Upload
taz1mx
View
83
Download
9
Embed Size (px)
Citation preview
Serv
ice M
an
ual
Mo
del : G
T360
Service ManualGT360
Date: April, 2009 / Issue 1.0
Internal Use Only
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 3 -
* The information in this manual is subject to change without notice and should not be construed as acommitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes toequipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the GT360Series.
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
J.P.Kim Jul. 18. 2008 0.1 -
- 4 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 5 -
1. INTRODUCTION ...............................71.1 Purpose .................................................. 71.2 Regulatory Information............................ 71.3 ABBREVIATION ..................................... 9
2. PERFORMANCE.............................112.1 H/W Features.........................................112.2 Technical specification...........................12
3. TECHNICAL BRIEF ........................193.1 GT360 series Component
Block diagram... .....................................193.2 Baseband Processor (BBP)
Introduction ............................................203.3 Power management IC ..........................283.4 Power ON/OFF ......................................323.5 SIM interface..........................................333.6 Micro SD external memory Interface .....343.7 Memory ..................................................353.8 LCD Display ...........................................363.9 Keypad Switching & Scanning ...............393.10 Touch KEY...........................................413.11 Keypad back-light illumination .............433.12 LCD back light illumination...................443.13 ISP(Image Signal Processor)...............453.14 JTAG & ETM interface connector ........463.15 Audiot ...................................................473.16 Charging circuit ....................................493.17 BLUETOOTH.......................................503.18 FM Radio .............................................523.19 18pin Multi Media Interface
connector .............................................533.20 General Description .............................553.21 Receiver part........................................573.22 Transmitter part....................................583.23 RF synthesizer .....................................593.24 DCXO...................................................603.25 Front End Module control.....................603.26 Power Amplifier Module .......................61
4. PCB layout......................................624.1 Main PCB component placement ..........62
5. Trouble shooting............................665.1 Trouble shooting test setup....................665.2 Power on Trouble...................................675.3 Charging trouble ....................................705.4 LCD display trouble................................725.5 Camera Trouble .....................................745.6 Receiver & Speaker trouble ...................765.7 Microphone trouble ................................785.8 Ear-MIc Jack Detection trouble..............795.9 Vibrator trouble ......................................805.10 Keypad back light trouble.....................825.11 SIM & USD trouble...............................845.12 Touch trouble .......................................885.13 Qwerty Key trouble ..............................905.14 Trouble Shooting of Receiver Part.......925.15 Trouble Shooting of Transmitter Part...96
6. Download & S/W upgrade...............1036.1 S/W download setup ............................1036.2 Download program user guide.............1046.3 Multi-Download Program Setting .........105
7. CIRCUIT DIAGRAM ......................107
8. BGM PIN MAP...............................117
9. PCB LAYOUT................................121
10. RF Calibration ............................12710.1 Test Equipment Setup .......................12710.2 Calibration Step .................................127
11. Stand-alone Test ........................13311.1 Test Program Setting .........................13311.2 Tx Test ...............................................13511.3 Rx Test...............................................136
12. ENGINEERING MODE................137
13. EXPLODED VIEW &REPLACEMENT PART LIST ......139
13.1 Exploded View ...................................139
13.2 Replacement Parts ............................141
Table Of Contents
- 6 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 7 -
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the GT360 Series.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system. There are may be risks of toll
fraud associated with your telecommunications system. System users are responsible for
programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that
this product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. LGE will not be
responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the GT360 Series or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the GT360 Series must be performed only at the LGE or its authorized
agents. The user may not make any changes and/or repairs expect as specifically noted in this
manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the
system and may void any remaining warranty.
1. INTRODUCTION
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 8 -
1. INTRODUCTION
E. Notice of Radiated Emissions
The GT360 Series complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
An GT360 Series may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 9 -
1. INTRODUCTION
1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS Enhanced General Packet Radio Service
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
1. INTRODUCTION
- 10 -
LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
8PSK 8 Phase Shift Keying
- 11 -
2. GENERAL PERFORMANCE
2.1 H/W Feature
2. GENERAL PERFORMANCE
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Feature Comment
Standard Battery Li-Polymer, 800mAh
AVG TCVR Current 250mA typ @PL5
Standby Current 1.85 mA typ @PP9
Talk time 5.6 hours (GSM850/EGSM TX Level 10)
Standby time Over 430 hours (Paging Period:9, RSSI: -85dBm)
Charging time Under 3 hours
RX Sensitivity GSM850/EGSM: -105dBm↓, DCS/PCS: -105dBm↓
TX output power GSM850/EGSM : 32.5dBm (@PL 5)
DCS/PCS: 30/29.5dBm (@PL 0)
GPRS compatibility Class 12
SIM card type 3V Small
Display Main 240x320 262K TFT 2.4”
Status Indicator Dial keys are implemented by touchpad.
Navi, Send, Call End, Back, Volume Up, Volume Down,
Camera, Touch hot Key and CLEAR
Number key, Alphabet, OK, space bar,
Function key are implemented by Qwertykey
ANT Built in antenna
EAR Phone Jack - 18pin multi port Headset jack (Call/Music)
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
- 12 -
2. GENERAL PERFORMANCE
2.2 Technical specification
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
TX: 890 + 0.2 x (n-1024) MHz
1 Frequency BandRX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
2 Phase ErrorRMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
12 19 dBm 3dB
4 Power Level DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
- 13 -
2. GENERAL PERFORMANCE
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
5Output RF Spectrum 6,000 -71
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM900/EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -196
(due to switching transient) 600 -21
1,200 -21
1,800 -24
- 14 -
2. GENERAL PERFORMANCE
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -226
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM850/EGSM
8 Bit Error RatioBER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500 * -5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
* Mean that Adopt a straight line in between 300 Hzand 1,000 Hz to be Max. level in the range.
- 15 -
2. GENERAL PERFORMANCE
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.716 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18System frequency
2.5ppm(26 MHz) tolerance
19 32.768KHz tolerance 30ppm
Standby20 Power consumption
- Normal 2 mA(@PP9)
21 Talk TimeEGSM/Lvl 7 (Battery Capacity 800mA):180 minEGSM/Lvl12(Battery Capacity 800 mA):320minUnder conditions, at least 300 hours:1. Brand new and full 800mAh battery
22 Standby Time2. Full charge, no receive/send and keep GSM in idle mode.3. Broadcast set off.4. Signal strength display set at 3 level above.5. Backlight of phone set off.At least 65 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.2. Test distance set as 50 cm
24 Charge CurrentFast Charge : < 450 mASlow Charge: < 200 mA
Antenna Bar Number Power
7 >-92 dBm ~
7 → 5 -97dBm ~ -93dBm
25 Antenna Display5 → 4 -100dBm ~ -98dBm
4 → 2 -103dBm ~ -101dBm
2 → 1 -105dBm ~ -104dBm
1 → 0 < -106 dBm
Off No Service
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. GENERAL PERFORMANCE
- 16 -
Item Description Specification
Battery Bar Number Voltage( 0.05V)
3 3.74V ~ 4.2V
26 Battery Indicator 2 3.64V~3.73V
1 3.45V ~ 3.63V
0 3.35V ~ 3.44V
27 Low Voltage Warning3.57V ↓ 0.05V (Call)
3.45V ↓ 0.05V (Standby)
28 Forced shut down Voltage 3.35 0.05 V
Li-ion Battery or Li-Polymer Battery
29 Battery TypeStandard Voltage = 3.7 VBattery full charge voltage = 4.2 VCapacity: 800mAh
Switching-mode charger31 Travel Charger Input: 100 ~ 240 V, 50/60Hz
Out put: 5.6V, 0.4A
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. GENERAL PERFORMANCE
- 17 -
* EDGE RF Specification (Option: is not serviced for “EDGE mode”)
Item Description Specification
1 RMS EVM 9%2 Peak EVM 30%3 95th Percentile EVM 15%4 Origin Offset Suppression ≥ 30dB
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 27dBm 3dB 13 17dBm 3dB
6 27dBm 3dB 14 15dBm 3dB
7 27dBm 3dB 15 13dBm 3dB
8 27dBm 3dB 16 11dBm 5dB
9 25dBm 3dB 17 9dBm 5dB
10 23dBm 3dB 18 7dBm 5dB
11 21dBm 3dB 19 5dBm 5dB
5 Power Level 12 19dBm 3dB
DCS1800, PCS1900
Level Power Toler. Level Power Toler.
0 26/25dBm 3dB 8 14 dBm 3dB
1 26/25dBm 3dB 9 12 dBm 4dB
2 26/25dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
6 Output RF Spectrum GSM900/EGSM
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. GENERAL PERFORMANCE
- 18 -
Item Description Specification
6 Output RF Spectrum DCS1800, PCS1900
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
7 Output RF Spectrum GSM900/EGSM
(due to switching transient) Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 --30
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 19 -
3.1 GT360 series Component Block diagram
3. TECHNICAL BRIEF
Figure 1. GT360 series Functional Block Diagram
- 20 -
3. TECHNICAL BRIEF
3.2 Baseband Processor (BBP) Introduction
3.2.1 General Description
S-GOLDRadio™ is a GSM/EDGE single chip mixed signal Single Chip Radio IC containing all analog
and digital functionality of a cellular radio. Additionally S-GOLDRadio™ Provides multimedia
extensions such as camera, software MIDI, MP3 sound. It is designed as a single chip solution,
integrating the digital and mixed signal portions of the base band in 0.13um, 1.5V technology.
The chip will fully support the FR/HR/EFR/NB-AMR speech codec.
S-GOLDRadio™ support multi-slot operation modes CSD/GPRS/EGPRS (up to class 12) without
additional external hardware.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 2. Top level block diagram of the S-GOLDRadio™ (PMB8888)
GSCipher
TEAKLit Æ
GEA-1/2/3
SRAMUSB FS
DMAC
GPIO
USI
JTAG
GPT
RTC
EqualizeSpeech
and Decodin
Speechand Encodin
DAC
DACMUX
AD
Keypad
USARTs
CAPCOM
ICU
I≤C
I≤
AUXADC
EBU
MMC/SDI
CGU
CameraI
DisplayI
FCDP
Multimedia IC
ARMÆ 926
MOVE IrDA
USIM
RFContro
DigR
I≤S / IR-Memory
SCCU
GSTimer
USBLD
PoweContro
S-GOLDradio
3-wireCtrl
DCXO
Sigma-DeltaMASH
Modulato
PA/FEContro
GMSK8PSK
DCOffsetComp
L
FIR
FIRLPF
DA
LDO
AD
AD
Baseband R
Power
AD+-
SD2(1.8V)
ANALD
RTCLD
RF1LD
I/LD
SD1(1.5V)
Charger
RFLD
AUXLD
VILD
GPLD
SILD
RFLD
S(BL
PLLDHands-
freeAmp
LEDPWMís
RampGen
DigR
- 21 -
3. TECHNICAL BRIEF
3.2.2 Block Description
• Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-Sincludes an MMU, and the Jazelle Java extension for Java acceleration.- TEAKLite DSP core
• ARM-Memory- 32k Byte Boot ROM on the AHB- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM- 16k Byte Cache for Program (internal)- 8k Byte tightly coupled memory for Program(internal)- 8k Byte Cache for Data(internal)- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory- 104K x 16bit Program ROM- 8k x 16bit Program RAM- 60k x 16bit Data ROM- 37k x 16bit Data RAM- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus systemThe processor cores and their peripherals are connected by powerful buses. Multi-layer AHB forconnecting the ARM and the other master capable building blocks with the internal and externalmemories and with the peripheral buses.
• Clock systemThe clock system allows widely independent selection of frequencies for the essential parts of theS-GOLD3. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block- CPU and DSP Timers- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)- Programmable PLL with additional phase shifters for system clock generation- GSM Timer Module that off-loads the CPU from radio channel timing- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)- GMSK Modulator: gauss-filter with B*T=0.3- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter- Hardware accelerators for equalizer and channel decoding.- Incremental Redundancy memory for EDGE class 12 support- A5/1, A5/2, A5/3 Cipher unit- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission- Advanced static and dynamic power management features including TDMA-Frame synchronous
low power mode and enhanced CPU modes(idle and sleep modes)- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 22 -
3. TECHNICAL BRIEF
- Serial RF Control interface: support of direct conversion RF- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial
data transmission- 1 Serial Synchronous SPI compatible interfaces in the controller domain- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller
supporting IrDA’s SIR standard (up to 115.2Kbps)- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)- I2C-bus interface (e.g. connection to S/M power)- A fast display interface supporting serial and parallel interconnection- An ITU-R BT.656 compatible Camera interface.- Programmable clock output for a camera- An multimedia/Secure Digital Card Interface (MMCI/SD: SDIO capable)
3.2.3 External Devices connected to memory interface
Table 1. Memory interface
3.2.4 RF Interface
S-GOLDRadio uses this interface to control RF IC and Peripherals. 13 signals are provided switch
on/off RF ICs Periodically each TDMA frame.
Table 2. RF Interface Spec.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Device Name Maker Remark
NAND FLASH K5D1G12ACD-D075 Samsung Synchronous / A synchronous
SDRAM K5D1G12ACD-D075 Samsung Synchronous 133MHz
LCD IM200DBN7A LGIT 8bit access 2times transmission
Resource Interconnection Description
TX2 TXHB Output High band(DCS/PCS) Tx
TX1 TXLB Output Low band(850/900) Tx
RX1, RX1X GSM850_RXP, GSM850_RXN Input of GSM850 LNA
RX2, RX2X GSM900_RXP, GSM900_RXN Input of GSM900 LNA
RX3, RX3X DCS1800_RXP, DCS1800_RXN Input of DCS1800 LNA
RX4, RX4X PCS1900_RXP, PCS1900_RXN Input of PCS1900 LNA
PABS PA_BAND Select PAM operation band.
FE1, FE2 VC1, VC2 Control FEM operation band & mode
PAEN PA_EN PAM Enable
VRAMP TX_RAMP Tx Ramp signal
T_OUT6 PA_MODE Select PAM operation mode (GSM/EDGE)
- 23 -
3. TECHNICAL BRIEF
3.2.5 USART Interface
GT360 have two UART Drivers as follow :
- USART0 : SW upgrade / Calibration
- USIF : BT Interface.
Table 3. USIF Interface Spec.
3.2.6 ADC channel
BBP ADC block is composed of 7 external ADC channel. This block operates charging process and
other related process by reading battery voltage and other analog values.
Table 4. S-GOLDRadio ADC channel usage
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Resource Name Remark
UART0
UART0_TXD UART_TX Transmit Data
UART0_RXD UART_RX Receive Data
USIF
USIF_TXD UART_BT_TX Transmit Data
USIF_RXD UART_BT_RX Receive Data
T_OUT3 UART_BT_RTS Flow Control Signal
T_OUT4 UART_BT_CTS Flow Control Signal
ADC channel
Resource Interconnection Description
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 LCD_ID LCD ID measure (Hitachi LCD_ID = 0)
M7 GND
M8 VBAT Battery supply voltage measure
M9 N.C
M10 JACK_TYPE JACK type measure (Not used)
3.2.7 GPIO map
Over a hundred allowable resources, GT360 is using as follows except dedicated to SIM and Memory.
GT360 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,
is shown in below table.
Table 5 S-GOLDradio GPIO pin Map
- 24 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Port Function Net Name Description
#Keypad
KP_IN1 KEY_I2C_SCL Key coder IC control
KP_IN2 KEY_I2C_SDA Key coder IC control
KP_IN3 DIF_RESET LCD reset
KP_IN4 BT_RESET BT reset
KP_IN5 IF_MODE3 LCD interface mode (Hitachi LCD => High)
KP_IN6 VIB_PWR_EN Motor LDO enable
KP_OUT0 CAM_PWR_EN Camera LDO enable
KP_OUT1 LIN_INVERT Motor control
KP_OUT2 TOUCH_SCL Touch IC control
KP_OUT3 TOUCH_SDA Touch IC control
#USART0
USART0_RXD UART_RX UART, RS232 data
USART0_TXD UART_TX UART, RS232 data
USART0_RTS_N MMC_DET Micro SD card Detect
USART0_CTS_N HOOK_DETECT Earmic hook key Detect
DSPOUT0 JACK_DET Earmic Detect
#USB
USB_DPLUS USB_DP USB +
USB_DMINUS USB_DM USB -
#CIF:Camera Interface
CIF_D0 CAM_D(0) Camera DATA(0)
CIF_D1 CAM_D(1) Camera DATA(1)
CIF_D2 CAM_D(2) Camera DATA(2)
CIF_D3 CAM_D(3) Camera DATA(3)
CIF_D4 CAM_D(4) Camera DATA(4)
CIF_D5 CAM_D(5) Camera DATA(5)
CIF_D6 CAM_D(6) Camera DATA(6)
- 25 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
CIF_D7 CAM_D(7) Camera DATA(7)
CIF_PCLK CAM_PCLK Camera pixel clock
CIF_HSYNC CAM_HS Camera H sync
CIF_VSYNC CAM_VS Camera V sync
CLKOUT2 CAM_MCLK Camera main clock
CIF_PD_GPIO CAM_PWDN Camera sensor power down
CIF_RESET_GPIO CAM_RST Camera reset
#Display_Interface
DIF_D0 DIF_D(0) LCD DATA(0)
DIF_D1 DIF_D(1) LCD DATA(1)
DIF_D2 DIF_D(2) LCD DATA(2)
DIF_D3 DIF_D(3) LCD DATA(3)
DIF_D4 DIF_D(4) LCD DATA(4)
DIF_D5 DIF_D(5) LCD DATA(5)
DIF_D6 DIF_D(6) LCD DATA(6)
DIF_D7 DIF_D(7) LCD DATA(7)
DIF_CS1 DIF_CS LCD chip select
DIF_CS2 BT_INT BT interrupt
DIF_CD DIF_CD LCD command/data switch
DIF_WR DIF_WR LCD write
DIF_RD DIF_RD LCD read
DIF_HD EOC Indicating End of charging
DIF_VD DIF_VSYNC LCD V sync
DIF_RESET1_GPIO KEY_INT Key coder IC interrupt
#I2C
I2C_SCL I2C_SCL For Sub-PMIC/Audio DAC/Camera
I2C_SDA I2C_SDA For Sub-PMIC/Audio DAC/Camera
#Chip Card (USIM1)
CC_IO SIM_DATA SIM card I/O
CC_CLK SIM_CLK SIM card CLOCK
CC_RST SIM_RST SIM card RESET
#MMCI: Multimedia Card IF
MMCI_CMD MMC_CMD uSD Card command/response
MMCI_DAT0 MMC_D0 uSD Card Data (0)
MMCI_CLK MMC_CLK uSD Card Clock
- 26 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
#USIF: Universal Serial IF
USIF_TXD_MTSR UART_BT_TX BT UART data output
USIF_RXD_MRST UART_BT_RX BT UART data input
USIF_SCLK BT_VCXO_EN BT vcxo (26MHz) enable
#I2S1: DAI-PCM
I2S1_CLK0 I2S1_CLK BT synchronous data clock
I2S1_RX I2S1_RX BT synchronous data input
I2S1_TX I2S1_TX BT synchronous data output
I2S1_WA0 I2S1_WA0 BT synchronous data sync
#MMCI: SD-Extension
MMCI_DAT1 MMC_D1 uSD Card Data (1)
MMCI_DAT2 MMC_D2 uSD Card Data (2)
MMCI_DAT3 MMC_D3 uSD Card Data (3)
#Voiceband: Analog Interface
EP_N BB_SND_L For Speaker
EP_P BB_SND_R For Speaker
HS_N RCV_N For Receiver
EP_CM NA
HS_P RCV_P For Receiver
MIC1_N MIC_N For Mic
MIC1_P MIC_P For Mic
MIC2_N HS_MIC_N For Headset Mic
MIC2_P HS_MIC_P For Headset Mic
VMIC MICBIAS Power for MIC
#Measurement
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 LCD_ID LCD ID measure (Hitachi LCD_ID = 0)
M7 GND
M8 VBAT Battery voltage measure
M9 NA
M10 JACK_TYPE JACK type measure (Not used)
#JTAG
TDO TDO JTAG
TDI TDI JTAG
TMS TMS JTAG
#FCDP:Flash Controller DMA Port
FCDP_RBN FCDP
#GSM TDMA Timer: GSM Control
T_OUT3 UART_BT_RTS BT UART request to send
T_OUT4 UART_BT_CTS BT UART clear to send
T_OUT5 TOUCH_INT Touch IC interrupt
T_OUT6 PA_MODE PAM
T_OUT7 RPWRON Remote Power On
T_OUT8 LIN_PWM_FRQ Motor control
#Other Functional Pins:
Clocks and control
CLKOUT0 CHG_EN Charging enable
F32K To 32KHz crystal
OSC32K To 32KHz crystal
RESET_N nRESET
#Extra I/Os & Interrupt Inputs
DSPIN0 CLK32K BT 32kHz sleep clock
DSPIN1 SLIDE_OPEN Slide open/close detect
#Baseband I/0
FSYS3 NA
FSYS2 26MHZ_BT BT Main clock
#Reference Oscillator / PLL
REFR NA
XOX 26MHz 26MHz Main clock
XO 26MHz 26MHz Main clock
#LED's
BL1_PWM / VSENSE1 DBB_BL_PWM Not used
BL2_PWM LIN_PWM_MAG Motor control
BL3_PWM SUB_KEY_BL Sub Key LED control
VSS_FLASH GND
FLASH_SINK QWERTY_KEY_BL Qwerty Key LED control
#Control Logic
LPBCL_ECHO GND
ON_OFF / SCAN_RESET PWRON
RESET2_N / VSENSE2 M_RESET Memory reset
PO_RESET_N / SCAN_OUT2 PO_RESET
- 27 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 28 -
3. TECHNICAL BRIEF
3.3 Power management IC
3.3.1 General Description
S-GOLDradio has a highly integrated Power and Battery Management block for mobile handsets.
Block Description
• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).
• Support of S-GOLD standby power-down concept
• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices
• Voltage independent switching of two SIM cards
• LDO regulators for baseband I/O supply
• LDO regulator for analog mixed-signal section of S-GOLD
• Low-noise LDO regulators for RF devices
• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth
• Audio amplifier 8 Ohms for handsfree operation and ringing
• Charge Control for charging Li-Ion/Polymer batteries under software control
• Pre-charge current generator with selectable current level
• RTC regulator with ultra-low quiescent current
• USB interface support for peripheral and mini-host mode
• Vibrator driver with adjustable voltage
• Fully controlable by software via I2C - Bus
• Temperature and battery voltage sensors
• Interrupt channels for peripherals
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 29 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3. Top level block diagram of the PMU Block of PMB8888
Table 6. LDOs Output Table of PMU Block of PMB8888
- 30 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LDO Net name Output Voltage Output Current Usage
SD1 VSD1_1V5 1.5V 400mA Core & for LDO
SD2 1V8_VSD2 1.8V 300mA Memory
VAUX 2V9_VAUX 2.9V 150mA BT Power
VIO 2V62_VIO 2.62V 100mA Peripherals
VSIM 2V9_VSIM 2.9V 22mA SIM card
VMME 2V9_VMMC 2.9V 150mA SD Card
VAUDIO 2V5_VAUDIO 2.5V 220mA Headset
VUSB 3V1_VUSB 3.1V 40mA USB Switch
VRF1 2V85_VRF1 2.85V 150mA
VRF2 1V5_VRF2 1.5V 80mA
VRF3 2V85_VRF3 2.85V 150mA
VPLL 1V5_VPLL 1.5V 20mA S-GOLDRadio PLL
VRTC 2V0_VRTC 2.0V 4mA RTC
VVIB 2V8_VVIB 2.8V 140mA Touch
Figure 4. LDOs Circuit Diagram of GT360 series
47n
HL
102
C114
0.1u
C12
810
0p
2V85_VRF3
1uC
123
2V85_VRF3
C113
0.1u
0.01
uC
120
C10
40.
1u C107
1u
2V8_VVIB
2V85_VRF12V85_VRF3
0.01
uC
105
C100
2V9_VAUX
2.2uC106
1u
2V85_VRF3
1V5_VRF2
C11
52.
2u
2V0_VRTC
D100
3
1
2
2V5_VAUDIO 3V1_VUSB
KDR331V
220n
C10
8
1u0.1u
C117C127
1V5_VPLL
2V85_VRF3
1V5_VRF2
C11
8
VBAT
39p
VBAT 2V9_VSIM
C12
41u
C12
1
C129
0.01
u
0.1u
1V5_VSD1
VS
S_M
SF
3
E18
VS
S_R
TC
VU
SB
B7
VV
IBD
12
T2
VS
SR
F6
VS
SR
F7
U2
VS
SR
F8
U3
VS
SR
F9
U6
VS
S_A
UD
IOE
3
H2
VS
S_E
P
E11
VS
S_L
DO
1
VS
S_L
DO
2D
6
VS
S_L
DO
3C
3
L12
VS
S_M
AIN
_1V
SS
_MA
IN_2
L10
VS
S_M
AIN
_3M
10J8
VS
S_M
AIN
_4L
8V
SS
_MA
IN_5
VR
F1
A2
B4
VR
F2
B1
VR
F3
A8
VS
IM
M2
VS
SR
F1
V2
VS
SR
F10
V4
VS
SR
F11
V5
VS
SR
F12
VS
SR
F13
V6
VS
SR
F14
W1
N2
VS
SR
F2
N3
VS
SR
F3
P2
VS
SR
F4
R2
VS
SR
F5
L11
VD
D_M
AIN
_1V
DD
_MA
IN_2
M11
VD
D_M
AIN
_3L
9M
9V
DD
_MA
IN_4
D7
VD
D_R
EF
VD
D_R
F2P
LL
B3
D18
VD
D_R
TC
C7
VIO
C10
VL
ED
A7
VM
MC
A3
VP
LL
B2
VB
AT
_RF
13
A5
VD
DC
HA
RG
E
VD
DD
IGT
6P
4V
DD
MS
VD
DP
LL
W6
VD
DP
_EB
U_1
V19
L1
VD
DR
X
T3
VD
DT
RX
VD
DT
XW
4W
5V
DD
VC
O
VD
DX
OV
7
VD
D_F
US
E_F
SM
4
E1
VA
UD
IO
D11
VA
UX
VB
AT
_AU
DIO
E2
VB
AT
_BS
W_U
SB
_MM
CC
6
VB
AT
_LD
O1
E12
VB
AT
_LD
O2
B8
SE
NS
E_I
N1
D5
SE
NS
E_I
N2
C4
A1
NC
1A
19N
C2
NC
3W
19
K1
AG
ND
_MS
1A
GN
D_M
S2
K4
CH
AR
GE
_UC
_SC
AN
_IN
1C
8
C5
CH
_GA
TE
A4
CH
_SO
UR
CE
1uC
109
1V8_VSD2
VBAT
2V62_VIO
C12
6
R101 0
220n
L10
147
nH
L10
047
nH
C12
21u
C11
022
0n
C11
11u
C10
312
0p
0R100
0.1u
C11
90.
01u
C13
0
2V0_VRTC
C10
20.
01u
2.2uC101
C12
51u
2V9_VMMC
2.2u
C11
6
C112
0.1u
2V85_VRF3
2V85_VRF1
VCHG_OVP
VBUS_OVP
- 31 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.3.2 Charging
GT360 charge the battery using an external charging IC of Intersil ISL9221 for Li-Polymer battery in
4.2 Volts level.
1 Charging method : CC-CV
2 Charger detect voltage : 4.0 V
3 Charging time : 2h 30m
4 Charging current : 400 mA
5 CV voltage : 4.2 V
6 Cutoff current : 110 mA
7 Full charge indication current (icon stop current) : 110 mA
8 Recharge voltage : 4.15 V
9 Low battery alarm
a. Idle : 3.45 V ~ 3.35 V
b. Dedicated : 3.45 V ~ 3.35 V
10. Low battery alarm interval
a. Idle : 3 min
b. Dedicated : 1 min
11. Switch-off voltage : 3.35 V
12. Charging temperature adc range
a. ~ -5 : low charging voltage operation (3.6 V ~ 3.9 V)
b. -5 ~ 50 : standard charging (up to 4.2 V)
c. 50 ~ : low charging voltage operation (3.6V ~ 3.9V)
4.2V~3.74V 3.74V~3.64V 3.64V~3.45V 3.45V~3.35V
Figure 5. Battery Block Indication
- 32 -
3. TECHNICAL BRIEF
3.4 Power ON/OFF
GT360 series Power State : Defined 3cases as follow
] Power-ON : Power key detect (S-GOLDradio PWRON port)
] Power-ON-charging : Charger or USB detect.
Input ON is a power-on input for S-GOLDradio with 2 active high levels (see Figure 6). It might be
triggered by a push button. To detect if the push-button is pressed during system operation the logical
level at pin ON or its change (if Bit 1 EION in INTCTRL2 is asserted) is recorded in bit LON of the ISF
register. If the high level of voltage at pin ON does not reach VIHdet (Vbat-0.8 ~ Vbat-0.3) the above-
mentioned bit won’t be set.
To support Remote power on function for factory mass production, applied an BJT as following figure.
As monitoring the RPWRON and Key matrix KEY_COL7 & KEY_ROW6, GT360 series system
recognize whether remote power on or End-key pushed
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 6. Remote power on and End-key power on circuit.
Remote Power On
Q201
2
56
31
4 EMX18
2K R22
0
3.3M
R221
10uC226
R22
5
100K
R223
2K
330K
R21
9
2V0_VRTC
RPWRON_EN
RPWRON
END_KEY_IN
PWRON
END
R22
4
100K
R222
10K
END_KEY_IN
END_KEY
KEY_COL7
KEY_ROW6
- 33 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.5 SIM interface
GT360 supports 1.8V & 3V plug in SIM, SIM interface scheme is shown in (Figure 7). SIM_DATA,
SIM_CLK, SIM_RST ports are used to communicate with BBP(S-GOLDRadio).
SIM Interface
SIM_CLK : SIM card reference clock
SIM_RST : SIM card Async /sync reset
SIM_DATA : SIM card bidirectional data
Figure 7. SIM Circuit
SIM CONNECTOR
C548
1000p
2V9_VSIM
4C5C6
5
C76
GND178
GND2GND39
10GND4
J5001
C12
C2C3
3
22p
C547
R52
3
DN
I
15K
C546
R522
2V9_VSIM
DNI
C543
220n
SIM_DATA SIM_CLKSIM_RST
- 34 -
3. TECHNICAL BRIEF
3.6 Micro SD external memory Interface
In GT360 series a Micro SD slot for external Memory is connected to PMB8888.
Micro SD memory pad assign.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 8. Micro SD Card Circuit
MICRO SD Connector2V62_VIO
27p27pC533C531
27pC530
100K
27pC532
R50
4
100K
R50
2
100K
R50
3
C534
2V9_VMMC
1u
VDD
VSS
S500
CD_DAT3
CLK
CMD
DAT0
DAT1_2
DAT2DETECT_ADETECT_B
DUMMY1
DUMMY2
DUMMY3
GND
2V9_VMMC
AXA463062P
100K
R50
8
100K
R50
0
27pC529
27p27pC527 C528C526
27p
100K
R50
1
MMC_CMD
MMC_CLK
MMC_D0
MMC_D1
MMC_DETMMC_D2
MMC_D3
SD mode
Pin No. Name Type Description
DAT1_2 MMC_D1 I/O Data bit [1]
DUMMY1 NC
DAT0 MMC_D0 I/O Data bit [0]
VSS GND GND Ground
CLK MMC_CLK I Clock
VDD 2V9_VMMC Power Power
CMD MMC_CMD I/O Command response
CD_DAT3 MMC_D3 I/O Data bit [1]
DUMMY2 NC
DAT2 MMC_D2 I/O Data bit [2]
DETECT_A MMC_DET
DETECT_B GND GND Ground
DUMMY3 GND GND Ground
- 35 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.7 Memory
1Gbit NAND Flash & 512Mbit SDRAM employed on GT360 series with 8 bit bus for NAND and 16bit
bus for SDRAM thru ADD(0) ~ ADD(24). The 1Gbit NAND Flash memory with SDRAM stacked device
family offers multiple high-performance solutions.
0.1uC138
1V8_VSD2
C1340.1u
R11
0
3.3K
R10
9
3.3K
TP105
TP100
1V8_VSD2
TP104
R105 22R106 22
TP102
1V8_VSD2
0.1uC135C131
0.1u
1V8_VSD2
C1370.1u
0.1uC133C132
0.1u
0.1uC136
R111
1
E2VSSQ1
J2VSSQ2
L2VSSQ3
_CASF7
C6_CE
_CSE9
_RASE7
_REE5
D6_WE
F8_WED
_WPF5
N7VCC2
VCCQN6
VDD1B4
VDD2G9H2
VDD3M2
VDD4
D2VDDQ1
F2VDDQ2
K2VDDQ3
C2VSS1VSS2
F9G2
VSS3VSS4
N4
B5VSS5
N5VSS6VSS7
N8
M6
NC
18N
C19
M7
B7
NC
2
M8
NC
20N
C21
N2
N9
NC
22
B9
NC
3E
8N
C4
NC
5F
3F
6N
C6
G4
NC
7N
C8
G5
G6
NC
9
E6R__B
UDQMH3
VCC1B6
J6IO2
L6IO3IO4
J7
IO5L7J8
IO6L8
IO7
LDQMG3
NC
1B
2
NC
10H
5H
6N
C11
NC
12J3
NC
13K
5K
6N
C14
NC
15K
7K
8N
C16
NC
17M
5K4
DQ10DQ11
L3L4
DQ12DQ13
M3M4
DQ14N3
DQ15
DQ2C3D4
DQ3DQ4
D3E4
DQ5DQ6
E3F4
DQ7J4
DQ8DQ9
K3
IO0J5
IO1L5
G8CKE
CLEC5
H4CLK
DN
U1
A2
P9
DN
U10
DN
U11
P10
A9
DN
U2
DN
U3
A10
B1
DN
U4
DN
U5
B10
N1
DN
U6
DN
U7
N10
P1
DN
U8
DN
U9
P2
B3DQ0
C4DQ1
A0C7C8
A1
A10D9
A11H9
A12G7
A2C9
A3B8
A4M9
A5L9
A6K9
A7J9
A8H7H8
A9
ALED5
BA0D7D8
BA1 K5D1G12ACD-D075
U100
SDRAM_CS
M_RESET
DATA(0:15)
DATA(0:7)
DATA(15)
DATA(4)DATA(5)DATA(6)DATA(7)DATA(8)DATA(9)DATA(10)DATA(11)DATA(12)DATA(13)DATA(14)
DATA(0)DATA(1)DATA(2)DATA(3)
DATA(3)DATA(4)DATA(5)DATA(6)DATA(7)
SDCLKI
FLASH1_CS
ADD(0:12)
ADD(12)
ADD(2)ADD(3)ADD(4)ADD(5)ADD(6)ADD(7)ADD(8)ADD(9)
DATA(0)DATA(1)DATA(2)
ADD(0)ADD(1)
ADD(10)ADD(11)
_WRFCDP
ADD(13)ADD(14)
CKE
_CAS_RAS
_WR
_BC0_BC1
SDCLKO
ADD(16)ADD(17)
_RD
Figure 9. Memory Circuit
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.8 LCD Display
LCD module include:
- Main LCD: 240x320 262K TFT 2.4”
- Backlight : 5 piece of white LED
LCD Connector Interface Spec:
Table 7. LCD Connector Interface Spec.
3. TECHNICAL BRIEF
- 36 -
Pin No. Pin Name I/O Description
1 GND Ground
2 PWM O PWM signal output for backlight control
3 DTX3 I Interface Mode
4 DTX1 I Interface Mode
5 DTX1 I Interface Mode
6 VSYNC-O O Vsync Interface out
7 RD O Read
8 WR I/O Write
9 RS I/O Address/Data select
10 CS I/O Chip Select
11 D15 I/O Data[15] for LCD
12 D14 I/O Data[14] for LCD
13 D13 I/O Data[13] for LCD
14 D12 I/O Data[12] for LCD
15 D11 I/O Data[11] for LCD
16 D10 I/O Data[10] for LCD
17 D9 I/O Data[9] for LCD
18 D8 I/O Data[8] for LCD
19 D7 I/O Data[7] for LCD
20 D6 I/O Data[6] for LCD
21 D5 I/O Data[5] for LCD
22 D4 I/O Data[4] for LCD
23 D3 I/O Data[3] for LCD
- 37 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Pin No. Pin Name I/O Description
24 D2 I/O Data[2] for LCD
25 D1 I/O Data[1] for LCD
26 D0 I/O Data[0] for LCD
27 LCD-ID I Menufacture ID
28 VCC1 I Logic
29 VCC1 I Analog
30 RESET I/O LCD reset
31 MLED5 O LED Cathode
32 MLED4 O LED Cathode
34 MLED3 O LED Cathode
34 MLED2 O LED Cathode
35 MLED1 O LED Cathode
36 MLED I LED Anode
37 GND - Ground
- 38 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 10. 37pin LCD connector circuit
IFMODE(1)IFMODE(0)
EVLC14S02050VA101
3132
3334
3536
37
45
67
89
1718
19
2
2021
2223
2425
2627
2829
3
30
CN1001
1011
1213
1415
16
R102 0
2V62_VIO
0R101
0.1uC100R100
100K
DIF_D(3)DIF_D(4)DIF_D(5)DIF_D(6)DIF_D(7)
LCD_ID
DIF_RESET
DIF_CSDIF_CDDIF_WR
DIF_VSYNCDIF_RD
IF_MODE3
DIF_D(0)DIF_D(1)DIF_D(2)
LCD_BL_PWM
MLED5MLED4MLED3MLED2MLED1MLED
- 39 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.9 Keypad Switching & Scanning
The keypad is controlled by a Key coder IC (PP2106M2). It can be used for scanning keypads up to 8
rows and 8 columns (max 64 keys). PMB8888 control PP2106M2 by KEY_I2C_SCL, KEY_I2C_SDA
and KEY_INT.
Figure 11-1. Keypad Configuration Circuit
(1%)
QWERTY KEY
4.7K
R415
R41
847
0
R410 470
470R404
2V62_VIO
R403 470
470R412R411 0
C41
727
p
27p
C40
2
C423 27p
C40
427
p
27p
C41
5
C401 0.1uF
C41
6
C41
427
p
27p
C41
827
p
470R409
R414 470
TEST
23V
DD
26X
IX
O25
R406 4701817
P44P45
16
P4615
14P
47
13P
50
12P
51
11P
52P
53109
P54
P555
P5643
P57
PG
ND
29
RE
SE
TB
27
2SEL_28P
1
PP2106M2
CL
K_S
EL
24
GN
D1
8G
ND
228
P10
22
7P15P17
6
21P40P41
20
P4219
P43U400
R40
10
2V62
_VIO
120KR400
0.1uF
C400
470
R41
6R
417
470
470
R41
9
27pC422
C40
327
p
470R405
R40
2
4.7K
2V62_VIO
C41
927
p
R407 470
C420 27p
27pC421
2V62_VIO
0R413
27pC424
C41
327
p
470
R42
0
470R408
KEY_ROW4
KE
Y_C
OL4
KE
Y_C
OL2
KE
Y_C
OL0
KEY_COL7
KEY_COL5
KEY_ROW1
KEY_ROW3
KE
Y_I
2C_S
DA
KEY_I2C_SCLKEY_INT KEY_ROW5
KE
Y_C
OL3
KE
Y_C
OL1
KEY_COL6
KEY_ROW6
KEY_ROW0
KEY_ROW2
- 40 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 11-2. Keypad Configuration Circuit
Soft2OIE
Y
MNV
Soft1
GD
FZSym
MSGLSpaceSFn
CLRH
K
UT
PJ
W
RAQ
CXShift
ENTERB
KB405
KB409KB408
C42727p
KB402
KB413KB412KB411
C42627p
KB407KB403 KB406KB404
KB427
KB410
KB421
KB414
KB434
KB431KB428KB425 KB426
KB400
KB415
KB429
KB420
KB401
KB424
KB423KB422KB419KB418KB416 KB417
C42527p
KB433
KB430
KB432
KEY_COL6
KEY_ROW4
KEY_ROW0
KEY_COL7
KEY_ROW1
KEY_ROW3
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4
KEY_COL5
KEY_ROW2
END
OK
DOWNUPLEFT
RIGHTCLRHOT
SENDSOFT2SOFT1103
107
104
VA100EVL14S02200
101
106
102
VBAT
150R112
KB100
105
108 109
100
KEY_ROW5
KEY_COL4
KEY_COL5
KEY_COL6
KEY_ROW4
END_KEY
KEY_COL7
KEY_ROW6
- 41 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.10 Touch KEY
The Touch keypad is controlled by CY8C20434. PMB8888 control CY8C20434 by TOUCH_SCL,
TOUCH_SDA and TOUCH_INT.
- 42 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.11 Keypad back-light illumination
There are 3 snow white color LEDs on Main PCB and 7 blue color LEDs on Sub PCB for keypad
illumination. Sub Keypad Back-light is controlled by S-GOLDradio PWM port which has a duty control
function. And Main Keypad Back-light is controlled by S-GOLDradio FLASH_SINK port. The whole
configuration of the S-GOLDradio Flash LED circuit is shown in below Figure12.
- 43 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 12. Qwerty + Multi_Keypad Backlight Circuit
QWERTY_KEY BACKLIGHT
R311
47
47
R312
47
R310
VBAT
LD300LEWWS44-E
LEWWS44-E LD302
LEWWS44-E LD301
VA
301
ICV
N05
05X
150F
RQWERTY_KEY_BL
MULTI_KEY BACKLIGHT
100o
hm
R10
7
VBAT
R11
1
10K
1uC101
2SC5585Q100
1K
R110
LE
BB
-S14
E
LD
100
LE
BB
-S14
E
LD
101
LE
BB
-S14
E
LD
104
LE
BB
-S14
E
LD
105
R10
410
0oh
m
LD
102
LE
BB
-S14
E
100o
hm
R10
5
LD
103
LE
BB
-S14
ER10
610
0oh
m
100o
hm
R10
3
LD
106
LE
BB
-S14
E
C1021u10
0oh
mR
109
R10
810
0oh
m
SUB_KEY_BL
- 44 -
3. TECHNICAL BRIEF
3.12 LCD back light illumination
MAX8630W is a charge pump designed to support PWM control mode. And MAX8630W supports 5
white LEDs. The MAX8630W is capable of driving up to 5 LEDs at a total of 100mA(MAX8630W
100mA).
The current sinks may be operated individually or in parallel for driving higher current LEDs. To
maximize power efficiency, the charge pump operates in 1X, 1.5X, or 2X mode, where the mode of
operation is automatically selected by comparing the forward voltage of each LED with the input
voltage.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LCD BACKLIGHT
C1140.1u
DNIR114
12LED3
11LED4
10LED5
7OUT
8PWM P_GND
15
MAX8630WU100
C1N
26C
1P
C2N
45C
2P
9CPWM
GND1
IN3
14LED1
13LED2
C115 1u
1uC104
C103 1u
100K
R11
6
0R115
C11
2C
111
9p
C10
9
9p9pC
110
9p
C10
8C
107
9pVBAT
9p
1uC113
MLED1
MLED
MLED3MLED2
MLED5MLED4
DBB_BL_PWM
LCD_BL_PWM
Figure 13. Charge-Pump Circuit
3.13 ISP(Image Signal Processor)
GT360 Series support Camera resolution up to 2M pixel. Camera Sensor I/F is integrated in the S-
GOLDradio(PMB8888).
- 45 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 14. ISP & Camera Circuit
DN
IR
119
K11
DIF
_CS
1D
IF_C
S2
K8
DIF
_D0
E17
G15
DIF
_D1
DIF
_D2
G17
C19
DIF
_D3
G16
DIF
_D4
DIF
_D5
C18
H15
DIF
_D6
DIF
_D7
F16
DIF
_HD
F15
H10
DIF
_RD
DIF
_RE
SE
T2_
GP
IOF
17D
IF_V
DH
16
DIF
_WR
J9
V14
CIF
_D0
CIF
_D1
U13
T12
CIF
_D2
CIF
_D3
T13
R11
CIF
_D4
CIF
_D5
R12
V13
CIF
_D6
T11
CIF
_D7
V12
CIF
_HS
YN
CC
IF_P
CL
KW
12
CIF
_PD
_GP
IOW
11W
10C
IF_R
ES
ET
_GP
IO
CIF
_VS
YN
CV
11U
11C
LK
OU
T2
C17
DIF
_CD
DIF
_CD
EO
C
CA
M_M
CL
KC
AM
_PW
DN
CA
M_R
ST
DIF
_RD
DIF
_VS
YN
CK
EY
_IN
TD
SR
BT
_IN
T
CA
M_D
(0)
CA
M_D
(1)
CA
M_D
(2)
CA
M_D
(3)
CA
M_D
(4)
CA
M_D
(5)
CA
M_D
(6)
CA
M_D
(7)
CA
M_P
CL
KC
AM
_HS
CA
M_V
S
DIF
_D(0
)D
IF_D
(1)
DIF
_D(2
)D
IF_D
(3)
DIF
_D(4
)D
IF_D
(5)
DIF
_D(6
)D
IF_D
(7)
DIF
_CS
DIF
_WR
CAMERA POWER
2EN1EN2
35
GNDNC14
NC26
PG
ND
9
1VIN VOUT1
87
VOUT2
VBAT
RT9011-MGPQWU500
EUSY0319001C5512.2u
C5522.2u
2V8_VCAMIO
100K
1V8_VCAM
C550
1u
R52
5
CAM_PWR_EN
(ENBY0020401,24PIN,0.9T,SOCKET,AXK7L24227G)
CAMERA CONNECTORC
505
7.5p
R505 10R506 10
10R507
C50
87.
5p
C54
07.
5p
FB500
R511R510 10
1010R512
C51
57.
5p
7.5p
R51510
C53
9
C52
17.
5p
7.5p
C51
97.
5pC
503
C50
17.
5pC
502
7.5p
7.5p
C50
0
C51
07.
5p
C52
37.
5p
R514 1010R516
2V8_VCAMIO1V8_VCAM
2
2021222324
3456789
G1G2
G3G4
1
10111213
141516171819
CN500
AXK7L24227GENBY0020401
R519 1010
R521R520
7.5p
C54
1
10
7.5p
C52
0
C51
87.
5p
7.5p
C52
5
7.5p
C50
6
C50
47.
5p
R509 10
C51
27.
5p
C51
37.
5p
10R513
C50
77.
5p
1uC51
17.
5p
C535
C51
6
C50
97.
5p
7.5p
C51
47.
5p
10R517
C52
47.
5p
C52
27.
5p
10R518
7.5p
C53
8
C53
67.
5pC
537
7.5p
7.5p
C51
7
I2C_SCLI2C_SDA
CAM_PCLK
CAM_D(7)CAM_D(6)CAM_D(5)CAM_D(4)
CAM_D(3)CAM_D(2)CAM_D(1)CAM_D(0)
CAM_PWDNCAM_RST
CAM_MCLKCAM_HSCAM_VS
- 46 -
3. TECHNICAL BRIEF
3.14 JTAG & ETM interface connector
In case of GT360 series mass production, the JTAG interface connector will not be mount on board.
That is only for developing and software debugging purpose.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
222324
G1 G2
G3 G4
6789
16
252627282930
1718192021
CN100
1
101112131415
2345
1V8_VSD2
TDI
_EXTRSTTDO
TMS
RTCKTCK
TRST_N
ON BOARD ARM9 JTAG & ETM INTERFACE
Figure 15. JTAG & ETM Interface Circuit
- 47 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.15 AudioGT360 series Audio signal flow diagram as following diagram.
Figure 16. Audio Signal Flow Diagram
- 48 -
3. TECHNICAL BRIEF
3.15.1 Audio amplifier
We use MAX9877 Audio AMP, which have speaker & headphone amplifiers. An audio signal path can
be selected by I2C command.
3.15.2 Microphone circuit
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 17. Audio AMP Circuit Diagram
AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR
C3021u
C312 1u
0R313
OUT+
B5OUT-
C4
PG
ND
C5
PV
DD
RXIN+D4B4
RXIN-
SCLC3
SDAB3
B1
VD
D
A3
VS
S
B2BIAS
C1NA4
C1PA5
D3
GN
D
HPLA2
HPRA1
INA1D2
INA2D1
C2INB1
C1INB2
D5
C309
MAX9877AEWP_TG45U303
1u
C305 1u
C308 1u
VBAT
0R314
C304 1u
C301
1u
1uC315
0R
300
C311 1u
HSO_L
HSO_R
BB_SND_LBB_SND_R
I2C_SCL
SPK_N
SPK_P
i2C_SDA
FM_SND_RFM_SND_L
Figure 18. Microphone Circuit Diagram
MICMIC
10uC322
39pC321
C31739p
L30
2
100n
H
MICBIAS
EV
LC
14S
0205
0
VA300
L304
100nH
C320
22n
100nH
L303
22n
C31939p
C318
MIC300
SPU0409HE5H-PB
2G1G2
3
O4
P1
MIC_P
MIC_N
- 49 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.16 Charging circuit
ISL9221 accepts two power inputs, normally one from a USB (Universal Serial Bus) port and the otherfrom a desktop cradle.The ISL9221 features 28V and 7V maximum voltages for the cradle and the USB inputs respectively.Due to the 28V rating for the cradle input, low-cost, large output tolerance adapters can be usedsafely.An over voltage protection functions are integrated in ISL9221 for USB & Charge
Figure 19. Charging Circuit Diagram
(1%)
(160
8,25
V,K
,X5R
)
(100
5,10
V,K
,X5R
)
(100
5,10
V,K
,X5R
)
(100
5,10
V,K
,X5R
)
(1%)
CHARGING IC OVP
(1%)
(160
8,25
V,K
,X5R
)
C2131u
1
VDC_BYP12
2VUSB
_CHG4
_EN5
3_PPR
BAT11
8GND
6IMIN
IUSB7
IVDC9
13PGND
10USB_BYP
VDC
ISL9221U201
VCHG_OVP VBUS_OVP
VBUS_USB
C2101u
VCHG
C2111u
2V62_VIO
100K
R20
9
2V0_VRTC
R22
6
DN
I
R21
6
33K
R21
3
10K
1uC212
100K
R21
5
VBAT
R21
4
16KC209
1u
CHG_EN
EOC
- 50 -
3. TECHNICAL BRIEF
3.17 BLUETOOTH
General FeaturesThe BlueCore 5-FM BGA is a single chip radio and baseband IC for Bluetooth 2.4 GHz systemsincluding enhanced data rates (EDR) to 3Mbits/s. It includes an integrated FM receiver with stereoaudio output stage and an RDS demodulator.With the on-chip CSR Bluetooth software stack, it provides a fully compliant Bluetooth system tov2.0+EDR of the specification for data and voice communications.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
BLUETOOTH_CSR
C6070.1u
1R
603
C60915p
L602 470nH
1000pC615
15pC610
2.2R605
FB601
B4
VS
S_L
OH
2
VS
S_P
AD
SG
8
C10
VS
S_P
IO
VS
S_R
AD
IO_1
D2
E2
VS
S_R
AD
IO_2
VS
S_R
AD
IO_3
F2
K2XTAL_INXTAL_OUT
J2
F8
_RS
T
J6
H4
VR
EG
EN
AB
LE
_H
H3
VR
EG
EN
AB
LE
_L
VR
EG
IN_H
J5V
RE
GIN
_LJ1
VR
EG
OU
T_H
K5
VS
S_A
NA
_1C
3
VS
S_A
NA
_2D
3
VS
S_A
NA
_3E
3
VS
S_A
NA
_4F
3
VS
S_A
NA
_5G
3
VS
S_A
NA
_6J3
VS
S_C
OR
EB
6
G9
VS
S_D
IG
VS
S_F
M1_
1B
2C
1V
SS
_FM
1_2
VS
S_F
M2
H6UART_RTS
H5UART_RX
K7UART_TX
J8
USB_DNK6
USB_DPJ7
VD
D_A
NA
K1
A6
VD
D_A
UD
IO
VD
D_C
OR
E_1
A7
H10
VD
D_C
OR
E_2
A2
VD
D_F
M
VD
D_L
OH
1
G10
VD
D_P
AD
S
VD
D_P
IOB
10
VD
D_R
AD
IO_1
C2
G2
VD
D_R
AD
IO_2
VD
D_U
SB
PIO
_5P
IO_6
F9
F10
PIO
_7P
IO_8
C5
B7
PIO
_9
RF_NG1F1
RF_P
D1RX_NRX_P
E1
H8
SP
I_C
LK
SP
I_M
ISO
K9
SP
I_M
OS
IK
10
SP
I__C
SJ9
SPKR_LA5A4
SPKR_R
C4
TE
ST
_EN
UART_CTSLO_REF
PCM2_CLKD9
PCM2_INE10
PCM2_OUTD8
PCM2_SYNCD10
PCM_CLKH9
PCM_INK8H7
PCM_OUT
J10PCM_SYNC
PIO
_0A
10A9
PIO
_1
PIO
_10
A8
C6
PIO
_11
PIO
_2B
8B
9P
IO_3
PIO
_4E
9E
8
AIO
_0K
4J4A
IO_1
B5AUX_DAC
AU_REFA3
CLK_32KC9B3
FILT_EXT
FM_NA1B1
FM_P
C7I2C_CLK
I2C_DATAC8
K3
M600BLUECORE5-FM
VBALUN_BT
R600
G2
8G
31NC
2NC_DC
3UB
0
FL600LFB212G45BA1A220
B15
B27
G1
4
6
C604DNI22n
0.1u
C603
C624C6232.2u
2.2uC608
NAL600
FB600
820pC617
TP601
560R604
2V62_VIO
2V9_VAUX
TP605
C6211.5p
1uC602
TP
606
15p
820p
C618
C616
TP603
15pC619
C625 C626
DNI 2.2u
C614
TP602
0.01u
TP604
1R
601
AMAN802015LG14
ANT600
FEED
GND1
GND2
C600DNI
TP600
33nHL601
C60515p
0.1uC601
C611 47n
2V62_VIO
VBALUN_BT
L603 18nH
DNI
C620
C613 1000p
C612 220n
1R
602C606
15p
R607 47KR606 470K
BT
_VC
XO
_EN
BT
_IN
T
I2S1_CLK
I2S1_TXI2S1_RX
I2S1_WA0
UART_BT_CTS
UART_BT_RX
BT
_RE
SE
T
FM_SND_RFM_SND_L
UART_BT_RTS
UART_BT_TX
CLK32K
FM_ANT
26MHZ_BT
Figure 20. Bluetooth / FM Radio Circuit Diagram
- 51 -
3. TECHNICAL BRIEF
Bluetooth Radio- Common TX/RX teminal simplifies external matching, eliminates external antenna switch- No external trimming is required In production- Bluetooth v2.0 + EDR Specification compliant
Bluetooth Transmitter- +6 dBm RF Transmit power with level control from on-chip 6-bit DAC over a dynamic range > 30dB- Class 2 and Class 3 support without the need for an external power amplifier or TX/RX switch.
Bluetooth Receiver- Integrated channel filters- Digital demodulator for improved sensitivity and co-channel rejection- Real time digitized RSSI available on HCI interface- Fast AGC for enhanced dynamic range- Channel classification for AFH
Synthesiser- Fully integrated synthesizer requires no external VCO varactor diode, resonator or loop filter- Compatible with crystals between 7.5 and 40MHz(in multiples of 250KHz) or an external clock
Audio- Single-ended stereo analogue output- 16-bit 48 kHz digital audio bit stream output
Baseband and Software- Internal 48Kbyte RAM, allows full speed data transfer, mixed voice and data, and full piconet
operation, including all medium rate packet types- Logic for forward error correction, header error control, access code correlation. CRC, demodulation,
encryption bit stream generation, whitening and transmit pulse shaping. Supports all Bluetooth v 2.0 + EDR features incl. ESCO and AFH
- Transcoders for A-law, u-law and linear voice from host and A-law, u-law and CVSD voice over air
Physical Interfaces- Synchronous serial interface up to 4Mbits/s for system debugging- UART interface with programmable baud rate up to 4Mbits/s with an optional bypass mode- USB v1.1 interface- I2C slave for FM- Two audio PCM interfaces (input and output)- Analogue stereo (output only)
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 52 -
3. TECHNICAL BRIEF
3.18 FM Radio
• Simultaneous operation with Bluetooth
• Support of US/Europe (87.5 to 108 MHz) and Japanese (76 to 90 MHz) FM band
• Wide dynamic range AGC
• Soft mute and stereo blend
• Adjustment-free stereo decoder and AFC
• Autonomous search tuning function (up/down) with programmability (threshold setting)
• RDS demodulator
• Audio output available over Bluetooth audio interface or dedicated audio output
• Control of FM via Bluetooth HCI or I2C
• Adaptive filter to suppress narrow band interference in the FM channel
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Bluetoot
Antenn
2 .4
F
Radi
I/ORO
MM
Processo
2.4 GH
Radi
RA
AUDIO
Driver
UAR
PI
I2S(PCM
RIN / OU
Main PMB 8888
RF
Stereo Analogu
VBT_2V
BlueCor -5 F
Figure 21. Bluetooth / FM Radio Block Diagram
- 53 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.19 18pin Multi Media Interface connector
Table 11. Multi media interface pin assign
KM380 series MMI
Pin Function Description
1 FM_ANT FM radio antenna / Audio ground
2 HS_MIC Headset microphone signal
3 JACK_TYPE Not used
4 HS_OUT_L Headset left sound
5 HS_OUT_R Headset Right sound
6 USB_DP USB_DP
7 UDB_DM USB_DM
8 JACK_DET Headset detect (active low)
9 VBAT Battery voltage
10 VBAT Battery voltage
11 RPWRON_EN Remote power on (active high. 2.8V)
12 VCHG Charger voltage
13 VCHG Charger voltage
14 DSR Not used
15 VBUS_USB USB VBUS
16 UART_Tx UART Tx
17 UART_Rx UART Rx
18 GND Power GND
- 54 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
(160
8,25
V,K
,X5R
)
2 : Headset MIC
12,13 : CHG
9,10 : BATT
15 : VUSB
3 : Jack type
14 : DSR
16 : D/ TX
8 : JACK_D
18PIN IO CONNECTOR
11 : R/ON
4 : CTS/HSO_L
5 : RTS/HSO_R
7 : USB-/Remote_ADC/RXD
6 : USB+/Remote_INT/TXD
17 : D/ RX
(100
5,10
V,K
,X5R
)
C21
439
p
0.1uC200
1uC
216
100pC201
C202 0.1u
GN
D1
GN
D2
INO
UT
ICV
FP
1018
1E30
1FR
FL
200
47R211
RPWRON_EN
DSR
RXTX
DN
IR
206
C20827p
39p
C20
4
10u
C20
3
24p
47R210
L20
0 C205
100n
H
1R229
R20
7
1.5KR202
DN
I
1800FB201
R2032.2K
10K
R20
4
FB206 1800
27p
C206 0.1u
C207
DN
I
R22
7
VBUS_USB
2V5_VAUDIO
330K
2V62_VIO
R201
VBUS_USB
R208 DNI
FB203 1800
C218
47R212
2V5_VAUDIO2V62_VIO
27p
R230
VBAT
0
27p
100K
R20
5
C217
VIN-
1M
R200
U200
NCS2200SQ2T2G
GND
2
1OUT
5VCC
VIN+3
4
1R228 6789
VCHG
1112131415161718
19
2
20
21
22
345
CN200
1
10
C21
51u
1800FB202
USB_DP
FB200 1800
USB_DM
HSO_L
HSO_R
FM_ANT
JACK_TYPE
DSR
HS_MIC_N
HS_MIC_P
HOOK_DETECT
RPWRON_EN
JACK_DET
UART_RXUART_TX
Figure 22. 18 Pin Multi port Circuit Diagram
- 55 -
3. TECHNICAL BRIEF
3.20 General Description
The RF transceiver is integrated in S-GOLDradio(PMB8888),which suppors quad-band operation for
voice and data transfer applications. The whole transceiver function is integrated in main IC, PMB8888
provides 4 LNA inputs for RF receiving and two outputs for PAM input for High/Low band. A direct
conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA
functionality.
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 23. PMB 8888 Function Block Diagram
- 56 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
R10
4
390K
VBAT
R10
7
100K
XOW8W7
XOX
T5VDET
P3VRAMP
K9T_OUT8
TX1V3W3
TX2
T_OUT3A18J10
T_OUT4T_OUT5
H11E13
T_OUT6T_OUT7
B19
W2RX1RX1X
V1U1
RX2T1
RX2X
RX3R1
P1RX3X
RX4N1
RX4XM1
PABIASR3R4
PABS
PAENM3
PAMODEU5
REFRU4
M8G3J4
M9
M0H3J3
M1
M10F4
M2G4H4
M7
FE1N4P5
FE2
G19CLKOUT0
CC_CLKU9
V10CC_IO
V9CC_RST
R10
8
4.7K
26MHz
X100NX3225SA
GND1 2
4GND2
HOT11
3HOT2
R102
0
DNI
R103
LIN_PWM_FRQRPWRON
LCD_ID
CHG_EN
JACK_TYPE
DCS1800_RXN
BAT_ID
TX_RAMP
PA_ENVC2VC1
PA_BAND
PCS1900_RXN
PCS1900_RXP
DCS1800_RXP
UART_BT_RTSUART_BT_CTS
TOUCH_INT
SIM_DATASIM_CLKSIM_RST
PA_MODE
RF_TEMP
GSM850_RXPGSM850_RXNGSM900_RXPGSM900_RXN
TXHBTXLB
Figure 24. S-GOLD Radio Circuit Diagram
- 57 -
3. TECHNICAL BRIEF
3.21 Receiver part
The constant gain direct conversion receiver contains all active circuits for a complete receiver chain
for GSM/GPRS/EDGE (see Figure 25). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced
inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated
by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
Down conversion to baseband domain is performed by low/high band quadrature direct down
conversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output buffer
and DC-offset compensation. The 3rd order low pass filter is fully integrated and provides sufficient
suppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasing
through the baseband ADC. The receive path is fully differential to suppress on-chip interferences.
Several gain steps are implemented to cope with the dynamic range of the input signals. Depending
on the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable.
Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) to
reduce the DC-offset at baseband-output. A programmable gain correction can be applied to correct
for front end- and receiver gain tolerances.
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 25. Receiver Block Diagram of S-GOLDradio
- 58 -
3. TECHNICAL BRIEF
3.22 Transmitter part
The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for
DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N
Sigma-Delta synthesizer without any external components (see Figure26). The analog I/Q modulation
data from the baseband is converted to digital, filtered and transformed to polar coordinates. The
phase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of its
associated VCO is divided by four or two, respectively, and connected via an output buffer to the
appropriate single ended output pin. This configuration ensures minimum noise level. The 8PSK
transmitter supports power class E2 for GSM850 and GSM900 as well as for DCS1800 and PCS1900.
The digital transmitter architecture is based on a polar modulation architecture, where the analog
modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently
transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude
information is fed into a digital multiplier for power ramping and level control. The ready processed
amplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analog
amplitude information.
The phase signal from the CORDIC is applied to the Sigma-Delta fractional-N modulation loop. The
divided output of its associated VCO is fed to a highly linear amplitude modulator, recombining
amplitude and phase information. The output of the amplitude modulator is connected to a single
ended output RF PGA for digitally setting the wanted transmit power. The PA interface of SMARTi-PM
supports direct control of standard dual mode power amplifiers (PA’s) which usually have a power
control input VAPC and an optional bias control pin VBIAS for efficiency enhancement. In GMSK
mode, the PA is in saturated high efficiency mode and is controlled via its VAPC pin directly by the
baseband ramping DAC.
In this way both up- / down-ramping and output power level are set. In 8PSK mode, the ramping
functionality is assured by an on-chip ramping generator, whereas output power is controlled by the
PGA’s as described above.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 59 -
3. TECHNICAL BRIEF
3.23 RF synthesizer
The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX
operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma-
Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided
by the internal crystal oscillator. This frequency serves as comparison frequency of the phase detector
and as clock frequency for all digital circuitry.The divider in the feedback path of the synthesizer is
carried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidth
is about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automatically
adjusted prior to each slot (OLGA2). To overcome the statistical spread of the loop filter element values
an automatic loop filter adjustment (ALFA) is performed before each synthesizer startup.
The fully integrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz)
and operates at double or four times transmit or receive frequency. To cover the wide frequency range
the VCO is automatically aligned by a binary automatic band selection (BABS) before each
synthesizer startup.
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 26. Transmitter Architecture Block Diagram
- 60 -
3. TECHNICAL BRIEF
3.24 DCXO
The transceiver contains a fully integrated 26MHz digitally controlled crystal oscillator (DCXO) with
three outputs for the system clock, one output for the GSM baseband and two additional for other
subsystems (GPS, Bluetooth, etc.). The only external part of the oscillator is the crystal itself. The
overall pulling range of the DCXO consists of eight subranges. The subrange closest to the ‘0ppm’ at
the middle AFC-value is selected during the calibration process in the mobile’s production and is used
for the rest of the lifetime. The frequency tuning is performed along the selected subrange by
programming the frequency control word (XO_TUNE) via the three wire bus (“3Wbus”).
3.25 Front End Module control
Implemented in the Transceiver are two outputs for direct control of front end modules with two logic
input pins to select RX- and TX-mode as well as low- and high band operation.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
PIN 14
DCS1800
L
L
L
GSM900
L
PCS1900
L
EGSM900 RX
GSM850L
DCS1800 RX
L
H
RF
GSM850_EGSM TX
GSM850 RX
L
VC2
DCS_PCS TX
PIN 13
H
VC1
PCS1900 RX L
L
5.1nH
L609
C6453.9p
PAD601
3.9pC646
3.3pC648
PAD600
C62233p
0.5pC634
0
R608 C631
5p
22nH
L607
33pC627
12nHL605
DNIC641
13G
SM
850_
900T
X
GS
M90
0RX
13 4
GS
M90
0RX
2
NC
119
NC
22016
VC
1V
C2
10
17ANT
GN
D1
9
GN
D2
12 14G
ND
3G
ND
415 18
GN
D5
GS
M18
00R
X1
5 6G
SM
1800
RX
2
GS
M18
00_1
900T
X117
GS
M19
00R
X1
GS
M19
00R
X2
8
GS
M85
0RX
11 2
GS
M85
0RX
2
NAL604
LMSP43NA-782U601
2.5pC643 C644
2.5p
PAD602
5.6pC650
3.3pC647
22pC632
5.6pC649
L608
5.6nH
L610
18nH
CN600MM8430-2600RB3
3G
ND
14
GN
D2
GN
D3
5G
ND
46
1IN OU
T 2
0.75pC633
VC1
VC2
GS
M85
0_R
XP
GS
M85
0_R
XN
GS
M90
0_R
XN
GS
M90
0_R
XP
DC
S18
00_R
XP
DC
S18
00_R
XN
PC
S19
00_R
XN
PC
S19
00_R
XP
Figure 27. FEM Circuit Diagram
- 61 -
3. TECHNICAL BRIEF
3.26 Power Amplifier Module
Table 10 PAM pin description
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
1R612
1R610
0.5pC635
0.5pC634
C636DNIR615
1 C642
1
DNIDNIC641
R613
10KR611
C63847p
1uC629
VBAT
1.2nH
L606
R614 1
0.01u 0.01uC640C639
DCS_PCS_IN1
DCS_PCS_OUT12
GND114
GND211
GND38
7GSM850_900_IN
10GSM850_900_OUT
2MODE_SELECT
15PGND
TX_EN6
4VBATT
VRAMP5
TQM7M5005 U600
BS313
BY_CAP1
BY_CAP29
DNIC637
10uC628
27pC630
R609 1
PA_MODE
TXLB
TXHB
PA_BAND
PA_EN
TX_RAMP
Figure 28. Power Amplifier Circuit Diagram
Pin Mame Description
1 MODE GMSK/EDGE Power control mode. L=GMSK, H=EDGE
2 DCS/PCS_IN RF input(DCS/PCS) DC Blocked
3 BS Band Select
4 REVD1 Reserved
5 VBATT DC Supply
6 VRAMP Analog PA Bias Control(All Bands, EDGE Mode)
Analog Output Power Control(All Bands, GMSK Mode)
7 GSM_IN RF input(EGSM) DC Blocked
9 GSM_OUT RF Output(EGSM) DC Blocked
10,11 GND Ground
12 REVD2 Reserved
13,14,15 GND Ground
16 DCS/PCS_OUT RF Output(DCS/PCS) DC Blocked
Pad GND PAD GRID Ground pad grid is device underside.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. PCB layout
- 62 -
4. PCB layout
4.1 Main PCB component placement
Main PCB Top Main PCB Top placement
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. PCB layout
- 63 -
Main PCB bottom Main PCB bottom placement
- 64 -
4. PCB layout
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Battery Connector
Bluetooth & FM radio Chip
Bluetooth Antenna
Camera Connector
BBP
Mobile Switch
Memory
PAM
Power Inductor
Main FPCB Conn.
Vibrator PAD
Speaker PAD
Backup battery
FEM
Vibrator
Key Encoder
SIM Connector
MMIConnector
Hall Effect S/W
MIC
Micro SD Socket
- 65 -
4. PCB layout
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
KEY PCB Top
KEY PCB Bottom
Touch FPCB Conn.
Main FPCB Conn.LCD Conn.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 66 -
5. Trouble shooting
5.1 Trouble shooting test setup
Equipment setup
Power on all of test equipment
-Connect PIF-UNION JIG or dummy battery to the DUT for power up.
-Connect mobile switch cable between Communication test set and DUT when you need to make an
phone call.
-Follow trouble shooting procedure
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 67 -
5.2 Power on Trouble
Check Points
-Battery Voltage( Need to over 3.35V)
-Power-On Key detection (PWRON signal)
END
VA100EVL14S02200
VBAT
150R112
KB100
END_KEY
Remote Power On
Q201
2
56
31
4 EMX18
2K R22
0
3.3M
R221
10uC226
R22
5
100K
R223
2K
330K
R21
9
2V0_VRTC
RPWRON_EN
RPWRON
END_KEY_IN
PWRON
END
R22
4
100K
R222
10K
END_KEY_IN
END_KEY
KEY_COL7
KEY_ROW6
TP1
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 68 -
START
CheckìPWRONî signal of
TP1 2.0V
Check R112 when push the power key
Check ìPWRONî signal of
TP1 0V
Check the BACKUP Battery
Check solder R112 or
Replace Dome Switch(PWR key)
Check solder Q201
Yes
Yes
Yes
Yes
No
No
No
No
Connect power supply to the DUT Vbat = over 3.35V
Check the all LDOís output
Is it correct?
Check solder whole LDO parts or replace it
Q201
TP1
PWR key
Replace main PCB
Is the 26MHz clock from TP2X100 of U102 ?
Check solder Replace X-TAL
No X100
TP2
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 69 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 70 -
5.3 Charging trouble
Check Points
-Connection of TA (check TA voltage 5.6V)
-Charging Current Path component voltage drop
-Battery voltage
1 Charging method : CC-CV
2 Charger detect voltage : 4.0 V
3 Charging time : 2h 30m
4 Charging current : 420 mA
5 CV voltage : 4.2 V
6 Cutoff current : 100 mA
7 Full charge indication current (icon stop current) : 100 mA
8 Recharge voltage : 4.15 V
(100
5,10
V,K
,X5R
)
C21
439
p
GN
D1
GN
D2
INO
UT
ICV
FP
1018
1E30
1FR
FL
200
47
47
1R229
1800FB201
FB206 1800
FB203 1800
47
R230
VBAT
0
1R228 6789
VCHG
1112131415161718
19
2
20
21
22
345
CN200
1
10
C21
51u
1800FB202
FB200 1800
(1%)
(160
8,25
V,K
,X5R
)
(100
5,10
V,K
,X5R
)
(100
5,10
V,K
,X5R
)
(100
5,10
V,K
,X5R
)
(1%)
CHARGING IC OVP
(1%)
(160
8,25
V,K
,X5R
)
C2131u
1
VDC_BYP12
2VUSB
_CHG4
_EN5
3_PPR
BAT11
8GND
6IMIN
IUSB7
IVDC9
13PGND
10USB_BYP
VDC
ISL9221U201
VCHG_OVP VBUS_OVP
VBUS_USB
C2101u
VCHG
C2111u
2V62_VIO
100K
R20
9
2V0_VRTC
R22
6
DN
I
R21
6
33K
R21
3
10K
1uC212
100K
R21
5
VBAT
R21
4
16KC209
1u
CHG_EN
EOC
4.2V~3.75V 3.75V~3.64V 3.64V~3.45V 3.45V~3.35V
TP1
TP2
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 71 -
Yes
Yes
No
START
18pin IO(CN200) Is soldered ?
Source pin (TP1) of FL200
= 5.6V ?
Resolder the CN200
The TA can be broken
Change other TA then retest
Yes
No
No
Output pin (TP2)
of C212=4.2V?
Check solderU201 or replace it
Yes
Battery voltage is over 3.35V?
No charging until battery
Voltage goes up to 3.35V
TP1
TP2
Charge is operating properly
Yes
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 72 -
5.4 LCD display trouble
Check Points
-LCD assembly status ( LCD FPCB, Connector on FPCB)
-EMI filter soldering
-Connector combination
Check the connection LCD FPCB connector
Check signal flow via EMI filter
The LCD backlight enable signal (SUB PCB)
Socket
MAIN To FPCB Connector
ICVE10054E250R201FRFL402
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
VBAT
3
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
FL404 ICVE10054E250R201FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A3
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
FL403 ICVE10184E150R101FR
C41
227
p
C40
827
p
C41
027
pC
411
27p
C40
627
p
27p
C40
9
27p
C40
7
2V62_VIO
6
FL400 ICVE10054E250R201FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B4
C40
527
p
ICVE10054E250R201FRFL401
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
2V8_VVIB
27282930313233343536373839
22
40
23242526
141516171819
2
20
3456789
21
CN4001
10111213
KEY_COL7KEY_COL6KEY_COL5
KEY_ROW6KEY_ROW5KEY_ROW4
SUB_KEY_BL
KEY_COL4
END_KEY
RCV_PRCV_N
DIF_WRDIF_RD
DIF_D(7)DIF_D(6)DIF_D(5)DIF_D(4)
DIF_VSYNCDIF_RESETLCD_IDIF_MODE3
TOUCH_SCL
DBB_BL_PWM
TOUCH_SDATOUCH_INT DIF_D(3)
DIF_D(2)DIF_D(1)DIF_D(0)
DIF_CSDIF_CD
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 73 -
START
Is LCD FPCB normal?
Signal is normal on 2.62V Signal
FL400, FL401, FL402,FL403,FL404
Assemble
Replace LCD FPCB
Check solder and repair
Damaged filter
Yes
Yes
No
No
Check LCD connector combination then LCD test
with New LCD
FL400,401,402,403,404
- 74 -
5. Trouble shooting
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.5 Camera Trouble
Check Points
-Connectors combination
-FPCB status CAMERA POWER
2EN1EN2
35
GNDNC14
NC26
PG
ND
9
1VIN VOUT1
87
VOUT2
VBAT
RT9011-MGPQWU500
EUSY0319001C5512.2u
C5522.2u
2V8_VCAMIO
100K
1V8_VCAM
C550
1u
R52
5
CAM_PWR_EN
(ENBY0020401,24PIN,0.9T,SOCKET,AXK7L24227G)
CAMERA CONNECTORC
505
7.5p
R505 10R506 10
10R507
C50
87.
5p
C54
07.
5p
FB500
R511R510 10
1010R512
C51
57.
5p
7.5p
R51510
C53
9
C52
17.
5p
7.5p
C51
97.
5pC
503
C50
17.
5pC
502
7.5p
7.5p
C50
0
C51
07.
5p
C52
37.
5p
R514 1010R516
2V8_VCAMIO1V8_VCAM
2
2021222324
3456789
G1G2
G3G4
1
10111213
141516171819
CN500
AXK7L24227GENBY0020401
R519 1010
R521R520
7.5p
C54
1
10
7.5p
C52
0
C51
87.
5p
7.5p
C52
5
7.5p
C50
6
C50
47.
5p
R509 10
C51
27.
5p
C51
37.
5p
10R513
C50
77.
5p
1uC51
17.
5p
C535
C51
6
C50
97.
5p
7.5p
C51
47.
5p
10R517
C52
47.
5p
C52
27.
5p
10R518
7.5p
C53
8
C53
67.
5pC
537
7.5p
7.5p
C51
7
I2C_SCLI2C_SDA
CAM_PCLK
CAM_D(7)CAM_D(6)CAM_D(5)CAM_D(4)
CAM_D(3)CAM_D(2)CAM_D(1)CAM_D(0)
CAM_PWDNCAM_RST
CAM_MCLKCAM_HSCAM_VS
Check the connector combination
- 75 -
5. Trouble shooting
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
START
Replace New Camera module
Working properly?
Assemble
Yes
Yes
No
Check camera connector, 24pin main connector Combination then Camera test With equipped camera module
Replace Camera module
Yes
Replace Main PCB
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.6 Receiver & Speaker trouble
Check Points
-Speaker pin contact
-Audio amp soldering
-SUB PMIC soldering
5. Trouble shooting
- 76 -
AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR
C3021u
C312 1u
0R313
OUT+
B5OUT-
C4
PG
ND
C5
PV
DD
RXIN+D4B4
RXIN-
SCLC3
SDAB3
B1
VD
D
A3
VS
S
B2BIAS
C1NA4
C1PA5
D3
GN
D
HPLA2
HPRA1
INA1D2
INA2D1
C2INB1
C1INB2
D5
C309
MAX9877AEWP_TG45U303
1u
C305 1u
C308 1u
VBAT
0R314
C304 1u
C301
1u
1uC315
0R
300
C311 1u
HSO_L
HSO_R
BB_SND_LBB_SND_R
I2C_SCL
SPK_N
SPK_P
i2C_SDA
FM_SND_RFM_SND_L
SPK
1
2
CN501
C54447p
100nH
L501
100nH
L500
EV
LC
18S
0201
5
VA
501
VA
500
EV
LC
18S
0201
5
C542100p
C54547p
SPK_N
SPK_P
MAIN RECEIVER
+
-
0R100
C10247p47p
C101
OUT100
R102 0OUT101
RCV_P
RCV_N
TP1
TP3TP5
TP6TP4
TP2
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 77 -
START
Assemble
Replace Main Board
Replace U303 of main -board
Yes
Check Speaker tension and Contacts are clear.
No
No
Replace Main PCB
Replace Receiver
Check the soldering status Of U303 of main -board
Yes
Input Signal ( TP1, TP2) is Low(0V)?
Output Signal( TP3, TP4) is Low(0V)?
TP3 TP4
TP3
TP4
Receiver Signal( TP5, TP6) High(1.6V)?
TP5 TP6
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 78 -
5.7 Microphone trouble
Check Points
-Microphone hole
-MICBIAS & Signal come from
-Audio signal level of the Microphone
-Soldering of components
MICMIC
10uC322
39pC321
C31739p
L30
2
100n
H
MICBIASE
VL
C14
S02
050
VA300
L304
100nH
C320
22n
100nH
L303
22n
C31939p
C318
MIC300
SPU0409HE5H-PB
2G1G2
3
O4
P1
MIC_P
MIC_N
START
Check the signal level at ( TP1,2)each side of MIC300.
Check mic. Bias line
Yes
No
No
Check microphone sound hole
Replace microphone
(MIC300)
Replace Main PCB
Yes
Mic bias ON (2.5V)when
call?( TP3,L302)
Yes
TP1
TP2
TP3
TP1
TP3
TP2
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 79 -
5.8 Ear-MIc Jack Detection trouble
START
Is the status of FB202, FB203(TP1,2)
low?
Assemble
Resolder FB202, FB203
Yes
No
No
Check the Ear-Jack detection.
Resoldering or Replace CN200
The main board has a problem
Replace Main PCB
Yes
Check the soldering status of CN200
TP1 TP2 CN200
5.9 Vibrator trouble
Check Points
-Connectors combination
TP2
TP3
TP4
TP1
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 80 -
MOTOR CIRCUIT
VIB+
VIB-
R302 100K
C30
31u
2IN_A
1IN_B
4OUT_Y
VCC5
U301 TC7SZ86FU
GND3
3V0_VMOT
OUT300
2200pC307
L301100nH
R30
1
100K
3V0_VMOTVBAT
U300 R1114D301D-TR-F
CE6
2GND1
5GND2
4NC
VDD1 3
VOUT
3V0_VMOT
R306
130K
R305 0
130K
R308
1u
R303 0
C300
R309 100KC314
R304
0
0.01u
R307 0
OUT301
C316 2200p
100nHL300
1uC313
1IN_B
4OUT_Y
VCC5
VO+5
VO-8
1_SHUTDOWN
U304 TC7SZ86FU
GND32
IN_A
TPA6205A1DRBRU302
BYPASS2
GND7
3IN+
4IN-
9PGND
6VDDVIB_PWR_EN
VIB_PWR_EN
LIN_PWM_FRQLIN_INVERT
LIN_PWM_MAG
TP4
TP3TP1
TP2
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 81 -
START
Assemble
Check the soldering of U302,L300,L301
Yes
No
Check Vibrator Connector Combination
Replace Vibrator
Check the signal of OUT300,OUT301
(TP1,2)176Hz 2Vp-p PWM?
Yes
Check the signal of C303 (TP4)
Voltage is 3.0V?
Check the signal of R304 (TP3)
Voltage is 2.6V?
Check the soldering of U300
No
Resoldering of Replace U102
Yes
- 82 -
5. Trouble shooting
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.10 Keypad back light trouble
Check Points
-Signal path is connected well
-TR is working properly
QWERTY_KEY BACKLIGHT
R311
47
47
R312
47
R310
VBAT
LD300LEWWS44-E
LEWWS44-E LD302
LEWWS44-E LD301V
A30
1
ICV
N05
05X
150F
R
QWERTY_KEY_BL
MULTI_KEY BACKLIGHT
100o
hm
R10
7
VBAT
R11
1
10K
1uC101
2SC5585Q100
1K
R110
LE
BB
-S14
E
LD
100
LE
BB
-S14
E
LD
101
LE
BB
-S14
E
LD
104
LE
BB
-S14
E
LD
105
R10
410
0oh
m
LD
102
LE
BB
-S14
E
100o
hm
R10
5
LD
103
LE
BB
-S14
ER10
610
0oh
m
100o
hm
R10
3
LD
106
LE
BB
-S14
E
C1021u10
0oh
mR
109
R10
810
0oh
m
SUB_KEY_BL
TP1
TP2
TP1
TP2
- 83 -
5. Trouble shooting
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
START
Check VBAT
check GPIO signal(SUB_KEY_BL
,TP2) Voltage of Q100 > 0.7v
Check BATTERY
Replace TR(Q100)
Yes
No
No
Check All of LEDs solder
Yes
KEY_LED is operating
check GPIO signal(QWERTY_KEY_BL,TP1) Voltage
of VA301 < 1.0v
Resolder or Replace VA301 or U102
No
5.11 SIM & USD trouble
SIM Check Points
-Power is working
-Socket soldering
-Proper SIM is used
TP1 SIM_CLK
TP3SIM_DATA
TP2 2V9_VSIM
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 84 -
SIM CONNECTOR
C548
1000p
2V9_VSIM
4C5C6
5
C76
GND178
GND2GND39
10GND4
J5001
C12
C2C3
3
22p
C547
R52
3
DN
I
15K
C546
R522
2V9_VSIM
DNI
C543
220n
SIM_DATA SIM_CLKSIM_RSTTP1
TP2TP3
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 85 -
START
6 pins are soldered well?
Check Proper SIM Card
Assemble
Resolder pin
Replace Main Board
Yes
Yes
No
Check All of SIM card voltage KS360 Series support 1.8V & 2.9V SIM only
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 86 -
uSD Check Points
-Power is working
-Socket soldering
-Card detect is working
Card insert Card eject
2V62_VIO
27p27pC533C531
27pC530
100K
27pC532
R50
4
100K
R50
2
100K
R50
3
C534
2V9_VMMC
1u
VDD
VSS
S500
CD_DAT3
CLK
CMD
DAT0
DAT1_2
DAT2DETECT_ADETECT_B
DUMMY1
DUMMY2
DUMMY3
GND
2V9_VMMC
AXA463062P
100K
R50
8
100K
R50
0
27pC529
27p27pC527 C528C526
27p
100K
R50
1
MMC_CMD
MMC_CLK
MMC_D0
MMC_D1
MMC_DETMMC_D2
MMC_D3
TP1TP2
TP2TP4
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 87 -
START
TF socket pins are well soldered
Check proper uSD?
Assemble
Resolder it (check data line
uSD D0~D3 (TP1~4)is 2.9V
Replace Main Board
Yes
Yes
No
Check Micro SD card voltage (2V9_VMMC)
- 88 -
5. Trouble shooting
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.12 Touch trouble
Touch Check Points
-Power is working
-Connector soldering
-Touch IC soldering
(* After press the touch hot key, Touch key will works )
TP5 TP6
TP7
TP8
Socket
MAIN To FPCB Connector
ICVE10054E250R201FRFL402
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
VBAT
3
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
FL404 ICVE10054E250R201FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A3
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
FL403 ICVE10184E150R101FR
C41
227
p
C40
827
p
C41
027
pC
411
27p
C40
627
p
27p
C40
9
27p
C40
7
2V62_VIO
6
FL400 ICVE10054E250R201FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B4
C40
527
p
ICVE10054E250R201FRFL401
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
2V8_VVIB
27282930313233343536373839
22
40
23242526
141516171819
2
20
3456789
21
CN4001
10111213
KEY_COL7KEY_COL6KEY_COL5
KEY_ROW6KEY_ROW5KEY_ROW4
SUB_KEY_BL
KEY_COL4
END_KEY
RCV_PRCV_N
DIF_WRDIF_RD
DIF_D(7)DIF_D(6)DIF_D(5)DIF_D(4)
DIF_VSYNCDIF_RESETLCD_IDIF_MODE3
TOUCH_SCL
DBB_BL_PWM
TOUCH_SDATOUCH_INT DIF_D(3)
DIF_D(2)DIF_D(1)DIF_D(0)
DIF_CSDIF_CD
- 89 -
5. Trouble shooting
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
START
Touch IC is well soldered?
Assemble
Yes
Yes
No
Check Touch Connector Combination
Yes
No
Change the Touch window
Yes
Check the voltage of TP1~4. Voltage is
2.8V?
Resolder FL403 or Replace Main Board
Check the voltage of TP5~8. Voltage is
2.8V?
Replace Main or SUB FPCB
Rosolder Touch IC
TP5
TP6
TP7
TP8
TP1~ 3
TP4
- 90 -
5. Trouble shooting
5.13 Qwerty Key trouble
Key Check Points
-Dome switch contacts
-Key coder IC soldering
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
(1%)
QWERTY KEY
4.7K
R415
R41
847
0
R410 470
470R404
2V62_VIO
R403 470
470R412R411 0
C41
727
p
27p
C40
2
C423 27p
C40
427
p
27p
C41
5
C401 0.1uF
C41
6
C41
427
p
27p
C41
827
p
470R409
R414 470
TEST
23V
DD
26X
IX
O25
R406 4701817
P44P45
16
P4615
14P
47
13P
50
12P
51
11P
52P
53109
P54
P555
P5643
P57
PG
ND
29
RE
SE
TB
27
2SEL_28P
1
PP2106M2
CL
K_S
EL
24
GN
D1
8G
ND
228
P10
22
7P15P17
6
21P40P41
20
P4219
P43U400
R40
10
2V62
_VIO
120KR400
0.1uF
C400
470
R41
6R
417
470
470
R41
9
27pC422
C40
327
p
470R405
R40
2
4.7K
2V62_VIO
C41
927
p
R407 470
C420 27p
27pC421
2V62_VIO
0R413
27pC424
C41
327
p
470
R42
0
470R408
KEY_ROW4
KE
Y_C
OL4
KE
Y_C
OL2
KE
Y_C
OL0
KEY_COL7
KEY_COL5
KEY_ROW1
KEY_ROW3
KE
Y_I
2C_S
DA
KEY_I2C_SCLKEY_INT KEY_ROW5
KE
Y_C
OL3
KE
Y_C
OL1
KEY_COL6
KEY_ROW6
KEY_ROW0
KEY_ROW2
TP2TP1
TP4
TP3
- 91 -
5. Trouble shooting
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Fig 6 Waveform of DCXO
START
Check soldering of components of
U400
Assemble
Resolder the component
Yes
No
No
Check the Dome switch contacts are clear
Check the voltage of TP1~4.
Volta ge is 2.6V?
Resolder or Replace U400
Domeswitch
TP3
TP1 TP2
TP4
- 92 -
5. Trouble shooting
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.14 Trouble Shooting of Receiver Part
START
Check point VCTCXO
Check point PLL Control
Setup Test Equipment Cell Power : -7 4dBm
GSM850 CH190/EGSM CH 30DCS CH699
Re-Download S/W & CAL
VCTCXO
MobileSW&FEM
PLL
Check point Mobile SW & FEM
Main PCB Bottom
5.14.1 Checking DCXO Circuit
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 93 -
Replace X100
Yes
No
DCXO Circuit is OK. See next page to check
PLL Circuit.
1pin : 26MHz
1pin
X100Is the waveform of 1pin Similar to Fig.6?
DCXO
DCXO Cicuit DCXO Waveform
XOW8W7
XOXREFR
U4
G19CLKOUT0
CC_CLKU9
V10CC_IO
V9CC_RST
26MHz
X100NX3225SA
GND1 2
4GND2
HOT11
3HOT2
CHG_EN
SIM_DATASIM_CLKSIM_RST
1pin
5.14.2 Checking Mobile SW & FEM
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 94 -
FEM RX Control Logic
RF
PAD601PAD600
C62233p
0.5pC634
0
R608 C631
5p
33pC627
12nHL605
13G
SM
850_
900T
X
GS
M90
0RX
13 4
GS
M90
0RX
2
NC
119
NC
22016
VC
1V
C2
10
17ANT
GN
D1
9
GN
D2
12 14G
ND
3G
ND
415 18
GN
D5
GS
M18
00R
X1
5 6G
SM
1800
RX
2
GS
M18
00_1
900T
X117
GS
M19
00R
X1
GS
M19
00R
X2
8
GS
M85
0RX
11 2
GS
M85
0RX
2NAL604
LMSP43NA-782U601
PAD602
22pC632
CN600MM8430-2600RB3
3G
ND
14
GN
D2
GN
D3
5G
ND
46
1IN OU
T 2
0.75pC633
VC1
VC2
TP2_C625 (ANT_SW2)
U600
TP5~8
TP1_C621 (ANT_SW1)
TP10
CN600TP9
Mobile SW & FEM Circuit
Mobile SW & FEM Check Points
RX Mode EGSM DCS PCS
ANT_SW1 Off Off Off
ANT_SW2 Off Off Off
TP10
TP9
TP1
TP2
TP5,6,7,8
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 95 -
Check TP10 of CN600with RF Cable and TP9 of C631
TP10 Signal same as TP9?
Replace Mobile SW (SW401)
Yes
No
Yes
Mobile SW & FEM is OK.Check Antenna.
Check PMB8888 Control Signal is OK ?
No
Yes
Check TP1, TP2 of U600 ?
Replace FEM (U600) TP5~8 Signal is OK ?
No
Yes
EGSM RXANT SW1
ANT SW2
Mobile SW FEM Control Signals
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 96 -
5.15 Trouble Shooting of Transmitter Part
5.15.1 Checking DCXO CircuitSee RX Part “1. Checking DCXO Circuit”
Check point DCXO
Setup Test Equipment Cell Power : ñ74dBm
GSM850 CH 190/EGSM CH 30DCS CH699
Re-Download S/W & RF CAL
Check point Transceiver
Check point PA Control
Signal
Check FEM & Mobile
SW
DCXO
PowerAmp
Transceiver
FEM & MS
Main PCB Bottom
5.15.2 Checking Transceiver Output Signals
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 97 -
1R612
1R610
C636DNI
1R613
10KR611
C63847p
R614 1DCS_PCS_IN
1DCS_PCS_OUT
12
GND114
GND211
GND38
7GSM850_900_IN
10GSM850_900_OUT
2MODE_SELECT
15PGND
TX_EN6
4VBATT
VRAMP5
TQM7M5005 U600
BS313
BY_CAP1
BY_CAP29
DNIC637
R609 1
PA_MODE
TXLB
TXHB
PA_BAND
PA_EN
TX_RAMP
TXLBTXHB
Transceiver Output Circuit
Transceiver Output Operation
MODE Transceiver Output
GSMK Fixed
8PSK Ramp Burst Control
TXHB
TXLB
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 98 -
Signals are Normal ?
Replace PMB8888(U102)
Yes
N0
Transceiver is OK.See next page to check
PAM Control Circuit.
Check Output Signal (TP1, TP2)
Transceiver Output (GMSK) Transceiver Output (8PSK)
TXLB (MODE: GMSK) : TP1 TXLB (MODE: 8PSK) : TP1
5.15.3 Checking PAM Control Signals
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 99 -
MODE MODE PA_LEVEL TXON_PA
GMSK LOW Ramp Burst Control HIGH
8PSK HIGH Control Amp bias HIGH
TX RAMP
PA_EN
PA_MODE
Transceiver Output
PAM Mode Operation
1R612
1R610
C636DNI
1R613
10KR611
C63847p
R614 1DCS_PCS_IN
1DCS_PCS_OUT
12
GND114
GND211
GND38
7GSM850_900_IN
10GSM850_900_OUT
2MODE_SELECT
15PGND
TX_EN6
4VBATT
VRAMP5
TQM7M5005 U600
BS313
BY_CAP1
BY_CAP29
DNIC637
R609 1
PA_MODE
TXLB
TXHB
PA_BAND
PA_EN
TX_RAMP
PA_EN
TX_RAMP
PA_MODE
PAM Control Signals
- 100 -
5. Trouble shooting
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Signals are Normal ?
CheckPMB8888(U102)
Yes
No
PAM Control Signal is OK.
See next page to check FEM & Mobile SW Circuit.
Check Control Signals(TP1, TP2, TP3)
TP3(PA MODE) : R616 TP1(TX_RAMP) : R612 TP2(PA_EN) : R614
TP1(TX RAMP)
TP2(PA EN)
TP3(PA MODE)
TP1(TX RAMP)
TP2(PA EN)
TP3(PA MODE)
TP1(TX RAMP)
TP2(PA EN)
TP3(PA MODE)
GSMK Control Signal 8PSK Control Signal
- 101 -
5. Trouble shooting
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.15.4 Checking FEM & Mobile SW
FEM TX Control Logic
Mobile SW & FEM Checking Points
TX Mode EGSM DCS PCS
ANT_SW1 On Off Off
ANT_SW2 Off On On
RF
PAD601PAD600
C62233p
0.5pC634
0
R608 C631
5p
33pC627
12nHL605
13G
SM
850_
900T
X
GS
M90
0RX
13 4
GS
M90
0RX
2
NC
119
NC
22016
VC
1V
C2
10
17ANT
GN
D1
9
GN
D2
12 14G
ND
3G
ND
415 18
GN
D5
GS
M18
00R
X1
5 6G
SM
1800
RX
2
GS
M18
00_1
900T
X117
GS
M19
00R
X1
GS
M19
00R
X2
8
GS
M85
0RX
11 2
GS
M85
0RX
2
NAL604
LMSP43NA-782U601
PAD602
22pC632
CN600MM8430-2600RB3
3G
ND
14
GN
D2
GN
D3
5G
ND
46
1IN OU
T 2
0.75pC633
VC1
VC2
TP2_C625 (ANT_SW2)
U600
TP5~8
TP1_C621 (ANT_SW1)
TP10
CN600 TP9
Mobile SW & FEM Circuit
TP10
TP9
TP2
TP1
TP5,6,7,8
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Trouble shooting
- 102 -
Check TP6 of CN600 with RF Cable and TP9 of C631
TP10 Signal same as TP10?
Replace Mobile SW (CN600)
Yes
No
Yes
Mobile SW & FEM is OK. Check Antenna.
Check PMB8888(U102) Control Signal is OK ?
No
Yes
Check TP1, TP2 of U600 ?
Replace FEM (U600) TP9 Signal is
OK ?
No
Yes
EGSM TX
TP1(ANT SW1)
TP2(ANT SW2)
Mobile SW FEM Control Signals
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
6. Download & S/W upgrade
- 103 -
6. Download & S/W upgrade
6.1 S/W download setup
Preparation• Target terminal• PIF-Union• RS-232 Cable and PIF-UNION to Phone interface Cable• Power Supply or Battery• PC supporting RS-232 with Windows 2000 or newer.
If you are going to use battery, the voltage of the battery should be over 3.7V for stable powersupplying during S/W download.
S/W download & upgrade setup
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
6. Download & S/W upgrade
- 104 -
6.2 Download program user guide
KS360 KS360 KS36KS360
6.2.1 After “GSMULTI” folder copy, paste C:\
6.2.2 “MultiGSM.exe” execution file execute
GT360 GT360
6.3 Multi-Download Program Setting(Model-Base)
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
6. Download & S/W upgrade
- 105 -
KC550 KC550
KC550 KC550 KC550KC550
■ Multi-Download Program Execution →→ Setting : Configuration
■ Setting Completed
GT360 GT360
- 106 -
6. Download & S/W upgrade
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
KS3KS360 0 KS3KS360
■ Stand-by Condition: “Wait phone connecting” confirm →→ Phone connection
GT360 GT360
- 107 -
PWRURXDUTXD
3G 2.5G
GNDRXTXVCHARON_SWVBAT
4
80
220
E
2.5
42.0
11
1
2V9_VMMC
AA
8
150
150
3
1V8_VSD2
2.9
VSIM
SD2
E
9
9
3
84
300
F
C
2V9_VAUX
F
UART
2V62_VIO
VMME
B
VVIB
D
400 1V5_VSD1
VRF2
VRF3
Voltage(V) Current(mA)
2V85_VRF1
14
0 ... 120
12
20
2.9/1.8
2
22
150
1.5
EXT_RESET
1
2.9/1.8
2.8
1.5
VAUDIOa
VPLL
150
ON BOARD ARM9 JTAG & ETM INTERFACE
100
72
2V8_VVIB
5
2.9
140
2V9_VSIM
C
2V5_VAUDIO
Domain
2.85
1V5_VRF2
B
C
2V0_VRTC
10
3.1 40
1.8
SU1
VLED
VIO
2V85_VRF3
3V1_VUSB
VRTC
5.6 ... 25
VUSB
VRF1
3
13
VAUX
2.85
6
D
E
15
2.62
10
47n
HL
102
E
7
D
SD1 1.5
6
Net Name
C
F
5 16
D
1V5_VPLL
C114
0.1u
C14518p
C12
810
0p
R11
4
3.3K
0.1uC138
2V85_VRF3
1uC
123
2V85_VRF3
C113
10KR115
0.1u
4
5VCC
VBUS_USB
1V8_VSD2
TC7SH08FSU101
GND
2
1
3
0.01
uC
120
C10
40.
1u C107
1u
2V62_VIO
2V8_VVIB
2V85_VRF12V85_VRF3
C1340.1u
VBAT
R11
0
3.3K
0.01
uC
105
C100
2V9_VAUX
2.2u
R11
3
1K
R10
9
3.3K
R117100K
C106
1u
1V8_VSD2
2V85_VRF3
2V0_VRTC
1V5_VRF2
1u
C11
52.
2u
C147
2V0_VRTC
TP105
TP107
D100
3
1
2
2V5_VAUDIO 3V1_VUSB
KDR331V
220n
TP1061V5_VSD1
C10
8
1u0.1u
C117C127
C141
22u
TP100
1V8_VSD2
R10
4
390K
VBAT
L10310uH
DN
IR
119
TP104
1V5_VPLL
2V85_VRF3
R105 22
X101
32.768KHz12
1V5_VRF2
C11
8
VBAT
39p
VBAT
10u
C14
3
VBAT
2V9_VSIM
C12
4
220nC146
1u
C12
1
C129
0.01
u
0.1u
R11822K
R106 22
VCHG
18pC144
1V5_VSD1
TP102
R10
7
100K
CTS12
DSR10
GND1
NC14
7NC2
NC389
NC4
5ON_SW
11RTS
RX23
TX
6VBAT
C14
010
u
UART
VS
S_M
SF
3
E18
VS
S_R
TC
A12VSS_SD1
VSS_SD2A9
C13VSS_SU
VU
SB
B7
VV
IBD
12
XOW8W7
XOX
T2
VS
SR
F6
VS
SR
F7
U2
VS
SR
F8
U3
VS
SR
F9
U6
VS
S_A
UD
IOE
3
H2
VS
S_E
P
VS
S_F
LA
SH
E7
E11
VS
S_L
DO
1
VS
S_L
DO
2D
6
VS
S_L
DO
3C
3
L12
VS
S_M
AIN
_1V
SS
_MA
IN_2
L10
VS
S_M
AIN
_3M
10J8
VS
S_M
AIN
_4L
8V
SS
_MA
IN_5
D1
VS
S_M
ON
O
VR
F1
A2
B4
VR
F2
B1
VR
F3
VSD1A15
A10VSD2
A8
VS
IM
M2
VS
SR
F1
V2
VS
SR
F10
V4
VS
SR
F11
V5
VS
SR
F12
VS
SR
F13
V6
VS
SR
F14
W1
N2
VS
SR
F2
N3
VS
SR
F3
P2
VS
SR
F4
R2
VS
SR
F5
L11
VD
D_M
AIN
_1V
DD
_MA
IN_2
M11
VD
D_M
AIN
_3L
9M
9V
DD
_MA
IN_4
D7
VD
D_R
EF
VD
D_R
F2P
LL
B3
D18
VD
D_R
TC
T5VDET
C7
VIO
C10
VL
ED
L2
VM
IC
A7
VM
MC
A3
VP
LL
P3VRAMP
A6VREF1
VREF2L3
VB
AT
_MO
NO
E4
B2
VB
AT
_RF
13
A14VBAT_SD1
VBAT_SD2A11
VBAT_SUB12
A5
VD
DC
HA
RG
E
VD
DD
IGT
6P
4V
DD
MS
VD
DP
LL
W6
VD
DP
_EB
U_1
V19
L1
VD
DR
X
T3
VD
DT
RX
VD
DT
XW
4W
5V
DD
VC
O
VD
DX
OV
7
VD
D_F
US
E_F
SM
4
K9T_OUT8
US
AR
T0_
CT
S_N
K10J15
US
AR
T0_
RT
S_N
B18
US
AR
T0_
RX
DU
SA
RT
0_T
XD
H17
US
B_D
MIN
US
M17
P16
US
B_D
PL
US
E16
US
IF_R
XD
_MR
ST
US
IF_S
CL
KH
9
C16
US
IF_T
XD
_MT
SR
E1
VA
UD
IO
D11
VA
UX
VB
AT
_AU
DIO
E2
VB
AT
_BS
W_U
SB
_MM
CC
6
VB
AT
_LD
O1
E12
VB
AT
_LD
O2
B8
C12SU_GATESU_GND
B14
SU_ISENSEB13
TCKV8
TDIT7T8
TDO
U8TMS
N5TRIG_IN
W9TRST_N
TX1V3W3
TX2
T_OUT3A18J10
T_OUT4T_OUT5
H11E13
T_OUT6T_OUT7
B19
W2RX1RX1X
V1U1
RX2T1
RX2X
RX3R1
P1RX3X
RX4N1
RX4XM1
A13SD1_FB
SD1_FBLA16
SD2_FBB9
B10SD2_FBL
SD2_SD1_SUBSTC11
SE
NS
E_I
N1
D5
SE
NS
E_I
N2
C4
B11SU_FB
MO
NO
_OU
TN
D3
MO
NO
_OU
TP
D2
A1
NC
1A
19N
C2
NC
3W
19
D9
ON
_OF
F_S
CA
N_R
ES
ET
D19OSC32K
PABIASR3R4
PABS
PAENM3
PAMODEU5
C9
PO
_RE
SE
T_N
_SC
AN
_OU
T2
REFRU4
E9
RE
SE
T2_
N_V
SE
NS
E2
RESET_NF19
RTCKR6
M8G3J4
M9
F1
MIC
1_N
MIC
1_P
G1 J1
MIC
2_N
MIC
2_P
H1
MMCI_CLKR10
MMCI_CMDU10R8
MMCI_DAT0
MMCI_DAT1T9R9
MMCI_DAT2MMCI_DAT3
T10
L5MON1MON2
M5
MO
NO
_IN
NC
1C
2M
ON
O_I
NP
KP
_IN
1A
17B
16K
P_I
N2
KP
_IN
3B
17
KP
_IN
4D
17B
15K
P_I
N5
KP
_IN
6K
12C
14K
P_O
UT
0K
P_O
UT
1C
15D
14K
P_O
UT
2K
P_O
UT
3D
13 D8
LP
BC
K_E
CH
O
M0H3J3
M1
M10F4
M2G4H4
M7
FCDP_RBNF18
FE1N4P5
FE2
E6
FL
AS
H_S
INK
FSYS2U7R7
FSYS3
F2
HS
_N
HS
_PK
3
F5
I2C
_SC
LI2
C_S
DA
G5
J12
I2S
1_C
LK
0I2
S1_
RX
E14
D15
I2S
1_T
XI2
S1_
WA
0J1
1
IREF1B5
IREF2L4
N16EBU_CAS_N
EBU_CKET18
R17EBU_CS0_N
R19EBU_CS1_NEBU_CS2_N
T17
EBU_CS3_NP18
EBU_RAS_NK19
EBU_RD_NP19
EBU_SDCLKIU15
EBU_SDCLKOU19
U18EBU_WAIT_N
N18EBU_WR_N
J2E
P_C
M
K2
EP
_NE
P_P
G2
E19F32K
EBU_AD13W14
EBU_AD14V15W13
EBU_AD15
EBU_AD2V18W17
EBU_AD3T15
EBU_AD4EBU_AD5
U14
EBU_AD6V17T14
EBU_AD7R13
EBU_AD8EBU_AD9
W16
R18EBU_ADV_N
EBU_BC0_NN19P15
EBU_BC1_N
U16EBU_BFCLKI
P17EBU_BFCLKO
R16EBU_A21EBU_A22
N17
EBU_A23T19U17
EBU_A24
G18EBU_A3
L16EBU_A4EBU_A5
J19
EBU_A6J16K17
EBU_A7K18
EBU_A8EBU_A9
L17
R14EBU_AD0EBU_AD1
W18
EBU_AD10V16U12
EBU_AD11W15
EBU_AD12
DS
PIN
1H
5J5D
SP
OU
T0
H19EBU_A0EBU_A1
J17
EBU_A10K15L18
EBU_A11M16
EBU_A12EBU_A13
J18
EBU_A14M18N15
EBU_A15L15
EBU_A16EBU_A17
L19
EBU_A18M15M19
EBU_A19
EBU_A2K16
H18EBU_A20
K11
DIF
_CS
1D
IF_C
S2
K8
DIF
_D0
E17
G15
DIF
_D1
DIF
_D2
G17
C19
DIF
_D3
G16
DIF
_D4
DIF
_D5
C18
H15
DIF
_D6
DIF
_D7
F16
DIF
_HD
F15
H10
DIF
_RD
DIF
_RE
SE
T2_
GP
IOF
17D
IF_V
DH
16
DIF
_WR
J9
DS
PIN
0K
5
V14
CIF
_D0
CIF
_D1
U13
T12
CIF
_D2
CIF
_D3
T13
R11
CIF
_D4
CIF
_D5
R12
V13
CIF
_D6
T11
CIF
_D7
V12
CIF
_HS
YN
CC
IF_P
CL
KW
12
CIF
_PD
_GP
IOW
11W
10C
IF_R
ES
ET
_GP
IO
CIF
_VS
YN
CV
11
G19CLKOUT0
U11
CL
KO
UT
2
C17
DIF
_CD
K1
AG
ND
_MS
1A
GN
D_M
S2
K4
B6A_GND
D10
BL
1_P
WM
_VS
EN
SE
1B
L2_
PW
ME
10 E8
BL
3_P
WM
CC_CLKU9
V10CC_IO
V9CC_RST
CH
AR
GE
_UC
_SC
AN
_IN
1C
8
C5
CH
_GA
TE
A4
CH
_SO
UR
CE
PMB8888U102
R121 2.2K
1uC
109
R10
8
4.7K
C148DNI
1V8_VSD2
39p
VBAT
2V62_VIO
2V62_VIO
C15
0
1V8_VSD2
2V62_VIO
C12
6
R101 0
220n
100K
R11
2
222324
G1 G2
G3 G4
6789
16
252627282930
1718192021
CN100
1
101112131415
2345
L10
147
nH
L10
047
nH
C12
21u
C11
0
1V8_VSD2
220n
KD
S16
0E
D10
2
0.1uC135C131
OJ102
0.1u
C11
11u
39p
C15
239
p39
pC
151
C15
3
1V8_VSD2
C10
312
0p
C1370.1u
26MHz
X100NX3225SA
GND1 2
4GND2
HOT11
3HOT2
22u
0R100
C139
0.1u
C11
90.
01u
C13
0
2V0_VRTC
R102
0
C10
20.
01u
C149DNI
2.2uC101
C12
5
C142
DNI
1u
10uH
L104
0.1uC133
2.2KR120
C1320.1u
DNI
R103
0.1uC136
R116 0
R111
1
2V9_VMMC
2.2u
C11
6
C112
0.1u
1V8_VSD2
E2VSSQ1
J2VSSQ2
L2VSSQ3
_CASF7
C6_CE
_CSE9
_RASE7
_REE5
D6_WE
F8_WED
_WPF5
2V85_VRF3
N7VCC2
VCCQN6
VDD1B4
VDD2G9H2
VDD3M2
VDD4
D2VDDQ1
F2VDDQ2
K2VDDQ3
C2VSS1VSS2
F9G2
VSS3VSS4
N4
B5VSS5
N5VSS6VSS7
N8
M6
NC
18N
C19
M7
B7
NC
2
M8
NC
20N
C21
N2
N9
NC
22
B9
NC
3E
8N
C4
NC
5F
3F
6N
C6
G4
NC
7N
C8
G5
G6
NC
9
E6R__B
UDQMH3
VCC1B6
J6IO2
L6IO3IO4
J7
IO5L7J8
IO6L8
IO7
LDQMG3
NC
1B
2
NC
10H
5H
6N
C11
NC
12J3
NC
13K
5K
6N
C14
NC
15K
7K
8N
C16
NC
17M
5
K4DQ10DQ11
L3L4
DQ12DQ13
M3M4
DQ14N3
DQ15
DQ2C3D4
DQ3DQ4
D3E4
DQ5DQ6
E3F4
DQ7J4
DQ8DQ9
K3
IO0J5
IO1L5
G8CKE
CLEC5
H4CLK
DN
U1
A2
P9
DN
U10
DN
U11
P10
A9
DN
U2
DN
U3
A10
B1
DN
U4
DN
U5
B10
N1
DN
U6
DN
U7
N10
P1
DN
U8
DN
U9
P2
B3DQ0
C4DQ1
A0C7C8
A1
A10D9
A11H9
A12G7
A2C9
A3B8
A4M9
A5L9
A6K9
A7J9
A8H7H8
A9
ALED5
BA0D7D8
BA1
2V85_VRF1
K5D1G12ACD-D075
U100
D10
1
KD
S16
0E
TP101
USB_DP
SU
B_K
EY
_BL
LIN_PWM_FRQ
LIN
_IN
VE
RT
MIC
_PM
IC_N
HS
_MIC
_PH
S_M
IC_N
RPWRON
VIB
_PW
R_E
N
LCD_ID
DIF
_RE
SE
T
TO
UC
H_S
CL
TO
UC
H_S
DA
BB
_SN
D_L
BB
_SN
D_R
RC
V_N
RC
V_P
PO_RESETM_RESET
USB_DM
MM
C_D
ET
BT
_RE
SE
T
DIF
_CD
nWAIT
QW
ER
TY
_KE
Y_B
L
CHG_EN
JACK_TYPE
KE
Y_I
2C_S
CL
KE
Y_I
2C_S
DA
DSR
RPWRON_EN
UART_RXUART_TX
VBAT
SL
IDE
_OP
EN
CA
M_P
WR
_EN
EO
C
MMC_CLK
DCS1800_RXN
CL
K32
K
LIN
_PW
M_M
AG
DB
B_B
L_P
WM
UA
RT
_TX
BT
_VC
XO
_EN
UA
RT
_BT
_TX
I2S
1_W
A0
I2S
1_T
X
I2S
1_C
LK
US
B_D
MU
SB
_DP
BAT_ID
TX_RAMP
PA_ENVC2VC1
PA_BAND
PCS1900_RXN
PCS1900_RXP
DCS1800_RXP
HO
OK
_DE
TE
CT
IF_M
OD
E3
VCHG_OVP
VBUS_OVP
MIC
BIA
S
I2C
_SD
AI2
C_S
CL
SDRAM_CS
UART_BT_RTSUART_BT_CTS
TOUCH_INTM_RESET
MMC_CMDMMC_D0
MMC_D1MMC_D2MMC_D3
SIM_DATASIM_CLKSIM_RST
PA_MODE
CA
M_M
CL
KC
AM
_PW
DN
CA
M_R
ST
I2S
1_R
X
UA
RT
_BT
_RX
UA
RT
_RX
JAC
K_D
ET
DATA(0:15)
DATA(0:15)
DATA(0:7)
RF_TEMP
GSM850_RXPGSM850_RXNGSM900_RXPGSM900_RXN
TXHBTXLB
DIF
_RD
DIF
_VS
YN
CK
EY
_IN
TD
SR
BT
_IN
T
CA
M_D
(0)
CA
M_D
(1)
CA
M_D
(2)
CA
M_D
(3)
CA
M_D
(4)
CA
M_D
(5)
CA
M_D
(6)
CA
M_D
(7)
CA
M_P
CL
KC
AM
_HS
CA
M_V
S
TDI
_EXTRSTTDO
TMS
RTCKTCK
DIF
_D(0
)D
IF_D
(1)
DIF
_D(2
)D
IF_D
(3)
DIF
_D(4
)D
IF_D
(5)
DIF
_D(6
)D
IF_D
(7)
DIF
_CS
DIF
_WR
DATA(15)
nRESET
PWRON
_EXTRST
PO_RESET
TRST_N
DATA(4)DATA(5)DATA(6)DATA(7)DATA(8)DATA(9)DATA(10)DATA(11)DATA(12)DATA(13)DATA(14)
_CAS
FLASH1_CSSDRAM_CS
_RAS
_BC0_BC1
_RD_WR
DATA(0)DATA(1)DATA(2)DATA(3)
CKE
SDCLKOSDCLKI
FCDP
TRST_N
ADD(0:17)
26MHZ_BT
nRESET
RTCK
TCK
TDITDO
TMS
DATA(3)DATA(4)DATA(5)DATA(6)DATA(7)
SDCLKI
FLASH1_CS
ADD(0:12)
ADD(12)
ADD(2)ADD(3)ADD(4)ADD(5)ADD(6)ADD(7)ADD(8)ADD(9)
DATA(0)DATA(1)DATA(2)
ADD(0)ADD(1)
ADD(10)ADD(11)
_WRFCDP
ADD(13)ADD(14)
CKE
_CAS_RAS
_WR
_BC0_BC1
SDCLKO
ADD(16)ADD(17)
_RD
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 108 -
3
(1%)
Battery ConnectorEND
3
6
(160
8,25
V,K
,X5R
)
(100
5,10
V,K
,X5R
)
(100
5,10
V,K
,X5R
)
(100
5,10
V,K
,X5R
)
(1%)
(160
8,25
V,K
,X5R
)
CHARGING IC OVP
8
B2 : Headset MIC
10
5
12,13 : CHG
2 9
C
5 7
9,10 : BATT
15 : VUSB
3 : Jack type
14 : DSR
16 : D/ TX
8 : JACK_D
18PIN IO CONNECTORA
11 : R/ON
4
Remote Power On
4 : CTS/HSO_L
5 : RTS/HSO_R
(1%)
D
7 : USB-/Remote_ADC/RXD
6 : USB+/Remote_INT/TXD
2
HALL EFFECT S/W
17 : D/ RX
E
4
D
A
1
1
(100
5,10
V,K
,X5R
)
(160
8,25
V,K
,X5R
)
C22439p
C21
439
p
0.1uC200
Q201
2
56
31
4 EMX18
1uC
216
100KR217
C222
2V62_VIO
1u
C2131u
1
VDC_BYP12
2VUSB
_CHG4
_EN5
3_PPR
100pC201
BAT11
8GND
6IMIN
IUSB7
IVDC9
13PGND
10USB_BYP
VDC
C202
ISL9221U201
R22
4
100K
0.1u
GN
D1
GN
D2
INO
UT
ICV
FP
1018
1E30
1FR
FL
200
2K R22
0
47R211
C221
10u
RPWRON_EN
DSR
RXTX
VBAT
VCHG_OVP VBUS_OVP
DN
IR
206
C20827p
39p
C20
4
10u
C20
3
24p
47R210
L20
0 C205
100n
H
R218
1K
VBUS_USB
1R229
C2200.1u
R222
10K27pC225
C2101u
VCHG
C2111u
R20
7
1.5KR202
DN
I
1800FB201
3.3M
R221
2V62_VIO
100K
R20
9
10uC226
R2032.2K
10K
R20
4
FB206 1800
27p
C206 0.1u
C207
DN
I
R22
7
VBUS_USB
2V5_VAUDIO
2V0_VRTC
R22
6
DN
I
R22
5
100K
330K
R223
2K
2V62_VIO
R201
R21
6
33K
VBUS_USB
R21
3
10K
R208 DNI
1uC212
4V
SS
FB203 1800
U202
EM-0781-T53N
CO
UT
2
VD
D10.1u
C219
C218
47R212
330K
2V5_VAUDIO2V62_VIO
27p
R21
9
R230
2V0_VRTC
VBAT
0
27p
100K
R20
5
C217
VIN-
1M
R200
U200
NCS2200SQ2T2G
GND
2
1OUT
5VCC
VIN+3
4
100K
R21
5
VBAT
1R228 6789
VCHG
1112131415161718
19
2
20
21
22
345
123
4
CN200
1
10
CN201
R21
4
16K
39pC223
C2091u
C21
51u
1800FB202
RPWRON_EN
USB_DP
FB200 1800
USB_DM
HSO_L
HSO_R
END_KEY_IN
END_KEY
RPWRON
CHG_EN
SLIDE_OPEN
BAT_ID
FM_ANT
EOC
JACK_TYPE
DSR
HS_MIC_N
HS_MIC_P
HOOK_DETECT
KEY_COL7
KEY_ROW6
END_KEY_IN
PWRON
RPWRON_EN
JACK_DET
UART_RXUART_TX
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 109 -
1
1
9
D
C
B
MOTOR CIRCUIT
MIC
D
13
E
AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR
12
C
1614
A
C
5
158
4
7
2
E
F
E
114
9
C
6
5
VIB+
VIB-
10
D
3
2
MIC
A
87
6
F
B
QWERTY_KEY BACKLIGHT
F
D
3
E
R302 100K
10uC322
39pC321
R311
C31739p
47
C30
31u
L30
2
100n
H
C302
2IN_A
1IN_B
4OUT_Y
VCC5
1u
U301 TC7SZ86FU
GND3
47
R312
3V0_VMOT
MICBIAS
OUT300
2200pC307
L301100nH
47
C312
R310
VBAT
1u
0R313
R30
1
100K
3V0_VMOT
OUT+
B5OUT-
C4
PG
ND
C5
PV
DD
RXIN+D4B4
RXIN-
SCLC3
SDAB3
B1
VD
D
A3
VS
S
B2BIAS
C1NA4
C1PA5
D3
GN
D
HPLA2
HPRA1
INA1D2
INA2D1
C2INB1
C1INB2
D5
C309
VBAT
MAX9877AEWP_TG45U303
1u
EV
LC
14S
0205
0
VA300
LD300LEWWS44-E
U300 R1114D301D-TR-F
CE6
2GND1
5GND2
4NC
VDD1 3
VOUT
3V0_VMOT
R306
130K
LEWWS44-E
R305 0
C305
LD302
1u
C308 1u
L304
100nH
VBAT
C320
22n
130K
R308
0R314
100nH
L303
22n
C31939p
C318
1u
R303 0
C300
R309 100KC314
R304
0
0.01u
C304 1u
R307 0
C301
1u
MIC300
SPU0409HE5H-PB
2G1G2
3
O4
P1
LEWWS44-E LD301
OUT301
1uC315
0R
300
C316 2200p
VA
301
ICV
N05
05X
150F
R
100nHL300
C311
1uC313
1IN_B
4OUT_Y
VCC5
1u
VO+5
VO-8
1_SHUTDOWN
U304 TC7SZ86FU
GND32
IN_A
TPA6205A1DRBRU302
BYPASS2
GND7
3IN+
4IN-
9PGND
6VDDVIB_PWR_EN
MIC_P
MIC_N
HSO_L
HSO_R
BB_SND_LBB_SND_R
I2C_SCL
SPK_N
VIB_PWR_EN
LIN_PWM_FRQLIN_INVERT
LIN_PWM_MAG
QWERTY_KEY_BL
SPK_P
i2C_SDA
FM_SND_RFM_SND_L
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 110 -
Soft2OIC
E
2
Y
5
E
MN
6
V
2 3
Soft1
65
GD
10
FZSym
MSGL
3
Space
Socket
SFn
CLR
(1%)
H
A
K
QWERTY KEY
MAIN To FPCB Connector
UT
PJ
W
7
RAQ
1
D
7
B
1
D
98
CXShift
ENTER
4
4
B
ICVE10054E250R201FRFL402
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
VBAT
3
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
FL404 ICVE10054E250R201FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A3
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
FL403 ICVE10184E150R101FR
4.7K
R415
R41
847
0
R410 470
470R404
KB405
2V62_VIO
KB409
R403 470
C41
2
KB408
27p
C40
827
p
C41
027
pC
411
27p
C40
627
p
470R412R411 0
27p
C41
727
p
C40
9
27p
C40
7
27p
C40
2
C42727p
C423 27p
C40
427
p
27p
KB402
C41
5
C401 0.1uF
C41
6
C41
427
p
27p
C41
827
p
470R409
R414 470
TEST
23V
DD
26X
IX
O25
R406 4701817
P44P45
16
P4615
14P
47
13P
50
12P
51
11P
52P
53109
P54
P555
P5643
P57
PG
ND
29
RE
SE
TB
27
2SEL_28P
1
PP2106M2
CL
K_S
EL
24
GN
D1
8G
ND
228
P10
22
7P15P17
6
21P40P41
20
P4219
P43U400
KB413
R40
10
KB412
2V62
_VIO
KB411
C42627p
KB407KB403 KB406
120KR400
0.1uF
C400
470
R41
6R
417
470
470
R41
9
27pC422
C40
327
p
470R405
KB404
KB427
R40
2
4.7K
2V62_VIO
KB410
C41
927
p
KB421
2V62_VIO
R407 470
KB414
C420 27p
KB434
27pC421
KB431
6
KB428
2V62_VIO
FL400 ICVE10054E250R201FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B4
KB425
C40
5
KB426
27p
KB400
KB415
0R413
KB429
KB420
27pC424
ICVE10054E250R201FRFL401
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
C41
327
p
KB401
2V8_VVIB
470
R42
0
KB424
KB423
272829
KB422
30313233343536373839
22
40
23242526
141516171819
2
20
3456789
21
CN4001
10111213
KB419KB418KB416 KB417
470R408
C42527p
KB433
KB430
KB432
KEY_COL6
KEY_COL7KEY_COL6KEY_COL5
KEY_ROW6KEY_ROW5KEY_ROW4
SUB_KEY_BL
KEY_COL4
END_KEY
RCV_PRCV_N
KEY_ROW4
KEY_ROW0
KEY_COL7
KEY_ROW1
KEY_ROW3
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4
KEY_COL5
KEY_ROW2
DIF_WRDIF_RD
DIF_D(7)DIF_D(6)DIF_D(5)DIF_D(4)
DIF_VSYNCDIF_RESETLCD_IDIF_MODE3
TOUCH_SCL
DBB_BL_PWM
KEY_ROW4
KE
Y_C
OL4
KE
Y_C
OL2
KE
Y_C
OL0
KEY_COL7
KEY_COL5
TOUCH_SDATOUCH_INT DIF_D(3)
DIF_D(2)DIF_D(1)DIF_D(0)
DIF_CSDIF_CD
KEY_ROW1
KEY_ROW3
KE
Y_I
2C_S
DA
KEY_I2C_SCLKEY_INT KEY_ROW5
KE
Y_C
OL3
KE
Y_C
OL1
KEY_COL6
KEY_ROW6
KEY_ROW0
KEY_ROW2
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 111 -
B
C
D
C
97
SPK
2V 0.5mAh
BACKUP BATTERYSIDE KEY
VOL-UPVOL-DOWN
CAMERA POWER
(ENBY0020401,24PIN,0.9T,SOCKET,AXK7L24227G)
CAMERA CONNECTOR
1
3
B
2
4
83 10
1
A
5
2 5
CAM
MICRO SD Connector
SIM CONNECTOR
D
E
A
64
C50
57.
5p
R505 10R506 10
10R507
C50
87.
5p
C54
07.
5p
1
2
FB500
2V62_VIO
CN501
R511R510 10
1010R512
C51
57.
5p
7.5p
C548
1000p
R51510
C53
9
C52
17.
5p
7.5p
27p
2V9_VSIM
C51
9
27pC533C531
27pC530
100K
27pC532
4C5C6
5
C76
GND178
GND2GND39
10GND4
R50
4
J5001
C12
C2C3
3
22p
C547
7.5p
C50
3
C50
17.
5pC
502
7.5p
7.5p
C50
0
C51
07.
5p
C52
37.
5p
R514 1010R516
C54447p
C5491u
2V0_VRTC
BA
T50
0
2EN1EN2
35
GNDNC14
NC26
PG
ND
9
1VIN VOUT1
87
VOUT2
VBAT
RT9011-MGPQWU500
EUSY0319001
100nH
L501
100nH
L500
VA
505
VA
506
1234
CN502123
CN503
100K
R50
2
100K
R50
3
C534
2V9_VMMC
1u
EV
LC
18S
0201
5
VA
501
VDD
VSS
VA
500
EV
LC
18S
0201
5
S500
CD_DAT3
CLK
CMD
DAT0
DAT1_2
DAT2DETECT_ADETECT_B
DUMMY1
DUMMY2
DUMMY3
GND
2V9_VMMC
AXA463062P
100K
R50
8
100K
R50
0
R52
4
4.7K
C5512.2u
C5522.2u
2V8_VCAMIO1V8_VCAM
2V8_VCAMIO
2
2021222324
3456789
G1G2
G3G4
1
10111213
141516171819
CN500
AXK7L24227GENBY0020401
R519 1010
R521R520
7.5p
C54
1
10
100K
1V8_VCAM
C550
1u
R52
5
7.5p
C52
0
C51
87.
5p
7.5p
C52
5
7.5p
C50
6
C50
47.
5p
R509 10
C51
27.
5p
C51
37.
5p
10R513
R52
3
DN
I
C50
77.
5p
27pC529
27p27pC527 C528C526
27p
1uC51
17.
5p
C535
C51
6
C50
97.
5p
7.5p
C51
47.
5p
VA
502
VA
503
100K
R50
1
10R517
C52
47.
5p
C52
27.
5p
10R518
C542100p
C545
15K
47p
C546
R522
2V9_VSIM
DNI
C543
220n
7.5p
C53
8
C53
67.
5pC
537
7.5p
7.5p
C51
7
VA
504
I2C_SCLI2C_SDA
CAM_PCLK
CAM_D(7)CAM_D(6)CAM_D(5)CAM_D(4)
CAM_D(3)CAM_D(2)CAM_D(1)CAM_D(0)
CAM_PWDNCAM_RST
CAM_MCLKCAM_HSCAM_VS
MMC_CMD
MMC_CLK
MMC_D0
MMC_D1
MMC_DET
KEY_ROW6KEY_COL0
KEY_ROW5KEY_COL1KEY_COL0
SPK_N
SPK_P
CAM_PWR_EN
SIM_DATA SIM_CLKSIM_RST
MMC_D2
MMC_D3
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 112 -
4
D
PIN 14
DCS1800
1
L
L
7
L
1 10
A
6
3
GSM900
L
PCS1900
L
6
EGSM900 RX
GSM850L
BLUETOOTH_CSR
DCS1800 RX
B
CC
L
H
4
RF
GSM850_EGSM TX
A
GSM850 RX
85
L
2
5
VC2
DCS_PCS TX
9
2
PIN 13
H
VC1
PCS1900 RX
7
3
L
L
E
D
C6070.1u
5.1nH
L609
1R612
C6453.9p
1R
603
1R610
C60915p
PAD601
3.9pC646
L602 470nH
1000pC615
15pC610
2.2R605
FB601
3.3p
B4
VS
S_L
OH
2
VS
S_P
AD
SG
8
C10
VS
S_P
IO
VS
S_R
AD
IO_1
D2
E2
VS
S_R
AD
IO_2
VS
S_R
AD
IO_3
F2
K2XTAL_INXTAL_OUT
J2
F8
_RS
T
C648
J6
H4
VR
EG
EN
AB
LE
_H
H3
VR
EG
EN
AB
LE
_L
VR
EG
IN_H
J5V
RE
GIN
_LJ1
VR
EG
OU
T_H
K5
VS
S_A
NA
_1C
3
VS
S_A
NA
_2D
3
VS
S_A
NA
_3E
3
VS
S_A
NA
_4F
3
VS
S_A
NA
_5G
3
VS
S_A
NA
_6J3
VS
S_C
OR
EB
6
G9
VS
S_D
IG
VS
S_F
M1_
1B
2C
1V
SS
_FM
1_2
VS
S_F
M2
H6UART_RTS
H5UART_RX
K7UART_TX
J8
USB_DNK6
USB_DPJ7
VD
D_A
NA
K1
A6
VD
D_A
UD
IO
VD
D_C
OR
E_1
A7
H10
VD
D_C
OR
E_2
A2
VD
D_F
M
VD
D_L
OH
1
G10
VD
D_P
AD
S
VD
D_P
IOB
10
VD
D_R
AD
IO_1
C2
G2
VD
D_R
AD
IO_2
VD
D_U
SB
PIO
_5P
IO_6
F9
F10
PIO
_7P
IO_8
C5
B7
PIO
_9
RF_NG1F1
RF_P
D1RX_NRX_P
E1
H8
SP
I_C
LK
SP
I_M
ISO
K9
SP
I_M
OS
IK
10
SP
I__C
SJ9
SPKR_LA5A4
SPKR_R
C4
TE
ST
_EN
UART_CTSLO_REF
PCM2_CLKD9
PCM2_INE10
PCM2_OUTD8
PCM2_SYNCD10
PCM_CLKH9
PCM_INK8H7
PCM_OUT
J10PCM_SYNC
PIO
_0A
10A9
PIO
_1
PIO
_10
A8
C6
PIO
_11
PIO
_2B
8B
9P
IO_3
PIO
_4E
9E
8
AIO
_0K
4J4A
IO_1
B5AUX_DAC
AU_REFA3
CLK_32KC9B3
FILT_EXT
FM_NA1B1
FM_P
C7I2C_CLK
I2C_DATAC8
K3
PAD600
M600BLUECORE5-FM
C62233p
0.5p
VBALUN_BT
R600
C635
G2
8G
31NC
2NC_DC
3UB
0
0.5p
FL600LFB212G45BA1A220
B15
B27
G1
4
6
C634
C636
C604DNI
DNI
22n
0
R608
0.1u
C603
C624C6232.2u
2.2uC608
NAL600
10KR617
FB600
820pC617
R616
TP601
100K
560R604
C631
5p
2V62_VIO
22nH
R615
1
L607
2V9_VAUX
33pC627
12nH
TP605
L605
C6211.5p
C642
1
DNIDNIC641
R613
1uC602
13G
SM
850_
900T
X
GS
M90
0RX
13 4
GS
M90
0RX
2
NC
119
NC
22016
VC
1V
C2
10
TP
606
17ANT
GN
D1
9
GN
D2
12 14G
ND
3G
ND
415 18
GN
D5
GS
M18
00R
X1
5 6G
SM
1800
RX
2
GS
M18
00_1
900T
X117
GS
M19
00R
X1
GS
M19
00R
X2
8
GS
M85
0RX
11 2
GS
M85
0RX
2
NAL604
LMSP43NA-782U601
10KR611
2.5pC643 C644
2.5p
C638
PAD602
15p
47p
820p
C618
C616
TP603
5.6pC650
15pC619
1uC629
C625 C626
VBAT
DNI
1.2nH
2.2u
L606
3.3pC647
C614
TP602
0.01u
22pC632
5.6p
TP604
C649
R614 1
0.01u 0.01uC640C639
DCS_PCS_IN1
DCS_PCS_OUT12
GND114
GND211
GND38
7GSM850_900_IN
10GSM850_900_OUT
2MODE_SELECT
15PGND
TX_EN6
4VBATT
VRAMP5
TQM7M5005 U600
BS313
BY_CAP1
BY_CAP29
1R
601
AMAN802015LG14
ANT600
FEED
GND1
GND2
C600DNI
L608
5.6nH
L610
18nH
DNI
TP600
C637
10uC628
27pC630
33nHL601
C60515p
CN600MM8430-2600RB3
3G
ND
14
GN
D2
GN
D3
5G
ND
46
1IN OU
T 2
0.1uC601
0.75pC633
C611 47n
2V62_VIO
VBALUN_BT
L603 18nH
DNI
C620
C613 1000p
R609 1
C612 220n
1R
602C606
15p
R607 47KR606 470K
VC1
VC2
PA_MODE
BT
_VC
XO
_EN
BT
_IN
T
TXLB
TXHB
I2S1_CLK
I2S1_TXI2S1_RX
I2S1_WA0
UART_BT_CTS
UART_BT_RX
BT
_RE
SE
T
PA_BAND
PA_EN
TX_RAMP
FM_SND_RFM_SND_L
UART_BT_RTS
UART_BT_TX
GS
M85
0_R
XP
GS
M85
0_R
XN
GS
M90
0_R
XN
GS
M90
0_R
XP
DC
S18
00_R
XP
DC
S18
00_R
XN
PC
S19
00_R
XN
PC
S19
00_R
XP
RF_TEMP
CLK32K
FM_ANT
26MHZ_BT
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 113 -
Header
C
D
E
6 7
B
3 4 5
10
1 2
94 5 61 2 3
Header
FPCB To SLIDE Connector
TP101
MAIN To FPCB Connector
7 8
A
C
D
A
TP100
2V8_VVIB
3233343536373839
22
40
23242526272829
16171819
2
20
3456789
21
3031
CN1011
101112131415
29
313233343536373839
22
40
232425262728
1516171819
2
20
3456789
21
30
CN1001
1011121314
2V62_VIO
TP103TP102
VBAT VBAT
RCV_P
DBB_BL_PWMTOUCH_INTTOUCH_SDATOUCH_SCLKEY_COL7
2V8_VVIB2V62_VIO
DIF_D(2)DIF_D(1)DIF_D(0)
DIF_D(5)
IF_MODE3
KEY_COL6KEY_COL5KEY_COL4KEY_ROW6KEY_ROW5KEY_ROW4SUB_KEY_BL
END_KEY
RCV_N
DIF_CSDIF_CDDIF_WRDIF_RDDIF_VSYNCDIF_RESETLCD_IDIF_MODE3
DIF_D(7)DIF_D(6)DIF_D(5)DIF_D(4)DIF_D(3)
DBB_BL_PWM
LCD_IDDIF_RESETDIF_VSYNC
DIF_RDDIF_WRDIF_CDDIF_CS
DIF_D(0)DIF_D(1)DIF_D(2)DIF_D(3)DIF_D(4)
DIF_D(6)DIF_D(7)
END_KEY
SUB_KEY_BL
RCV_PRCV_N
TOUCH_SCLTOUCH_SDATOUCH_INT
KEY_ROW4KEY_ROW5KEY_ROW6KEY_COL4KEY_COL5KEY_COL6KEY_COL7
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 114 -
X
D
IFMODE(1)
H
4
E
86
4
A
L
5
B
TOUCH
2
10
5
IFMODE(1)
7
IFMODE(0)
Socket
1
C
IFMODE(0)
C
6
A
Sharp
3
MULTI_KEY & END_KEY
END
OK
DOWNUP
MULTI_KEY BACKLIGHT
D
IFMODE(3)
7
LCD FILTER, ZIP CONNECTOR
MODE
LCD BACKLIGHT
2
LEFT
RIGHTCLRHOT
SENDSOFT2SOFT1
1
L
3
Hitachi
L
9
H
103
FPCB To SLIDE Connector
107
104
VA100EVL14S02200
100o
hm
R10
7
2V8_VVIB
VBAT
R11
1
10K
C1140.1u
101
106
102
2V8_VVIB
EVLC14S02050VA101
3132
3334
3536
37
45
67
89
1718
19
2
2021
2223
2425
2627
2829
3
30
CN1001
1011
1213
1415
16
1u
VBAT
C101
150R112
KB100
2SC5585Q100
1K
R110
LE
BB
-S14
E
LD
100
LE
BB
-S14
E
LD
101
LE
BB
-S14
E
LD
104
LE
BB
-S14
E
LD
105
R102 0
R10
410
0oh
m
2V62_VIO
DNIR114
45 6
789
G1 G2
G3 G4
2V62_VIO
CN101
1 1023
12LED3
11LED4
10LED5
7OUT
8PWM P_GND
15
TP100
MAX8630WU100
C1N
26C
1P
C2N
45C
2P
9CPWM
GND1
IN3
14LED1
13LED2
LD
102
LE
BB
-S14
E
100o
hm
R10
5
LD
103
LE
BB
-S14
ER10
610
0oh
m
C10627p27p
C105
105
108 109
C115 1u
1uC104
C103 1u10
0K
R11
6
0R101
100o
hm
R10
3
LD
106
LE
BB
-S14
E
C1021u
0.1u
VBAT
C100
100
R100100K
100o
hm
R10
9
0R115
C11
2C
111
9p
C10
9
9p9pC
110
9p
C10
8C
107
9p
29
VBAT
9p
313233343536373839
22
40
232425262728
1516171819
2
20
3456789
21
30
CN1021
1011121314
DNI
R113
1uC113
R10
810
0oh
m
KEY_ROW5
KEY_COL4
KEY_COL5
KEY_COL6
KEY_ROW4
END_KEY
MLED1
MLED
MLED3MLED2
MLED5MLED4
DIF_D(3)DIF_D(4)DIF_D(5)DIF_D(6)DIF_D(7)
LCD_ID
DIF_RESET
DIF_CSDIF_CDDIF_WR
DIF_VSYNCDIF_RD
IF_MODE3
KEY_COL7
KEY_ROW6
RCV_NRCV_P
DBB_BL_PWMTOUCH_INTTOUCH_SDATOUCH_SCLKEY_COL7
TOUCH_SDATOUCH_INT
LCD_ID
IF_MODE3
DIF_D(0)DIF_D(1)DIF_D(2)
DBB_BL_PWM
LCD_BL_PWM
KEY_COL6KEY_COL5KEY_COL4KEY_ROW6KEY_ROW5KEY_ROW4SUB_KEY_BL
END_KEY
TOUCH_SCLRCV_PRCV_N
TOUCH_RST
SUB_KEY_BL
DIF_VSYNCDIF_RDDIF_WRDIF_CDDIF_CS
DIF_D(0)DIF_D(1)DIF_D(2)DIF_D(3)DIF_D(4)DIF_D(5)DIF_D(6)DIF_D(7)
IF_MODE3
LCD_BL_PWM
MLED5MLED4MLED3MLED2MLED1MLED
LCD_IDDIF_RESET
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 115 -
8 9
6
41
Header
FROM SLIDE PCB
Socket
TO TOUCH FPCB
MAIN RECEIVER
+
-
2 5
E
7
B
3 4 5
7
2V8_VVIB
10
1 2
3
D
C
A
C
D
A
6
0R100
C10247p47p
C101
OUT100
R102 01 102345 6
789
G1 G2
G3 G4
OUT101
CN100
2345 6
789
G1 G2
G3 G4
2V8_VVIB
CN102
1 10
RCV_PRCV_N
TOUCH_RST
TOUCH_SCLTOUCH_SDATOUCH_INT
RCV_P
RCV_N
TOUCH_RSTTOUCH_INT
TOUCH_SCLTOUCH_SDA
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 116 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 117 -
8. BGM Pin Map
8. BGM Pin Map
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
BGA IC pin check (U102, PMB8888)
: Not in use
- 118 -
8. BGM Pin Map
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
BGA IC pin check (U100, K5D1G12ACD-D075)
: Not in use
- 119 -
8. BGM Pin Map
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
BGA IC pin check (U303, MAX9877)
: Not in use
- 120 -
8. BGM Pin Map
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
BGA IC pin check (M600, BC5FM)
: Not in use
- 121 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Hall Effect SWU202No WallpaperChange
Vibrator AmpU302No Vibrator
Dome SWNo Keypad &Press
Key EncoderU400No Qwerty Key
Micro PhoneMIC300No Record
Main FPCBConnector CN400No DisplayNo VibratorNo Multi-keyNo Speaker &Receiver
GT360
- 122 -
9. PCB LAYOUT
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Backup BatteryBAT500No Service
BluetoothAntenna ANT600No BT Connect
Camera ModuleU500No Camera
MemoryU100No Booting
Mobile SW CN600GSM TX PowerNO Service
Bluetooth & FMRadio Chip M600BT ModuleNo Service
CameraConnectorCN500No Camera
BB ChipsetU102 No PowerOn No DisplayNo Service
VibratorNo Vibrator
Speaker CN501No Speaker(Sound)
Battery ConnectorCN201No Power
Power InductorL103,104No BootingNo Power
SIM ConnectorJ500No Service
Micro SD SocketS500No Micro SD
PAM U600GSM TX PowerNo Service
FEM U601GSM RXSensitivitry & TXPower
MMI ConnectorCN200No Ear MicNo Speaker
GT360
- 123 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LEDLD100~106No Multi_KeyBacklight
GT360
- 124 -
9. PCB LAYOUT
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LCD Filter, ZIPConnectorCN100NO Display
Main FPCBConnectorCN100No DisplayNo Power
Touch FPCBConnectorCN100No TouchSense
LCD Back LightU100No Display
GT360
- 125 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LCD ConnectorCN100, 101No Power
No BootingNo Display
GT
360
GT
360
- 126 -
9. PCB LAYOUT
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
TouchConnectorCN100No Touch Sense
TouchConnectorCN102No Touch Sense
GT360 GT360
- 127 -
10. RF Calibration
10. RF Calibration
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
10.1 Test Equipment Setup
10.2 Calibration Step
10.2.1 Turn on the Phone
10.2.2 Execute “HK_27.exe”
4.00 V 0.000 A
- 128 -
10. RF Calibration
10.2.3 Click “SETTING” Menu
10.2.4 Setup “Ezlooks” menu such as the following figure
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 129 -
10. RF Calibration
10.2.5 Setup “Line System” menu such as the following figure
10.2.6 Setup Logic operation such as the following figure
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Adjust the number of times
PWR : Power SupplyCELL :Call- Test Equipment
Setup UART Port
Operation Mode1. By- Pass: not control by GPIB2. Normal : control by GPIB
- 130 -
10. RF Calibration
10.2.7 Select “MODEL”
10.2.8 Click “START” for RF calibration
10.2.9 RF Calibration finishes.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
10. RF Calibration
- 131 -
10.2.10 Calibration data will be saved to the following folder
- 132 -
10. RF Calibration
Notices:
1. The state of Phone is “test mode” during the CALIBRATION.
2. Calibration program automatically changes either “normal mode” or “ptest mode”.
3. RF Calibration steps as follow:
TX Channel compensation: EGSM->DCS->PCS->EDGE EGSM->EDGE DCS->EDGE PCS
RX Channel compensation: EGSM->DCS->PCS
4. Phone Operation Mode
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Normal Mode ptest Mode
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. Stand-alone Test
- 133 -
11. Stand-alone Test
11.1 Test Program Setting
1 Set COM Port.
2 Check PC Baud rate.
3 Confirm EEPROM & Delta file prefix name.
4 Click “Update Info” for communicating Phone and Test-Program.
Not Connected
- 134 -
11. Stand-alone Test
5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the
“Reset” bar.
6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Connected
Change "ptest mood"
- 135 -
11. Stand-alone Test
11.2 Tx Test
1 Click “Non signaling mode” bar and then confirm “OK” text in the command line.
2 Put the number of TX Channel in the ARFCN.
3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu.
4 Finally, Click “Write All” bar and try the efficiency test of Phone.
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 136 -
11. Stand-alone Test
11.3 Rx Test
1 Put the number of RX Channel in the ARFCN.
2 Select “Rx” in the RF mode menu.
3 Finally, Click “Write All” bar and try the efficiency test of Phone.
4 The Phone must be changed “normal mode” after finishing Test.
5 Change the Phone to “normal mode” and then Click the “Reset” bar.
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Change "normal mode"
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. ENGINEERING MODE
- 137 -
12. ENGINEERING MODE
Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided
by a handset. The key sequence for switching the engineering mode on is “1809#*360# “Select. Pressing
END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and
press ‘select’ key to progress the test. Pressing ‘back key will switch back to the original test menu.
[1] BB TEST
[1-1] Battery Info
[1-1-1] BattInfo
[1-2] Bluetooth Test
[1-2-1] Enter Test Mode
[1-2-2] OnOff Test
[1-2-3] Headset Test
[1-2-4] BT Test1
[1-2-5] BT Test2
[1-2-6] Xhtml Compose Print
[1-2-7] Xhtml Print Test
[2] Model Version
[2-1] Version
[3] Eng Mode
[3-1] Cell environ
[3-2] PS Layer Info
[3-2-1] Mobility
[3-2-2] RadioRes
[3-2-1] Gprs
[3-3] Layer1 Info
[3-4] Reset Information
[3-5] Memory Configurarion
[3-6] MemGenConf
[3-7] MemAllUse
[3-8] MemDetUse
[3-9] MemDump
[3-10] Change Frequency Band
[4] Call Timer
[5] Factory Reset
[6] MF TEST
[6-1] All Auto Test
[6-2] Backlight
[6-2-1] BacklightOn
[6-2-2] BacklightOff
[6-3] Audio
[6-3-1] Audio Test
[6-4] Vibrator
[6-4-1] VibratorOn
[6-4-2] VibratorOff
[6-5] LCD
[6-5-1] Auto LCD
[6-6] Key pad
[6-7] Mic Speaker
[6-8] Camera
[6-8-1] Camera Main Preview
[6-8-2] FlashOn
[6-8-3] FlashOff
[6-8-4] CameraFlashBunning
[6-9] FM Radio
[6-9-1] FM Radio Test
[6-10] Touchpad Test
[7] Network selection
[7-1] Automatic
[7-2] GSM850
[7-3] EGSM
[7-4] DCS
[7-5] PCS
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 138 -
- 139 -
24 25
4 2
1
6
26
29
30
28
27
31
32 33
34
35
2119
22
20
1816
15
14
17
13
12
11
10
36
42
4140
39 38
43
44 45
47
46
4849 50 52
37
54
5351
23
7
8
9
3
5
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.1 EXPLODED VIEW
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 140 -
KJIHGFEDCBAA
B
C E
D
F
HJ
I
K
G
ASS'Y EXPLODED VIEW
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 141 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13.2 Replacement Parts<Mechanic component>
LevelLocation
No.Description Part Number Spec Color Remark
1 GSM(FOLDER) TGFF0100802 White Green
2 APEY PHONE APEY0623302 White Green
3 ABGF00 BUTTON ASSY,MAIN ABGF0005301 QWERTY ENGLISH WN White Green 35
3 ACGM00 COVER ASSY,REAR ACGM0114301Color
UnfixedJ
4 MCCC00 CAP,EARPHONE JACK MCCC0056101 MOLD, Urethane Rubber S190A, , , , , White 47
4 MCCG00 CAP,MULTIMEDIA CARD MCCG0013301 MOLD, Urethane Rubber S190A, , , , , White 48
4 MCJN00 COVER,REAR MCJN0086401 MOLD, PC LUPOY SC-1004A, , , , , White 38
4 MDAK00 DECO,REAR MDAK0015501 COMPLEX, (empty), , , , , White 50
4 MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White
4 MLEA00 LOCKER,BATTERY MLEA0046101 MOLD, PC LUPOY SC-1004A, , , , , Black 42
4 MPBJ00 PAD,MOTOR MPBJ0054901 COMPLEX, (empty), , , , , Black 40
4 MPBN00 PAD,SPEAKER MPBN0056601 COMPLEX, (empty), , , , , Black 46
4 MPBT00 PAD,CAMERA MPBT0059301 COMPLEX, (empty), , , , , Black 39
4 MPBZ00 PAD MPBZ0206803 COMPLEX, (empty), , , , ,Without
Color43
4 MPBZ00 PAD MPBZ0206804 COMPLEX, (empty), , , , ,Without
Color
4 MSDB00 SPRING,COIL MSDB0001701 G7000 Pearl White 4
4 MTAA00 TAPE,DECO MTAA0161601 COMPLEX, (empty), , , , ,Without
Color49
4 MTAB00 TAPE,PROTECTION MTAB0239701 COMPLEX, (empty), , , , ,Without
Color53
4 MTAK00 TAPE,CAMERA MTAK0012201 COMPLEX, (empty), , , , ,Without
Color51
4 MWAE00 WINDOW,CAMERA MWAE0036401 CUTTING, PMMA MR 200, , , , ,Without
Color52
3 ACGQ00 COVER ASSY,SLIDE ACGQ0027601Color
Unfixed
4 ABGG00 BUTTON ASSY,SUB ABGG0004401 White Green E, 27
4 ACGK00 COVER ASSY,FRONT ACGK0114301Color
UnfixedG
Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
- 142 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
5 MBJL00 BUTTON,SIDE MBJL0060801 COMPLEX, (empty), , , , , Green 20
5 MBJL01 BUTTON,SIDE MBJL0060701 COMPLEX, (empty), , , , , Green 19
5 MCJK00 COVER,FRONT MCJK0089501 MOLD, PC LUPOY SC-1004A, , , , , Green 19
5 MFBD00 FILTER,MIKE MFBD0031301 COMPLEX, (empty), , , , , Black
5 MTAB01 TAPE,PROTECTION MTAB0239101 COMPLEX, (empty), , , , , Green 21, 22
4 ACGR00COVER ASSY,SLIDE(LOWER)
ACGR0016601Color
UnfixedF
5 MCJV00 COVER,SLIDE(LOWER) MCJV0016401 COMPLEX, (empty), , , , , Green 10
5 MGDA00 GUIDE,LEFT MGDA0013901 MOLD, POM LUCEL N109-LD, , , , , Green 12
5 MGDB00 GUIDE,RIGHT MGDB0008701 MOLD, POM LUCEL N109-LD, , , , , Green 11
5 MMAA00 MAGNET,SWITCH MMAA0000901 G7000 12x2x0.7t Metal Silver 16
5 MPBM00 PAD MPBZ0211501 PRESS, NS, , , , , Black 17
5 MPBZ00 PAD MPBZ0206801 COMPLEX, (empty), , , , ,Without
Color14
5 MPBZ01 PAD MPBZ0206802 COMPLEX, (empty), , , , ,Without
Color15
5 MSGY00 STOPPER MSGY0024601 MOLD, Urethane Rubber S190A, , , , , Green 13
4 ACGS00COVER ASSY,SLIDE(UPPER)
ACGS0020601Color
UnfixedB
5 ABGG00 BUTTON ASSY,SUB ABGG0004901 FUNCTIONWithout
Color5
5 MCJW00 COVER,SLIDE(UPPER) MCJW0019901 MOLD, PC LUPOY SC-1004A, , , , , White 1
5 MFBB00 FILTER,RECEIVER MFBB0026701 COMPLEX, (empty), , , , , Black 4
5 MPBG00 PAD,LCD MPBG0079501 COMPLEX, (empty), , , , , Black 9
5 MTAB00 TAPE,PROTECTION MTAB0239302 COMPLEX, (empty), , , , ,Without
Color6
5 MTAD00 TAPE,WINDOW MTAD0088901 COMPLEX, (empty), , , , ,Without
Color2
5 MTAG00 TAPE,BUTTON MTAG0008101 COMPLEX, (empty), , , , ,Without
Color3
5 MTAJ00 TAPE,FLEXIBLE PCB MTAJ0007801 COMPLEX, (empty), , , , ,Without
Color8
5 MTAZ00 TAPE MTAZ0217901 PRESS, NS, , , , ,Without
Color7
4 ARDY00 RAIL ASSY,SLIDE ARDY0006101 White Green D, 31
4 GMEY00 SCREW MACHINE,BIND GMEY0010601 1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK Black 32
4 GMZZ00 SCREW MACHINE GMZZ0021901 3.0 mm,1.5 mm,SWCH18A ,N ,+ ,- , Black
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 143 -
LevelLocation
No.Description Part Number Spec Color Remark
4 MCCH01 CAP,SCREW MCCH0130601 MOLD, PC LUPOY SC-1004A, , , , , Green 34
4 MLAZ00 LABEL MLAZ0038303 PRINTING, (empty), , , , , White
4 MPBF00 PAD,FLEXIBLE PCB MPBF0032501 COMPLEX, (empty), , , , , Black
4 MTAB00 TAPE,PROTECTION MTAB0239601 COMPLEX, (empty), , , , , Green 29
4 MTAB01 TAPE,PROTECTION MTAB0239301 COMPLEX, (empty), , , , ,Without
Color24
4 MTAZ00 TAPE MTAZ0214201 COMPLEX, (empty), , , , , Green
4 MWAC00 WINDOW,LCD MWAC0101401 CUTTING, PMMA MR 200, 1.2, , , ,Without
ColorA, 25
3 GMEY00 SCREW MACHINE,BIND GMEY0009201 1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm Black 37
3 MLAZ00 LABEL MLAZ0038301 PID Label 4 ArrayWithout
Color
5 ACKA00 CAN ASSY,SHIELD ACKA0009101Without
Color
6 MCBA00 CAN,SHIELD MCBA0033101 PRESS, STS, , , , , Silver
6 MGAD00 GASKET,SHIELD FORM MGAD0171801 COMPLEX, (empty), , , , , Silver
6 MIDZ00 INSULATOR MIDZ0178701 COMPLEX, (empty), , , , ,Without
Color
5 ACMY00 CAMERA ASSY ACMY0006403Without
Color
6 ABFZ BRACKET ASSY ABFZ0014401Without
Color
7 MBFP00 BRACKET,CAMERA MBFP0009201 MOLD, PC LUPOY SC-1004A, , , , , Gray
7 MTAK00 TAPE,CAMERA MTAK0012601 COMPLEX, (empty), , , , ,Without
Color
7 MTAZ00 TAPE MTAZ0214701 COMPLEX, (empty), , , , ,Without
Color
5 ADCA00 DOME ASSY,METAL ADCA0082101 MAIN White
5 MLAZ00 LABEL MLAZ0038301 PID Label 4 ArrayWithout
Color
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 144 -
LevelLocation
No.Description Part Number Spec Color Remark
4 SNGF00 ANTENNA,GSM,FIXED SNGF00364023.0 ,-2.0 dBd,, ,internal, GSM900/1800/1900 ,; ,TRIPLE ,-2.0 ,50 ,3.0
45
4 SPEAKER SUSY0024802PIN ,8 ohm,91 dB,16 mm,3.4T spring contact ,; , , , , , ,,[empty]
41
4 SAEY00 PCB ASSY,KEYPAD SAEY0060403 26
5 SAEB00PCB ASSY,KEYPAD,INSERT
SAEB0023502
6 ADCA00 DOME ASSY,METAL ADCA0082001 White
5 SAEE00 PCB ASSY,KEYPAD,SMT SAEE0027603
6 SAEC00PCB ASSY,KEYPAD,SMTBOTTOM
SAEC0026103
7 C100 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C103 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C104 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
7 C105 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
7 C106 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
7 C108 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
7 C109 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
7 C110 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
7 C112 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
7 C113 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
7 C114 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C115 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 CN100 CONNECTOR,FFC/FPC ENQY001430137 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC,STRAIGHT ,BOTH ,SMD ,[empty] ,[empty] ,
7 CN101CONNECTOR,BOARD TOBOARD
ENBY004530110 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT,FEMALE ,SMD ,[empty] , ,
7 CN102CONNECTOR,BOARD TOBOARD
ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket
7 Q100 TR,BJT,NPN EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY
7 R100 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
7 R101PCB ASSY,MAIN,PADSHORT
SAFP0000501
<Main component> Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
- 145 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
7 R102PCB ASSY,MAIN,PADSHORT
SAFP0000501
7 R110 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
7 R111 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
7 R112 RES,CHIP,MAKER ERHZ0000420 150 ohm,1/16W ,J ,1005 ,R/TP
7 R114PCB ASSY,MAIN,PADOPEN
SAFO0000501 0OHM_1005_DNI
7 R115PCB ASSY,MAIN,PADSHORT
SAFP0000501
7 R116 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
7 U100 IC EUSY0263108 TDFN ,14 PIN,R/TP , ,; ,IC,Charge Pump
7 VA100 VARISTOR SEVY0000701 14 V, ,SMD ,120pF, 1005
7 VA101 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 SAED00PCB ASSY,KEYPAD,SMTTOP
SAED0025703
7 C101 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
7 C102 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
7 LD100 DIODE,LED,CHIP EDLH0004501 BLUE ,1608 ,R/TP ,
7 LD101 DIODE,LED,CHIP EDLH0004501 BLUE ,1608 ,R/TP ,
7 LD102 DIODE,LED,CHIP EDLH0004501 BLUE ,1608 ,R/TP ,
7 LD103 DIODE,LED,CHIP EDLH0004501 BLUE ,1608 ,R/TP ,
7 LD104 DIODE,LED,CHIP EDLH0004501 BLUE ,1608 ,R/TP ,
7 LD105 DIODE,LED,CHIP EDLH0004501 BLUE ,1608 ,R/TP ,
7 LD106 DIODE,LED,CHIP EDLH0004501 BLUE ,1608 ,R/TP ,
7 R103 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R104 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R105 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R106 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R107 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R108 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R109 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 SPJY00 PCB,SUB SPJY0054701 FR-4 ,0.5 mm,MULTI-4 , ,; , , , , , , , , ,
3 SAFY00 PCB ASSY,MAIN SAFY0247503 I, 36
4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0087301
- 146 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 SVCY00 CAMERA SVCY0018101 CMOS ,MEGA ,2M FF Toshiba(1/4'),8.5x8.5x4.6,FPCB
5 SJMY00 VIBRATOR,MOTOR SJMY0008504 2.0 V,0.1 A,10*3.6 ,12mm linear motor ,; ,3V , , , , , , ,
5 SPKY00 PCB,SIDEKEY SPKY0058801 POLYI ,0.2 mm,MULTI-2 , ,; , , , , , , , , ,
5 SPKY01 PCB,SIDEKEY SPKY0058901 POLYI ,0.2 mm,MULTI-2 , ,; , , , , , , , , ,
4 SAFF00 PCB ASSY,MAIN,SMT SAFF0163703
5 SAFC00PCB ASSY,MAIN,SMTBOTTOM
SAFC0104201
6 ANT600 ANTENNA,GSM,FIXED SNGF00367013.0 ,-2.0 dBd,, ,internal, bluetooth chip ,; ,SINGLE ,-2.0,50 ,3.0
6 BAT500 BATTERY,CELL,LITHIUM SBCL00017012 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi4.8, Pb-Free
6 C100 CAP,CERAMIC,CHIP ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
6 C101 CAP,CERAMIC,CHIP ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
6 C102 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C103 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP
6 C104 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C105 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C106 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C107 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C108 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C109 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C110 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C111 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C112 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C113 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C114 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C115 CAP,CERAMIC,CHIP ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
6 C116 CAP,CERAMIC,CHIP ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
6 C117 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C118 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C119 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C120 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C121 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
- 147 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 C122 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C123 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C124 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C125 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C126 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C127 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C128 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C129 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C130 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C131 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C132 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C133 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C134 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C135 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C136 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C137 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C138 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C139 CAP,CERAMIC,CHIP ECCH000039322000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
6 C140 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C141 CAP,CERAMIC,CHIP ECCH000039322000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
6 C143 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C144 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP
6 C145 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP
6 C146 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C147 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C150 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C151 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C152 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C153 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C200 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
- 148 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 C201 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C202 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C203 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C204 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C205 CAP,CHIP,MAKER ECZH0000901 24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C206 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C207 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C208 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C209 CAP,CHIP,MAKER ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
6 C210 CAP,CHIP,MAKER ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
6 C211 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C212 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C213 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C214 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C215 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C216 CAP,CHIP,MAKER ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
6 C217 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C218 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C221 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C222 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C223 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C224 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C225 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C226 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C301 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C302 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C304 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C305 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C308 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C309 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
- 149 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 C311 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C312 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C315 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C425 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C426 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C427 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C500 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C501 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C502 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C503 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C504 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C505 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C506 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C507 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C508 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C509 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C510 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C511 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C512 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C513 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
- 150 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 C514 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C515 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C516 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C517 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C518 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C519 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C520 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C521 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C522 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C523 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C524 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C525 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C526 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C527 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C528 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C529 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C530 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C531 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C532 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C533 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C534 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
- 151 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 C535 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C536 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C537 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C538 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C539 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C540 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C541 CAP,CERAMIC,CHIP ECCH00105017.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C542 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C543 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C544 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C545 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C547 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C548 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C549 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C601 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C602 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C603 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C605 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C606 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C607 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C608 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C609 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C610 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C611 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
6 C612 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C613 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C614 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
- 152 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 C615 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C616 CAP,CHIP,MAKER ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 C617 CAP,CHIP,MAKER ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 C618 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C619 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C621 CAP,CHIP,MAKER ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C622 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C623 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C624 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C626 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C627 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C628 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C629 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C630 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C631 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C632 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C633 CAP,CERAMIC,CHIP ECCH0000196 0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C634 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
6 C635 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
6 C638 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C639 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C640 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C643 CAP,CERAMIC,CHIP ECCH0004906 2.5 pF,50V ,C ,X7R ,TC ,1005 ,R/TP
6 C644 CAP,CERAMIC,CHIP ECCH0004906 2.5 pF,50V ,C ,X7R ,TC ,1005 ,R/TP
6 C645 CAP,CERAMIC,CHIP ECCH0000195 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C646 CAP,CERAMIC,CHIP ECCH0000195 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C647 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C648 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C649 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C650 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 CN200 CONNECTOR,I/O ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type
- 153 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 CN201 CONNECTOR,ETC ENZY0020401 3 PIN,2.5 mm,BOTTOM , ,
6 CN500CONNECTOR,BOARD TOBOARD
ENBY0020401 24 PIN,0.4 mm,ETC , ,H=0.9, Socket
6 CN600 CONN,RF SWITCH ENWY0001801 STRAIGHT ,SMD ,2 dB,3000PCS/REEL
6 D100 DIODE,SWITCHING EDSY0017301 VSM ,15 V,100 mA,R/TP ,PB-FREE
6 D101 DIODE,SWITCHING EDSY0009901 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t)
6 D102 DIODE,SWITCHING EDSY0009901 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t)
6 FB200 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB201 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB202 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB203 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB206 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB500 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 ,
6 FB600 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 ,
6 FB601 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 ,
6 FL200 FILTER,EMI/POWER SFEY0007101 SMD ,1CH,1608Feedthru ESD/EMI filter for power Pb-free
6 FL600 FILTER,DIELECTRIC SFDY00026012450 MHz,2.0*1.25*1.0 ,SMD ,2400M~2500M, IL 3.8,8pin, U-B, 34.2_j95, BT (CSR BC41B143A) ,; ,BPF ,2450,100 ,SMD ,R/TP
6 J500 CONN,SOCKET ENSY0018701 6 PIN,ETC , ,2.54 mm,H=1.8
6 L100 INDUCTOR,CHIP ELCH0004722 47 nH,J ,1005 ,R/TP ,
6 L101 INDUCTOR,CHIP ELCH0004722 47 nH,J ,1005 ,R/TP ,
6 L102 INDUCTOR,CHIP ELCH0004722 47 nH,J ,1005 ,R/TP ,
6 L103 INDUCTOR,SMD,POWER ELCP0006703 10 uH,M ,3.2*2.6*1.0 ,R/TP ,
6 L104 INDUCTOR,SMD,POWER ELCP0006703 10 uH,M ,3.2*2.6*1.0 ,R/TP ,
6 L200 INDUCTOR,CHIP ELCH0009114 100 nH,J ,1005 ,R/TP ,coil
6 L300 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,
6 L301 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,
6 L500 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,
6 L501 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,
6 L601 INDUCTOR,CHIP ELCH0004730 33 nH,J ,1005 ,R/TP ,
6 L602 INDUCTOR,CHIP ELCH0003823 470 nH,K ,1608 ,R/TP ,chip coil,PBFREE
6 L603 INDUCTOR,CHIP ELCH0001402 18 nH,J ,1005 ,R/TP ,Pb Free
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 154 -
LevelLocation
No.Description Part Number Spec Color Remark
6 L605 INDUCTOR,CHIP ELCH0003819 12 nH,J ,1005 ,R/TP ,
6 L606 INDUCTOR,CHIP ELCH0001411 1.2 nH,S ,1005 ,R/TP ,PBFREE
6 L607 INDUCTOR,CHIP ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE
6 L608 INDUCTOR,CHIP ELCH0001402 18 nH,J ,1005 ,R/TP ,Pb Free
6 L609 INDUCTOR,CHIP ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005
6 L610 INDUCTOR,CHIP ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE
6 M600 MODULE,ETC SMZY0015801 84 Ball 0.5pitch, BGA , Bluetooth+FM (6.0*6.0*1.0)
6 Q200 TR,BJT,NPN EQBN0007601 SOT-23 ,0.15 W,R/TP ,EMT3
6 Q201 TR,BJT,NPN EQBN0013701 EMT6 ,150 mW,R/TP ,DUAL TRANSISTORS
6 R100PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R101PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R105 RES,CHIP,MAKER ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP
6 R106 RES,CHIP,MAKER ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP
6 R109 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP
6 R110 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP
6 R111 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R112 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R113 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R114 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP
6 R115 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R116PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R117 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R118 RES,CHIP,MAKER ERHZ0000444 22 Kohm,1/16W ,J ,1005 ,R/TP
6 R120 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R121 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R200 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP
6 R201 RES,CHIP,MAKER ERHZ0000467 330 Kohm,1/16W ,J ,1005 ,R/TP
6 R202 RES,CHIP,MAKER ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP
6 R203 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R204 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 155 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R205 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R209 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R210 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R211 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R212 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R213 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP
6 R214 RES,CHIP,MAKER ERHZ0000224 16 Kohm,1/16W ,F ,1005 ,R/TP
6 R215 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R216 RES,CHIP,MAKER ERHZ0000268 33 Kohm,1/16W ,F ,1005 ,R/TP
6 R218 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R219 RES,CHIP,MAKER ERHZ0000467 330 Kohm,1/16W ,J ,1005 ,R/TP
6 R220 RES,CHIP,MAKER ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP
6 R221 RES,CHIP ERHY0000298 3.3M ohm,1/16W,J,1005,R/TP
6 R222 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R223 RES,CHIP,MAKER ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP
6 R224 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R225 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R228 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R229 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R230PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R300PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R313PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R314PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R500 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R501 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R502 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R503 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R504 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R505 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R506 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 156 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R507 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R508 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R509 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R510 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R511 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R512 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R513 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R514 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R515 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R516 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R517 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R518 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R519 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R520 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R521 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R522 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP
6 R523PCB ASSY,MAIN,PADOPEN
SAFO0000501 0OHM_1005_DNI
6 R524 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
6 R600PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R601 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R602 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R603 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R604 RES,CHIP,MAKER ERHZ0000496 560 ohm,1/16W ,J ,1005 ,R/TP
6 R605 RES,CHIP,MAKER ERHZ0000456 2.2 ohm,1/16W ,J ,1005 ,R/TP
6 R606 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP
6 R607 RES,CHIP,MAKER ERHZ0000287 47 Kohm,1/16W ,F ,1005 ,R/TP
6 R608PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R609 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R610 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R611 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 157 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R612 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R613 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R614 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R615 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R616 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP
6 R617 THERMISTOR SETY0006301NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T,PBFREE
6 S500 CONN,SOCKET ENSY0021001 8 PIN,ANGLE ,Reverse , mm,
6 U100 IC EUSY0338202FBGA ,107 PIN,ETC ,FULLY 1.8V 1G(LB/128Mx8)NAND+512M(8Mx4x16) SDRAM ,; ,IC,MCP
6 U101 IC EUSY0227901SON5-P-0.35(fSV) ,5 PIN,R/TP ,2-INPUT AND GATE, PbFree
6 U102 IC EUSY0347801BGA ,293 PIN,R/TP ,EDGE RF BB PM Onechip BB ,;,IC,Digital Baseband Processor
6 U200 IC EUSY0250501SC70 ,5 PIN,R/TP ,Comparator, pin compatible toEUSY0077701
6 U201 IC EUSY0351601DFN ,12 PIN,R/TP ,Dual Charger IC (Bypass) ,;,IC,Charger
6 U303 IC EUSY0360201CSP ,20 ,R/TP ,Class D(mono) + Capless HP + A/S ,;,IC,Audio Sub System
6 U600 PAM SMPY0017901dBm, %, A, dBc, dB,5x5 ,SMD ,IFX Linear Edge ,; , , , , , ,, ,R/TP ,R/TP ,
6 U601 FILTER,SEPERATOR SFAY0012001 , , dB, dB, dB, dB,4532 ,IFX EDGE Quad Pin
6 VA500 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA501 VARISTOR SEVY0003801 18 V, ,SMD ,
6 X100 X-TAL EXXY001840426 MHz,10 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.6 ,12ppmat -30'C ~ +85'C, C0 1.0pF, C1 3.6fF ,; ,26 ,10PPM ,8 , ,,SMD ,R/TP
6 X101 X-TAL EXXY001870132.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9,
5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0102601
6 C219 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C220 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C300 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C303 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C307 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
6 C313 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C314 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 158 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C316 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
6 C317 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C318 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C319 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C320 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C321 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C322 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C400 CAP,CHIP,MAKER ECZH0004402100000 pF,16V ,Z ,X7R ,TC ,1005 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C401 CAP,CHIP,MAKER ECZH0004402100000 pF,16V ,Z ,X7R ,TC ,1005 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C402 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C403 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C404 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C405 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C406 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C407 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C408 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C409 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C410 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C411 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C412 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C413 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C414 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C415 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C416 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C417 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C418 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C419 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C420 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C421 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C422 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 159 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C423 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C424 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C550 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C551 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 C552 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 CN400CONNECTOR,BOARD TOBOARD
ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket
6 FL400 FILTER,EMI/POWER SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)
6 FL401 FILTER,EMI/POWER SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)
6 FL402 FILTER,EMI/POWER SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)
6 FL403 FILTER,EMI/POWER SFEY0010501SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF),Pb-free
6 FL404 FILTER,EMI/POWER SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)
6 L302 INDUCTOR,CHIP ELCH0004727 100 nH,J ,1005 ,R/TP ,
6 L303 INDUCTOR,CHIP ELCH0004727 100 nH,J ,1005 ,R/TP ,
6 L304 INDUCTOR,CHIP ELCH0004727 100 nH,J ,1005 ,R/TP ,
6 LD300 DIODE,LED,CHIP EDLH0013701WHITE ,ETC ,R/TP ,SIDEVIEW ,; ,[empty] ,2.9~3.75,30mA , , ,120mW ,[empty] ,[empty] ,2P
6 LD301 DIODE,LED,CHIP EDLH0013701WHITE ,ETC ,R/TP ,SIDEVIEW ,; ,[empty] ,2.9~3.75,30mA , , ,120mW ,[empty] ,[empty] ,2P
6 LD302 DIODE,LED,CHIP EDLH0013701WHITE ,ETC ,R/TP ,SIDEVIEW ,; ,[empty] ,2.9~3.75,30mA , , ,120mW ,[empty] ,[empty] ,2P
6 MIC300 MICROPHONE SUMY0010608UNIT ,42 dB,3.76*2.95*1.1 ,MEMS mic ,; , , ,OMNI,[empty] , ,[empty]
6 R102PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R104 RES,CHIP ERHY0000166 390 Kohm,1/16W ,F ,1005 ,R/TP
6 R107 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP
6 R108 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
6 R217 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R301 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R302 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R303PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R304PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R305PCB ASSY,MAIN,PADSHORT
SAFP0000501
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 160 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R306 RES,CHIP ERHY0000283 130K ohm,1/16W,J,1005,R/TP
6 R307PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R308 RES,CHIP ERHY0000283 130K ohm,1/16W,J,1005,R/TP
6 R309 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R310 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R311 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R312 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R400 RES,CHIP,MAKER ERHZ0000213 120 Kohm,1/16W ,F ,1005 ,R/TP
6 R401PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R402 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
6 R403 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R404 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R405 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R406 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R407 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R408 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R409 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R410 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R411PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R412 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R413PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R414 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R415 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
6 R416 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R417 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R418 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R419 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R420 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R525 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 SPFY PCB,MAIN SPFY0178401FR-4 ,0.8 mm,STAGGERED-8 ,ETNA MAIN PCB ,; , , , , ,, , , ,
- 161 - LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 U202 IC EUSY0313401QFN ,4 PIN,R/TP ,1.8X1.2X0.5 size wide input voltageHall Switch
6 U300 IC EUSY0232816 SON1612-6 ,6 PIN,R/TP ,3.0V ,150mA,LDO
6 U301 IC EUSY0140901 SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free
6 U302 IC EUSY0335701 QFN ,8 PIN,R/TP ,1.2W, Mono, Differencial Audio AMP
6 U304 IC EUSY0140901 SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free
6 U400 IC EUSY0300004QFN ,28 ,R/TP ,Keycoder ic, 28pin, 64keys ,; ,IC,AnalogMultiplexer
6 U500 IC EUSY0319001WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V DualLDO
6 VA300 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA301 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005
6 VA502 VARISTOR SEVY0005201 5.5 V, ,SMD ,1005, 50pF
6 VA503 VARISTOR SEVY0005201 5.5 V, ,SMD ,1005, 50pF
6 VA504 VARISTOR SEVY0005201 5.5 V, ,SMD ,1005, 50pF
6 VA505 VARISTOR SEVY0005201 5.5 V, ,SMD ,1005, 50pF
6 VA506 VARISTOR SEVY0005201 5.5 V, ,SMD ,1005, 50pF
Note
Note