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Ladder QA Summary
Ladder 8 7 6 5 4 3 2 1 8 7 6 5 4 3 2 1 Remarks
1 X X X X X X X X O O O O O X O O • left : short (via-GND)• right chip3 : cannot mask
2 O O O O O O O O O O O O O O O D • right chip1 : defect of bump bond
3 O D D D O O O O O O O O X O O O• left chip5-7 : defect of bump bond (~30%)• right chip4 : delamination of chip• leakage current : 200mA at 20V
4 X X X X O O O O O O O O O O X X • left chip5-8 : short (via-GND)• right chip 1-2 : delamination of chip
5 O O O O O O O O O O O O O O O O• to be repaired (connector of left bus)• few % of left chip 1,2,5,7 and Right chip 2,4 : defect bump bond
6 O O O O O O O O O O O O O O O O
7 X X • left chip1-2 : destroyed
8 • wire bonding (going on)
9 • completion of sensor gluing
Left Right
Ladder 1
Noise pixelCannot mask
Cannot take data because ofshort between DATA B22 (via hole) and GND
6
Wires of only chip4 of right BUS popped up.
Delamination for Ladder3delaminated from stave
chip6 chip5 chip4 chip3
Side view (Ladder3)
Top view (Ladder3)
Sensor module
8 7 6 5 4 3 2 18 7 6 5 4 3 2 1
BUS
popped upStave
Stave
Sensor module
BUS
8
8 7 6 5 4 3 2 18 7 6 5 4 3 2 1
Wires of chip1 and 2 of right BUS were damaged.
Delamination for Ladder4
Wires of chip8 of left BUS (some analog line and JTAG line) were damaged.
Side view (Ladder3)
Top view (Ladder4)
Sensor moduleBUS
half area doesn’t respond
Stave