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R E L I A B L E . L O G I C . I N N O V A T I O N .TM
LITTLE LOGIC SELECTION GUIDE
2Q 2002
(actual size of chip)
DBV DCK
DBV DCK
AHCCBTD
DBV DCK
CBTLV
DBV DCK
DBV(5) DCK(5)DCT DBV(6)
DCUDCK(6)
YEA
YZA
AUC LVC
DBV(5) DCK(5)DCT DBV(6)
DCUDCK(6)
YEA
YZA
DBV DCK
CBT AHCT
2—Overview Texas InstrumentsO
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A WINNING DESIGN IS LIKE A PUZZLE.TEXAS INSTRUMENTS GIVES YOU THE RIGHT PIECES.
Space-Saving Package Options
Quad-Gate14-pin TSSOP
33,66 mm2 Single-Gate5-pin YEA1,26 mm2
Up to 96% less space
Dual-Gate8-pin DCU11,8 mm2
Up to 35% less space
Little Logic devices from Texas
Instruments (TI) are the pieces
that help complete the design
puzzle. Their extremely small
size gives designers the ability
to greatly simplify design rout-
ing and maximize ASIC design
development. Little Logic
devices in 5-pin SOT-23, 5-pin
SC-70, 6-pin SOT-23, 6-pin
SC-70, 8-pin SM-8, 8-pin US-8
and the NanoStar™ and
NanoFree™ packages allow
designers to place a particular
gate function close to related
circuitry, shortening and sim-
plifying routes on a board. This
represents a major advance
over multiple-gate devices,
which require the routing of
multiple etches from distinct
partitions on a printed circuit
board (PCB) through one logic
device. In addition, TI’s Little
Logic devices also allow design-
ers to alter the output of an
ASIC without redesign and
manufacture, effectively
extending the life of the device
and maximizing design invest-
ment. TI’s growing line of Little
Logic products is helping
designers in almost every end-
equipment build more simple,
powerful and cost-effective
designs. If you would like more
information on how TI’s Little
Logic can help you put all your
design pieces together, call
your local TI Field Sales office
or your authorized TI distribu-
tor. Or visit our Web site at:
www.ti.com/sc/littlelogic
Little Logic Simplifies Board Layout and Offers Better Overall Performance
Simplified Routing Quick Fixes for ASICs
After
Before
High Low High
ASICLow
µP
BufferQuad Gate
14-pin
TSSOP
Single
Gate
Single
Gate
Single
Gate
Single
Gate
CONTENTSOverview 2
Little Logic Products by Performance 3Little Logic Signal Switches 4Logic Migration to 3.3-V Future 4
Selection Guide 5Single-Gate Functions 5Dual-Gate Functions 6Triple-Gate Functions 7Signal-Switch Functions 7
Cross-Reference 8Competitor Cross-Reference 8Part Number Definition 12Competitor Part Prefixes 12
Packaging 13Little Logic Packaging and Mechanical
Data 13Little Logic Package Cross-Reference 13
WCSP Design Summary 14Introduction to WCSP 14Package Data 14IR Reflow Profile 16PCB Design Guidelines 16Stencil Vitals 17Packaging Tape and Reel 17Electrical Characteristics 18Board Level Reliability Data 18Thermal Characteristics 18
Resources and Support 19On-Line Help 19Literature 19Little Logic Sample Requests 19TI Worldwide Technical Support 20
Texas Instruments Overview—3
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AHC (Advanced High-Speed CMOS)• Operating range: 2 to 5.5-V VCC• 5-ns typical tpd
SN74AHC1G00 SN74AHC1G14
SN74AHC1G02 SN74AHC1G32
SN74AHC1G04 SN74AHC1G86
SN74AHC1GU04 SN74AHC1G125
SN74AHC1G08 SN74AHC1G126
AHCT (Advanced High-Speed CMOS)• Operating range: 4.5 to 5.5-V VCC• 4.7-ns typical tpd
SN74AHCT1G00 SN74AHCT1G32
SN74AHCT1G02 SN74AHCT1G86
SN74AHCT1G04 SN74AHCT1G125
SN74AHCT1G08 SN74AHCT1G126
SN74AHCT1G14
SN74LVC1G00
SN74LVC1G02
SN74LVC1G04
SN74LVC1GU04
SN74LVC1G06
SN74LVC1G07
SN74LVC1G08
SN74LVC1G14
SN74LVC1G17
SN74LVC1G18
SN74LVC1G32
SN74LVC1G66
SN74LVC1G79
SN74LVC1G80
SN74LVC1G86
SN74LVC1G125
SN74LVC1G126
SN74LVC1G240
SN74LVC2G00
SN74LVC2G02
SN74LVC2G04
SN74LVC2GU04
SN74LVC2G06
SN74LVC2G07
SN74LVC2G08
SN74LVC2G14
SN74LVC2G17
SN74LVC2G32
SN74LVC2G34
SN74LVC2G53
SN74LVC2G66
SN74LVC2G74
SN74LVC2G79
SN74LVC2G80
SN74LVC2G86
SN74LVC2G125
SN74LVC2G126
SN74LVC2G157
SN74LVC2G240
SN74LVC2G241
SN74LVC3G04
SN74LVC3GU04
SN74LVC3G06
SN74LVC3G07
SN74LVC3G14
SN74LVC3G17
SN74LVC3G34
LVC (Low Voltage CMOS)• Operating range: 1.65 to 5.5-V VCC• 2.1-ns typical tpd
LITTLE LOGIC PRODUCTS BY PERFORMANCE
SN74AUC1G00
SN74AUC1G02
SN74AUC1G04
SN74AUC1GU04
SN74AUC1G06
SN74AUC1G07
SN74AUC1G08
SN74AUC1G14
SN74AUC1G17
SN74AUC1G32
SN74AUC1G66
SN74AUC1G79
SN74AUC1G80
SN74AUC1G86
SN74AUC1G125
SN74AUC1G126
SN74AUC1G240
SN74AUC2G00
SN74AUC2G02
SN74AUC2G04
SN74AUC2GU04
SN74AUC2G06
SN74AUC2G08
SN74AUC2G14
SN74AUC2G17
SN74AUC2G32
SN74AUC2G34
SN74AUC2G53
SN74AUC2G66
SN74AUC2G74
SN74AUC2G79
SN74AUC2G80
SN74AUC2G86
SN74AUC2G125
SN74AUC2G126
SN74AUC2G157
SN74AUC2G240
SN74AUC2G241
SN74AUC3G04
SN74AUC3GU04
SN74AUC3G06
SN74AUC3G07
SN74AUC3G14
SN74AUC3G17
SN74AUC3G34
AUC (Advanced Ultra-Low Voltage CMOS)• Operating range: 0.8 to 2.7-V VCC• 2.0-ns typical tpd
Performance Comparisons
Operating Optimized Propagation Output InputVoltage Range Voltage Delay - tpd Drive Tolerance IOFF
Family (V) (V) (typ) (ns) (mA) (V) Protection
AUC 0.8 to 2.7 1.8 2.0 8 3.6 Yes
LVC 1.65 to 5.5 3.3 3.5 24 5.5 Yes
AHC 2.0 to 5.5 5.0 5.0 8 5.5 No
AHCT 4.5 to 5.5 5.0 5.0 8 5.5 No
CBT 4.5 to 5.5 5.0 0.25† –‡ 5.5 Yes
CBTD 4.5 to 5.5 5.0 0.25† –‡ 5.5 Yes
CBTLV 2.3 to 3.6 3.3 0.25† –‡ 3.6 Yes
†The progagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltagesource (zero output impedance). The value listed is a maximum.
‡The FET switch has no output drive. The drive current at the output terminal is determined by the drive current of the device connected at the input terminal of the FET switch.
4—Overview Texas InstrumentsO
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LOGIC MIGRATION TO 3.3-V FUTUREAs portable electronics design-ers look to extend battery life,operating voltages decrease. TImakes the migration to loweroperating system voltages
simple by offering numerouslogic technologies with mixedvoltage operation from 5.0-V to0.8-V. The above chart repre-sents TI’s logic technology
offering in Little Logic atvarious operating voltages andpropagation delays.
Technology Advancement
Su
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olt
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e (
VC
C)
5
4
3.3 V
2.5 V
1.8 V
1.5 V1.2 V
0.8 V
3
2
1
0
AHC—13.0 ns
LVC—4.2 ns
LVC—5.2 ns
AUC—1.9 ns
5 V
LVC—2.5 ns
AUC—2.5 ns
AUC—2.2 ns
AUC—3.3 ns
AUC—5.0 ns
+
+
+
+
+
+
+
AHC— 8.5 ns
AHCT—8.5 ns
LVC—3.7 ns
LITTLE LOGIC SIGNAL SWITCHES
CBT (Bus Switch)• Operating range: 4-V to 5.5-V VCC• 0.25-ns typical tpdSN74CBT1G125 SN74CBT1G384SN74CBTD1G125 SN74CBTD1G384
CBTLV (Low Voltage Bus Switch)• Operating range: 2.3-V to 3.6-V VCC• 0.25-ns typical tpdSN74CBTLV1G125
LVC (Low Voltage CMOS)• Operating range: 1.8-V to 5.5-V VCC• 2.1-ns typical tpdSN74LVC1G66 SN74LVC2G66
AUC (Advanced Ultra-Low-VoltageCMOS)• Operating range: 0.8-V to 2.7-V VCC• 2.1-ns typical tpdSN74AUC1G53 SN74AUC1G66SN74AUC2G66
The LVC1G66 can be used forsimple translation from 5-VTTL levels to LVTTL. Thecontrol pin is tolerant to 5.5 Vand, with a maximum ron of
LVC1G66 TTL-to-LVTTL Level Shifter15 Ω at VCC = 3.3 V, the volt-age drop across the switch isonly 0.36 V with 24 mA ofthrough current.
Visit www.ti.com/sc/littlelogic for the Application Report,Choosing the Right TI Signal Switch.
GND B A
VCCC
LVC1G66
3.3 V
LVTTL
5-V TTL
Signal
Texas Instruments Selection Guide—5
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SINGLE-GATE FUNCTIONSPerformance Package
Function Description AHC AHCT LVC AUC DBV DCK YEA* YZA*
1G00 Single 2-Input NAND Gate A A A A A A A A
1G02 Single 2-Input NOR Gate A A A A A A A A
1G04 Single Inverter A A A A A A A A
1GU04 Single Inverter (Unbuffered) A A A A A P P
1G06 Single Inverter Buffer/Driver With Open Drain Output A A A A P P
1G07 Single Buffer/Driver With Open Drain Output A A A A A A
1G08 Single 2-Input AND Gate A A A A A A A A
1G14 Single Schmitt Trigger Inverter A A A A A A A A
1G17 Single Schmitt Trigger Buffer A A A A P P
1G18 1 of 2 Non-Inverting Mux P P P P P P
1G32 Single 2-Input OR Gate A A A A A A A A
1G66 Single Analog Switch A A A A A A
1G79 Single D-Type Flip-Flop (Q Output) A P A A A A
1G80 Single D-Type Flip-Flop (Q_
Output) A P A A P P
1G86 Single 2-Input Exclusive-OR Gate A A A P A A A A
1G125 Single Bus Buffer Gate With 3-State Output A A A A A A P P
1G126 Single Bus Buffer Gate With 3-State Output A A A A A A P P
1G240 Single Buffer/Driver With 3-State Output A A A A P P*YEA and YZA (NanoStar and NanoFree) are only active in LVC and AUC technologies. A = Available P = Planned*YZA (NanoFree) is the lead-free version of NanoStar.NOTE: Visit www.ti.com/sc/littlelogic for product release updates. Information above valid as of July 2002.
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45
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45
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45
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45
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5 4
3211G00
AHCAHCTLVCAUC
AHCAHCT
AHCAHCT
AHCAHCT
AHCAHCT
AHCAHCT
AHCAHCT
AHCAHCT
1G17
1G06 1G07
1G126 1G240
1G32
1G86 1G125
1G02 1G04/1GU04
1G08
1G79
5 4
321
DD
CQ
CLK
1G80
C
CLKDD
Q
AHCAHCT
1G14
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LVCAUC
LVCAUC
LVCAUC
LVCAUC LVC
AUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
5 46
321
1G18
LVC
LVCAUC
1G66
45
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Single-Gate Diagrams
6—Selection Guide Texas InstrumentsO
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DUAL-GATE FUNCTIONSPerformance Package
Function Description LVC AUC DBV (6) DCK (6) DCT DCU YEA* YZA*
2G00 Dual 2-Input NAND Gates A P A A P P
2G02 Dual 2-Input NOR Gates A P A A P P
2G04 Dual Inverters A P A A P P
2GU04 Dual Inverters (Unbuffered) A P A A P P
2G06 Dual Inverter Buffer/Drivers With Open Drains A P A A P P
2G07 Dual Non-Inverters With Open Drains A P A A P P
2G08 Dual 2-Input AND Gates A P A A P P
2G14 Dual Schmitt Trigger Inverters A P A A P P
2G17 Dual Schmitt Trigger Input Buffers A A A P P
2G32 Dual 2-Input OR Gates A P A A P P
2G34 Dual Buffer Gates A P A A P P
2G53 Dual Analog Mux/Demuxes A P A A A A
2G66 Dual Analog Switches A P A A A A
2G74 Single Positive Edge Triggered D-Type Flip-Flop A P A A P P
With Clear & Reset
2G79 Dual D-Type Flip-Flop (Q Output) P P P P P P
2G80 Dual D-Type Flip-Flop (Q_
Output) P P P P P P
2G86 Dual 2-Input Exclusive-OR Gates A P A A P P
2G125 Dual Bus Buffer Gate With 3-State Outputs A P A A P P
2G126 Dual Bus Buffer Gate With 3-State Outputs A P A A P P
2G157 Single 2 Line-to-1 Line Data Selector/Multiplexer A P A A P P
2G240 Dual Bus Buffer Gates With 3-State Outputs P P P P P P
2G241 Dual Buffer/Drivers With 3-State Outputs A P A A P P*YEA and YZA (NanoStar and NanoFree) are only active in LVC and AUC technologies. A = Available P = Planned*YZA (NanoFree) is the lead-free version of NanoStar.NOTE: Visit www.ti.com/sc/littlelogic for product release updates. Information above valid as of July 2002.
CQS D R
2G125 2G157
2G74
4 4
4
3 3
3
2 2
2
1 1
1
5 5
5
6 6
6
7 7
7
8 8
8
2G2414321
5678
2G024321
5678
2G864321
5678
2G324321
5678LVCAUC
2G00 2G084 43 32 21 1
5 56 67 78 8
Q
2G1264321
5678
LVCAUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
LVCAUC
5 46
321
2G34
LVCAUC
5
5
46
321
2G17
2G14
46
321
LVCAUC
LVCAUC
5
55
46
321
46
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6 4
3212G06
2G07
2G04/2GU04
LVCAUC
LVCAUC
LVCAUC
YA/BG
AB Y
LVCAUC
2G664321
5678LVCAUC
2G534321
5678
Dual-Gate Diagrams
Texas Instruments Selection Guide—7
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TRIPLE-GATE FUNCTIONSPerformance Package
Function Description LVC AUC DCT DCU YEA* YZA*
3G04 Triple Inverters A P A A P P
3GU04 Triple Inverters (Unbuffered) P P P P P P
3G06 Triple Inverter Buffer/Drivers With Open Drain Outputs A P A A P P
3G07 Triple Buffer/Drivers With Open Drain Outputs A P A A P P
3G14 Triple Schmitt Trigger Inverters A P A A P P
3G17 Triple Schmitt Trigger Buffers P P P P P P
3G34 Triple Buffer Gates A P A A P P*YEA and YZA (NanoStar and NanoFree) are only active in LVC and AUC technologies. A = Available P = Planned*YZA (NanoFree) is the lead-free version of NanoStar.NOTE: Visit www.ti.com/sc/littlelogic for product release updates. Information above valid as of July 2002.
LVCAUC
LVC
3G073G063G04/3GU04444 333 222 111
555 666 777 888
3G344321
5678
3G144321
5678LVCAUC
LVCAUC
LVCAUC
3G174321
5678LVCAUC
SIGNAL-SWITCH FUNCTIONSPerformance Packaging
Function Description CBT CBTD CBTLV LVC AUC DBV (5) DCK (5) DCT DCU YEA* YZA*
1G66 Single Analog Switch A A A A P P
1G125 Single Bus Switch A A A A A P P
1G384 Single Bus Switch A A A A P P
2G53 Dual Analog Mux/Demuxes A P A A A A
2G66 Dual Analog Switches A P A A A A*YEA and YZA (NanoStar and NanoFree) are only active in LVC and AUC technologies. A = Available P = Planned*YZA (NanoFree) is the lead-free version of NanoStar.NOTE: Visit www.ti.com/sc/littlelogic for product release updates. Information above valid as of July 2002.
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1G125 1G384
CBTCBTDCBTLV
CBTCBTD
LVCAUC
2G664321
5678
LVCAUC
1G66
45
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LVCAUC
2G534321
5678
Triple-Gate Diagrams
Signal-Switch Diagrams
8—C
ross-Reference
Texas Instruments
OverviewSelection GuideCross-ReferencePackagingWCSP Design SummaryResources and Support
AHCT Devices (5-pin, unless noted)Function Company (Prefix): TI (AHCT) Toshiba (TC7SE/WT) Fairchild (NC7ST) ON (VHC1GT) STMicro (V1T)
1G00 Single 2-Input NAND Gate SN74AHCT1G00 TC7SET00 NC7ST00 MC74VHC1GT00 74V1T001G02 Single 2-Input NOR Gate SN74AHCT1G02 TC7SET02 NC7ST02 MC74VHC1GT02 74V1T021G04 Single Inverter SN74AHCT1G04 TC7SET04 NC7ST04 MC74VCH1GT04 74V1T041G08 Single 2-Input AND Gate SN74AHCT1G08 TC7SET08 NC7ST08 MC74VHC1GT08 74V1T081G14 Single Schmitt Trigger Inverter SN74AHCT1G14 MC74VHC1GT14 74V1T141G32 Single 2-Input OR Gate SN74AHCT1G32 TC7SET32 NC7ST32 MC74VHC1GT32 74V1T321G86 Single 2-Input Exclusive-OR Gate SN74AHCT1G86 TC7SET86 NC7ST86 MC74VHC1GT86 74V1T861G125 Single Bus Buffer Gate w/3-State Output SN74AHCT1G125 MC74VHC1GT125 74V1T1251G126 Single Bus Buffer Gate w/3-State Output SN74AHCT1G126 MC74VHC1GT126 74V1T126
LVC DevicesFunction Company (Prefix): TI (LVC) Toshiba (TC7S/WZ) Fairchild (NC7S/WZ) ON (VHC) STMicro (LX) Philips (LVC) IDT (LVC) Pericom (STX)
Single Gate (5-pin, unless noted)1G00 Single 2-Input NAND Gate SN74LVC1G00 TC7SZ00 NC7SZ00 NL17SZ00 74LX1G00 74LVC1G00 IDT74LVC1G00A PI74STX1G001G02 Single 2-Input NOR Gate SN74LVC1G02 TC7SZ02 NC7SZ02 NL17SZ02 74LX1G02 74LVC1G02 IDT74LVC1G02 PI74STX1G021G04 Single Inverter SN74LVC1G04 TC7SZ04 NC7SZ04 74LX1G04 74LVC1G04 IDT74LVC1G04A PI74STX1G041GU04 Single Inverter (Unbuffered) SN74LVC1GU04 TC7SZU04 NC7SZU04 NL17SZU04 74LX1GU04 74LVC1GU04 IDT74LVC1GU04A PI74STX1GU041G06 Single Inverter Buffer/Driver w/Open Drain SN74LVC1G06 TC7SE05 NC7SZ05 NL17SZ06 74LX1G05 74LVC1G06 IDT74LVC1G06A1G07 Single Buffer/Driver w/Open Drain Output SN74LVC1G07 NL17SZ07 74LX1G07 74LVC1G07 IDT74LVC1G07A1G08 Single 2-Input AND Gate SN74LVC1G08 TC7SZ08 NC7SZ08 NL17SZ08 74LX1G08 74LVC1G08 IDT74LVC1G08A PI74STX1G081G14 Single Schmitt Trigger Inverter SN74LVC1G14 NC7SZ14 NL17SZ14 74LX1G14 74LVC1G14 PI74STX1G141G17 Single Schmitt Trigger Buffer SN74LVC1G17 NL17SZ171G18 1 of 2 Non-Inverting Mux SN74LVC1G181* NC7SZ181
AHC Devices (5-pin, unless noted) For up-to-date cross-reference information, visit www.ti.com/sc/littlelogicFunction Company (Prefix): TI (AHC) Toshiba (TC7S/W) Fairchild (NC7S) ON (VHC) STMicro (V1G)
1G00 Single 2-Input NAND Gate SN74AHC1G00 TC7SH00 NC7S00 MC74VHC1G00 74V1G001G02 Single 2-Input NOR Gate SN74AHC1G02 TC7SH02 NC7S02 MC74VHC1G02 74V1G021G04 Single Inverter SN74AHC1G04 TC7SH04 NC7S04 MC74VHC1G04 74V1G041GU04 Single Inverter (Unbuffered) SN74AHC1GU04 TC7SHU04 NC7SU04 MC74VHC1GU04 74V1GU041G08 Single 2-Input AND Gate SN74AHC1G08 TC7SH08 NC7S08 MC74VHC1G08 74V1G081G14 Single Schmitt Trigger Inverter SN74AHC1G14 TC7SH14 NC7S14 MC74VHC1G14 74V1G141G32 Single 2-Input OR Gate SN74AHC1G32 TC7SH32 NC7S32 MC74VHC1G32 74V1G321G86 Single 2-Input Exclusive-OR Gate SN74AHC1G86 TC7SH86 NC7S86 MC74VHC1G86 74V1G861G125 Single Bus Buffer Gate w/3-State Output SN74AHC1G125 MC74VHC1G125 74V1G1251G126 Single Bus Buffer Gate w/3-State Output SN74AHC1G126 MC74VHC1G126 74V1G126
COMPETITOR CROSS-REFERENCE
*Preview 16-pin package
Texas Instruments
Cross-R
eference—9
OverviewSelection GuideCross-ReferencePackagingWCSP Design SummaryResources and Support
LVC Devices (Continued)Function Company (Prefix): TI (LVC) Toshiba (TC7S/WZ) Fairchild (NC7S/WZ) ON (VHC) STMicro (LX) Philips (LVC) IDT (LVC) Pericom (STX)
Single Gate (5-pin, unless noted) (Continued)1G32 Single 2-Input OR Gate SN74LVC1G32 TC7SZ32 NC7SZ32 NL17SZ32 74LX1G32 74LVC1G32 IDT74LVC1G32A PI74STX1G321G66 Single Analog Switch SN74LVC1G66 NC7SZ66 74LVC1G661G79 Single D-Type Flip-Flop (Q Output) SN74LVC1G79 74LVC1G79 IDT74LVC1G79A PI74STX1G791G80 Single D-Type Flip-Flop (Q
_Output) SN74LVC1G80 74LVC1G80
1G86 Single 2-Input Exclusive-OR Gate SN74LVC1G86 NC7SZ86 74LX1G86 74LVC1G86 IDT74LVC1G86A PI74STX1G861G125 Single Bus Buffer Gate w/3-State Output SN74LVC1G125 TC7SZ125 NC7SZ125 NL17SZ125 74LX1G125 74LVC1G125 IDT74LVC1G125A PI74STX1G1251G126 Single Bus Buffer Gate w/3-State Output SN74LVC1G126 TC7SZ126 NC7SZ126 NL17SZ126 74LX1G126 74LVC1G126 IDT74LVC1G126A PI74STX1G1261G240 Single Bus Buffer Gate w/3-State Output SN74LVC1G240Dual Gate (8-pin, unless noted)2G00 Dual 2-Input NAND Gates SN74LVC2G00 TC7WZ00 NC7WZ00 NL27WZ002G02 Dual 2-Input NOR Gates SN74LVC2G02 NC7WZ02 NL27WZ022G04 Dual Inverters SN74LVC2G041 NC7WZ041 NL27WZ041
2GU04 Dual Inverters (Unbuffered) SN74LVC2GU041 NC7WZU041 NL27WZU041
2G06 Dual Inverter Buffer/Drivers w/Open Drains SN74LVC2G061 NL27WZ061
2G07 Dual Buffer/Drivers w/Open Drain Outputs SN74LVC2G071 NC7WZ071 NL27WZ071
2G08 Dual 2-Input AND Gates SN74LVC2G08 NC7WZ08 NL27WZ082G14 Dual Schmitt Trigger Inverters SN74LVC2G141 NC7WZ141 NL27WZ141
2G17 Dual Schmitt Trigger Input Buffers SN74LVC2G171 NC7WZ171
2G32 Dual 2-Input OR Gates SN74LVC2G32 TC7WZ32 NCWZ32 NL27WZ322G34 Dual Buffer Gates SN74LVC2G341
2G53 Analog Mux/Demux SN74LVC2G532G66 Dual Analog Switches SN74LVC2G66 NC7WB662G74 D-Type Flip-Flop w/Pre & CLR SN74LVC2G742 NC7SZ742 NL17SZ742G79 Dual D-Type Flip-Flop (Q Output) SN74LVC2G79*2G80 Dual D-Type Flip-Flop (Q
_Output) SN74LVC2G80*
2G86 Dual 2-Input Exclusive-OR Gates SN74LVC2G86 NC7WZ86 NL27WZ862G125 Dual Bus Buffer Gates w/3-State Outputs SN74LVC2G125 NC7WZ125 NL27WZ1252G126 Dual Bus Buffer Gates w/3-State Outputs SN74LVC2G126 NC7WZ126 NL27WZ1262G157 2-Input Non-Inverting Mux SN74LVC2G1572G240 Dual Bus Buffer Gates w/3-State Outputs SN74LVC2G240* NC7WZ2402G241 Dual Bus Buffer Gates w/3-State Outputs SN74LVC2G241 NC7WZ241Triple Gate (8-pin, unless noted)3G04 Triple Inverters SN74LVC3G04 TC7WZ04 NC7NZ04 NL37WZ043GU04 Triple Inverters (Unbuffered) SN74LVC3GU04* NC7NZU043G06 Triple Inverter Buffer/Drivers w/Open Drains SN74LVC3G06 NL37WZ063G07 Triple Buffer/Drivers w/Open Drain Outputs SN74LVC3G07 NL37WZ07
COMPETITOR CROSS-REFERENCE (Continued)
*Preview 16-pin package 28-pin package
10—
Cross-R
eferenceTexas Instrum
entsOverviewSelection GuideCross-ReferencePackagingWCSP Design SummaryResources and Support
COMPETITOR CROSS-REFERENCE (Continued)
LVC Devices (Continued)Function Company (Prefix): TI (LVC) Toshiba (TC7S/WZ) Fairchild (NC7S/WZ) ON (VHC) STMicro (LX) Philips (LVC) IDT (LVC) Pericom (STX)
Triple Gate (8-pin, unless noted) (Continued)3G14 Triple Schmitt Trigger Inverters SN74LVC3G14 NC7NZ14 NL37WZ143G17 Triple Schmitt Trigger Buffers SN74LVC3G17* NC7NZ17 NL37WZ173G34 Triple Buffers SN74LVC3G34 NC7NZ34
*Preview
AUC DevicesFunction Company (Prefix): TI (AUC) Fairchild (NC7SP) Fairchild (NC7SV) Philips (AUC)Single Gate (5-pin, unless noted)1G00 Single 2-Input NAND Gate SN74AUC1G00 NC7SP00 NC7SV00 74AUC1G00*1G02 Single 2-Input NOR Gate SN74AUC1G02 NC7SP02 NC7SV02 74AUC1G02*1G04 Single Inverter SN74AUC1G04 NC7SP04 74AUC1G04*1GU04 Single Inverter (Unbuffered) SN74AUC1GU04 NC7SPU041G06 Single Inverter Buffer/Driver w/Open Drain Output SN74AUC1G061G07 Single Buffer/Driver w/Open Drain Output SN74AUC1G071G08 Single 2-Input AND Gate SN74AUC1G08 NC7SP08 NC7SV081G14 Single Schmitt Trigger Inverter SN74AUC1G14 NC7SP14 NC7SV141G17 Single Schmitt Trigger Buffer SN74AUC1G171G18 1 of 2 Non-Inverting Mux SN74AUC1G181G32 Single 2-Input OR Gate SN74AUC1G32 NC7SP32 NC7SV32 74AUC1G32*1G66 Single Analog Switch SN74AUC1G661G79 Single D-Type Flip-Flop SN74AUC1G79*1G80 Single D-Type Flip-Flop SN74AUC1G80*1G86 Single 2-Input Exclusive-OR Gate SN74AUC1G86* NC7SP86 NC7SV861G125 Single Bus Buffer Gate w/3-State Output SN74AUC1G125 NC7SP125 NC7SV1251G126 Single Bus Buffer Gate w/3-State Output SN74AUC1G1261G240 Single Bus Buffer Gate w/3-State Output SN74AUC1G240Dual Gate (8-pin, unless noted)2G00 Dual 2-Input NAND Gates SN74AUC2G00*2G02 Dual 2-Input NOR Gates SN74AUC2G02*2G04 Dual Inverters SN74AUC2G04*2GU04 Dual Inverters (Unbuffered) SN74AUC2GU04*2G06 Dual Inverter Buffer/Drivers w/Open Drain Outputs SN74AUC2G06*2G07 Dual Buffer/Drivers w/Open Drain Outputs SN74AUC2G07*2G08 Dual 2-Input AND Gates SN74AUC2G08*2G14 Dual Schmitt Trigger Inverters SN74AUC2G14*2G17 Dual Schmitt Trigger Input Buffers SN74AUC2G17*
*Preview
Texas Instruments
Cross-R
eference—11
OverviewSelection GuideCross-ReferencePackagingWCSP Design SummaryResources and Support
COMPETITOR CROSS-REFERENCE (Continued)AUC Devices (Continued)
Function Company (Prefix): TI (AUC) Fairchild (NC7SP) Fairchild (NC7SV) Philips (AUC)Dual Gate (8-pin, unless noted) (Continued)2G32 Dual 2-Input OR Gates SN74AUC2G32*2G34 Dual Buffer Gates SN74AUC2G34*2G53 Analog Mux/Demux SN74AUC2G53*2G66 Dual Analog Switches SN74AUC2G66*2G74 D-Type Flip-Flop w/Pre & CLR SN74AUC2G74*2G79 Dual D-Type Flip-Flops SN74AUC2G79*2G80 Dual D-Type Flip-Flops SN74AUC2G80*2G86 Dual 2-Input Exclusive-OR Gates SN74AUC2G86*2G125 Dual Bus Buffer Gates w/3-State Outputs SN74AUC2G125*2G126 Dual Bus Buffer Gates w/3-State Outputs SN74AUC2G126*2G157 Mux/Demux SN74AUC2G157*2G240 Dual Bus Buffer Gates w/3-State Outputs SN74AUC2G240*2G241 Dual Bus Buffer Gates w/3-State Outputs SN74AUC2G241*Triple Gate (8-pin, unless noted)3G04 Triple Inverters SN74AUC3G04*3GU04 Triple Inverters (Unbuffered) SN74AUC3GU04*3G06 Triple Inverter Buffer/Drivers w/Open Drains SN74AUC3G06*3G07 Triple Buffer/Drivers w/Open Drain Outputs SN74AUC3G07*3G14 Triple Schmitt Trigger Inverters SN74AUC3G14*3G17 Triple Schmitt Trigger Buffers SN74AUC3G17*3G34 Triple Buffers SN74AUC3G34*
*Preview
Signal Switch DevicesFunction Company: TI Toshiba Fairchild ON STMicro Philips IDT Pericom
CBTLV1G125 Single LV FET Bus Switch SN74CBTLV1G125 PI3A125CBT1G384 Single Low Power Bus Switch SN74CBT1G384 TC7SB384 NC7SZ384CBTD1G384 384 Function w/Level Shifting SN74CBTD1G384 TC7SBD384 NC7SZD384LVC1G66 Single Analog Switch SN74LVC1G66 NC7SZ66 74LVC1G66LVC2G53 Analog Mux/Demux SN74LVC2G53LVC2G66 Dual Analog Switches SN74LVC2G66 NC7WB66AUC1G66 Single Analog Switch SN74AUC1G66AUC2G53 Analog Mux/Demux SN74AUC2G53*AUC2G66 Dual Analog Switches SN74AUC2G66*
*Preview
12—Cross-Reference Texas InstrumentsO
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Standard Prefix: 74 = Commercial
Product Families: AHC, AHCT, AUC, CBT, CBTD, CBTLV, LVC
DCU = US-8 packageDCT = SM-8 package
DCK = SC-70 packageDBV = SOT-23 package
YEA = NanoStar packageYZA = NanoFree package
Package Type:
SN74 1G 00 RAHC YEA
R = Tape & Reel
Logic Function
2G = Dual Gate1G = Single Gate 3G = Triple Gate
PART NUMBER DEFINITION
COMPETITOR PART PREFIXESTI Toshiba Fairchild ON STMicro Philips IDT Pericom
Little Logic
SN74AHC1G TC7S NC7S MC74VHC1G 74V1G
SN74AHCT1G TC7SHET NC7ST MC74VHC1GT 74V1T
SN74LVC1G TC7SZ NC7SZ NL17SZ 74LX1G 74LVC1G IDT74LVC1G P174STX1G
SN74LVC2G TC7WZ NC7WZ NL27WZ
SN74LVC3G TC7WZ NC7NZ NL37WZ
Little Logic Signal Switch
SN74CBT1G TC7SB NC7SB
SN74CBTLV1G TC7SBL
SN74LVC1G66 NC7SZ66
SN74LVC2G66 NC7WB66
NOTE: Philips and IDT are alternate source.
Texas Instruments Packaging—13
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LITTLE LOGIC PACKAGING AND MECHANICAL DATA
IMPORTANT: Texas Instruments referenced devices are believed to be pin-for-pin, mechanically interchangeable. However, TI does not guarantee that inter-changeability in a particular application is exact in all respects. Therefore, the applicable data sheet should be used to determine product interchangeability.
Little Logic4,00 mm
0,65 mm
2,95 mm
DCT DCU DBV DCK YEA/YZA YEA/YZAPackage Data 8-pin 8-pin 5- or 6-pin 5- or 6-pin 5- or 6-pin 8-pin
Length (mm) 2,95 ± 0,20 2,0 ± 0,1 2,90 ± 0,1 2,00 ± 0,15 1,40 ± 0,05 1,90 ± 0,05
Width (mm) 4,00 ± 0,25 3,1 ± 0,1 2,80 ± 0,2 2,10 ± 0,2 0,90 ± 0,05 0,90 ± 0,05
Height (mm) 1,30 0,90 1,20 0,95 0,50 0,50
Footprint Area (mm2) 11,80 6,20 8,12 4,20 1,26 1,71
Weight (gm) 0,0206 0,0095 0,0135 0,006 ≤ 0,001 0,0013
TI Toshiba Fairchild ON STMicro Philips IDT Pericom
NanoStar YEA
NanoFree YZA
SC-70-5 DCK FU P5 DF CT GW DY CX
SOT23-5 DBV F M5 DT ST GV TX
SC-70-6 DCK P6 DF
SOT23-6 DBV DT
US-8 DCU FK K8 US
SM-8 DCT FU
Little Logic3,1 mm
0,50 mm2,0 mm
Little Logic2,80 mm
0,95 mm
2,90 mm
Little Logic 2,10 mm
0,65 mm2,0 mm
1,4 mm
0,9 mm
0,5 mm
DCT (SM-8)
(Actual Size)
DCU (US-8)
(Actual Size)
DBV (SOT-23)
(Actual Size)
DCK (SC-70)
(Actual Size)
NanoStarTM
(YEA)5-pin or 6-pin
(Actual Size)
5-pin or 6-pin 5-pin or 6-pin
NanoFreeTM
(YZA)
LITTLE LOGIC PACKAGE CROSS-REFERENCE
1,9 mm
0,9 mm
0,5 mmNanoStarTM
(YEA)8-pin
(Actual Size)
NanoFreeTM
(YZA)
14—WCSP Design Summary Texas InstrumentsO
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As the marketplace continues to demand size reduc-tions in various consumer electronic products such ascell phones, PDAs, MP3/CD players and otherportable devices, the need for smaller logic packagingbecomes paramount. The major challenge of today’sdigital processing industry is the overall system costreduction as complexity and functionality increase.These marketplace forces have resulted in circuitintegration and board miniaturization becoming anecessary trend for successful competition. To addressthese rapidly evolving customer requirements, TI hasdefined the latest innovation in logic packaging:NanoStar™ and NanoFree™. This is a wafer-levelpackage and, to date, is the world’s smallest 5-, 6-and 8-pin logic solution for single- and dual-gate logicfunctions. NanoStar and NanoFree are registeredunder JEDEC MO-211, and are the only wafer-levellogic solutions available to date. NanoStar uses aneutectic SnPb ball, and NanoFree uses a Pb-free(SnAgCu) ball. Other than ball metallurgy, there is nodifference between NanoStar (package designatorYEA) and NanoFree (package designator YZA).
INTRODUCTION TO WCSP
(Bottom view)
Dimensions in millimeters (mm)
NanoStar/NanoFree
LGA
Dimensions in mm
0,950,85
DBV
3,02,6
3,02,8 DCK
2,31,9
2,151,85
1,651,55
1,51,4
1,050,95
1,451,35ESV
1,651,55
Single-Gate Comparison
SOT-23 (5-pin) SC-70 (5-pin) WCSP (5-/6-pin)Package Data TI – DBV TI – DCK ESV LGA TI – YEA/YZALength (mm) 2,90 ± 0,1 2,00 ± 0,15 1,60 ± 0,05 1,45 ± 0,05 1,40 ± 0,05Width (mm) 2,80 ± 0,20 2,10 ± 0,30 0,90 ± 0,05 1,00 ± 0,05 0,90 ± 0,05Height (mm) 1,20 ± 0,25 0,95 0,55 0,55 0,50 maxFootprint Area (mm2) 8,12 4,20 2,56 1,45 1,26Weight (gm) 0,0135 0,006 ≥ 0,003 ≥ 0,001 ≤ 0,001
Dual-/Triple-Gate Comparison
SOT-23 (6-pin) SC-70 (6-pin) SSOP (8-pin) VSOP (8-pin) WCSP (8-pin)Package Data TI – DBV TI – DCK TI – DCT TI – DCU TI – YEA/YZALength (mm) 2,90 ± 0,1 2,00 ± 0,15 2,95 ± 0,20 2,0 ± 0,10 1,90 ± 0,05Width (mm) 2,80 ± 0,20 2,10 ± 0,30 4,0 ± 0,25 3,10 ± 0,10 0,90 ± 0,05Height (mm) 1,20 ± 0,25 0,95 1,30 max 0,90 max 0,50 maxFootprint Area (mm2) 8,12 4,20 11,80 6,20 1,71Weight (gm) 0,0135 0,006 0,0206 0,0095 0,0013
A
B
GNDY
VCC
1,40
0,90 0,5Max.
1
2
34
5
PACKAGE DATA
NanoFreeTM
Texas Instruments WCSP Design Summary—15
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Package Attributes
Attribute 5-Ball 6-Ball 8-Ball
Ball Pitch (mm) 0,5 0,5 0,5
Ball Diameter (mm) 0,17 0,17 0,17
Package Length (mm) 1,4 1,4 1,9
Package Width (mm) 0,9 0,9 0,9
Package Height (mm) 0,5 max 0,5 max 0,5 max
Ball Matrix (rows, columns) 3 x 2, depopulate 1 3 x 2 4 x 2
Weight (mg) 0,995 0,998 1,30
Ball Metallurgy SnPb or Pb-Free SnPb or Pb-Free SnPb or Pb-Free
Moisture Level Level 1 @ 260ºC Level 1 @ 260ºC Level 1 @ 260ºC
PACKAGE DATA (Continued)
5-Ball Package
0,950,85
1,451,35
0,190,15
0,150,10
0,50 max
0,35 max
0,05
0,05
0,25
1,00 typ
C
B
A
1 2
0,05
0,05
Seating Plane
Pin A1 Index Area
6-Ball Package
0,950,85
1,451,35
0,190,15
0,150,10
0,50 Max.
0,35 Max.
0,05
0,05
0,25
1,00
C
B
A
1 2
0,05
0,05
Seating Plane
Pin A1 Index Area
8-Ball Package
0,950,85
1,951,85
0,190,15
0,150,10
0,50 Max.
0,35 Max.
0,05
0,05
0,25
1,50C
D
B
A
1 2
0,05
0,25
0,05
Seating Plane
Pin A1 Index Area
16—WCSP Design Summary Texas InstrumentsO
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Solder Bump Eutectic 63/37
(AI/NiV/Cu)
Nitride
AICu2 PadDie
ProtectiveOvercoat
Solder Ball Composition
0,10/0,15 mm
Sn/Pb Eutecticsolder withliquidustemperature of183ºC
1,35/1,45 L x 0,85/0,95 W (mm)
PCB
Land on PCB
NanoStar Little Logic0,5 mm Max.
0,17 mm
Package Area Configuration (0,5-mm Ball Pitch)
Note: Self-planarizing package.
0,50 mm0,50 mm
SolderPad
0,50 mm
0,117 mmTrace1,0 mm
+ + +
+ +
The PCB layout assumes 0,117-mm (4.6-mil)trace width and 1-oz. copper layer thickness.
SMD
A D
B C
NSMD
Solder Mask Defined Non-Solder Mask Defined(SMD) Pad (NSMD) Preferred Method
Solder Mask Solder MaskCopper Pad Opening Copper Pad Opening
“A” “B” “C” “D”0,350 mm 0,175 mm 0,175 mm 0,350 mm
± 0,025 ± 0,25 + 0,000/– 0,025 ± 0,025(13.8 mils) (6.9 mils) (6.9 mils) (13.5 mils)
Solder Mask and Non-Solder Mask
PCB DESIGN GUIDELINES
250
300250
200
150
Time (sec.)
200150
100
50
100500
0
Tem
pera
ture
(ºC)
Ideal Reflow Profile
Note: This data represents the 5-pin NanoStar (YEA) leaded version. This is an ideal profile, and actual conditions obtained in any specified reflow oven will vary. This profile isbased on convection or RF plus forced convection heating. For more information regarding reflow, refer to the WCSP Application Note at www.ti.com/sc/nanostar
Ideal (1st and 2nd) Reflow Profile
RT to 140°C 60 to 90 sec.
140°C to 180°C 60 to 120 sec.
Time Above 183°C 60 to 150 sec.
Peak Temp. 220°C ± 5°C
Time Within 5°C Peak Temp. 10 to 20 sec.
Ramp Down Rate 6° sec. max.
IR REFLOW PROFILE
Texas Instruments WCSP Design Summary—17
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+ + + + + + +
CL
5º
Pin 1*
0,25 ± 0,05
Section Y – Y Dimensions in mm
*Pin 1 location is in the upper left-hand corner of the cavity. Units shipped with bumps down.
K 0 Y
Y
P1 A 0
P2 E1,75 ± 0,1
1P01,55 ± 0,05
W+ + + + + +
F
B 0
Reel Tape Configuration
PACKAGING TAPE AND REEL
Solder Paste
TI recommends the use of type 3 or finer solder pastewhen mounting the WCSP package. The use of pasteoffers the following advantages:
• It acts as a flux to aid wetting of the solder ball tothe PCB land.
• The adhesive properties of the paste will hold thecomponent in place during reflow.
• Paste contributes to the final volume of solder inthe joint, and thus allows this volume to bevaried to give an optimum joint.
• Paste selection is normally driven by overall system assembly requirements. In general, the“no clean” compositions are preferred due to thedifficulty in cleaning under the mountedcomponents.
+
+
+ +
+
Stencil
Stencil Thickness = 0,10 mm
Dimensions in mmStencil Aperture
0,06 RAD
0,3
0,3
0,5
0,50
STENCIL VITALS
Note: Design can be extended for 6- and 8-ball.
Dimensions 5- and 6-Ball 8-Ball
Pocket Width, AO (mm) 1,10 ± 0,05 1,10 ± 0,05
Pocket Length, BO (mm) 1,60 ± 0,05 2,10 ± 0,05
Pocket Depth, KO (mm) 0,56 ± 0,05 0,56 ± 0,05
Pocket Pitch, P1 (mm) 4,00 ± 0,1 4,00 ± 0,1
Sprocket Hole-to-Pocket Centerline, F (mm) 3,50 ± 0,05 3,50 ± 0,05
Sprocket Hole-to-Pocket Offset, P2 (mm) 2,0 ± 0,05 2,0 ± 0,05
Sprocket Hole Pitch, P0 (mm) 4.,00 ± 0,1 4,00 ± 0,1
Tape Width, W (mm) 8,00 ± 0,3 8,00 ± 0,3
Reel Diameter (mm) Max. 330 330
18—WCSP Design Summary Texas InstrumentsO
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C (pF)R (W) L (nH) 5-Ball 6-Ball 8-Ball
Min. 0.001 0.021 0.045 0.046 0.042
Mean 0.001 0.021 0.046 0.046 0.043
Max. 0.001 0.021 0.047 0.047 0.044
347
389
442.0
251.66
205
251.7
279.0
154.32
0
50
100
150
200
250
300
350
400
450
500
SOT-23 SOT-323 Ceramic CSP/LGA
WCSP (1G)
Th
erm
al
Re
sis
tan
ce
(˚C
/W) JEDEC 1S2P
JEDEC 1S0P
Thermal Impedance (Junction to Ambient) of Single-Gate Packages
Thermal Airflow (linear ft/minute)
Package Impedance 0 150 250 500
5-Ball 1S0P RθJA (°C/W) 251.66 233.62 224.28 211.12
RθJC (°C/W) 21.4
1S2P RθJA (°C/W) 154.32 152.05 150.73 148.72
RθJC (°C/W) 18.75
6-Ball 1S0P RθJA (°C/W) 236.83 219.01 210.02 197.39
RθJC (°C/W) 21.03
1S2P RθJA (°C/W) 143.47 141.14 139.87 137.93
RθJC (°C/W) 18.48
8-Ball 1S0P RθJA (°C/W) 236.59 218.76 209.46 196.32
RθJC (°C/W) 16.45
1S2P RθJA (°C/W) 139.87 137.69 136.34 134.34
RθJC (°C/W) 14.80
Note: Electrical package parasitic was achieved through PACED electrical model-ing and is based on a 3D model. Actual electrical data may differ slightly from simulated results.
Board Level ReliabilityNf (cycles to 1.0% failure)
NanoStar 1286 cycles
ELECTRICAL CHARACTERISTICS
THERMAL CHARACTERISTICS
BOARD LEVEL RELIABILITY DATA
Thermal Impedance Values at Various Airflow Rates
Texas Instruments Resources and Support—19
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LITERATURESelection Guides Lit. Number
Logic Selection Guide . . . . . . . . . . . . . . . .SDYU001*Advanced Bus Interface Logic
Selection Guide . . . . . . . . . . . . . . . . . . .SCYT126*Design Considerations for Logic
Products, Volume 3 . . . . . . . . . . . . . . . .SDYA019
Data Books
Little Logic Data Book . . . . . . . . . . . . . . . .SCED010*Signal Switch Data Book . . . . . . . . . . . . . .SCDD003*AHC/AHCT Data Book . . . . . . . . . . . . . . .SCLD003B
Application Notes
Application of the Texas InstrumentsAUC Sub-1-V Little Logic Devices . . . . .SCEA027*
Selecting the Right Texas InstrumentsSignal Switch . . . . . . . . . . . . . . . . . . . . .SZZA030*
Brochures/Product Bulletins Lit. Number
Logic Reference Guide . . . . . . . . . . . . . . . .SCYB004AUC Product Brochure . . . . . . . . . . . . . . .SCEB011Bus Switches (CBT & CBTLV)
Product Bulletin . . . . . . . . . . . . . . . . .SCDB002A
To order any TI Logic literature listed, please contactthe Texas Instruments Literature Response Center at1-800-477-8924 and provide the literature number.
*Literature available on the Web by substituting theLit. Number (all lower-case) in the following address:
www-s.ti.com/sc/techlit/litnumber
ON-LINE HELPFor information regarding TI’s Little Logic portfoliovisit:
www.ti.com/sc/littlelogic
For additional logic information including applicationreports, samples, and data sheets visit:
logic.ti.com
To access the TI Logic Knowledge Base and getanswers to your technical questions go to:
www.ti.com/sc/lkb
To subscribe to Logic News, a monthly newsletterfeaturing new products and other TI Logic news,visit:
www.ti.com/sc/logicnews
LITTLE LOGIC SAMPLE REQUESTSWorking day and night and need a free TI
product sample fast? Orders for material in
stock received by 7 p.m. CST shipped before
midnight the same day.
We’re waiting to take your order online 24/7.
We’ll help you. That’s what our Product Sampleprogram is all about. Helping you place your order forFREE product samples when you’re ready to place it.
• 10,000 different devices plus package options.
• No waiting to talk to TI sales or distributors.
• Free—including shipping.
• Orders for material in stock received by 7 p.m.CST shipped before midnight the same day.
• Shipping will be UPS “Next Day” in the U.S. and“Priority 1” internationally.
• Shipping confirmation notice lets you track yourorder on the UPS Web site.
• Phone option—if you need help selecting a samplepart, call your regional Product Information Centerfound on the back cover of this guide or visit
support.ti.com
© 2002 Texas Instruments IncorporatedPrinted in the U.S.A. at ______________
Printed on recycled paper. SCYT129
Reliable. Logic. Innovation.; the black/red banner; NanoStar; NanoFree; MicroStar BGA; and MicroStar Jr. are trademarks of Texas Instruments.
TI Worldwide Technical Support
InternetTI Semiconductor Product Information CenterHome Pagesupport.ti.com
TI Semiconductor KnowledgeBase Home Pagesupport.ti.com/sc/knowledgebase
Product Information CentersAmericasPhone +1(972) 644-5580Fax +1(972) 927-6377Internet/Email support.ti.com/sc/pic/americas.htm
Europe, Middle East, and AfricaPhone
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