

2. The mounting location should provide sufficient clearance around thesides and the connector location.

3. Mount the touch‐screen panel using the instructions provided with thewall mount bracket kit (P/N 1057332) or the desktop stand kit (P/N 1059653).

NOTE: Use the industry standard VESA (Video Electronics StandardsAssociation) mounting bracket.

4. Go to Cable Connections.



Cable Connections

All connections to the control module are externally connected using thequick‐connect plugs. Refer to the Parts section for a list of recommendedcables.

System Power Connections

32

1

Figure 30 Power connectors

WARNING! Equipment must be properly grounded and fused according toits rated current consumption (see ID plate). Failure to follow the safetyprocedures can result in serious injury.

Connector Type Connecting Device

1. 24 VDC input totouch‐screen panel

3‐pin terminal blockConnects to the control module's 24 VDCoutput.

2. Power input socket withswitch

IEC 60320 C13, 3‐pin connector(100V-240V, 48-62 Hz, 3A[maximum])

Connects to a grounded wall outlet to turn thesystem On or Off.

3. 24 VDC touch‐screenpanel power connector

3‐pin terminal blockConnects to the touch‐screen panel or forpowering the hub.

A 24V power supply is available to power the panel when there are moretouch‐screen panels than control modules in the system.



System Link Connections

This section describes the cable connections in a single module setup and ina multi module setup. For additional details, refer to System Architectureunder System Overview.

Single Module Connection

1

2

3

4

Figure 31 System link connections for basic system setup


1.Single touch‐screenpanel

2. Ethernet port RJ45Connects an Ethernet cross‐over cable from asingle touch‐screen panel to a single mastercontrol module.

3. Control module numberLED

LED display

Displays a unique system‐generatedidentification number that is automaticallyassigned to each control module andtouch‐screen panel in the order in which they areconnected.

4. Master control module



Multi Module Connections

73

64

5

2

1

3 4

Figure 32 System link connections for expanded system setup


1.Multiple touch‐screen panels

2. Master control module

3. Ethernet port RJ45

Connects the Ethernet cable from theEthernet network port on the master controlmodule to the Ethernet port on the expansionbank of the expansion control module.

4. Control module number LED LED display

Displays a unique system‐generatedidentification number that is automaticallyassigned to each control module andtouch‐screen panel in the order in which theyare connected.

NOTE: In expanded systems the mastercontrol module is number one (1), and theexpansion control modules are assignednumbers from two (2) through eight (8).

5. System link output 25‐pin female connectorConnects to system link input connection onthe expansion control module.

6. System link input 25‐pin, male connectorConnects to system link output connection onthe previous control module.

7. Expansion control module



Master I/O Bank Connectors and LEDs

OR

Figure 33 Master I/O bank



Master I/O Bank Connectors


1. Encoder repeater 4‐pin male connectorConnects typically to a customer machine thatrequires encoder signals.

2. Encoder input (2) 12‐pin female connector (2)

Connects to an encoder with 0.1-30 pulses/mm, to track the line position ofproducts as they move through the machine.

Two types of encoders are available for thecontrol system:

� quadrature encoders (RS422)

� single phase encoders (NPN)

3. Light tower with alarm 7‐pin female connector

Connects to a light tower and/or alarm horn.

The four light tower colors indicate the followingconditions:

� Red steady: Fault

Red flashing:Warning

� Yellow steady: Product fault

Yellow flashing: Product warning

� Green steady: System ready

Green flashing: Ready/Hold

� Blue: Ejector and bead verification are

enabled

Or

Audible alarm Splitter cable Alarm horn or siren

4. Serial port DB‐9, 9‐pin connectorConnects to a computer for diagnostics orgeneral purpose communication.

5. System I/O DB‐15,15‐pin female connector

Connects to the:

� customer's PLC type machine using the

remote I/O cable, and/or

� machine stop relay adapter

box.

For configuration details for the System I/Oconnector, refer to System I/O ConnectorInformation in Appendix A.

NOTE: The mating connector is supplied in theship‐with kit.

NOTE: Refer to Remote Output Relay AdapterKit Instruction Sheet and Remote Input/Output(I/O) Cable Assembly Kit Instruction Sheet,available at www.emanuals.nordson.com.

Master I/O Bank LEDs

LEDs Function

6. System I/O Illuminates to display the status of the system input and output. There are fourinput and four output LEDs.

7. Encoder Stays on while the machine is running.

Continued...



Master I/O Bank LEDs (contd)

LED Name LED Status Function

8. System

RED (steady)

Illuminates to display a fault condition.

� Any condition that prevents the system from continuing to

operate (e.g. hardware failure, such as ROM or FLASH).

� In this condition the Ready output drops out and a line stop is

issued.

� Faults must be manually reset.

RED (flashing)

Illuminates to display a warning condition.

� Hardware related problem, and the system will continue to

operate (e.g. bad program data, applicator shorted, hardwareconfiguration problem).

� System Ready condition is maintained and the line continues

to run.

� Warnings are temporary and the system reaction lasts as long

as the warning condition exists.

� Warnings can be latched on the touch‐screen panel, refer to

Warning Latch in the touch‐screen panel documentation.

9. Product

YELLOW (steady)

Illuminates to display a product fault.

� Product defects that may cause the system to cease

operation.

� Ready condition is maintained, and a line stop is issued in this

condition.

� Product faults must be manually reset.

YELLOW (flashing)

Illuminates to display a product warning.

� Product defects and potential product defects that could

result in a bad product.

� Defective products are ejected if ejection is enabled (e.g.

various types of bead defects, clipping, jamming, wrong barcode).

� Ready condition is maintained and the line continues to run.

10. Ready

GREEN (steady)

Illuminates to display that the system is ready.

Ready condition is a state when the control system is ready tomake products once the line is started and products are detected.

GREEN flashing

Illuminates to display a ready or hold condition.

The control system is ready (as defined above) but the system isnot enabled, either via the remote input or the communicationsinterface.



Pattern Controller I/O Bank Connectors and LED

Figure 34 Pattern controller I/O bank

Pattern Controller Bank Connectors


1. Trigger input (Channel 1-4)

5‐pin female connector (4)Connects up to four NPN or PNP triggers perbank (8 per module).

2. Run‐up output (Channel 1-2)

4‐pin female connector (2)Connects to a 0-10 V and 4-20 mA pressuretransducer.

3. Remote purge input(4 channels)

6‐pin female connector

Connects to a purge box for activating the purgefunction.

NOTE: Remote purge can be accomplishedwith the standard eight‐input wired remote, orwith a four channel wireless remote.

NOTE: Remote purge can be setup instead as aremote enable input for each of the fourchannels on the bank by using the advancedsettings on the touch‐screen panel.

Pattern Controller Bank LED

LEDs Function

4. Trigger (4) Illuminates each time the trigger activates.



Verification I/O Bank Connectors and LEDs

1

2

5

43

Figure 35 Verification I/O bank

Verification Bank Connectors


1. Trigger input (Channel 1-4)

5‐pin female connector (4)Connects up to four NPN or PNP triggers perbank (8 per module).

2. Sensor input (Channel 1-4)

DB‐9‐pin connector (5)

Connects to five sensors to analyze theproduct's surface for the presence or absence ofglue. The sensor interface includes:

� One digital input for detection

� One output for calibration

� Separate 24 VDC supply for sensor

power

NOTE: Sensor numbers five and six can beused as a standard sensor input or as a Smartsensor, see 3 in Figure 35.

Continued...




3. Smart sensor input (2 [Channel 5-6])

NOTE: Some versions maycontain a single currentsensor on Channel 6.

High density D‐SUB, 15‐pinconnector

Connects to a smart sensor output. The smartsensor interface includes:

� Sensor inputs (3)

� Trigger output

� RS232 for data communication

� Encoder output

� Calibrate/learn signal

Verification Bank LEDs

LEDs Function

4. Sensor (6) Illuminates each time the sensor activates.

5. Trigger (4) Illuminates each time the trigger activates.



Output Connectors

Two types of connector panels are available with this control system:

� Four standard output connector (can be used with either UGD or LVD

driver board)

or

� Logic interface (used only with LVD driver board)

1

OR

2 (a)

2 (b)

Figure 36 Types of output connectors

WARNING! The universal gun driver outputs are not isolated from the linevoltage, make sure that care is exercised when handling applicatorconnections while the unit is powered.

NOTE: When connecting an external driver to a control module, make sureto use a 24V logic driver. The universal gun driver outputs are not compatiblewith the external driver inputs.




1. Four channel (UGD orLVD) output connector inbank A (applicators 1-4)

4‐pin female connector (4) Connects to electric applicators and solenoids.

And/Or

2 (a). Four standard machinecontrol output connector inbank B (applicators 5-8)

4‐pin female connector (4) Machine control outputs:

1. Ejector - for firing a pneumatic valve thatactuates an ejection mechanism (rotaryejector, dump gate, pusher, etc.).

2. Batch kicker - for firing a pneumaticvalve that actuates once for every presetnumber of products (or batch).

3. Delivery table control - for stopping thedelivery table when products are ejectedupstream to preserve shingling ofproduct flow.

4. Product mirror - this signal is a mirrorimage of the product sensed by thetrigger at the ejection point. It is onlyused in the Logic ejector mode.

Or

2 (b).Logic interface in bank B Connects to the Bobst Cube.



Machine Control Configurations

The machine control outputs can be delivered trough three differentcombinations of driver boards and output connectors.

1 2 3

Figure 37 Machine control driver boards and output connector configurations

Driver Board Specifications

1. 24 VDC with outputconnectors

A ground referenced sourcing (PNP), 24 VDCsignal typically connected to a PLC input orused to drive 24V solenoid valves.

2. 24 VDC with D‐sub outputconnectors

A ground referenced 5 VDC active low‐logicsignals on 37‐pin D‐sub connectors. Only theOUTPUT connector (top male) is used. Do Not connect to INPUT connector (bottomfemale).

3. Universal gun driver withoutput connectors

A high‐voltage current controlled output forfiring solenoids and electric valves directly.These outputs are not isolated from linevoltage and should not be connected to earthground.



Ejector Setup Guidelines

The ejector ensures that only accurately glued products remain on theproduction line. The preeject trigger assists in registering the product prior toejection. The defect appears in the expected position window, which is adefault product length setting.

The tracking distances are learned through the Learn Distance procedure,where the machine is cleared and a product is set through the machine. Thetouch‐screen panel provides the visual queues as the process progresses.

Figure 38 Pre‐eject trigger operation

1. Tracking distance

2. Machine direction

3. Pre‐eject trigger

4. Ejector‐to‐trigger offset

5. Ejector

Eject Confirm Setting

In this setting, a separate trigger is placed downstream from the ejector. Thecontrol system looks for the improperly ejected products to appear at thetrigger. This setting can be used to generate a machine stop.

Figure 39 Pre‐eject trigger operation with a separate trigger



3. Ejector delay

4. Ejector

5. Eject confirm trigger



This page intentionally left blank.



System Setup

WARNING! Allow only qualified personnel to perform the following tasks.Follow the safety instructions in this document and all other relateddocumentation.

Before setting up the combi system make sure of the following:

� Control module power cable is connected to a grounded outlet.

� Control module and touch‐screen panel are turned on.

� Pattern generation and product verification components are

connected.

For connection details refer to Appendix A in this manual.

High level system setup tasks are also available in the LogiComm ControlSystem User's Guide.




Main Menu Screen

Once the master control module and the touch‐screen panel are powered on,the control system performs an initializing procedure and the touch‐screenpanel displays the following screen.

Figure 40 Main Menu components

1. Status bar

2. Message log

3. System setup and programmablebuttons



Status Bar

The status bar contains system function and programmable status barbuttons.

System Function Buttons

The system function buttons in the Status Bar are dedicated to fixed systemlevel functions and cannot be changed or reassigned. These buttons arevisible and functional from every menu.

Figure 41 System function buttons on the Status Bar

1. System function buttons

The system function buttons are used to change the state of the machine byturning certain system level functions on and off. Typically these functionsare also affected by remote system inputs. They can also be affected byother system settings.

Glue On/OffThis function is specific to pattern generation and combi systems. Itdetermines whether all gun outputs are enabled or disabled system‐wide.

‐ Glue Off (light blue)

All gun outputs are disabled. The photocell signals are received andproduct length and pattern settings are displayed.

‐ Glue Off (by Input [yellow])

Gun outputs are disabled either by the Glue Enable or the Unit Enable(or Disable) system input.

‐ Glue Standby (yellow)

Gun outputs are disabled because the line speed is below the GlueStart Speed (Setup Page 2).

‐ Glue On (green)

Gun outputs are enabled. Glue application will start with the nexttrigger input.



System Function Buttons (contd)

Verification On/OffThis function is specific to product verification and combi systems. Itdetermines whether products are inspected by the verification system andwhether defects are reported in the Message Log screen.

‐ Verification Off (light blue)

Product inspection is disabled. Photocell signals are received andproduct length is displayed. Actual bead images and sensor inputsare still displayed.

‐ Verification Off (by Input [yellow])

Product inspection is disabled either by the Verification Enable or theUnit Enable (or Disable) system input.

‐ Verification Standby (yellow)

Product inspection is disabled because the line speed is below theVerification Start Speed (Setup Page 3).

‐ Verification On (green)

Product inspection is enabled. Inspection will start with the nexttrigger input.

Machine Stop Enabled/DisabledThis function is available in pattern generation, product verification andcombi systems. It determines whether the machine stop system output isactivated.

‐ Machine Stop Disabled (light blue)

Machine stop output is not activated regardless of conditions.

‐ Machine Stop Enabled (dark blue)

Machine stop output is activated when a machinestop event isencountered. Possible machine stop events include:

� Overlength/Underlength

Go to Gun Settings>Properties>Advanced Trigger Settings.orGo to Sensor Settings>Properties>Advanced Trigger Settings.

� Too many successive defective products

Go to Setup Page 3 > Machine Control Settings

� Some smart sensor settings also have machine stop settings.

‐ Machine Stopped (red)

Press the button to clear the machine stop and deactivate the output.



Reject On/OffThis function is specific to product verification and combi systems. Itdetermines whether the ejector output will activate to divert defectiveproducts from the production line.

‐ Reject Off (light blue)

Defective products (as determined by the inspection process of theVerification System) will not be diverted from the production line. TheReject One and Reject All function in the Reject Control menu stillfunction.

‐ Reject Standby (yellow)

Defective products will not be diverted from the production linebecause the system input Ejector is Ready is turned off.

‐ Reject On (green)

Defective products (as determined by the inspection process of theVerification System) will be diverted from the production line.



Programmable Status Bar Buttons

The programmable status bar buttons can be programmed only to obtainsystem status information that are specific to the production process, such as

production rate, line speed, product count and defect count. These buttonsare programmable and can be set up to provide the most meaningfulinformation to the production process.

Figure 42 Programmable StatusBar buttons

Most status bar buttons can be reassigned:

1. Touch the status bar buttons to open the Key Definition popup.

2. Scroll up and down through the list to select the desired function. In somecases a channel selection menu will appear prompting the selection ofthe desired channel to be displayed in the status bar button.

Glue OFF

Reject OFFVerification OFF

No Job

Module 5Sensor Defect Count

0 pcs

Module 6Sensor Defect Count

0 pcs

Message Log

Machine Stop DisabledLine Speed 10 pcs

Power Down

Input 1Product Count

0 pcs

Home

24- Sep- 2010 00:43:38

Status Bar Button Assignment

Button

Button

Help

OK

Linespeed 1

Key Definition Menu

Linespeed 2

Standby On/Off

Job Name

Production Rate

OK

Help

Cancel

Page DownProduction Count

Figure 43 Key Definition pop‐up

Special Status Bar Buttons

There are three special function status bar buttons:

‐ Power Down

Saves system settings prior to removing power.

‐ Standby

Places the system in standby mode.

‐ Job Status

Displays the job name and allows the user to change between jobsetup and job run.

To reassign the functions of the buttons, go to Setup Page 4 > Status BarButton Assignment screen.



Message Log

The message log screen displays the latest system fault, warning, or alarmcondition.

Message Log

Alarm - Inspect 1B1 - Product failed pattern verification 24- Sep- 2010 00:43:38

Figure 44 Message log button

When a message appears, the clock area next to the message log changesto an Alarm Reset button. Press the Alarm Reset to clear the message andsilence the audible alarm output.

Help Pages

Context sensitive help pages are available in most menus through the Helpbutton in the touch‐screen panel. These pages give a basic explanation ofthe settings contained on each page.

System Setup Pages

Four system setup pages are accessed from the System Setup button on theMain Menu screen. Depending on the configuration of the machine, somebuttons may not be visible or accessible.

Setup Page 1� Administrative Setup Wizard

A stepbystep guided process for entering the most common systemsettings.

� Pattern Generation (Pattern Control) Setup Wizard

A stepbystep guided process for setting up the pattern generationsystem.

� Verification Setup Wizard

A stepbystep guided process for setting up a verification system.

� Encoder properties

Set encoder scale factor and direction of travel for each installedencoder.

NOTE: The system automatically detects the presence and type of eachinstalled encoder. For more details, refer to Setup Encoders underSystem Setup given later.



Setup Page 1 (contd)

� Save/Restore System Information

Save a backup of all system settings and stored jobs to a USB memorydevice. Recall backup information to the machine.

NOTE: A USB device must be installed before this menu is activated.For more details, refer to Save and Restore System Settings underSystem Setup given later.

� I/O Control

Assign the system inputs and outputs to a userdefined function. For a listof input and output options as well as a definition of each function, refer toSystem I/O Information in Appendix A. Under Advanced Settings, theoutputs to the light tower can also be reassigned. For more details, referto Setup System I/O under System Setup given later.

� Driver Board Settings

A consolidated list of UGD gun assignments is available. For moredetails, refer to Driver Boards under System Overview and OutputConnectors under Installation.

� Interface Settings

Activate the serial interface protocol for certain OEM machines.

� Encoder Assignment

Assign each gun, runup, sensor and machine control output channel toone of the two encoders in the system. For more details, refer to SetupEncoders under System Setup given later.

NOTE: Adhesive dispensing applicators are referred to as “guns” in someinstances.



Setup Page 2� Flush/Purge Settings

Change the Gun Purge button on the Main Menu screen from PurgeMode (activate guns while the button is pressed) to Flush Mode (activateguns until button is pressed a second time). Also set the purge pressurefor each pressure transducer output channel.

� Glue Start/Stop Speed

Set the line speed where the gluing operation begins on line startup andthe corresponding speed where gluing stops on deceleration. Activatethe pattern memory feature.

� Compensation Settings

Set the reference speed for compensation calculation for each installedencoder. Refer to Compensation under Setup the Gun in Programmingfor Pattern Generation.

� Tip Seal

Set the tip seal operation.

� Glue Autostart

Set gluing operation to be On automatically during system power up.

� Gun Trigger Offset

A consolidated list of GTO settings for each gun channel is available inSystem Settings in Appendix A. There is also an option to set multipleGTO settings at one time. Refer to Setup the Gun in Programming forPattern Generation.

� OptiStroke Settings (Feature not available)

� Gun Coupling

Pair together two pattern channels for a combination gun output (AND,OR, Alternate). For more details, refer to Gun Coupling underProgramming for Pattern Generation.

� Machine Stop Settings

Set the conditions to activate the machine stop output (system output).



Setup Page 3� Ejector Settings

Access the ejector settings from the Reject Control button on the MainMenu screen. For more details, refer to Programming for ProductVerification in Programming the System.

� Verification Start/Stop Speed

Set the line speed where the verification operation begins on line startupand the corresponding speed where verification stops on deceleration.

� Batch Settings

Set the batch kicker machine control output in a verification system. Formore details, refer to Programming for Product Verification inProgramming the System.

� Machine Control Settings

Select the number of defects that will activate machine stop. Set themachine clear out function and then set the blocked photocell function.

� Smart Sensor Select

Normally smart sensors are automatically detected during system powerup. When enabled, this feature allows for manual selection of smartsensors.

� Counter Assignments

Select photocells for Feed Count, Delivery Count and Post Eject.

NOTE: These assignments can only be made while no job is active.

� Sensor Photocell Offset

A consolidated list of STO settings for each sensor is available. Normallythis is set individually in the Sensor Menu.

� Auto Alarm Clear

Normally disabled, this function allows an automatic timeout to be setthat will disable the alarm after the designated time.

� Learn Settings

Set up the number of product samples to be learned when using templateinspection.

� Spare Output Settings

Special function not normally used.

� Deliver Table Settings

Disabled by default, this machine control output can be used tointermittently stop the delivery table when a product is ejected in order topreserve product shingling into the compression section.



System Settings Page 4� Software/Hardware Versions

Displays the software versions and hardware configuration of all systemcomponents. For more details, refer to Software/Hardware Versionsunder System Setup Tasks given later.

� Time/Date

Setup the control module clock. All system time and date information isgenerated by the master module clock and not by the touch‐screen panelclock.

� Passwords

Setup the data and program (job) data passwords.

� Machine Information

Enter the machine information used in job reports.

� Screen Saver

Enable the touch‐screen panel saver to increase backlight life.

� Status Bar Button Assignments

Reassign the status bar buttons. For more details, refer to Status Bargiven earlier.

� Advanced Settings

Password protected area for certain special features. This is onlyaccessible by Nordson personnel.

� Units

Change the unit of measure from metric to English (imperial system)units.

� Touch Screen Calibration

Start the calibration procedure for the touch‐screen panel.

� Photocell, Gun, Runup, and Sensor Names and Name Style

Enter and display device names. For more details refer to System Setup.

� Language

Select from the available languages.

NOTE: Some language selections require you to restart the system.



System Setup Tasks

These are instructions for basic system settings. High level system setuptasks are also available in the LogiComm Control System User's Guide.

Setup Encoders

The control system can have one or two independent encoders. As a default,all devices in the system are assigned to Encoder 1. When two encoders areused, it is necessary to assign the appropriate devices to the correct encoderthrough Setup Page 1 > Encoder Assignment.

Encoder Assignment

Figure 45 Encoder assignment screen

Each encoder must also be scaled correctly in order to accurately detectdistances in the machine. This is done through Setup Page 1 > Encoder Settings.

When using a contact wheel of a known diameter and an encoder of a knownresolution (in pulses per revolution) the encoder scaling can be calculated asfollows:

Encoder Scale (pulses per mm) = Encoder Resolution (pulses per revolution)Wheel diameter (mm) x 3.14

Determine Scale Factor Using a Hand‐held Tachometer

If the encoder scaling is not known, a handheld tachometer can be used todetermine the correct scale factor. This is done by the following procedure:

1. Set the encoder scale factor to 1.0.

2. Run the line up to a production speed and measure the speed with ahandheld tachometer.

3. Adjust the scale factor by the formula: New Scale Factor = Measured Line Speed

LogiComm Display Speed



Determine Scale Factor Based on Product Length Measurement

If a handheld tachometer is not available, a similar procedure can be usedbased on product length measurement.

1. Install and assign a photocell to a gun or sensor.

2. Set the encoder scale factor to 1.0.

3. Run a product past the photocell and observe the displayed productlength.

Figure 46 Product length displayed

4. Adjust the scale factor by the formula:New Scale Factor = Measured Product Length LogiComm Displayed Product Length

Encoder Reverse Setting

If the line speed is displayed as a negative number, the encoder can beelectronically reversed through the Encoder Settings, see the specificbuttons below:

Figure 47 Reverse off and Line Speed buttons



Setup Save and Restore System Information

To perform this operation a USB memory device must be installed in thetouch screen panel. A USB icon will appear next to the date/time line on thescreen when a device has been recognized by the operating system.

There are three types of control system settings that can be saved to a USBmemory device throughSetup Page 1 > Save/Restore System Information.

Figure 48 Save and restore buttons

The buttons correspond to the file extensions described below:

� Active Program currently active program/job (NAC file extension).

� System Configuration – settings relating to the setup of the system

(NCN file extension).

� Stored Programs – all programs/jobs saved into a single file (NST file

extension).

NOTE: These files can be copied and archived, but the files themselvesare binary files that can only be read by loading them into a controlsystem.

� When Save All is used, two versions of the message log are saved

along with the other files: a nonreadable NMS file and a readabletext file with a TXT file extension.



Save Settings

A user‐definable name can be given to the stored backup files, and thesefiles are saved using the Windows CE dialog box, see below:

Figure 49 Save As dialog box

1. Touch the OK button on the dialog box to save the settings. By defaultthe settings are saved on the USB disk in the RestorePoint directory, buta different location may be used using the navigation buttons on thedialog box.

2. Touch X in the top right corner to exit without saving.



Restore Settings

1. Touch the Restore button on the Save/Restore System Information torestore the system settings.

See the following Windows CE dialog box for an example of the filesdisplayed:

Figure 50 Open files dialog box

NOTE: In order to properly identify the correct file by extension, select thedetails icon on the Save/Restore System Information screen.

2. Restore files in the following order by selecting the appropriate file.

Figure 51 Restore files dialog box

a. Restore the .NCN (configuration) first.

b. Restore the .NST (storage) file next. This will replace any previouslystored programs inside the control system engine. All previouslystored programs will be replaced with the ones restored from the USBdisk.

c. Optionally restore the .NAC file, which will overwrite the current activeprogram with the one from the USB disk.

3. Touch the OK button.



Setup System I/O

There are four system inputs and four system outputs located on the masterI/O Bank of the master control module. The System I/O is accessed throughSetup Page 1 > I/O Control screen.

Figure 52 I/O screen

The input and output can be independently assigned using the buttons on themenu to scroll through and select the desired functions, see Figure 53. Referto System I/O Information in Appendix A for a list and description of I/Ofunctions available. Each I/O point has a corresponding status LED shown inthe button that indicates the current state of the input or output.

Figure 53 Output assignment pop‐up



Software/Hardware Versions

The control system contains many programmable devices throughout thesystem. The software versions of each device, as well as the hardwareconfiguration of each control module can be displayed through Setup Page 4 > Software/Hardware Versions:

Figure 54 Software/Hardware Versions screen

Assign Device Names

The devices in a control system can be identified in two unique ways. Eachdevice has a physical name that designates its location in the system as wellas a logical name that is user‐definable.

Physical Names

Physical device names have three following components in the form of XYZ:

� X - refers to the control module number (shown on the System Link Panel

of each control module).

� Y - refers to the module bank location (either A or B).

� Z - refers to the channel number of the device.

For example:

‐ Gun 1B3 refers to the gun channel 3 on bank B of the

control module 1 (always the master control module).

‐ Photocell 2A4 refers to photocell 4 on bank A of the second control

control module.



Logical Names

Logical names are customer assignable names. Logical names can beassigned to the following list of devices through Setup Page 4.

� Photocells

� Guns

� Runup Outputs

� Sensors

� Control Modules

In addition, the following machine Information can be defined for use inprinted production reports

� Machine Name

� Company Name

� Company Address

Name Styles

The names displayed on the touch‐screen panel can be assigned throughSetup Page 4 > Name Style.

Figure 55 Name style screen

� Names Only –displays only the logical name.

� Type and ID – displays both the logical and physical name.

� ID Only – displays only the physical name.

� Examples are displayed for each device type in the Example Name

Format box.

The Auto Name function provides a convenient method of automaticallynaming all devices in the system sequentially (e.g. Gun 1, Gun 2, Gun 3, etc).






Programming the System The following sections provide details on how to program the control systemfor pattern generation and product verification.

Setup the Wizards

The setup wizards can be accessed by selecting:System Setup > Setup - Page 1 of 4

There are three setup wizards:

� Administrative

� Pattern generation (Pattern control)

� Product verification (Verification)

The wizards provide a stepbystep process for setting up the control systemwith pattern generation and product verification functionalities.




Programming for Pattern Generation

Setup the Gun

A system for pattern generation can have between four and eight guns.

Select the gun channel button on the Main Menu screen to access the GunMenu screen.

Figure 56 Gun Menu screen

1. Gun channel button (located on the MainMenu screen)

2. Bead number selection button

3. Bead type selection button

4. Gun settings button

5. Programmed pattern

6. Trigger selection button

7. Gun activation button

8. Product length

9. Pattern parameter

10. Glue ON/OFF button

Select the number of beads

CancelOK

0 1 2

3 4 5

6 7 8



Gun Setup Checklist

The critical steps required to setup the gun are:

1. Select trigger (photocell).

2. Select the type of pattern (or beads) for the the application.

3. Select the number of beads and set other pattern parameters.

4. Assign gun settings.

5. Trigger settings.

6. Compensation.

7. Gun driver selection and setup.

8. Adjust the delay and duration settings.

Select Number of Beads

Select Number of Beads to enter the number of beads for the pattern. Seefigure on the left.

Figure 57 Number of beadselection keypad



Select the Trigger

Select Trigger (Photocell) to assign:

� a specific trigger to a gun channel, or

� any trigger to any gun channel, or

� a single trigger to multiple guns

1

2

2 Bead(s) Normal

Active Trigger 1A1

Gun MenuModule 6

Delay Duration

1

2

Module 1 Module 2

100.00 mm 50.00 mm

50.00 mm200.00 mm

Settings

Photocell Selection For Gun 1A1: Trigger 1A1Gun To Photocell Offset 100.00 mm

Trigger 1A1

Trigger 1A2

Trigger 1A3

Trigger 1A4

OK Cancel

Global Triggers

Help

Output 8

Output 7

Output 6

Output 5

Figure 58 Photocell Selection pop‐up

1. Triggers in the system 2. Global trigger button

NOTE: The Trigger button has an embedded LED which turns greenwhen the trigger is activated and white when deactivated.

NOTE: The Global Triggers button is activated when there is more thanone control module in the system. Global Triggers comes from the mastercontrol module through the system link cable.

Verify Trigger Operation

Reliable pattern generation operation is dependent upon a repeatable,consistent trigger input. Use the product length display to verify that thephotocell is operating properly.

After the photocell has been assigned, run several products through themachine past the photocell. The trigger LED should light and the measuredproduct length will be displayed with a green bar, as shown below.

Active Trigger 1A2

Product Length: 152.50 mm

Figure 59 Product length display



The product length display is updated several times per second and shouldnot vary more than a few millimeters. If the trigger signal is unstable, afterverifying the mechanical and electrical installation of the photocell, refer toTrigger Settings under Gun Settings Menu given later.

Program the Pattern

Select the Pattern Type.

The following bead types are available:

� Normal

� Dotted

� Autospot

� Stitched

� Random

� Modulated

� Continuous

Normal beads

Normal beads or solid beads are generated when the line velocity is abovethe start speed. This is the default bead type for the system.

Assign the delay and the duration values. Delay is the distance from theleading edge of the product to the beginning of the bead, and duration is thedistance from the start of the bead to the end of the bead.

1

2 3

6

7 7

8

9 10

12

8

115

4

Figure 60 Bead patterns

1. Bead 1

2. Delay 1

3. Duration 1

4. Bead 2

5. Delay 2

6. Duration 2

7. Leading edge

8. Direction of travel

9. Applicator

10. Trigger

11. Gun‐trigger‐offset

12. Next product



Dotted beads

This bead type provides patterns of constant weight (volume) dots ofadhesive spaced by a userdetermined distance.

Time

10 ms

5 ms

2 ms

Pitch = 25 mm (1.0 in.)

178 mm (7.0 in.)Dur 1

Figure 61 Effect on dot size of decreasing gun‐on time from 10 ms (top) to 2 ms(bottom)

Autospot beads

This bead type relieves residual pressure after a sudden machine stop. Thegun dispenses dot beads when the system is below the activation speed anddispenses normal beads when above the activation speed.

2

1

Figure 62 Autospot bead pattern for decelerating line speed



Stitched beads

This bead type reduces the adhesive usage and increases adhesive bondstrength. When stitched bead is selected, normal beads are broken into aseries of shorter beads

178 mm (7.0 in.)

0%

10%

30%

50%

70%

90%

Dur 1Glue Savings

Interval = 25 mm (1.0 in.)

Figure 63 Effect of increasing glue savings from 0 percent (top) to 90 percent(bottom)

Random beads

This bead type provides a way to mix products of differing length on theproduction line during the same production run. When alternating betweenshort and long products on the production line, the system is programmed toautomatically determine the length of each product as it passes the trigger,and it then adjusts the bead size to fit the product.

1

2

AB

Figure 64 Random‐length bead pattern (A: Start Gap/B: Stop gap)



Modulated beads

This bead type provides nearly a constant bead volume below a set linespeed. When the production line slows down below the specified speed, thesystem divides the beads into smaller subbeads to prevent the bead volume

from increasing.

At any line speed, the total gunon time to produce the modulated beadremains the same as the total gunon time to produce the solid bead, so thatthe modulated bead contains the same amount of adhesive as the solidbead. As the line speed decreases, the subbeads get shorter and theirthickness increases. Specify the interval desired between subbeads, andthe control will always place a subbead at the beginning of the bead lengthdefined and one as close as possible to the end of the bead length.

Line Speed

38.1 m/min (125 ft/min)

30.5 m/min (100 ft/min)

22.9 m/min (75 ft/min)




Interval = 25 mm (1.0 in.) Speed = 30 m/min (100 ft/min)

Dur 1178 mm (7.0 in.)

Figure 65 Effect on modulated bead pattern as production line drops belowactivating line speed of 30 m/min (100 ft/min)

Continuous beads

Continuous beads provide continuous adhesive application above a presetline speed. When this bead type is selected, the gun outputs remain openuntil the production line slows below the preset stop speed. With continuousgluing no pattern is programmed, and no trigger signal is required.



Gun Coupling

Gun coupling is used to create combine two adjacent pattern channelstogether to create more complex patterns than are possible using a singlechannel. Gun coupling is set up through System Setup page 2 > Gun Coupling

Three modes of gun coupling are available:

� AND

The resulting output is the result of Channel A AND Channel B, where Aand B are adjacent gun channels (such as 1 and 2, 3 and 4, etc). TheAND function can be used, for example, to create a Random Dot patternby ANDing together one channel set for Random Length and one channelset for Dotting.

� OR

The resulting output is the result of Channel A OR Channel B, where Aand B are adjacent gun channels (such as 1 and 2, 3 and 4, etc). The ORfunction can be used, for example to create complex patterns requiringmore than the 8 bead segments available on a single channel.

� ALTERNATING

Alternating is used for certain special dualvalve applicators that aredesigned for highspeed applications. In an alternating pattern, a singlephotocell is used to alternately turn on one gun pattern then the other onalternating triggers.



Gun Settings

Select Settings to adjust the gun parameters. For the location of the Settingsbutton see Figure 56

1

2

Gun SettingsModule 6Trigger Settings Trigger 1A1

Compensation

Light On

L A825 − Current

Trigger Masking Off

Advanced

Advanced

Gun Trigger Offset

Gun Driver − 4 CH Universal Driver − Temperature: 26 C

Peak Duration: 0.80 mSec, Peak Current: 1.8000 Amps, Hold Current: 0.6000 Amps

On:

0.0 mm

100.0 mm

0.0 mm

Off:

3

Figure 66 Gun Settings screen

1. Trigger Settings (Gun-trigger‐offset)

2. Gun Compensation

3. Gun driver selection

The main gun setting selections are:

� Trigger settings

� Compensation

� Gun selection



Trigger Settings

� Guntotrigger offset (GTO)

This setting is the distance between each photocell and its correspondinggun. Enter the GTO value from 0–9900.00 mm.

� Trigger Polarity

This is a setting that is used to select the type of photocell output.Typically light on is used. If the pattern is being triggered on the trailingedge of the product instead of the leading edge, switch the polarity. If theproduct length displayed in the Gun menu shows the product gapdistance, the trigger polarity needs to be changed.

� Masking

This is a setting that is used to lock the trigger for a predetermineddistance. Use this setting when the product contains cutouts or causesan unwanted trigger signal. Enter the masking length from 0–10000 mm.

� Advanced Trigger Settings

Use Over Length Detection On and Under Length Detection On to detectcarton skewing and overlapping that may jam the machine. Action oneither fault can result in machine stop, feed stop, and/or a warning output.

Use the Teach Product Length button to measure product length, thenset the short and long tolerances.

Compensation

Gun compensation is the mechanical delay from the time when the controlsystem instructs the gun to fire and when the adhesive lands on thesubstrate. Even though gun compensation is a time value, the control systemprompts the user to enter a distance at a set speed to facilitate the measuringbead error method for determining gun compensation.

Each gun can have different compensation settings. This setting ensuresaccurate placement of the beads in applications where the line speed varies.

It is critical for the gun compensation values to be correct to maintain properbead placement and product ejection at high and low speeds.

There are two basic ways of entering gun compensation values:

� Measuring the bead error

� Directly entering a compensation value



Measuring Bead Error Method (Recommended)

This procedure gives the most accurate gun compensation values.

1. Set the gun compensation value to 0 mm.

2. While operating the line at jog or minimum line speed, adjust theadhesive patterns until they are in the correct position on the product.

NOTE: If the beads are close to the edge of the product, turning on thefirst bead only might make this procedure easier to implement since thetrailing bead might fall off the product at high speed.

3. With the line operating at or near the maximum line speed, run a fewproducts through and pull them out of the machine for inspection.

4. In the touch‐screen panel, go through the following menu screens:

System Setup > Setup - Page 2 of 4 > Compensation Settings

In the Compensation Settings screen, change the Set Speed value tothe Speed at Last Run value. This should be the speed at which thelast series of products were glued.

5. Measure the distance the glue beads were lagging on the productsglued at high speed.


Gun Menu > Settings

In the Settings screen, enter the leading edge error distance forCompensation On and enter the trailing edge error distance forCompensation Off.

7. Perform this function for each gun in the system.

All guns should now be correctly set for high and low line speedoperation.

NOTE: If the gun compensation values are entered without measuringthe error, the compensation value may be modified to obtain accuracy.Follow these steps to modify the compensation value:

‐ If the leading edge is delayed (too far back on product) at high speed,

more ON compensation is needed to advance the bead firing. Thesame holds true for the trailing edge and the OFF compensation.

‐ If the leading edge is advanced (too far up on the product) at high

speed, less ON compensation is needed. The same holds true for thetrailing edge and the OFF compensation.

‐ Check and adjust compensation at high and low speeds until the

beads do not move on the product. Once the bead positions arestable at high and low line speeds, but they are not in the correctposition on the product, the bead pattern delay, durations, and/orGTO should be changed to bring the pattern into its proper location.



Directly Entering a Compensation Value

If you are familiar with the turn on and turn off times for the guns beingused, enter the gun compensation values directly in milliseconds.


System Setup > Setup - Page 2 of 4 > Compensation Settings

In the Compensation Settings screen, set the Set Speed value to 60 m/min.


Gun Menu > Settings

In the Settings screen, enter the gun response time in theCompensation On and Compensation Off screens.

The values are shown in millimeters (value is the same asmilliseconds) when the set speed is 60 m/min.

‐ Typical gun compensation values for standard air‐operated guns

are 10 - 20 ms.

‐ Typical gun compensation values for high‐speed air‐operated

guns are 5 - 10 ms.

‐ Typical gun compensation values for electric guns are 1 - 5 ms.



Gun Selection

This screen allows you to select a gun driver from the available list andcustomize the settings. The range for all the parameters are based on theselected gun.

1. Default gun selection is none and will fault if Glue On without gunassigned.

2. Select electric gun by model or pneumatic gun by solenoid wattage.

CAUTION: Do not change defaults except in extreme cases.

To determine universal gun driver settings for solenoid valves 1. If the solenoid valve has LEDs or other electronic components,

remove these devices from the solenoid valve to prevent any gunshort circuit or damage to the solenoid valves.

2. Determine the nominal current of the solenoid valve using any of thefollowing steps:

Using power and voltage rating:If you know the power rating, but not the resistance of the solenoid,calculate the nominal current using the following formula: Nominal Current = Power Rating/Voltage Rating (typically 24 V)

Measure resistance using an ohm meterIf you have measured the resistance of the coil, calculate the nominalcurrent that the solenoid will need using the following formula: Nominal Current = Voltage Rating/Resistance Measured(The voltage rating for the solenoid is typically 24 V)

3. Multiply the calculated nominal current by 1.5 to determine the spikecurrent.

4. Multiply the calculated nominal current by 0.75 to determine the holdcurrent.

5. The last variable to determine is the spike time or duration.

This value varies from solenoid to solenoid and the optimal value isbest determined by trial and error. Start with 3 ms and decrease thistime until the gun does not open consistently. Add 50 to 100 percentto this marginal spike time and leave the gun driver set to that value.For low cycle rate applications you can leave the spike time set to 3ms. For most valves, 0.5 ms spike time would be sufficient to openthe valve.

Copy/Paste Function

Use the Copy/Paste functions for easier programming of multi‐gun systems.To program the pattern settings for the first gun:

1. Touch the Copy button. The button will change to say **Copy.

2. Navigate to the next gun using the arrow buttons in the lower right cornerand touch the Paste button.



Pressure Control Setup

Set the linear pressure curve (the amount of adhesive relative to the machinespeed).

The pattern controller accurately regulates the system pressure to maintainproper adhesive volume during line speed changes. This menu is used to setthe two‐point linear pressure profile for each runup.

Runup 1B1

Runup 1B22 PointAutospot Settings

Output Curve Settings

Minimum

Maximum

Linespeed Pressure

1

2

100%

300.0 m/min

30 %

90 %

0.0 m/min

0%

0%100%

80%

60%

40%

20%

200.0 300.0100.00.0Speed m/min

30%

30%

Pressure Settings1

2

3

4

5 6

7

8

Figure 67 Output Pressure Settings screen

1. Pressure Settings button

2. Minimum line pressure cut‐off limit

3. Line speed/Runup pressure settings

4. Maximum line pressure cut‐off limit

5. Autospot pressure setting

6. 2/5 point curve set

7. Pressure output setting

8. Pressure output/Line speeddisplay

1. Select Pressure Settings on the Main Menu screen.

2. Set the minimum line pressure cut‐off limit.

3. Set the runup pressure at each line speed.

4. Set the 2 or 5 point curve.

5. Set the maximum line pressure cut‐off limit.

6. Set the Autospot pressure setting if applicable.



Gun Purge Setup

The gun purge screen allows you to purge or flush a gun in a specific gunzone.

NOTE: Regular purging or flushing of the guns allows them to remain free ofresidue or any build up.

1

Flush / Purge Settings

Flush Purge

Gun Purge Pressure

Zone 1A1 - Runup 1A1

Zone 1A2 - Runup 1A2

50%

50%

Setup - Page 1 of 4 2

4

3

Figure 68 Gun purge screen

1. Setup - Page 1of 4

2. Purge button

3. Flush button

4. Zone for runup selection forguns

� When the system is set to Purge, the gun outputs are maintained as long

as the button is activated. This mode is used for removing trapped air ormaterial from the adhesive applicator or nozzle, or relieving systempressure by turning the applicator on.

� When the system is set to Flush, it allows continuous firing when

manually operating the applicators for cleaning or other purposes. Thisfeature is used for flushing liquid adhesive system.



The Gun Purge menu allows the purging or flushing (as determined by thePurge/Flush setup) to be performed on single gun or all guns together. Thepressure zone for each gun may be assigned and the corresponding purgepressure can be set. Hammering is a rapid firing of output, can also be enabled.

5

Figure 69 Purge settings

1. Assigned pressure zone

2. Purge pressure

3. Purge single gun

4. Purge All gun button

5. Enable hammering



Working with Job Files

The control system's pattern generation programs are organized around JobFiles to match your operating environment. Each job is saved in the mastercontrol module by a user‐designated name, which can later be recalled andused repeatedly.

Creating and Running a New Job

Follow these instructions to create a new job:

1. Touch the Job Files button on the Main Menu screen to open the JobFiles menu.

2. Touch the New button.

3. Type a descriptive name of the job in the New Job dialog box. Thedescription can be set generically or can be changed for each productionrun.

Job Files Menu

New Job

Name

Description

L ARGE CHOCOL ATE

JOB 589−363

OK

Figure 70 Job Files menu screen

4. Touch the OK button. An empty Active Job is created and the Job Statuschanges to yellow and displays the job name and Setup in the Job StatusBar button.

5. Program the desired pattern and pressure settings for each gun used inthe job.

6. Touch the Job Status button on the Status Bar to run the job. The buttonchanges to green and the job changes to Run mode. Refer to JobReports for more information on Run mode and Setup mode productioncounters.

Saving a Job

Follow these instructions to save a job:

1. Touch the Job Files button and then click Save As.

2. Touch OK.

When a New Job is created, it is not automatically saved. Touch the SaveAs button to recall the job.



Opening a Saved Job

Follow these instructions to open a saved job:

1. Open the Job Files menu.

2. Touch the required file (highlighted in blue), and then click the Openbutton. When the job opens, a unique job description can be assigned toit for identification during production run.

The job will open in Setup Mode. If required the pattern program andpressure settings can be modified.

3. To run the job, touch the Job Status button on the Status Bar. The buttonchanges to green and the job changes to Run mode.

NOTE: When changes are made to an existing job after opening it, thechanges are not automatically saved. Use the Save As function to savethese changes.

Job Status

The Job Status button on the Main Menu screen presents an overview of thecurrent job.

Depending on the counters assigned, the Job Status screen shows theSetup, Run and Total counts for each assigned counter. Refer to JobReports and Counters given later.

Figure 71 Job status screen



Ending a Job

To end a production run, click the End Job button on the Job status screen. Aproduction report is automatically created and saved to an installed USBdrive or to the touch‐screen panel's Compact Flash drive.

Backing Up Job Files

Job files can be archived to a USB memory device throughSystem Setup Menu Page 1 > Save/Restore System Information.

Saving and Restoring Jobs From USB Device

If the master control module memory limits are reached, job files can be alsobe stored in a USB memory device using the corresponding buttons on theJob Files menu.

Job Reports and Counters

Job reports are created anytime an active job ends.

NOTE: An active job ends anytime a new job is created or a saved job isopened.

The job report as well as the Job Status screen uses the assigned countersto present and save meaningful production data. Counters are assignedthrough System Setup Page 3 > Counter Assignment and Batch SettingsWhen these pages are used, a trigger input gets assigned to the followingcounters:

� Feed Count

� Delivery Count

� Post Eject Count

� Batch Count



At the end of the job, a detailed production report is created that includes theall of the shown counters in the job status menu as well as the counts foreach gun and sensor. The job report is saved to a file that can be importedinto Microsoft Excel using a template that is saved along with the job reportfile. A sample production report is shown below:

Figure 72 Sample production report






Programming for Product Verification

Setup the Sensor

Select the sensor channel button on the Main Menu screen to access theSensor Menu screen.

Active Trigger 1A1

Message Log

Bead Tolerance

All Beads

Start

(mm)

2.00 2.00

Stop

(mm)

Cumulative

Length

Start

(mm)

10.00 240.00

Min Max

0.00 100.00

Duration

(mm)

Start

(mm)

115.00 25.00

Duration

(mm)

(mm)(mm)

1 12.00 16.00

2 44.00 16.00

3 76.00 16.00

4 108.00 16.00

5 140.00 16.006 172.00 16.007 204.00 16.008 236.00 16.00

Bead Start DurationMaximum

Gap

Sensor

Masking

Zone Max (mm)

1st 30.00

Product Length: 7,876


Sensor Menu - Inspect 1A1

8

3

2

4

5

67

9 10 11 12

1

Figure 73 Sensor menu screen

1. Sensor selection button

2. Trigger selection button

3. User defined maximum gapinspection region (thin green line)

4. Ideal bead template (thick greenline)

5. Actual bead (thick black line)

6. User defined cumulative lengthinspection region (thin blue line)

7. Sensor masking area

8. User entered tolerance data

9. User entered cumulative lengthsettings

10. User entered gap settings

11. User entered masking settings

12. Actual bead measurements



Sensor Setup Checklist

The critical steps for setting up sensors are:

1. Select the trigger.

2. Set up the trigger properties.

3. Verify trigger operation.

4. Calibrate the sensor (if necessary).

5. Program the inspection parameters and/or program the smart sensorsettings.

6. Learn the inspection template or code (if necessary).

7. Verify sensor operation.

Smart Sensors

The smart sensors are advanced sensors that have builtin processingexternal to the control system. These sensors communicate with the controlsystem through a serial interface to provide setup and status information. Inaddition, the result of each inspection is reported to the control modulethrough discrete inputs in the smart sensor interface for display,tracking/ejecting defects and reporting.



Select the Trigger

Select Trigger (Photocell) to assign:

� a specific trigger to a gun channel, or

� any trigger to any gun channel, or

� a single trigger to multiple guns

1

2

2 Bead(s) Normal

Active Trigger 1A1

Gun MenuModule 6

Delay Duration

1

2

Module 1 Module 2

100.00 mm 50.00 mm

50.00 mm200.00 mm

Settings

Photocell Selection For Gun 1A1: Trigger 1A1Gun To Photocell Offset 100.00 mm

Trigger 1A1

Trigger 1A2

Trigger 1A3

Trigger 1A4

OK Cancel

Global Triggers

Help

Output 8

Output 7

Output 6

Output 5

Figure 74 Photocell Selection pop‐up

1. Triggers in the system 2. Global trigger button

NOTE: The Trigger button has an embedded LED which turns greenwhen the trigger is activated and white when deactivated.

NOTE: The Global Triggers button is activated when there is more thanone control module in the system. Global Triggers comes from the mastercontrol module through the system link cable.



Verify Trigger Operation

Reliable system operation is dependent upon a repeatable, consistent triggerinput. Use the product length display to verify that the photocell is operatingproperly.

After the photocell has been assigned, run several products through themachine past the photocell. The trigger LED should illuminate and themeasured product length will be displayed with a green bar, as shown below.

Active Trigger 1A2


Figure 75 Product length display

The product length display is updated several times per second and shouldnot vary more than a few millimeters. If the trigger signal is unstable, afterverifying the mechanical and electrical installation of the photocell. Refer toTrigger Settings under Gun Settings Menu in Programming for PatternGeneration.



Setup the Properties

In this screen assign:

� Trigger Settings

� Sensor Settings

Verification ON

PropertiesTrigger Settings

Sensor Trigger Offset Sensor Polarity:Sensor Settings

1

2

Figure 76 Sensor Properties screen

1. Trigger settings 2. Sensor settings



Trigger Settings

‐ Sensortotrigger Offset (STO)

STO is a setting that allows you to set the distance between eachtrigger and its corresponding gun.

STO is critical to proper the function of the system. This settinginforms the engine and the touch‐screen panel about the physicalset‐up of the devices in relation to each other.

See Figures 77 and 78 for sample application and waveformsshowing GTO and STO.

Figure 77 Example 1 of STO application

Figure 78 Example 2 of STO application



‐ Trigger Polarity

Selects the type of photocell output being used. Typically Light On isused if the pattern is being triggered on the trailing edge of theproduct instead of the leading edge. If the product length displayed inthe Gun menu shows the product gap distance, the trigger polarityneeds to be changed.

‐ Trigger Masking

Masking is a length that is used to lock the trigger for a predetermineddistance. Use this setting when the product contains holes orotherwise causes an unwanted trigger signal.

‐ Advanced Trigger Settings

Use Over Length Detection On and Under Length Detection On todetect carton skewing and overlapping that may jam the machine.Action on either fault can result in machine stop, feed stop, and/or awarning output.

Use the Teach Product Length button to measure actual productlength, then set the short and long tolerances.

Sensor Settings

Use sensor settings to set:

‐ Sensor Polarity

Select whether the sensor input is active (light on) or inactive (darkon) when the sensor is detecting.

‐ Sensor Input Number

This setting should not normally be changed. It designates thephysical connector number associated with the selected sensorchannel.

‐ Sequencer

Sequencers should normally be disabled on newer machines. Earlyhardware required the use of external power sequencers onGD100200 sensors to limit power supply inrush at system startup. Ifthe verification I/O bank is labeled Do not use sequencers beneaththe sensor connectors, set this setting to Disabled.

NOTE: Setting the sequencer output to Enable will cause some sensorsto be unintentionally recalibrated at power up.



Select Inspection Parameters

Select the inspection parameters to match the requirements of theapplication. Inspection parameters can be turned on or off for each beadinput.

All the tools in this menu can be used in any combination to perform thedesired type of inspection for the application. Each of the parameters areseparately enabled for each sensor using the buttons on this menu.

1

2

3

54

Verification ON

Sensor Menu − Inspect 1A1Bead Tolerances

Figure 79 Inspection parameter screen

1. All Beads

Set tolerance (+ or -) for the start and stop position of the bead.

Individual bead tolerances can be set by using Advanced Settings.

2. Maximum Gap

Set maximum sensor gap for normal, random, and continuous beadtype. Use this feature for product ejection when the gap in the gluepatterns appear greater than a user defined setting. Multiple

maximum gap inspection regions can be set on a single sensor.

3. Cumulative Length

Set the maximum and minimum allowable glue length measured in adesignated region.

4. Sensor Masking

Set up to four masking zones per sensor. Use this setting to ignoreareas where false sensor readings may occur.

5. Stop Speed

Use this setting to designate the line speed below which noinspections are performed.



Template Verification

When the Learn Pattern button is pressed, the engine scans products (thenumber of products is programmable) and uses this information to obtain apattern. A pattern is used as a template for the products that follow in theproduction run. From this learned data and the tolerances set by the user, acomparison template is stored in the verification accelerator board.

When verifying normal bead data, sensors are sampled on every encoderpulse and compared to the corresponding template values. If the datacompares favorably to the template data, the product is considered good. Ifproduct data does not match the template within the set tolerance, it isqueued for ejection.

See Figure 80 for an example of a template verification setting in the Sensorscreen.

Figure 80 Template verification setting

1. Tolerance band (orange)

2. Sensor mask region

3. Actual bead (black)

4. Learned template or ideal bead(green)

5. No glue

6. Glue region



Template Verification (contd)

The various regions of the Template Verification display are described below:

‐ Tolerance region

The tolerance setting is made before the sensor is taught thetemplate. Tolerance is applied to the beginning and end of eachlearned bead segment. Beginning and ending tolerances can be setdifferently. When a bead begins or ends outside the tolerance region,the product is determined to be defective.

‐ Sensor Mask region

Sensor masking is used to ignore the inspection on a specified regionof the product. This is normally used when an area of the product iscausing false or unreliable sensor readings. The Sensor mask regionis specified by setting a start distance from leading edge of theproduct and the duration of the mask.

‐ Glue region

The glue region is designated by the green (learned template) andblack (actual sensor reading) lines between the tolerance bands. Intemplate verification, the measured bead in the glue region must becontinuous with no breaks or the product will be reported as defectiveand then ejected.

‐ No Glue region

The region outside the orange tolerance bands is a no glue region. Ifa sensor measures any glue in any of these regions, the product isreported as defective and ejected.

NOTE: When verifying normal bead data, sensors are sampled on everyencoder pulse and compared to the corresponding template values. If thedata compares favorably to the template data, the product is consideredgood. If product data does not match the template, it is queued forejection.



Learn Pattern

In learn pattern mode, a valid pattern is used as a template for the rest of theproducts in the production line.

Verification ON

Sensor Menu - Inspect 1A1

1

3

2

4

Figure 81 Learn Pattern pop‐up

1. Learn pattern button

2. Learn pattern pop‐up

3. Calibrate On/Off buttons

4. Learn button (start learn)

Set the number of products to be learned in the system setup menu. If thesystem scans multiple products, there is a probability of obtaining anaccurate pattern that can be used as a template.



Learn Template

After the tolerance has been set in the Inspection Parameters menu, thetemplate is created through the Learn Pattern menu.

1. Touch the Learn Pattern button to open the Learn Pattern pop‐up.

2. Touch the Learn button and run the correct number of products throughthe machine required to build the template. These must be known goodproducts, because the template will be built from the sensor readings ofthese products.

Sensor Calibration

See Figure 81.

Some sensors can be calibrated dynamically using the Calibrate Signalbuttons in the Learn Pattern pop‐up.

‐ Touch the On button to begin calibration.

‐ Touch the Off button to end calibration.

For more details on calibration refer to the specific sensor manual.



Product Verification Analysis Methods

Accumulated Bead Length

See Figure 82 and 83 to view examples accumulated bead length settings inthe Sensor screen.

The accumulated bead length verification method provides an analysis toolto monitor too much or too little adhesive on the substrate by allowing theuser to set upper and lower limits for the total length of glue in a designatedarea called the measurement zone. A typical application is for the detectionof excessive glue that could cause a squeeze‐out. A squeeze‐out occursduring compression when excess glue seeps out of the glue flap, causing theproducts to stick together.

In using this method, the user designates the measurement zone by enteringthe start position and length of the measurement zone. The user then sets anupper and lower limit to the total amount of measured glue bead over thezone. During the inspection process, the control system adds together eachbead segment in the specified region, without consideration of the exactlocation of the segments. The product is determined to be defective if thetotal length of glue bead exceeds the upper limit or is less than the lowerlimit.

Maximum Gap Measurements

See Figures 82 and 83 to view examples maximum gap settings in theSensor screen.

The maximum gap verification method provides an analysis tool that inspectsfor gaps in the adhesive bead that exceed a user‐specified maximum. Atypical application for maximum gap verification is for the inspection ofwheel‐applied glue where railroad tracks, or broken beads are common, andwhere the critical quality control measure is to ensure that gaps in the glueare not excessive in order to ensure bond integrity.

In using this method, the user designates the measurement zone by enteringthe start position and length of the measurement zone. The user then sets amaximum gap length limit. During the inspection process, the control systeminspects over the user‐specified region, comparing each gap in the adhesivebead to the maximum limit, and without consideration of the exact location ofthe gaps and segments. The product is determined to be defective if any gapexceeds the maximum gap limit.

NOTE: For accumulated bead length and maximum gap verificationmethods there is no need to learn the pattern.



Examples of accumulated bead length and maximum gapmeasurements

Figure 82 Example 1 - Maximum gap and accumulated bead screen

1. Actual bead (black)

2. Measurements of the actual bead

3. User entered maximum gapsettings

4. User entered accumulated beadsettings

NOTE: With a maximum gap setting of 2 mm, the system would reject thisproduct based on the occurrence of a 3 mm gap. However if the maximumacceptable gap is set to 3 or higher this product would be valid. Similarly, ifthe accumulated glue minimum was set to 45 (out of a 48 mm zone), theproduct would be rejected due to the total measured glue length of 41 mm.

Figure 83 Example 2 - Maximum gap and accumulated bead measurement



Link Product Verification to Pattern Generation

This feature can be used to automatically set inspection parameters basedon the pattern programmed on a linked pattern channel.

Figure 84 An example of a Normal bead linktogun menu

To link a sensor channel to a pattern channel:

1. Touch the Link to Gun button.

NOTE: This button normally displays Manual.

2. Select the linked pattern channel. Only channels on the same controlmodule can be linked together, and only normal, dotted and stitchedpattern types can be linked to sensors.

NOTE: The inspection tools and parameters are set automatically basedon the linked pattern program.

Monitor Sensors

The Monitor button on the Main Menu opens the Monitor screen, where up tofour sensors can be displayed simultaneously.



Job Status

The Job Status button on the Main Menu screen presents an overview of thecurrent job.

Depending on the counters assigned, the Job Status screen shows theSetup, Run and Total counts for each assigned counter. Refer to JobReports and Counters given later.

Figure 85 Job status screen

Ending a Job

Touch the End Job button on the Job Status screen to end a production run.A production report is automatically created and saved to an installed USBdrive or to the touch‐screen panel's Compact Flash drive.

Job Reports and Counters

Job reports are created anytime an active job ends.

NOTE: An active job ends anytime a new job is created or a saved job isopened.

The job report as well as the Job Status screen uses the assigned countersto present and save meaningful production data. Counters are assignedthrough System Setup Page 3 > Counter Assignment and Batch SettingsWhen these menus are used, a trigger input gets assigned to the followingcounters:

� Feed Count

� Delivery Count

� Post Eject Count

� Batch Count

NOTE: Reject counts in an inspection system are based on the assignedpreeject trigger, when used.



At the end of the job, a detailed production report is created that includes allof the shown counters in the job status menu as well as the counts for eachgun and sensor. The job report is saved to a file that can be imported intoMicrosoft Excel using a template that is saved with the Job report. A sampleproduction report is shown below:

Figure 86 Sample production report



Setup the Ejector

The ejector is set up using the Reject Control button on the Main Menuscreen, see Figure 87.

Select from the following type of ejectors that are supported by the controlsystem:

� Rotary ejector

� Logic interface

� Marking system

Figure 87 Reject Control button

Each ejector type has a different setup procedure. However, the rotaryejector is the most common ejector used.

Pre‐Eject Trigger

The following figure describes the rotary ejector operation.

For the most accurate and reliable ejection, always use a preeject photocell,mounted just in front of the ejector. After enabling the preeject function,select the trigger channel to be used as the preeject trigger.

Figure 88 Pre‐eject trigger operation


2. Machine direction


4. Ejector‐to‐trigger offset

5. Ejector



Teaching Tracking Distances

The distance from the photocell for each sensor and the preeject trigger isknown as the tracking distance.

Figure 89 Learn Distances pop‐up

The tracking distances must be taught using the following procedure:

1. Empty the machine of all products

2. Press the Learn Distances button on the Reject Control menu.

3. Run a single product through the entire machine from the first photocell tothe preeject photocell.

As the product passes each photocell designated for an inspectionprocess, the Learn Distances pop‐up displays a green number, indicatingthat the tracking distances are being learned.

4. If an error occurs during the teaching of tracking distances, the Learn

Distances pop‐up will turn red and the process must be repeated.

EjectorTrigger Offset

The distance between the preeject trigger and the center-line of the ejectoris known as the ejector‐trigger‐offset (ETO). This setting must be accessedthrough:Reject Control > Ejector Settings.

Batch Settings

Batch counting is used to fire an output on the machine control outputconnector once per batch. A photocell is assigned for the batch countingoperation using the System Setup >Batch Counter Setup menu. This menualso allows a delay and duration to be programmed for the firing of the batchkicking device. Each time the product count reaches the batch count, theoutput is activated once to fire the kicker. The control system also keepstrack of the number of batched produced, which can be displayed in theCounters menu as well as in the Production Reports.



Troubleshooting

WARNING! Allow only qualified personnel to perform the following tasks.Follow the safety instructions in this document and all other relateddocumentation.

This section provides quick‐reference information for diagnosing controlsystem faults. The tables depict the messages that appear on the MessageLog screen in the event of a system problem. These tables provide typicalcorrective actions for each message type. This information is also availablein the Help pages in the Message Log Screen.

If you cannot resolve the problem using the troubleshooting tables, contactyour Nordson representative for technical assistance.

Alarm Messages Alarm Message Explanation Corrective Action

Line velocity low for encoder 1Line speed is below the user specifiedminimum alarm value

N/A


N/A


N/A

ForcedGun could not be fired in time togenerate programmed pattern

Reduce line speed, increaseguntotrigger (GTO). Use faster gunsthat require less compensation and/orincrease bead or gap size.

Adhesive turned off due to shortproduct length

Trigger was shorter than patternresulting in truncated pattern

Increase trigger mask value.Check for crushed or short products.

Product jammedTrigger stayed activated for a distancegreater than the programmed jamparameter

Check the line for products or debrisblocking trigger.

Queue over flowToo many products between triggerand gun

Move the trigger and gun closertogether or increase product pitch.

Template ending in beadThe calculated template for a sensor isending in a bead

Increase the sensor viewing area byadjusting the trigger mask or thesensortriggeroffset (STO).

Product failed max gap, accum. bead,or pattern verification

An image that does not match theInspection Parameters has beendetected

N/A

Sensor triggertoejector distance istoo small, not rejected

The distance between the ejector andthe trigger is smaller than the distancebetween the sensor trigger and theejector

Correct the ejector offset distance.

Operator rejected productThe operator ejected a product usingthe control button on touchscreenpanel

N/A

Continued...



Alarm Message Explanation Corrective Action

Machine stop due to consecutive badproducts

The maximum allowable number ofconsecutive bad products wasreached

The number of bad products can bechanged under:System Settings and Machine ControlSettings

Machine stop due to too many badproducts

The maximum allowable number ofbad products was reached

The number of bad products can bechanged under:System Settings and Machine ControlSettings.

Product failed pattern verificationProduct was deemed defective by thecontroller. Adhesive pattern onproduct was out of tolerance

Check Inspection Parameters. Ifcorrect, fix adhesive applicationproblem.

Product failed maximum gapverification

The largest gap in the adhesive wasgreater than the userselected limit


Product failed accum. beadverificationToo much bead

The total accumulated adhesive wasgreater than the userselected limit

Check Inspection Parameters.

Product failed accum. beadverificationToo little bead

The total accumulated adhesive waslesser than the userselected limit


Product failed pattern and max gapverification

The product’s adhesive pattern wasout of tolerance and there was a gap inthe adhesive that was greater than themaximum userselected limit


Product failed pattern, max gap, andaccum. beadToo much bead

There are major problems with theadhesive patterns. Adhesive is out oftolerance, there is a gap that is toolarge, and there is excessive totaladhesive on the product


Product failed pattern, max gap, andaccum. beadToo little bead

There are major problems with theadhesive patterns. Adhesive is out oftolerance, there is a gap that is toolarge, and there is too little totaladhesive on the product


Product failed pattern, max gap, andaccum. bead Too much/too little bead

There are major problems with theadhesive patterns. Adhesive is out oftolerance, there is a gap that is toolarge, and there is excessive or toolittle total adhesive on the product


Product failed pattern and accum.bead Too much bead

The product’s adhesive pattern wasout of tolerance and there wasexcessive total adhesive on theproduct


Product failed pattern and accum.bead Too much/too little bead

The product’s adhesive pattern wasout of tolerance and there wasexcessive or insufficient total adhesiveon the product


Product failed pattern and accum.bead Too little bead

The product’s adhesive pattern wasout of tolerance and there wasinsufficient total adhesive on theproduct


Continued...



Alarm Messages (contd)

Alarm Message Explanation Corrective Action

Product failed max gap and accum.bead Too much bead

There are major problems with theadhesive patterns. Adhesive is out oftolerance, there is a gap that is toolarge, and there is excessive totaladhesive on the product


Product failed max gap and accum.bead Too little bead

The product has a gap in the adhesivepattern that is greater than theuserdefined limit and insufficient totaladhesive


Product failed max gap and accum.bead Too much/too little bead

The product has a gap in the adhesivepattern that is greater than theuserdefined limit and excessive orinsufficient total adhesive


Product failed accum. bead Too much/too little bead

The product has excessive orinsufficient total adhesive


Gun fired with no gun assignmentNo gun driver parameters wereentered

Select a gun type for that outputchannel.

Fault MessagesFault Message Explanation Corrective Action

Module 1 Configuration checksumfail

The checksum of the software in flashis corrupt

Power cycle the unit. Reload orupgrade the software. If the problempersists, replace the engine board.

Module 1 Processor overload faultCPU cannot complete all tasks inallocated time

Remove processing loads from CPU.

Module 1 Unrecovered flash writefault

The unit tried to write to flash, but thenew value was corrupt

Power cycle the unit. Reload orupgrade the software. If the problempersists, replace the engine board.

Module 1 Excessive interrupts N/A N/A

Module 1 Failure of flash checksumon boot

The checksum of the software in flashis corrupt

Reload or upgrade the software. If theproblem persists, replace the engineboard

Module 1 (ISR) Bus error CPU faultPower cycle the unit. Reload orupgrade the software. If the problempersists, replace the engine board.

Module 1 (ISR) Address error CPU faultPower cycle the unit. Reload orupgrade the software. If the problempersists, replace the engine board.

Module 1 (ISR) Illegal opcode CPU faultPower cycle the unit. Reload orupgrade the software. If the problempersists, replace the engine board.

Module 1 (ISR) Divide by zero CPU faultPower cycle the unit. Reload orupgrade the software. If the problempersists, replace the engine board.

Module 1 (ISR) Uninitialized interrupt Internal faultPower cycle the unit. Reload orupgrade the software. If the problempersists, replace the engine board.

Continued...



Fault Message Explanation Corrective Action

Internal fault #12 Internal faultPower cycle the unit. Reload orupgrade the software. If the problempersists, replace the engine board.

















Continued...



Fault Messages (contd)


















Continued...
















Module 1 Bank A address loopbackfailed

Address line test on the I/O module inbank A failed

Replace the I/O bank PCA in bank A. Ifthe problem persists, replace theengine PCA.

Module 1 Bank B address loopbackfailed

Address line test on the I/O module inbank B failed

Replace the I/O bank PCA in bank B. Ifthe problem persists, replace theengine PCA.

Module 1 Bank A data loopbackfailed

Data bus test on the I/O module inbank A failed

Replace the I/O bank PCA in bank A. Ifthe problem persists, replace theengine PCA.

Module 1 Bank B data loopbackfailed

Data bus test on the I/O module inbank b failed

Replace the I/O Bank PCA in bank b. Ifthe problem persists, replace theengine PCA.

Continued...



Fault Messages (contd)


Module 1 Bank A FPGA RAM failedMemory failure in the bank A FPGAcard (accelerator PCA).

Replace the FPGA card (acceleratorPCA) in bank A.

Module 1 Bank B FPGA RAM failedMemory failure in the bank B FPGAcard (accelerator PCA).

Replace the FPGA card (acceleratorPCA) in bank B.

Module 1 FPGA A address loopbackfailed

Address test failure in the bank AFPGA card (accelerator PCA)


Module 1 FPGA B address loopbackfailed

Address test failure in the bank BFPGA card (accelerator PCA)


Module 1 Corrupt RAM error Memory test failure in module 1 Replace engine PCA in module 1.

Module 1 FPGA A data loopbackfailed

Data bus test failure in the bank AFPGA card (accelerator PCA)


Module 1 FPGA B data loopbackfailed

Data bus test failure in the bank BFPGA card (accelerator PCA)


Module 1 Engine CPLD addressloopback failed

Address test failure in module 1 Replace engine PCA in module 1.

Module 1 Engine CPLD dataloopback failed

Data bus test failure in module 1 Replace engine PCA in module 1.

Module 1 Master IO addressloopback failed

Address line test on the Master I/Omodule failed

Replace the master I/O bank PCA. Ifthe problem persists, replace theengine PCA.

Module 1 Master IO data loopbackfailed

Data bus test on the master I/Omodule failed

Replace the master I/O bank PCA. Ifthe problem persists, replace theengine PCA.

Module 1 SPI loopback failedSerial Peripheral Interface (SPI) testfailure in module 1

Replace engine PCA in module 1. Ifthe problem persists, replace powerPCA.

Lost connection to module 2Control module number 1 cannotcommunicate with control modulenumber 2.

Check Ethernet cables and SystemLink cables. Make sure that controlmodule number 2 is powered.















User Generated Event MessagesUser Event Message Explanation

Power Off Power was removed from the system

Power On Power was applied to the system.

Power On autostart enabled Power was applied to the system with

automatic pattern start.

Glue On The pattern controller was enabled.

Glue Off The pattern controller was disabled

Verification On Bead verification was enabled.

Verification Off Bead verification was disabled.

Reset the reject counter The reject counter was reset

Detection ejector control enabled The reject counter was reset

Detection ejector control disabled The ejector was disabled.

Machine stop disabled Machine stop was disabled.

Machine stop enabled Machine stop was enabled.

Sleep mode turned Off The system was taken out of sleep

mode

Sleep mode turned On The system was placed into sleep

mode.

Teach sensor Sensor number 1 was taught a good

pattern.

Abort teach sensor The teaching of sensor number 1 was

aborted.

Factory test enabled Entering the factory test mode.

Engine reset The engine was reset.

Set time and date The date and time were set.

Program saved A user program was saved to memory.

Program deleted A user program was deleted from

memory.

Program opened A user program was retrieved from

memory for use.

Engine software has been upgraded The software in the control module was

successfully upgraded.

Panel software has been upgraded The software in the operator panel was

successfully upgraded.

Warning filter settings changed The filter settings have been changed.



Warning Messages Warning Message Explanation Corrective Action

Unexpected ISR

The system has detected anunhandled interrupt of unknown origin.Some of the systems function are nolonger operational

Power cycle system. Upgrade tocurrent software. If problem persists,replace the engine board.

Module 1 Encoder 0 Intermittent ormissing signal

The system has detected an encoderthat is showing symptoms indicating abad or intermittent encoder signal

Check encoder number 1'smechanical and electricalconnections. Replace encoder and/or encodercable.




Module 1 Communications errorThe system has detected acommunications error

Check encoder number 1'smechanical and electricalconnections. Replace the Ethernet or serial cables.

Module 1 RAM errorThe RAM (internal SD or static) hasbeen corrupted

Power cycle system. Upgrade tocurrent software. If problem persists,replace engine board.

Module 1 Program checksum errorWhen loading a program, thechecksum of the program is corrupt

Delete the program and load a knowngood program or a new program.




Module 1 Watchdog timeout CPU fault

Power cycle system. Upgrade to current software.If problem persists, replace the engineboard.

Module 1 Bead memory exceededThe number of stitched, dotted, orautospot beads exceeds the memoryavailable

Increase the interval or decrease thebead size or the number of beads.

Module 1 Pgm: LS points the same Internal errorDelete the program and load a knowngood program or a new program.

Module 1 Pgm: LS incorrect order Internal errorDelete the program and load a knowngood program or a new program.

Module 1 Pgm: LS too many beads Internal errorDelete the program and load a knowngood program or a new program.

Module 1 Runup hi and low limitsconflict

Internal errorCorrect the output percentage limits tobe within bounds, or restore thesystem to factory default settings.

Module 1 Bad trigger number Internal errorDelete the program and load a knowngood program or a new program.

Continued...



Warning Message Explanation Corrective Action

Module 1 Trigger not available Internal errorDelete the program and load a knowngood program or a new program.

Module 1 Driver slot A thermal faultInternal ambient temperaturemeasured is too high to guaranteeproper operation

Lower the ambient temperaturearound the system. Lower the cycle rate on the guns.

Module 1 Driver slot A short circuitchannel 1

Gun is drawing more current thanallowed

Check the gun or gun cable for shortcircuits. Reduce the gun load. Check the gun settings (spike currentsettings and hold current settings).




Module Driver slot A short circuitchannel 3





Check gun or gun cable for shortcircuits. Reduce gun load. Check gun settings (spike currentsettings and hold current settings).

Module 1 Driver slot A open circuitchannel 1

Gun is not drawing enough current forproper operation

Check gun or gun cable for opencircuits. Check gun settings (spike currentsettings and hold current settings).






Check gun or gun cable for opencircuits.Check gun settings (spike currentsettings and hold current settings).




Module 1 Driver slot A > 100 WattsGun load is drawing more power thanallowed

Reduce gun load.Check gun settings (spike currentsettings and hold current settings).

Module 1 Driver slot A unknownboard type

Driver board is not recognized

Make sure driver number 1 is fullyseated in system. Upgrade software.Replace the driver board.

Continued...



Warning Messages (contd)


Module 1 Driver slot B thermal faultThe internal ambient temperaturemeasured is too high to guaranteeproper operation

Lower the ambient temperaturearound the system.Lower the cycle rate on the guns.

Module 1 Driver slot B short circuitchannel 1








Check gun or gun cable for shortcircuits. Reduce gun load.Check gun settings (spike currentsettings and hold current settings).




Module 1 Driver slot B open circuitchannel 1












Module 1 Driver slot B > 100 WattsGun load is drawing more power thanallowed

Reduce gun load.Check gun settings (spike currentsettings and hold current settings).

Module 1 Driver slot B unknownboard type

Driver board is not recognized

Make sure driver number 2 is fullyseated in system. Upgrade software. Replace the driver board.

Module 1 Invalid hardwareconfiguration mismatch bank 0

The FPGA card (or accelerator card)number 1 is wrong type for I/O bankinstalled

Replace FPGA card or replace I/Obank to match it.

Continued...




Module 1 Invalid hardwareconfiguration mismatch bank 1

The FPGA card (or accelerator card)number 2 is the wrong type for I/Obank

Replace FPGA card or replace I/Obank to match it.

Module 1 Invalid hardwareconfiguration no pattern bank 0

The pattern control FPGA card (oraccelerator card) is installed with nocorresponding pattern control I/O bank

Add a pattern generation I/O bank orremove the pattern generation FPGAcard.

Module 1 Invalid hardwareconfiguration no detection bank 0

The bead verification FPGA card (oraccelerator card) is installed with nocorresponding bead verification I/Obank

Add a bead verification I/O bank orremove the bead verification FPGAcard.

Module 1 Invalid hardwareconfiguration no pattern bank 1

The pattern control FPGA card (oraccelerator card) is installed with nocorresponding pattern control I/O bank

Add a pattern generation I/O bank orremove the pattern generation FPGAcard.

Module 1 Invalid hardwareconfiguration no detection bank 1

The bead verification FPGA card (oraccelerator card) is installed with nocorresponding bead verification I/Obank

Add a bead verification I/O bank orremove the bead verification FPGAcard.

Module 1 Invalid hardwareconfiguration no FPGA for patternbank 0

The pattern control I/O bank isinstalled with no correspondingpattern control FPGA card (oraccelerator card)

Add a pattern generation FPGA cardor remove the pattern generation I/Obank.

Module 1 Invalid hardwareconfiguration no FPGA for detectionbank 0

The bead verification I/O bank isinstalled with no corresponding beadverification FPGA card (or acceleratorcard)

Add a bead verification FPGA card orremove the bead verification I/O bank.

Module 1 Invalid hardwareconfiguration no FPGA for patternbank 1

The pattern control I/O bank isinstalled with no correspondingpattern control FPGA card

Add a pattern generation FPGA cardor remove the pattern generation I/Obank.

Module 1 Invalid hardwareconfiguration no FPGA for detectionbank 1

The bead verification I/O bank isinstalled with no corresponding beadverification FPGA card (or acceleratorcard)

Add a bead verification FPGA card orremove the bead verification I/O bank.

Module 1 Invalid hardwareconfiguration no master bank

None of the modules have a masterI/O bank. A master I/O bank isrequired to provide encoder signals,remote I/O, and a serial port to thesystem

Add a master I/O bank to modulenumber 1. Module number 1 is the firstcontrol module in the system link.

Module 1 Factory test jumperinstalled

The factory test jumper plugged intoX15 on the engine board

Remove jumper for normal operation.If no jumper present, replace engineboard.

Module 1 Real time cloak ram failedRAM test failed on the memorylocated inside the real time clockdevice

Replace the real time clock device.

Module 1 Bank A address loopbackfailed

Self diagnostics detected a problem inI/O bank A

Check connections between bank Aand engine board.Replace bank A. Replace engine board if system stilldoes not pass test.

Continued...





Module 1 Bank B address loopbackfailed

Self diagnostics detected a problem inI/O bank B

Check connections between bank Band engine board. Replace bank B. Replace engine board if system stilldoes not pass test.

Module 1 Bank A data loopbackfailed

Self diagnostics detected a problem inI/O bank A

Check connections between bank Aand engine board. Replace bank A. Replace engine board if system stilldoes not pass test.

Module 1 Bank B data loopbackfailed

Self diagnostics detected a problem inI/O bank B

Check connections between bank Band engine board. Replace bank B.Replace engine board if system stilldoes not pass test.

Module 1 Bank A FPGA RAM failedSelf diagnostics detected a problem inbank A's FPGA card (or acceleratorcard) memory

Check connections between bank A'sFPGS card and Engine board.Replace bank A's FPGA card. Replace engine board if system stilldoes not pass test.

Module 1 Bank B FPGA RAM failedSelf diagnostics detected a problem inbank B's FPGA card (or acceleratorcard)

Check connections between bank B'sFPGA card and engine board.Replace bank B's FPGA card.Replace engine board if system stilldoes not pass test.

Module 1 Ram disk checksum failed Internal errorPower cycle the system. If the problempersists, restore the system to factorydefault settings.

Module 1 Unassigned encoder Internal errorDelete the program and load a knowngood program or a new program.

Module 1 FPGA A address loopbackfailed

Self diagnostics detected a problem inbank A's FPGA card (or acceleratorcard) memory

Check connections between bank A'sFPGA card and engine board. Replace bank A's FPGA card. Replace engine board if system stilldoes not pass test.

Module 1 FPGA B address loopbackfailed

Self diagnostics detected a problem inbank B's FPGA card (or acceleratorcard) memory

Check connections between bank B'sFPGA card and engine board. Replace bank B's FPGA card. Replace engine board if system stilldoes not pass test.

Module 1 FPGA A data loopbackfailed

Self diagnostics detected a problem inbank A's FPGA card (or acceleratorcard) memory

Check connections between bank A'sFPGA card and engine board. Replace bank A's FPGA card. Replace engine board if system stilldoes not pass test.

Module 1 FPGA B data loopbackfailed

Self diagnostics detected a problem inbank B's FPGA card (or acceleratorcard) memory

Check connections between bank B'sFPGA card and engine board. Replace bank B's FPGA card.Replace engine board if system stilldoes not pass test.

Module 1 Engine CPLD addressloopback failed

Self diagnostics detected a problem inthe engine's CPLD circuit

Replace engine board.

Continued...




Module 1 Engine CPLD dataloopback failed

Self diagnostics detected a problem inthe engine's CPLD circuit

Replace engine board

Module 1 Master IO addressloopback failed

Self diagnostics detected a problem inthe master I/O bank

Check connections between masterI/O bank and engine board. Replace master bank. Replace engine board if system stilldoes not pass test.

Module 1 Master IO Data loopbackfailed

Self diagnostics detected a problem inthe master I/O bank

Check connections between masterI/O bank and engine board. Replace master I/O bank. Replace engine board if system stilldoes not pass test.

Module 1 Bad encoder N/A N/A

Module 1 Power supply IO shortThe 24V I/O power supply isoverloaded

Check for shorts on external devicesthat use 24 VDC from the system.Replace power board.

Module 1 Corrupt image bufferThe buffer containing bead imageshas been corrupted

No action required. The images in thebuffer were lost and the buffer hasbeen reinitialized.

Module 1 Invalid image sizeThe image size reading obtained fromthe FPGA card (or accelerator card) iscorrupt

Check connections between thebanks, FPGA card, and engine board.Upgrade software and FPGA code.Replace FPGA card if problempersists.

Module 1 Real time clock batteryfailed

Real time clock device internal batterydead

Replace the real time clock device.

Module 1 Encoder 1 Changed fromquad to none

The quadrature encoder wasdisconnected

Make sure the encoder change wasintentional. If not, replace encodercable and/or master I/O bank module,and/or control module.

Module 1 Encoder 1 Changed fromquad to single phase

The encoder was changed fromquadrature to single phase

Make sure the encoder change wasintentional. If encoder type does notmatch what is installed, replaceencoder cable and/or master I/O bankmodule, and/or control module.

Module 1 Encoder 1 Changed fromsingle phase to quad

The encoder was changed from singlephase to quadrature


Module 1 Encoder 1 Changed fromsingle phase to none

The singlephase encoder wasdisconnected

Make sure the encoder change wasintentional. If encoder type does notmatch what is installed, replaceencoder cable and/or Master I/O bankmodule, and/or control module.

Module 1 Encoder 2 Changed fromquad to none

The quadrature encoder wasdisconnected

Make sure the encoder change wasintentional. If not, replace encodercable and/or master I/O bank module,and/or control module.

Continued...





Module 1 Encoder 2 Changed fromquad to single phase

The encoder was changed fromquadrature to single phase


Module 1 Encoder 2 Changed fromsingle phase to quad

The encoder was changed from singlephase to quadrature


Module 1 Encoder 2 Changed fromsingle phase to none

The singlephase encoder wasdisconnected


Module 1 Encoder 1 Changed fromnone to quad

A quadrature encoder was connectedto the encoder number 1 input


Module 1 Encoder 1 Changed fromnone to single phase

A single phase encoder wasconnected to the encoder number 1input


Module 1 Encoder 2 Changed fromnone to quadrature

A quadrature encoder was connectedto the encoder number 2 input


Module 1 Encoder 2 Changed fromnone to single phase

A single phase encoder wasconnected to the encoder number 2input


Module 1 Power supply changed Power supply ID has changedMake sure the change was intentional.If not, replace power board and/orengine board.

Module 1 Gun driver A changedA different type gun driver wasinstalled in the first driver position

Make sure the change was intentional.If the driver type does not match whatwas installed, make sure driver is fullyseated and/or replace driver board.

Module 1 Gun driver B changedA different type gun driver wasinstalled in the second driver position

Make sure the change was intentional.If the driver type does not match whatwas installed, make sure driver is fullyseated and/or replace driver board.

Continued...




Module 1 Invalid scratch flashAn error occurred when saving theconfiguration to the on board flashmemory

Power cycle the system. If the problempersists, restore the system to factorydefault settings.

Module 1 Previous changes to flashnot saved

On power up, the system detected thatthere were changes to the system thatdid not get saved prior to poweringdown

Allow more time to save changesbefore removing power.

Module 1 Error formatting CF cardAn error occurred when trying to lowlevel format the Compact Flash card

Verify that the Compact Flash card isin the module. Replace theCompactFlash with another card.

Module 1 Unable to open CF cardTheCompact Flash card could not befound

Verify that theCompact Flash card is inthe module. Replace theCompactFlash with another card.

Module 1 Unable to format CF cardAn error occurred when trying toformat the Compact Flash card


Module 1 Invalid partition on CF cardAn error occurred when trying topartition format the Compact Flashcard


Module 1 Cannot open file system onCF card

An error occurred when trying toaccess the file system on the CompactFlash card


Module 1 CF Card is not a DOS diskAn error occurred when trying toaccess the file system on the CompactFlash card

—

Module 1 Bank B trigger shortOne of the triggers in bank B isdrawing too much current

Check for shorts in the trigger cables. Replace trigger cable and/or triggerdevice.

Module 1 Bank B runup shortOne of the runup outputs in bank B isdrawing too much current

Check for shorts in the runup cables.Replace runup cable and/or runupdevice.

Module 1 Bank A primary powershort

— —

Module 1 Bank A bead sensor 1/2light power short

Bead sensor number 1 or number 2 inbank A is drawing too much current

Check for shorts in the bead sensorcables. Replace bead sensor cable and/orbead sensor.

Module 1 Bank A bead sensor 3/4/5light power short

Bead sensor number 3, number 4, ornumber 5 in bank A is drawing toomuch current

Check for shorts in the bead sensorcables.Replace bead sensor cable and/orbead sensor.

Module 1 Bank B primary powershort

— —

Continued...





Module 1 Bank B bead sensor 1/2light power short

Bead sensor number 1 or number 2 inbank B is drawing too much current


Module 1 Bank B bead sensor 3/4/5light power short

Bead sensor number 3, 4, or 5 in bankB is drawing too much current


Module 1 Encoder power shortThe 24V supply to the encoders isoverloaded

Check for shorts in encoder cable. Replace encoder cable and/orencoder.

Module 1 Output power shortOne of the remote outputs isoverloaded

Check for shorts on the remoteoutputs. Reduce load on remote outputs.

Module 1 Input power shortThe 24V supply used with the remoteinputs is overloaded

Check for shorts in remote I/O cableand in device driving the remoteinputs. Replace remote I/O cable and/ordevice connected to the remoteinputs.

Module 1 Light tower shortThe 24V supply to the light tower isoverloaded

Check for shorts in light tower cable. Replace light tower cable and/or lighttower.

Module 1 Bank A runup shortOne of the runup outputs in bank A isdrawing too much current

Check for shorts in the runup cables.Replace runup cable and/or runupdevice.

Module 1 Bank A trigger shortOne of the triggers in bank A isdrawing too much current

Check for shorts in the trigger cables.Replace trigger cable and/or triggerdevice.

Module 1 External Flash write timedout

A write failed to the flash memory onthe engine board

Try to save data again (if userprogram). Power cycle unit. If warningreturns, replace the engine board.

Module 1 ISR OC thresholdexceeded

More bead processing interruptsoccurred than the CPU can keep upwith

Slow the line speed down, reduce thenumber of beads, or increase stitchingor dotting interval.

Module 1 Software is not compatiblewith FPGA A rev

FPGA board (accelerator board) in topslot needs upgrading

Upgrade software in unit.

Module 1 Software is not compatiblewith FPGA B rev

FPGA board (accelerator board) inbottom slot needs upgrading

Upgrade software in unit.

Module 1 Software is not compatiblewith bank A rev

Bank A’s CPLD firmware is notcompatible with the software

Replace bank A’s I/O bank.

Module 1 Software is not compatiblewith bank B rev

Bank B’s CPLD firmware is notcompatible with the software

Replace bank B’s I/O bank.

To be used later Not defined Call Nordson technical support.

Continued...




Module 1 SPI loopback failedSerial Peripheral Interface (SPI) testfailed

Replace the 34pin ribbon cablebetween engine and power board. Ifproblem persists, replace the engine.If warning still persists, replace thepower board.

Module 1 Preeject trigger occurredafter eject confirm

— —

Module 1 Preeject trigger occurredbefore sensor trigger

The preeject trigger should alwaysoccur before the ejectconfirm trigger

Make sure the settings and triggerassignments are correct for thepreeject and ejectconfirm triggers.

Module 1 Preeject trigger too close tolast sensor

Control module requires a minimumdistance between bead sensortriggers and the preeject trigger

Move preeject trigger fartherdownstream on the machine.

Module 1 Software is not compatiblewith engine CPLD rev

Firmware in master I/O Bank CPLD isnot compatible with the currentsoftware

Replace the master I/O Bank board.

Module 1 Software is not compatiblewith master IO bank rev

Firmware in master I/O bank CPLD isnot compatible with the currentsoftware

Replace master I/O bank board.

Module 1 Compact flash interfacefailed internal test

Internal Compact Flash selftest failedReplace the Compact Flash card. Ifwarning persists, replace the engineboard.

Module 1 Compact flash failed fileread/write test

Compact Flash failed file read/writetest

Replace Compact Flash card. Ifwarning persists, replace engineboard.

A master bank is installed on a slaveunit

Only module #1 should have a MasterI/O Bank installed

Check the system link cabling andmake sure that the control module withthe master I/O bank is the first modulein the chain.

Module 1 System link disconnectedor has a fault

Problem detected with system linkboard in module number 1

Check the system link cabling andmake sure that the control module withthe master I/O bank is the first modulein the chain. If problem persists,replace the system link board/cables.

Module 1 ISR IC threshold exceededMore trigger processing interruptsoccurred than the CPU can keep upwith

Slow the line speed down. Increaseproduct pitch.

Module 1 ISR forward thresholdexceeded

Excessive forward/backward motiondetected

Reduce backlash on encoder.

Module 1 ISR reverse thresholdexceeded

Excessive forward/backward motiondetected

Reduce backlash on encoder.

Module 1 ISR bead thresholdexceeded

More bead processing interruptsoccurred than the CPU can keep upwith

Slow the line speed down. Decreasethe number of beads on the product.

Module 1 119 Internal fault Call Nordson technical support.

Continued...





Module 1 Unknown code (0) Internal fault Call Nordson technical support.








To be used later Internal fault Call Nordson technical support.

Panel is reporting corrupt software.Bad CRC

Software bits in the panel do notcorrespond

Upgrade the panel software.Reprogram the panel’sCompact Flashcard (DO NOT reformat this card)with an external programmer.



Parts List

Master Modules Part Number Description

1053710 4 channel pattern master, UGD

1067345 4 channel pattern master, LVD

1053711 8 channel pattern master, UGD / UGD

1067346 8 channel pattern master, UGD / LVD

1067347 8 channel pattern master, LVD / LVD

1053712 6 channel verification master

1067361 6 channel verification Logic master

1053713 12 channel verification master

1067362 12 channel verification Logic master

1053715 4 channel pattern & 6 ch verification combination master,UGD

1067360 4 channel pattern & 6 ch verification combination Logicmaster, UGD

1067348 4 channel pattern & 6 ch verification combination Logicmaster, LVD

1067349 4 channel pattern & 6 ch verification combination master,LVD

Expansion Modules Part Number Description

1053716 4 channel pattern expansion, UGD

1067363 4 channel pattern expansion, LVD

1053718 8 channel pattern expansion, UGD

1067364 8 channel pattern expansion, UGD / LVD

1067365 8 channel pattern expansion, LVD / LVD

1053719 6 channel verification expansion

1053720 12 channel verification expansion

1053721 4 channel pattern & 6 channel verification combinationexpansion, UGD

1067366 4 channel pattern & 6 channel verification combinationexpansion, LVD



Data Communication Cables and Accessories Part Number Description

1066052 Cable, Ethernet, 2m





1034149 Control module system link connection or ext, 4.4 m,multi‐module systems only

1078614 Control module system link connection or ext, 15 m,multi‐module systems only

1091421 Control module system link connection or ext, 1.5 m,multi‐module systems only

1078615 Control module system link connection or ext, 50 ft,multi-module systems only

Touch‐screen Panel Part Number Description

1082706 XGA touch‐screen module w/ 5 m power cable

1060755 Cable, 24V ext., 5 m (16.4 ft), for touchscreen

1057332 Kit, panel pivot wall mount

7302679 Holder for touchscreen, VESA mount

Accessories Part Number Description

1068176 Connector kit

1059609 Remote purge box (2 pattern banks) 8 channel

1098889 Wireless remote purge kit, 8 channel

1060380 Light tower w/siren

1059621 Light tower extension cable

1062957 Siren

1063802 Siren box splitter cable

1059607 Cable, remote I/O, pigtails, 5 m

1034147 Cable, ext, remote I/O, 4.4 m

1063801 Machine stop relay adapter

377227 Encoder repeater splitter cable (4 pin to 2 x 12 pin)

377228 Encoder repeater extension



Applicator Cables - Electric Applicators

Part Number Description

7302530 Cable, LA825/LA820, 2.5 m (new conn on 820)

7302531 Cable, LA825/LA820, 5 m (new conn on 820)

7302330 Cable, LA825/LA820, 7.5 m (new conn on 820)

7302532 Cable, LA825/LA820, 10 m (new conn on 820)

7302533 Cable, WM801, 2.5 m

7302534 Cable, WM801, 5 m

7302535 Cable, WM801, 10 m

1060587 Cable, LA822, 2.5 m

1059608 Cable, LA822, 5 m

1060588 Cable, LA822, 10 m

1063858 Cable, E400, 20 ft

1100667 Cable, E400, 12 m

1041835 Cable, e.dot (LogiComm to e.dot hose), 10 m

1074921 Cable, EM 100/900, 240V, 5 m

1076423 Cable, EM 100/900, 120V, 5 m

1074922 Cable, E701, 5 m

1074923 Cable, M70x/E35x‐1 coil/Sure Seal, 5 m

1075924 Splitter cable, M70x/E35x‐1 coil/Sure Seal

Applicator Cables - Pneumatic Applicators*


7302536 ClassicBlue/SolidBlue/SureBead, 2.5 m

7302537 ClassicBlue/SolidBlue/SureBead, 5 m

7302538 ClassicBlue/SolidBlue/SureBead, 10 m

1041836 MiniBlue I & II, standard with SD or SP solenoid (LogiComapplicator connector only,cable included with applicator)

7133035 MiniBlue with SG solenoid, 2 m

7165491 MiniBlue with SD or SP solenoid, 2 m





7302536 Other Pneumatic 20 x 27 mm housing solenoid, 2.5 m

7302537 Other Pneumatic 20 x 27 mm housing solenoid, 5 m


7302539 Other Pneumatic 16 x 16 mm housing solenoid, 2.5 m



*Solenoids with built in Boost must use the Low Voltage DC Driver

Solenoids with MOV caps should be replaced by: 20 x 27 mm Solenoid Cap with LED, Part 105852316 x 16 mm Solenoid Cap with LED, Part 7131860



Applicator Cables - Miscellaneous


7302542 Discrete wire, any applicator, 10 m

1059606 Cable, applicator, ext, 5 m

375353 Applicator connector

7301617 Adapter, 2 applicator splitter, series, 0.2 m

7302549 Adapter, 2 applicator splitter, parellel, 0.2 m

Encoders Part Number Description

7302430 Quadrature pkg w/ 10 m cable, bracket & small wheel (2 ppmm), metric shaft encoder

1064710 Quadrature pkg w/ 10 m cable, bracket & wheel (1.5 ppm), english shaft encoder

772050 Quadrature encoder (EPC 30-metric)

772051 Quadrature encoder (EPC 30-english)

377221 Cable, quadrature encoder, 5 m

7301432 Cable, quadrature encoder, 10 m

372759 Cable, ext, encoder, 5 m

7302371 Friction wheel, 10mm diameter x 250 mm circumference,rubber

311453 Friction wheel, 10 mm diameter x 500 mm circumference,rubber

311454 Friction wheel, 10 mm diameter x 500 mm circumference,metal

296144 Friction wheel, 3/8 in. diameter x 500 mm circumference,rubber

Photocell Part Number Description

7302981 LA650 photocell, laser

7303071 Bracket, LA650, vertical drop bar

7303072 Bracket, LA650, horizontal drop bar

7301645 Basic drop bar with photo eye bracket

738443 Photocell, PZ with 0.3 m pigtail

377269 Photocell kit, fiber optic, 2 m cable

313376 Bracket, fiber optic photocell

738463 Cable, ext, photocell, 3 m





7302375 Adapter, photocell to sensor input



I/P Transducer Part Number Description

377188 1 in 1 out (W/ 2M cable), transducer assembly

377189 1 in 2 out (W/ 2M cable), transducer assembly

377641 Cable, runup output, 5 m

377642 Cable, runup output, 10 m

377228 Cable, extension, 5m

772033 Transducer, run‐up, piston pump, DIN mount

154890 Transducer, run‐up, piston pump, DIN mount, IP66

GD200 Verification Sensor for Liquid Adhesive Part Number Description

1094546 GD 200‐S, integrated sensor

1084633 GD 200‐F with 18 inch fiber

1084634 GD 200‐F with 32 inch fiber

727142 Cable, sensor, GD 200‐F, 10 ft

1067046 Cable, sensor, GD 200‐F, 25 ft

1097296 Cable, sensor, GD 200‐S, 2.5 m

1067047 Cable, sensor, GD 200‐S, 5 m

1097297 Cable, sensor, GD 200‐S, 7.5 m

1067048 Cable, sensor, GD 200‐S, 10 m

HD‐100 Hot Melt Verification Sensor (High Speed) Part Number Description

1067705 HD‐100 package (Universal Bracket, cable and sensor)

377499 Sensor, HD‐100, hot melt

377498 Sensor, HD‐100 and 10 m cable

377500 Cable, HD‐100, 10 m

7303737 Cable, HD‐100, 30 m

1074713 Waveguide, HD100

HD‐70 Hot Melt Verification Sensor (Low Speed) Part Number Description

1091351 HD‐70 Sensor package (includes sensor, bracket, 10 mcable)

1090391 HD‐70 Sensor

1078804 Cable for HD‐70, 5 m

1078807 Cable for HD‐70, 10 m

1087199 Cable for HD‐70, 10 m right angle



Reject, Marking & Batch Control Equipment


377491 Ejector, rotary, 230VAC, CE

377490 Ejector, rotary, 400-460VAC, CE

738562 Ejector, rotary, 115VAC, CW ROT, W/MC control

727664 System, ink marking, ENVL, w/20 ft cable (US)

727119 Pusher, pnuematic (w/regulator and hose)

7302542 Cable, solenoid, 10 m

7302114 Cable, cube interface, 10 m

7302372 Cable, cube panel to encoder input, 1 m

UV Sensors Part Number Description

1054179 GD 400, UV Luminence sensor package (includes cableand drop bar assembly)

1062640 GD 400, UV Luminence sensor only

1069171 Cable for GD 400, 5 m

Other Sensors Part Number Description

1067729 Cello Position Sensor, 18 in DB package (includes cableand drop bar assembly)

1067931 Cello Position Sensor, 23 in DB package (includes cableand drop bar assembly)

1067709 Cello Presence Sensor, 18 in DB package (includes cableand drop bar assembly)

1067708 Cello Presence Sensor, 23 in DB package (includes cableand drop bar assembly)

1067704 Security Tag Sensor, 18 in DB package (includes cableand drop bar assembly)

1067707 Security Tag Sensor, 24 in DB package (includes cableand drop bar assembly)

1103811 Double sheet detector with mounting bracket

1104335 Double sheet detector without mounting bracket

727142 Cable, sensor, extension, 10 ft.

1067046 Cable, sensor, extension, 25 ft.



Barcode Sensors Part Number Description

1073415 BC5100 Smart Sensor Barcode Scanner

1091891 BC5100 Smart Sensor Barcode Scanner, Raster

1059564 Cable for BC5100 Barcode Scanner, 15 ft

1072674 Cable for BC5100 Barcode Scanner, 25 ft

727267 Basic Drop Bar Mounting Assembly

727268 Top Mount Bracket Assembly

7303367 CBC5100 Color Barcode System (includes sensor,controller, encoder pkg and cables)

GD500 Sensors Part Number Description

7303180 GD 500 Smart Sensor

7302954 Cable for GD 500, 7 m

7303034 Bracket for wheels, straight, GD‐500

7303036 Rectangular bracket

7303223 Straight‐line bracket assembly

7302562 GD 500 Corrugated System with control box (includessensor, controller, and cables)




Technical Data A-1


Appendix ATechnical Data

System Specifications

Operating Conditions

Item Specification

Ambient temperaturerange

32-104� F (0-40� C)

Enclosure ratingIP30

Humidity 5-95% non‐condensing

Non‐Operating Conditions

Item Specification

Ambient temperaturerange

‐86-185� F (‐30-85� C)

Humidity 5-95% non‐condensing

Technical DataA-2


Power Supply

Item Specification

Input voltage 100-240 V, 48-62 Hz, 3A (maximum)

System output voltages24 VDC (for remote I/O, tip seal, triggercircuits, encoders, and pressure transducers)

Performance

Item Specification

Maximum operationalline speed

1200 m/min (3937 ft/min)

Bead programmingresolution

0.25 mm

Gun outputs4 or 8 gun output per control module(64 maximum per system)

Gun drivers

Universal gun driver: 80 W maximum per four guns (160 W per control module) Auto‐configuring of driver parameters.

24 VDC gun driver: 80 W per control module, 60 W per maximumgun output.

Reduce the total available power by 9.5 W forevery GD‐100/GD‐200 sensor used.

Gun compensationrange

0-500 mm in 0.1 mm steps at a given speed, or0.0-50.0 mS in 0.1 mS

Number of encoders Two

Encoder typessupported

Single‐ended NPN single‐phase anddifferential quadrature encoders.

Verification channels6 or 12 per control module (up to 96 sensorsper system).

Pressure output2 or 4 per control module (up to 32 per system)each with multipoint curves.

Number of productsensor inputs

4 to 8 per control module (up to 64 per system).

PNP or NPN type.

Minimum number ofstored programs

50 programs.

Maximum number ofbead intervals perchannel

8 beads per programmed channel output.

Technical Data A-3


Connector Pin Layout

For information on connectors and connecting devices, refer to CableConnections in Installation.

The view of all the connectors shown in the drawings is from the panel side.

System Link Connectors

System Link Input

Pin Signal

1 Global reset input

2 Node ID 0

3 Node ID 1

4 Node ID 2

5 Common

6 Global trigger input 1




10 Encoder number 1, quadrature input B

11 Common

12 Encoder number 1, quadrature input A/pulse input

13 Encoder number 1, pulse detection

14 Eject enable

15 Common





20 Encoder number 2, quadrature input B

21 Common

22 Encoder number 2, quadrature input A/pulse input


24 Encoder number 2, quadrature detection


Technical DataA-4


System Link Output

Pin Signal

1 Global reset output

2 Node ID 0

3 Node ID 1

4 Node ID 2

5 Common

6 Global trigger output 1




10 Encoder number 1, quadrature output B

11 Common

12 Encoder number 1, quadrature pulse output A


14 Eject enable

15 Common





20 Encoder number 2, quadrature output B

21 Common

22 Encoder number 2, quadrature pulse output A




Power Entry Connector

Panel/Hub Power

Pin Signal

1 Earth ground/PE

2 24 V common

3 24 V

12

3

1

2

3

45

Technical Data A-5


Gun Driver Output Connector

Gun Driver Output

Pin Signal

1 Gun -

2 Not used

3 Gun +

4 Chassis

Verification I/O Connectors

Trigger Input

Pin Signal

1 Not used

2 Photocell signal (NPN/PNP, consumes 8mA)

3 24 VDC

4 Common

5 Not used

Sensor Input

Pin Signal

1 24 VDC for illumination (floating supply)

2 24 VDC for sensor power

3 Calibrate output (NPN)

4 Security key number 1


6 Illumination common (floating supply)

7 Sensor common

8 Sensor input (NPN or PNP)


1

2

3

45

1

23

4

Technical DataA-6


Smart Sensor Input

Pin Signal

1 24 VDC

2 RS‐232 receive data

3 RS‐232 transmit data

4 24 VDC common

5 Trigger to sensor output (NPN)

6 Not connected

7 Sensor input number1 (NPN or PNP)

8 Not connected

9 24 VDC

10 Not connected or encoder output (NPN)

11 Sensor input number 3 (NPN or PNP)

12 Learn output (PNP)

13 24 VDC common

14 Sensor input number 2 (NPN or PNP)

15 24 VDC common

Pattern Controller I/O Connectors

Trigger Input

Pin Signal

1 Not used

2 Photocell signal (NPN/PNP, consumes 8mA)

3 24 VDC

4 Common

5 Not used

Run up Output

Pin Signal

1 Common

2 4 to 20 mA output (500 ohm load maximum)

3 0 to 10 Volt output (500 ohm load minimum)

4 24 VDC

1

2

3

4

5

6

1

2

4

3

Technical Data A-7


Remote Purge Input

Pin Signal

1 Purge gun number 1




5 5 VDC common

6 5 VDC output

Master I/O Connectors

Encoder Repeater Output

Pin Signal

1 Encoder number 1 output (NPN)

2 Common

3 Encoder number 2 output (NPN)

4 Common

Encoder Input

Pin Signal

A (1) 24 VDC

B (2) Signal A (quadrature differential)

C (3) Signal A not (quadrature differential)

D (4) Signal B (quadrature differential)

E (5) Signal B not (quadrature differential)

F (6) Common

G (7) 24 VDC

H (8) Pulse train input (NPN only)

J (9) Common

K (10) Quadrature differential encoder type (connect tocommon for quadrature differential encoders)

L (11) Pulse train encoder type (connect to common forpulse train encoders)

M (12) Common

Technical DataA-8


Light Tower

Pin Signal

1 Green light

2 Blue light

3 Yellow light

4 Red light

5 Siren

6 24 common

7 24 VDC

System Input/Output

Pin Signal

1 24 VDC

2 Remote output number 1 (24 VDC, 1A maximum)

3 24 VDC


5 24 VDC


7 24 VDC


9 Remote input number 1 (drive with 24 VDC, consumes 8mA)

10 24 VDC common


12 24 VDC common


14 24 VDC common


Technical Data A-9


System Settings

Use the settings specifications given in the following tables to set up thecontrol module.

Minimum GTO Required

The following settings show the minimum recommended distance betweenthe trigger and the gun based on maximum line speed and gun responsetime.

Line Speed(m/min.)

Gun Compensation Settings (mS)

1 2 3 4 5 10 15 20

50 7 8 8 9 10 14 18 23

100 13 15 17 18 20 28 37 45

200 27 30 33 37 40 57 73 90

300 40 45 50 55 60 85 110 135

400 53 60 67 73 80 113 147 180

500 67 75 83 92 100 142 183 225

600 80 90 100 110 120 170 220 270

700 93 105 117 128 140 198 257 315

800 107 120 133 147 160 227 283 360

900 120 135 150 165 180 255 330 405

1000 133 150 167 183 200 283 367 450

Technical DataA-10


Maximum Line Speed for Smallest Bead or Gap

The following table shows the minimum bead (or gap) recommended for agiven line speed.

For example, if your line is operating up to 600 m/min, do not program a bead(or gap) smaller than 5 mm. If you do, you might experience bead placementjitter and gun forced warnings.

NOTE: These calculations are made on the assumption that all the guns arefiring simultaneously and that the gun compensation is approximately equalfor turn on and turn off. If a single gun is firing, then the maximum line speedmay be higher than shown.

NOTE: The settings shown in the table should not be a system limitation,adjust the system settings according to your production line requirements.

Line Speed (m/min) Minimum Bead/Gap Length (mm)

120 1

240 2

360 3

480 4

600 5

720 6

840 7

960 8

1080 9

Technical Data A-11


System I/O Information

The System I/O assignments are made through:

System Setup � I/O Control

Each of the four inputs and outputs can be assigned to any of the functionsdescribed in the following tables:

Programmable Inputs

I/O Assignment Function

Not assigned This input has not function

Glue enable Turns on the pattern control function, allowing theadhesive pattern to be applied when triggered withthe line running. Functions as a hard Glue ON/OFFbutton and supersedes the button on thetouch‐screen panel.

Low level Allows a warning to be generated when a low‐leveldetector is connected to this input. This input isnormally used with the fill control output.

Tip seal input Triggers the tip‐seal output when a standard triggerinput is not used for that purpose.

Unit enable Enables the adhesive application and the bead

verification functions. Logically “ANDed” withother enable inputs.

Unit disable Logical inverse of unit enable function.

Glue Enable Turns on pattern control function (used incombination with the glue on/off panel button).

Verification enable Turns on product verification. Functions as a hardVerification On/Off button and supersedes thebutton on the touch‐screen panel.

Reset A pulse of 0.5 seconds will reset all alarms andwarnings. Equivalent to the panel resetfunction.

Ejector Ready* Used in combination with the Reject ON/OFFbutton to signal the ejector ready output and enablethe ejector output.

Master Pressure Enable Globally enables all pressure outputs.

Module 1 1A1 PressureEnable

Enables only a single pressure output(pressure channel 1A1)

Module 1 1A2 PressureEnable

Enables only a single pressure output(pressure channel 1A2)

* Indicates that the function is in development for a future software release.

Technical DataA-12


Programmable Outputs


Not assigned This input has not function

Any warning Output is on whenever a warning is generated.

Any fault Output is on whenever a fault is generated.

Any Alarm Output is on any time the alarm is on.

Ready to run Unit is powered on, no fault is present (warnings donot inhibit ready) and unit is enabled. Does notreflect the status of glue or verification on/offbuttons.

Machine stop Used to signal a stop condition to the parentmachine. Typically caused by excessive productdefects.

Feed Stop Used to control the flow of product into themachine.

Minimum Line Speed There is an output selection available for eachencoder input that indicates the line speed is abovethe programmed minimum glue setting.

Smart sensor machinestop

Used to signal a stop condition to the parentmachine. Typically caused by a single productdefect detected by a smart sensor. This is often tiedto the feed to stop products entering the line afterincorrect codes are detected.

Fill Control Used in conjunction with an automatic fillingsystem. Is active when the low level input is active.

Tip Seal Used to retract the tip seal gun tip cover.

Light Tower and Horn Outputs can be assigned to mimic each of the lighttower and alarm horn functions. The functions ofthe outputs are as follows:

� RED: LogiComm Fault

� RED flashing: LogiComm Warning

� YELLOW: Product Fault

� YELLOW flashing: Product Warning

� GREEN: Ready

� GREEN flashing: Ready/Hold

� BLUE: Ejector and verification are

enabled

� ALARM Horn (Siren): Audible Alarm

Reject Enabled Reflects the status of the ejector on/off button onthe operator panel.

Verification and RejectEnabled

Verification and the ejector are both enabled(independent of Ejector Ready input) on thetouch‐screen panel.

Continued...

Technical Data A-13



Ejector Ready* Verification is enabled on touch‐screen panel (andremote input), ejector button enabled (and EjectorReady) input is true, and line speed is above theverification minimum.

Glue Enabled Reflects the status of the glue on/off button on theoperator panel.

Verification Enabled Reflects the status of the verification on/off buttonon the operator panel.

Verification Standby Output is on when verification is enabled on thepanel (and remote input), but line speed is belowminimum verification speed.

Teaching Distances* Output is on when the system is in the process oflearning the distances in the machine.

Teaching Sensors* Output is on when any sensor is creating a templateby learning the pattern applied to a preset numberof products.

Reset* Provides a 0.5 second pulse when the reset buttonis pressed on the panel in response to an alarm,warning or fault.

Composite Output Output to signal the presence of any number ofspecific warnings.

Force output On Used to force an output to the “on” state fortesting purposes.

Mask Warning* Output to signal the presence of a specific warning.

* Indicates that the function is in development for a future software release.

Technical DataA-14



Field Software Upgrade B-1


Appendix BField Software Upgrade

Software Upgrade Procedure

The following instructions pertain to upgrading the control module software inthe field or plant environment. For expanded systems, perform thisprocedure on all the control modules simultaneously.

NOTE: All control modules that have software versions 5.000 are capable ofbeing upgraded through this procedure.

System Requirements

The following hardware and software requirements are necessary to upgradethe control module:

� Control module

� Personal computer with:

‐ Administrative privileges (Windows XP, 2000, and NT)

‐ Windows 95, 98 (second edition), ME, XP, or 2000

‐ Internet Explorer version 4.0 or later (IE 5.0 is recommended)

‐ Monitor

‐ Keyboard

‐ Compact Flash reader

‐ Compact Flash

Upgrade Setup

If the LogiComm UPG file down-loader is not already installed in thecomputer, perform the following steps:

1. Go to www.enordson.com/support.

2. Select the LogiComm link.This link will allow you to install the LogiComm UPG file down-loader, theUPG file, and the instructions.

Field Software UpgradeB-2


Installing the Software 1. Disconnect power from the control module.

2. Remove the screw that holds the compact flash securely in place.

Figure B‐1 Location of the screw

3. Eject the compact flash by pressing the eject button on the side of thecompact flash slot.

Figure B‐2 Location of the eject button

4. Insert the compact flash in the compact flash reader.

5. Start the UPG file down-loader on your computer.

6. Choose to make an engine compact flash (default).

7. Select the UPG file you wish to use. The default UPG file will be the onethat came with your UPG down-loader software.

8. Select the compact flash drive that currently holds the engine compactflash.

9. Click on Store and Verify.



10. Wait for the thumbs up to appear before you remove the compact flashfrom the reader. This will assure that the compact flash is ready.

11. Place the compact flash back into the control module and replace thescrew (removed in step 2).

12. See Figure B‐4. Place a programming jumper on each of the FPGAcards. Make sure of the following:

� the jumper is inserted on the SFLASH (not the JTAG) connector

� the small circuit board is pointing up

NOTE: Failure to do so will result in a failed upgrade. A failed upgrade due tomissing FPGA jumpers will be indicated by the internal and external LEDsrepeatedly flashing red then yellow then green after power up.

Figure B‐3 Single bank

Figure B‐4 Double bank

13. Apply power to the control module. The upgrade process will begin.

NOTE: In multi‐module systems, the expansion modules cannot begintheir upgrades until the master control module has been powered up.



Upgrade Process

The upgrade will take approximately 5 to 15 minutes depending on the typeof control module.

During the upgrade process, the red, yellow and green LEDs on the controlmodule's engine board will illuminate in the following sequence:

1. All three LEDs will illuminate at once.

2. All three LEDs will go off and the yellow LED will begin flashing. Thespeed at which the LED flashes will vary (sometimes fast andsometimes very slow). This is to indicate that the upgrade process isstill working.

3. While the yellow LED is flashing, the green LED will come on brieflythen off to indicate that the initial boot is completed and the code thatperforms the upgrade has started.

If the upgrade is successful, the yellow LED will turn off and the green LEDwill come on, and then:

1. Remove power from the control module and then remove the FPGAjumper(s).

2. Reboot the control module and the touch‐screen panel to start thepanel upgrade.



If there is an error during upgrade, the yellow LED will go off and the red LEDwill begin flashing. The number of flashes of the red LED indicate the type oferror. The number of flashes with their error types are:

Flashes Failure

1 Unknown Flash Size

2 SDRAM test

3 Boot code bad CRC

4 Upgrade flash app blank init SP or PC

5 Fast static Ram test

6 Upgrade flash app bad CRC

7 BBRAM (Warning bits)

8 Engine CPLD loopback test

9 Unknown app launch type

10 App CRC failure and no CF

11 TBD

12 TBD

13 Compact Flash Error

14 MFS Error

15 ELoader verify error

16 ELoader load error

17 External App Program Error

18 Internal App Program Error

19 Boot Program Error

20 External Bootloader Program Error

21 Internal Bootloader Program Error

22 Pattern Control FPGA Program Error

23 Bead Verification FPGA Program Error

24 Power Supply FPGA Program Error

25 Invalid FPGA Program Error

26 Unknown Program Error

27 FPGA Jumper Missing

28 Unhandled Interrupt

NOTE: In the case of an error, if the control module makes an attempt torestart, the red LED will stop flashing after a period of time.



Upgrade Process (contd)

Resuming normal operation after an error will require the FPGA jumpers andthe engine compact flash to be removed.

CAUTION! Make sure that the engine power is disconnected beforeremoving the FPGA jumper(s) or the compact flash.

If the engine upgrade is successful, and the touch‐screen panel and enginesoftware versions are different, the panel will begin its upgrade automatically.The following panel display will appear:

Figure B-5 Touch-screen panel display

3. After the touch‐screen panel upgrades itself, it will restart and runnormally.

Original copyright date 2011. Nordson and the Nordson logo are registered trademarks of Nordson Corporation.

NORDSON CORPORATION ● DULUTH, GEORGIA ● USAwww.nordson.com

Documents

LogiComm Control System with Combination Configurationemanuals.nordson.com/adhesives/English_Manuals/1105135.pdf · LogiComm2 Control System with Combination Configuration Part 1105135_01