Introduction to Automotive Solutions From Infineon

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    Infineon Technology DayJochen Hanebeck

    Oct-2010

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    Global semi market is back on pre-crisis level

    290

    333

    Revenue in US Dollar billion and market growth rate

    Forecast range (average) market growth rateForecast range revenue

    Revenue Market growth rate

    Source: WSTS for historical data; Forecast: of VLSI, Gartner, iSuppli, WSTS, IC Insights, Future Horizons; market growth rate year-on-year.

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    We align to our customer segments

    Customers

    Board

    Automotive Industrial &Multimarket

    WirelessSolutions

    Mobile Phone

    Platforms Mobile Software

    RF Solutions Tuner and

    Receiver

    RF Power

    Chip Card &Security

    Payment

    Communication Entertainment

    Government ID Personal & Object ID

    Platform Security

    Power Semi-

    conductors Power ICs

    Microcontroller Sensors

    Electric Drivetrain

    Power Discretes

    Power Modules Power ICs

    ASICs RF & Protection

    Devices

    Microcontroller

    Sales, Operations, Central Functions

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    Infineon's revenue in Q3 was 1,209million

    Oct-2010

    Infineon Third Quarter FY10

    Revenue in million Segment Result margin

    +59%

    Segment

    Result880 52 110 163

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    Revenue Split by Focus Area

    Oct-2010

    AutomotiveIndustrial &

    Multimarket

    Chip Card& Security

    Energy Efficiency / Mobility

    1,183m

    Communications

    537mSecurity

    182m

    WirelessSolutions

    H1 FY10 revenue split

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    Infineon Functional Organization

    P. Bauer (CEO) Prof. Dr. H. Eul Dr. R. Ploss

    B

    oard

    Operations

    CentralFunctions

    R

    egions

    Automotive

    J. Hanebeck

    C. Geisler

    M. Seitz

    Industrial &

    Multimarket

    A. Mittal

    P. Schiefer

    O. Schuster

    Wireless

    Solutions

    W.K. Tan

    C. Eisenschmid

    Consolidation & External ReportingDr. F. Kirchmeier

    Controlling & Projects

    A. Sauer Corporate Dev. & Investor Relations

    U. Pelzer

    Enabling Technologies & Services

    Dr. F. Neppl Public Authorities & Associations

    Dr. A. Hoffmann

    Accounting Services & ProcessesM. Schneider

    Audit & Risk Management

    R. Hawliczek Business Continuity

    W.-R. Moritz

    Communications

    R. Driever Compliance Officer

    R. Hawliczek

    Finance & TreasuryF.-X. Gerard

    Human Resources

    Dr. T. Marquardt Information Technology

    M. Schmelmer

    Legal & Patent

    M. v. Eickstedt

    PurchasingH.-M. Schweizer

    Quality Management

    H. Mahler R&D Excellence

    Dr. C. Kutter

    Taxes

    A. Rappl

    Frontend - Power

    Dr. H.-D. Loewe

    Assembly & Test - PowerK. T. Ng

    Frontend CMOS

    P. Haidas

    Assembly & Test CMOSW. T. Gan

    Joint management responsibility of Division Head and Division Finance Head

    Corporate Supply Chain

    Dr. K. Gruber

    FinanceP. Gruber

    Chipcard & Security

    Dr. H. Gassel

    M. Friedinger

    Sales,

    Marketing &

    Distribution

    A. Mueller

    Divisions&

    Sales

    Operations

    Dr. R. Ploss

    Japan

    Y. Mori, A. Trost

    Asia Pacific

    A. Chong, T.T. Pow, H.-M. Stech

    North America

    J.-B. Loire, A. Prillwitz

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    Energy Efficiency

    Communications

    Security

    Strategic Cornerstones Aim at ExpandingLeadership Positions Using

    Focus Areas Core Competencies

    Analog / Mixed Signal

    RF

    Power

    Embedded Control

    Target Markets

    Automotive

    Industrial Electronics

    Chip Card & Security

    Mobile Phone Platforms

    Manufacturing Strategy

    Investment in in-house manu-

    facturing for speciality technologies eg300mm for Power discretes

    Manufacturing of standard techno-logies

    in foundries. Below 65nm no investment

    in own plants.

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    Cleaner

    Infineon Automotive - We make cars

    The Automotive Division focuses on Products for

    three Major Growth Drivers

    Best-in-class powertrain products

    (TriCore, Sensors, Power ICs) System & application know-how

    Optimizedhybrid and electric drivetrain

    products (HybridPack)

    Energy management concepts

    Electrificationof functions and

    replacement of relais & mechanical

    functions

    Dedicated sensor, power andmicrocontroller products

    Innovativesensor technologies:

    Magnetics (Hall, I-GMR), MEMS (Inertia,

    pressure) and SiGe (Radar, ACC)

    Safety standard compliant products PRO-

    SILTM (SIL3 or ASIL-D standard)

    Scalable product portfolio to address lowcost car design and production

    Easy to integrate chipset solutions for

    safety and powertrain and body

    Software and support structure to

    enable emerging country OEM and Tier1s

    Optimized Chipsets forE-bikes

    Safer Affordable

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    1. Freescale 16,1%

    2. Infineon 7,8%3. NXP 7,1%

    4. STM 6,6%

    5. ON 4,3%

    6. TI 3,7%

    7. Renesas 3,3%

    8. NEC 3,1%

    Source: Strategy Analytics, April 2010

    1. Infineon 9,0%

    2. Freescale 8,0%

    3. STM 7,7%

    4. NEC 7,3%

    5. Renesas 7,0%

    6. NXP 6,4%

    7. Toshiba 5,6%

    8. Bosch 4,9%

    1. Infineon 13,6%

    2. STM 10,5%

    3. Bosch 10,4%

    4. Freescale 8,5%

    5. NXP 8,2%

    6. TI 5,9%

    7. NEC 5,3%

    8. ON Semi 2,9%

    1. STM 9,2%

    2. Infineon 8,8%3. Freescale 7,6%

    4. NXP 7,0%

    5. NEC 4,5%

    6. Renesas 3,9%

    7. Toshiba 2,8%

    8. ROHM 2,7%

    1. Renesas 19,8%

    2. Toshiba 18,0%3. NEC 15,6%

    4. ROHM 3,8%

    5. Fujitsu 3,6%

    6. TI 3,2%

    7. Sanken 3,1%

    8. Infineon 2,8%

    3,9%

    5,7%

    8,2%

    9,0%

    1994 1998 2002 2009

    Infineon Automotive

    Market Share Development

    Infineon is the

    worlds #1

    in Automotive!

    Europe

    Worldwide Automotive Semiconductor Ranking

    APAC + ROW NAFTA Japan

    ROW: Key Rest-Of-World countries

    Brazil, Russia

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    Infineon Automotive Semiconductor Solutionscombine Sense, Compute and Actuate

    Magnetic Sensors

    Temperature

    Sensors

    16/32 bit C 32 bit TriCore

    (C + DSP)

    MOSFETs IGBTs

    Regulators

    Transceivers

    Smart Power

    System ICs

    Pressure Sensors Magnetic (Hall)

    Sensors

    Pressure Sensors

    TPMS

    Magnetic (Hall)

    Sensors

    RF ICs

    8 bit Cs

    16/32 bit Cs

    32 bit TriCore

    (C + DSP)

    8 bit Cs

    16/32 bit Cs

    Magnetic Sensors

    Temperature

    Sensors

    RF ICs

    Diodes

    Transistors

    MOSFETs

    Regulators

    Transceivers

    Smart Power System ICs

    Transceivers

    Diodes

    MOSFETs

    Transistors

    Regulators

    E-Power

    Smart Power

    Sense Compute Actuate

    Powertrain

    Safety

    Hybrid Electrical Drives

    Body & Convenience

    Diesel Engine Mgmt.

    Gasoline Engine Mgmt.

    Transmission Control

    Starter / Alternator

    ABS/ESP/Traction Control SuspensionAirbag/Restraint Systems Side-airbag

    Power Steering Tire Pressure Monitoring

    Light Control

    Heating, Ventilation,

    Air Condition

    Door & Seat

    Smart Battery Terminal

    Hybrid motor drive

    Regenerative braking Battery management

    8 bit Cs

    16/32 bit Cs

    32 bit TriCore(C + DSP)

    HybridPack

    IGBTs

    Regulators Transceivers

    Smart Power

    MOSFETs

    Our target markets

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    High Commitment to

    the Automotive

    Industry

    +

    Focus and long

    experience on

    power

    semiconductors

    =

    Ideal Match for HEV

    / EV

    Power

    Semiconductors*

    ** Power SemiconductorSource: IMS;Including power semis forautomotive

    Automotive

    Semiconductor*

    *Application-specificsemiconductorSource: Strategy Analytics

    Infineon AutomotiveYour trusted partner for HEV / EV

    95 98 02 03 05 06 09

    1

    2222

    55

    95 98 01 03 05 07 09

    8

    4

    1 1

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    Electric Vehicles (EV) and Hybrid EVsdrive semiconductor demand

    Fuel cost, CO2 reduction and price are main

    drivers for EVs and HEVs

    Powertrain semiconductor (SC) bill-of-material

    (BOM) of an EV/HEV is 2 to 3 times higher

    than total Auto (ICE) Semiconductor Bill-of-

    Materials

    50-80% related to IGBT and diode chips in

    state-of-the-art module packages

    Auto(ICE) vs. EV/HEV Semiconductor BOM

    Fast followers enter

    HEV market

    Market growthfostered by

    new vehicle

    launches

    Page 13Oct-2010

    http://www.gjie8.com/up_files/%E6%B1%BD%E8%BD%A6%E7%89%A9%E6%B5%81/%E4%B8%80%E6%B1%BD%E6%A0%87%E5%BF%97.jpghttp://www.google.com.sg/imgres?imgurl=http://pic3.nipic.com/20090519/2673651_134053064_2.jpg&imgrefurl=http://www.nipic.com/show/3/82/0b5bbb777ef55852.html&usg=__BzKxpjzLci6fYDE67R4k-JH0c8c=&h=952&w=1002&sz=66&hl=zh-CN&start=3&tbnid=p3SzbD7UQJNrXM:&tbnh=142&tbnw=149&prev=/images?q=%E4%B8%8A%E6%B1%BD&hl=zh-CN&sa=N&gbv=1&tbs=isch:1&itbs=1http://www2.daimlerchrysler.com/cgi-bin/redirect/redirect.cgi?url=http://www.mercedes-benz.comhttp://auto.suzuki.de/
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    Infineon AutomotiveYour trusted partner for automotive applications

    Broad innovative product portfolio, leading edge technologies and

    system expertise

    Growing global customer base

    Global No. 1 for automotive semiconductors

    Strategic partnerships on all levels of the value chain

    Automotive ExcellenceTM:

    Most comprehensive quality program in the industry

    Strong growth perspective driven by Low cost cars and HEV/EV

    Oct-2010 Page 15

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