Joint Meeting of ASP-DAC SC

ASP-DAC 2014 OC

Jan. 23, 2014

Singapore

Agenda1. Opening (Yasuura, SC Chair) 18:30-18:35

2. Introduction 18:35-18:40

3. Bylaws update 18:40-18:45

4. ASP-DAC 2014 report (Ha and Ishiura) 18:45-19:00

5. ASP-DAC 2015 report (Uchiyama and Chang) 19:00-19:10

6. ASP-DAC 2016 report (Martins) 19:10-19:15

7. SC reports (Yasuura) 19:15-19:20

8. Sister conference reports 19:20-19:30

DAC, ICCAD, and DATE

9. Other business issues 19:30-19:35

10. Adjurn 19:35

1

Bylaws updates

• CEDA joins ASP-DAC as a regular sponsor.• Section 2-4. Voting:

– One voting right from IEEE and one voting right from ACM.

• Section 6. Sponsorships:– The conference shall be sponsored by IEEE and ACM.

• IEEE consists of Circuits and Systems Society (IEEE CASS) and Council on Electronic Design Automation (IEEE CEDA).

• ACM consists of Special Interest Group on Design Automation (ACM SIGDA).

• The OC may add other local organizations, if necessary, under the following principle ...

• IEEE (CASS+CEDA) and ACM (SIGDA) always have the equal sponsorship ratio.

2

ASP-DAC 2014Report

Yong Lian and Yajun Ha

General Co-Chairs

Date: January 20-23, 2014

Place: Suntec, Singapore

ASP-DAC 2014

Date: 20 Jan (Monday)- 23 Jan (Thursday)

Venue: Suntec Convention & Exhibition Centre

Banquet: Flower Field Hall, Gardens by the Bay

History: 19th event of the ASP-DAC series ASP-DAC 2013 in Yokohama, Japan

ASP-DAC 2012 in Sydney, Australia

3

Session Organization

Regular Sessions 4 parallel breakouts 26 Sessions

Special Sessions Invited Talks 9 Sessions

University LSI Design Contest Short Talks & Poster Exhibition 1 Session

Tutorials (8 three-hour tutorials) 4 system-level and 4 physical-level tutorials Each participant can choose 1 system-level and 1

physical level tutorial to attend

Attendees in 2014as of 23 Jan, 2014

Total Number: 282

Strong attendance from academiaAcademia: 252 (including 53 students)

Industries: 30

International participation (26 countries/regions)

Singapore: 31

Overseas: 251ASP 156

NA 51

EU 41

Mid-East 3

4

Attendees as of Jan. 23, 2014

* Designers’ Forum Only(16) and Tutorial Only(N/A) are not included.** workshop attendees are just estimate

2008 2009 2010 2011 2012 2013 2014Host Country 185 304 117 280 36 286 31

ASP(except host country)

146 105 155 128 151 100 147

NA 59 64 66 61 48 41 51EU 22 18 29 22 24 30 41Sub-Total 412* 490 367 491 259 462 270

Tutorial Only -- 39 162 32 42 14 12

Total -- 531 529 523 301 476 282

Attendees – Tutorial(2008~2014)Thanks to student group rate policy and new

change of format, tutorials come back to a reasonable level of attendees

Special rate for student group4 or more students as a group

Change of format3-hour, 4 parallel tutorials each half day

Options to select 2 out of 8 topics

2008 2009 2010 2011 2012 2013 2014

#Registrants 126 113 216 111 42 106 65

5

Delegate Summary

Country Number of Delegates

1 Japan 53

2 USA, Canada 50 (46, 4)

3 Hongkong/China 46

4 Europe 41

5 Singapore 31

6 Taiwan 27

7 Korea 16

8 India 5

9 Australia 6

10 Israel, Jordan, Malaysia, Kuwait, US Minor Islands

5 (1 each)

Total 282 (263 paid)

Tutorial Delegates

Tutorial Instructor

#PD1 Prof. Massoud Pedram 12

#PD2Prof. Tsung-Yi Ho and Prof. Krishnendu Chakrabarty

16

#PD3 Prof. Fadi Kurdahi and Prof. Ahmed Eltawil 12

#PD4 Prof. Sheldon Tan and Prof. Hai Wang 22

#SD1 Prof. Wolfgang Mueller and Prof. Gunar Schirner 10

#SD2 Mr. Alex Goryachev and Mr. Ronny Morad 15

#SD3 Prof. Rolf Drechsler and Dr. Rainer Findenig 8

#SD4 Prof. Zhiru Zhang and Prof. Deming Chen 17

6

Keynote Addresses“Title: All Programmable SOC FPGA for Networking and Computing in Big Data Infrastructure”Ivo Bolsens

Senior VP and CTO, Xilinx, USA

“Designing Analog Functions without Analog Transistors”Georges Gielen

Professor, Katholieke Universiteit Leuven, Belgium

“Beyond Charge-based Computing”Kaushik Roy

Professor, Purdue University, USA

I.

II.

III.

IV.

“The Art of Innovation - How Singapore Will Continue to Drive the Progress in Semiconductor Technologies”Ulf Schneider

Managing Director, Lantiq Asia PacificPresident, SSIA, Singapore

University LSI Design Contest

10 excellent designs are accepted out of 19 submissions from five countries/areas

Best Design Award A Dual-loop Injection-locked PLL with All-digital Background

Calibration System for On-chip Clock Generation

Wei Deng, Ahmed Musa, Teerachot Siriburanon,

Masaya Miyahara, Kenichi Okada, Akira Matsuzawa

(Tokyo Institute of Technology, Japan)

Special Feature Award A Single-Inductor 8-Channel Output DC-DC Boost Converter with

Time-limited Power Distribution Control and Single Shared Hysteresis Comparator

Jungmoon Kim, Chulwoo Kim (Korea Univ., Republic of Korea)

7

University LSI Design Contest - Impression

Accepted papers quality are high with good oral presentation

Wide coverage on different area:5 RF+3 Analog+2 Digital

Submissions to this year’s ASP-DAC are from 5 countries/areas in Asia: Japan, Korea, China, Singapore, India.

UDC at ASP-DAC is established as a high-level design contest for Asian universities.

Financial Support

Singapore Tourist Board to support 10 conference and 11 tutorial registrations for students.

IEEE CEDA to support the lunch boxes for University Design Contest

8

Supporter’s exhibition

2 companies (Silicon Clound and Toshiba) joined

Exhibitors showed interesting exhibitions and demos

Many people visited their booths and exhibitions are successful

9

ASP-DAC 2014 Publication Report

Chong Kwen Siong Singapore

1

Outline

Publication Issues: with IEEE Authors’ Kit

Final Manuscripts and Copyrights

Final Program Proceedings

Prohibited Authors List Check

2

General Information

Advance Program

Materials We Have

10

3

GGeneral Information

The Publication Chair is required to work together with all parties, especially GC, TPC, Prof Taoka, Conference Secretariat and IEEE.

The Publication Chair is required to understand the general conference publication flow and to specify some deadlines (as advised/agreed by GC and TPC)

PPublication Issues: with IEEE No Items Remarks

1 Conference Publication Form (CPF)1 & Letter of Acquisition (LOA)

CPF submitted on 2 Sep CPF approved on 15 Sep LOA received on 20 Sep

Advice: Start earlier; decide the proceedings format

2 PDF eXpress Registration1

Registration submitted on 2 Sep Registration approved on 15 Sep

Advice: Should be available when Final Submission starts until the end of the conference; register earlier

3 E-Copyright Form Registration2,3,4

Registration submitted on 18 Sep Registration approved on 20 Sep

Advice: require IT setup; should be available when Final Submission starts

1 Website: http://www.ieee.org/conferences_events/conferences/organizers/conf_app.html?appName=Publication 2 Website: http://ecopyright.ieee.org/registration/ 3 Website: https://ecopyright.ieee.org/copyrights/registration.jsp 4 Website: https://ecopyright.ieee.org/copyrights/login.jsp 4

11

AAuthor’s Kit No Items Remarks

1 Initial submission guide (templates were largely based on the 2013 templates)

Initial submission guide/templates (in latex, doc and pdf) in May

2 Final submission guide (templates were largely based on the 2013 templates)

Final submission guide/templates (in latex, doc and pdf) available on 6 Sep Website information updated before 6 Sep All website information completed by 15 Oct

Advice: Make Conference Registration website, Paper Submission website, IEEE PDF eXpress check website, and e-Copyright Form website to be available as early as possible

3 Instructions for Authors/Presenters

Available in December (Arranged by Tulika; room arrangement/presentation info required)

5

PProhibited Authors List (PAL) Check

No Items Remarks

1 General Information

Checking completed using the list from the IEEE Intellectual Property Rights (IPR) Office (updated on Aug 2013)

Advice: register with IEEE IPR Office to get the PAL list

6

12

AAdvance Program No Items Remarks

1 General Information

First version available on 15 Oct Many revisions/updates thereafter

Advice: aim to be available before registration starts

2 Preliminary Technical Program

Update of Authors latest by 4 Oct – not critical Keynote information, Special Sessions, Regular papers, UDC papers, Tutorials – from TPC, tutorial chair, UDC chairs & Taoko’s system

Advice: Take special attention on Special Sessions as such information could be delayed by authors

3 Registration Information

Price/Discount/Deadline – from Registration chair/Conference co-chairs

4 Conference and Singapore Information

Hotel booking forms Banquet information Singapore transport/general info

7

FFinal Manuscript and Copyrights No Items Remarks

1 Manuscripts Only 2/3 manuscripts submitted by the first deadline (11 Nov) All draft/final papers (save one paper cancelled by TPC) submitted by the second deadline (18 Nov) Many requests for further update of manuscripts thereafter All manuscripts (no changes allowed) received on 3 Jan UDC/Regular papers: update of title/author list required approval from TPC/UDC chair Invited papers: update of the title/author list was allowed Update of database was strictly done by TPC Edit of the manuscripts was handled by Prof Taoka

Advice: Check inconsistencies between the database and manuscripts

2 Copyright forms

Hard-copy (signed) and e-copy forms were accepted/received Check types of copyright notices (e.g. U.S. Government, Crown Government and General)

Note: Many inconsistencies between the manuscripts/copyright forms (but were acceptable – informed by IEEE Copyright Office) 8

13

PProceedings No Items Remarks

1 General Information

USB format (recommended) Followed requirements mentioned in the IEEE LOA First version completed: 6 Jan USB copies: 330 pieces available on 6 Jan All data transferred into USBs: 9 Jan

2 Further Details

Using Taoka’s system Manuscripts all available (on 3 Jan) Messages/other information available (on 6 Jan)

Advice: The progress will much be depending on the available of the final manuscripts and award lists

3 Liaison with the IEEE

Deadline: 22 Feb 2014 No show papers/no presentation papers– need inputs from TPC

9

FFinal Program No Items Remarks

1 General Information

A4-size booklet; prefect binding; colour – cover; Black & white – other contents First version available: 6 Jan Sample available: 9 Jan Printing production: 10 Jan (printing); 16 Jan (available) Printing company: CMYK Digital Hub Pte Ltd suggested by Conference Secretariat Number of copy: 280

2 Further details

Using Taoka’s system General messages received by early Dec; but all were finalized on 6 Jan PDF version could be uploaded into the web after the conference

Advice: The progress will much depending on the available of the final manuscripts, award lists and exhibitors’ information 10

14

MMaterials We Have

No Items Remarks/Notes

1 Author’s kit Initial templates (.tex, .doc, .pdf) Final templates (.tex, .doc, .pdf) Presentation guide (.pptx, .pdf)

2 Advance Program

.doc version

3 Final Program .doc version Need to combine with two pdf files generated by Prof Taoka

4 Proceedings Downloadable from Taoka’s system

11

15

ASP-DAC 2014SC/OC Joint Meeting

January 23, 2014Suntec, Singapore

ASP-DAC 2014 TPC Report

ASP-DAC 2014 TPC HQ

TPC Vice ChairNaehyuck Chang

Seoul National Univ.

TPC Vice ChairTulika Mitra

National Univ. of Singapore

TPC ChairNagisa IshiuraKwansei Gakuin Univ.

16

ASP-DAC 2014 TPC HQ

TPC SecretaryYasuhiro Takashima

Univ. of Kitakyushu

TPC SecretaryHyung Gyu Lee

Daegu Univ.

TPC SecretaryShigeru Yamashita

Ritsumeikan Univ.

Topics/Subcommittee

1 System-Level Modeling and Simulation/Verification

2 System-Level Synthesis and Optimization

3 System-Level Memory/Communication Design and Networks on Chip

4 Embedded and Real-Time Systems

5 High-Level/Behavioral/Logic Synthesis and Optimization

6 Validation and Verification for Behavioral/Logic Design

7a Physical Design (Placement)

7b Physical Design (Routing)

8 Timing, Power, Thermal Analysis and Optimization

9 Signal/Power Integrity, Interconnect/Device/Circuit Modeling and Simulation

10 Design for Manufacturability/Yield and Statistical Design

11 Test and Design for Testability

12 Analog, RF and Mixed Signal Design and CAD

13a EDA and Design Methodologies for Emerging Technologies

13b Emerging Applications

split

split

17

Paper submission

2-stage submissionRegistration (July 10) PDF modification (July 17)

Deadlines were enforced very strictly To ensure fairness, we declined all post-deadline

submission/PDF modification requests

Registration (July 10) 419↓ auto-reject, withdraw

Confirmed & reviewed 343

Paper submission

161

269235

291

692

424 408350 355 340

300 287 311343

0

100

200

300

400

500

600

700

800

'01 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14

Japan

Japan

JapanJapan/Taiwan

Taiwan/Japan

IndiaJapan

China

Japan

Korea Japan/KoreaAustralia/

Taiwan

Japan/China

Singapore/Japan

18

Paper submission

country ’14 ’13 ’12 ’11 ’10 ’09 ’08 ’07 ’06 ’05 ‘04

USA 96 71 75 73 109 105 92 129 155 205 95

China 54 39 45 39 41 43 67 61 57 214 36

Taiwan 32 52 37 44 52 54 34 40 42 43 32

Japan 26 24 24 31 33 50 31 44 52 45 36

India 21 8 11 13 13 21 25 19 15 15 9

Germany 19 19 14 ? ? ? ? ? ? ? ?

Singapore 18 11 ? ? ? ? ? ? ? ? ?

Hong Kong 11 12 10 ? ? ? ? ? ? ? ?

Korea 10 12 12 11 16 9 33 23 21 30 18

Iran 10 6 4 11 9 13 ? 21 12 16 ?

Others 46 55 39 60 53 54 11 53 47 98 38

Total 343 311 287 300 340 355 350 408 424 692 291

Paper submissiontopics (subcommittee) sub rev

1 System-Level Modeling and Simulation/Verification 21 242 System-Level Synthesis and Optimization 23 273 System-Level Memory/Communication Design and Networks on Chip 28 364 Embedded and Real-Time Systems 41 365 High-Level/Behavioral/Logic Synthesis and Optimization 21 266 Validation and Verification for Behavioral/Logic Design 15 137a Physical Design (Placement) 7 127b Physical Design (Routing) 13 168 Timing, Power, Thermal Analysis and Optimization 42 279 Signal/Power Integrity, Interconnect/Device/Circuit Modeling and Simulation 10 1610 Design for Manufacturability/Yield and Statistical Design 37 2511 Test and Design for Testability 14 1512 Analog, RF and Mixed Signal Design and CAD 16 1613a EDA and Design Methodologies for Emerging Technologies 44 2613b Emerging Applications 32 28

total 343

after “reshuffling”

19

TPC memberssubcommittee members

1 System-Level Modeling and Simulation/Verification 72 System-Level Synthesis and Optimization 83 System-Level Memory/Communication Design and Networks on Chip 114 Embedded and Real-Time Systems 115 High-Level/Behavioral/Logic Synthesis and Optimization 76 Validation and Verification for Behavioral/Logic Design 47a Physical Design (Placement) 57b Physical Design (Routing) 58 Timing, Power, Thermal Analysis and Optimization 89 Signal/Power Integrity, Interconnect/Device/Circuit Modeling and Simulation 610 Design for Manufacturability/Yield and Statistical Design 711 Test and Design for Testability 612 Analog, RF and Mixed Signal Design and CAD 513a EDA and Design Methodologies for Emerging Technologies 713b Emerging Applications 7

total 104

TPC members

country membersJapan 23U. S. A. 22China 17Taiwan 16Korea 8Germany 5Hong Kong 4Singapore 2Australia, Finland, France, Sweden, Switzerland 1×5

India, Australia 1×2Canada 1

total 104

20

TPC meeting

■Monday, September 2, 2013■Kyoto Research Park, Japan

9:00-9:30 Opening9:30-15:00

(12:00-13:00)

- Paper selection- Session organization- Best Paper Award nominationLunch

15:30-17:30 EDA Workshop19:00- Dinner

TPC meeting

■90/104 members attended physically1 attended via Skype

■Paper selection was very smoothMost of the subcommittees finished their

work by 3:00pm

23 presentations at EDA Workshop

21

TPC meeting dinner

19:00-21:00Sanjaku-Sanzun-Bashi(10F, Isetan, JR Kyoto Station)

Paper selection

Submitted 343↓ paper selection

Accepted 108 (31.5%)

22

Accepted papers

country #accU.S.A. 35 32.4%China 18 16.7%Germany 8 7.4%Japan 8 7.4%Taiwan 8 7.4%Hong Kong 4 3.7%India 4 3.7%Singapore 4 3.7%

country #accItaly 3Sweden 3Switzerland 3Canada 2France 2Korea 2Australia 1Finland 1Greece 1Iran 1

Accepted papers

country #acc

#sub acc ratio

U.S.A. 35 96 36.5%China 18 54 33.3%Germany 8 19 42.1%Japan 8 26 30.8%Taiwan 8 32 25.0%Hong Kong 4 11 36.4%India 4 21 19.0%Singapore 4 18 22.2%

23

Accepted papers

topics (subcommittee) sub acc ratio1 System-Level Modeling and Simulation/Verification 24 7 29.2%2 System-Level Synthesis and Optimization 27 7 25.9%3 System-Level Memory/Communication Design and Networks on Chip 36 10 27.8%4 Embedded and Real-Time Systems 36 10 27.8%5 High-Level/Behavioral/Logic Synthesis and Optimization 26 8 30.8%6 Validation and Verification for Behavioral/Logic Design 13 5 38.5%7a Physical Design (Placement) 12 4 33.3%7b Physical Design (Routing) 16 5 31.3%8 Timing, Power, Thermal Analysis and Optimization 27 9 33.3%9 Signal/Power Integrity, Interconnect/Device/Circuit Modeling and Simulation 16 7 43.8%10 Design for Manufacturability/Yield and Statistical Design 25 7 28.0%11 Test and Design for Testability 15 5 33.3%12 Analog, RF and Mixed Signal Design and CAD 16 7 43.8%13a EDA and Design Methodologies for Emerging Technologies 26 8 30.8%13b Emerging Applications 28 9 32.1%

total 343 31.5%

Double/parallel submissions

■2 papers (ICCD 2013)July 23: ICCD notification (rejected)July 17: ASP-DAC submission→ REJECTED

■1 paper (TCAD)→ REJECTEDWe should explicitly prohibit journal vs

ASP-DAC double/parallel submission in CFP

24

Notification

■Schedule was carefully planned

Sept 2 TPC MeetingSept 3 List of accepted papers posted

on webSept 11 Notification with commentsSept 13 DATE 2014 submission deadline

Sept 9

Notification was done two days ahead of the schedule

Special sessions

■Proposal basis■Received 11 proposals9 were adopted1 was rejected1 was accepted as a tutorial

25

Program organization

0pening

Keynote

S1A1

UDC B1 C1

lunch

S2 A2 B2 C2

S3 A3 B3 C3

Keynote

S4 A4 B4 C5

lunch

S5 A5 B5 C5

S6 A6 B6 C6

Banquet Keynote

Keynote

S7 A7 B7 C7

lunch

S8 A8 B8 C8

S9 A9 B9 C9

Day 1 (Jan 20) Day 2 (Jan 21) Day 3 (Jan 22)

5 papers

Special sessions

(1S) “Normally-Off Computing: Towards Zero Stand-by Power Management”Hiroshi Nakamura (Univ. of Tokyo, Japan)

(2S) “EDA for Energy”Fadi Kurdahi (UC Irvine, U.S.A.), Sani Nassif (IBM, U.S.A.), Mohammad Al Faruque (UC Irvine, U.S.A.)

(3S) “Neuron Inspired Computing using Nanotechnology”Kevin Cao, Sarma Vrudhula (Arizona State Univ., U.S.A.)

(4S) “Design Automation Methods for Highly-Complex Multimedia Systems”Sri Parameswaran (Univ. of New South Wales, Australia)

(5S) “Billion Chips of Trillion Transistors”Chen-Yong Cher (IBM, U.S.A.)

26

Special sessions (cont’d)

(6S) “Overcoming Major Silicon Bottlenecks: Variability, Reliability, Validation, and Debug”Subhasish Mitra (Stanford Univ., U.S.A.)

(7S) “Brain Like Computing: Modelling, Technology, and Architecture”Ahmed Hemani (KTH, Sweden)

(8S) “Design Flow for Integrated Circuits using Magnetic Tunnel Junction Switched by Spin Orbit Torque”Mehdi Tahoori (Karlsruhe Inst. of Tech., Germany)

(9S) “The Role of Photons in Harming or Increasing Security”Francesco Regazzoni (Univ. of Lugano, Switzerland), EdorardoCharbon (Delft Univ. of Tech., Netherlands)

Best Paper Award

13 candidates were nominated at TPC meeting Through 2 rounds of reviews by Award Selection

Committee, one winner has been selectedAward Selection Committee

Yoshi WadanabePaolo IenneChung-Ta KingJian-Jia ChenDeming ChenMiroslav VelevHung-Ming ChenWen-Hao Liu

Masanori HashimotoLuca DanielHai ZhouTomokazu YonedaSheldon TanIk Joon Chang/Yongpan LiuJongsun Park

change afterthe 1st review

27

Best Paper Award

(2B-1) Flexible Packed Stencil Design with Multiple Shaping Apertures for E-Beam Lithography

Chris Chu (Iowa State Univ., U.S.A.)

Wai-Kei Mak (National Tsing Hua Univ., Taiwan)

10-Year Retrospective Most Influential Paper Award Sponsored by IEEE CEDA 4 most cited papers from ASP-DAC 2004 were

nominated as candidates One winner has been selectedAward Selection Committee (same as Best Paper Award)

Yoshi WadanabePaolo IenneChung-Ta KingJian-Jia ChenDeming ChenMiroslav VelevHung-Ming ChenWen-Hao Liu

Masanori HashimotoLuca DanielHai ZhouTomokazu YonedaSheldon TanIk Joon Chang/Yongpan LiuJongsun Park

CoIs

CoIs

28

Candidates(1D-1) “Register Binding and Port Assignment for Multiplexer

Optimization”Deming Chen, Jason Cong

(1E-1) “TranGen: A SAT-Based ATPG for Path-Oriented Transition Faults”

Kai Yang, Kwang-Ting Cheng, Li-C. Wang(2E-2) “Design Diagnosis Using Boolean Satisfiability”

Alexander Smith, Andreas Veneris, Anastasios Viglas(3D-1) “Efficient Translation of Boolean Formulas to CNF in

Formal Verification of Microprocessors”Miroslav N. Velev

10-Year Retrospective Most Influential Paper Award

(2E-2) Design Diagnosis Using Boolean Satisfiability

Alexander Smith, Andreas Veneris, Anastasios Viglas

(Univ. of Toronto, Canada)

10-Year Retrospective Most Influential Paper Award

29

Subcommittee chairs’ meeting

“Topics of ASP-DAC are conservative...”→ Newly held “subcommittee chairs’

meeting” (Jan 22) to discuss: Next year’s CFP Various TPC policies

No show/no author presentation

<1st day and 2nd day>■No show: 0■No author presentation: 1

30

TPC Summary

There were minor troubles, of course, but almost everything has been smooth and efficient this year

Thank you!

31

ASP-DAC 2015 OC Report

Kunio Uchiyama Hitachi Ltd.

ASP-DAC SC-OC meeting 2014/1/23

Chairs • Chairs – General Chair: Kunio Uchiyama(Hitachi Ltd., Japan) – TPC Chair: Naehyuck Chang (Seoul National Univ.,

Korea) – Secretary: M. Yamaoka (Hitachi) , K. Shimamura

(Hitachi), Y. Uematsu (Hitachi), Y. Sakurai (Hitachi), K. Seto (Tokyo City U.), N. Togawa (Waseda U.)

– Secretariat: JESA

http://www.aspdac.com/aspdac2015/

32

Date and Place • Date

– January 19(Mon) – 22(Thu), 2015 • Place

– Makuhari Messe, Chiba, Japan (http://www.m-messe.co.jp/en/index.html)

From Tokyo 23-29 min. (train) From Narita 30min. (bus) From Haneda 40min. (bus)

Conference

Exhibition

Park

Stadium Disney Land

Makuhari Messe

33

Organizing Committee

• Tutorial: – M. Ikeda(U.Tokyo), T. Isshiki(Tokyo I. T.)

• Design Contest: – H. Ito(Tokyo I. T.), N. Miura (Kobe U.)

• Designers’ Forum: – Y. Masubuchi(Toshiba), K. Inoue(Kyushu U.)

• Finance: – T. Matsumoto(U.Tokyo), A. Takahashi(Tokyo I. T.)

• Publication: – S. Nagayama(Hiroshima City U.), M. Imai(Hirosaki U.)

• Publicity: – H. Tomiyama(Ritsumeikan U.), T. Matsunaga (Kyushu S.

U.), N. Kojima(Toshiba) • Web publicity: Y. Hara (Nara IST), T. Ishihara(Kyoto U.) • Promotion: Y. Nakamura(NEC)

• OC Meetings (Plan)

• 1st 2013/3/11 • 2nd 2013/9/27 • 3rd 2014/1/21 • 4th 2014/3 • 5th 2014/6 • 6th 2014/9 • 7th 2014/12 • 8th 2015/3

Directions

• Maintain continuity • Contribute as a forum for the collaboration

among – EDA researchers/developers – Designers – Application engineers – Manufacturers – Etc.

Registration Packages for Electronic Industries Tutorial Package for Students

34

ASP-DAC 2015 TPC

Naehyuck ChangASP-DAC 2015 Technical Program Chairnaehyuck@elpl.snu.ac.kr

Special Sessions (submission)

ID Title Organizer Talks

1 Normally-Off Computing : Towards Zero Stand-by Power Management Hiroshi Nakamura (Univ. of Tokyo, Japan) 4

2 EDA for Energy Fadi Kurdahi (UC Irvine, USA) 3

3 Neuron Inspired Computing using Nanotechology Kevin Cao, Sarma Vrudhula (Arizona State Univ., USA)4

4 HIGH‐LEVEL SPECIFICATIONS TO COPE WITH DESIGN COMPLEXITY Wolfgang Mueller (Univ.of Paderborn/C‐LAB, Germany) 4

5 A bug's life: prediction, creation, detection and extinction Tali Rabetti (IBM research lab, Israel) 4

6 Design Automation Methods for Highly-Complex Multimedia Systems Sri Parameswaran (Univ. of New South Wales, Australia) 4

7 Design Flow for Integrated Circuits using Magnetic Tunnel Junction Switched by Spin Orbit Torque

Mehdi Tahoori (Karlsruhe Institute of Technology, Germany)4

8 The role of photons in harming or increasing security Francesco Regazzoni, AlaRI (Univ. of Lugano, Switzerland)3

9 Bain Like Computing: Modelling, Technology and Architecture Ahmed Hemani (School of ICT, KTH, Kista, Sweden)4

10 Overcoming Major Silicon Bottlenecks: Variability, Reliability,Validation and Debug

Subhasish Mitra (Stanford Univ., USA)3

11 Billion chips of trillion transistors Chen-Yong Cher (IBM TJ Watson Research Center, USA)3

35

Special Session(Accepted)

Session ID Title Organizer Talks

1SNormally-Off Computing : Towards Zero Stand-by Power Management

Hiroshi Nakamura (Univ. of Tokyo, Japan) 4

2S EDA for Energy Fadi Kurdahi (UC Irvine, USA) 3

3S Neuron Inspired Computing using NanotechologyKevin Cao, Sarma Vrudhula (Arizona State Univ., USA)

3

4SDesign Automation Methods for Highly-Complex Multimedia Systems

Sri Parameswaran (Univ. of New South Wales, Australia)

4

5S Billion chips of trillion transistorsChen-Yong Cher (IBM TJ Watson Research Center, USA)

3

6SOvercoming Major Silicon Bottlenecks: Variability, Reliability,

Validation and DebugSubhasish Mitra (Stanford Univ., USA) 3

7S Bain Like Computing: Modelling, Technology and Architecture Ahmed Hemani (School of ICT, KTH, Kista, Sweden) 4

8SDesign Flow for Integrated Circuits using Magnetic Tunnel Junction Switched by Spin Orbit Torque

Mehdi Tahoori (Karlsruhe Institute of Technology, Germany)

4

9S The role of photons in harming or increasing securityFrancesco Regazzoni, AlaRI (Univ. of Lugano, Switzerland)

3

2015 CFP

•Purpose•Balance the submissions and trend•Match with sister conferences (DAC)•Remove ambiguity to avoid excessive paper migration•Ensure quality review removing diversity in a subcommittee•Promote popular and timely topics

36

2015 CFP

Number of reviewed papers in ASP-DAC 2014 and 2013

2015 CFP

TPC size of the ASP-DAC 2015: 100 TPC size of the ASP-DAC 2015: 104

37

2015 CFP

Topic ID Topic (subcommittee) Name TPC Size

1 System-Level Modeling, Simulation and Verification 7

2 Interconnect/Device/Circuit/Gate Modeling, Simulation and Verification 7

3 System-Level Architecture and Design Methodologies 8

4 Power and Thermal Modeling, Simulation and Optimization/Management 7

5 On-chip and System-level Communication Design, I/O, Networks on Chip, and Memory Systems 7

6 Embedded Systems 10

7 Logic/Behavioral/High-Level Synthesis and Optimization 7

8 Physical Design 8

9 Timing and Signal/Power Integrity Analysis and Verification 8

10 Design for Manufacturability, Yield and Statistical Design 7

11 Test and Design for Testability 4

12 Analog, RF and Mixed Signal Design and CAD 5

13 CAD and Design Methodologies for Emerging Technologies 7

14 CAD for Emerging Applications and Cyber-Physical Systems 8

2015 CFP

• Important deadlines• Deadline for submission: 5 PM JST (UTC+9) July 11 (Friday), 2014• Notification of acceptance: Sep. 15 (Monday), 2014• Deadline for final version: 5 PM JST (UTC+9) Nov. 10 (Monday), 2014

38

Track Chairs’ COI

• Motivation• General understanding on the volunteer positions

• Pure service• No right to abuse the power for their interest

• Getting rid of perception and incidences• Paper assignment• Paper selection• Best paper nomination

• Sister and neighborhood conferences• Track chairs are not allowed to submit the papers in their tracks• Track chairs’ papers are separately handled

• Suggestion on the best paper nomination• Track chairs’ papers are not allowed to be nominated as a best paper

candidate

10-Year Award

• Motivation• Traditional EDA topics have leveraged and positioned the reputation

of major EDA conferences• Higher number of citations• Well formulated problems• Less chances to have harsh reviews• Free from out-of-scope issues

• High-level and new topics are the driving forces of EDA conferences as of today

• Suggestion on the 10-year retrospective best paper nomination• Plan 1: Two awards per year: from-end and back-end• Plan 2: Looking at two-year window horizon, and award front-end

and back-end every other year

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Other Businesses

• Any other business?

40

Asia and South Pacific Design Automation Conference (ASP-DAC) 2016

hosted by

University of Macau & IEEE Macau Joint-Chapter CAS/COM

inMacao, China

ASP-DAC 2016

• General Chair– Rui Martins (University of

Macau)

• Venue– Macao

• University of Macau Hengqin New Campus (tentative - includes Hotel with 100 rooms),

or alternative

• Hotel nearby - Galaxy, Venetian or Sheraton

• Date – 2016 February 1(Mon) - 4(Thu) (tentative)

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New Campus of University of Macau

•Covering an area of 1.0926km2, accommodate 10000 students

From Airport 5-10 min. (taxi)From Ferry Terminal 20min. (taxi)Via Hong Kong 1 hour (ferry)

Venetian Macao

Airport

Conference Venue

University of Macau Hengqin Campus

City of Dreams

Taipa Houses-MuseumGalaxy Macau

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Thank You,Looking forward to seeing you in Macao!!!

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Reports from SC Chair

Jan. 23, 2014

Hiroto Yasuura

SC Chair of ASP-DAC

Discussion Items

• Assignment of GC of 2017

• TPC chair candidate for 2017

• Call for proposal of 2018

• Schedule

• Member updates

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ASP-DAC 2017 venue

• Japan – Keep Japan Outside-Japan rule for several years

– Final Decisions are made at SC meeting in ASP-DAC2014 (Singapore)

• ASP-DAC Bylaw (Section 5. Location of the Conference)The location of the conference shall alternate between Japan and other countries or areas in the Asia South Pacific Region. The location shall be decided by the SC. The SC Chair may call for proposals from the hosting country or area, if necessary. The hosting country or area shall be decided at least three years before the conference.

Year Date City GC

2010 Jan. 18-21 Taipei Y.L.Lin

2011 Jan. 25-28 Yokohama Asada

2012 Jan.30-Feb.2 Sydney Parameswarann

2013 Jan.22-25 Yokohama Kimura

2014 Jan.20-23 Singapore Lian & Ha

2015 Jan.19-22 Makuhari Uchiyama

2016 Feb.1-4 Macao Martins

2017 ??.??-?? Tokyo?

Present Schedule

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Candidate of GC of 2017

TPC Scheme

• Rotations of TPC (members, subcommittee Chairs, Vice Chair, Chair)– Rotation Rule– Subcommittee Chair -> Vice TPC Chair -> TPC Chair

• 3-year term limit for TPC members. 1/2 or more should stay on the next TPC

• Separation of TPC from OC• Clarification of the roles and responsibility for

each member– Vice Chairs and Subcommittee Chairs

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• TPC Chairs of 2015, 2016– Prof. Naehyuck Chang (Seoul National University)– Prof. Ting-Ting Hwang (National Tsing Hua University)–

Rotation Schedule of TPCYear TPC Chair Vice Chair Sub Committee Chair

2011 Shin Yao-Wen Xie

2012 Yao-Wen Xie Ishiura

2013 Xie Ishiura Naehyuck

2014 Ishiura Naehyuck Ting-Ting

2015 Naehyuck Ting-Ting

2016 Ting-Ting

2017

Candidate of TPC Chair of 2017

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ASP-DAC 2018• Call for Proposals

– Call on Web. in March

– Deadline of the first proposals, June 30

– Proposal should be submitted by a group including an SC member.

– Discussions and negotiations

– Final Decisions in ASP-DAC SC meeting in 2015 (Makuhari)

– Excellent but not selected proposal might be pooled as future candidate if a group agrees

Discussion Items

• Assignment of GC of 2017

• TPC candidate for 2017

• Call for proposal of 2018

• Schedule

• Member updates

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ASP-DAC 2014

• General co-Chairs: – Yong Lian (National Univ. Singapore)

– Yajun Ha (National Univ. Singapore)

• Venue:– Suntech International Convention & Exhibition

Center, Singapore

• Date: Jan. 20 (Mon) – 23 (Thu), 2014(Lunar new year: Jan. 31, 2014)

ASP-DAC 2015

• General Chair:– Kunio Uchiyama (Hitachi)

• Venue:– Makuhari, Japan

• Date: Jan.19 (Mon) – 22 (Thu), 2015(Lunar new year: Feb. 19, 2015)

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ASP-DAC 2016

• General Chair:– Rui Martins (University of Macau)

• Venue:– University of Macau Hengqin New Campus

• Date: Feb. 1 (Mon) – 4 (Thu), 2016(Lunar new year: Feb. 8, 2016)

ASP-DAC 2017

• General Chair:– Naofumi Takagi (Kyoto University)

• Venue:– Tokyo area?

• Date: 2017(Lunar new year: Jan. 28, 2017)

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SC Member Updates• Chair

– Hiroto Yasuura (Kyushu Univeristy)

=> Hidetoshi Onodera (Kyoto University)

• Past Chair– Hiroto Yasuura (Kyushu Univeristy)

• Vice Chair– Hidetoshi Onodera (Kyoto University)

=> Shinji Kimura (Waseda Univeristy, GC13)

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51ST Design Automation Conference

DAC 2014 SAN FRANCISCO, CA | JUNE 1-5

General Information

June 2-6, 2014 Moscone Center San Francisco, CA

Exhibit Hours: Monday, June 2: 9:00am-6:00pm Tuesday, June 3: 9:00am-6:00pm Wednesday, June 4: 9:00am-6:00pm

Conference Schedule Sunday, June 1 • Workshops Monday, June 2 • New! General Session/Keynote • Tutorials • IP Track Session • Afternoon Keynote • Evening Reception

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Thursday, June 5 • Morning Keynote • Best Paper Awards • Security Track • Technical Sessions • Panels • Special Sessions • Training Day • Closing Reception

Tuesday, June 3 • Morning Keynote • Technical Sessions • Designer Track • Panels • Special Sessions • Evening Reception Wednesday, June 4 • Morning Keynote • Technical Sessions • Designer Track • Automotive Track • Panels • Special Sessions • Evening Reception

General Information

Committee

◆ General Chair ◆ Soha Hassoun, Tufts Univ.

◆ Vice Chair ◆ Anne Cirkel, Mentor Graphics

◆ Technical Program Co-Chairs ◆ Charles Alpert, Cadence Design Systems, Inc. ◆ Sharon Hu, Univ. of Notre Dame

◆ Automotive Track Co-Chairs ◆ Tony Cooprider, Ford Motor Company ◆ Samarjit Chakraborty, Technical Univ. of

Munich

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Confirmed Keynotes

Monday, June 2 • 9:00-10:00am • Sir Hossein Yassaie,

CEO and President - Imagination Technologies

Monday, June 2 • 3:00-4:00pm • Dr. Cliff Hou, Vice President,

Research and Development - TSMC • Talk: Industry Opportunities in

the Sub-10nm Era

Tuesday, June 3 • 9:00-10:00am • Jim Tung, MathWorks Fellow - MathWorks, Inc. • James Buczkowski, Henry Ford Technical Fellow

- Ford Motor Company • Dual Keynote: Automating the Automobile

Creating Verticals at DAC

◆ Motivation: Need to grow design automation in the embedded system and software space ■ Already >35% of the technical program is in embedded ■ Not seeing traction among attendees and on the exhibit

floor

◆ Create Vertical track to emphasize specific market verticals and integration. Focus in 2014 is on: ■ Automotive (2 days) ■ Security (1 day) ■ IP (1 day) ■ Mobile (1 day)

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Automotive Track

◆ dddThe Automotive Track has been created this year to bring together researchers and practitioners from the automotive domain with their counterparts from the embedded systems & software (ESS) domains. This also includes those from the electronic design automation (EDA) space.

Automotive Track Chair: Samarjit Chakraborty Technical University of Munich Anthony Cooprider Ford Motor Company

Track # of Submissions

AUTO1. Automotive 44

Automotive TPC

◆ dddAutomotive Track Technical Program Committee: Adir Allon IBM Research - Haifa Butts Ken Toyota Motor Corporation Di Natale Marco Scuola Superiore Sant'Anna Dixit Manoj MathWorks, Inc. Ecker Wolfgang Infineon Technologies AG Eles Petru Linköping University Grunler Christian Daimler AG Hamann Arne Robert Bosch GmbH Lukasiewycz Martin TUM CREATE Ltd. Nuckolls Ed Freescale Semiconductor, Inc. Paparo Mario STMicroelectronics Ramesh S. General Motors Company Ravindran Kaushik Natl. Instruments Corporation Samii Soheil General Motors Company Stechele Walter Technical University of Munich Stormer Christoph ETAS Group Zeng Haibo Mcgill University

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Paper Submission History

YEAR ABSTRACT SUBMISSION APPROVED FOR REVIEW

2011 959 741

2013 913 743

2014 1060 788

2014 Paper Submission By Committee

SUBCOMMITTEE # OF PAPERSEDA1. System-on-chip design and HW/SW codesign 38

EDA2. On-Chip Communication and Networks-on-Chip 34

EDA3. Cross-Layer Power Analysis and Low-Power Design 64

EDA4. Low-Power Devices and Circuits 26

EDA5. Verification 47

EDA6. High-Level Synthesis, Logic Synthesis, and FPGAs 47

EDA7. Analog Design and Simulation 40

EDA8. Physical Design and Design Closure 50

EDA9. Physical Verification, Lithography and DFM 30

EDA10. Analysis of Digital Design 38

EDA11. Testing 16

EDA12. New and Emerging Design Technologies 53

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2014 Paper Submission By Committee

SUBCOMMITTEE # OF PAPERSESS1. Embedded Software 58

ESS2. Embedded System Design 46

ESS3. Embedded System Design Methodologies 41

ESS4. Embedded Storage and I/O Systems 42

AUTO1. Automotive 44

SEC1. Hardware Security 40

SEC2. Embedded and Cross-Layer Security 34

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Overview of Conf

▪ Held from Nov 18~21 @ Hilton San Jose

▪ GC: Jorg Henkel, PC: Yao-Wen Chang (Vice PC: Diana Marculescu)

▪ TPC: 17 tracks, 106 members, meeting in Austin, TX ▪ Registration: 348 (375 in 2012, 350 in 2011)

▪ Keynotes ▪ T. Sterling: Future of computing through brain-inspired architectures ▪ L. Liebmann: Escalating design impact of resolution-challenged lithography ▪ L. Scheffer: Networks of NMOS and neurons

Program Summary

▪ Paper stat: 354 submitted, 92 accepted (26%) ▪ Session organization: 40 sessions (26 regular, 12 tutorial/special, 2

designers’ perspective) + 3 keynotes ▪ ICCAD contest on Tuesday (87 teams participated)

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DATE 2014• Venue: Dreseden, Germany

• Date: March 24 – 28, 2014

• General Chair: 

Prof. Gerhard Fettweis

• TPC Chair: 

Prof. Luca Fanucci

Technical Programme (1)• Technical Papers

– Submissions: • 1090 (final submissions 890) papers (1003 in  2013, 950 in 2012, 928 in 2011)

– Acceptance: • 206 papers plus 107 IPs (total 23.1%; 36 % (incl. IPs))

– 4 tracks:• D: Design Methods, Tools, Algorithms and Languages

• A: Application Design

• T: Test and Reliability

• E: Embedded Systems Software

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Technical Programme (2)• Tutorials (Monday)

– 12 half‐day tutorials, registration for two

• Keynote in opening session (Tuesday):

• Sessions (Tuesday – Thursday)– 16 Special Sessions

– 2 Special Days• Special Day 1 (Wednesday): Advancing Electronics Beyond CMOS, T Mikolajick

• Special Day 2 (Thursday): System Level Design, Jürgen Teich

• Workshops (Friday)

• Venue: Grenoble, France

• Date: March 9 – 13, 2015

• General Chair: 

Prof. Wolfgang Nebel

• TPC Chair: 

Prof. David Atienza

Submission until: Sept. 14th, 2014

Notification by: Nov. 14th, 2014

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