Investor and Analyst Presentation Q1 2020/21Investor and Analyst Presentation 7 Market players in the high-end segment 7 Market position HDI Technology (2019) Rank Supplier Country/Region

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben Tel +43 (0) 3842 200-0

www.ats.net

AT&SFirst choice for advanced applications

Investor and Analyst PresentationQ1 2020/21


www.ats.net

COMPANY OVERVIEW

Investor and Analyst Presentation 2

Among the top PCB producers

worldwide

A world leading high-tech PCB & IC substrates company

* For CY 2019 Source: Prismark

** For AT&S FY 2019/20

High-end interconnect solutionsfor

Mobile Devices, Automotive, Industrial,

Medical Applications and Semiconductor

Industry

Outperforming

market growth

over the last

decade# 2

high-end PCB producer

worldwide*

€ 1bnrevenue in

FY 2019/20

~ 10,000Employees**

Efficient global production

footprint with

6 plants in Europe and Asia


Leading provider of high-end PCBs and IC substrates

Unique market position Broad product portfolio to serve all growth markets

Long-standing customer relationships with technology and market leaders

Technology innovator due to continuous R&D efforts

Quality benchmark with outstanding process know-how, productivity and efficiency

Growth oriented strategy Megatrend-driven markets with attractive growth potential

Address growth opportunities with incremental investments

Sustainable profitability AT&S has constantly outperformed the PCB and substrates market over the last years

EBITDA margin of 20 – 25% above industry average

Strong cash flow generation and therefore improved internal financing capabilities

Solid balance sheet and attractive dividend policy

Well positioned for the future

3


Market Segments & Product Applications

4

Computer, Communications,

Consumer Appliances

Smartphones, Tablets, Wearables, Ultrabooks,

Cameras

Industrial

Machine-2-Machine Communication,

Robots, Industrial Computer,

X2X Communication

Automotive

Advanced Driver Assistance Systems,

Emergency-Call, X2X Communication

Medical

Patient Monitoring, Hearing Aids,

Pacemaker, Neurostimulation, Drug

Delivery, Prosthesis

IC substrates

High Performance Computer, Microserver

Segment Mobile Devices & Substrates Segment Automotive, Industrial, Medical


Key facts FY 2019/20

762.9814.9

991.81,028.0 1,000.6

167.5130.9*

226.0 250.1194.5

22.0%

16.1%

22.8%

24.3%

19.4%

2015/16 2016/17 2017/18 2018/19 2019/20

Revenue EBITDA EBITDA margin 7%

+7% CAGR

€ in millions*Based on ramp-up effects for new plants in China

Revenue split by segment: FY 2019/20

Revenue split by customer: FY 2019/20(based on customer’s headquarters)

5

69%

31%

Mobile Devices & Substrates

Automotive, Industrial, Medical

68%

16%

8%

8%

Americas

Germany/Austria

Asia

Other European countries


Global footprint ensures proximity to supply chain & cost efficiency

1,012* 398* 1,326* 3,082* 4,441* 249*

Shanghai China

AnsanKorea

ChongqingChina

Leoben, HeadquartersAustria

FehringAustria

NanjangudIndia

AT&S plant

AT&S sales support office

AT&S Headquarters

*Staff, Average, FTE, Q1 2020/21; 80 employees in other locations


Market players in the high-end segment7

Market position HDI Technology (2019)

Rank Supplier Country/RegionHDI

(revenue in US-$ millions)

1 Compeq TWN 776

2 AT&S AUT 736

3 TTM USA 716

4 Unimicron TWN 706

5 Tripod TWN 508

6 Meiko JPN 461

7 Zhen Ding TWN 428

8 Korea Circuit KOR 227

9 Founder PCB CHN 222

10 CMK JPN 220

Source: Prismark, AT&S Market Intelligence


Strategic focus on high-end technologies

AT&S revenue – based on technologies

High-endHDI PCBs andIC substrates

~ 30%

Complementary technologySingle-sided (SS), double-sided (DS), multilayer- (ML),

flex and rigid-flex (RF) PCBs~ 70%

HDI and any-layer PCBs, Embedding, IC substratesHigh-end technology share

> 80%*

SS, DS, ML, Flex, RFComplementary technology

share< 20%*

General PCB market – based on technologies

* for FY 2019/20Source: Prismark, AT&S


R&D as the key for technological leadership

as of FY 2019/20* Revenue generated with products with new, innovative technologies introduced to the market within the last three years

R&DHeadquarters

AustriaIndustrialization at the respective

production site

9.5%R&D Quota

(equivalent to € 94.8 million)

30.8%Innovation Revenue Rate *

International R&D Partners

326 Patents


More than AT&S

Printed circuit boards

Leading producer of high-end PCB

IC substrates

One of the leading producers

mSAP / SLP

Technology leader

PCBs/substrates for modules

High growth potential

Substrates for HPC modules

Diversification of application and customer portfolio

Broadening the service range and opening up of new business opportunities

Module integration services Build-up of additional capabilities

Technology

Innovation power

Clear focus on dedicated applications

Leadingprovider ofinterconnectsolutions


www.ats.net

MARKET UPDATE & GROWTH DRIVERS


PCB & IC substrates market outlook

6.8 8.92.7

3.12.6

3.21.3

1.54.8

9.3

17.2

23.714.5

16.9

8.0

10.0

CY 2019 CY 2025

Consumer

Computer

Communication

Substrates

Medical

Industrial

Aviation

Automotive

2019

76.6+4.7%

58.0

+2.4%

+3.9%

+2.5%

+5.5%

+11.4%

+4.5%

+3.0%

+3.1%

CAGR 2025in US-$ billionSource: Prismark, April 2020; Substrate: Yole, May 2019


5G Big data AI IoT

Game changers for innovative applications


+119% CAGR

Total smartphones

2019: 1.37 billion units2025: 907 million units

2025: 1.54 billion units

+2.0% CAGR

5G smartphones

2019: 16 million units

Source: IDC (2020), AT&S Analysis

5G

Big data

AI

5G – The new standard for connectivitySignificant growth opportunities ahead


5G

Big data

AI

IoT Source: IDC (2019, 2020)

2025: 175 Zetabyte

2019: 40 Zetabyte

Connected devices Global data volume

2025: 55 billion units

2019: 42 billion units

+27.9% CAGR+4.6% CAGR

IoT and Big dataStrong growth drivers for IC substrates


+11.5% CAGR

2025: US-$ 9.2 billion

2019: US-$ 4.8 billion

High-end processor modules High-end IC substrates


+8.1% CAGR

More powerful processors modules require larger form factor, higher layer count and thus higher value IC substrates

Embedding of components further increases AT&S value add

Source:Prismark (2020), Yole (2019)

Growth by adding value for AT&S5G

Big data

AI

IoT


IoT and Big dataStrong growth drivers for IC substrates


AT&S first high-end IC substrates manufacturer in China

IoT and Big data growth drivers for IC substrates

IC substrates market should show strong growth of 11 % (CAGR) until 2025

Strategic focus on business with IC substrates to follow the trend of the heterogeneous module integration

Increase capacities and capabilities to become one of the leading providers of high-end IC substrates for high-performance computing

Since 2016 serial production of IC substrates in Chongqing I

Construction start of Chongqing III in 2019


Process and equipment characterization

Certification Equipment move in and installation

Decision for IC substrates expansion for HPC

Additional capacities out of phase II (CHQ I)

Additional capacities out of phase III (CHQ III)

Start main building structure CHQ III

Full capacities on stream

190%220%

360%

500%IC substrates capacities

CHQ I:Despite COVID-19 the first patch of equipment was installed and qualified and the ramp up is on track

Relevant revenue contribution out of phase II (CHQ I) expected in 2020/21

CHQ3: Covid-19 related construction delay is below 7 weeks

An improved qualification plan can compensate the delay of the construction and guarantee to meet the certification date

1.9x

1.2x

1.6x

1.4x

100%

IC substrates business in ChongqingCapacity expansion and technology investment pushed forward

FY 2019/20

Chongqing I Chongqing III


100%130%

166%190% 190%

0%

100%

200%

300%

400%

500%

FY2019/20 FY2020/21 FY2021/22 FY2022/23 FY2023/24

IC Substrate Core Production Leoben-HinterbergInvesting into the future

Up to € 120 million investment volume for a technology upgrade in Leoben-Hinterberg

Up to 25% of the investments will be funded by the EU programme “IPCEI on Microelectronics

200 additional employees by 2023

1.3x1.3x

1.1x 1x

Decision for IC substrates expansion for HPC

Equipment move in and installation

Additional capacities

Full capacities on stream

FY 2019/20FY 2019/20

IC substrate cores capacities Leoben-Hinterberg


Module business


Increased functionality - lower space

Increased performance

Reduced time to market

Reduced cost

Scalable for various applications

Customer requirements driving demand for modularization

CAGR: 11.3%

Changing customer requirements driving the need for modularization

Strong growth potential in module integration market volume

AI and 5G are further drivers formodule integration

2025: US-$ 52 billion*

2019: US-$ 27 billion*

Module integration market

* Assembly and test only - excludes the value of Module PCBs/SubstratesSource: A.T. Kearney (8/2018), AT&S (4/2020)

Modules & module integration AT&S solutions for the electronics industry


AT&S solutions for the electronics industryNew business opportunities through entry into the module market

22

SubstrateManufacturing

Module Design Chip Manufacturing

(Front-end)

PCB Manufacturing

Chip Assembly & Test

(Back-end)

Product/Module

Assembly

ProductOwnership

OSATs

PCB

Wafer FoundriesODM/EMS/

OSATsOEMs

OEMs

Fab-lessIC Players

Module Integration Service ProviderDesign houses

02

Module Board Manufacturer (SLP)

01

00

Possible Module Applications:

Power Module 5G Module

Automotive GPS Modul


www.ats.net

Q1 2020/21 – FINANCIALS AND KEY FIGURES


Global market developmentLong-term trends largely unaffected, effect of COVID-19 with short-term impact

Digital technologies and electronics are increasingly gaining importance for people’s lifestyle

Growth in data drives the need for processor modules and therefore high-end IC substrates

Trade frictions still cause market uncertainty

Unclear consumer behavior still causes low visibility especially in Mobile devices

Despite increasing electronic content difficult market situation in the automotive sector is expected to remain in place for the time being

Ongoing low industrial investment activity

Medical market stable with positive demand for special applications

24


AT&S development in Q1 2020/21Strong first quarter despite challenging environment

Excellent crisis management helped to mitigate impact on revenue

IC substrates once again with strong demand

Mobile Devices segment supported by customer and application diversification

Drop in vehicle sales weighs on Automotive segment

Industrial segment profits from better product mix

Medical & Healthcare influenced by temporary unfavourable product mix

25


Revenue and EBITDA development

222.7

267.6 263.0247.3 247.9

34.9

66.255.2

38.1 39.5

15.7%

24.7%

21.0%

15.4%15.9%

Q1 2019/20 Q2 2019/20 Q3 2019/20 Q4 2019/20 Q1 2020/21

Revenue EBITDA EBITDA margin

in € millions

Revenue and EBITDA positively influenced by currency effects

Future technology generations require higher R&D spending

Positive EBIT of € 0,2 million despite higher depreciation

Net profit lower at € -7.5 million (PY: € -6.2 million)

Operating free cash flow at € -53.8 million (PY: € -21.2 million) due to higher investment activity


Revenue distribution Q1 2020/21

70%

13%

12%

5%

Americas Germany/Austria Asia Other European countries

Revenue split by segment Revenue split by regionbased on customer’s headquarters

27

76%

24%

Mobile Devices & Substrates Automotive, Industrial, Medical

27


Business development – Mobile Devices & Substrates

143.8

186.0 190.1

166.0

187.2

23.8

55.4 55.4

29.437.0

14.3%

26.0%

23.7%

15.6%

18.1%

Q1 2019/20 Q2 2019/20 Q3 2019/20 Q4 2019/20 Q1 2020/21

Revenue with external customers EBITDA EBITDA Margin*

in € millions; *Margin calculated from total business unit revenue

IC substrates revenue driven by highervolume and better product mix

Higher volume as well as broadened customer and application portfolio support Mobile Devices

Revenue and earnings positively impacted by FX effects


Business development – Automotive, Industrial, Medical

Industrial segment shows solid developmentdriven by better product mix

Automotive segment burdened by strong decrease in vehicle sales

Medical & Healthcare influenced by temporary unfavourable product mix

in € millions; *Margin calculated from total business unit revenue

78.981.6

72.9

81.3

60.7

10.98.0

5.2 4.8 3.1

12.4%

8.8%

6.5%5.3% 4.3%

Q1 2019/20 Q2 2019/20 Q3 2019/20 Q4 2019/20 Q1 2020/21

Revenue with external customers EBITDA EBITDA margin*


Net CAPEX

in € millions

Investments in IC substrates and technology upgrades main reason for increase

254.3240.7

141.7

100.8

218.5

49.7

81.9

2015/16 2016/17 2017/18 2018/19 2019/20 Q1 2019/20 Q1 2020/21


Balance Sheet

31.03.2020 30.06.2020 Change in %

Total assets Mio. € 1,853.5 1,980.1 6.8%

Equity Mio. € 760.3 726.4 (4.5%)

Equity ratio % 41.0% 36.7% –

Net debt Mio. € 246.7 298.3 20.9%

AT&S – Conference Call Q1 2020/21 32

High level of existing liquid funds Cash: € 387.6 million

Financial assets: € 224.6 million

Additional unused credit lines of € 419.6 million

Future cashflow still to be considered

94.862.8 45.0

378.7

87.2

1,031.8

2020/21* 2021/22 2022/23 2023/24 2024/25

Repayments Cash & Financial Assets Unused credit lines

Solid finance structureExisting funds and cashflow generation help to meet repayments and capex needs

Currency: EUR *as of 30.06.2020

419.6

612.2


www.ats.net

OUTLOOK


Outlook for 2020/21

Future trends not harmed by COVID-19 pandemic

Expectations for customer demand for the current year Product launches may be delayed in the Mobile Devices segment due to uncertain consumer sentiment

Automotive market will not recover quickly to pre-crisis levels

Industrial segment to remain at the level of previous year

Slight growth expected for medical applications

Demand for IC substrates remains strong according to current forecasts

Q2 with revenue at the level of previous year and EBITDA margin within target range of 20 to 25%

Outlook update as soon as economic framework conditions can be better quantified

Investments in the IC substrate and module business to be consistently continued Depending on market developments CAPEX for maintainance and tech-upgrade of up to € 80 million

CAPEX for strategic projects of up to € 410 million plus € 30 million due to timing variances

AT&S is well positioned to positively participate in intact market trends


Medium-term guidance confirmed

First choice for advanced applications

Technology development to module integration and capacitiy expansion

Expansion of technology leadership Leading provider of new interconnect solutions Innovation revenue rate: > 20%

Focus on continued profitable growth

Revenue target of € 2 billion

Prosecution of sustainable margin improvement Medium-term EBITDA margin target of 25-30%

Creation of shareholder value Medium-term ROCE above 12%

Sustainability management 80% renewable energy Eco-balancing of product groups 30 % women in management positions


www.ats.net

ANNEX


STATEMENT OF PROFIT OR LOSS

€ in thousands Q1 2019/20 Q1 2020/21Change

YoY

Revenue 222,739 247,862 11.3%

EBITDA 34,905 39,493 13.1%

EBITDA margin 15.7% 15.9% 0.2pp

EBIT (562) 243 >100%

EBIT margin (0.3%) 0.1% 0.4pp

Finance costs – net (1,739) (5,245) (>100%)

Profit/(loss) for the year (6,204) (7,462) (20.3%)

Earnings per share (€ 0.21) (€ 0.25) -

Financials Q1 2020/21

Revenues increase in IC-Substrates, Mobile Devices and Industrial segment, lower volume in Automotive segment out of market situation

EBITDA development supported by higher revenues and in spite of higher R&D costs for future applications

Higher depreciation due to growing fixed asset base

Higher negative FX-effects and highernegative interest result due toinvesting/financing activities



Quarterly loss and negative FX-effects led to an decrease in equity

Increase caused by higher financial liabilities

Lower equity mainly due to negative FX effects and higher total assets

STATEMENT OF FINANCIAL POSITION

€ in thousands 31 Mar 2020 30 Jun 2020Change

YoY

Equity 760,259 726,415 (4.5%)

Total assets 1,853,510 1, 980,050 6.8%

Net debt 246,747 298,311 20.9%

Net working capital 144,418 154,300 6.8%

Equity ratio 41.0% 36.7% (4.3pp)

Lower trade receivables and higher trade payables

Higher property/plant/equipment and increase in financing activities (higher cash and financial assets as well as higher financial liabilities)


STATEMENT OF CASH FLOWS

€ in thousands Q1 2019/20 Q1 2020/21Change

YoY

Cash flow from operating activities 28,505 28,124 (1.3%)

Cash flow from investing activities (63,745) (171,214) (>100%)

Cash flow from financing activities (2,710) 119,406 >100%

Change in cash and cash equivalents (37,950) (23,684) 37.6%

Operating free cash flow1)

(21,173) (53,756) (>100%)

Free cash flow2)

(35,240) (143,090) (>100%)

1) Cash flow from operating activities minus Net CAPEX2) Cash flow from operating activities minus cash flow from investing activities


Positive effects from result and negative effect out change in working capital

Higher net capex and higher temporary netinvestment in financial assets (directly linked to financing activities)

Preparation of investing activities in the nearest future

Higher net capex mainly due to IC substrates investment

Financing activities lead to increased negative free cash flow


Stock ProfileListing: Vienna Stock Exchange,

Prime Standard

Indices: ATX, Vönix, WBI

Thomson Reuters (A): ATSV.VI

Bloomberg (A): ATS:AV

Publication of the first half-year 2020/21 03 November 2020

Publication of the first three quarters 2020/21 02 February 2020

Financial Calendar Shareholder structure

# of shares outstanding 38.85m

Dividend for 2019/20: € 0.25 per share

64.4%

18.0%

17.6%

Free Float

Dörflinger Private Foundation*

Androsch Private Foundation* *including direct and indirect holdings


Gross debt, financial assets and cash, net debt

Key credit figures

523593

540

717

801

260212

331

567 554

263

381

209150

247

2016/17 2017/18 2018/19 2018/19 2019/20

Gross debt Financial assets and cash Net debt

1.6

2.9

0.90.6

1.3

2015/16 2016/17 2017/18 2018/19 2019/20

Target: < 3x

Net debt/EBITDA

Net debt increase due to higher financial liabilities

€ in millions Multiple


AT&S PRODUCT PORTFOLIO – I

ECP®:Embedded Component Packaging IC substrates Substrate-like printed circuit boards

mSAP

Embedded Component Packaging allows to embed active/passive components (e.g. wafer level dies) within the layers of a PCB – contributes to miniaturization.

IC substrates serve as interconnection platform withhigher density (Line/Space < 15 micron) between semiconductors (Chips) & PCBs .

Substrate-like PCBs (mSAP technology) are the next evolution of high-end HDI PCBs with higher density: Line/Space < 30 micron.

Production siteLeoben, Shanghai Chongqing Chongqing, Shanghai

ApplicationsDevices such as smartphones, tablets, digitalcameras and hearing aids

High-end processors for Computer, Communication, Automotive, Industrial

Mobile applications like smartphones


HDI any-layer printed circuit

boards

HDI microvia printed circuit boards – high density interconnect

Multilayer printed circuit boards

Double-sided printed circuit boards

IMS printed circuit boards – insulated metal

substrate

Further technological enhancement to HDI microvia: All electrical connections in HDI any-layer boards consist of laser-drilled microvias. Advantage: further miniaturization, and higher performance and reliability. AT&S produces HDI any-layer in 4 to 12 layers.

HDI: high density interconnect, meaninglaser-drilled connections (microvias). HDI is first step towards miniaturization.AT&S can produce 4-layerlaser PCBs up to 6-n-6HDI multi layer PCBs.

Found in almost every area of industrial electronics. AT&S produces printed circuit boards with 4 to 28 layers, in quantities from individual prototypes to small batches and mass production.

Used in all areas of electronics. AT&S focuses on double-sided printed circuit boards with thicknesses in the range of 0.1-3.2mm.

IMS: insulated metal substrate. Primary function: heat dissipation for use mainly with LEDs and power components.

Production siteShanghai Shanghai, Leoben Leoben, Nanjangud, Fehring Fehring, Nanjangud Fehring

ApplicationsSmartphones, Tablets, Notebooks

Mobile phones and nearly all electronic applications including automotive (navigation, infotainment and driver assistance systems)

Used in all electronic applications including touch panels, and in products ranging from aircraft to motorcycles, from storage power plants to solar arrays

Primarily industrial and automotive applications

Lighting industry

AT&S PRODUCT PORTFOLIO – II


Flexible printed circuit boards

Semi-flexible printed circuit boards

Rigid-flex printed circuit boards

Flexible printed circuitboards on aluminum

AT&S patentedtechnologies

Used to replace wiring and connectors, allowing for connections and geometries that are not possible with rigid printed circuit boards.

More limited bend radius than flexible printed circuitboards. The use of astandard thin laminatemakes them a cost-effective alternative.

Combine theadvantages of flexibleand rigid printed circuitboards, yielding benefitsfor signal transmission,size and stability.

Used when installing LEDsin car headlights, forexample, where theprinted circuit board isbonded to an aluminumheat sink to which theLEDs are then attached.

Production siteAnsan, Fehring Fehring Ansan Ansan

ApplicationsNearly all areas ofelectronics, includingmeasuring devices andmedical applications

Automotive applications Industrial electronics,such as productionmachines and industrialrobots

Lighting, automotive,building lighting

AT&S PRODUCT PORTFOLIO – III

ECP®: Embedded Component PackagingECP® is a patented AT&S packaging

technology used to embed active and passive electronic components in the inner layers of a printed circuit

board. ECP® technology is used in ever smaller, more efficient and more powerful devices, such as

smartphones, tablets, digital cameras and hearing aids.Production sites: Leoben, Shanghai

2.5D® Technology PlatformCombines mechanical and electronic miniaturization, and enables partial reduction of the thickness of a

circuit board. Advantage: populated assemblies have a thinner profile. Can be also used to make cavities in

the printed circuit board, e.g. for acoustic channels. Major application for this technology is the 2.5D® rigid-

flex printed circuit board, a lower cost alternative for flex-to install applications.

Production sites: Leoben, Shanghai


MILESTONES IN THE GROUP’S HISTORY

1987Founding of the Group, emerging

from several companies owned by

the Austrian State Owned

Industries

1994Privatization and

acquisition by Messrs

Androsch, Dörflinger, Zoidl

1999Initial public offering on Frankfurt Stock Exchange

(„Neuer Markt“). Acquisition of Indal Electronics

Ltd., largest Indian printed circuit board plant

(Nanjangud) – today, AT&S India Private Limited

2002Start of production at new Shanghai

facility – one of the leading HDI

production sites in the world

2010Start of production

at plant II in India

2009New production direction: Austrian

plants produce for high-value niches

in the automotive and industrial

segment; Shanghai focuses on the

high-end mobile devices segment

2008AT&S change

to Vienna Stock

Exchange 2006Acquisition of Korean

flexible printed circuit

board manufacturer,

Tofic Co. Ltd. – today,

AT&S Korea Co., Ltd.

2015AT&S again achieves record high sales and

earnings for financial year 2014/15 and

decides to increase the investment program in

Chongqing from € 350 million to € 480 million

2011 Construction starts on new

plant in Chongqing, China

Capacity increase in

Shanghai by 30%

2013AT&S enters the IC substrate

market in cooperation with a

leading manufacturer of

semiconductors

2017Successful introduction and

optimisation of the mSAP technology

in Shanghai and Chongqing

2016AT&S starts serial production

of IC substrates at the plant

in Chongqing

2018Start of the second

expansion phase at

plant 1 in Chongqing

2019Start construction

of plant 3 in

Chongqing for IC

substrates

46

Thank you for your attention!

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0

www.ats.net


DisclaimerThis presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria (“AT&S”), and thecontents are proprietary to AT&S and for information only.

AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein, and noreliance may be placed for any purpose whatsoever on the information contained in this presentation, which has not been independently verified. You are expressly cautioned notto place undue reliance on this information.

This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management‘s expectationsand assumptions. However, such statements are by their very nature subject to known and unknown risks and uncertainties. As a result, actual developments, results, performanceor events may vary significantly from the statements contained explicitly or implicitly herein.

Neither AT&S, nor any affiliated company, or any of their directors, officers, employees, advisors or agents accept any responsibility or liability (for negligence or otherwise) for anyloss whatsoever out of the use of or otherwise in connection with this presentation. AT&S undertakes no obligation to update or revise any forward-looking statements, whether asa result of changed assumptions or expectations, new information or future events.

This presentation does not constitute a recommendation, an offer or invitation, or solicitation of an offer, to subscribe for or purchase any securities, and neither this presentationnor anything contained herein shall form the basis of any contract or commitment whatsoever. This presentation does not constitute any financial analysis or financial research andmay not be construed to be or form part of a prospectus. This presentation is not directed at, or intended for distribution to or use by, any person or entity that is a citizen orresident or located in any locality, state, country or other jurisdiction where such distribution, publication, availability or use would be contrary to law or regulation or which wouldrequire any registration or licensing within such jurisdiction.

Documents

Investor and Analyst Presentation Q1 2020/21Investor and Analyst Presentation 7 Market players in the high-end segment 7 Market position HDI Technology (2019) Rank Supplier Country/Region