ISSUE 1711 - Welcome to FTM Board Club · ISSUE 1711 Application Spotlight on: Connectivity Component Focus: Pages 3-12 NXP Semiconductors’ wireless power-transmitter reference

I S S U E 1 7 1 1

Application Spotlight on:

Connectivity

Component Focus: Pages 3-12 NXP Semiconductors’ wireless power-transmitter reference design provides output power up to 15W

Design Note: Page 13 Vishay’s isolated buck-converter topology offers a simpler isolated 24V or 48V industrial power supply

Application Spotlight: Pages 14-21 Cypress Semiconductor’s CYBT-343026-01 module provides dual-mode Bluetooth radio connectivity

Technical View: Pages 22-23 A comparison of LoRaWAN™ and cellular NB-IoT technologies for low-power wide-area networking

S T A R P R O D U C T

Complete hardware and software package enables rapid development of touch-sensing user interfaces

The user interface of a product is an important element which design engineers need to address if it is to provide a compelling user experience. Touch pads, sliders and rotary interfaces offer a more intuitive and effective means of user interaction than traditional buttons.

Now NXP Semiconductors has simplified the design of touch-based user interfaces with the introduction of the new NXP Touch solution. This solution includes software which works simply and seamlessly with NXP’s capacitive touch-sensing hardware IP on the Kinetis KE15Z microcontroller.

The main benefits of the NXP Touch solution include:• Robust EMC performance• A high degree of noise immunity. The NXP

Touch system is certified for compliance with the IEC 61000-4-6 standard according to the 3V and 10V tests.

• Self-capacitance and mutual capacitance modes which are capable of supporting touch pads in a matrix of up to 6 x 6 sensors

• Effective performance even in the presence of liquids such as water, oil and vapour

NXP SEMICONDUCTORS• High sensitivity. A sensor boost feature

operates to ensure robust sensing of touches through thick acrylic or glass overlays.

NXP supports users of the NXP Touch solution with software to facilitate project start-up and development. The NXP Touch Library, which is based on the MCUXpresso Software Development Kit, includes:• APIs for high-level touch applications• Typical design examples• Advanced Filtering and Integrating Detection

(AFID)/Signal Adaptive Filtering Algorithm (SAFA) key detectors

• Automatic touch IP register configuration• A GUI to make debugging and test easy

The new library code is suitable for use in RTOS-based multi-tasking applications and in C++ object-oriented applications.

NXP’s Freedom Touch board demonstrates keys, sliders and rotary touch switches

APPLICATIONS• Home appliances• Smart lighting • Health and wellness monitors• Glucose monitors• Thermostats

FEATURES• Supports:

• Sliders • Analogue sliders • Rotary switches • Analogue rotary switches • Matrix sensors • Keypads

• Optimised for use with Touch-Sensing Interface (TSI) module found in most Kinetis MCUs

171102 For samples or pricing [email protected]

F T M T E C H N O L O G Y W A T C HN E W S I N B R I E F

F O L L O W U S N O W – S E A R C H F T M B O A R D C L U B O N

Connectivity and the Internet of Things are well supported today by manufacturers of RF components and modules, and of other types of connectivity components. This means that the task of embedding connectivity in end-product designs is readily enabled by the electronics supply chain.

Amar Abid-AliVertical Segment ManagerFuture Connectivity Solutions (a division of Future Electronics)

But if the problem of how to connect devices is more easily solved than before, the question of why to connect them is perhaps more pressing than ever. How can OEMs make the connectedness of their products as valuable and important as possible to their customers?

The Future Electronics/Cypress Semiconductor Nebula development board is one of the ways in which OEMs can find an answer – the Nebula board is featured on page 21 of this issue. That is because it provides a platform for using the Cypress Wireless Internet Connectivity for Embedded Devices (WICED) application development environment. WICED is the only tool that gives a unified environment for developing connectivity applications for both Wi-Fi® and Bluetooth® connections.

The chipset on the Nebula board supports both these radio technologies. By developing on the WICED platform, designers can more quickly and easily integrate a suite of applications for a single end-product, such as a smart home gateway, which uses both radios. This development process is helped by the provision of sample applications in WICED for functions such as connecting to cloud services, audio-over-Bluetooth/Wi-Fi, sensors and beacons, and smart home gateways.

Another answer to the ‘why’ question is to enable new use cases or new functionality. Many companies are finding new ways to add value to their products through support for location-aware functions or services. In many cases this will be enabled by embedding a satellite positioning receiver in the end-product. One of the easiest ways to do this is by using a module such as the EM75 from Sierra Wireless, described on page 16.

Murata introduces tiny RAIN RFID tag

Murata has released the LXMSJZNCMF-198, its latest RAIN RFID tag intended to be embedded in end-product applications.

The product combines a RAIN RFID chip and an antenna to create a complete RFID tag which has a 1.25mm2 footprint and a height of only 0.55mm. This makes it ideal for use in eyewear, watches and other wearable accessories, as well as healthcare applications such as test tube sample identification.

New 3D LiDAR sensor gives wide angle of view Panasonic Industry Europe has announced the development of 3D Light Detection and Ranging (LiDAR) sensor equipment which measures the distance to an object by measuring the round-trip travel time of a pulse laser directed at the object. Using proprietary Panasonic laser-scanning technology, this 3D LiDAR is capable of scanning over a viewing angle as wide as 60° vertically and 270° horizontally.

Latest IP cores for CrossLink FPGAs provide flexible video-bridging capabilities Lattice Semiconductor has introduced seven new modular IP cores for its award-winning CrossLink FPGA product. These modular IP cores offer the building blocks for users to create their own unique video-bridging solutions.

The cores are typically used to bridge between MIPI® and other traditional or legacy display and camera interfaces.

The primary function of the module is to provide cellular LTE (4G) connectivity to embedded devices. But the module also includes a GNSS receiver which can decode GPS, GLONASS and other satellite signals.

Some applications, however, will require location awareness indoors, where GNSS signals cannot be received. The technology for ultra-accurate indoor positioning is also available today: Decawave provides ultra-wideband radio ICs and modules that can triangulate multiple signals to produce an indoor position measurement accurate to ±10cm in three dimensions. Decawave products are available to buy today from Future Electronics.

Decawave is an example of the way in which RF and connectivity technology is changing rapidly and creating opportunities for new products, applications and even business models. The pages of this and future issues of FTM will provide the first look at the products available from Future Electronics that are making them possible.

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©Copyright 2017 Future Electronics Ltd. All trademarks contained herein are the property of their respective owners. Applications for product samples, badge boards, demonstration boards, Future Electronics’ boards and other advertised materials from Future Electronics are offered subject to qualification. Images of product packages throughout this publication are for illustration purposes and not necessarily an exact representation of the advertised part.

S E E P R E V I O U S I S S U E S O F F T M AT W W W. M Y- F T M . C O M 3

New 700V DC-DC converter with fixed-ratio output in miniature board-mount package

Vicor has added a new fixed-ratio, high-voltage bus converter to its line-up of Bus Converter Module (BCM) products. The new BCM4414xG0F4440 steps down a rectified input voltage in a range from 400V to 700V DC by a fixed 1/16 ratio to produce an output of 25.00V to 43.75V DC.

The module is housed in a thermally efficient 4414 VIA package measuring 111mm x 36mm x 9.3mm and offering 4.3kV of galvanic isolation. It is supplied in chassis-mount and board-mount versions. Maximum power output is 1.75kW, and peak efficiency is 97%. The power density of the BCM4414xG0F4440 is 700W/in3.

The robust VIA package also provides integrated PMBus™ communication, EMI filtering and protection against transient voltages. These flexible modules can easily be paralleled to provide higher-power arrays.

VICORIn addition, the BCM outputs can be connected in series for higher output voltages. Providing DC-DC conversion after AC rectification and power factor correction, the 700V BCM provides a small, efficient component enabling designers to create compact and cost-effective three-phase systems with a Safety Extra-Low Voltage (SELV) output.

BCM products are also ideal power components for use in tethered unmanned vehicles and power-distribution systems.

APPLICATIONS• Power distribution systems• Remote unmanned vehicles• Three-phase power circuits• Industrial equipment

FEATURES• Bi-directional operation• 40A maximum continuous output current• Operating-temperature ranges:

• T-grade: -40˚C to 100˚C • C-grade: -20˚C to 100˚C • Mil-grade: -55˚C to 100˚C

• Over-voltage, over-current, under-voltage, short-circuit and thermal protection functions


Apply now at my-boardclub.comFast-track board request code: FTM711A

Orderable Part Number: FRDM-TOUCH

Also, a BCM can be used as an isolated unregulated front-end, which can then feed various Vicor point-of-load buck and buck-boost regulator modules, as well as Vicor PRM and VTM modules in a factorised power architecture.

How the latest connectivity technology can open up opportunities for new applications and new products

C O M P O N E N T F O C U S

S E E P R E V I O U S I S S U E S O F F T M AT W W W. M Y- F T M . C O M

New synchronous buck regulators offer high efficiency over wide input-voltage range

New reference design implements 15W Qi-compliant wireless charging transmitter

NXP Semiconductors’ WCT-15WTX1-COILFF is a reference design for a fixed-frequency, single-coil wireless power transmitter with a 15W rating.

The SiC46x series synchronous buck regulators from Vishay operate over a very wide input-voltage range of 4.5V to 60V and provide an output current of up to 10A with high conversion efficiency.

The reference design uses the MWCT10xx transmitter controller IC, a device which integrates all the required functions of a wireless power-transmitter design that complies with the Wireless Power Consortium (WPC) Qi® standard.

The SiC46x regulators include integrated high- and low-side N-channel trench power MOSFETs, and operate at an adjustable switching frequency of up to 2MHz. The SiC461 is rated for a maximum output current of 10A. The other parts are the 2A SiC464, the 4A SiC463 and the 6A SiC462.

The regulators are capable of providing an adjustable output voltage as low as 0.8V and as high as 90% of the input voltage. The 60V input-voltage rating of the SiC46x devices means that they can handle the kick-back transients caused by motors in power tools, battery-operated vehicles and robotic vacuum and garden equipment. It also makes them suitable for use in a wide variety

NXP SEMICONDUCTORS

VISHAY

The design incorporates the NXP Touch capacitive-sensing technology to detect a mobile device positioned ready for charging while consuming very little power in stand-by mode.

The WCT-15WTX1COILFF offers considerable freedom to the developer to differentiate the end-product design and to meet a range of application requirements. The MWCT101x controller supports the Extended Power Profile (EPP) for industrial and consumer power-transmitter designs of the MP-Ax or MP-Bx types or for custom applications.

It uses fixed-frequency control methods such as rail-voltage control, phase-difference

control or duty-cycle control. This software-based solution supports wireless charging for both EPP and baseline power profile receivers.

In addition, the easy-to-use FreeMASTER GUI offers configuration, calibration and debugging functions to provide a user-friendly design environment and to reduce development time.

of battery packs and high-voltage battery chargers.

The SiC46x regulators’ architecture provides for ultra-fast response to voltage transients with a small requirement for output capacitance. Tight ripple regulation is maintained at very light loads.

The devices are stable with any capacitor, and no external ESR network is required for loop stability. The SiC46x parts also incorporate a power-saving scheme which significantly increases light-load efficiency.

The regulators offer a full set of protection functions, including over-voltage and under-voltage protection and thermal shut-down.

NXP’s wireless power transmitter operates from a single coil

SiC46x: Handles high kick-back voltagesSee Design Note on page 13.

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Schottky diodes give performance gains of as much as 20%

Boost regulator module for single-cell batteries offers low stand-by power consumption

Diodes Incorporated has used an advanced deep-trench fabrication process to produce a new SDT series of Schottky diodes which offers superior performance to planar-type Schottky diodes at similar or lower cost.

RECOM’s new R-78S boost switching regulator module is intended for use in IoT devices powered by a single-cell battery.

At launch the family consists of 29 devices housed in thermally-efficient packages. The new Schottky diodes may be used to provide the blocking, free-wheeling, flyback and other diode functions commonly required in a wide range of applications.

Diodes’ innovative deep-trench process enables the SDT family of Schottky diodes to offer a forward voltage as low as 0.62V, and a leakage current of just 3.5µA. These values are as much as 20% better than those of diodes manufactured on a planar process.

Combining a wide input-voltage range, high efficiency and low stand-by losses, the R-78S regulator extends the working lifetime of single-cell batteries by maintaining a stable 3.3V output all the way down to the cut-off voltage at which the battery is fully discharged.

Easy to integrate in end-product designs, the R-78S boost regulator is able to provide a stable 3.3V output from an input voltage

ranging from 3.15V to 0.65V.

This means that devices such as microcontrollers, wireless modules or IoT systems can be supplied from a single 1.5V cell, providing a longer run-time than systems powered by a conventional 3V button battery.

The efficiency of the R-78S series can reach 93% at full load, and over 90% even at light loads. No-load current is 160μA, falling to 7μA when the Control pin is used.

DIODES INCORPORATED

RECOM

APPLICATIONS• AC-DC chargers and adapters• DC DC converters• AC LED lighting• Home appliances

FEATURES• Available in single and dual configurations• Soft and fast switching• Excellent high-temperature stability• 150°C maximum junction temperature

APPLICATIONS• IoT sensors and transmitters• Remote monitoring and data-logging

systems• Planned-maintenance systems

FEATURES• >80% efficiency at 10% load • Continuous short-circuit protection • Over-temperature protection• Operating-temperature range:

-40°C to 100°C • Three-year warranty

APPLICATIONS• Point-of-load power supplies in telecoms

servers• Industrial products • Industrial computing equipment• Vending and slot machines• Cellular communications modules• Home automation equipment • Networking equipment• Power tools• Factory automation equipment • Battery chargers

FEATURES• 98% peak efficiency• ±1% output-voltage accuracy• 5μA shut-down current• 250μA operating current when enabled

but not switching• Adjustable soft start and current limit

APPLICATIONS• Wireless charging

FEATURES• Compliant with the Qi v1.2.2 specification• Cost-optimised consumer design• >70% transfer efficiency• Integrated digital demodulation on-chip• I2C, UART, SPI and CAN interfaces

This exceptional performance results in outstanding power efficiency. It also helps designers to accommodate power-conversion circuits in smaller form factors.

Maximum average rectified-current ratings range from 5A to 40A, with peak repetitive reverse voltages up to 120V and forward surge currents as high as 280A. These values help designers to provide for robust system operation across the full operating-temperature range.

An integrated under-voltage lock-out circuit protects rechargeable cells from damage due to deep discharging. The R-78S is certified as compliant with the new EN62368-1 standard.

SDT series: All packages offer excellent thermal performance

R-78S: stable 3.3V output

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PowerDI®5, TO220AB and ITO220AB package options all offer excellent thermal-transfer properties which allow the SDT diodes to perform reliably in demanding applications. These packages are well suited to high-volume manufacturing processes. The PowerDI5 package has a particularly small footprint of 6.5mm x 4.0mm, and is just 1.1mm high.

Information about Apple’s support for Qi wireless charging in the iPhone® 8 and iPhone X smartphones can be found here: blog.nxp.com/enabling-technologies/nxp-welcomes-new-apple-iphones-with-qi-wireless-charging.



Entry-level 32-bit MCUs ideal for use in 8- and 16-bit applications

STMicroelectronics’ entry-level 32-bit STM32F030 Value Line of microcontrollers based on an ARM Cortex-M0 core is intended for use in applications that today use an 8-bit or 16-bit MCU.

The STM32F030 devices feature 256kbytes of programme Flash, and are supplied in 32-, 48- or 64-pin LQFP packages, or a 20-pin TSSOP package.

Products in the STM32F0 Value Line provide designers with built-in safety functions, precise internal oscillators, multiple clock sources, and a real-time clock and calendar with alarm and periodic wake-up from stop or stand-by mode. Other important features include a five-channel DMA controller, internal voltage regulator, 12-bit ADC, and versatile communication capabilities such as two I2C interfaces, six USARTs and two serial peripheral interfaces.

STMICROELECTRONICS The MCUs are backed by the STM32F0 software and hardware ecosystem. Configuration takes only a few seconds with the STM32CubeMX configuration tool. The STM32CubeMX tool can also generate initialisation C code, and automatically download STM32CubeF0 embedded software.

STM32F030: Easy to configure with STM32CubeMX

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Pyroelectric passive infrared sensor offers improved radial sensitivity

New 10mm x 14mm buck regulator modules support output currents up to 22A

Panasonic has developed a special lens which improves the radial sensitivity of pyroelectric PIR sensors.

Vicor has extended its family of Cool-Power® 48V ZVS buck regulator modules by introducing the PI3523, PI3525 and PI3526, which provide output currents twice as high as existing parts in the family in a package just 40% larger.

The wide-angle models in the EKMCxxx and EKMBxxx PaPIR sensor families featuring the patented lens are intended for use in both wired and battery-powered applications. The superior optical characteristics of the new lens give a large detection angle of 150° horizontal x 35° vertical.

Pyroelectric PIR sensors use lenses to direct incoming heat radiation to the sensor elements. If an object with a temperature that differs from that of the surroundings moves into the detection area, the sensor reacts. Parameters such as the ambient temperature and the size, speed and direction of movement of the object influence the response time and the detection distance of the sensor.

PANASONIC

VICOR

APPLICATIONS• Thermostats for heating control• Automatic light switches • IP cameras • Intruder alarm systems • Smart offices • Display automatic wake-up function

FEATURES• Available with white, pearl-white or black

lens• Operating-temperature range:

-20°C to 60°C• 5m human body detection range• Operating-voltage range: 2.3V to 4.0V

APPLICATIONS• Lighting• Communications equipment• Automotive equipment• Data centres

FEATURES• >96% peak efficiency• User-adjustable soft-start and tracking• Constant-voltage or constant-current

operation• Two-phase interleaving• Operating-temperature range:

-40°C to 125°C

APPLICATIONS• User interfaces• Handheld equipment• Audio/video receivers • PC peripherals• Gaming equipment • GPS devices• Industrial equipment • Programmable logic controllers • Inverters• Printers and scanners• Alarm systems• Video intercoms• Heating and ventilation equipment

FEATURES• Seven general-purpose 16-bit timers • PWM timer• Supply-voltage range: 2.4V to 3.6V• Comprehensive set of power-saving

modes• Operating-temperature range:

-40°C to 85°C

An inherent feature of pyroelectric PIR sensors is that tangential movements, at a 90° angle to the sensor, are easier to detect than radial movements. This means that the detection distance is smaller if the object moves towards the sensor. Panasonic’s new wide-angle lens has the effect of increasing sensitivity to radial movements.

Wide-angle versions of the EKMCxxx and EKMBxxx products are available with a digital output, and with a stand-by current rating of 1µA, 2µA, 6µA or 170µA.

This means that the Cool-Power 48V family now provides scalable power options for direct-to-point-of-load applications operating from a 48V nominal input and drawing a current of up to 22A.

The PI352x modules only require an output inductor and few passive components to make a complete and cost-effective design which occupies less than 740mm2 of PCB area. Supporting easy paralleling in combinations of up to three regulators, the PI352x devices can be scaled to support higher-current loads.

Panasonic PIR sensors: Wide field of view

Vicor: 60V maximum input

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Part Number Package Input Voltage Range Nominal Output Voltage Current

PI3523-00-LGIZ* 10mm x 14mm 30 – 60V 3.3V 22A

PI3525-00-LGIZ 10mm x 14mm 30 – 60V 5.0V 20A

PI3526-00-LGIZ* 10mm x 14mm 30 – 60V 12V 18A

PI3542-00-LGIZ 10mm x 10mm 36 – 60V 2.5V 10A

PI3543-00-LGIZ 10mm x 10mm 36 – 60V 3.3V 10A

PI3545-00-LGIZ 10mm x 10mm 36 – 60V 5.0V 10A

PI3546-00-LGIZ 10mm x 10mm 36 – 60V 12V 9A


Bus bar power connectors designed for Open Compute Project applications

Chip-type solid polymer capacitors offer highest capacitance in their class

Panasonic Industry Europe has added two new series to its SP-Cap family of conductive polymer aluminium capacitors, providing higher capacitance and better ripple-current performance in devices housed in D-case sizes.

New bus bar power connectors and cable assemblies from TE Connectivity (TE) offer lower power consumption in power-distribution applications when used to provide a connection either for the power supply or for a back-up battery.

As polymer capacitors do not require voltage derating, unlike tantalum capacitors, an SP-Cap part rated at 6.3V can act as a direct replacement for a 10V tantalum capacitor. Similarly, pure tantalum products give diminished capacitance at higher frequencies. In both cases, an SP-Cap part requires the use of fewer components in circuit designs. The same will often apply to circuits which currently

Suitable for use in telecoms and networking equipment, the bus bar connectors and cable assemblies conform to the specifications set for Open Compute Project (OCP) applications. They can also be used in products in which a 150A or 500A connection is needed.

These TE bus bar connectors and cable assemblies feature a low-cost, robust design which offers low contact resistance and better heat dissipation than other power products currently in the market. By cutting power losses and improving power consumption, these connectors can help to reduce the cost of data-centre operations. In addition, the same connector can be used for either 12V or 48V power and for either power or return.

PANASONIC

TE CONNECTIVITY

use multiple multi-layer ceramic capacitors (MLCCs), especially the stacked types.

By comparison with tantalum devices, the SP-Caps offer more stable performance over temperature and frequency, are more reliable because of their self-healing mechanism, and are resistant to ignition.

In the SP-Cap family, the CY and SY series are available with nominal capacitance values ranging from 330µF to 470µF, and with voltage ratings of 6.3V and 4V.

They are rated for 2,000h of operation at a temperature of 85°C.

The capacitors are housed in a surface-mount package with a footprint of 7.3mm x 4.3mm. Package height is 2.8mm.

The connectors and cable assemblies are available with several current ratings:• The 500A bus bar connectors are optimised

for power and battery back-up shelves • The 150A connectors are for use in cubby

shelves • The 25A and 50A cable assemblies are ideal

for individual server sleds

SP-Cap capacitors: Stable performance over time and temperature

TE’s bus bar connectors: Low contact resistance TE Connectivity and TE connectivity (logo) are trademarks.

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Complete 5W AC-DC converter in compact modular package

Rectifiers save space and improve thermal performance in consumer devices

RECOM’s new RAC05-K series are low-cost 5W AC-DC converters in a 1″ x 1″ package which offer high power density of 7.7W/in³ and high efficiency at light and full load.

Vishay Intertechnology has introduced a new family of surface-mount Trench MOS Barrier Schottky (TMBS) rectifiers in a compact package, the eSMP® series SlimDPAK, or TO-252AE, package style.

The RAC05-K converters are intended for use in Internet of Things (IoT) devices and factory-automation systems that include sensors and communications nodes that are always on. These systems are typically in a quiescent state for long periods, and so require a power supply which draws little power when supplying light loads. The no-load power consumption of the RAC05-K parts is only 75mW and efficiency remains above 70% even when the load falls to as low as 10% of the converter’s maximum power output.

The SlimDPAK rectifiers offer the advantages of a lower profile and better thermal performance than comparable devices in a DPAK (TO-252AA) package. While the new devices are footprint-compatible with the DPAK package, their profile is 43% lower, helping designers in the development of new ultra-slim consumer electronics products.

The TMBS rectifiers feature current ratings up to 35A for single-chip configurations,

and 40A for dual-chip, centre-tap, common-cathode configurations. The rectifiers’ heat-sink area is 14% larger than that of devices in the DPAK package, providing for excellent thermal-resistance values of as little as 1.5°C/W.

The TMBS rectifiers are also notable for their low forward-voltage drop of as little as 0.44V at 20A, 0.46V at 35A, and 0.49V at 40A, helping to minimise losses in power-conversion circuits.

RECOM

VISHAY

APPLICATIONS• IoT devices• Stand-by power equipment• Monitoring systems• Instruments and meters• Controllers and sensors• Industrial controls• Security systems• Space-constrained designs

FEATURES• Operating-temperature range:

-25°C to 50°C at full load• Short-circuit, over-voltage and over-

current protection functions • Internal EMC class B filter• UL/IEC/EN60950-1 and

UL/IEC/EN62368-1 certifications• CE marked• Three-year warranty

APPLICATIONS• DC-DC converters • Freewheeling diodes• Polarity-protection diodes

FEATURES• Maximum reverse voltages ranging from

45V to 150V • AEC-Q101 qualified version available • 175°C maximum junction temperature• Ideal for automated placement

APPLICATIONS• OCP reference designs • Power shelves • Battery back-up shelves • IT trays/cubby shelves• Server sleds

FEATURES• Robust metal connector is designed to

withstand rack installation • Low-profile connectors • Custom cable assemblies available

APPLICATIONS• Power-converter circuits• Power adaptors

FEATURES• High ripple-current ratings

• CY series: 5.1ARMS • SY series: 6.3ARMS

• ±20% capacitance tolerance

The RAC05-K modules provide a complete offline power supply with no need for external components. They operate from a universal mains input-voltage range of 85V to 264V AC, and provide standard output voltages of 3.3V, 5V, 12V, 15V or 24V DC, giving sufficient power to operate relays, data gateways and building-automation nodes.

The modules feature a 60ms hold-up time at an input of 230V AC, which means that missing mains cycles do not affect the output.

RAC05-K: Excellent light-load efficiency

TMBS rectifiers: Large heat-sink area

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171113 For samples or pricing [email protected] 171115 For samples or pricing e-mail

[email protected]




Robust wire-to-board connectors have small board footprint

PCB relays provide choice of options for applications in building systems control

Low-power PCB relays are available from TE Connectivity (TE) with one or two poles and maximum contact ratings ranging from 3A to 16A. This means that they can be used to meet a variety of isolated switching requirements in the control circuits in intelligent buildings.

Hirose has introduced the DF52 series of space-saving wire-to-board connectors for applications requiring high strength and durability.

Various options are offered in parameters such as contact rating, contact configuration, coil, enclosure and termination.

The connector range consists of crimp plugs and right-angle receptacles in a single row. The mated height profile is just 1.75mm, and the depth of the connector is 4.1mm, reducing the space on the board dedicated to connections.

The housings have been designed with thicker and more robust walls to prevent breakage and to provide resistance against mechanical stress during cabling assembly. In addition, a higher cable pull force of approximately 20N can be achieved.

The DF52’s crimp plug features a robust lance structure which keeps the contacts securely in place even when high forces are applied to the cable.

TE CONNECTIVITY

HIROSE

Relays with a high 16A contact rating include the 0410 83, a board-mount, 1 Form X relay which offers a contact gap of more than 3mm. Also offering a 16A rating are the OMIH, which offers 5kV of contact-to-coil isolation, and the RT and RZ series, which include models rated for operation at high temperatures.

TE also supplies the RT (Inrush) relay, which is rated for a 16A maximum current in normal operation, but which can withstand an inrush current of up to 80A. The RTX model can withstand inrush currents of up to 320A.

Highly reliable box-shape crimp contacts are used to prevent deformation and to provide strong resistance against breakage, snaring and rough operation.

The crimp plug has visible slits in the housing structure to act as an indicator. When the slits are no longer visible, this indicates that the connectors are fully engaged, guaranteeing complete electrical and mechanical connection.

TE’s range of PCB relays includes devices capable of withstanding high inrush currents

DF52: Highly reliable crimp contacts

11F O L L O W U S N O W – S E A R C H F T M B O A R D C L U B O N

Robust switches offer long life in harsh operating conditions

LED holder provides electrical and thermal connection for CoB LEDs

C&K supplies a broad range of high-quality, durable switches for integration into various types of control gear in transportation equipment and off-road vehicles. The switches are ideal for use in control grips, joysticks, off-road panels, hydraulics, power-control panels, heavy equipment, lifts and other applications.

TE Connectivity’s (TE) LUMAWISE drive LED holder type Z50 allows luminaire designers to eliminate discrete driver boxes from spotlight and tracklight designs, creating a more aesthetically pleasing solution while reducing system costs.

Many of the C&K switches are suitable for harsh applications which are subject to outdoor exposure and heavy use. These products, which are reliable, rugged and sealed against corrosion, include two families of sub-miniature snap-action switches.

The LCS series switches are fabricated in a thermoplastic polyester or high-temperature thermoplastic housing, and

The LUMAWISE drive type Z50 brings integrated driver functionality to TE’s Zhaga-inspired, Z50 range of LED holders. Incorporating a DC-DC converter into the holder itself, the type Z50 provides a low-profile, constant-current driver for Chip-on-Board (CoB) LEDs. The holder can accommodate CoB LEDs in four sizes: 16mm x 19mm, 19mm x 19mm, 20mm x 24mm, and 24mm x 24mm.

Designed to operate from a 48V DC input, TE’s LUMAWISE drive LED holder type Z50 works with a wide range of readily available constant-voltage power supplies.

C&K SWITCHES

TE CONNECTIVITY

APPLICATIONS• Instrument panels • Cabin switches• Remote controls for cranes and handling

equipment• Seat-belt latch verification • Seat occupancy detection

FEATURES: (LCS series)• Compact design• Long life and high electrical capacity• Wide variety of actuator styles• IP67 sealing

APPLICATIONS• Track lighting• Spotlights• Downlights

FEATURES• Enables elegant and space-saving

luminaire designs • Four current output options• Supports compliance with requirements

of Zhaga book 12

APPLICATIONS• Digital cameras• Displays• Digital video recorders• Car navigation systems• Access control units• Measurement devices• Set-top boxes• Portable devices

FEATURES• Contact positions: 2 to 20 (in most sizes)• 0.8mm contact pitch• 2.5A maximum current rating• 100V AC/DC voltage rating• 20 mating cycles• Cable size range: AWG 28 to 32

APPLICATIONS• Elevators and escalators• HVAC equipment• Smart meters• Lighting controls • Building management equipment• Solar power generation appliances• Security equipment• Access control devices• Fire detectors and alarms

FEATURES• PE relay is only 10mm high• PCN relay is only 5mm wide• Mono-stable (non-latching) and bi-stable

(latching) relays available• AC or DC coils

feature a copper alloy spring, pivot and terminal. The contacts are either gold-plated or silver alloy. The switches are available in a range of temperature ratings up to a maximum operating temperature of 120°C.

The ZMS series of IP65-sealed snap-acting switches offer a long electrical life of 100,000 cycles when switching 3A at 12V DC. Mechanical life is 500,000 cycles. The switches’ operating-temperature range is -40°C to 85°C.

This allows multiple fixtures to be powered from a single power supply.

A 0V to 10V dimming option is an optional feature in the Z50 LED holder.

C&K switches: Sealed housing protects against corrosion

LUMAWISE LED holder: Compatible with readily available power supplies

10


171117 For samples or pricing [email protected] 171119 For samples or pricing e-mail

[email protected]


C O M P O N E N T F O C U SC O M P O N E N T F O C U S

TE Connectivity and TE connectivity (logo) are trademarks.

LUMAWISE, TE Connectivity and TE connectivity (logo) are trademarks.

D E S I G N N O T E


Fig. 2: An isolated synchronous buck converter generating two outputs


Generating isolated supplies for industrial applications using a synchronous buck regulator in an isolated buck topology

Industrial power applications typically require a high input voltage. Standard voltage rails are 24V, 36V and 48V. The DC-DC buck switching regulators and controllers used to power the circuits in industrial applications are required to provide solid, reliable performance and to withstand the effects of noise, power surges and outages.

It is common for the power-supply requirements in industrial systems to be complex. Galvanic isolation is often needed to meet safety standards, as well as to break ground-loop interference in noise-sensitive applications. For example, in factory-automation systems such as PLCs and I/O modules, an increasing number of I/O channels leads to a requirement for higher sensing accuracy. As a result, isolation between different voltages is preferred, providing for digital/analogue signal isolation, or channel-to-channel isolation to block interference from a common ground, as shown in Fig. 1.

The traditional way to provide such an isolated supply would be to use a flyback converter operating from the main supply to generate the various voltages needed by the bias supply. Flyback designs typically use asymmetric transformer turn ratios for the primary and secondary windings, together with an optocoupler and reference voltage, or an auxiliary winding, for feedback regulation.

Flyback converters need an elaborate compensation design for stability. This entails a tedious design process and produces a bulky circuit with a high component count and cost.

There is, however, a simpler way to provide an isolated power supply at the voltage levels required in industrial equipment, without the use of a flyback topology.

Isolated buck converter topologyAn isolated buck converter uses a synchronous buck converter with coupled inductor windings to create isolated outputs, as shown in Fig. 2. Isolated converters in this topology use a smaller transformer for a given power requirement when compared to a flyback converter, as the transformer’s primary and secondary turn ratios are better matched. There is also no need for an optocoupler or auxiliary winding, as the secondary output closely tracks the primary regulated output voltage, resulting in a smaller circuit and lower cost.

VISHAY

Fig. 1: Typical architecture of the power supply of industrial equipment carrying digital and analogue signals

Socket provides tailor-made connection for latest DDR4 DRAM modules

A range of memory sockets from TE Connectivity (TE) is intended to carry JEDEC standard Small Outline Dual Inline Memory Modules (SO DIMMs) for the latest DDR4 DRAM memory devices, as well as previous DDR3, DDR2, DDR and SDRAM modules.

They enable reliable interconnection to standard memory modules in computing and communication server applications. Providing 260 pins, the DDR4 SO DIMM sockets are rated for a maximum voltage of 25V AC, and a maximum current of 0.5A.

TE CONNECTIVITY

APPLICATIONS• Routers and network switches• Base-stations • Servers • Industrial equipment • Instrumentation

FEATURES• Gold-plating options• Multiple height options to enable stacking

to save space• Zero insertion force for easy module

insertion• Two key types: standard and reverse key

position to prevent erroneous insertion• Latch floating helps ensure co-planarity

and easy soldering• Up to 25 mating cycles

All sockets provide latches for module retention, and mechanical voltage keying. They are offered in both standard and reverse positions. These new TE sockets accept the new DDR4 single-sided SO DIMM modules.

These sockets help to ensure reliable connections and help equipment designers to provide for optimum functionality, speed and usability.

SO DIMM connectors: Available in standard and reverse positions



Thick-film chip resistors withstand operation in presence of atmospheric sulphur

Vishay Intertechnology has introduced a new series of thick-film chip resistors for automotive and industrial applications which offer a combination of excellent resistance to atmospheric sulphur with high power and pulse-load performance.

The RCA-HP e3 series of resistors has a special robust construction which provides an ability to withstand concentrations of sulphur in saturated vapour form in accordance with the ASTM B809-95 standard. Sulphur resistance is verified through accelerated testing at 90°C for 1,000 hours.

In addition, the resistors can handle high and repetitive pulses, and support power dissipation of as much as 1.5W.

The RCA-HP e3 series resistors are available in eight case sizes ranging from 0402 to

2512. The devices offer resistance values ranging from 1Ω to 1MΩ, with tolerances of ±1% and ±5%. The devices are specified with a thermal coefficient of resistance of ±100ppm/K or ±200ppm/K.

All the resistors feature double-sided printed resistor elements with a protective coating, apart from the RCA0402-HP e3 which is single-sided. The devices have pure tin plating, which provides compatibility with lead-free and lead-containing soldering processes.

VISHAY

APPLICATIONS• Automotive systems• Industrial equipment • Commercial applications

FEATURES• AEC-Q200 qualified• 155°C maximum film temperature• Operating-temperature range:

-55°C to 155°C

RCA-HP e3 resistors: Rated for power dissipation up to 1.5W


F O L L O W U S N O W – S E A R C H F T M B O A R D C L U B O N12

This topology has several advantages, including:• Isolated positive and negative supplies are easy to generate• The primary-side supply is available to power loads that do not require

isolation from the input• The design is simpler than that of a traditional flyback converter• The circuit contains fewer components and is smaller than that of a

flyback converter

An isolated buck converter circuit can be made with a part from the SiC46x series of fully integrated synchronous buck regulators from Vishay. These devices, which are featured on page 5, offer high power-conversion efficiency and high power density with low electrical parasitics, a characteristic of their excellent silicon and of Vishay’s advanced packaging design techniques.

The SiC46x parts can operate from an input-voltage range of 4.5V to 60V, which makes them suitable for industrial power supplies running from a distribution bus at up to 48V. Users also benefit from features such

as multiple power-saving modes for operation at very low output current, adjustable operating frequency, fast transient response, cycle-by-cycle current limiting, and a comprehensive set of protection features. The SiC46x regulators use an all-ceramic capacitor solution for both input and output capacitance.

ConclusionPLCs and I/O module power-supply designs have become complex, since they are required to provide multiple isolated voltages, floating bias voltages, and negative output voltages. Required to supply various isolated rails for gate drivers, op amps and communication interfaces such as RS-485 and RS-232, designers can adopt the isolated buck converter topology in place of the traditional flyback converter and benefit from a lower component count, smaller PCB, a compact, low-profile system and a simpler design.

Part Number Case Size

Power Rating

P70 (W)Operating Voltage (V)

RCA0402-HP e3 0402 0.2 50

RCA0603-HP e3 0603 0.25 75

RCA0805-HP e3 0805 0.5 150

RCA1206-HP e3 1206 0.75 200

RCA1210-HP e3 1210 0.75 200

RCA1218-HP e3 1218 1.5 200

RCA2010-HP e3 2010 1.0 400

RCA2512-HP e3 2512 1.5 500

TE Connectivity and TE connectivity (logo) are trademarks.

A P P L I C A T I O N S P O T L I G H T


Integrated Bluetooth 4.2 module with MCU core supports stand-alone operation

Complete Wi-Fi module includes TCP/IP and security protocol firmware

Cypress Semiconductor has introduced the CYBT-343026-01, a fully integrated Bluetooth® Smart Ready wireless module based on the Cypress CYW20706 Bluetooth radio IC.

The SPWF04SA and SPWF04SC from STMicroelectronics are ready-to-use Wi-Fi® radio modules intended for use in IoT applications.

Conforming to the specifications of the Bluetooth 4.2 standard, the CYBT-343026-01 EZ-BT™ module is supplied with a royalty-free Bluetooth Low Energy stack. It features an ARM® Cortex®-M3 microcontroller core for stand-alone operation without an external host controller.

The module includes a crystal oscillator, passive components, 512kbytes of serial Flash memory and a power amplifier which enables it to achieve Class I or Class II output power capability. It supports peripheral functions including an ADC and four PWMs, provides UART, I2C and serial peripheral interfaces, and offers a Bluetooth audio channel. It also includes up to 11 GPIOs.

The module is supported by the Cypress Wireless Connectivity for Embedded Devices (WICED) software development platform,

The modules include an ARM® Cortex®-M4-based STM32F4 microcontroller and a powerful 2.4GHz Wi-Fi transceiver which complies with the IEEE 802.11b/g/n standard.

The modules provide a ready-made interface to cloud computing services, since they are supplied with a complete set of TCP/IP protocol firmware, including application and security layers. They can operate in serial-to-Wi-Fi and stand-alone modes.

The modules are configured around a single-chip 802.11 transceiver with integrated power amplifier and comprehensive power-management sub-system, and the STM32F4 MCU with UART/serial peripheral interface and an extensive GPIO suite. They also incorporate timing clocks and a voltage regulator.

CYPRESS SEMICONDUCTOR

STMICROELECTRONICS

which includes a software development kit and an Eclipse-based integrated development environment.

The CYBT-343026-01 is fully qualified by the Bluetooth Special Interest Group, which validates manufacturers’ Bluetooth compliance test results. It is housed in a 12.0mm × 15.5mm × 2.0mm package. In addition, the CYBT-343026-01 module includes regulatory certification for FCC (USA), ISED (Canada), CE (Europe), and MIC (Japan).

The SPWF04SA module includes an embedded 2.4GHz antenna; the SPWF04SC provides an interface to an external u.FL antenna. Both models are FCC/IC and CE certified.

The modules’ integrated software package includes an AT command-layer interface for user-friendly access to stack functions via the UART serial port.

The SPWF04Sx modules feature a MicroPython scripting engine to enable simple and fast custom application development on the internal MCU.

CYBT-343026-01: Royalty-free BLE stack

ST’s Wi-Fi module: Provides AT command interface

14

APPLICATIONS• Medical devices• Industrial systems• PC accessories• Toys• Remote controls• Gaming controllers• Beacons

FEATURES• 12dBm maximum Transmit power in

Classic Bluetooth mode• Receive sensitivity:

• -93.5dBm in Classic Bluetooth mode • -96.5dBm in Bluetooth Low Energy

mode• 16-bit delta-sigma ADC• Castellated solder pad connections • Operating-temperature range:

-30°C to 85°C

APPLICATIONS• IoT devices

FEATURES• Supports HTTP, MQTT, SMTP and

WebSockets high-level protocols • SSL/TLS security stack• Supports WPA2-Personal and WPA2-

Enterprise security and Wi-Fi Protected Set-up (WPS)

• IPv6 networking capabilities• 27mm x 15mm footprint



C O N N E C T I V I T Y


New Bluetooth Low Energy radio module offers class-leading low power consumption

Sub-1GHz transceiver module enables easy integration of SPIRIT1 transceiver

The SPSGRFC from STMicroelectronics is a series of easy-to-use, low-power RF modules based on ST’s SPIRIT1 RF transceiver operating in license-free bandwidth at frequencies below 1GHz. Offering many programmable features, each module provides a complete RF platform in a tiny 11.5mm x 13.5mm x 2.0mm form factor.

Panasonic Industry Europe’s new PAN1760A is a Bluetooth® radio module which offers very low power consumption when transmitting or receiving Bluetooth Low Energy signals.

The series includes three parts, the SPSGRFC-433, SPSGRFC-868 and SPSGRFC-915, operating at 433MHz, 868MHz or 915MHz. The SPSGRFC RF module is CE, FCC and IC certified and enables the integration of wireless connectivity in electronic devices without requiring specialist RF experience or expertise.

The modules implement various signal modulation schemes: Frequency Shift Keying (FSK), Gaussian FSK, Minimum Shift Keying

The module features peak power consumption of only 3.3mA in Transmit and Receive mode. Its low power consumption enables sophisticated Bluetooth capabilities to be built into embedded devices without compromising battery life.

The surface-mount PAN1760A module, which measures 15.6mm x 8.7mm x 1.9mm, conforms to the specifications of the Bluetooth 4.2 standard, and is supplied with a Bluetooth Low Energy protocol stack.

The PAN1760A product can either be operated in AT command or Host mode for simple integration of Bluetooth connectivity into existing products that have a microcontroller, or in stand-alone mode.

STMICROELECTRONICS

PANASONIC

(MSK), Gaussian MSK, On-Off Keying (OOK) and Amplitude Shift Keying (ASK). They include a u.FL connector to an external antenna.

The SPSGRFC is pin- and firmware-compatible with the earlier SPSGRF family. It is rated for operation over a temperature range of -40°C to 85°C.

In stand-alone mode, the PAN1760A’s 256kbytes of Flash memory, 83kbytes of RAM and ARM® Cortex®-M0 microcontroller core are available for the user application. This means that the PAN1760A can be used in many designs without the need for an external processor, saving cost and space and reducing complexity.

The new PAN1760A also supports easy migration from earlier Panasonic Bluetooth modules such as the PAN1760, the PAN1761, and the PAN1026. All versions share the same footprint. In addition, the amount of new code required when migrating from the PAN1026 or PAN1760 is very small. Previously developed Bluetooth Low Energy profiles and applications can also easily be transferred to the PAN1760A.

SPSGRFC: Full set of regulatory approvals

PAN1760A: Can operate in stand-alone mode

15

APPLICATIONS• Automatic meter reading• Home and building automation • Wireless sensor networks• Industrial monitoring and control • Wireless fire and security alarm systems • Point-to-point wireless links• 6LoWPAN MESH networks• Wireless M-Bus devices

FEATURES• Data rates up to 500kbits/s• -118dBm receiver sensitivity• Programmable output power up to

11.6dBm• Serial peripheral interface• Up to 32 programmable I/O functions on

four programmable module pins

APPLICATIONS• IoT devices• Medical equipment• Industrial systems

FEATURES• 26MHz crystal• Chip antenna• -93dBm receiver sensitivity• 0dBm maximum Transmit power• Two UART interfaces• SPI and I2C interfaces• Four PWM outputs• ADC




The X-NUCLEO-IDW04A1 Wi-Fi evaluation board features the SPWF04SA module, is compatible with STM32 Nucleo boards, and is equipped with both an Arduino® UNO R3 and an optional ST morpho connector. Orderable Part Number: X-NUCLEO-IDW04A1



Launch of industry’s first LTE-Advanced Pro embedded cellular modules

ESD diodes protect very sensitive high-speed interfaces

Sierra Wireless has announced the industry’s first global LTE-Advanced Pro cellular modules, enabling the world’s fastest IoT applications for mobile computing, networking and industrial Machine-to-Machine (M2M) communications systems.

Nexperia has introduced the TrEOS series of diodes which provide ESD protection for very sensitive high-speed interfaces such as USB3.1 and HDMI lines.

The new AirPrime® EM75 series, which includes satellite positioning and embedded SIM (eSIM) capability, provides global 4G coverage on a single module with an uplink speed twice as fast as that of any other solution on the market.

The EM75 modules also support unlicensed LTE-LAA bands for an additional speed boost, 3.5GHz local private networks, and public safety networks such as FirstNet™.

Use cases such as high-definition video streaming, augmented reality and virtual reality, and a range of industrial, public-safety and military applications which require high uplink and downlink speeds will benefit from the deployment of LTE-A Pro embedded modules.

The TrEOS family from Nexperia includes single- and multi-line devices. The technology provides the ideal combination of low capacitance, low clamping voltage and high ESD robustness.

SIERRA WIRELESS

NEXPERIA

The EM75 series will enable public safety band 14 for FirstNet in the U.S. and bands 20 and 28 for public safety LTE networks in Europe. In addition, support for 3.5GHz private LTE networks such as CBRS will enable new IoT use cases including: • Secure communication and system tools on

field workers’ devices • Industrial IoT applications in remote mining

and farming sites • Streaming video applications at stadiums or

outdoor sport events

In addition, access to 5GHz unlicensed bands (LTE-LAA) will provide network operators with better spectrum utilisation resulting in higher data speeds and a more consistent user experience.

The series’ EM7565 module, which is supplied in the PCI Express M.2 form factor, offers support for carrier aggregation and 256 QAM modulation, dramatically improving network performance. The modules provide global LTE coverage on 24 LTE bands with the most carrier certifications in the industry, so businesses can use one module for global 4G networks, simplifying manufacturing and inventory management.

Offering diode capacitance ratings as low as 0.10pF, these Nexperia devices are suitable for use with SuperSpeed USB channels operating at data-transfer rates of up to 10Gbits/s.

Nexperia TrEOS diodes: Very low capacitance

16

APPLICATIONS• Routers• Drones• Robots• Interactive digital billboards• Vehicles• Internet hotspots• Outdoor machinery • Industrial equipment

FEATURES• LTE and 3G HSPA+ connectivity• 600Mbits/s peak download rate• 150Mbits/s peak upload rate• Secure boot• USB3.0 and Hi-Speed USB2.0 interfaces• PCIe interface• 1.8V/3V SIM interface• CE, FCC, GCF, IC, NCC and PTCRB

certifications• Free firmware over-the-air updates

APPLICATIONS• Ultra high-speed data lines • Interface lines with very sensitive I/Os • Generic ESD protection across the board

FEATURES• Ultra-low dynamic resistance as low as

0.10Ω • Deep snap-back technology • Extremely low clamping voltages

• ESD capability exceeds requirement of IEC 61000-4-2, level 4 standard

• Up to 9A surge current capability in accordance with IEC 6100-4-5 standard

• Flexible package options





USB Type-C controller provides integrated USB Power Delivery functions

The STUSB1602 is a USB Type-C™ controller which implements port management on the host and/or device side, and is suited to a broad range of applications.

The STUSB1602 can handle all USB-C controller functions, including: • attach detection• plug orientation detection• host-to-device connection• connector voltage support• supply voltage configuration

It also provides a line driver for USB Power Delivery (PD) Transmit and Receive signals, and

a Biphase Mark Coding (BMC) transceiver, which provides for USB PD negotiation and alternative-mode operation through an external microcontroller.

The STUSB1602 is compliant with the USB Type-C standard revision 1.2 and the USB PD standard revision 2.0. It is compatible with version 3.0 of the USB PD standard.

STMICROELECTRONICS

STUSB1602: Integrated BMC transceiver

17

APPLICATIONS• Smart plugs, wall power adapters and

chargers • Power hubs and docking stations • Gaming devices • Displays • Cameras, camcorders and media players • Any USB Type-C source or sink device

FEATURES• Configurable start-up profiles• Integrated power switch for connector

voltage supply• Support for dead battery operation• I2C interface and interrupt• Integrated supply-voltage monitoring



Part Number Package Version Size (mm) Protected

Lines Configuration Typical Diode Capacitance (pF)

Maximum Diode Capacitance (pF)

Maximum Reverse Withstand Voltage (V)

Maximum ESD Capability (kV)

Maximum Reverse Current (µA)

PESD3V3C1BSF SOD962-2 0.6 x 0.3 x 0.3 1 Bi-directional 0.2 0.25 3.3 20 0.05PESD5V0C1BSF SOD962-2 0.6 x 0.3 x 0.3 1 Bi-directional 0.2 0.25 5 20 0.05PESD5V0C1USF SOD962-2 0.6 x 0.3 x 0.3 1 Uni-directional 0.45 0.5 5 20 0.05PESD5V0H1BSF SOD962-2 0.6 x 0.3 x 0.3 1 Bi-directional 0.15 0.2 5 15 0.05PESD5V0R1BSF SOD962-2 0.6 x 0.3 x 0.3 1 Bi-directional 0.1 0.15 5 10 0.05PUSB3AB4 SOT1176-1 2.5 x 1 x 0.5 4 Bi-directional 0.17 0.2 5 15 0.1PUSB3AB6 SOT1358-1 1.1 x 2.1 x 0.5 – Bi-directional 0.15 – – 15 –PUSB3FR4 SOT1176-1 2.5 x 1 x 0.5 – Uni-directional 0.29 – – 15 –PUSB3FR6 SOT1358-1 1.1 x 2.1 x 0.5 – Uni-directional 0.35 – – 15 –


The P-NUCLEO-USB002 kit allows designers to explore the performance of the STM32F072 32-bit MCU and two STUSB1602 USB Type-C port controllers, for developing applications which manage one or two USB Type-C ports. Orderable Part Number: P-NUCLEO-USB002



Enhanced balun with integrated harmonic filter for use with BlueNRG transceivers

ESD protection diodes optimised for protection of NFC interfaces

STMicroelectronics’ BALF-NRG-02D3 ultraminiature balun integrates a matching network with a harmonics filter in a single chip.

Nexperia offers a series of ultra-low capacitance, bi-directional ESD protection diodes which safeguard devices containing an NFC interface from damage caused by ESD strikes and other transient voltage events.

The matching impedance of the device is optimised for the BlueNRG series of Bluetooth® Low Energy (BLE) systems-on-chip, both the BlueNRG-1, and the more recent BlueNRG-2.

These devices are intended for use in space-constrained designs, such as consumer mobile products, in which an NFC antenna is integrated into the host product’s battery or battery cover. This provides an entry point for ESD strikes which could damage the NFC controller IC.

The PESD24VF1BSF and PESD24VF1BL have a maximum reverse stand-off voltage of 24V. The PESD18VF1BSF and PESD18VF1BL have an 18V rating.

The PESD24VF1BSF and PESD18VF1BSF are housed in a DSN0603-2 package measuring 0.6mm x 0.3mm x 0.3mm. The PESD24VF1BL and PESD18VF1BL are in a DFN1006-2 package with a 1.0mm x 0.6mm x 0.5mm outline.

STMICROELECTRONICS

NEXPERIA

By integrating both the matching network and filter in a single component, ST reduces the complexity of the RF circuit, and provides an optimised link budget in a footprint of less than 1.2mm². Its non-conductive glass substrate offers low dispersion over temperature, achieving superior performance to currently available products.

The device is housed in a four-bump, chip-scale package on glass measuring 1.4mm x 0.9mm.

Each diode protects one signal line from an ESD contact discharge of up to ±10kV, a rating which is consistent with the provisions of the IEC 61000-4-2 standard. The devices’ low capacitance helps to make it easy to design the NFC antenna-matching circuit. In the smaller PESD18VF1BSF and PESD24VF1BSF diodes, maximum diode capacitance is 0.45pF.

In addition, there is a very small voltage dependency of the diode capacitance, avoiding intermodulation distortion.

BALF-NRG-02D3: Footprint less than 1.2mm2

Nexperia ESD diodes: 10kV of protection

18

APPLICATIONS• Systems with Bluetooth connectivity

FEATURES• 50Ω nominal input/conjugate match to

BlueNRG devices • Low insertion loss • Low amplitude imbalance • Low phase imbalance

APPLICATIONS• NFC antenna protection• Protection of high-speed and standard

data lines with high signal levels

FEATURES• 1A maximum peak pulse current• Junction-temperature range:

-45°C to 125°C• 1nA reverse leakage current





Bluetooth Low Energy SoC includes embedded microcontroller

Waterproof micro USB connector has IPx7 rating

CUI’s Interconnect Group has released the UJ2W-MIBH-4-SMT, a waterproof micro USB2.0 Type-B jack connector which has an IP rating of IPx7, offering protection from liquid and moisture in challenging environments.

The new BlueNRG-2 from STMicroelectronics is a very low-power Bluetooth® Low Energy (BLE) System-on-Chip (SoC), offering a wider range of features than the earlier BlueNRG network processor. The SoC complies with the specifications of the Bluetooth 4.2 standard.

Thanks to its copper-alloy contact terminals with 30µinch gold-over-nickel plating and stainless steel shielding, the UJ2W-MIBH-4-SMT offers high durability over a rated lifetime of 10,000 mating cycles. The connector is housed in a surface-mount package with a horizontal orientation. It has a voltage rating of 30V AC, a current rating of 1.8A, and an operating temperature range of -25°C to 85°C. Plastic mounting ears are also included to provide added stability on the board.

In particular, the BlueNRG-2 enables the use of an embedded ARM® Cortex®-M0 processor core for running user application code.

The BlueNRG-2 includes 256kbytes of programming Flash memory and 24kbytes of static RAM memory with retention. UART, I²C and serial peripheral interfaces provide for off-chip communication. The SoC also features multi-function timers, a watchdog timer, a real-time clock and DMA controller.

CUI INC

STMICROELECTRONICS

Complying with the USB2.0 standard, the UJ2W-MIBH-4-SMT allows for high-speed data and power transmission, making it well-suited for a variety of I/O applications in consumer and portable electronic devices that may be used in outdoor environments.

A 10-bit ADC is available for interfacing with analogue sensors, and for reading the measurements of the integrated battery monitor. A digital filter can process a PDM stream.

The BlueNRG-2 offers the same excellent RF performance with which users of the BlueNRG radio will be familiar. Its integrated high-efficiency DC-DC converter keeps the same ultra low-power characteristics, but the BlueNRG-2 draws a lower sleep-mode current than the BlueNRG, to extend battery run-times.

UJ2W-MIBH-4-SMT: Plastic mounting ears provide added stability

19

APPLICATIONS• Mobile computing equipment• Digital audio devices• Camcorders • GPS units

FEATURES• 30mΩ contact resistance• 100MΩ insulation resistance• 35N maximum insertion force• 8N minimum withdrawal force• UL94V-0 flammability rating

APPLICATIONS• Fitness, wellness and sports equipment • Consumer medical devices• Security systems• Remote controls • Home and industrial automation • Lighting • PC peripherals

FEATURES• Supply-voltage range: 1.7V to 3.6V• Operating-temperature range:

-40°C to 105°C• 14, 15 or 26 GPIOs• Battery voltage monitor• Up to 8dBm Transmit power at antenna

connector• Up to 96dB RF link budget• 8.3mA Transmit current at -2dBm, 3.0V




Orderable Part Number: STEVAL-IDB008V1

APPLICATIONS• Asset tracking• Energy management• Fitness monitors• Lighting controls• HVAC equipment • Portable controls• Security equipment• Building automation

FEATURES• Indicator LEDs• Two user buttons• Temperature sensor• 8Mbit serial Flash memory IC




Reader IC supports all the main RFID protocols

Common mode filters with integrated ESD protection for USB, HDMI and MIPI lines

STMicroelectronics’ ST25RU3993 is an RFID reader IC which implements all the relevant protocols, including ISO 18000-6C (the EPC Class1 Gen2 standard), the ISO 29143 air-interface protocol for mobile RFID interrogators, and ISO 18000-6A/B for operation in direct mode.

Nexperia’s new common-mode filters with integrated TrEOS ESD protection help designers to create unbroken communications links and to prevent EMI disturbance between high-speed wired communications standards and popular wireless systems such as LTE, Wi-Fi® or Bluetooth® radios.

It includes an on-chip oscillator and a power amplifier, and offers a complete set of RFID features including Dense Reader Mode (DRM) functionality and support for frequency hopping, low-level transmission coding, low-level decode, data framing and cyclic redundancy checking.

The filter devices are particularly suitable for use with high-speed USB3.1, HDMI2.0 or MIPI wired interfaces.

The Nexperia devices offer a wider differential pass-band than other silicon-based solutions and than ferrite-based products. In addition, they have a lower ESD clamping voltage than any other common-mode filters.

The integrated ESD capability provides more than 15kV of protection against system-level ESD strikes.

STMICROELECTRONICS

NEXPERIA

The ST25RU3993 operates at very low power, making it suitable for use in portable and battery-powered equipment.

Housed in a 7mm x 7mm QFN package, the ST25RU3993 offers very high sensitivity and provides high immunity against the effects of antenna reflection and self-jamming. This is crucial in mobile and embedded applications,

in which antenna design is often compromised by cost or size constraints. High sensitivity enables end-products to achieve the required read range while using a simpler and cheaper antenna, thus reducing overall system cost.

Thanks to its high level of integration, the ST25RU3993 requires only an external 8-bit

microcontroller to create a complete RFID reader system, eliminating the need for a complex RFID co-processor.

This is enough even for the most sensitive USB 3.1 transceivers. The Nexperia products also offer strong common-mode noise rejection for the USB3.1 fundamentals at 2.5GHz and 5GHz.

With the introduction of these products, Nexperia provides a solution for common-mode filtering and stand-alone ESD protection in the same footprint, which allows for last-minute changes to PCB designs for maximum flexibility and shorter design cycles.

Devices with combined common-mode filtering and ESD capability include: PCMF1USB3S Protects one line pair PCMF1HDMI2S Protects one line pairPCMF2HDMI2S Protects two line pairsPCMF3USB3S Protects three line pairs PCMF3HDMI2S Protects three line pairs

Nexperia: Wide differential pass-band

20

APPLICATIONS• RFID readers

FEATURES• Integrated supply regulators • Support for frequency hopping • Amplitude Shift Keying (ASK) or PR-ASK

modulation • Phase bit for tag tracking with 8-bit linear

RSSI • Operating-temperature range:

-40°C to 85°C

APPLICATIONS• Protection of USB, HDMI and MIPI lines

FEATURES• Convenient RF routing for USB Type-C™

connectors• Integration of filters with ESD protection

saves space• 0.3pF diode capacitance




To apply for these free boards go to: www.my-boardclub.com/ftmTerms and conditions apply. Visit www.my-boardclub.com/about_us for details

IoT reference design board provides Wi-Fi and Bluetooth connections to the cloud

The SPBTLE-1S from STMicroelectronics is an easy-to-use Bluetooth® Low Energy processor module which complies with the Bluetooth 4.2 standard specification. The device supports multiple roles simultaneously, and can act at the same time as a Bluetooth Smart master and slave.

Future Electronics has developed the Nebula IoT cloud-ready board based on Cypress Semiconductor wireless communications technology. It enables system designers to quickly create IoT device prototypes and deploy IoT ecosystems.

Based on the BlueNRG-1 system-on-chip, the SPBTLE-1S module provides a complete RF platform in a tiny form factor. As well as the radio and a chip antenna, the module includes an ARM® Cortex®-M0 microcontroller core backed by 160kbytes of Flash and 24kbytes of RAM. A comprehensive Bluetooth Low Energy protocol stack is embedded in the module.

Wireless connectivity is provided by a Murata 1DX module, which features the Cypress CYW4343W, a chipset containing Wi-Fi®, Bluetooth® Low Energy and Bluetooth Classic radios. The Bluetooth radio conforms to the 4.2 version of the standard, including the Enhanced Data Rate (EDR) feature.

The board also includes STMicroelectronics’ STM32F429, a microcontroller based on an ARM® Cortex®-M4 core, and offering 2Mbytes of Flash and up to 256kbytes of SRAM.

The Nebula board supports application development through Cypress’ WICED (Wireless Internet Connectivity for Embedded Devices) platform. WICED is the only software development kit to combine support for wireless, MCUs and memory in a single Eclipse-based Integrated Development Environment (IDE) running on a Windows, OS X or Linux operating system.

Future Electronics’ Board Club: supporting innovative electronics designEurope’s electronics industry thrives on the application of innovation and creativity, and an essential innovator’s tool in design projects is the development board. The Board Club website is a Future Electronics resource for users of development boards. Here, and only here, Board Club members can gain access to exclusive free development boards and development board offers.If you would like to register for membership, please visit: www.my-boardclub.com/register.php

STMICROELECTRONICS

CYPRESS SEMICONDUCTOR

It also includes high-frequency and low-power oscillators, helping accelerate the time-to-market of the final application. The module has certifications including CE marking and FCC and IC approvals.

The SPBTLE-1S may be powered directly by a pair of AAA batteries, or by any power source from 1.7V to 3.6V.

Nebula board: Four interfaces for add-on boards

21

RF module provides ready-to-use implementation of a Bluetooth Low Energy master or slave

APPLICATIONS• Fitness, wellness and sports equipment• Consumer medical devices• Security/proximity monitors• Remote controls• Home and industrial automation• Assisted living• Mobile phone peripherals• PC peripherals

FEATURES• 5dBm maximum Transmit power • AES security co-processor• 13.5mm x 11.5mm footprint, 2mm high• Operating temperature range:

-40°C to 85°C



Orderable Part Number: NEB1DX-01

The board is equipped with four different interfaces for accessing the STM32F429’s peripherals:• Arduino Shield • mikroBUS™ socket• Pmod connector/interface • USB

The Nebula board provides for the user to connect a wide variety of standard add-on boards via these connectors. These add-on boards are intended for use in specific applications such as motor control, sensors and wireless connectivity.


The STEVAL-IDB007V1M evaluation platform is based on the SPBTLE-1S module. It provides a set of peripheral hardware resources including accelerometer, pressure sensor and temperature sensor, user buttons and LEDs and debug message management via USB. Orderable Part Number: STEVAL-IDB007V1M

Fig. 2: Laird’s RM1 LoRa module

Fig. 3: MultiTech’s MultiConnect® Conduit™ LoRaWAN gateway

For the past few years, Machine-to-Machine (M2M) and Internet of Things (IoT) applications have relied on 2G and 3G cellular telephone networks for wide-area connectivity. Consumer demand for high-speed broadband coverage on the smartphone has led network providers to supplement these older protocols with the new high-bandwidth 4G, also called LTE, technology. While LTE networks provide an excellent service for consumers who wish to stream high-quality video on the move and who are prepared to pay a premium for it, M2M users need a different, price-sensitive network for their low-power, low data-rate, long-range applications.

By Matt RoseWireless Specialist, Future Connectivity Solutions

This means that an opportunity has arisen for dedicated Low-Power Wide-Area Networks (LPWANs) to fill the void. There are many contenders in this space, but two network technologies have taken a lead: LoRaWAN™, and Narrowband-IoT (NB-IoT), a cellular LTE technology developed by the 3GPP industry consortium which also defines the 3G and LTE network standards.

There are distinct differences between the performance and features of these two competing standards. Is there room for both of them in the market, and is one more likely to take more market share?

Competitor 1: LoRaWANLoRaWAN is an LPWAN specification intended for 900MHz wireless sensor nodes in local private networks or in regional and nationwide public networks. The protocol provides interoperability among nodes without the need for complex local installations. The network architecture is laid out in a star topology, in which gateways relay messages between sensor nodes, network servers and application servers.

The LoRaWAN gateway is connected to the network server by way of Ethernet, cellular or WLAN (Wi-Fi®) routers, while sensor nodes use chirp modulation to connect to the gateways, as shown in Figure 1. The span between a node and a gateway can stretch to many miles. The LoRaWAN air protocol uses different frequency channels and data rates, and uses wideband linear frequency-modulated pulses (chirps), the frequency of which increases or decreases over a certain period of time to encode information.

The protocol’s maximum data rate ranges from 0.3kbits/s to 50kbits/s. To maximise the battery life of sensor nodes and to make the best use of network capacity, the network server uses an adaptive data rate to manage the effective data rate and the RF output for each node.

LoRaWAN has three classes of end-point devices to address different applications. It implements several layers of encryption, including a network-level unique network key (EUI64), an application-level unique application key (EUI64), and a device-specific key (EUI128) at the node level.

Class A devices have bi-directional communications: one transmission is followed by two receive slots. This is the lowest-power option and would typically be used in a Smart City application.

Class B devices are similar, but have an option for additionally scheduled receive slots. This option means the server can be notified when the end node is receiving. A typical use case would be an automatic irrigation system.

Class C nodes transmit periodically, but are otherwise in receive mode. Typically they would be used in a smart street-lighting application.

Modules for implementing a LoRa sensor node are available from Microchip, Murata, MultiTech and Laird, as shown in Figure 2. LoRaWAN gateways are available from MultiTech, as shown in Figure 3.

Public LoRaWAN networks are now in operation in parts of Europe and North America. Information about LoRaWAN network installations can be found via the LoRa Alliance™, a consortium of hundreds of technology companies and network service providers which promotes and regulates the LoRaWAN standard (www.lora-alliance.org).

Competitor 2: NB-IoT on LTE networksLTE technology is notably different from previous generations of cellular networks with regard to carrier frequency and bandwidth, as shown in Figure 4. A number of 4G LTE bands are specified by the standard, and they vary depending on country as well as carrier.

These licensed spectrums are split into Frequency Division Duplexing (FDD) and Time Division Duplexing (TDD) types where the FDD spectrum requires pair bands, one for uplink and one for downlink, and the TDD uses a single band as uplink and downlink on the same frequency but separated in time.

Fig. 1: LoRaWAN network topology

T E C H N I C A L V I E W

F O L L O W U S N O W – S E A R C H F T M B O A R D C L U B O N22

READ THIS ARTICLE TO FIND OUT ABOUT:

• The ways that the LoRa and the cellular NB-IoT low-power wide-area networking technologies work

• The differences in data rate, power consumption, range and cost between the two technologies

• The parameters by which OEMs should decide which LPWAN technology to use

T E C H N I C A L V I E W


Some 31 pairs of LTE bands operate at frequencies between 452MHz and 3.6GHz, and an additional 12 TDD bands are between 703MHz and 3.8GHz. The higher frequencies allow for faster transmission in urban areas, while lower frequencies offer additional range but less bandwidth in rural areas. These bands typically offer between 10MHz and 20MHz of bandwidth for data transfer, although they can be split up into smaller 1.4MHz, 3.0MHz and 5.0MHz bands.

As its name suggests, a Narrowband-IoT network uses smaller, 200kHz bands. Maximum Transmit power is 23dBm, and the maximum data rate on an NB-IoT link is 200kbits/s.

One of the advantages of NB-IoT is that it operates within a licensed spectrum, which means that it provides a secure and established public network for use by IoT businesses, without the risk of interference or jamming to which the LoRaWAN unlicensed frequency bands are exposed.

What is more, NB-IoT technology was developed specifically for use by IoT applications that have low data usage and by devices which require long battery lifetimes. In Europe, network carrier Vodafone has been taking the lead in NB-IoT network deployment: it has clearly calculated that the technology allows it to extend usage of its LTE network infrastructure by providing cost-effective support for low data-rate applications, such as sensing and monitoring devices.

Head-to-head comparisonThe choice between using a LoRaWAN or an NB-IoT network for a particular application can involve the consideration of many parameters. The first thing to consider is whether public infrastructure is available in the area in which the application’s nodes are to operate. If an application is to run in an urban or suburban area which already has good LTE network coverage, then support for NB-IoT service might be relatively easy to secure.

Conversely, in tightly defined areas of operation such as a university campus, or in remote rural areas with no LTE coverage, a quicker or more cost-effective option might be to install a private LoRaWAN network. Even if there is LTE coverage available, the business case might still favour LoRaWAN: it is a matter of balancing capital expenditure against operational expenditure. There is an upfront cost to installing a private LoRaWAN network, but once in place it is normally cheap to run and is free of subscription fees. This requires the private network owner to have the skills and resources to perform network commissioning and management.

By contrast, the use of a public NB-IoT network has no upfront cost, because the network has already been put in place by a mobile phone network operator, but continuing operation requires the payment of regular subscription charges to the carrier.

Another issue to consider is regulatory and carrier certification costs. In both cases, products with LoRaWAN and NB-IoT embedded modules will require CE regulatory certification in Europe for intentional and unintentional emissions. NB-IoT devices will also require carrier certification from the network service provider.

Other considerations are the cost and size of the embedded module for the application, as well as data rate and range. In the case of both LoRaWAN and NB-IoT, chip suppliers and module manufacturers have brought prices and sizes in line with existing technologies such as Wi-Fi®, ZigBee® and Bluetooth® technologies. Modules are now available that measure just 24mm x 24mm, and prices are on target to fall to a level similar to those of other RF protocols as adoption of the technologies widens.

And while the capabilities of LoRaWAN and NB-IoT are equally suitable to many applications, at the margins either technology might be a clearly superior choice. For instance, at a very low data rate of 300bits/s, LoRaWAN can achieve an extraordinarily long range of 15km in open space. Some applications with a low data requirement might need this long range, which could mean that NB-IoT would be unsuitable.

Alternatively, some applications might need a guaranteed 150kbits/s data rate over the entire coverage area, a requirement which NB-IoT can meet and a LoRaWAN network cannot.

Is there a winner? It is clear from the above that both the LoRaWAN and NB-IoT network technologies have features which will appeal strongly to developers and manufacturers of IoT devices and systems. The choice between the two comes down largely to a mix of: • technical requirements, such as range and coverage, and data usage• implementation and management considerations – carriers such as

Vodafone will make it easy to get a customer’s NB-IoT connection up and running quickly. Other carriers will provide a similar service to users of public LoRaWAN networks. Setting up and running a private LoRaWAN network requires some expertise in network management.

• cost – is it more profitable to minimise capital or operational expenditure?

• timing – LoRaWAN network roll-outs are under way, but in Europe LTE networks are already widely available, and some will quickly be ready to run NB-IoT services.

In either case, the Future Connectivity Solutions division of Future Electronics is on hand to provide advice to OEMs and systems developers, and to support them in development and volume production by supplying components, modules and cloud connectivity services.

Fig. 4: LTE networks use multiple frequency bands to optimise for coverage and data rate


How to successfully connect IoT devices to the cloud: NB-IoT and LoRaWAN technologies compared

LoRaWAN NB-IoT

Spectrum Unlicensed Licensed

Bandwidth 500kHz to 125kHz 180kHz

Peak Data Rate 300bits/s to 50kbits/s on downlink and uplink

500bits/s to 200kbits/s on downlink 300bits/s to 180kbits/s on uplink

Number of Messages per Day Unlimited Unlimited

Duplex Communication No Half-duplex

Power Efficiency Very high Medium

Peak Current at Maximum Transmit Power 32mA 120mA to 300mA

Sleep Current 1μA 5μA

Latency (Maximum Guaranteed) <10s 1.6s to 10s

Table 1: Comparison of the features of NB-IoT and LoRaWAN technologies

Nebula IoT Reference Design Board• The Nebula board is an IoT cloud-ready board developed

by Future Electronics which allows developers to quickly prototype and deploy their IoT ecosystems.

• Wireless connectivity is supported by the Murata 1DX module which houses the Cypress-based CYW4343W Wi-Fi and BLE (v.4.1 +EDR) chipset radio.

• The board contains STMicroelectronics' STM32F429 MCU which is an ARM® Cortex®-M4, with 32bit RISC core, 2MB Flash and up to 256kB SRAM.

• The Nebula board supports application development through Cypress’ Wireless Internet Connectivity for Embedded Devices (WICED) platform. WICED is the only SDK that combines wireless, MCUs and memory in one environment that runs on Windows, OS X and Linux through Eclipse-based IDE.

• The board is equipped with 4 different interfaces to access the STM32F429 peripherals to enable developers to create any IoT application: 1. Arduino™ Compatible Shield 2. mikroBUS™ Socket 3. Pmod™ Type 2A 4. USB Device

• The board is designed for users to explore the vast opportunities in IoT applications such as asset tracking, energy management, fitness, lighting controls, HVAC, portable controls, security and building automation.

• In addition, the Nebula board explores easy hardware expandability through a large number of standardised add-on boards via these connectors, with each one focusing on a different application such as motor controls, sensors and wireless connectivity to enable IoT development. These will be available to purchase from Future Electronics.


Orderable Part Number: NEB1DX-01


Documents

ISSUE 1711 - Welcome to FTM Board Club · ISSUE 1711 Application Spotlight on: Connectivity Component Focus: Pages 3-12 NXP Semiconductors’ wireless power-transmitter reference