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L. Greiner 1IPHC meeting – May 7, 2012
STAR HFTSTAR HFT
Plans for the next year
A short report on HFT/PXL plans for post May 2012
TPC – Time Projection Chamber(main tracking detector in STAR)
HFT – Heavy Flavor Tracker SSD – Silicon Strip Detector
r = 22 cm LBNL – Jim Thomas
IST – Inner Silicon Tracker r = 14 cm MIT – Bernd Surrow
PXL – Pixel Detector r = 2.5, 8 cm LBNL – Leo Greiner
2IPHC meeting – May 7, 2012L. Greiner
STAR HFTOutline
• Existing HFT/PXL status and schedule• Testing Goals at IPHC• Immediate plans / discussion• Possible scenarios for the near term
3IPHC meeting – May 7, 2012L. Greiner
STAR HFTExisting PXL status and schedule
• CD-2/3 passed September 2011 – we are a fully funded DOE construction project.
• Many thanks to IPHC group for years of collaboration, support and help including during reviews.
• Significant management overhead, reports, reviews, etc.
• The main task for 2012 is the construction and delivery of a three sector prototype detector by January of 2013.
4IPHC meeting – May 7, 2012L. Greiner
STAR HFTSelected HFT Tasks for the next year
• Installation of the new IDS pieces and new beam pipe in ~ July 2012.
• Production of a prototype PXL detector using complete mechanics, installation tooling, sensors, RDO system, interface to STAR. This will allow for both an in beam test of the PXL design and a measurement of the charged particle environment at low radius.
• The installation for the PXL prototype detector is scheduled for December 2012.
• The SSD and IST detectors are not scheduled to be installed until summer 2013.
5IPHC meeting – May 7, 2012L. Greiner
STAR HFTPXL tasks for 2012
We have a deliverable of a working prototype detector (3 sectors) to be installed at the end of 2012. Thus we need to produce first articles of all of the production stages for the final detector.
Tasks for 2012:• Production probe testing working for Ultimate sensors• Cable design complete with Cu conductors• New pre-production RDO (all boards) system working• Full firmware and software for data-taking• All mechanical designs complete and tested.• Mechanical structures fabricated.• Ladders => sectors fabricated + full scripted testing.• Metrology• Slow control system• Software for tracking using metrology data• Software for cosmic ray / beam testing tracking.• etc.
6IPHC meeting – May 7, 2012L. Greiner
STAR HFTSteps to Prototype Detector
Fix cable design (width)
Fabricate cables Fix mechanical designFabricate mech pieces
Probe test sensors
Fabricate ladders
Fabricate sectors
Testing and metrology
Test ladder cable design
Deliver to STAR, test and install
Sensor and mechanical only. RDO, slow control, etc. not shown.
Prototype detector planned to be fabricated with Ultimate 1 sensors.
7IPHC meeting – May 7, 2012L. Greiner
STAR HFTCable testing
• Cable design validation is very relevant to many parts of the project;– The hybrid cable design itself is needed to fabricate
ladders from a working design.– Mechanical – if additional cable width is needed we
will need to re-design the mechanical parts including assembly fixturing.
– Ultimate 2 submission – We wish to fully check the functioning of sensors on a ladder before submitting the next version of the sensors.
A working hybrid cable design is required for most of the next production steps.
8IPHC meeting – May 7, 2012L. Greiner
STAR HFTNext Steps
• A design for the final cable has already been prepared assuming successful testing of the existing (one-power) design.
• Perhaps this is an optimistic scenario• PCB shop at CERN will quote cost for initial design and
wait to produce final cable design.• Produce PCBs• Additional testing and design steps will be discussed in
MS’s talk.
9IPHC meeting – May 7, 2012L. Greiner
STAR HFTPoints to return to
• Ultimate 2 submission schedule• Additional testing plans and schedule• Cable submission schedule
10IPHC meeting – May 7, 2012L. Greiner
STAR HFTSTAR PXL DETECTOR STRUCTURE
STAR PXL Detector10 sectors
PXL Sector3 outer ladders1 inner ladder
MAPSRDObuffers/drivers
4-layer kapton cable with aluminium tracesAluminum conductor Ladder Flex Cable
11IPHC meeting – May 7, 2012L. Greiner
STAR HFTCable Structure
Preliminary Design: Hybrid Copper / Aluminum conductor flex cable
There are two cable regions joined by wire bonds
Outer ladders have a simple rectangular driver region PCB.
Inner ladders have a complex driver region PCB that incorporates a kapton flex region to allow the ladder interface connector to be routed to the top of the sector.
12IPHC meeting – May 7, 2012L. Greiner
STAR HFTSTAR PXL Ladder PCBs
There are 3 PCBs to produce for the STAR PXL detector ladders.
Low Mass Ladder PCB – common for all ladders
Outer Ladder Driver PCB – joined to low mass PCB and used for outer ladders.
Inner Ladder Driver PCB – joined to low mass PCB and used for inner ladders.
There are 3 outer ladders for every 1 inner ladder.
13IPHC meeting – May 7, 2012L. Greiner
STAR HFTLow mass ladder PCB
TOPSTACKUP
BOTTOMKapton
Board material: 25 µm kaptonConductor: 20 µm copperSolder mask: NoneSilk screen: NoneFinal thickness: TBD – 150 µm?Finish: ENIG gold plate
All low mass ladder PCBs are the same designPrototypes will be copper conductorProduction will be Aluminum conductor
14IPHC meeting – May 7, 2012L. Greiner
STAR HFTOuter Ladder Driver PCB
TOPSTACKUP
BOTTOM
INNER 1
INNER 2FR-4
PREPREG
FR-4Board material: FR-4Conductor: 1 oz. copperSolder mask: both sidesSilk screen: TOP onlyFinal thickness: 0.5 mmFinish: ENIG gold plate
15IPHC meeting – May 7, 2012L. Greiner
STAR HFTInner Ladder Driver PCB
This is a composite PCB consisting of a kapton flex PCB with FR-4 PCB additions at each end.
Connector End
Driver End
16IPHC meeting – May 7, 2012L. Greiner
STAR HFTInner Ladder Driver PCBKapton TOP/BOTTOM
TOP
SECTION A-B STACKUP
BOTTOMKapton
SECTION A-BA B
Board material: TOP/Bottom – 25 µm kaptonConductor: 1 oz. copperSolder mask: both sidesSilk screen: TOP onlyFinal thickness: TBD – 150 um?Finish: ENIG gold plate
17IPHC meeting – May 7, 2012L. Greiner
STAR HFTInner Ladder Driver PCB
Connector End
Board material: TOP/Bottom – kaptonInner1/Inner2 - FR-4
Conductor: 1 oz. copperSolder mask: both sidesSilk screen: TOP onlyFinal thickness: 0.5 mmFinish: ENIG gold plate
TOPSTACKUP
BOTTOM
INNER 1
INNER 2FR-4
PREPREG
Kapton
18IPHC meeting – May 7, 2012L. Greiner
STAR HFTInner Ladder Driver PCBDriver End
TOPSTACKUP
BOTTOM
INNER 1
INNER 2FR-4
PREPREG
Kapton
Board material: TOP/Bottom – kaptonInner1/Inner2 - FR-4
Conductor: 1 oz. copperSolder mask: both sidesSilk screen: TOP onlyFinal thickness: 0.5 mmFinish: ENIG gold plate
19IPHC meeting – May 7, 2012L. Greiner
STAR HFTQuantities:
We would like to produce a prototype detector with ≥ 3 sectors. Yield arguments suggest that we will need:
40 Low Mass Ladder PCBs35 Outer Ladder Driver PCBs15 Inner Ladder Driver PCBs
In addition, we would like to start the process of building ladders with Aluminum conductor PCBs so we would also like:
10 Low Mass Ladder PCBs with ~25 µm Aluminum conductor
20IPHC meeting – May 7, 2012L. Greiner
STAR HFTProjected completion dates
• Order Ultimate sensors: September 2011• First Ladder cable in FR-4: Oct/Nov 2011• First product probe testing: January 2012• Ultimate probe testing complete: February 2012• PXL RDO ready: April 2012• First prototype sectors: August 2012• Install Prototype detector: January 2013