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6-Aug-08 H.K. Lin 1 iPhone 3G Disassembly Comparison with previous iPhone

iPhone 3G Dis Assembly

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Page 1: iPhone 3G Dis Assembly

6-Aug-08 H.K. Lin1

iPhone 3G Disassembly

Comparison with previous iPhone

Page 2: iPhone 3G Dis Assembly

6-Aug-082

iPhone 3G at a glance

10 hours talktime / 300 hours standbyBattery life:

NoMemory Card

YesPolyphonic:

NoInfra-red:

Black(8/16 GB), White (16 GB) Color

YesBluetooth:

115.5 x 62.1 x 12.3 mm / 133gramsSize:

2 mega pixels FFCamera:

320 x 480 pixels, 3.5 inches Screen:

GPRS + EDGE+WCDMA+HSDPA+WIFIData:

GSM 850 / 900 / 1800 / 1900HSDPA 850 / 1900 / 2100

Network:

2008,JulyAvailable:

Page 3: iPhone 3G Dis Assembly

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PCBA

Page 4: iPhone 3G Dis Assembly

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Wireless MODEM

7. Infineon BGA736 Tri-band LNA8. TCXO

6. Murata Quad-band FEM

3. TriQuint TQM666032 4. TriQuint TQM676031 5. TriQuint TQM616035( 2100, 1900, 850PA-duplexers respectively )

1. Infineon PMB6952 Dual Mode W-DMA/EDGE

RF Parts

2. Skyworks SKY77340EDGE Quad-band PA

Infineon PMB 6820PMU

Intel 3050M0Y0CE 5818A456(16MB NOR+8MB PSRAM)

NOR+SRAM

Infineon XMM 6080 ARM 926 Based (Guess?)

DBB

1

2

3 4 5

6 7

8

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XMM 6080 Block I

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XMM 6080 Block II

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PMB6952 Block

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PA Parts

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Logic Board

NS LM2512AADisplay Interface

Broadcom BCM5974Touch screen controller

Wolfson WM6180CAudio Codec

ST LIS331ALG Sensor

Linear LTC4088-2Battery Charger/USB Controller

InfineonPMB2525(HH II)

GPS

SST 4Mb (SST25VF040B)

Flash

NXPPMU

SAMSUNG 64XX Series with SAMSUNG 128MB M-DDR

CPU

Page 10: iPhone 3G Dis Assembly

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NAND Flash?

Remove Shielding Can

Toshiba TH58NVG6D1DTG80(8GB)

Page 11: iPhone 3G Dis Assembly

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Where are the other wireless chip??

These chips/modules may implement WIFI/BT (Vendor: Murata). But one thing for sure, these components must be the customized parts.

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Some interesting detections from PCB

Debug Connector? NAN Ya PCB!

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Disassembly I

The LCD and glass covering are separate components. It is easy for repairing the iPhone 3G!

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Disassembly II

VibratorPhone Jack

Camera Module

MIC

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Disassembly III

The battery isn't soldered on. It helps to replace the battery. But the spring type connection may cause the supply voltage drop while the phone drops on the ground.

Dock and headphone connector.The primary antenna is on the other side of this part.

Page 16: iPhone 3G Dis Assembly

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Disassembly IVUnlike the metal rear panel on the original iPhone. Made from ABS plastic. The coat on the back feels nice and is very reflective.

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Antenna LocationBT and WLAN Antenna 3.5G WWAN Antenna

GPS Antenna on the top

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Mechanical Staking

BatteryPCB

Shielding CanSIM Holder

LCM

Dock and Antenna

Glass

Battery

LCM

Dock and Antenna

Glass

PCB1Shielding Can

PCB2

iPhone

iPhone 3GFPC

FPC

NAND

BTB

Page 19: iPhone 3G Dis Assembly

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Battery Spec

iPhone

iPhone 3G

Page 20: iPhone 3G Dis Assembly

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HW Cost Analysis

The BOM cost is very close to 2G iPhone on sale last year. It is obvious the NAND depreciation compensates for the high price of 3G MODEM. The cost will be reduced quarter by quarter. The cheaper iPhone we can get.