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KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Lecture IVMetallization
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KUKUM – SHRDC INSEP Training Program 2006
Summary of IC Processes
School of Microelectronic Engineering
KUKUM – SHRDC INSEP Training Program 2006
Two Types of Thin Film
School of Microelectronic Engineering
Dielectric Film (CVD Process) Oxide Nitride Epitaxial silicon
Conducting Film (PVD Process) Aluminum alloy Ti, TiN Silicides Copper (CVD or electroplating) Tungsten (Metal CVD) Polysilicon (LPCVD)
KUKUM – SHRDC INSEP Training Program 2006
Conducting Thin Film Applications
School of Microelectronic Engineering
Front-End-Of-Line (FEOL) Gate and electrodes
Polysilicon Polycide
Back-End-Of-Line (BEOL) Interconnection Silicides Barrier ARC
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Interconnection Al-Cu alloy is commonly used material Deep sub-micron metallization …. Copper
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Interconnection Copper Metalization
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Silicides To reduce contact resistance of metal / semiconductor interface. TiSi2, WSi2 and CoSi2 are commonly used materials Self-aligned-silicide-process (SALICIDE)
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Barrier Layer To prevent aluminum diffusion into silicon (junction-spiking) TiN is widely used barrier material
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Barrier Layer To prevent aluminum diffusion into silicon TiN is widely used barrier material
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
ARC (anti reflective coating) to reduce “notching” during photolithography process.
TiN is widely used material
KUKUM – SHRDC INSEP Training Program 2006
CVD vs PVD
School of Microelectronic Engineering
CVD: Chemical reaction on the surface PVD: No chemical reaction i.e. purely physical
CVD: Better step coverage (50-100%) and gap-fill capability PVD: Poor step coverage (<15%) and gap-fill capability
CVD: Impurities in the film, lower conductivity, hard to deposit alloy. PVD: Purer deposited film, higher conductivity, easy to deposit alloy.
KUKUM – SHRDC INSEP Training Program 2006
Physical Vapor Deposition (PVD) Process
School of Microelectronic Engineering
PVD works by vaporizing the solid materials, either by heating or by sputtering, and recondensing the vapor on the substrate to form the solid thin film.
KUKUM – SHRDC INSEP Training Program 2006
Physical Vapor Deposition (PVD) Process
School of Microelectronic Engineering
Evaporation Thermal Evaporation Electron Beam Evaporation
Sputtering Simple DC Sputtering DC Magnetron Sputtering DC Triode RF Diode RF Triode RF / DC magnetron
KUKUM – SHRDC INSEP Training Program 2006
Thermal Evaporation
School of Microelectronic Engineering
In the early years of IC manufacturing, thermal evaporation was widely used for aluminum deposition.
Aluminum is relatively easy to vaporized due to low melting point (660 C).
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
System needs to be under high vacuum (~ 10-6 Torr)
Flowing large electric current through aluminum charge heats it up by resistive heating.
Aluminum starts to vaporized
When aluminum vapor reaches the wafer surface, it recondenses and forms a thin aluminum film.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
The deposition rate is mainly related to the heating power, which controlled by the electric current.
The higher the current, the higher the deposition rate.
A significant trace amount of sodium, low deposition rate and poor step coverage.
Difficult to precisely control the proper proportions for the alloy films such as Al:Si, Al:Cu and Al:Cu:Si.
No longer used for metalization processes in VLSI and ULSI
KUKUM – SHRDC INSEP Training Program 2006
Electron Beam Evaporation
School of Microelectronic Engineering
A beam of electrons, typically with the energy about 10 keV and current up to several amperes, is directed at the metal in a water-cooled crucible in vacuum chamber.
This process heats the metal to the evaporation temperature.
IR lamp is used to heat the wafer (improve step coverage)
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Better step coverage (higher surface mobility due to lamp heating)
Less sodium contamination (only part of aluminum charge is vaporized.
Cannot match the quality of sputtering deposition, therefore very rarely used in advanced semiconductor fab.
KUKUM – SHRDC INSEP Training Program 2006
Sputtering
School of Microelectronic Engineering
The most commonly used PVD process for metallization
Involves energetic ion bombardment, which physically dislodge atoms or molecules from the solid metal surface, and redeposit them on the substrate as thin metal film.
Argon is normally used as sputtering atom
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
When power is applied between two electrodes under low pressure, a free electron is accelerated by the electric field.
When it collides with Ar, another free electron is generated (ionization collision). Ar becomes positively charged.
The free electron repeat this process to generate more free electrons.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
The positively charged Ar ions are accelerated toward a negatively biased cathode, usually called target. The target plate is normally made from the same metal that to be deposited on wafer.
When these energetic argon ions hit the target surface, atoms of the target material are physically removed from the surface by the momentum transfer of the impacting ions.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Sputtered-off atoms leave the target and travel inside the vacuum chamber in the form of metal vapor.
Eventually, some of them reach the wafer surface, adsorb and become so-called adatoms.
The adatoms migrate on the surface until they found nucleation sites and rest there.
Other adatoms recondense around the nucleation sites to form grain.
When the grains grow and meet with other grains, they form a continuous poly-crystalline metal thin film on the wafer surface.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
The border between grains is called a grain boundary.
The grain boundary can scatter electron flows, therefore cause higher resistivity.
Grain size mainly determined by surface mobility, which is related to many other factors.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Normally, higher temperature will result in larger grain size.
Grain size has a strong effect on film reflectivity and sheet resistance.
Film with larger grain size has less grain boundary to scatter electron flow, therefore lower resistivity.
KUKUM – SHRDC INSEP Training Program 2006
Simple DC Sputtering
School of Microelectronic Engineering
The simplest sputtering system.
Wafer is placed on on the grounded electrode and the target is the negatively biased electrode, the cathode.
When a high-power DC voltage (several hundred volts) is applied, the argon atoms are ionized by electric field.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
These accelerate and bombard the target, then sputtered-off the target material from the surface.
KUKUM – SHRDC INSEP Training Program 2006
DC Magnetron Sputtering
School of Microelectronic Engineering
The most popular method for PVD metallization process, because it can achieve high deposition rate, good film uniformity, high film quality, and easy process control.
High deposition rate allow single-wafer processing, which has several advantages over batch-processing.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
A rotating magnet is placed on top of metal target.
In a magnetic field, electrons will be constrained near magnetic field line.
This gives electrons more chances for ionization collision.
Therefore, the magnetic field serves to increase plasma density and cause more sputtering near the magnet.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
By adjusting the location of magnets, the uniformity of the deposited film can be optimized.
Normally, a shield is installed inside the chamber to protect the chamber wall from being deposited.
KUKUM – SHRDC INSEP Training Program 2006
Sputtering System
School of Microelectronic Engineering
GENERATOR RACK
PUMP FRAME
CRYOPUMPCOMPRESSOR
HEAT EXCHANGER
TRNSFORMER/MAIN ACBOX
SYSTEMCONTROLLER/ SYSTEMAC BOX
MAINFRAME
LOAD LOCK
ORIENT / DEGAS
COOL DOWNPRE CLEAN
SPUTTERCHAMBER
Cluster tool with multiple chamber. Staged vacuum;
Loading station: 10-6 Torr Transfer chamber: 10-7 to 10-8 Torr Process chamber: 10-9 Torr
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
APPLIED MATERIALS, ENDURA HPPVD SYSTEM
KUKUM – SHRDC INSEP Training Program 2006
Basic Metallization Process
School of Microelectronic Engineering
Burn-in Step To condition the target before processing production wafers. Native oxide and defects on the target were removed.
De-gas (Orient/Degas Chamber) To orient the wafer. Heat the wafer to drive-out gases and moiture. Prevent out-gassing during the deposition process
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Pre-Clean (Pre-clean Chamber) Sputtering etch to remove native oxide on the metal surface. Prepare contact holes and vias for metal deposition.
KUKUM – SHRDC INSEP Training Program 2006
Titanium Deposition Process
School of Microelectronic Engineering
Normally deposited as welding layer prior to aluminum alloy deposition (reduce contact resistance)
Titanium can trap oxygen and prevent it from bonding with aluminum to form high reistivity aluminum oxide.
To produce larger grain size, wafer is normally heated to 350 C.
Collimated chamber is normally used in deep submicron IC fabrication to achieve better titanium step coverage.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Collimator allows metal atoms to move in mainly in vertical direction
Significantly improve bottom step coverage
KUKUM – SHRDC INSEP Training Program 2006
Titanium Nitride Deposition Process
School of Microelectronic Engineering
TiN is widely used as ARC, glue and barrier layers.
The deposition normally uses a reactive sputtering process.
When nitrogen flows with argon into the process chamber, some nitrogen molecules dissociate as a result of ionization collision.
Free nitrogen radicals are very reactive. They can react with sputtered Ti atoms to form TiN and deposit it on the wafer surface.
They can also react with Ti target to form a thin TiN layer on the target surface.
Argon bombardment could dislodge TiN from the target surface, redeposited on the wafer surface.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
KUKUM – SHRDC INSEP Training Program 2006
Al-Cu alloy Deposition Process
School of Microelectronic Engineering
Needs an ultrahigh baseline vacuum to achieve low film resistivity.
Standard process Depositing aluminum alloy over tungsten plug, after Ti and TiN wetting layer. Normally deposited at 200 C, to achieve smaller grain size for better line patterned etch.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Hot Aluminum Process To allow aluminum to fill contact holes and vias, instead of W-plug This will reduce the contact resistance between metal layers.
Aluminum: 2.9 to 3.3 Ω.cm Tungsten: 2.9 to 3.3 Ω.cm
Aluminum is deposited at 450 to 500 C.
KUKUM – SHRDC INSEP Training Program 2006
Metal Thin Film Measurement
School of Microelectronic Engineering
Thickness Measurement
Reflectivity
Sheet Resistance
Deposition Rate
Film Stress
Process Uniformity
KUKUM – SHRDC INSEP Training Program 2006
Thickness Measurement
School of Microelectronic Engineering
Metal films such as aluminum, Ti, TiN and copper are opaque films; therefore, optical-based technique such as reflectospectrometry cannot be used.
A destructive process is normally required to precisely measure the actual film thickness.
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Step height measurement (profilometer) SEM / TEM Four point probe – indirect measurement
KUKUM – SHRDC INSEP Training Program 2006
School of Microelectronic Engineering
Accoustic Measurement Laser shot on thin film surface Photo-detector measures reflected intensity Thermal expansion causes a sound wave Propagates and reflects at interface of different materials Accoustic wave echoes back and forth Film thickness can be calculated by;
d = Vs ∆t / 2
Vs – speed of sound∆t - time between reflectivity peaks
KUKUM – SHRDC INSEP Training Program 2006
Reflectivity
School of Microelectronic Engineering
Reflectivity change indicates a process drift.
A function of film grain size and surface smoothness
Larger grain size, lower reflectivity
Can be measured using Reflectometry (intensity of the reflected beam of light).
Reflectivity measurement results usually use the relative value to silicon.
KUKUM – SHRDC INSEP Training Program 2006
Sheet Resistance Measurement
School of Microelectronic Engineering
Most important characteristics of conducting film.
Widely used to rapidly monitor the deposition process uniformity by indirectly measure the film thickness.
Four Point Probe is commonly used measurement tool
KUKUM – SHRDC INSEP Training Program 2006
Deposition Rate
School of Microelectronic Engineering
KUKUM – SHRDC INSEP Training Program 2006
Film Stress Measurement
School of Microelectronic Engineering
Stress is due to the mismatch between different materials Compressive stress causes hillock, short between metal Tensile stress causes crack, metal open, peel off Two types of measurement
Contact – profilometer Non-contact – capacitance measurement
KUKUM – SHRDC INSEP Training Program 2006
Process Uniformity
School of Microelectronic Engineering
Max-min uniformity
(Max value – Min value) / 2 x average