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Skyworks series of silicon limiter diode chips provides passive receiver protection over a wide range of frequencies from 100 MHz to beyond 30 GHz. These devices utilize Skyworks well established silicon technology for high resistivity and tightly controlled thin basewidth PIN limiter diodes. Limiter circuits employing these devices perform with strong limiting action and low loss. The CLA series consists of nine individual chip designs of different intrinsic region basewidths and capacitances designed to accommodate multistage limiter applications. The mesa constructed, thin basewidth, low capacitance CLA4601, CLA4602, CLA4604 and CLA4605 and SMP1330 are designed for low-level and cleanup applications. The CLA4603, and CLA4606 through CLA4609 are planar designs designed for mid-range and high-power applications.
Applications• Receiver protection
Features • High power, mid-
range and clean-up designs
• Low insertion loss (0.1 dB at 10 GHz)
• Power handling to 70 dBm
• Tight control of basewidth
Transmitter
Receiver
High Power Amplifier
Low Noise Amplifier
Low Noise A lifi
DownconverterMixer
Receiver ProtectorLimiter
Simplified Radar Transceiver with a Receiver Protector Limiter
Skyworks Green™ products are compliant to all applicable materials legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074.
Limiter Diodes
Skyworks’ broad product portfolio includes limiter diodes as packaged and bondable silicon chips, in addition to ceramic hermetic packaged and plastic surface mount packaged devices for receiver protection applications.
Select products and sample/designer kits available for purchase online.
www.skyworksinc.com
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LimiterPIN
RFChoke
DCBlock
DCBlock
Input Output
A Single-Stage Limiter
1 dB
-10-10 0 10 20 30
0
10
Outp
ut P
ower
(dBm
)
Input Power (dBm)
20
30Limiter Output Pin-IL
Low InsertionLoss Operation
LimitingOperation
Threshold Level
Output Power vs. Input Power for a Single-Stage Limiter
The PIN limiter diode can be described as an incident- power-controlled, variable resistor. In the case when no large input signal is present, the impedance of the limiter diode is at its maximum, thereby producing minimum insertion loss, typically less than 0.5 dB. The presence of a
large input signal temporarily forces the impedance of the diode to a much lower value, producing an impedance mismatch which reflects the majority of the input signal power back towards its source.
Electrical Specifications at 25 °C
Capacitance, CJ, specified at 1 MHz. Resistance, RS, measured at 500 MHz.
Typical Performance at 25 °C
Insertion loss for CLA4601 through CLA4607 at 10 GHz; insertion loss for CLA4608 at 5 GHz.Limiter power results at 1 GHz for shunt connected, single limiter diode and DC return in 50 Ω line.
Maximum pulsed power for 1 µs pulse and 0.1% duty factor with chip at 25 °C heat sink. Derate linearly to 0 W at 175 °C. Maximum CW input power at 25 °C heat sink. Derate linearly to 0 W at 175 °C. Recovery time to insertion loss from limiting state.
CW thermal resistance for infinite heat sink. Pulse thermal resistance for single 1 µs pulse.
Thermal Impedance (q) Top Contact
Part Number
Breakdown Voltage (V) Min. – Max.
I Region (µm) Nominal
CJ @ 0 V (pF) Typ.
CJ @ 6 V (pF) Max.
RS @ 10 mA (Ω) Max.
TL @ 10 mA (ns) Typ.
Average (°C/W) Max.
1 µs Pulse (°C/W) Typ.
Diam. (mils/mm)
Typ.
CLA4601 Series 15–30 1.0 0.12 0.10 2.5 5 120 15 1.2/0.03
CLA4602 Series 15–30 1.0 0.20 0.15 2.0 5 80 10 1.5/0.038
SMP1330 Series 20–50 1.5 0.20 – 1.5 4 110 25 N/A
CLA4603 Series 20–45 1.5 0.20 0.15 2.0 5 100 10 1.5/0.038
CLA4604 Series 30–60 2.0 0.12 0.10 2.5 7 100 10 1.5/0.038
CLA4605 Series 30–60 2.0 0.20 0.15 2.0 7 70 7 2.5/0.064
CLA4606 Series 45–75 2.5 0.20 0.15 2.0 10 80 7 2.5/0.064
CLA4607 Series 120–180 7.0 0.20 0.15 @ 50 V 2.0 50 40 1.2 3/0.076
CLA4608 Series 120–180 7.0 0.80 0.5 @ 50 V 1.2 100 15 0.3 5/0.127
CLA4609 Series >250 28 0.26 0.14 1.5 1175 15 0.3 6.5/0.165
Part NumberInsertion Loss @
-10 dBm (dB)Input Power for 1 dB
Loss (dBm)Maximum Pulsed
Input Power (dBm)Output at Max. Pulsed
Input (dBm)Maximum CW Input
Power (W)Recovery Time
(ns)
CLA4601 Series 0.10 7 47 21 2 5
CLA4602 Series 0.10 7 50 24 3 5
SMP1330 Series 0.15 11 50 30 1 30
CLA4603 Series 0.10 10 50 22 2 10
CLA4604 Series 0.10 12 47 24 3 10
CLA4605 Series 0.10 12 50 27 4 10
CLA4606 Series 0.10 15 53 27 3 20
CLA4607 Series 0.10 20 60 39 6 50
CLA4608 Series 0.20 20 66 44 15 100
CLA4609 Series 0.30 38 70 50 20 1000
How to Select Limiter Diode Packages Skyworks limiter diodes are available in several types of packages and as unpackaged dice. In most cases the requirements of the end application will determine the optimal physical diode configuration.
Plastic Surface Mount Technology Packages
Plastic surface mount technology (SMT) packages are inexpensive and are compatible with modern pick-and-place assembly techniques, so they are optimal choices for high-volume, low-cost final product assemblies.
While careful attention has been paid to minimizing package parasitic reactances they are always present in such diode configurations. These parasitics, package capacitance and package inductance, inherently reduce the bandwidth over which a diode may be used and can affect insertion loss and isolation. Plastic SMT packages also add thermal resistance to that of the die, thereby reducing the amount of power a diode can dissipate without exceeding its maximum rated operating junction temperature.
Ceramic-Metal Packages
Ceramic-metal packages offer several advantages over plastic packages: their parasitic inductances and capacitances are generally lower, sometimes by as much as 75%, than that of the plastic SMT packages described above. Their thermal resistances are also generally much lower than that of the large majority of plastic SMT packages. Most ceramic packages used for limiter diodes are capable of being hermetically sealed, thereby offering maximum protection to the die against environmental contaminants such as sodium (Na), water vapor, etc.
Ceramic-metal packages have two disadvantages compared to plastic SMT packages: they are typically more costly, and, they generally are not compatible with automated surface mount assembly.
(Packageless) Dice
Diode dice, sometimes known as chips, eliminate the parasitic reactances and thermal resistance of the package. This configuration produces the widest bandwidth of operation as well as maximal power dissipation capabilities.
Of course, the end user of unpackaged diode dice must be capable of handling these tiny devices as well as performing die attach and wire bonding assembly techniques. The assemblies which contain dice must be protected from mechanical damage, especially to the fragile bond wires.
AnodeMetallizedGold Dot
Silicon
Cathode Metallized Back Contact: Gold
0.004 (0.127 mm) Min.0.006 (0.152 mm) Max.
0.010 (0.251 mm) Min.0.014 (0.356 mm) Max. Sq.
150-801:0.002 (0.051 mm) Min.
150-806:0.0011 (0.028 mm) Min.
150 Series
0.014 ± 0.001(0.325 ± 0.025 mm)
0.014 ± 0.001(0.325 ± 0.025 mm)
Metallized Back Contact, Gold
AnodeTop Contact, Gold0.002 (0.050 mm)
Dia. Min.
0.004 (0.010 mm)0.006 (0.015 mm) Nom.
Schematic
149-815
Outline Drawings
-203 Hermetic Pill
0.050 (1.27 mm)0.040 (1.02 mm)
0.055 (1.40 mm)0.051 (1.30 mm)
Dia.
Schematic
N-Type
247-001
-210 Hermetic Pill
0.025 (0.63 mm)Max.
0.124 (3.15 mm)0.119 (3.02 mm) Dia.
0.097 (2.46 mm)0.83 (2.11 mm)
0.083 (2.20 mm)0.077 (1.95 mm)
0.064 (1.63 mm)0.060 (1.52 mm)
0.225 (5.72 mm)0.205 (5.20 mm)
0.064 (1.63 mm)0.060 (1.52 mm)
2 PLCS
Schematic
023-000
-240 Hermetic Stripline
-011 (240)
1 2
Schematic
Colored DotDenotes Cathode
50°45°
0.175 (4.44 mm)0.125 (3.18 mm)
2 Plcs.
0.104 (2.64 mm)0.092 (2.34 mm)
Sq.
0.042 (1.06 mm)0.028 (0.71 mm)0.005 (1.27 mm)
0.003 (0.76 mm)
0.098 (2.49 mm)0.092 (2.34 mm)
Cover Dia.
0.022 (0.56 mm)0.018 (0.46 mm)
2 Plcs.
325-011
-219 Hermetic Pill
0.075 (1.91 mm)0.065 (1.65 mm)
Sq.
0.045 (1.14 mm)0.030 (0.76 mm)
0.020 (0.51 mm) Typ.
0.048 ± 0.005
0.033 (0.84 mm)Min.
0.010 (0.24 mm)Ref.
0.012 (0.30 mm)Typ.
Schematic
404-801
-085LF, -086LF
-040LF
SOT-23 (-005LF) Plastic
All dimensions in millimeters
S1632
2 ± 0.2
2 ± 0.2
OrientationIndicator 0.90 ± 0.1
Detail B
0.4 ± 0.1
0.27 ± 0.15
3
3 1
2
Exposed Pad
Detail B
0.5 ± 0.15
1.7 ± 0.151
2
Top View Side View Bottom View
0.037 (0.94 mm)
0.120 (3.05 mm) 0.110 (2.79 mm)
0.104 (2.64 mm)
0.083 (2.10 mm)
Footprint
0.030 (0.8 mm) 3 Plcs.
0.070 (1.8 mm)
0.075 (1.9 mm)
0.037 (0.95 mm)
0.035 (0.9 mm) 3 PLCS.
0.055 (1.40 mm) 0.047 (1.19 mm)
0.024 (0.61 mm) 0.018 (0.45 mm)
0.080 (2.03 mm) 0.070 (1.78 mm)
0.045 (1.14 mm)
0.035 (0.89 mm)
0.004 (0.10 mm) 0.0005 (0.01 mm) 0.027 (0.69 mm) Ref.
0.007 (0.18 mm)
0.003 (0.08 mm)
0.018 (0.45 mm) 0.015 (0.38 mm) 3
1 2 0.040 (1.02 mm)
Outline Drawings (Continued)
All dimensions in millimeters
0.650
CathodeIndicator
CathodeTerminal
1.000
Bottom View
Side View
Top View
2X 0.25 ± 0.05
2X 0
.50
± 0
.05
0.46
+0.
04/–
0.06
0.05
/0.0
0
0.60
0
0.325
S1892
Application Notes For additional information, please refer to the following Application Notes.
Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods and Packaging
PIN Diode Basics
PIN Limiter Diodes in Receiver Protectors
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Skyworks is continuously innovating RF, analog and mixed-signal ICs. For the latest product introductions and information about Skyworks, visit our Web site at www.skyworksinc.com
For additional information on our broad overall product portfolio, please contact your local sales office or email us at [email protected].
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