JENOPTIK Laser, Optik, Systeme GmbH - lastek.co.kr · 9Automotive Sensor 9Embedded Electronics 9100nm~1um: 40Gbits/in² 9Sub-100nm: 100Gbits/in² 9Programmable device 9Multiple tests

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JENOPTIK Laser, Optik, Systeme GmbH


Was established on July 1, 1995 as 100% subsidiary of the JENOPTIK AG.

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About JENOPTIK

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Carl Zeiss sets up workshopfor precision mechanicsin Jena

Ernst Abbe, professor at the university of Jena, joins the company,designing microscopes

Ernst Abbe established theCarl-Zeiss-Foundationin Jena

Zeiss Jena is convertedinto a state-owned enterprisedoing business in the name of VEB Carl Zeiss Jena

JENOPTIK GmbH

JENOPTIK AG

Jenoptik Carl Zeiss JENA GmbH

splits up into:

Carl Zeiss JenaGmbH

JENOPTIK GmbH

1846 1866 1889 1948 1990 1991 1995

The state-ownedKombinat VEB Carl Zeiss JENA

is converted into

JENOPTIK Carl Zeiss JENA GmbH

197319641960

History of JENOPTIK

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JENOPTIK AG

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Jenoptik Technology-Center Jena/Germany

Export Ratio: 80%

Pioneer and Market leader: Developing Imprinting Technology since 199276 Jenoptik HEX_Systems // 43% market share

JENOPTIK PC Micro Engineering

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Portfolio - PC Mikrotechnik

HotEmbossingSolutions

HEX01HEX02HEX03HEX04

UV-Modul

LithographySolutions

X-Ray ScannerDEX02DEX03DEX04

MonochromatorMGU1MGU2

complete Beamlinepartner Bestec GmbH

Applications & Service

Manufacturing,Planing &

Process Assistance

micro/nano components:

optical: e.g. lenses, gratings, holograms

fluidic: e.g. channels, life science, PCRs

continuous development of technology &

equipment

partner University Freiburg

Portfolio

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Hot Embossing Solutions

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Hot Embossing Process Schematics

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HE Temperature Pattern Chart

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HE - Process Schematic at Jo-MT

Precise Engineering

> 100m

High Resolution Tech.

LIGA / UV-LIGA

ToolDesign

Si-Machining - Wet Etch-Dry Etch

Substrate & Tool Heating

> TG

Press Tool on the

Substrate20kN-200kN

Cooling-AEROSOL

De-Embossing-O2-Purging

Next Step-Bonding- Dicing

Master- Ra down to 100nm- Bending down to 20m

Vacuum

Condition

Process

Chemical sealing- glue, solvents- Thermal

ActiveDe-Embossing

Most criticalstep

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Polymers used for Micro Molding

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Hot Embossing Process Schematics Hot Embossing

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Hot Embossing Process Schematics Force

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Hot Embossing Process Schematics De-Embossing

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Polymer Micro and Nano-patterning

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Hot Embossing Products Line-up

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Hot Embossing Solution HEX01

HEX 03

HEX 01

Cost effective entry system with tabletop layout

Pressing force of up to 20kN (50kN Option)

Embossing temperature up to 320C (500C Option)

Mold non-orthogonality compensation

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HEX 03

HEX 02

Medium range system

Pressing force up to 200kN (250kN Option)

Embossing temperature up to 320C

(500C Option)

Mold non-orthogonality compensation

Suggestive user interface with macro

script language

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HEX 03

High-end embossing solution

Pressing force up to 200kN (250kN Option)

Embossing temperature up to 320C

(500C Option)

Temperature stability +/- 1C

Maximum substrate diameter 180mm

Cleanroom compatible

Active De-embossingTM

Optical alignment with +/- 2m overlay accuracy

HEX 03

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HEX 03 Chamber (Top)

HEX 03 Chamber (Bottom)

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HEX 04

Max Substrate Size 300mm in diam.

Thickness of Sandwich up to 20mm

Max Press Force up to 400kN (600kN opt.)

Embossing Temperature up to 500C

Cycle Time typically 3 min

Temperature Stability +/- 2C

Optical Alignment +/- 2m overlay accuracy

Cleanroom Compatible

Active De-embossingTM

Handling Unit

UV Unit

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>90

With Active De-Embossing Unit

Without Active De-Embossing Unit

90.90.

Key Feature - Active De-Embossing UnitTM

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Double Side Embossing with Alignment

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SensLab Tool - Double Side Embossing

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Glass Embossing (1)

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Glass Embossing (2)

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Micro and Nano Optic Applications

Feature size < 100nm

+ Optical Filter - Gratings

+ Binary optics

+ Lenses for CD/DVD

+ Aligned Double-Side Embossing+ Nano-precise Surface Forming+ Excellent Uniformity

Glass Master+ E-Beam written+ Aspect Ratio: 1-50+ Feature Size: 30nm - 50m+ price: up to 10k

70 nm line space, AR 1

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UV-Unit Technology Development

UV-Source High Brightness LED ArrayWavelength 365nmEmbossing Temperature Ambient up to 100CExposure area 150mm diameter (HEX_01)

Up to 300mm (HEX_04)Uniformity (150mm) < 5%Force < 10N up to 10kN

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Master Manufacture

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Master Manufacturing

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Master Silicon Master

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Masters fabricated with silicon dry etching

Detail of Silicon Embossing Tool Resulting Microchannel

Hot Embossing with Si-Master small feature(1) Microfluidics Capillary Electrophoresis Chips

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Embossed microchannel array

Replicated channels in PMMA Height: 5 m

Width: 0.8 mH.Becker, K. Lowack, A. ManzImperial College, London, IMM Mainz

Embossing tool: Silicon

Hot Embossing with Si-Master small feature(2) high aspect ratios

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23m

83m

Fluidic ChannelsPMMA

Hot Embossing with Si-Master small feature(3)

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Hot Embossing with Si-Master small feature(4)

AR: 1,5Application: Coordinates Mash for Cell-Structures

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Nickel Master:manufactured byElectroplating and LIGA

Master Nickel Master

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LIGA-Tool Material: PMMA Height: 150 mm AR: 5

Hot Embossing with Ni Master(1)

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LIGA-Tool Material: PMMA Height: 150 mm AR: 5


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LIGA - Tool:AR: > 20smallest structure: 7mheight: 150m

Capacitive Accelerator-Sensor


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LIGA - Tool:AR:19 smallest structure: 8m height: ca. 150m

Capacitive Accelerator-Sensor


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Tool Manufacturing: ElectroplatingNi in Si-Wafer

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Hot Embossing Applications

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MolecularElectronics

Optical Device

Optical MediaMagnetic Media

Laboratories On A Chip

Semiconductor

NanoScale

Pattern

Optical Communications

Wave-guidesOptical filter

Computer Network Solution

Laser pickup readout system

DVD, DVR: Blue-Ray LensOptical LensPrism Sheet

Automotive SensorEmbedded Electronics

100nm~1um: 40Gbits/in

Sub-100nm: 100Gbits/in

Programmable deviceMultiple testsSmaller amounts of

material and More efficient result

Challenge for MoorsLaw

Miniaturizations

Material Characters

Application Diagrams

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Solutions for commercial applications

Microoptic Microfluidic Micromechanic

L.O.S fiber

Cannon

Fuji

Blusi

Bosch

JENOPTIK PC MT

LSU

LTU

JENOPTIK PC MT

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Hot Embossing ApplicationsMicro-fluidic & Bio-MEMS Applications

Micro-optic ApplicationsMicro-mechanic Applications

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Application based on Polymer MEMS

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Embossing Materials for u-fluidic

Acronym Full name Temp.Stability in OC Proberties Structure

COC Cycle-olefine/copolymer 140Hightransparency

Amorphous

PMMA Polymethylmetacrylate 80 HightransparencyAmorphous

PC Polycarbonate 130 HightransparencyAmorphous

PS Polystyrene 80 Transparent AmorphousPOM Polyoxymethylene 90 Low Friction Semi Crystalline

PFA PolyfluoralkoxyCopolymer 260High Chemicalresistive

Semi Crystalline

PVC Polyvinylchloride 60 Cheap Amorphous

PP Polypropylene 110 MechanicalPropertiesSemi Crystalline

PET PolyethyleneTerephtalate 110Transparent, Lowfriction

Amorphous/SemiCrystalline

PEEK Polyetheretherketone 250 High Temp.ResistivitySemi Crystalline

PA Polyamide 80-120 Good mech.PropertiesSemi Crystalline

PSU Polysulfone 150 Chemical andTemp. ResistivityAmorphous

PVDF Polyvinylideneflouride 150 Chemically inert,piezo-electricSemi Crystalline

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In 2007 75% of all fluidic applications are done in Polymer

Materials for -Fluidics Applications

63%63%

81%

63%

16%

38%

59%

59%

75%

0%

20%

40%

60%

80%

100%Si

Polymer

GlassMetall

Ceramics

2002/03 >2007

Embossing Materials for u-fluidic

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Lactate Scout Alcohol Drugs Oestrogen

Application(1) - Fluidic (SensLab)

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Continous Flow PCR SystemAndreas Manz, IC London

Batch PCR ReactorLarry Kricka, Univ. PennsylvaniaClaudia Grtner, AMT Jena

Application(2) - Fluidic : PCR Reactors Batch/ContinousFlows

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Application(3) - Fluidic : IZM Waveguide

0%

10%

20%

30%

40%

50%

60%

500 600 700 800 900

Wavelength (nm)

Tran

smis

sion

unfilled fluidic channel

filled fluidic channel

Master: milled brass

Channel width: 250mChannel depth: 250m

Waveguide width: 250mWaveguide thickness: 250m

Hot Embossed PMMA

light

fluid

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Feature Size

[30 nm ~ 500 m]

Structure for:

separation

mixing

filtering

passive Valves

chambers

Inlet

Analytic-read out

Application(4) - BioMEMS : Analytic Chip

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Nano Structure realized with acommercial HEX03 Hot Embossing System

PMMA120nm pitch60nm lines

120nm depthaspect ratio 1:2

Application(5) Nano Embossing

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Optical fibre(50 m core)

Multilevel Master polymer embossed micro-fluidic channels with integrated optical fibres

Application(6) - Fluidic : with Integrated Optics

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Masters fabricated with silicon dry etchingMaster structure Embossed part in PMMA

Application(7) - Fluidic : Microfluidic Mixer

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Application(8) - Fluidic : Cover lid bonding

Cross-section of a single micro channel

Device filled with liquid

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Hot Embossing ApplicationsMicro-fluidic & Bio-MEMS Applications

Micro-optic ApplicationsMicro-mechanic Applications

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Solutions for Manufacturing ofMicro-Optical Components

Aligned Double-Side Embossing

Nano-precise Surface Forming

Pneumatic Soft Deembossing

Excellent Uniformity

Application Micro-Optical Components(1)

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Molds

Limits

CoolingHeating

Alignment

De-Embossing

Mold (Bottom) for 52 Lenses

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Appication - Microspectrometer

Glasfaser

Lichteinkopplungi - x

Lichtauskopplungmit 45 -Kante

photodiode array

selffocussingreflexiongrating(d=0,2 m; g=2 m

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Application - Refractive Optical Array

Material: RT 133

Structure depth: 45 m

Lattice constant: 30 m

Filling factor: > 98 %

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1. Goal (was): New applications of optical data storage (next generations after CD, DVD) Optics and/or the assembly around the pure optic components Blue ray disc, 405 nm Lens: NA 0.85, shape accuracy: Lambda/4, roughness 10. 20 nm Cost effectiveness of production: better the with a 16 fold injection molding technology

2. Market/Costumer In principle. 2002: Matsushita, Mitsubishi, Pioneer, Philips, Sony, Thomson, LG Electronics, Hitachi, Sharp and

Samsung define a 25 Gbytes standard, the numerical aperture (NA) of the lens is 0.85 Toshiba und NEC develop a DVD follower And so on.... Thomson was a partner in the project

3. Results 25 and 52 fold embossing assembly Ca. 1 dozen mold insert techniques were tested Yield 85 % Shape accuracy:

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University FreiburgDr. Claas MllerManaging Director of the Chair of Process Technology

Paul Scherer InstitutDr. Helmut SchiftHead of Micro and Nano Structuring Group

Luisiana State UniversityDr. Jost GoettertDirector for Microfabricationat the CAMD

Forschungszentrum KarlsruheDr. Matthias HeckeleHead of the MicrofluidicDepartement

PC MikrotechnikMr. Frank ReutherHead of the R&D Department

Technology Advisory Board Members

Mission:Establishing equipment concepts for state-of-the-art Hot Embossingand Nano Imprinting Technology requirements!

Technology: Full size substrate thermal and UV-Imprinting

Applications: -Fluidics, -Optics, portableHDD

Process: Nano StructuresHigh Aspect RatiosMicro StructuresResidual LayersImprinting

Materials: PMMA, COC, PC, Glass, etc.

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Strategic Partners

ForschungszentrumKarlsruhe

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Leading Research Centers for MEMS, Micro Optical and Bio-Nano Developments

University of California Irvine, USA

Stanford Microfluidic Labs, USA

Berkeley Nanotechnology Labs, USA

Paul Scherer Institut (PSI), CH

IMTEK Freiburg, Germany

UCLA, USA

Pusan National University, Korea

ITRI, Japan

ETRI, Korea

Matsushita Central Research , Osaka, Japan

Mitsubishi Advanced Technology R&D Centre, Osaka, Japan

Hong Kong Productivity Council, Hong Kong SAR

SSLS / National University Singapore, Singapore

MEMS Exchange / CNRI, Washington, USA

Foundation Tekniker, Bilbao, Spain

Forschungszentrum CAESAR Bonn,Germany

K.E.T.I. Seoul, South Korea

Forschungszentrum Karlsruhe, Germany

University Turin, Italy

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JENOPTIK Mikrotechnik GmbH - WorldWide Installations

Dedicated Micro- & Nano-Hot Embosing Solutions

51 Systems Installed

( sometimes multiple)

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New!! JENOPTIK LAB MEMBERSHIP

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Contacts

Thank you very much for your attention !

Enrico PiechotkaDirector Marketing & SalesPC Mikrotechnik

Phone: +49-3641-65 3042Telefax: +49-3641-65 3562Mobile: [email protected]

Phone: +82-32-623-6320Telefax: +82-32-623-6325Mobile: [email protected]

Documents

JENOPTIK Laser, Optik, Systeme GmbH - lastek.co.kr · 9Automotive Sensor 9Embedded Electronics 9100nm~1um: 40Gbits/in² 9Sub-100nm: 100Gbits/in² 9Programmable device 9Multiple tests