Introduction to Power Electronics 000

8/13/2019 Introduction to Power Electronics 000

1/41

Power El

C Mark

University o

ctronics

ohnson

Nottingham


2/41

Overview

lIntroduction to Po

l Current Challenges fl IeMRC Power Electro

l Research Examples

l

Conclusions

er Electronics

r Power Electronicsics Themes


3/41

What Does Power Elec

Efficient, flexible control and c

AC

AC

Typically involves controlled

and/or frequency

Conversion efficiencies typi

AC sources: single

phase or three phase AC

Rectifi

Inve

AC-AC

conversio

AC loads: machines,

industrial processes,

power transmissionand distribution

systems

c

ronics Do?

nversion of electrical energy

DC

DC

change of voltage/current level

ally in excess of 90%

DC sources: batteries,

solar panel, power

supply output

cation

sion

DC loads:

electrical/electroniccircuits, machines,

industrial processes

DC-DC

onversion


4/41

Benefits of Power El

l Energy saving

l Cost and space saving

l Reduced maintenance

l Longer life

l Low environmentalimpact

SustainabilityEnvironmental

footprintE

Effi

ctronics

ergy

ciencyAvailability

Flexibility

Quality

of life

l Better performance

l Better control

l Flexibility

l Improved reliability


5/41


6/41

Power Electronics is

Enabling technology throughout

Primary energy

extraction &

transport

Energy

conversion &

concentration

Electricity

39%

Transport

21%

Other

40%

~16,000 TWh/ann

global electricit

40% today growing to 60% by 2040

80% of this will be managed by po

Growing

the energy supply chain

Energy

transmission

and distribution

Energy

delivery

IT

14%

Lighting

19%

HVAC

16%

Motion51%

Heat

Work

m

er electronics


7/41

The Market

l Power electronics is an ess

future sustainable energyl It is the only technology th

flexible control of electrical

l share of electrical energy

power electronics is expect2000 to 80% in 2015

l Global market for power elwas $9.8bn and is expectewith a compound annual g

l In 2007 power electronicstrillion of sales in related h

[1] Power Electronics: Technolohttp://www.electronics.ca/repor

ctronics.html

ential technology in all

cenariosat can deliver efficient andenergy

hich will be controlled by

ed to increase from 40% in

ctronics devices in 2007to reach $17.7bn by 2013

owth rate of 11.6%1

ontributed to another $1rdware electronics

ies and Global Marketss/power_energy/utility_power_ele


8/41


9/41

Why Manufacture in

l UK based technology anis currently relatively str

l UK is internationally cosupply chain

l Many systems are appliccustomised and tend toadded value

l Suited to a technological

manufacturing base andhigh UK labour costs

the UK?

manufacturing capabilityong

petitive across the whole

ation specific, highlyave a relatively high

ly advanced

can absorb the relatively


10/41

Early History of Power

1880

Bridge rectifier

(1896)

Mercury arc

rectifier

(1902)

Phase angle

control (1903)

Id1

vL

ias1

ias2

iL

3 phase input

Id2

Cycloconverter

(1922)

Th

(19

Selenium

rectifier

(1876)

lectronics

ratron

27)

Ignitron

(1933)

HVDC

(1935)

Thyristor

(1957)

Thyratron motor

(1934)

1960

Silicon power

diode

(1954)

D l t f


11/41

0.4kV, 0.08kA

1kV, 0.15k A

2.5kV, 0.5kA

2.5kV, 1.5k

4kV, 3kA

0.6kV, 0.2kA

2.5kV, 0.6kA

4.5

6

1k

0

0.01

0.1

1

10

100

1960 1970 1980 1

Year

Switched

Power(MVA)

Development ofSemiconductor D

12kV, 1.5kA

8kV, 4kA

kV, 3kA

kV, 6kA

, 25A

.5kV, 0.2kA

1kV, 0.3kA

1.2kV, 0.6kA

1.7kV, 1.2kA

3.3kV, 1.2kA

6.5kV 0.9kA

4.5kV, 2.1kA

4.5kV, 4kA

6kV, 6kA

990 2000

ETT

LTTGTO

IGBT

IEGT

GCT

owervices

Whats in Todays Powe

Electronic


12/41

What s in Today s PoweSystems?

SA+

SA-

DA+

DA-600 V

CDC20mF, 1000V

GDUA GDUB

DC+

DC-

Passive

components

Gate drivesand control

s

Electronic

PA

PB

PC

Half-bridge sandwich (one per phase)

GDUC

Power

emiconductor

module

Thermal

management


13/41

Overview

l Introduction to Powe

lCurrent ChallengeElectronics

l IeMRC Power Electro

l Research Examples

l Conclusions

r Electronics

for Power

ics Themes


14/41


15/41


16/41

Analysis

Product Area

Relia

bilityandqualification

Packagingandintegration

Thermalm

anagement

MaterialsTechnologies

Efficiency

Simulatio

nanddesignmethods

Active

Automotive power train 26 26 22 22 21 19

Renewable energy sources (grid 22 21 18 19 23 19

Aircraft actuation 25 24 23 23 20 19

Aircraft power distribution 23 25 21 21 20 18

Aircraft generation 22 21 20 20 18 16

Marine propulsion 21 19 19 19 18 15

Automotive controls 21 21 18 16 16 17

Rail traction 21 20 18 19 16 16

High performance drives 21 18 20 20 16 16

Large industrial drives 21 18 16 16 13 14

Small drives for home appliance 17 15 14 13 16 16

Components: active 17 18 13 13 13 13

Aircraft engine controls 18 17 17 16 11 13

Power transmission and distrib 14 15 11 13 12 11

Components: thermal managem 13 14 13 11 11 10

Components: passive 11 13 11 11 9 6

Pulsed power 11 11 10 11 10 8

Other 1 1 1 1 1 1

Total Records 325 317 285 284 264 247

l Priority product areasl Priority technology areas

l TRL analysis

evices

PowerQ

uality

Control

Passivedevices

LifeCycle

Businessprocess

Healtha

ndusagemanagem

ent

Other

15 16 12 14 8 6 6 3 216

16 18 17 10 11 11 6 1 212

17 15 10 14 6 7 6 2 211

17 17 10 11 7 7 5 3 205

15 15 10 12 7 4 6 3 189

15 16 9 11 7 5 7 3 184

13 11 13 10 7 7 6 3 179

12 13 10 12 8 4 6 3 178

15 12 10 10 6 4 4 2 174

13 13 8 9 8 4 4 3 160

11 11 14 6 8 6 6 2 155

17 12 11 6 5 7 4 1 150

13 9 8 11 4 4 6 2 149

10 10 10 5 10 3 4 3 131

9 10 9 8 4 7 3 1 123

4 9 6 11 8 3 2 1 105

9 9 5 8 4 4 2 1 103

1 1 1 1 1 1 1 1 14

222 217 173 169 119 9 4 84 38 2838

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

y2008 y2009 y2010 y2011 y2012 y2013 y2014 y2015 y2016 y2017

TRL 1-2

TRL 3-4

TRL 5-6

TRL 7-8

TRL 9

P i it P d t


17/41

Priority Product

l Many challenges apply to a la

product areas

l Substantial potential for cros

Product area

Automotive power train

Renewable energy sources (grid interfa

Aircraft actuation

Aircraft power distribution

Aircraft generationAutomotive controls

Marine propulsion

High performance drives

Rail traction

Large industrial drives

reas

rge number of priority

-sector activities

Proportion of

challenges

58%

e and control) 53%

56%

58%

52%50%

47%

50%

47%

44%


18/41

Priority Technolog

l Many challenges identify same p

l Technology areas are strongly in

l Priorities are mainly underpinnin

applied across many product sec

Technology area

Reliability and qualification

Packaging and integration

Thermal management

Materials technologiesEfficiency

Simulation and design methods

Active devices

Areas

riority technology areas

terdependent

g technologies that can be

tors

Proportion ofchallenges

61%

65%

56%

55%56%

44%

47%


19/41

The Power Density

l How far can we go?

l Limiting factors: Losses (efficiency)

Cooling capability (heat trasurface)

Energy storage requiremenetc.)

Upper limit for core temp

Converter

volume

Core temperature (Tcore)

hallenge

sfer from

s (filters

rature

Heat

Cooling

( )2

3

~

- acoreeffe

TThPVh


20/41

The Reliability Ch

l Automotive drive train,

renewable generation insignificant load and envi

l Desire for higher powertemperatures and increa

both tend to reduce rel However

l Customers demand veryunexpected failures are

l Unscheduled maintenanexpensive

llenge

ail traction, aerospace,

erfaces etc. are subject toronmental cycling

ensity means increasedsed thermal cycling range

liability

high levels of availability,ot acceptable

e is time consuming and

h Ch ll


21/41

Meeting the Chall

SA+

SA-

DA+

DA-

GDUA

DC+

DC-

P

A

Reliability

PackagiIntegrat

Prognosti

Manageme

Design

Method

Compo

Technol

Power

Quality

Energy

Efficiency

Mis

Pro

Reliability/

Availability

enge

Thermal

Management

ng &ion

s & Health

nt

ools &

logy

ent

ogies

Weight

Volume

ion

file

Through-life

Cost

l


22/41

Power Electronics Int

l Performance specificatioinclude electrical, reliabiltargets

l Strong interactions betw

performance and reliabilaspects of power electroaddressed concurrently

l An integrated approach i

and manufacture of futusystems

gration

s for power electronicsity, cost and end-of-life

een packaging, thermal

ity themes means ALLnics technology must be

s essential in the design

re power electronic

O i


23/41

Overview


l Current Challenges f

lIeMRC Power Elec

l Research Examples

l Conclusions

r Electronics

r Power Electronics

ronics Themes


24/41

A J i d U A h


25/41

A Joined-Up App

Reliability

Packaging &

Integration

Prognostics & Hea

Management

Design Tools &

Methodology

Experimental:

testing, methodology,

qualification

Physics of failure

models

Model validation

Research & Technology Core

oach

Thermal

Management

lth

New technologies:

air and liquid cooling

System optimisation

Real-time models

New technologies:

materials, assembly

methods

System optimisation

Integration of

passives

SiC & other WBG

Technology

Road-

mapping

Technology

DemonstrationProjects

TRL 3-6

TRL 1-4

IeMRC Power Electroni

s Cluster


26/41

IeMRC Power Electroni

Design f

qualificat

Flagship

Project

TSB-funded

programmes in

power electronics

(TULIP & PEATE)

Power

electroniroadmap

Other IeMRC

projects on

Advanced

Capacitors,

Prognostics &

Diagnostics

EU-funded

aerospace

research within

MOET and Clean

Sky JTI

Reliability and

Physics of

Failure

IeMRC SiP

Design

EPSRC Gra

Challenge

3-D Mintegra

s Cluster

r

ion

Advanced

packaging

TSB-funded

research into

improved bonding

technology

(IMPECT &NEWTON)

EPSRC-funded

research in SiC:Platform grant &

responsive

mode

cs

TSB-funded

research into

modelling of

power modules(MPM)

d

:

ion

Cluster approach maximises

gearing and mutual coupling

between projects

Academic Partn

ers


27/41

Academic Partn

power electronics, module

design and failure analysis,

packaging, EMC, thermal

management

partial discha

effects

Materials support,

interconnect,

capacitors

component technol

power electronics

ers

physics-of-failure reliability

predictions, multi-physics

modelling and numerical

optimisation, design tools

rge high-permittivity

dielectrics and Silicon

Carbide device

fabrication

metallography

and microscopy

gies,

Industrial Partn

ers
http://www.gre.ac.uk/


28/41

Industrial Partn

l Areva T&D

l Corac Groupl Dynex Semiconductor

l Flomerics (Mentor Graphic

l Hispano Suiza (Safran)

l Goodrich

l GE Aviationl International Rectifier

l Morgan Technical Ceramics

l Rolls-Royce

l Semelab (TT Electronics)

l SR-Drives

l TRW Automotive

l Zodiac

ers

)

Overview


29/41

Overview


l Current Challenges f

l IeMRC Power Electro

lResearch Example

l Conclusions

r Electronics

r Power Electronics

ics Themes

s

IeMRC Flagship P

oject


30/41

IeMRC Flagship P

l Aim: Enhance competitielectronics industry throdesign and manufacturin

l Key target is technologi

improve power modulel Total IeMRC funding 8

academic partners, 11 i

l Fundamental research t

activitiesl Total of geared fundin

oject

eness of the UK powerugh improvements to theg capability

s and techniques to

erformance1 k, 5 directly-fundeddustrial partners

at underpins many

exceeds 8 M

Flagship Them

es


31/41

Flagship Them

l Road mapping: A UK centredhighlighting the research priorit

support was published in 2007l Technology watch: The proje

on emerging technologies for passociated thermal manageme

l Reliability and physics of fai Combined Modelling and Accel

academic and industrial partne Identify Root Cause (Physics) o Develop Physics of Failure mod Apply validated models:

to assess design options (MPM

prognostics and health managproject)

l Advanced packaging: investiadvanced power electronic mod Capacitor technology Thermal management technolo Novel Interconnect and die att Enhanced wire bonding

es

ower electronics road mapies for IeMRC/EPSRC and TSB

t maintains a technology watchwer electronic modules and

t systems

urerated Life Testing carried out by

sf Failures

els

project)

ment (IeMRC prognostics and diagnostics

ate the feasibility of a range ofule manufacturing technologies:

gy

ch

Power Electronic Modules


32/41

Power Electronic M

l Principal functional ele

l Physical containmentcomponent building bldies, resistors, etc.

l Can include control an

l Protection from enviroliquids, dust etc.

l Circuit interconnection

l Electromagnetic mana

l Thermal Management

odules

ment of power electronics

or one or more basiccks e.g. semiconductor

protection functions

nment e.g. ingress of

s (internal and external)

ement EMC issues

Anatomy of TypicalH i k

odule and


33/41

Heatsink

Lead-out interconnectBond wire

Encapsulation

Housing

Thermal stack has 9 layers

Heatsink

Thermal Grease

Copper baseplateSolder

Direct bonded copper

Ceramic


Solder

Die

, 8 interfaces!

Reliability Limita ions


34/41

Reliability Limita

CTE mismatch

causes fatigue failure

(de-bonding) at heel

CTE mismatch

causes fatigue failure

at interfaces

Repeated heating and cooli

repetitive mechanical stres

ions

Copper baseplate

Solder


Ceramic

Direct bonded copperSolder

Die

Bond wire

ng of assembly leads to

and eventual failure

Investigating Reliability Limitations


35/41

l Combined Modelling andAccelerated Life Testing

l Identify Root Cause (PhysicFailures

l Develop Physics of Failure

l Apply in design process and

management

Investigating Reliability

) of

odels

health

Limitations

0.1

1.0

10.0

100.0

1000.0

10000.0

10 100 1000

delta T (K)

ThousandsofCycles

0

500

1000

1500

2000

2500

3000

3500

4000

numbero

fcyclestofailu

re

1 2 3 4 5 6 7 8 9 10 11

substrate tile number

-60 to 150 C air-to-air

-60 to 150 C

No failure

K

ref

M

ref

refT

T

T

TNN

--

DD

= 111

Thermal Manageme t Options


36/41

Thermal Manageme

l Target overall reductio

for liquid-cooled systel Comparison of cooler op

Conventional base-plate a

Integrated base-plate cool

Direct cooler (no base-plat

Base-plate (1-3mm)

Cold plate Integrated base-

9 layers

8 interfaces

7 layer

6 interf

t Options

s in weight and volume

sions:

d separate cooler

r

e)

plate coolerDirect substrate cooler

ces

5 layers

4 interfaces

Impingement C oling


37/41

1. Jet impingement

2. Heat transfer3. Mixing of working fluid

1

Heat from El

l

l

Impingement C

3

ctronics

2

Jet impingement reduces thermalgradient and thermal resistance

Heat transfer coefficient increases(>30 kW/(m2K) achieved)

oling

Impingement Cooling


38/41

p g

l Prototype coolers manufac

Steel (17-4 PH SS) using tSintering (DMLS) rapid pr

l Grooves machined into thimprove sealing between

Direct cooling of

baseplate

g

tured in Stainless

he Direct Metal Lasertotyping process

baseplate todjacent cooling cells

Direct cooling of

DBC substrates

Thermal Impe ance


39/41

l Measure of the ability of the coothermal transients

l Cooling curves at a coolant flow

Thermal Step Response

0.001 0.01 0.1

Time

Dieto

CoolantTemperature

Difference

COLDPLATE B

ler to cope with step inputs and

rate of 4 litres/minute

- IGBT Die Temperature

0

5

1015

20

25

30

35

40

45

50

1 10 100

(seconds)

SEPLATE SUBSTRATE

Pumping Po er


40/41

l Power required to pass coolant

l

Data shown is for flow rates up

Die To Coolant Temperature

0.00 0.01 0.10

Pumping Pow

Dieto

CoolantTemperature

Difference(K)

SUBSTRATE B

luid through the cooler

to 4 litres/min

ifference vs Pumping Power

30

40

50

60

70

80

90

100

1.00 10.00 100.00

er Required (Watts)

SEPLATE COLDPLATE

Conclusions


41/41

l Power Electronics:

Underpins future transpor Is a current and future gr

Is an area of UK strength

l Key challenges for pow

Increased power densities Lower electromagnetic e

High reliability in extreme

Modular turn-key systems

Higher levels of integratio

Lower capital and mainte

l IeMRC supports researcprogramme addressing

and electricity supply networkswth area

r electronics include:

issions

operating environments

n

ance costs

h as part of a coordinatedthe key challenges

Documents

Introduction to Power Electronics 000