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With the iPhone 6s Plus, Apple introduces a new fingerprint sensor. The new device has the same structure and capacitive technology than the previous one, but with important innovations in term of sensor design, die process and packaging. iPhone 6s Plus Fingerprint Sensor New Design & Package Title: iPhone 6s Plus Fingerprint Sensor Pages: 118 Date: November 2015 Format: pdf + xls PRICE: Full report: EUR 3,290 For the iPhone 6s Plus, Apple proposes a new fingerprint with the same detection principle but new design, new front-end process and new back-end packaging. COMPLETE TEARDOWN WITH: Detailed Photos Precise Measurements Material Analysis Manufacturing Process Flow Supply Chain Evaluation Manufacturing Cost Analysis Selling Price Estimation Comparison of iPhone 5 and iPhone 6s Plus fingerprints Comparison of Apple’s Vs Samsung and Huawei fingerprints Integrated in the home button, the 12.5x10.9 mm sensor is incorporated within a rectangular shaped housing composed of a stainless steel ring and an aluminum base. The sensor is protected by a sapphire window coated with two different materials and supported by innovative assembly of dies and flex PCB. The fingerprint sensor allows it to scan the fingerprint just by pushing the button. The sensor has a resolution of 10,752 pixels with a pixel density of 500ppi. It uses a capacitive touch technology to take an image of the fingerprint from the subepidermal layers of the skin. Respect to the old fingerprint sensor, the new sensor is composed of two dies, one dedicated to the sensing and one containing the logic. The ASIC die has a 0.18μm manufacturing process and the sensor die is manufactured with a more recent CMOS 65nm technology. While in the previous sensor had edge cavities for the wire bonding; the new sensor is implemented with TSV which allow a better packaging and wire bonding to the flex PCB. The report includes comparisons with iPhone 5s fingerprint sensor and with the latest Samsung’s and Huawei’s fingerprints buttons.

iPhone 6s Plus Fingerprint Sensor New Design & Package€¦ · With the iPhone 6s Plus, Apple introduces a new fingerprint sensor. The new device has the same structure and capacitive

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Page 1: iPhone 6s Plus Fingerprint Sensor New Design & Package€¦ · With the iPhone 6s Plus, Apple introduces a new fingerprint sensor. The new device has the same structure and capacitive

With the iPhone 6s Plus, Appleintroduces a new fingerprintsensor. The new device has thesame structure and capacitivetechnology than the previous one,but with important innovations interm of sensor design, die processand packaging.

iPhone 6s Plus Fingerprint SensorNew Design & Package

Title: iPhone 6s Plus FingerprintSensorPages: 118Date: November 2015Format: pdf + xls

PRICE: Full report: EUR 3,290

For the iPhone 6s Plus, Apple proposes a new fingerprint with the same detection principle but new design, new front-end process and new back-end packaging.

COMPLETE TEARDOWN WITH:

• Detailed Photos

• Precise Measurements

• Material Analysis

• Manufacturing Process Flow

• Supply Chain Evaluation

• Manufacturing Cost Analysis

• Selling Price Estimation

• Comparison of iPhone 5 and

iPhone 6s Plus fingerprints

• Comparison of Apple’s Vs

Samsung and Huawei fingerprints

Integrated in the home button, the 12.5x10.9 mm sensor is incorporatedwithin a rectangular shaped housing composed of a stainless steel ring andan aluminum base. The sensor is protected by a sapphire window coatedwith two different materials and supported by innovative assembly of diesand flex PCB.

The fingerprint sensor allows it to scan the fingerprint just by pushing thebutton. The sensor has a resolution of 10,752 pixels with a pixel density of500ppi. It uses a capacitive touch technology to take an image of thefingerprint from the subepidermal layers of the skin.

Respect to the old fingerprint sensor, the new sensor is composed of twodies, one dedicated to the sensing and one containing the logic. The ASIC diehas a 0.18µm manufacturing process and the sensor die is manufacturedwith a more recent CMOS 65nm technology. While in the previous sensorhad edge cavities for the wire bonding; the new sensor is implemented withTSV which allow a better packaging and wire bonding to the flex PCB.

The report includes comparisons with iPhone 5s fingerprint sensor andwith the latest Samsung’s and Huawei’s fingerprints buttons.

Page 2: iPhone 6s Plus Fingerprint Sensor New Design & Package€¦ · With the iPhone 6s Plus, Apple introduces a new fingerprint sensor. The new device has the same structure and capacitive

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TABLE OF CONTENTS

Overview / IntroductionCompany Profile & Supply Chain

Physical Analysis• Physical Analysis Methodology• Fingerprint Button assembly Home Button Assembly Views Gasket & Flex PCB Removed Fingerprint Sensor Home Button Cross-Section

• Sensor Die Sensor Die View, Dimensions &

Marking Sensor Die Capacitors Sensor Die Delayering Sensor Die Bonding & TSV Sensor Die Process Sensor Cross-Section (Metal

Layers, TSV…)• ASIC Die Dimensions & Markings Delayering IC Process Die Cross-Section

Technology and Cost comparison with iPhone 5s fingerprint sensor

Manufacturing Process Flow• Global Overview• Sensor Front-End & TSV • Sensor 3D Packaging Process Flow• Sensor ASIC Process • Sensor Packaging Process• Fabrication Units

Cost Analysis• Sensor Front-End, TSV & 3D Packaging Cost• Sensor Back-End 0 • Sensor Wafer Cost• Sensor Die Cost• ASIC Front-End & Back-End 0 • ASIC Wafer Cost• ASIC Die Cost• Sapphire Window Cost• Component Cost & Price

Technology and Cost comparison with Huawei’s Ascend Mate and Samsung S6 fingerprint sensors

ANALYSIS PERFORMED WITH OUR COSTING TOOLS IC PRICE+ AND SYSCOST+

Author:Elena Barbarini

Elena is in charge of costinganalyses for MEMS, ICs andPower Semiconductors. She hasa deep knowledge of ElectronicsR&D and Manufacturingenvironment. She holds aMaster in Nanotechnologies anda PhD in Power Electronics.

Yvon is the laboratory manager.He has deep knowledge inchemical & physical technicalanalyses. He previously workedfor 25 years in Atmel NantesLaboratory and performs MEMSanalyses for over 8 years.

System Plus Consulting offerspowerful costing tools toevaluate the production cost& selling price from singlechip to complex structures.

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MEMS CoSim+

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Page 3: iPhone 6s Plus Fingerprint Sensor New Design & Package€¦ · With the iPhone 6s Plus, Apple introduces a new fingerprint sensor. The new device has the same structure and capacitive

Samsung Galaxy S6 Fingerprint Sensor

Huawei Ascend Mate 7Fingerprint Sensor

Capacitive Fingerprint Sensors Patent Analysis

For the second time Samsungintroduces in its products afingerprint sensor based on PCBcapacitive technology, but withsignificant innovations.

Fingerprint Cards integrates inHuawei’s product the firstsmartphone fingerprint sensorbased on capacitive sensingtechnology.

WILL APPLE AND SAMSUNGCONFRONT EACH OTHER ON THEFINGERPRINT SENSOR FIELD?Technology and patentinfringement risk analysis

Pages: 104Date: May 2014

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Pages: 83Date: April 2015

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Pages: 110Date: November 2015

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Page 4: iPhone 6s Plus Fingerprint Sensor New Design & Package€¦ · With the iPhone 6s Plus, Apple introduces a new fingerprint sensor. The new device has the same structure and capacitive

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Page 5: iPhone 6s Plus Fingerprint Sensor New Design & Package€¦ · With the iPhone 6s Plus, Apple introduces a new fingerprint sensor. The new device has the same structure and capacitive

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