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Advancing the Standard Doc Daugherty, Steven Neuhaus LAB Shape Fidelity LAB: E-Beam Lithography Simulation to Optimize Nanoparticle Self Assembly Devices University of Pennsylvania

LAB: E-Beam Lithography Simulation to Optimize

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Advancing the Standard Doc Daugherty, Steven Neuhaus

LAB Shape Fidelity

LAB: E-Beam Lithography Simulation to Optimize

Nanoparticle Self Assembly Devices

University of Pennsylvania

One of the country's most sophisticated interdisciplinary research and

teaching facilities for nanoscale science and engineering

Krishna P. Singh Center for Nanotechnology

Krishna P. Singh Center for Nanotechnology➢ Supports research in many fields

➢ Allows the university to bring together many nanotechnology and materials-development groups

➢ Foster collaboration among groups that may have previously conducted their work independently

➢ Large Centers in the Building➢ QNF – Quattrone Nanofabrication Facility➢ NBIC – NanoBio Interface Center➢ NCF – Nanoscale Characterization Facility

➢ Faculty Research Laboratories➢ Electrical, Mechanical, Bio- and Chemical

Engineering➢Materials Science➢ Physics, Chemistry and Biology

➢ The cleanroom is operated by QNF staff➢ Nearly 200 researchers use the cleanroom

in a calendar year➢ 10,800 sq ft of clean space for

nanotechnology research➢ Eight full-time technical staff keep it

running (lean)➢ Manage approximately 12,000 sq ft of total

lab space, supported by an additional 15,000 sq ft of mechanical space

➢ Capital equipment replacement valued in excess of $25M➢ Largest collection of university

nanofabrication equipment on the east coast between Boston and Atlanta

➢ Dedicated microfluidics cleanroom / lab-on-chip foundry

➢ Unique laser micromachining facility➢ Integrated with 3-D printing AddLab

Krishna P. Singh Center for Nanotechnology

➢ Nearly 200 researchers annually➢ 15% of users are from outside Penn➢ Large use from local universities ➢Mix of small/large companies

Life Sciences (33%)

Optics & Optoelectronics (17%)

Physics (17%)

Mechanical Devices (15%)

Materials (8%)

Electronics (8%)

Chemistry (2%)

Life Sciences (33%)

Optics & Optoelectronics (17%)

Physics (17%)

Mechanical Devices (15%)

Materials (8%)

Electronics (8%)

Chemistry (2%)

Application CaseTemplate-Assisted Self Assembly – Improving Shape Fidelity & Yield

Template-Assisted Self-Assembly (TASA)

- Can construct assemblies

with interparticle spacings

on the single-nm scale

- Geometric constraints

allow us to make

reproducible structures (statistics)

- Scalable to large area

- Should be applicable to

any stable colloid system

Precise placement of NCs in

patterns defined by template

geometry

LAB Shape Fidelity

Template-Assisted Self-Assembly (TASA)

Flauraud, V. et al. Nat. Nanotechnol. 12, 73–80 (2017). Scale bars 250nm.

Close-packed OpenShape-selective

heterostructures

LAB Shape Fidelity

Absorption enhancement

Γ𝑎𝑏𝑠 ∝ 𝝁 ⋅ 𝑬 2 Greybush, N. J. et al. ACS Nano (2014)

Surface Plasmon Enhanced Luminescence

Gargas, D. J. et al. Nat. Nanotechnol. (2014)

Emission enhancement

Γ𝑒𝑚 ∝ LDOS

LAB Shape Fidelity

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• The target design is the device on the left, patterned with large array spacing

• The critical CDs are the size of each central region (50 nm) and the 3 extended arms of the polygons (100 nm)• Important that center region is not too

large that nanoparticles fill it

• Current results not acceptable and TASA does not give high yields

Problem Statement

LAB Shape Fidelity

Target 1st Result

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Tool: Elionix ELS-7500EX (50 kV system)

Resist: 80 nm PMMA (180 C, soft bake, 90 seconds)

Exposure: 320 μC/cm² dose, 50 pAcurrent, 75 μm field size, writing grid = 1 nm, beam step size 1.25 nm.

Development: IPA:DI water 3:1, 60 seconds, then quench in IPA in 30 seconds and blow dry

Initial Process Conditions

LAB Shape Fidelity

Target 1st Result

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In this talk we will cover strategies and techniques for using BEAMER, LAB and TRACER together to solve problems in e-beam lithography

BEAMER has a variety of advanced dose correction and pattern modification techniques, let’s evaluate them with LAB simulation to pick a well reasoned next trial

Approach

LAB Shape Fidelity

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E-beam Lithography

3D PSFs

PSFs

GPF, VEP, V30, CON

+

3D Resist Profile

GDS

LAB Shape Fidelity

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Estimating blur from simulation

LAB Shape Fidelity

30 nm blur 50 nm blur 70 nm blur 80 nm blur 90 nm blur

• Both E-beam simulation and advanced corrections in BEAMER and LAB requires setting a beam blur – the effective spot size due to beam size, defocus, noise, forward scattering and more…

• There is process calibration, but using BEAMER E-BEAM simulation, we can estimate the blur by matching to SEM image

• Ambiguity – which is the actual dose where the feature edges fall?

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Estimating blur from simulation

LAB Shape Fidelity

Assuming a 50 nm blur

This is a reasonable assumption, not a guarantee

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Let’s explore the key learnings from analysis & simulation.

1. Standard PEC (Long Range Correction)

2. Standard PEC (Long & Short Range Correction)

3. Corner-PEC

4. Shape-PEC (Overdose Undersize)

5. Manual Pattern Modification

Evaluating Options

LAB Shape Fidelity

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Before considering PEC, the proper base dose for PEC needs to be found

1. Correct base dose can be found by measuring the center of a 1:1 Line Space Grating

200 nm lines in 4B x 4B grating

2. Expose the grating at increasing dose in a dose matrix

3. Measure the center of the pattern where pattern density is exactly 50%

4. Choose dose where line and space are same width

The result adjusted the dose from 320 μC/cm² to 192 μC/cm²

Base Dose Determination

LAB Shape Fidelity

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PEC (Long-Range Correction Only)

• Long range PEC merely increased the dose factor by 63%

• 63% increase of 192 is 312 μC/cm² -> previous base dose was actually very close to ideal for a no PEC scenario. No expected gain.

PEC (Long Range + Short Range Correction with blur of 50 nm)

• Short range results are asymmetric, even with some pattern optimization. This sometimes happens with very small isolated elements. Not ideal.

• Decided to abandon these two routes.

Standard PEC options

LAB Shape Fidelity

PEC LR+SR

PEC LR

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At this time, the user decided to switch to switch to a new process:

Tool: Elionix ELS-7500EX (50 kV system)

Resist: 80 nm ZEP520A (180C soft bake, 90 seconds)

Exposure: 106 μC/cm² dose, 30 pAcurrent, 75 μm field size, writing grid = 3 nm, beam step size 3.75 nm.

Development: o-xylene, for 70 seconds seconds, then quench in IPA in 30 seconds and blow dry

Getting better, but still needs improvement, now what?

ZEP Process

LAB Shape Fidelity

Target 2nd Result

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• UPenn offers contrast curves for their standard resist products

• LAB offer resist development rate modeling• Models: Simple Threshold, Mack4, and

Development Rate

• For E-Beam, Development Rate is preferable

• This ZEP contrast curve was entered into LAB material database• Gives development rate at any point

XYZ in resist during simulation of resist development

LAB

LAB Shape Fidelity

https://repository.upenn.edu/cgi/viewcontent.cgi?a

rticle=1033&context=scn_protocols

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• With this in hand, we proceeded with 3 simulation trials to pick the next exposure.• Corner-PEC

• Shape-PEC (Overdose Undersize)

• Manual Layout Modification

Next Steps

LAB Shape Fidelity

Corner-PEC

Shape-PEC ODUS

Manual Layout Modification

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• Corner-PEC allows “framing” a shape with shapes with alternate dose factors

• Selectively lower doses in interior of shape and inner corners, and raise dose in outer corners to improve shape fidelity

• Results:• Simulation CD match to targets looked

good

• However, large sidewall angle change due to lower interior dose

• No trial run

• Further adjustments would be needed but still possible candidate

Corner-PEC

LAB Shape Fidelity

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Shape-PEC ODUS

LAB Shape Fidelity

• Shape-PEC is a strategy that allows adjusting the shape edges to correct for short range effects

• It also allow “Overdose/Undersize”, to improve image contrast

• Results: • At 1.5x overdose, not promising. Interior

region already not resolving.

• Later experimental trial showed anticipated failure.

• Steeper sidewalls

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Manual Pattern Modification

LAB Shape Fidelity

• Manual modification: Because of results of previous trials, we decided to try using BEAMER layout operations manually adjust the pattern. The result kept the “lobes” at the same size, but removed the interior area.

• Results:• Simulation results are good for CD &

straight sidewalls. Decided to run next trial.

• Trial results still need a improvement, but design to wafer is now close enough

• Successful device yield through TASA achieved

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Results & Future Work

LAB Shape Fidelity

• BEAMER, LAB and TRACER can work together to enable smart planning of experimental trials

• No single correction technique is suited for all cases

• Sometimes, the simplest answer may be the best one

• Future work:• Further tune the size of the “lobes” as they

are undersized slightly, to increase yield

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[email protected]

Thank You!

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Advancing the Standard

25LAB Shape Fidelity