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IE551 Lecture 06: Electronic Manufacturing Systems − Electronic Manufacturing Processes, T.L. Landers et al, Prentice Hall

− Other materials

Contents 1. LCD Manufacturing System

1.1 LCD Module Structure and Manufacturing Architecture 1.2 LCD Fabrication/Assembly Processes 1.3 Physical Layout of Processing Equipment and Material Handling

2. IC Chip Manufacturing System 2.1 IC Chip Structure and Manufacturing Architecture 2.2 IC Chip Fabrication Processes 2.3 Physical Layout of Processing Equipment and Material Handling

3. PCB Manufacturing System 3.1 PCB Structure and Manufacturing Architecture 3.2 PCB Fabrication Processes 3.3 Physical Layout of Processing Equipment and Material Handling

1. LCD Manufacturing System 1.1 LCD Module Structure and Manufacturing Architecture

1. LCD (liquid crystal display) Module Structure LCD Module = LCD Panel (TFT+CF)+ BLU + PCB + Driver-IC+ Case Frame

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2. LCD Manufacturing System Architecture

(1) Fabrication: TFT line, CF line, Cell#1 line (2) Assembly: Cell#2 lines, Module lines

1.2 LCD Fabrication/Assembly Processes

1. TFT Fabrication Process: Sequence of patterning operations

2. CF Fabrication Process: Sequence of patterning and coloring operations

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3. LC Fabrication Process

4. LC Assembly Process

5. Module Assembly Process

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1.3 Physical Layout of Processing Equipment and Material Handling

1. Processing Equipment Types in LCD FAB

(1) Inline configuration

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(2) U-inline configuration example

2. Material Handling Example in LCD FAB: Robot & LMS

3. Factory Layout Examples (1) Multi-FAB Configuration Example

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(2) TFT FAB Layout Example

(3) Module Line Example: Multiple lanes

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2. IC Chip Manufacturing System 2.1 IC Chip Structure and Manufacturing Architecture

1. IC Chip Structure

2. IC Chip Manufacturing Network

3. IC Chip FAB System Architecture: Reentrant flow line (job shop): 동영상

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2.2 IC Chip Fabrication Processes

1. Pre-FAB & Post-FAB (Backend) Operations

Backend process: See http://www.semiteq.co.kr/products/simu.html

2. FAB Operations:

- Modern memory chips require 800 steps (400 main steps) with 30~40 layers

Sample Routing Data (SEMATECH) 1) Product Type: Non-Volatile Memory 2) 14 layers with 223 steps (including rework)

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Step

# Step Name Layer

Processing Time(Hours)

Per-Wafer Per-Lot Per-Batch

1 INITIAL_OX_PRE_CLN 1 0.25

2 INITIAL_OXIDATION 1 4.7

3 VAPOR_PRIME_OVEN (CVD) 1 0.58

4 ZL_PHOTORESIST_COATING 1 0.03

5 ZL_EXPOSE 1 0.01

6 ZL_DEVELOP 1 0.04

7 ZL_ADI(After Develop Inspection) 1 0.01

8 (Rework) STRIP (go to step 4) 1 0.02

9 ZL_ETCH_1 1 0.02

10 ZL_ETCH_2 1 0.01

11 ZL_ETCH_3 1 0.2

12 ZL_AEI(After Etch Inspection) 1 0.17

13 ZL_ETCH_4 1 0.06

14 ZL_ETCH_5 1 0.03

15 ZL_ AEI 1 0.33

16 ZL_ETCH_6 1 0.60

17 ZL_ETCH_7 1 0.12

18 ZL_AEI 1 0.17

19 NWM_VAPOR_PRIME_OVEN

(CVD)

2 0.58

20 NWM_PHOTORESIST _COATING 2 0.03

21 NWM_EXPOSE 2 0.03

22 NWM_DEVELOP 2 0.04

23 NWM_ADI 2 0.01

24 (Rework) STRIP (go to step 20) 2 0.02

25 NWM_ETCH_1 2 0.02

26 NWM_ETCH_2 2 0.01

27 NWM_ETCH_3 2 0.20

28 NWM_AEI 2 0.17

29 N_WELL_IMPLANTATION (doping) 2 0.01

30 NWM_STRIP_1 2 0.60

31 NWM_STRIP_2 2 0.17

184 REFLOW_PRE_CLN 13 0.20

185 REFLOW 13 2.80

186 SILICON_ETCH 13 0.03

187 METAL_DEPOSITION_1 13 0.12

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188 METAL_DEPOSITION _2 13 0.03

189 METAL_DEPOSITION _3 13 0.06

190 METAL_DEPOSITION _4 13 0.03

191 METAL_VAPOR_PRIME_OVEN 13 0.58

192 METAL_PHOTORESIST_COATING 13 0.03

193 METAL_EXPOSE 13 0.03

194 METAL_DEVELOP 13 0.04

195 METAL_ADI 13 0.01

196 (Rework) STRIP (go to step 192) 13 0.02

197 METAL_ETCH_1 13 0.02

198 METAL_ETCH_2 13 0.05

199 METAL_ETCH_3 13 0.04

200 METAL_ETCH_4 13 0.33

201 METAL_AEI 13 0.33

202 METAL_ETCH_6 13 0.25

203 TOPSIDE_DOPING 13 3.75

204 PAD_VAPOR_PRIME_OVEN 14 0.58

205 PAD_PHOTORESIST_COATING 14 0.03

206 PAD_EXPOSE 14 0.03

207 PAD_DEVELOP 14 0.04

208 PAD_ADI 14 0.01

209 (Rework) STRIP (go to step 205) 14 0.02

210 PAD_ETCH_1 14 0.02

211 PAD_ETCH_2 14 0.05

212 PAD_AEI 14 0.33

213 PAD_ETCH_4 14 0.04

214 PAD_AEI 14 0.33

215 ALLOY_2 14 1.9

216 LAMINATE 0.01

217 BACKSIDE GRINDING 0.02

218 DELAMINATE 0.02

219 ULTRASONIC 0.13

220 ULTRASONIC_CLN 0.00

221 UV_BAKE 0.02

222 WET(CLN) 1.18

223 VISUAL_INSPECT 0.98

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2.3 Physical Layout of Processing Equipment and Material Handling

1. Processing Equipment Types in Wafer FAB 1) Wafer/Batch Inline, 3) Wafer/Lot Oven, 3) Chamber, (4) Table type (1) Wafer Inline configuration example

(2) Batch Inline configuration example

(3) Wafer Oven configuration example

(4) Chamber configuration example

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2. Material Handling in a Bay (Intra-bay transport): OHT

STB: side track buffer

3. FAB Layout Example

Equipment Groups: CMP, Imp, Etch (dry/wet), Diff, Photo, CVD, Sputter, Test, Clean

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3. PCB Manufacturing System 3.1 PCB Structure and Manufacturing Architecture

1. PCB Structure (MLB: multi-layer board) Raw materials: CCL(copper clad laminate), Pre-preg (epoxy), Copper foil

3.2 PCB Fabrication Processes

1. BOP (bill of processes) Structure: 8-layer MLB

(1) CCL: 0.06~1.1mm thick, 1020x1020mm (2) Work sizes: 340x340, 510x340, etc. (m x n sheets) (3) TAT: 10~14 days

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2. Fabrication Process Flow

3.3 Physical Layout of Processing Equipment and Material Handling

1. Material Handling & Processing Equipment types

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2. Factory Layout Example (1) Overall Structure: Job shop

(2) Inner-layer shop

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Summary

1. LCD Manufacturing System 1.1 LCD Module Structure and Manufacturing Architecture: Flexible flow lines 1.2 LCD Fabrication/Assembly Processes - TFT/ CF/ LC Fabrication Process - LC/ Module Assembly Process 1.3 Physical Layout of Processing Equipment and Material Handling - Processing Equipment Types in LCD FAB: Inline, U-inline - Material Handling Example in LCD FAB: Robot & LMS - Factory Layout Examples: TFT FAB & Module Line

2. IC Chip Manufacturing System 1.1 IC Chip Structure and Manufacturing Architecture: Reentrant flow line (job shop) 2.2 IC Chip Fabrication Processes - Pre-/Post-FAB Operations & FAB Operations: SEMATECH Data 2.3 Physical Layout of Processing Equipment and Material Handling - Processing Equipment Types: Wafer Inline, Batch Inline, Wafer Oven, Chamber - Material Handling in a Bay & 300mm FAB Layout Example

3. PCB Manufacturing System 3.1 PCB Structure 3.2 PCB Fabrication Processes - BOP (bill of processes) Structure: 8-layer MLB - Fabrication Process Flow 3.3 Physical Layout of Processing Equipment and Material Handling - Material Handling & Processing Equipment types - Overall Structure: Job shop - Inner-layer shop